U.S. patent application number 11/441291 was filed with the patent office on 2007-02-08 for method and apparatus for processing semiconductor work pieces.
This patent application is currently assigned to Advanced Micro-Fabrication Equipment, Inc. Asia. Invention is credited to AiHua Chen, Ryoji Todaka, Gerald Yin.
Application Number | 20070032097 11/441291 |
Document ID | / |
Family ID | 37700236 |
Filed Date | 2007-02-08 |
United States Patent
Application |
20070032097 |
Kind Code |
A1 |
Chen; AiHua ; et
al. |
February 8, 2007 |
Method and apparatus for processing semiconductor work pieces
Abstract
A processing apparatus for semiconductor work pieces and related
methodology is disclosed and which includes a processing chamber
having an internal cavity, and which has a plurality of rotatable
processing stations positioned therein and wherein the rotatable
processing stations each process a semiconductor work piece.
Inventors: |
Chen; AiHua; (Shanghai,
CN) ; Todaka; Ryoji; (Shanghai, CN) ; Yin;
Gerald; (Shanghai, CN) |
Correspondence
Address: |
WELLS ST. JOHN P.S.
601 W. FIRST AVENUE, SUITE 1300
SPOKANE
WA
99201
US
|
Assignee: |
Advanced Micro-Fabrication
Equipment, Inc. Asia
|
Family ID: |
37700236 |
Appl. No.: |
11/441291 |
Filed: |
May 24, 2006 |
Current U.S.
Class: |
438/795 |
Current CPC
Class: |
C23C 16/4584 20130101;
C23C 16/4583 20130101; C23C 16/4582 20130101; C23C 16/458 20130101;
H01L 21/6719 20130101 |
Class at
Publication: |
438/795 |
International
Class: |
H01L 21/00 20060101
H01L021/00 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 5, 2005 |
CN |
200510028563.2 |
Claims
1. A processing apparatus for semiconductor work pieces,
comprising: a processing chamber having an internal cavity and
which has a plurality of rotatable processing stations within the
internal cavity, and which are each operable to process a
semiconductor work piece.
2. A processing apparatus as claimed in claim 1, and further
comprising: a platform rotation mechanism individually cooperating
with each of the rotatable processing stations.
3. A processing apparatus as claimed in claim 2, and further
comprising: a motor mounted on the platform rotation mechanisms and
which. is drivingly coupled to at least two of the processing
station so as to drive the respective processing station in a
synchronous fashion.
4. A processing apparatus as claimed in claim 3, and wherein the
motor is drivingly coupled to the respective processing stations by
a continuous belt.
5. A processing apparatus as claimed in claim 4, and further
comprising: a belt roller borne by each of the respective
processing station, and wherein the continuous belt transmits force
from the motor to the belt roller so as to cause rotation of the
respective processing stations.
6. A processing apparatus as claim 5, and wherein the continuous
belt has an undulating drive surface, and wherein the belt roller
further comprises a sprocket belt roller which is operable to
matingly and drivingly engage the undulating drive surface of the
continuous belt.
7. A processing apparatus as claimed in claim 2, and wherein the
plurality of processing stations include four rotatable processing
stations, and wherein the processing apparatus further comprises a
motor which synchronously drives two adjacent processing
stations.
8. A processing apparatus as claimed in claim 1, and further
comprising: a first support member mounted adjacent to the
processing chamber and which supports at least two processing
stations; and a first motor drivingly coupled to the first support
member and operable to selectively and simultaneously move the at
least two processing stations along a substantially vertical path
of travel.
9. A processing apparatus as claimed in claim 8, and further
comprising: a first sensor borne by the first support member and
which indicates the position of the first support member.
10. A processing apparatus as claimed in claim 8, and further
comprising: a worm drive mounted on the first support member and
drivingly coupled to the first motor, and which further transmits
force from the first motor to the first support member.
11. A processing apparatus as claimed in claim 1, and further
comprising: a plurality of lift pins moveably mounted on each of
the processing stations, and which are operable to reciprocally
move upwardly and downwardly relative to each of the processing
stations.
12. A processing apparatus as claimed in claim 11, and further
comprising: a second support member mounted adjacent to the
processing chamber, and wherein the second support member
cooperates within the plurality of lift pins to move the respective
lift pins upwardly and downwardly relative to the respective
processing stations; and a second motor drivingly coupled to the
second support member and operable to selectively move the second
support member so as to cause the upward and downward movement of
the respective lift pins in each of the respective processing
stations.
13. A processing apparatus as claimed in claim 12, and further
comprising: a second sensor borne by the second support member and
which facilitates the positioning of the plurality of lift pins
within a given range of travel relative to the respective
processing stations.
14. A processing apparatus as claimed in claim 1 and further
comprising: a first support member mounted adjacent to the
processing chamber and which supports at least two processing
stations; a first motor drivingly coupled to the first support
member and operable to selectively and simultaneously move the at
least two processing stations along a substantially vertical path
of travel; a plurality of lift pins moveably mounted on each
processing station, and which are operable to reciprocally move
upwardly and downwardly relative to each of the processing
stations; a second support member mounted adjacent to the
processing chamber, and cooperating with the plurality of lift pins
to move the respective lift pins upwardly and downwardly relative
to the respective processing stations; a second motor drivingly
coupled to the second support member and operable to selectively
move the second support member so as to cause the upward and
downward movement of the respective lift pins in each of the
respective processing stations; a vertically oriented rail defining
vertically oriented rail slots, and which is mounted on the
processing chamber; and rail slot engagement members individually
mounted on each of the first and second support members and which
are matingly received in each of the vertically oriented rail
slots, and which guide the first and second support members along a
substantially vertically oriented path of travel.
15. A processing apparatus as claimed in claim 1, and further
comprising: a heating component associated with each of the
processing stations, and which provides substantially uniform heat
energy to each of the processing stations.
16. A processing apparatus as claimed in claim 2, and wherein each
of the processing stations comprise: a shaft having a proximal and
a distal end; and a belt roller mounted on the distal end of the
shaft.
17. A processing apparatus for semiconductor work pieces,
comprises: a processing chamber having an internal cavity, and
which has a plurality of rotatable processing stations within the
internal cavity, and which are each operable to process a
semiconductor work piece; a platform rotation mechanism
individually cooperating with each of the rotatable processing
stations, and positioned below each of the processing stations, and
wherein the platform rotation mechanism rotates and heats the
respective processing stations, and wherein the respective
processing stations each defines a passageway which extends
therethrough, and which will accommodate a plurality of electrical
signal inputs; and a sealing member mounted on the processing
station and sealably engaging the processing chamber, and which
facilitates the formation of an airtight environment within the
internal cavity of the processing chamber.
18. A processing apparatus as claimed in claim 17, and wherein each
of the processing stations comprise: a shaft having a proximal and
a distal end; and a belt roller mounted on the distal end of the
shaft, and wherein rotation of the belt roller imparts rotational
motion to the associated shaft.
19. A processing apparatus as claimed in claim 18, and further
comprising: a hub mounted on the distal end of the shaft, and
wherein the belt roller is mounted to the hub; and a signal
amplifier electrically coupled to the hub.
20. A processing apparatus as claimed in claim 18, and further
comprising: a resistor wire borne by each of the processing
stations, and which, when energized, emits heat energy; a support
conduit cooperating with and extending longitudinally outwardly
relative to, the shaft of the respective processing stations, and
wherein the shaft defines a longitudinally disposed passageway
extending therethrough; and an electrical conduit extending through
the support conduit, and the shaft, and which is electrically
coupled to the resistor wire, and wherein the electrical conduit
delivers electricity to the resistor wire to energize same.
21. A processing apparatus as claimed in claim 20, and further
comprising: a temperature detection apparatus mounted within the
support conduit and which measures a surface temperature of the
respective processing stations.
22. A processing apparatus as claimed in claim 20, and wherein the
processing chamber has a bottom surface, and wherein the processing
apparatus further comprises: a bellows seal having opposite first
and second ends, and a longitudinal passageway which extends
between the first and second ends, and wherein the first end is
supported on the bottom surface of the processing chamber, and
wherein the support conduit extends through the bellows seal; and a
sealing member positioned between the bellows seal and the bottom
surface of the processing chamber so as to sealably mount the
bellows seal to the bottom surface.
23. A processing apparatus as claimed in claim 22, and further
comprising: a first outer shell having first and second ends, and
which further has a passageway which extends between the first and
second ends, and wherein the second end of the bellows seal is
sealably mounted to the first end of the first outer shell, and
wherein the shaft of the respective processing stations extend into
the passageway of the first outer shell and is rotatable relative
thereto; and a bearing mounted adjacent to the first end of the
first outer shell and which receives the shaft of the respective
processing stations so as to facilitate the rotation of the
processing stations.
24. A processing apparatus as claimed in claim 23, and further
comprising: a sealing component positioned between the first outer
shell and the bellows seal so as to substantially sealably secure
the bellows seal to the first outer shell.
25. A processing apparatus as claimed in claim 23, and further
comprising: a magnetic sealing component positioned between the
first end of the first outer shell and the shaft so as to
substantially sealably secure the shaft to the first outer shell
while the shaft rotates relative to the first outer shell.
26. A processing apparatus as claimed in claim 20, and wherein the
support conduit and the shaft are sealably affixed to one another
by fasteners, and wherein a sealing component is positioned between
the support conduit and the shaft.
27. A processing apparatus as claimed in claim 26, and further
comprising: a connecting block having opposite sides and which
defines a passageway extending therethrough, and wherein the shaft
is substantially coaxially aligned relative to the passageway of
the connecting block and sealably mounted to one side thereof, and
wherein the support conduit is substantially coaxially aligned
relative to the passageway defined by the connecting block and is
further sealably mounted to the opposite side of the connecting
block, and wherein a sealing member is positioned between both the
support conduit, and the shaft; and the adjoining connecting
block.
28. A processing apparatus as claimed in claim 23, and wherein the
proximal end of the shaft is engaged by the bearing, and wherein
the proximal end of the shaft defines, at least in part, a first
coolant passageway which facilitates the cooling of the sealing
component which cooperates with the shaft.
29. A processing apparatus as claimed in claim 28, and wherein the
first outer shell further defines a second coolant passageway which
facilitates the cooling of the sealing component which cooperates
with the shaft.
30. A processing apparatus as claimed in claim 29, and wherein the
first and second coolant passageways are coupled in fluid flowing
relation by way of an external conduit.
31. A processing apparatus as claimed in claim 30, and wherein the
first coolant passageway has a first intake end, and an opposite,
second, exhaust end, and wherein a source of coolant is supplied to
the first intake end.
32. A processing apparatus as claimed in claim 31, and wherein the
first coolant passageway further comprises: a first cooling slot
which is positioned near, and which circumscribes, at least in
part, the proximal end of the shaft, and which is further disposed
in cooling relation relative to the sealing component which
cooperates with the shaft; a first portion of the first coolant
passageway which extends longitudinally along the shaft and which
has a first end which is coupled in fluid flowing relation relative
to the first cooling slot, and an opposite second end, and wherein
a first aperture is formed in the shaft at the second end of the
first portion; and a second portion of the first coolant passageway
which extends longitudinally along the shaft, and which has a first
end which is coupled in fluid flowing relation relative to the
first cooling slot, and an opposite second end, and wherein a
second aperture is formed in the shaft at the second end of the
second portion.
33. A processing apparatus as claimed in claim 32, and further
comprising: a second outer shell having opposite first and second
ends, and which further defines a passageway which extends
longitudinally thereof and between the first and second ends, and
wherein first end of the second outer shell is mounted on, and is
substantially coaxially aligned relative to, the second end of the
first outer shell, and wherein the shaft extends through the second
outer shell and is rotatable relative thereto; and a plurality of
sealing components which are received in the passageway which is
defined by the second outer shell, and which sealingly couple the
shaft to the second outer shell, and wherein first and second ring
gaps are defined between adjacent sealing components, the shaft,
and the second, outer shell.
34. A processing apparatus as claimed in claim 33, and wherein the
first aperture formed in the shaft, and located at the second end
of the first portion of the first coolant passageway is located
within the first ring gap, and wherein a coolant inlet is coupled
in fluid flowing relation relative to the first ring gap, and
wherein a source of coolant enters the coolant inlet, travels along
the first ring gap, and then enters the first portion of the first
coolant passageway by way of the first aperture.
35. A processing apparatus as claimed in claim 34, and wherein the
second aperture formed in the shaft, and which is located at the
second end of the second portion of the first coolant passageway is
located within the second ring gap, and wherein the external
conduit has a first end which is coupled in fluid flowing relation
relative to the second ring gap, and an opposite second end which
is coupled in fluid flowing relation relative to the second coolant
passageway, and wherein the coolant leaving the first portion of
the first coolant passageway travels along the first cooling slot
and then passes into the second portion of the first coolant
passageway, and wherein the coolant exits the second portion of the
first coolant passageway by way of the second aperture, and then
travels along the second ring gap, and wherein the coolant exits
the second ring gap and enters into the first end of the external
conduit, and wherein the coolant exits the second end of the
external conduit and enters into the second coolant passageway.
36. A processing apparatus as claimed in claim 35, and wherein the
second coolant passageway comprises: a second coolant slot which is
positioned near, and which further circumscribes, at least in part,
the first end of the first outer shell, and which is further
disposed in spaced relation relative to the first coolant slot, and
wherein the second coolant slot has a first, intake end, and a
second, exhaust end, and wherein the second end of the external
conduit is coupled in fluid flowing relation relative to the first
end of the second coolant slot; and an external exhaust conduit
coupled to the second end of the second coolant slot, and which
exhausts the coolant to ambient.
37. A processing apparatus for semiconductor work pieces,
comprising: a processing chamber having an internal cavity and
which has a plurality of rotatable processing stations within the
internal cavity, and which are each operable to process a
semiconductor work piece, and wherein each of the plurality of
rotatable processing stations can move upwardly, downwardly and/or
rotate relative to the processing chamber; sealing assemblies
mounted on the processing chamber and which maintain the internal
cavity of the processing chamber substantially sealed while the
rotatable processing stations move upwardly, downwardly, and
rotate; and a cooling apparatus for cooling the sealing assemblies
to facilitate the proper operation of the sealing assemblies.
38. A processing apparatus as claimed in claim 37, and further
comprising: a bellows seal having opposite first and second ends,
and which further has a passageway which extends between the first
and second ends, and wherein the processing chamber has a bottom
surface, and the first end of the bellows is sealably secured to
the bottom surface of the processing chamber; and an elastic
sealing member sealably cooperating with the bellows seal.
39. A processing apparatus as claimed in claim 38, and further
comprising: a first outer shell having first and second ends, and
which further has a passageway which extends between the first and
second ends, and wherein the second end of the bellows is sealably
mounted to the first end of the outer shell; a shaft extending into
the passageway of the outer shell and which is further rotatable
relative thereto; and a magnetic sealing component mounted on the
first outer shell and sealably cooperating with the shaft so as to
sealably secure the shaft for rotatable motion relative to first
outer shell and the bellows seal.
40. A processing apparatus as claimed in claim 39, and further
comprising: a sealing component positioned between the first end of
the first outer shell, and the second end of the bellows, so as to
facilitate the sealing of the bellows to the first outer shell.
41. A processing apparatus as claimed in claim 37, and wherein the
cooling apparatus comprises, at least in part, water cooling
conduits, and wherein one of the water cooling conduits comprises
an externally mounted conduit.
42. A processing apparatus as claimed in claim 41, and wherein the
cooling apparatus further comprises: a first coolant passageway
which is formed in the shaft, and which is positioned, at least in
part near the sealing component; and a second coolant passageway
which is formed, in the first outer shell, and which is positioned,
at least in part, near the sealing component, and wherein the first
and second coolant passageways are coupled in fluid flowing
relation one relative to the other by way of the externally mounted
conduit.
43. A processing apparatus as claimed in claim 42, and further
comprising: a second outer shell having opposite first and second
ends, and which further has a passageway which extends
longitudinally thereof, and between the first and second ends, and
wherein first end of the second outer shell is mounted on, and is
substantially coaxially aligned relative to, the second end of the
first outer shell, and wherein the shaft extends through the second
outer shell and is rotatable relative thereto; and a plurality of
sealing components which are received in the passageway of the
second outer shell and which sealingly couple the shaft to the
second outer shell, and wherein first and second ring gaps are
defined between adjacent sealing components, the shaft, and the
second, outer shell.
44. A processing apparatus as claimed in claim 43, and further
comprising: an external coolant source coupled in fluid flowing
relation relative to the first ring gap, and wherein the first ring
gap and the first coolant passageway are coupled in fluid flowing
relation, and wherein the source of the external coolant enters the
first coolant passageway after first passing along the first ring
gap.
45. A processing apparatus as claimed in claim 44, and wherein at
least one of the water cooling conduits is an external conduit
having opposite first and second ends, and wherein the first
coolant passageway is coupled in fluid flowing relation relative to
the second ring gap, and wherein the external conduit has a first
end coupled in fluid flowing relation relative to the second ring
gap, and the second end of the external conduit is coupled in fluid
flowing relation relative to the second coolant passageway, and
wherein coolant in the first coolant passageway passes by means of
the external conduit to the second coolant passageway.
46. A method for processing semiconductor work pieces, comprising:
providing a processing chamber having an internal cavity; providing
a plurality of processing stations within the internal cavity of
the processing chamber; positioning individual semiconductor work
pieces on each of the individual processing stations; and rotating
and heating the individual processing stations so as to facilitate
the effective processing of the semiconductor work pieces within
the internal cavity of the processing chamber.
47. A method as claimed in claim 46, and wherein the plurality of
processing stations are synchronously rotated.
48. A processing apparatus for semiconductor work pieces,
comprising: a chamber defining an internal cavity; a plurality of
rotatable and heated processing stations received in the internal
cavity, and which are each operable to process a semiconductor work
piece; and wherein at least two of the processing stations rotate
in a substantially synchronous fashion so as to facilitate the
substantially uniform processing of the semiconductor work pieces;
and a motor drivingly coupled to the at least two of the rotatable
and heated processing stations, and which facilitates the
synchronous rotation of the at least two processing stations.
Description
RELATED PATENT DATA
[0001] This application claims priority from Chinese Patent
Application Serial No. 200510028563.2, and which was filed on Aug.
5, 2005.
TECHNICAL FIELD
[0002] The present apparatus relates to a method and apparatus for
processing semiconductor work pieces, and more specifically to an
apparatus which includes multiple processing chambers for
processing a plurality of semiconductor work pieces, and multiple
processing stations within each of the multiple processing
chambers.
BACKGROUND OF THE INVENTION
[0003] Presently, two types of semiconductor processing systems are
employed for fabricating semiconductor work pieces. The first type
of system is a batch processing system; while the second type of
system which is commonly used processes single semiconductor work
pieces. In batch processing systems, semiconductor work pieces are
typically oriented in either a horizontal or vertical orientation,
and are thereafter processed at the same time.
[0004] Although single piece semiconductor processing systems have
many advantages including producing uniform semiconductor products,
they also have numerous shortcomings including low throughput; high
overhead operating costs; and problems achieving uniform heating of
the semiconductor work pieces that are being processed. These long
recognized problems associated with single piece processing devices
have yet to be overcome.
[0005] Attempts have been made to address the problems associated
with the prior art batch processing systems. For example, in U.S.
Pat. No. 5,855,681, a batch processing system is described, and
which includes multiple processing chambers. Each of the processing
chambers includes multiple processing stations. In this prior art
device, the processing chambers can process multiple semiconductor
work pieces at one time.
[0006] While these and other devices have worked with some degree
of success, there are shortcomings that have detracted from their
usefulness. For example, one of the biggest problems associated
with batch processing systems lies principally with insuring
uniformity during the processing of the respective semiconductor
work pieces. In this regard, when batch processing a plurality of
semiconductor work pieces, the multiple semiconductor work pieces
are placed in the same chamber. Consequently, differences in heat
and gas flow in the processing chamber may cause non-uniform
processing of the several semiconductor work pieces. To overcome
the problems associated with non-uniform processing, several
solutions have been proposed. For example, and referring now to
FIG. 1, a processing apparatus for semiconductor work pieces 10 is
illustrated and wherein a silicon substrate to be processed 11 is
placed on a carbon pedestal 12. Positioned below and in spaced
relation relative to the carbon pedestal there is a second, heating
pedestal 13. Located within the heating pedestal there is a high
frequency heating coil 14 which is operable to impart heat energy
to the silicon substrate 11. During processing, the carbon pedestal
12 can rotate around a central shaft together with the carbon
pedestal support 15. This arrangement has been utilized to try to
insure uniform temperature processing.
[0007] Referring now to FIG. 2, another prior art semiconductor
work piece processing apparatus 20 is disclosed and which is more
particularly discussed in published U.S. Patent Application
2005/0011459. The semiconductor processing apparatus 20 includes a
rotatable semiconductor work piece carrier 21 which is positioned
within a processing chamber 22. A semiconductor work piece 23 is
placed on the semiconductor work piece carrier 21. The
semiconductor work piece carrier 21 rotates around a shaft 24.
Further, a heating pedestal 25 is provided which is stationary, and
located in a position which is closely adjacent thereto. A small
passageway 26 is defined between the semiconductor work piece
carrier 21, and the adjacent reaction chamber 22. In the present
prior art device, the semiconductor work piece carrier is rotated
while gas is simultaneously delivered to the reaction chamber and
flows horizontally, outwardly along the passageway 26. This
arrangement attempts to provide uniform film growth on the
semiconductor work piece 23 during processing.
[0008] While many of the difficulties associated with prior art
batch processing devices utilized heretofore can be remedied by
means of the prior art devices shown in FIGS. 1 and 2, these same
assemblies also create other problems. In both prior art devices,
multiple semiconductor work pieces are placed on the same
semiconductor work piece carrier. Further, these same semiconductor
work piece carriers are heated by a stationary heating pedestal.
Uniform heating of the semiconductor work pieces is affected by the
rotation of the semiconductor work piece carrier apparatus relative
to the stationary heating pedestal. The difficulty associated with
this particular type of approach is that the separation of the
heating apparatus from the semiconductor work piece carrier adds a
degree of complexity to the overall processing system. Still
further, achieving a uniform space or gap between the semiconductor
work piece carrier and the underlying heating pedestal becomes
difficult thereby making the control of the processing temperature
an increasing problem. In addition to the foregoing difficulties,
the prior art devices all employ semiconductor work piece carriers
which are driven or rotate thereabout a common shaft. This is not
an ideal solution for semiconductor processing devices which have
multiple processing stations within one processing chamber.
[0009] Therefore, a semiconductor processing apparatus which avoids
the shortcomings attendant with the prior art practices and
methodology utilized heretofore is the subject matter of the
present application.
SUMMARY OF THE INVENTION
[0010] A first aspect of the present invention relates to a
processing apparatus for semiconductor work pieces which includes a
processing chamber having an internal cavity and which has a
plurality of rotatable processing stations within the internal
cavity, and which are each operable to process a semiconductor work
piece.
[0011] Another aspect of the present invention relates to a
processing apparatus for semiconductor work pieces, and which
includes a chamber defining an internal cavity; a plurality of
rotatable and heated processing stations received in the internal
cavity, and which are each operable to process a semiconductor work
piece; and wherein at least two of the processing stations rotate
in a substantially synchronous fashion so as to facilitate the
substantially uniform processing of the semiconductor work pieces;
and a motor drivingly coupled to the at least two of the rotatable
and heated processing stations, and which facilitates the
synchronous rotation of the at least two processing stations.
[0012] Another aspect of the present invention relates to a
processing apparatus for semiconductor work pieces and which
includes a processing chamber having an internal cavity, and which
has a plurality of rotatable processing stations within the
internal cavity, and which are each operable to process a
semiconductor work piece; a platform rotation mechanism
individually cooperating with each of the rotatable processing
stations, and positioned below each of the processing stations, and
wherein the platform rotation mechanism rotates and heats the
respective processing stations, and wherein the respective
processing stations each define a passageway which extends
therethrough, and which will accommodate electrical signal inputs;
and a sealing member is borne by the processing chamber, and which
facilitates the formation of an airtight environment within the
internal cavity of the processing chamber.
[0013] Still another aspect of the present invention relates to a
processing apparatus for semiconductor work pieces and which
includes a processing chamber having an internal cavity and which
has a plurality of rotatable processing stations within the
internal cavity, and which are each operable to process a
semiconductor work piece, and wherein each of the plurality of
rotatable processing stations can move upwardly, downwardly and/or
rotate relative to the processing chamber; sealing assemblies
mounted on the processing chamber and which maintain the internal
cavity of the processing chamber substantially sealed while the
rotatable processing stations move upwardly, downwardly and rotate;
and a cooling apparatus for cooling the sealing assemblies to
facilitate the proper operation of the sealing assemblies.
[0014] Still another aspect of the present invention relates to a
method for processing semiconductor work pieces which includes the
steps of providing a processing chamber having an internal cavity;
providing a plurality of processing stations within the internal
cavity of the processing chamber; positioning individual
semiconductor work pieces on each of the individual processing
stations; and rotating and heating the individual processing
stations so as to facilitate the effective processing of the
semiconductor work pieces within the internal cavity of the
processing chamber.
[0015] These and other aspects of the present invention will become
readily apparent hereinafter.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Preferred embodiments of the invention are described below
with reference to the following accompanying drawings.
[0017] FIG. 1 is a greatly simplified schematic diagram of an
existing prior art processing apparatus for semiconductor work
pieces.
[0018] FIG. 2 is a second, greatly simplified schematic diagram of
a second processing apparatus for semiconductor work pieces.
[0019] FIG. 3 is a perspective, fragmentary view of the processing
apparatus for semiconductor work pieces of the present
invention.
[0020] FIG. 4 is a fragmentary, side elevation view of the
processing apparatus for semiconductor work pieces of the present
invention.
[0021] FIG. 5 is a second, fragmentary, side elevation view of the
processing apparatus for semiconductor work pieces of the present
invention, and which is taken from a position opposite to that seen
in FIG. 4.
[0022] FIG. 6 is fragmentary, side elevation view of a single
processing station which is useful in the present invention.
[0023] FIG. 7 is a transverse, vertical sectional view of a
processing station useful in the present invention, and which is
taken from a position along line 7-7 of FIG. 6.
[0024] FIG. 8 is a fragmentary, greatly enlarged, transverse,
sectional view taken from a position along line 7-7 of FIG. 6.
[0025] FIG. 9 is a longitudinal, vertical, sectional view taken
through a portion of a shaft which is useful in the processing
stations employed in the present invention.
[0026] FIG. 10 is a longitudinal, vertical, sectional view which is
taken from a position along line 10-10 of FIG. 9.
[0027] FIG. 11 is a fragmentary, greatly simplified view of the
cooling passageways which are provided in the present invention.
Some underlying surfaces are shown in phantom lines.
[0028] FIG. 12 is a fragmentary, perspective, longitudinal,
vertical, sectional view taken from a position along line 12-12 of
FIG. 7. Some supporting structures have been removed to illustrate
the structure thereof.
[0029] FIG. 13 is a fragmentary, longitudinal, vertical sectional
view taken through a bellow which is useful in the present
invention.
[0030] FIG. 14 illustrates one possible form of a semiconductor
processing system which may employ the apparatus of the present
invention.
[0031] FIG. 15 illustrates an arrangement which rotates the
adjoining processing stations of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0032] This disclosure of the invention is submitted in furtherance
of the constitutional purposes of the U.S. Patent Laws "to promote
the progress of science and useful arts" (Article 1, Section
8).
[0033] Referring more specifically to FIG. 14, a semiconductor
processing system which incorporates the teachings of the present
invention is shown therein. The semiconductor processing system 30
has a processing chamber 31 having an internal cavity 33 and which
is operable to receive a plurality of rotatable processing stations
which are generally indicated by the numeral 32. As will be
described in greater detail hereinafter, the plurality of rotatable
processing stations 32 process individual semiconductor work pieces
in a manner not possible, heretofore. Therefore, one aspect of the
present invention relates to a semiconductor processing system 30
which mounts a plurality of rotatable processing stations 32, and
which are each operable to process semiconductor work pieces while
simultaneously heating same.
[0034] Referring more specifically to now FIG. 3, one embodiment of
the processing apparatus 40 for semiconductor work pieces of the
present invention is shown. For purposes of clarity, only two
processing stations 32 are illustrated. However, it will be
recognized that the present invention is not limited to two
processing stations but may have various numbers of processing
stations depending upon the arrangement of the processing chamber
31.
[0035] Referring more specifically to FIGS. 4 and 5, the processing
apparatus for semiconductor work pieces 40 has a vertically
oriented rail 41 which is positioned adjacent to, and below, the
processing chamber 31 as seen in FIG. 14. The vertically oriented
rail has a first or upper end 42 which is positioned adjacent to
the processing chamber 31, and an opposite, second or distal end 43
which is remote thereto. The vertically oriented rail 41 defines at
least one rail slot 44, and which defines a path of travel for
various elements of the processing apparatus 40 which will be
described in greater detail hereinafter. As seen by reference to
FIG. 5, a plurality of substantially vertically oriented apertures
are disposed in predetermined spaced relation along the vertically
oriented rail 41. These holes or apertures are operable to
cooperate with other elements of the assembly as the assembly moves
along the rail. The arrangement of the vertically oriented rail 41
is designed such that pressure on the whole mechanical arrangement
as seen in FIG. 4 is substantially alleviated.
[0036] Referring still to FIGS. 4 and 5, it will be seen that the
present processing apparatus 10 includes a support housing 50
defining an internal chamber 51, and which is mounted on the second
end 43 of the rail 40. As illustrated in the drawings, a first
motor 52 is mounted on the support housing 50, and has a drive
shaft 53 which extends outwardly therefrom. Positioned within the
chamber 51 of the support housing 50 is a worm gear mechanism which
is generally indicated by the numeral 54. The worm gear mechanism
54 is coupled to a drive shaft 55. As illustrated in the present
drawings, the processing apparatus 40 includes a drive shaft
receiving bracket 60. The drive shaft receiving bracket has a first
end 61, and an opposite second end 62 through which the drive shaft
55 extends. As should be understood, by energizing the first motor
52, force is imparted to the drive shaft 55 to cause the drive
shaft receiving bracket 60 to move therealong the rail 44 for the
purposes which will be described in greater detail, below. In
addition to the foregoing, it will be seen that a position sensor
63 is mounted on the rail 41, and which is operable to sense the
position of other elements in the processing apparatus as they move
along the rail. Still referring to FIGS. 4 and 5, it will be seen
that a second motor 64 is mounted near the first end 42 of the
vertically oriented rail 41. The second motor 64 is moveably
mounted to the rail by means of a motor mount 65. Still further, a
position sensor 66 is mounted on the motor mount 65 and is operable
to provide relevant positional information for various assemblies
of the processing apparatus 40 as will be described in greater
detail in the paragraphs which follow.
[0037] The processing apparatus of the present invention includes a
first support member which is generally indicated by the numeral
70, and which is mounted to the drive shaft receiving bracket 60,
and which supports at least two processing stations 32. As seen by
reference to FIGS. 4 and 5, the first motor 52 which is provided,
is drivingly coupled to the first support member 70, and is
operable to selectively and simultaneously move the at least two
processing stations 32 along a substantially vertically disposed
path of travel as will be described hereinafter. In this regard,
the first support member 70 has a top surface 71, and an opposite
bottom surface 72. Still further, apertures or receiving stations
73 (FIG. 3) are formed in the first support member, and which are
individually operable to cooperate with other assemblies which will
be described, below. Still further, the first support member
selectively moves along a vertically disposed path of travel which
is generally indicated by the numeral 74. It should be further
understood that the first support member 70, as well as the second
support member, which will be discussed below, includes rail slot
engagement members (not shown), and which are individually mounted
on each of the first and second support members, and which are
matingly received in each of the vertically oriented rail slots 44.
These assemblies guide the respective first and second support
members along the substantially vertically oriented path of travel
74.
[0038] Referring still to FIGS. 4 and 5, the processing apparatus
40 of the present invention includes a second support member which
is generally indicated by the numeral 80, and which is mounted
adjacent to, and below the processing chamber 31. The second
support member 80 is drivingly coupled to the second motor 64 which
was earlier described. As seen in the drawings, the second support
member has a first or top surface 81, and an opposite, second, or
bottom surface 82. A pair of apertures 83 are formed therein (FIG.
3), and which are operable to cooperate with other assemblies which
will be described below. As seen in FIGS. 4 and 5, sealing members
84, here illustrated in the form of bellows, are mounted on the top
surface 81. The sealing members 84 are each individually operable
to receive or otherwise sealingly cooperate with an ejection rod 85
which is sealably contained therein. The ejection rods 85 are each
operable to cooperate with individual lifting pins 86. The lifting
pins movably cooperate with a pedestal which will be described in
greater detail below. As should be understood, the individual
sealing members or bellows 84 are connected to the bottom of the
processing chamber 31. Still further, the engagement of the
ejection rods 85 with the lifting pins 86 are effective for lifting
a semiconductor work piece 87, as seen in FIG. 4, off of the
accompanying pedestal so that they may be moved into, and out of,
the processing chamber 31. It should be understood, therefore, that
the second support member 80 cooperates with a plurality of sift
pins 86 to move the respective lift pins upwardly and downwardly
relative to the respective processing stations 32. Still further,
the second motor 64 is drivingly coupled to the second support
member 80 and operable to selectively move the second support
member 80 along a path of travel 88 so as to cause the reciprocal
upward and downward movement of the respective lift pins 86 in each
of the respective processing stations 32. In addition to the
foregoing, it should be understood that the position sensor 66 is
electrically coupled to the second motor 64, and is operable to
control the same motor so as to move the second support member 80
upwardly and downwardly along the vertically oriented rail 41 so as
to engage the lift pins in an appropriate fashion. The position
sensor 66 is rendered operable so as to stop the second motor when
the second support member 80 passes the sensor 64 thus insuring
that the individual lift pins can only rise and descend within a
certain range.
[0039] Referring now to FIGS. 7 and 9, the processing apparatus for
semiconductor work pieces 40 of the present invention includes a
rotating shaft which is generally indicated by the numeral 100. The
rotating shaft has a first, upper or proximal end 101, and a
second, lower, or distal end 102. Still further, the shaft defines
an inside facing surface 103, and an outside facing surface 104. A
longitudinally disposed passageway 105 is defined by the inside
facing surface, and extends between the first and second ends
thereof. Referring more specifically now to FIGS. 9 and 10, the
rotatable shaft 100 defines a connecting block seat 110 which is
positioned at the first end 101 thereof, and which is operable to
receive a connecting block 110A. The connecting block has a
passageway which extends therethrough (FIG. 8). Further, formed in
the rotating shaft 100 is a first coolant passageway which is
generally indicated by the numeral 111. The first coolant
passageway has a first intake end 112, and a second exhaust end
which is generally indicated by the numeral 113. Disposed
intermediate the first and second ends 112 and 113 is a first
coolant slot 114 which is formed thereabout, and in substantially
circumscribing relation relative to the first end 101. Still
further, the first coolant passageway 111 has a first portion 115
which extends longitudinally therealong the rotating shaft 100. The
first portion 115 has a first end 116, which is coupled in fluid
flowing relation relative to the coolant slot 114, and an opposite,
second end 117 which is remote thereto. In addition to the
foregoing, a first aperture 120 is formed in the rotating shaft 100
and is operable to couple the first portion 115 to a source of
coolant which will be described in greater detail, hereinafter.
Still further, the first coolant passageway 111 includes a second
portion 121 which extends longitudinally therealong the rotating
shaft 100. The second portion has a first end 122, and an opposite
second end 123. Still further, a second aperture 124 is formed
through the rotating shaft 100 and allows the second portion of the
passageway to be coupled in fluid flowing relation relative to
another assembly which will be discussed in greater detail
below.
[0040] Referring now to FIG. 7, and mounted in force transmitting
relation relative to the second end 102 of the rotating shaft 100,
is a sprocket belt roller which is generally indicated by the
numeral 130. The sprocket belt roller is operable to matingly
engage a drive belt which will be discussed in greater detail
hereinafter. The sprocket belt roller is operable to impart
rotational force from a motor which will be described below, to
cause the rotational movement of the shaft 100. The sprocket belt
roller 130 defines a centrally disposed passageway 131, and which
will accommodate the passage of a plurality of electrical conduits.
A spacer assembly 132 is positioned on the opposite side of the
sprocket belt roller 130, and further defines a passageway 133
which extends therethrough and which is substantially coaxially
aligned relative to the passageway 131 defined by the belt roller
130. Still further, a hub assembly 134 is provided and which is
mounted on the spacer assembly 132. The hub assembly 134 similarly
defines a passageway 135 which extends therethrough. The hub
assembly allows electrical conduits to pass therethrough, but
prevents the electrical conduits from being entangled while the
respective processing stations 32 rotate. Mounted endwardly of the
hub assembly 134 is a signal amplifier 136. The signal amplifier is
coupled to other components of the processing apparatus which will
be described also in the paragraphs which follow.
[0041] Referring more specifically to FIGS. 7 and 8, the processing
apparatus for semiconductor work pieces 40 of the present invention
includes a supporting rod, conduit, or member 140, and which
extends substantially longitudinally outwardly relative to the
first end 101 of the rotating shaft 100. The supporting rod 140 has
a first or proximal end 141, and an opposite second or distal end
142, which is affixed in an appropriate fashion to the first end
101 of the rotating shaft by means of the connecting block 110A.
This attachment may be facilitated by means of various conventional
fasteners, not shown. The supporting rod has an inside facing
surface 143, and an outside facing surface 144. The inside facing
surface defines a longitudinally disposed passageway 145 which
extends between the first and second ends; and which accommodates
the passage of other conduits which will be described, below. As
further seen by references to FIGS. 7 and 8, a pair of sealing
members which are generally indicated by the numeral 150, are
mounted on, or cooperate with, the connecting block 110A, and which
are operable to sealably couple the supporting rod 140 to the
rotating shaft 100. Still further, a seal 151 is positioned in
substantially covering relation relative to the first coolant
passageway 111. As seen in FIGS. 7 and 8, a pair of wire pipes, or
conduits 152 and 153 extend through the coaxially aligned and
longitudinally disposed passageways 105 and 145, respectively. The
wire pipes, or conduits include a first wire pipe 152 which directs
electrical conduits (not shown) to a heating unit or assembly such
as a resistor wire which is located within the pedestal 154 (not
shown); and a second wire pipe 153 which directs electrical
conduits (not shown) to a temperature detection apparatus which is
operable to detect the surface temperature of the accompanying
pedestal 154. The pedestal 154 which is mounted on the first end
141 of the supporting rod has a top supporting surface 155 which
supports the semiconductor work piece 87 (FIG. 4) within the
processing chamber 31 for processing.
[0042] Referring more specifically to FIGS. 7, 8 and 13, the
processing apparatus for semiconductor work pieces 40 of the
present invention includes individual bellow seals 160 which are
positioned within each of the processing stations 32. The
respective bellow seals 160 operate to insure that the connection
between the supporting rod 140, and the processing chamber 31 is
substantially sealed. In this regard, the bellow seal 160 sealably
couples to the bottom of the processing chamber 31 in the manner as
follows. Referring now to FIG. 13, it will be seen that the bellow
seal 160 has a main body 161 through which the supporting rod 140
extends. The respective bellow seals 160 are generally
longitudinally symmetrically deformable, and further has a
corrugated main body 161 which can be distorted with pressure and
then restored to its original length once the pressure is removed.
The respective bellow seals 160 are typically fabricated from a
metal material such as stainless steel or the like. The main body
161 has a first end 162, and an opposite second end 163. Still
further, a first circumscribing flange 164 is positioned at the
first end 162, and further, a second circumscribing flange 165 is
positioned at the second end 163. As seen, the main body 161
defines a longitudinally disposed passageway 166 through which the
supporting rod 140 extends. Additionally, a sealing member 167 is
positioned about, or otherwise cooperates with the first flange
164, and is operable to substantially seal the first flange to the
bottom of the processing chamber 31. The first and second flanges
164 and 165 are fabricated from metal. Therefore, the first and
second flanges 164 and 165 can be affixed to adjacent surfaces by
welding and the like.
[0043] Referring now to FIG. 8, the processing apparatus for
semiconductor work pieces 40 of the present invention further
includes a first outer shell which is generally indicated by the
numeral 170. The first outer shell has a first or upper end 171 to
which the second end 163 of the bellow seal 160 is secured by
welding or the like. Further, the first outer shell 170 has a
second, or lower end 172 which is remote thereto. The first outer
sell 170 has an inside facing surface 173, and an outside facing
surface 174. As seen in the drawings, the first outer shell 170 is
received in the apertures or receiving stations 73 which are
defined by the first support member 70. The inside facing surface
173 defines a longitudinally disposed passageway 175 which extends
between the first and second ends 171 and 172, and which
telescopingly receives the rotatable shaft 100. As best seen by
reference to FIG. 8, a sealing member 176 is positioned or
otherwise received on the first end 171, and is operable to seal
thereagainst the second end 163 of the bellow 160. As will be
recognized, for example, by a study of FIG. 8, the rotating shaft
100, which comprises a part of the platform rotation mechanism for
rotating the semiconductor work piece 87 extends into the
longitudinally disposed passageway 175 of the first outer shell and
is rotatable relative thereto. As will be seen by reference to FIG.
8, a pair of bearings 180, of conventional design, are mounted or
otherwise received within the longitudinally disposed passageway
175 and are positioned such that respective bearings are positioned
on or near the opposite ends thereof. The pair of bearings 180
facilitate rotation of the rotatable shaft member 100 as described
earlier. In addition to the foregoing, a magnetic sealing component
which is generally indicated by the numeral 181, is positioned near
the first or upper end 171, and thereby sealingly couples the
rotating shaft 100 relative to the first outer shell 170. Referring
now to FIGS. 8 and 12, it will be seen that the first outer shell
170, and more specifically the first end 171 thereof, defines, at
least in part, a second coolant passageway 182 (FIG. 12). The
second coolant passageway includes a second coolant slot 183 which
is positioned near the first end 171, and which circumscribes same.
The second coolant slot 183 has a first intake end 184, and a
second exhaust end 185. Still further, an external exhaust conduit
186 is coupled in fluid flowing relation relative to the second
exhaust end 185 (FIG. 12). As should be understood, the second
coolant passageway 182, which is formed in the first outer shell
170 is positioned, at least in part, near the magnetic sealing
component 181. Still further, the first and second coolant
passageways 111 and 182, respectively, are coupled in fluid flowing
relation one relative to the other by way of an externally mounted
conduit 187. As further seen by reference to FIGS. 7 and 8, a
sealing component 188 is positioned in covering relation relative
to the second coolant slot 183 and thereby sealably engages the
bellow seal which is generally indicated by the numeral 160.
[0044] The present invention 40 further includes a second outer
shell which is generally indicated by the numeral 200, and which
cooperates with, and is generally coaxially aligned relative to the
first outer shell 170. The second outer shell has a first end 201
which is juxtaposed relative to the second or lower end 172 of the
first outer shell, and is affixed thereto by conventional
fasteners. Further, the second outer shell has an opposite, second
end 202. Still further, the second outer shell has an inside facing
surface 203, and an outside facing surface 204. Still further, a
longitudinally disposed passageway 205 is defined by the inside
facing surface 203, and extends between the first and second ends
201 and 202. This passageway is substantially coaxially aligned
relative to the longitudinally disposed passageway 175 which is
defined by the first outer shell 170. As best illustrated in the
drawings, it will be appreciated that the sprocket belt roller 130
is disposed in predetermined spaced relation relative to the second
end 202. As earlier described, rotational force imparted to the
sprocket belt roller 130 is operable to impart rotational movement
to the rotatable shaft 100 so that it may freely rotate within the
passageway 175. As best seen by reference to FIG. 11, it will be
appreciated that first and second apertures 206 and 207,
respectively, are formed in the second outer shell 200 and which
facilitate fluid flowing communication with the longitudinally
disposed passageway 205 for the purposes which will be described in
further detail, below.
[0045] Referring more specifically to FIGS. 11 and 12, it will be
seen that the processing apparatus 40 of the present invention
includes a plurality of sealing components which are generally
indicated by the numeral 210, and which are received within the
longitudinally disposed passageway 205, and which sealingly couples
the rotatable shaft 100 to the second outer shell 200. The
plurality of sealing components 210 are disposed in predetermined
spaced relation along the rotatable shaft 100. The plurality of
sealing components further define a first ring gap 211, and a
second ring gap 212 which are best seen by reference to FIG. 11. As
should be understood, the first ring gap 211, and the second ring
gap 212 are operable to pass coolant therealong as will be
described below. With regard to FIGS. 9, 10 and 11, it will be
appreciated that the first aperture 120 formed in the rotatable
shaft 100 is located within the first ring gap 211; and further a
coolant inlet or conduit 213 is coupled in fluid flowing relation
relative thereto. A source of coolant (not shown) enters in through
the coolant inlet/conduit 213 and travels along the first ring gap
211. The coolant thereafter enters the first portion 115 of the
first coolant passageway 111. Still further, the second aperture
124 formed in the rotating shaft 100, and which is located at the
second end 113 of the second portion 121 of the first coolant
passageway 111, is located within the second ring gap 212. As
earlier described, an external conduit 187 has a first end which is
coupled in fluid flowing relation one relative to the second ring
gap 212, and an opposite second end which is coupled in fluid
flowing relation one relative to the second coolant passageway 182,
which is defined, in part, by the second coolant slot 183. In this
arrangement, coolant leaving the first portion 115 of the first
cooling passageway 111 travels along the first coolant slot 114,
and then passes into the second portion 121 of the first coolant
passageway. The coolant then exits the second portion of the first
coolant passageway by way of the second aperture 124. The coolant
then travels along the second ring gap 212. The coolant then exits
the second ring gap 212 and enters into the first end 187A of the
external conduit 187. The coolant exits the second end 187B of the
external conduit 187 and enters into the second coolant passageway
182 which is defined, in part, by the second coolant slot 183. As
earlier described, the second coolant slot 183 circumscribes, at
least in part, the first end 171 of the first outer shell 170 and
is further disposed in spaced relation relative to the first
coolant slot 114. The second coolant slot has a first intake end
184 and a second exhaust end 185. The second end 187B of the
external conduit 187 is coupled in fluid flowing relation relative
to the first intake end 184 of the second coolant slot. Still
further, the present invention includes, as earlier described, an
external exhaust conduit 186 coupled to the second exhaust end 185
of the second coolant slot and which exhausts the coolant to
ambient.
[0046] Referring now to FIG. 15, it should be understood that a
processing apparatus for semiconductor work pieces 40 of the
present invention includes a platform rotation mechanism which is
generally indicated by the numeral 220, and which individually
cooperates with each of the heated and rotatable processing
stations 32 in order to simultaneously heat and rotate the
respective processing stations 32 in a synchronous fashion. In this
regard, the platform rotation mechanism which is mounted below the
processing chamber 31 includes an electrical motor 221 which has a
drive shaft (not shown), and wherein a drive sprocket/pulley 222 is
mounted on the drive shaft and is rotatable therewith. Still
further, and mounted adjacent to the electric motor 221 is a first
pair of spaced idler pulleys 223. Still further, and located in
spaced relation relative to the respective sprocket belt roller
assemblies 130 which are mounted on the respective processing
stations 32, are a second pair of idler pulleys 224. As seen from
the drawing, a continuous belt 225 is received thereabout the drive
sprocket/pulley 222 and is directed by way of the first and second
pairs of idler pulleys 223 and 224 to matingly and forcibly engage
the respective sprocket belt roller assemblies 130 as provided for
on each of the processing stations 32. As should be understood, the
continuous belt 225 has an undulating or ribbed drive surface 226.
As earlier described, the sprocket belt rollers are operable to
matingly and drivingly engage the undulating drive surface 226 of
the continuous belt 225. As seen in FIG. 15, the single electric
motor 221 is operable to simultaneously drive or rotate adjacent
processing stations 32 in an advantageous manner.
Operation
[0047] The operation of the described embodiment of the present
invention is believed to be readily apparent and is briefly
summarized at this point.
[0048] In its broadest aspect, the present processing apparatus for
semiconductor work pieces of the present invention 40 comprises a
processing chamber 31 having an internal cavity 33, and which
further has a plurality of rotatable processing stations 32
positioned in the internal cavity 33. Each of the respective
rotatable processing stations 32 process individual semiconductor
work pieces 87. As earlier described, a platform rotation mechanism
220 individually cooperates with each of the rotatable processing
stations 32; and an electrical motor 221 is coupled to at least two
rotatable processing stations 32 so as to drive the respective
processing station in a synchronous fashion. As seen in FIG. 15,
the electric motor 221 is drivingly coupled to the respective
rotatable processing stations by a continuous belt 225. In the
arrangement as seen in that drawing, a sprocket belt roller 130 is
mounted on each of the respective rotatable processing stations 32.
The continuous belt 225 transmits force from the electric motor 221
to the respective sprocket belt rollers 130 so as to cause rotation
of the respective rotatable processing stations 32.
[0049] Another aspect of the present invention relates to a
processing apparatus for semiconductor work pieces 40 which
comprises a processing chamber 31 having an internal cavity 33 and
which has a plurality of rotatable processing stations 32 located
within the internal cavity 33. The respective processing stations
32 are each operable to process a semiconductor work piece 87. The
plurality of rotatable processing stations 32 can move upwardly,
downwardly and/or rotate relative to the processing chamber 31. The
present invention 40 further comprises a sealing assembly such as
the bellow seal 160, and the magnetic sealing components 181, and
which maintain the internal cavity 33 of the processing chamber 31
substantially sealed while the rotatable processing stations 32
move upwardly, downwardly and rotate. Still further, the processing
apparatus 40 further comprises a cooling apparatus for cooling the
sealing assemblies to facilitate the proper operation of the
sealing assemblies. In this regard, the cooling apparatus includes
a first coolant passageway 111; a second coolant passageway 182;
the first and second ring gaps 211 and 212, respectively; as well
as the externally mounted conduit 187 which is operable to direct a
source of coolant which facilitates the cooling of various
assemblies within the apparatus 40, and further inhibits heat
related damage to the seals of the processing chamber 30.
[0050] The present invention also relates to a method for
processing semiconductor work pieces 87 which comprises a first
step of providing a processing chamber 31 having an internal cavity
33; and providing a plurality of processing stations 32 within the
internal cavity 33 of the processing chamber. The methodology
further includes another step of positioning individual
semiconductor work pieces 87 on each of the individual processing
stations 32; and rotating and heating the individual processing
stations 32 so as to facilitate the effective processing of the
semiconductor work pieces 87 within the internal cavity 33 of the
processing chamber 32. As earlier disclosed, the method includes
another step whereby the plurality of processing stations 32 are
synchronously rotated.
[0051] As will be recognized from the foregoing, a first outer
shell 170, and second outer shell 200, can be made into a unitary
structure. Further, the first coolant passageway 111, and second
coolant passageway 182, which are joined together in fluid flowing
relation by the external conduit 187, provides a convenient means
whereby the coolant circulation path may be lengthened. This
facilitates the efficient utilization of the coolant. Further, the
present invention provides only one coolant inlet 213 which
provides the source of coolant to the present structure. This is an
extremely efficient design, and further reduces the cost of
manufacturing same.
[0052] Therefore it will be seen that the present invention
provides a convenient means for processing semiconductor work
pieces in a manner not possible heretofore. The present invention
further avoids many of the shortcomings attendant with the prior
art practices and processes utilized heretofore, and effectively
processes a multiplicity of semiconductor work pieces in an
efficient and highly advantageous manner.
[0053] In compliance with the statute, the invention has been
described in language more or less specific as to structural and
methodical features. It is to be understood, however, that the
invention is not limited to the specific features shown and
described, since the means herein disclosed comprise preferred
forms of putting the invention into effect. The invention is,
therefore, claimed in any of its forms or modifications within the
proper scope of the appended claims appropriately interpreted in
accordance with the doctrine of equivalents.
* * * * *