U.S. patent application number 11/189948 was filed with the patent office on 2007-02-01 for cooling fin assembly.
Invention is credited to Hung-Ming Chou, Li-Ping Lee, Wen-Yuan Wu.
Application Number | 20070023177 11/189948 |
Document ID | / |
Family ID | 37693028 |
Filed Date | 2007-02-01 |
United States Patent
Application |
20070023177 |
Kind Code |
A1 |
Lee; Li-Ping ; et
al. |
February 1, 2007 |
Cooling fin assembly
Abstract
A cooling fin assembly provides a plurality of cooling fins and
each of the cooling fins has a cooling fin body with at least a
recess part indenting toward a side thereof. The recess part has an
insert space with a through hole slightly less than the entire area
of the recess part for being passed through with a heat guide pipe.
Further, a folded side surrounds the through hole and extending
toward the side. Once a heat guide medium, which is inserted
between the through hole and the heat guide pipe, is heated up to
become in a state of melting during being set up, the molten heat
guide medium distributes between the outer surface of the heat
guide pipe and the through hole and over the folded side
evenly.
Inventors: |
Lee; Li-Ping; (Taipei,
TW) ; Wu; Wen-Yuan; (Taipei, TW) ; Chou;
Hung-Ming; (Taipei, TW) |
Correspondence
Address: |
G. LINK Co., LTD.
3550 Bell Road
Minooka
IL
60447
US
|
Family ID: |
37693028 |
Appl. No.: |
11/189948 |
Filed: |
July 27, 2005 |
Current U.S.
Class: |
165/182 |
Current CPC
Class: |
F28F 1/32 20130101; F28F
2013/006 20130101; F28F 1/30 20130101; F28F 2275/04 20130101 |
Class at
Publication: |
165/182 |
International
Class: |
F28F 1/30 20060101
F28F001/30 |
Claims
1. A cooling fin assembly, comprising: a plurality of cooling fins,
each of the cooling fins having a cooling fin body with at least a
recess part indenting toward a side thereof, the recess part having
an insert space with a through hole slightly less than the entire
area of the recess part and a folded side surrounding the through
hole and extending toward the side; and a heat guide pipe, passing
through the through hole.
2. The cooling fin assembly as defined in claim 1, wherein the
inner wall surface of the through hole is greater than the outer
surface of the heat guide pipe and a clearance is formed between
the folded side and the outer surface of the heat guide pipe.
3. The cooling fin assembly as defined in claim 1, wherein the
inner wall surface of the through hole contact with the outer
surface of the heat guide pipe and the folded side contacts with
the outer surface of the heat guide pipe completely too.
4. The cooling fin assembly as defined in claim 1, wherein the
insert space has a heat conductive medium.
5. The cooling fin assembly as defined in claim 1, wherein the heat
conductive medium is a tin paste.
6. The cooling fin assembly as defined in claim 1, wherein the
insert space provides a shape of circle, semi-cone or countersink
or any shapes.
7. The cooling fin assembly as defined in claim 1, wherein the
perimeter of the insert space is greater than the outer surface of
the heat guide pipe.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention is related to a cooling fin assembly
and particularly to a cooling fin assembly joined to a heat guide
pipe
[0003] 2. Brief Description of the Related Art
[0004] Technology progressing rapidly to allow many high power
electronic components being able to minimize the sizes thereof in
order to fulfill requirement of lightness, thinness, shortness and
smallness. Hence, more parts can be installed in the same size as
before. For instance, the CPU (central processing unit) in a
computer increases more electronic parts inside in order to obtain
higher performance efficiency. Therefore, heat removal from the
electronic components is a subject much more important than before.
In practice, mostly cooling fins associated with a fan is used for
helping the electronic components to dissipate heat. However, due
to external space limitation, it is required to have lighter and
smaller cooling fins with high heat transmission rate.
[0005] Under the preceding limitation, a conventional cooling fin
structure is joined to a heat guide pipe for enhancing heat
conductive capability. Referring to FIGS. 1 to 3 and 3a, the
conventional cooling structure with a heat guide pipe includes a
plurality of cooling fins 11 and at least a heat guide pipe 12.
Each of the cooling fins 11 has a through hole 111 and an
projection 112 surrounding the through hole 111 at a side of the
respective cooling fin 11 such that the cooling fins 11 are
attacked to each other in a way of the respective through hole
aligning with each other. The heat guide pipe passes through the
respective hole 111 and soldering paste 13 is coated between inside
the through hole and the projection 112 and the heat guide pipe 12
for binding the through holes 111 and the heat guide pipe
together.
[0006] However, the problem of the preceding prior art is in that
part of the coated soldering paste 13 is squeezed out and stays at
the outer surface of the outermost cooling fin 11 during the heat
guide pipe passing through the through holes 111. Under this
circumference, the soldering paste 13 left between the through hole
111 and the projection 112 and the heat guide pipe 12 is unable to
distribute evenly between the through hole 111 and the projection
112 and part of the soldering paste overflows to outside the
respective projection 112 as shown in FIG. 3a. It results in
undesirable tightness and looseness between the cooling fins 11 and
the heat guide pipe 12 to degrade heat conductive effect and to
defect appearance thereof.
[0007] Further, when the molten soldering paste passes the
respective cooling fins 11, the respective projection 112 increases
flow resistance and lowers the flow rate such that effect of heat
dissipation is seriously influenced and it is unable to meet the
need of the high power electronic component.
SUMMARY OF THE INVENTION
[0008] In order to solve the preceding problems, an object of the
present invention is to provide a cooling fin assembly in which at
least a cooling fins has a cooling fin body with at least a recess
part indenting toward a side thereof. The recess part has an insert
space with a through hole slightly less than the entire area of the
recess part for being passed through with a heat guide pipe.
Further, a folded side surrounds the through hole and extending
toward the side. Once a heat guide medium, which is inserted
between the through hole and the heat guide pipe, is heated up to
become in a state of melting during being set up, the molten heat
guide medium distributes between the outer surface of the heat
guide pipe and the through hole and over the folded side
evenly.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The detail structure, the applied principle, the function
and the effectiveness of the present invention can be more fully
understood with reference to the following description and
accompanying drawings, in which:
[0010] FIG. 1 is an exploded perspective view of a conventional
cooling fin assembly;
[0011] FIG. 2 is an exploded sectional view of the conventional
cooling fin assembly;
[0012] FIG. 3 is a sectional view of the conventional cooling fin
assembly;
[0013] FIG. 3a is an enlarged view of the part of dashed circle in
FIG. 3 illustrating soldering paste residue thereon;
[0014] FIG. 4 is a perspective view of a cooling fin assembly
according to the present invention;
[0015] FIG. 5 is a sectional view of a cooling fin assembly
according to the present invention;
[0016] FIG. 6 is a sectional view illustrating the cooling fin
assembly of the present invention being joined to a heat guide pipe
in series;
[0017] FIG. 7 is a sectional view illustrating soldering paste
being full between the inserted space and the clearance in the
cooling fin assembly of the present invention;
[0018] FIG. 8 is a sectional view illustrating the folded side of
the cooling fin assembly contacting the outer surface of the heat
guide pipe tightly;
[0019] FIG. 9 is a sectional view of another configuration of a
recess part in the cooling fin assembly of the present
invention;
[0020] FIG. 10 is a sectional view illustrating heat conductive
media being full of the recess part shown in FIG. 9; and
[0021] FIG. 11 is a sectional view illustrating another type of
folded side of the cooling fin assembly contacting the outer
surface of the heat guide pipe tightly.
DETAILED DESCRIPTION OF THE INVENTION
[0022] Referring to FIGS. 4 to 7, a preferred embodiment of a
cooling fin assembly according to the present invention provides a
cooling fin set 20, which is formed by way of a plurality of
stacked cooling fins 21. Each of the cooling fins 21 at least has a
recess part 221 at the main body thereof indenting to a side
thereof respectively. The recess part 221 constitutes an insert
space 2211 with a through hole 22 disposed about at the center near
the center of the recess part 221 for being at least a heat guide
pipe 23 passing through and the perimeter of the through hole 22
surrounds a folded edge 222 extending along a direction.
[0023] The insert space 2211 has a perimeter greater than the outer
circumference of the heat guide pipe 23 such that a heat conductive
medium 25 shown in FIG. 7 can be filled between the insert space
2211 and the heat guide pipe 23. The insert space 2211 provides a
circular shape or any irregular shapes and it can be seen in the
figure that the insert space 2211 is semi-cone shape and the heat
conductive medium 25 is soldering paste or soldering aid agent in
the embodiment.
[0024] The cooling fins 21 loosely fit with the heat guide pipe 23
and the inner diameter of the through hole 2 is greater than the
outer diameter of the heat guide pipe 23. That is, a clearance 24
is provided between the folded side 222 and the outer surface of
the heat guide pipe 23.
[0025] Once the heat guide medium 25 is heated up to become in a
state of melting, the molten heat guide medium 25 flow toward the
area between the outer surface of the heat guide pipe 23 and the
through hole 22 to fill with the insert space 2211 and the
clearance 24 evenly. In this way, the cooling fins 21 is capable of
joining with heat guide pipe 23 firmly due to the heat conductive
medium 25 having distributed between the outer surface of the heat
guide pipe 23 and the through hole 2 and over the outer surface of
the folded side 222.
[0026] Referring to FIG. 8, alternatively, the through hole 22 can
be made to allow the inner wall surface contacting with the outer
surface of the heat guide pipe 23 and the folded side 222 is
arranged to contact outer surface of the heat guide pipe 23
completely. In this way, it is able to achieve the same joining
effect as well.
[0027] Further, the insert space 2211 can be provided with any
shapes such as a countersink shape shown in FIGS. 9, 10 and 11.
[0028] It is appreciated that the cooling fin assembly according to
the present invention has the insert space 2211 thereof providing
the perimeter thereof greater than the outer diameter of the heat
guide pipe 23 so that there is no problem with the heat conductive
medium 25 being squeezed by the heat guide pipe 23 during the heat
guide pipe 23 passing through the through hole 22 done in prior
art. Hence, the heat conductive medium 25 is kept in the insert
space 2211 completely and is capable of melting and distributing to
inside the through hole 22 of each cooling fin 21 and the outer
surface of the heat guide pipe 23 evenly.
[0029] While the invention has been described with referencing to
preferred embodiments thereof, it is to be understood that
modifications or variations may be easily made without departing
from the spirit of this invention, which is defined by the appended
claims.
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