U.S. patent application number 11/488328 was filed with the patent office on 2007-02-01 for laminate structure.
This patent application is currently assigned to Stora Enso AB. Invention is credited to Lars Sandberg.
Application Number | 20070023929 11/488328 |
Document ID | / |
Family ID | 37708916 |
Filed Date | 2007-02-01 |
United States Patent
Application |
20070023929 |
Kind Code |
A1 |
Sandberg; Lars |
February 1, 2007 |
Laminate structure
Abstract
The invention relates to a laminate structure comprising a first
active layer having a first electrode potential, a second active
layer having a second electrode potential, wherein the second
electrode potential being different from the first electrode
potential and wherein the first and second active layers are
arranged at a distance from each other, and wherein the laminate
further comprises a third layer of an electrically weakable
adhesive at least partly bridging said distance between the first
and second layers.
Inventors: |
Sandberg; Lars; (Hammaro,
SE) |
Correspondence
Address: |
GREER, BURNS & CRAIN
300 S WACKER DR
25TH FLOOR
CHICAGO
IL
60606
US
|
Assignee: |
Stora Enso AB
|
Family ID: |
37708916 |
Appl. No.: |
11/488328 |
Filed: |
July 18, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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60704307 |
Aug 1, 2005 |
|
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60765854 |
Feb 7, 2006 |
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Current U.S.
Class: |
257/783 |
Current CPC
Class: |
B29C 66/43 20130101;
B29C 66/43121 20130101; Y10T 428/13 20150115; B29C 65/3492
20130101; B29C 65/3604 20130101; B29L 2031/7158 20130101; B65D
5/4275 20130101; Y10T 156/10 20150115; B65D 71/50 20130101; B29C
65/3676 20130101; B65D 43/162 20130101; H01M 10/0436 20130101; B29C
66/1222 20130101; B29C 66/53461 20130101; B29C 65/3456 20130101;
B29C 65/3468 20130101; Y10S 206/813 20130101; B29C 66/549 20130101;
Y10T 156/1158 20150115; B29C 65/3684 20130101; B29C 65/48 20130101;
B29C 66/61 20130101; B29K 2711/12 20130101; H01M 6/30 20130101;
H05K 2203/175 20130101; B29C 65/488 20130101; Y02E 60/10 20130101;
B29C 65/76 20130101; B29C 66/114 20130101; B65D 43/26 20130101;
H05K 2203/105 20130101; H05K 3/321 20130101; B29C 65/4855 20130101;
C09J 5/00 20130101; B29C 66/1122 20130101; B29L 2031/7132 20130101;
B29C 66/112 20130101; B29C 66/1224 20130101; B65D 21/0205 20130101;
B65D 53/04 20130101; H01M 6/40 20130101; B65D 77/20 20130101; B29C
66/24221 20130101; B29C 66/545 20130101; C09J 2301/502 20200801;
Y10T 292/48 20150401 |
Class at
Publication: |
257/783 |
International
Class: |
H01L 23/48 20060101
H01L023/48 |
Claims
1. Laminate structure comprising a first active layer having a
first electrode potential, a second active layer having a second
electrode potential, wherein the second electrode potential being
different from the first electrode potential, wherein the first and
second active layers are arranged at a distance from each other,
and wherein the laminate further comprises a third layer of an
electrically weakable adhesive at least partly bridging said
distance between the first and second layers.
2. Laminate structure according to claim 1, wherein the third layer
bridges said distance between the first and second layers.
3. Laminate structure according to claim 1, wherein said distance
between the first and second active layers is bridged by the third
layer and a fourth layer formed of an electrically conductive
adhesive.
4. Laminate structure according to claim 1, further comprising a
first substrate with a surface supporting the first and second
active layers, wherein the first active layer is separated from the
second active layer a distance along the surface of the first
substrate.
5. Laminate structure according to claim 4, wherein the first
substrate is formed of a non-conductive material.
6. Laminate structure according to claim 4, wherein the first
substrate is formed of paper board.
7. Laminate structure according to claim 4, wherein the first
substrate is formed of plastic.
8. Laminate structure according to claim 4, wherein the first
substrate is connectable to a second substrate, wherein the
electrically weakable adhesive is arranged to be located between
the first and second substrate.
9. Laminate structure according to claim 8, further comprising a
non electrically weakable adhesive arranged as a layer arranged to
be located between the electrically weakable adhesive and the
second substrate.
10. Laminate structure according to claim 1, further comprising a
plurality of said first active layer of a first material having a
first electrode potential, and a plurality of said second active
layer of a second material having a second electrode potential,
wherein said first and second layers are arranged in a plurality of
pairs, wherein respective first active layer and respective second
active layer of each pair is separated from each other a distance,
and wherein each distance, apart from a least one distance being
bridged by the electrically weakable adhesive, is bridged by an
electrolyte material, and wherein the pairs are connected to each
other by connecting the first active layer of a first pair to the
second active layer of a second pair.
11. Laminate structure according to claim 10, further comprising a
first substrate with a surface supporting said plurality of first
and second active layers, wherein each respective first active
layer is separated from each respective second active layer a
distance along the surface of the first substrate.
12. Laminate structure according to claim 1, further comprising a
switch member by which the first and second active layers are
electrically connectable to each other.
13. Laminate structure according to claim 1, further comprising a
first connector electrically connected to the first active layer
and a second connector electrically connected to the second active
layer, wherein the first and second connectors are adapted to be
electrically connected to each other by an external connector.
14. Method of releasing a laminate structure for opening or
releasing a package or releasing a connecting element, comprising
providing a first active layer having a first electrode potential,
providing a second active layer having a second electrode
potential, wherein the second electrode potential being different
from the first electrode potential, wherein the first and second
active layers are arranged at a distance from each other, and
providing a third layer of an electrically weakable adhesive at
least partly bridging said distance between the first and second
layers, releasing the electrically weakable adhesive by
electrically connecting the first and second active layers.
Description
FIELD OF INVENTION
[0001] The present invention relates to a laminate structure which
make use of an electrically weakable adhesive and which may easily
be broken or weakened.
TECHNICAL BACKGROUND
[0002] It is well known in the art that polymer chains can be
broken by the application of a voltage. This is for example
discussed in a review article by G. S. Shapoval (Cathodic
initiation of reactions of macromolecule formation and degradation,
Theoretical and Experimental Chemistry, Volume 30, Number 6,
November 1994).
[0003] US 6,620,308 B2 discloses a material for use in the airplane
industry. As is evident from the published patent, the material has
been developed under the supervision of the U.S. Department of the
Air Force. The material is developed for use as coatings and
adhesives. It is further elaborated in US 6,620,308 that the
adhesive bonds and polymeric coatings are commonly used in the
assembly and finishing of manufactured goods. It is stated that
adhesive bonds are used in place of mechanical fasteners, such as
screw, bolts and rivets, to provide bonds with reduced machining
costs and greater adaptability in the manufacturing process. It is
further discussed that adhesive bonds distribute stresses evenly,
reduce the possibility of fatigue, and seal the joints from
corrosive species. It further asserts that, similarly,
polymer-based coatings are commonly applied to the exterior surface
of the manufactured products. These coatings provide protective
layers that seal the surface from corrosive reactants, as well as
provide a painted surface that can the aesthetically pleasing.
[0004] The composition disclosed in US 6,620,308 B2 has a matrix
functionality and an electrolyte functionality, wherein the
electrolyte functionality is provided by a block copolymer or a
graft copolymer. The matrix functionality provides an adhesive bond
to a substrate, and the electrolyte functionality provides
sufficient ionic conductivity to the composition to support a
faradic reaction at an interface with an electrically conductive
surface in contact with the composition, whereby the adhesive bond
is weakened at the interface. The composition may be a
phase-separated composition having first regions or substantially
matrix functionality and second regions of substantially
electrolyte functionality.
[0005] US 6,620,308 B2 discloses that the electrical power supply
may supply direct or alternating current. It continues by stating
that direct current may be supplied from a battery or an AC-driven
DC-power. The composition is applied between two conductive
surfaces and by applying the voltage to the two conductive surfaces
the bonding between the composition and one of the conductive
surfaces is broken. Thus, a battery may be used and thereby be
connected with one pole to one of the conductive surfaces and the
other pole to the other conductive surface. US 6,620,308 B2
mentions that the conductive surfaces may be formed of wire mesh,
metal foil, and a conductive coating, e.g. a silver-filled
epoxy.
SUMMARY OF INVENTION
[0006] It is an object of the invention to provide a laminate
structure which may easily be broken.
[0007] This object has been achieved in accordance with the
invention with a laminate structure comprising a first active layer
having a first electrode potential, a second active layer having a
second electrode potential, wherein the second electrode potential
being different from the first electrode potential and wherein the
first and second active layers are arranged at a distance from each
other, and wherein the laminate further comprises a third layer of
an electrically weakable adhesive at least partly bridging said
distance between the first and second active layers.
[0008] The first and second active layers are adapted to be
electrically connected to each other via a conductor being separate
from the third layer, thereby forming a closed circuit from the
first active layer, via the conductor to the second active layer
and from the second active layer to the first active layer via the
third layer.
[0009] The different electrode potentials may be provided by
forming the first active layer of a first material having the first
electrode potential and forming the second active layer of a second
material having the second electrode material. It may also be
accomplished by providing a first electrolyte providing the first
electrode potential in connection with the first active layer and
providing a second electrolyte providing the second electrode
potential in connection with the second active layer. The
electrically weakable adhesive may be one of said electrolytes. The
design may also be a combination with different materials in the
active layers and with different electrolytes in connection with
respective active layer. In accordance with one embodiment the
laminate structure comprises a first active layer of a first
material having a first electrode potential and a second active
layer of a second material having second electrode potential.
Between those active layers is a layer of an electrically weakable
adhesive arranged. This adhesive also acts as the electrolyte for
the electrodes.
[0010] By providing a laminate structure of materials with
different electrode potentials and an electrically weakable
adhesive it is possible to accomplish a laminate structure that is
easily broken by simply short-circuiting the electrodes formed by
the first and second active layers. This short-circuiting may be
performed by closing an integrated switch, by providing an external
tool basically comprising a conductor being connectable to the
first and second layers, or even simply by short-circuiting it by
putting a finger in connection with both the first and second
active layers and thereby letting the moisture on the finger act as
a conductor. The short-circuiting might also be provided with any
suitable metallic object, such as a key, a bottle opener or the
like. By providing the different electrodes within the laminate
structure, the need for an external power source is dispensed with.
Thereby the laminate structure may be used for applications also
where it would be inconvenient to bring a power source. It is e.g.
especially convenient to be able to dispense with the external
power source when it comes to package applications. When buying a
package provided with the laminate structure above, the package may
easily be opened by short-circuiting the laminate structure such
that the glued opening is easily brokened. Since the laminate
structure internally provides the necessary energy, the buyer may
open the package without the need for any external power source.
This is especially useful if the buyer wants to open the package
before coming home or when on a picnic.
[0011] Preferred embodiments of the invention appear from the
dependent claims.
[0012] The third layer may bridge said distance between the first
and second active layers. By letting the third layer bridge the
distance between the first and second active layers a simple design
of the laminate structure is provided. The laminate may easily be
provided by providing the first active layer, applying the
electrically weakable adhesive onto the first active layer and then
providing the second active layer onto the electrically weakable
adhesive.
[0013] The distance between the first and second active layers may
be bridged by the third layer and a fourth layer formed of an
electrically conductive adhesive. With this design it is possible
to provide a semi-finished product with one of the active layers
already provided with the electrically weakable adhesive. When
closing the laminate structure a conventional electrically
conductive adhesive is applied to the other active surface or to
the electrically weakable adhesive and the laminate structure is
finalised.
[0014] The laminate structure may further comprise a first
substrate with a surface supporting the first and second active
layers, wherein the first active layer may be separated from the
second active layer a distance along the surface of the first
substrate.
[0015] In this way, it is possible to pre-manufacture parts of the
structure with the active surfaces on a substrate or carrier layer.
It may be noted that supported does not necessarily mean that the
active surfaces need to be in direct contact with the first carrier
layer. In one embodiment the first active surface is laminated
directly onto the first carrier layer, whereas significant portions
of the second active surface is laminated onto an insulating layer
laminated onto the first active surface. The laminate structure is
still supported by the first carrier layer.
[0016] The first substrate may be formed of a non-conductive
material. In this way, the conductors may simply be provided as
printed or laminated conductors on the non-conductive material.
There will be no immediate need for more complicated laminate
structures with insulating layers, etc.
[0017] The first substrate may be formed of plastic or of paper
board. These materials are preferred since it is easy to provide a
connecting element or package in plastic or in paper board. They
are also normally non-conducting making it easy to provide them
with an electrical circuitry using e.g. a printing or laminating
technique.
[0018] The first substrate may be connectable to a second
substrate, wherein the electrically weakable adhesive is arranged
to be located between the first and second substrate. This is
especially suitable for package applications where the first and
second substrates are formed of different portions of a paper
package and wherein the active surfaces are applied to the surfaces
of respective substrate.
[0019] The laminate structure may further comprise a non
electrically weakable adhesive arranged as a layer arranged to be
located between the electrically weakable adhesive and the second
substrate. If both active layers are formed on the first substrate
and the electrically weakable adhesive bridges the distance between
the active layers, this non electrically weakable adhesive may also
be non-conductive. If the second substrate carries the second
active layer, the non electrically weakable adhesive need to be
electrically conductive in order to form an electric circuit
between the first and second active layers via the electrically
weakable adhesive.
[0020] The laminate structure may further comprise a plurality of
said first active layer of a first material having a first
electrode potential, and a plurality of said second active layer of
a second material having a second electrode potential, wherein said
first and second layers are arranged in a plurality of pairs
wherein respective first active layer and respective second active
layer of each pair is separated from each other a distance, and
wherein each distance, a part from a least one distance being
bridged by the electrically weakable adhesive, is bridged by an
electrolyte material, and wherein the pairs are connected to each
other by connecting the first active layer of a first pair to the
second active layer of a second pair. By providing a plurality of
alternately arranged first and second active layers a stacked
battery is provided. In this way, it will be possible to provide a
greater voltage and electric current through the electrically
weakable adhesive, thereby accomplishing a more distinct or more
rapid weakening of the laminate structure.
[0021] The laminate structure may further comprise a first
substrate with a surface supporting said plurality of first and
second active layers, wherein each respective first active layer is
separated from each respective second active layer a distance along
the surface of the first substrate. By providing the plurality of
first and second active surfaces along the substrate surface it is
possible to provide the higher voltage without any significant
increase in space requirement. On a package solution it will only
slightly increase the thickness of the package material compared to
a laminate structure with a single set of one first active layer
and one second active layer.
[0022] The laminate structure may further comprise a switch member
by which the first and second active layers are electrically
connectable to each other. In this way, it is possible to secure
that the electrical connection is provided with controlled
electrical resistance.
[0023] The laminate structure may further comprise a first
connector electrically connected to the first active layer and a
second connector electrically connected to the second active layer,
wherein the first and second connectors are adapted to be
electrically connected to each other by an external connector. This
is a simple design where the active surfaces are simply provided
with an externally accessible portion. The external connector may
as discussed above be an especially adapted tool but it may also be
a key, bottle opener or the like, commonly accessible to a
user.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The invention will by way of example be described in more
detail with reference to the appended schematic drawings, which
shows presently preferred embodiments of the invention.
[0025] FIG. 1 shows a first basic structure in which different
layers are connected to each other using an electrically weakable
adhesive.
[0026] FIG. 2 shows in an exploded view a first embodiment of a
second basic structure with the active surfaces arranged on the
same side of the adhesive layer.
[0027] FIG. 3 shows in an exploded view a second embodiment of the
second basic structure.
[0028] FIG. 4 shows a cross-section of the structure in FIG. 3.
[0029] FIG. 5 shows in an exploded view of a third embodiment of
the second basic structure.
[0030] FIG. 6a shows a sandwich structure comprising a plurality of
first and second active layers.
[0031] FIG. 6b shows a flattened structure comprising a plurality
of first and second active layers.
[0032] FIG. 7 shows an embodiment with a second adhesive interposed
between the electrically weakable adhesive and one of the active
surfaces.
[0033] FIG. 8 shows an embodiment where twelve packages are being
held together by two panels.
[0034] FIG. 9 shows a panel as shown in FIG. 8.
[0035] FIG. 10a shows two packages adapted to be held together to
form a distribution unit.
[0036] FIG. 10b shows in enlargement a portion of the package of
FIG. 10a.
[0037] FIG. 11a and 11b shows a set of secondary articles in the
form of a cup and a saucer connected to a handling element.
[0038] FIG. 12 shows a handling element connected to two secondary
articles in the form of two packages.
[0039] FIG. 13a shows in cross-section a package.
[0040] FIG. 13b shows in cross-section the package of FIG. 11a when
opened.
[0041] FIG. 14 shows a portion of a bottle neck provided with a
screw cap.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0042] The laminate structure described in the following makes use
of an electrically weakable adhesive material. The inventive
laminate structure comprises active surfaces acting as electron
and/or ion emitter and receiver connected with a bonding layer
formed by the electrically weakable adhesive material. The bonding
layer possesses adhesive properties and conductive properties. When
a voltage is applied between the active surfaces and current flows
through the bonding layer, bonds formed in or between the bonding
layer and at least one of the active surfaces are broken or
weakened. Thus, the bonding layer forms an electrically weakable
adhesive.
[0043] The electrically weakable adhesive may bridge the complete
distance between the active layers but may also be completed with
additional layers of other materials capable of performing the
necessary electrical and/or mechanical connection. Such materials
may be conventional non electrically conductive adhesives,
polymers, varnishes, or the like, or electrically conductive
versions of respective material.
[0044] The electrically weakable material and different basic
configurations of the active surfaces will initially be discussed
in detail separately from the specific designs of the packages. The
different designs of the packages will thereafter be discussed in
detail. In some cases the design of the package will be discussed
in combination with a specific kind of basic configuration. It
should however be noted that this is for exemplifying purposes and
that the different basic configurations may be combined with the
different designs of the packages.
[0045] According to one embodiment the bonding layer is composed of
a composition possessing both matrix functionality and electrolyte
functionality. The matrix and the electrolyte functionalities may
be formed by a single phase or several separate phases.
[0046] The matrix functionality provides the adhesive properties
necessary to bind surfaces to one another mechanically or
chemically. The matrix functionality may be provided by polymers,
polymer resins or fibres that possess adhesive properties.
[0047] The electrolyte functionality provides the ion conductivity
necessary to support a faradic reaction, i.e. an electrochemical
reaction in which a material is oxidized or reduced, or some other
chemical/physical reaction. The materials are preferably chosen and
designed such that the reaction occurs at the interface between one
or both of the active surfaces and the bonding layer. Alternatively
the bonding layer may be designed such that the reaction will occur
within the bonding layer. This may, e.g., be accomplished by
providing islands of a material with electrolyte functionality
within the matrix material. The electrolyte functionality may be
provided by adding a salt to the material or by modifying the
polymer so that it includes ion-coordinating moieties.
[0048] The electrically weakable adhesive used in the inventive
packages may be the electrochemically disbondable composition
ElectRelease.TM. supplied by EIC laboratories and disclosed in more
detail in US 6,620,308.
[0049] FIG. 1 shows a common basic structure comprising a first
carrier layer 1 and a second carrier layer 2. A first active layer
3 is laminated on the first carrier layer 1. A second active layer
4 is laminated on the second carrier layer 2. The active layers are
bonded together by a bonding layer 5, comprising an electrically
weakable adhesive.
[0050] The electrical potential between the active layers 3, 4 is
adapted to be provided by making the active layers 3, 4 of
different materials with different electrode potentials. If the two
active layers 3, 4 are connected, e.g. by moving a switch 7 to a
position where it connects the two layers 3, 4, a closed circuit is
formed and current will flow through the bonding layer 5, thereby
causing the adhesive bond to break or to weaken. For example,
copper and graphite can be used as active layers 3, 4 with
different potentials. This design will create a flow of direct
current between the active layers 3, 4 via the bonding layer 5.
[0051] By providing the active surfaces of different electrode
potential an electrochemical cell in which electrical power is
produced by a chemical reaction is provided. The electrochemical
cell comprises basically two electrodes (the plus pole and the
minus pole, respectively) connected to each other by an electrolyte
and by an outer electrical circuit. When the cell is activated the
electrical current runs in the outer circuit from the plus pole to
the minus pole and in the electrolyte back from the minus pole to
the plus pole. The electric current is formed of a transport of an
electrical charge. In the outer circuit this transport of charges
is accomplished by electrons in movement from the minus pole to the
plus pole. In the electrolyte the transport is accomplished by
ions; negative ions in movement from the plus pole to the minus
pole, and positive ions in movement in the opposite direction. By
providing the possibility of movement of the electrons in the outer
circuit the chemical reaction in the electrochemical cell may
continue. At the minus pole the electrons are produced by the
material loosing their electrons (oxidation) and at the plus pole
they are consumed by materials receiving the electrons
(reduction).
[0052] In order to investigate the battery structure a number of
different battery structures were prepared using ElectRelease as
the electrically weakable adhesive. The structures were cured for 1
hour at 80.degree. C. in a convection oven. Battery potentials
immediately after fabrication are given in Table 1. TABLE-US-00001
TABLE 1 Battery potentials after fabrication Type no Battery type
Electrolyte Voltage 1 Pb/PbO.sub.2 ElectRelease .about.0.8 V 2
Zn/MnO.sub.2 ElectRelease .about.1.0 V 3 Cu/Al ElectRelease <0.2
V 4 Ag/MnO.sub.2 ElectRelease <0.2 V 5 Al/air ElectRelease
.about.0.2 V
[0053] Battery type no 1 was produced by disassembling a
conventional 6 V battery and then using the electrodes therein as
the electrodes separated by the ElectRelease as the electrolyte.
Battery type no 2 was produced using zinc-foil and manganese
dioxide foil glued together with ElectRelease and battery type no 3
was produced using copper foil and aluminum foil. Battery type no 4
was produced using screen printed silver and a printed mixture of
MnO.sub.2 powder in carbon screen printing paste. Battery type no 5
was prepared by wetting a filter paper with ElectRelease and then
gluing it to an aluminium foil. Steel wool was glued on top of the
filter paper as a contact for the air electrode. The ElectRelease
was applied with a thickness of about 200 .mu.m.
[0054] When short circuiting a Zn/MnO.sub.2 battery with
ElectRelease electrolyte a current was measured during the first
five minutes. The current quickly reached a current of about 7
.mu.A and then slowly decreased during the five minutes to about 6
.mu.A. This indicates an ongoing discharge process. Disbonding was
however not observed after five minutes.
[0055] A number of Zn/MnO.sub.2 battery structures was produced and
was left over weekend. Some of the samples were left short
circuited and some open. None of the open samples had disbanded
after the weekend (>48 hours). A plurality of the short
circuited samples had disbonded cleanly in the same manner as has
been observed in tests where an external voltage has been applied.
Disbonding occurred at the Zn electrode and the disbonded surface
was clean. Disbonding was investigated by manually applying a
gentle pulling force to the samples.
[0056] Other conceivable material combinations for providing the
electrode potential are, but not limited to: Pb/PbO.sub.2, Cu/Al,
Ag/MnO.sub.2, Al/air, Zn/air, Li/SOCl.sub.2, Li/SO.sub.2,
Li/MnO.sub.2, Mg/MnO.sub.2, Zn/HgO, Zn/carbon, Cd/HgO, Zn,
Ag.sub.2O, Zn/O.sub.2, Zn/HgO.
[0057] FIGS. 2-5 show embodiments wherein the active surfaces are
arranged on the same side on a carrier layer. In FIGS. 2, 3 and 5,
the different layers are for clarity reasons illustrated at a
distance from each other. However, it is apparent that in practice
the layers forms a laminated structure. From the description below
it will follow in which cases the different disclosed layers need
to be in direct contact with each other and when there may be one
or more additional, non-disclosed layers between the disclosed
layers. It may also be noted that in direct contact may dependent
upon the situation mean in mechanical contact or in electrical
contact.
[0058] FIG. 2 shows an embodiment wherein the active surfaces 3, 4
are arranged on the same side of the bonding layer, instead of
being provided as two separate layers 3, 4 on either side of the
bonding layer 5 as in FIGS. 1a-c. The structure comprises two
carrier layers 1, 2 that are to be delaminated. The carrier layers
1, 2 may, e.g., be made of paper, paper board or plastic, but other
materials are contemplated. The active surfaces 3, 4 are arranged
on one side of the bonding layer 5 and are separated from each
other a distance d along the surface 5a of the carrier layer 1.
[0059] The active surfaces 3, 4 may be applied to the first carrier
layer 1 using any conventional method, they may e.g. be printed or
laminated onto the carrier layer 1. The active surfaces 3, 4 may be
made of any conductive material, e.g. metal ink or foil, having
different electrode potential. The bonding layer 5 is provided
between respective active surface 3, 4 and the second carrier layer
2, thereby bonding the active surfaces 3, 4 to the second carrier
layer 2 and in turn thereby bonding the two carrier layers 1, 2 to
each other. The bonding layer 5 typically reaches the first carrier
layer 1 in the small accessible area formed by the gap or distance
d between the active surfaces 3, 4. As shown in FIG. 2, one of the
active surfaces 3 has an area of distribution formed as an open
half-circle partially enclosing the other active surface 4. This
other active surface 4 has an area of distribution formed as a
circle. The two active surfaces 3, 4 form a gap formed as a part of
a ring, in this case a part of a circular ring, having a width
defined by the above mentioned distance d.
[0060] The active surfaces 3, 4 are also connectable to each other
via a circuit 9 comprising a switch 7. The electrode potential is
shown as a voltage supply 6.
[0061] When the switch 7 is closed the electrode potential will
cause a current to flow between the active surfaces 3, 4 via the
bonding layer 5. This will cause the bonds in the bonding layer 5
or between the bonding layer 5 and one or both of the active
surfaces 3, 4 to break or to weaken.
[0062] The accessible area of the first carrier layer 1 between the
active surfaces 3, 4 may be made so small that even if the bonding
layer 5 reaches the first carrier layer 1, the force needed to
break the bond between this accessible area and the bonding layer 5
is negligible.
[0063] FIGS. 3 and 4 shows yet another embodiment of a kind similar
to the one shown in FIG. 2. In the embodiment of FIGS. 3 and 4, the
active surfaces 3, 4 are separated out of the plane by an
insulating layer 10, but are still on the same side of the bonding
layer 5 compared to the second carrier layer 2. The first active
surface 3 is electrically connected to a connector 3a that formed
part of the first active surface 3 in the embodiment of FIG. 2.
[0064] The insulating layer 10 separates the conducting elements
and protects them from tear and wear. The connector 3a is in
contact with the first active surface 3, but there is no direct
connection between the connector 3a and the second active surface
4.
[0065] The second active surface 4 is provided on the carrier layer
1 as in the embodiment of FIG. 2. The insulating layer 10 is
provided on this structure. Above the insulating layer 10 is the
first active surface 3 arranged, and finally on top of this is the
bonding layer 5 arranged. Since the first and second active
surfaces 3, 4 are separated out of the plane, the first active
surface 3 may be formed as a circular member completely surrounding
the circular end portion of the second active surface 4. The active
surfaces 3, 4 and the insulating layer 10 provides a gap between
the active surfaces 3, 4 adapted to be bridged by the bonding layer
5. The bonding layer 5 may extend all the way from the second
carrier layer 2 to the first carrier layer 1 and thereby provide a
direct adhesion between the first and second carrier layer 1,
3.
[0066] FIG. 5 shows an alternative embodiment to the one shown in
FIGS. 3 and 4, wherein the bonding layer 5 is adapted to carry a
second bonding layer 11. This second bonding layer 11 may be formed
of an adhesive that do not have to be conductive or electrically
weakable. By providing this second bonding layer it is possible to
pre-manufacture the first carrier layer 1 with the active surfaces
3, 4 and the bonding layer 5, and then finally apply a second
bonding layer 11 on the electrically weakable bonding layer 5 when
the second carrier layer 2 is to be fastened to the first carrier
layer 1. This additional bonding layer 11 may also be used in the
design disclosed in FIG. 2.
[0067] An artisan will realise that there exists several
alternatives to and combinations of the above disclosed
embodiments. A brief discussion of some these alternatives follow
hereinafter.
[0068] Respective active surface/layer may be arranged directly or
indirectly via a laminating layer or the like on respective carrier
layers. The active layer may in it self form both active surface
and carrier layer.
[0069] As mentioned above the active surfaces may be separated in
the plane and/or out of the plane. In order to separate the active
surfaces out of the plane, an insulating layer, e.g. varnish, may
be used. Insulating layers may also be used to separate conductive
elements, such as active surfaces, from the carrier layer in cases
when the carrier layer is conductive. Additional conductors may be
arranged e.g. between the bonding layer and the second carrier
layer in order to increase the conductivity in the plane of the
structure.
[0070] The active surfaces are electrically conductive surfaces,
conductors, and are preferably coated, printed or laminated on at
least one carrier layer. However, if the carrier layers are
electrically conductive and of different electrode potentials, no
extra active surfaces are needed. The active surfaces may be
composed of any electrically conductive material, e.g. copper,
aluminium or graphite. The active surfaces may for example be in
the form of a metal ink.
[0071] The carrier layer represent surfaces that are to be
delaminated by the electrical force and can be of any conductive or
non-conductive material, e.g. paper, paper board, glass, metal,
wood, moulded fibres or plastic. Two opposite sides of an opening
of a package may for example represent a first and a second carrier
layer. This will discussed in more detail below.
[0072] In accordance with one embodiment, the carrier layers are
formed of carton boards and one of the active layers are formed of
an aluminium foil with oxide. The active surface is moisturized
with a salt solution and bonded together using a composition
comprising polyurethane. When a voltage is applied over the
laminate structure, the aluminium oxide on the positively charged
foil dissolves whereby the laminate is broken. The electrical force
may be applied by using another material for the formation of the
other active surface, whereby the second material is chosen such
that the aluminium will be the positively charged electrode.
[0073] In order to increase the power supply, several batteries can
be printed on the carrier layer 1 and connected to the active
surfaces. This enables all batteries and the active surfaces to be
printed on the carrier layer in the same process step, which
facilities the manufacturing of the structure.
[0074] This may e.g. be accomplished in an internal battery
structure by providing a plurality of said first active layer 3 of
a first material having a first electrode potential, and a
plurality of said second active layer 4 of a second material having
a second electrode potential, wherein said first and second layers
3, 4 are arranged in a plurality of pairs wherein respective first
active layer and respective second active layer of each pair is
separated from each other a distance, and wherein each distance,
apart from a least one distance being bridged by the electrically
weakable adhesive, is bridged by an electrolyte material, and
wherein the pairs are connected to each other by connecting the
first active layer of a first pair to the second active layer of a
second pair.
[0075] FIG. 6a discloses a first battery structure with a first
carrier layer 1 (e.g. of paper board), a first active layer 3, a
layer of an electrically weakable adhesive 5, a second active layer
4, a first active layer 3, a second electrolyte 5b, a second active
layer 4, and a second carrier layer 2 (e.g. of paper board). The
first pair A of first and second active layers 3, 4 are separated a
distance, the distance being bridged by an electrolyte 5b. The
second pair B of first and second active layers 3, 4 are separated
a distance, the distance being bridged by an electrically weakable
adhesive 5. The first active layer 3 of the first pair A is
connected to the second active layer 4 of the second pair B. In
this way, the potential difference created by the two pair
structure will across the electrically weakable adhesive be twice
the potential difference of a structure with only one pair of
active layers or electrodes 3, 4. By electrically connecting the
active layers being the farthest away from each other this
potential difference will induce a current through the complete
pack of pairs of active layers. In this case the second layer 4 of
the first pair A is to be connected to the first layer 3 of the
second pair. The structure may be provided with additional pair of
active layers in order to further increase the available potential
difference.
[0076] Alternatively, the pairs of active surfaces 3, 4 may be
arranged side by side on one of the carrier layers 1 as shown in
FIG. 6b. The first pair of active layers 3, 4 are separated a
distance (along the surface of the first carrier layer 1) from each
other, the distance being bridged by an electrolyte 5b. The second
pair of active layers 3, 4 are separated a distance from each other
(in the direction of the normal of the surface of the first carrier
layer 1), the distance being bridged by an electrically weakable
adhesive 5. The resulting potential difference across will induce a
current through the complete pack of pairs once the active layers
being the farthest away from each other are connected to each
other. In this case the first active layer 3 to the left in FIG. 6b
is connected to the second active layer 4 at the top of the stack
to the right in FIG. 6b. The structure may be provided with
additional pair of active layers in order to further increase the
available potential difference.
[0077] Both the stack in FIG. 6a and FIG. 6b may be ended with the
layer structure of FIGS. 2-5 as the pair of active layers with the
distance between them being bridged by the electrically weakable
adhesive.
[0078] Another embodiment with an additional adhesive electrolyte
is shown in FIG. 7. If the electrically weakable adhesive 5 has
good electrolyte properties only with one of the active surfaces 3
it is contemplated to use a second adhesive electrolyte 5b (not
necessarily electrically weakable) as a layer between the
electrically weakable adhesive 5 and the active surface 4 to which
the electrically weakable adhesive 5 does not show good electrolyte
properties. The non electrically weakable adhesive 5b is
electrically conductive in order to form an electric circuit
between the first and second active layers 3, 4 via the
electrically weakable adhesive 5. In this case the non electrically
weakable adhesive is conductive both for a simple sandwich
structure as shown in FIG. 1 and for the structure as shown in
FIGS. 2-5. In this way the electrolyte properties may be optimised
at both electrodes. Also in the design of FIGS. 2-5, the additional
adhesive 5b will be in contact with one of the active layers 3, 4
and the electrically weakable adhesive 5, whereas the electrically
weakable adhesive will be in contact with the other active layer 4,
3. It may be noted that the additional adhesive 11 of FIG. 5 does
not form part of the electric circuit between the first and second
layers 3, 4.
[0079] The delaminating material structure comprising carrier
layers, active surfaces and an electrically weakable adhesive as
described above may be used whenever the strength of a seal needs
to be released, for example in the construction of packages. By
providing the material structure as described above the packages
may be opened by the application of a voltage. It can be used in
all kinds of packages, such as cans, jars, bottles, cartons and
blister packages. It may also be used together with all kinds of
materials, such as paper, paper board, glass, metal, wood, moulded
fibres or plastic. Two opposite sides of an opening of a package
may represent a first and second carrier layer and the electrically
weakable adhesive described above may be arranged between the
carrier layers.
[0080] Furthermore, the controlled delaminating material may be
used for collation of products in transit or handling and
subsequent separation of the products, for separating packages
bonded together and for tamper-proofing goods. It may also be used
to limit or change the properties of a product before it is
purchased in order to prevent theft. Collation of products,
tamper-proofing a product or preventing theft of a product may be
done by binding existing parts or elements of the product or
products together or by binding additional elements to the product
or products, using the controlled delaminating material.
[0081] FIG. 8 shows an application wherein a full pallet of
packages 50a-g are interlocked using a connecting element 51 which
make use of a controlled delaminating material. Interlocking a full
pallet saves packages from damage or from distorting during
distribution. Individual packages 50a-g are collated by the
attachment of a connecting element 51, for example a carton board
sheet 51. The surface, or parts of the surface, of the board sheet
51 facing the packages is printed with active layers 53, 54 and a
bonding layer possessing adhesive as well as conductive properties
is applied between the active layers 53, 54 and the packages 50 to
be interlocked.
[0082] FIG. 9 shows an example wherein a first circuit 9a is
printed at a carton board sheet 51. A second circuit 9b is printed
on the board sheet at a distance from the first circuit 9a. In
connection with said first circuit 9a, a first set of active
surfaces 53 are arranged at short intervals on said board sheet. A
second set of active surfaces 54 are arranged in connection with
said second circuit 9b. Respective second active surface 54 is
arranged at a small distance from respective first active surfaces
53. This has been disclosed in more detail with reference to FIGS.
2-5.
[0083] Respective active surfaces 53, 54, arranged at a small
distance from each other, form a pair of active surfaces 53, 54. A
bonding layer is applied between the active surfaces 53, 54 and the
packages 50a-g. The bonding layer is applied in spots such that
each spot covers each pair of active surfaces 53, 54. The set of
active surfaces 53, 54 and electrically weakable adhesive forms an
electrically weakable adhesion area. As shown in FIG. 9 a plurality
of such pairs of active surfaces 53, 54 and the accompanying
electrically weakable adhesive is arranged along the circumference
of the connecting element 51.
[0084] The active surfaces 53, 54 are of different materials with
different potentials. Preferably, also the circuits 9a, 9b are of
respective materials of different potentials. The circuits 9a, 9b
may be connected by a switch 7. When the switch is open, no current
flows through the bonding layer 55. When the switch is closed,
current will flow through the bonding layer between the active
surfaces 53, 53 thereby causing bonds in the bonding layer or
between the bonding layer and one or both of the active surfaces
53, 54 to break or to weaken.
[0085] In an alternative embodiment for holding packages together,
the packages may be held together directly using controlled
delaminating materials. In one example of this embodiment, multi
packs are held together and released after purchase. Such a design
is shown in FIGS. 10a-b.
[0086] FIG. 10a is a schematic drawing, which shows an example
wherein two packages are adapted to be held together using
controlled delaminating materials. The packages has been separated
slightly in order to make all components visible.
[0087] In FIGS. 10a-b, the left package 60a is provided with a
double connector circuit 9a, 9b (as shown in detail in FIG. 9 and a
switch 7 located on an accessible side 60a' of the package 60a. The
circuits 9a, 9b extends to a surface 61a facing a neighbouring
package 60b. The circuits 9a, 9b extend essentially along the
perimeters of the surface 61a facing the neighbouring package 60b
and are as shown in detail in fig lob provided with active surfaces
63, 64 and an electrically weakable adhesive layer 65.
[0088] Thus, in this example, the side 61a of the package 60a forms
the first carrier layer. The active surfaces 63, 64 and the
circuits 9a, 9b may be arranged on the said surface 61a of the
package 60a in a pattern similarly to the one described above with
reference to FIG. 9 (shown in detail in FIGS. 2-5). Spots of
bonding layers may be applied between each pair of active surfaces
and the side 62b of the other package 60b facing the first package
60a, whereby the packages are glued together. When the circuit 9a,
9b is open no current flows through the bonding layer 65, and the
packages 60a, 60b remains glued together. When the circuit 9a, 9b
current will flow through the bonding layer 65 causing bonds
therein or between the bonding layer 65 and one or both of the
carrier layers 61a, 62b to break or to weaken, and the packages may
easily be separated. As an example, the circuit 9a, 9b may be
closed by the user pressing a button arranged on the outside on the
package, which causes a switch 7 to close. The current needed to
break or weaken the bonds may be applied by forming the active
surfaces 63, 64 of different materials with different
potentials.
[0089] Further layers may be applied between the two connected
surfaces of the packages; such layers may be insulating layers,
further conducting layers or layers of conventional adhesives as
described above.
[0090] FIGS. 11a-b shows a set of secondary articles in the form of
a cup 71 and a saucer 72 connected to a handling element 70.
[0091] The handling element comprises a first adhesion area 73 to
which the cup 71 is connected and a second adhesion area 74 to
which the saucer is connected. The adhesion areas 73, 74 are
located on opposite sides of a disc or board shaped handling
element 70. The handling element 70 comprises further an engagement
portion 70a in the form of an extension provided with a
through-going opening for hanging the handling element (with the
thereto connected cup and saucer) on a display rack. The handling
element is further provided a first active surface and second
active surface. The active surfaces are formed of different
materials with different potentials. The handling element is
further provided with circuitry 6 for connection of the active
surfaces to each other. Basically, the adhesion area comprises an
electrically weakable adhesive and may be designed in accordance
with the disclosure above.
[0092] FIG. 12 shows a handling element 80 connected to two
secondary articles in the form of two packages 81 and 82.
[0093] The handling element is provided with two adhesion areas 83
and 84 and forms a sling with the engagement area. 80a located
between said adhesion areas 83, 84. The two adhesion areas 83, 84
of the handling element 80 may be connected to one and the same
secondary article (or package). One or more of the packages may be
of the kind adapted to be temporarily connected to each other as
described above. The packages connected to the handling element may
also be connected to each other at the bottom (or top) using a
connecting element as described above. The manner of providing the
voltage to the electrically weakable adhesive of the adhesion areas
83, 84 may be accomplished by providing two active surfaces of
different materials with different potentials as discussed in
detail above.
[0094] The packages described in the following make use of an
electrically weakable adhesive material. FIGS. 10a-b, FIGS. 13a-b
and FIG. 14 discloses examples of uses and applications in
different kind of packages.
[0095] FIGS. 13a-b discloses in cross-section a package provided
with a closure adapted to be opened using the electrically weakable
laminated structure described above.
[0096] The package comprises a top panel 20, a bottom panel 21, a
front panel 22, a back panel 23 and two side panels (in front of
and behind the cross-section of FIGS. 13a-b). A closure flap 24 is
connected to or integrally formed with the top panel 20. The
closure flap 24 is folded relative to the top panel 20, extends
along a portion of the front panel 22 and is fastened to the front
panel 22 using the electrically weakable laminated structure
described above.
[0097] Two active surfaces 3, 4 are arranged side by side, but not
in direct contact, on one side of the opening closed by the top
panel 20. The active surfaces 3, 4 are arranged on the outside of
the front panel 22 facing the closure flap 24. A bonding layer 5 is
applied between the active surfaces 3, 4 and the closure flap 24,
thereby bonding the active surfaces 3, 4 to the closure flap 24. An
electrical circuit 9 is provided to electrically connect the active
surfaces 3, 4. The circuit is schematically drawn to include a
switch 7 and a voltage supply 6. The voltage is provided by forming
the active surfaces 3, 4 of different materials having different
potentials. This has been discussed in more detail with reference
to basic laminate structure of FIGS. 1-5.
[0098] In FIG. 13a, the switch 7 is open, no current flows through
the bonding layer 5 and the closure flap 24 remains bonded to the
active surfaces 3, 4 and, consequently, to the front panel 22. In
FIG. 13b, the switch 7 is closed, a closed circuit is formed,
current flows through-the bonding layer 5, thereby causing bonds in
the bonding layer 5 or between the bonding layer 5 and one or both
of the active surfaces 3, 4 to break or to weaken, whereby the
package may easily be opened.
[0099] FIGS. 13a-b is a schematic picture showing the principle.
Although not shown in FIGS. 13a-b, the circuit 9 and the switch 7
may be arranged such that the user that wants to open the package
presses a button arranged on the outside of the package, which
causes the switch to close and the bonds in the bonding layer to
break or to weaken. Furthermore, insulating layers may be arranged
in order to separate the active surfaces 3, 4 out of the plane as
described above with reference to FIGS. 2-5 and a conventional
non-conducting adhesive may be arranged between the bonding layer 5
and the closure flap 24. It may also be noted that, in contrast to
FIGS. 13a-b where the front panel 22 constitutes the first carrier
layer 1 and the closure flap 24 constitutes the second carrier
layer 2, the closure flap 24 may constitute the first carrier layer
1 and the front panel 22 of the package may constitute the second
carrier layer 2.
[0100] FIG. 14 shows another embodiment of a package adapted to be
opened by the application of an electrical force, which package
comprises two parts, a container 30, which is adapted to receive a
product, and a cap 31. The package may for example be a bottle, but
any kind of package is possible. The active surfaces 3, 4 are
arranged at a distance from each other on the surface of the cap 31
facing the container 30. A bonding layer 5 is applied between the
active surfaces 3, 4 and the surface of the container 30 facing the
cap 31. The bonding layer 5 glues the cap 31 to the container 30.
The active layers 3, 4 are connected by a circuit 9 comprising a
switch 7 and a voltage supply 6. The voltage is provided by forming
the active surfaces 3, 4 of different materials having different
potentials. When the switch 7 is open, no current flows between the
active surfaces 3, 4 or through the bonding layer 5 and the cap
remains glued to the container 30. When the switch 7 is closed and
current flows through the bonding layer 5, the bonds in the bonding
layer 5 or between the bonding layer 5 and one or both of the
active surfaces 3, 4 are broken or weakened, whereby the container
30 may easily be opened.
[0101] Furthermore, insulating layers may be arranged in order to
separate the active surfaces 3, 4 out of the plane as described
above with reference to FIGS. 2-5 and a conventional non-conducting
adhesive may be arranged between the bonding layer 5 and the
container 30 or the cap 31. It may also be noted that, in contrast
to FIG. 14 where the cap 31 constitutes the first carrier layer 1
and the container 30 constitutes the second carrier layer 2, the
container 30 may constitute the first carrier layer 1 and the cap
31 may constitute the second carrier layer 2.
[0102] The inner envelope surface of the cap 31 and the outer
envelope surface of the neck of the container 30 may be threaded,
whereby the cap is screwed on the container. The threads may extend
about the complete circumference of the neck or only partly as in a
bayonet connection often used in glass jars and metal lids. In such
an embodiment the controlled delaminating material may serve as a
tamper proof or as an easily breakable sealing layer.
* * * * *