U.S. patent application number 11/532654 was filed with the patent office on 2007-01-18 for test probe and tester, method for manufacturing the test probe.
This patent application is currently assigned to SEIKO EPSON CORPORATION. Invention is credited to Haruki ITO, Shinji MIZUNO, Koji YAMAGUCHI.
Application Number | 20070013393 11/532654 |
Document ID | / |
Family ID | 35995574 |
Filed Date | 2007-01-18 |
United States Patent
Application |
20070013393 |
Kind Code |
A1 |
ITO; Haruki ; et
al. |
January 18, 2007 |
TEST PROBE AND TESTER, METHOD FOR MANUFACTURING THE TEST PROBE
Abstract
A test probe having a conductive part electrically connected to
terminals of a test-object device, including: a silicon substrate;
a protrusion made of resin provided on the silicon substrate; a
first conductive part which is provided on the protrusion and comes
in contact with the terminals; and a second conductive part which
is provided in a region other than a region having the protrusion
on the silicon substrate and is electrically connected to the first
conductive part.
Inventors: |
ITO; Haruki; (Suwa, JP)
; MIZUNO; Shinji; (Suwa, JP) ; YAMAGUCHI;
Koji; (Suwa, JP) |
Correspondence
Address: |
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 828
BLOOMFIELD HILLS
MI
48303
US
|
Assignee: |
SEIKO EPSON CORPORATION
4-1, Nishi-shinjuku 2-chome Shinjuku-ku
Tokyo
JP
|
Family ID: |
35995574 |
Appl. No.: |
11/532654 |
Filed: |
September 18, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11184763 |
Jul 19, 2005 |
|
|
|
11532654 |
Sep 18, 2006 |
|
|
|
Current U.S.
Class: |
29/874 ;
324/755.01 |
Current CPC
Class: |
G01R 1/06761 20130101;
G01R 1/07314 20130101; G09G 3/006 20130101; Y10T 29/49204 20150115;
G09G 3/3622 20130101 |
Class at
Publication: |
324/754 |
International
Class: |
G01R 31/02 20060101
G01R031/02 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 9, 2004 |
JP |
2004-262273 |
Claims
1. A method for manufacturing a test probe, comprising: having a
conductive part electrically connected to terminals of a
test-object device; providing a protrusion made of resin on a
silicon substrate; providing a first conductive part that comes in
contact with the terminals on the protrusion; and providing a
second conductive part that is electrically connected to the first
conductive part in a region other than a region having the
protrusion on the silicon substrate.
2. The method according claim 1, further comprising: forming the
protrusion so as to extend in a first direction; and providing a
plurality of first wiring patterns in the first direction on the
protrusion as the first conductive part.
3. The method according claim 2, further comprising denting a
region on the protrusion surface other than a region having the
first wiring patterns by half-etching.
4. The method according claim 1, further comprising forming the
protrusion in a shape of an arch when seen cross-sectionally, the
surface thereof bulging in a direction opposite from the silicon
substrate.
5. The method according claim 1, further comprising forming the
protrusion by dispensing a function liquid containing the
protrusion-forming resin from a liquid dispensing head onto the
silicon substrate.
6. The method according claim 1, further comprising forming a
second insulating layer so as to cover the second conductive
part.
7. The method according claim 1, further comprising thinning the
silicon substrate.
8. The method according claim 1, further comprising providing a
third insulating layer made of resin on a second surface of the
silicon substrate opposite from a first surface having the
protrusion and the conductive part.
9. The method according claim 8, further comprising adhering a
sheet form to the second surface of the silicon substrate as the
third insulating layer.
10. The method according claim 8, further comprising thinning the
silicon substrate by treating the second surface before providing
the third insulating layer.
11. The method according claim 1, further comprising dicing the
silicon substrate per every test probe after forming the plurality
of test probes on the same silicon substrate almost
simultaneously.
12. The method according claim 11, further comprising: adhering a
sheet form to the second surface of the silicon substrate opposite
from the first surface having the protrusion and the conductive
part; and dicing the silicon substrate together with the sheet
form.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional patent application of U.S.
Ser. No. 11/184,763 filed Jul. 19, 2005, claiming priority to
Japanese Patent Application No. 2004-262273 filed Sep. 9, 2004, all
of which are incorporated by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Technical Field
[0003] The present invention relates to a test probe and a tester
and a method for manufacturing the test probe.
[0004] 2. Related Art
[0005] In a general procedure of manufacturing a liquid-crystal
panel display, there is a process in which short circuit, wire
breakage, display characteristics, and the like are tested. In such
a test process, a tester having a test probe is used. The test
probe includes a conductive part having a plurality of connection
terminals connected to scanning line terminals or data line
terminals of the liquid-crystal panel display which is the device
to be tested (the object device). A distance between the connection
terminals (hereinafter referred to as a "pitch of the probe-side
terminals" when appropriate) corresponds to a distance between the
scanning line terminals or between the data line terminals
(hereinafter referred to as a "pitch of the object-side terminals"
when appropriate) of the liquid-crystal display panel. The patent
publication referenced below discloses an example of a technique
pertaining to a tester having a test probe. The test probe
disclosed in this patent publication includes a conductive part
having the connection terminals on a flexible substrate made of
polyimide or the like.
[0006] Japanese Unexamined Patent Publication No. 2000-56285 is the
example of related art.
[0007] However, there is a problem in the described conventional
technology. Along with the liquid-crystal panel display that is
becoming more highly precise in recent years, the pitch of the
object-side terminals is becoming smaller (narrower). Accordingly,
the pitch of the probe-side terminals of the test probe is also
required to be smaller (narrower). However, with a composition of
the conventional technology containing the conductive part having
the connection terminals on the flexible substrate, it is difficult
to narrow the pitch of the probe-side terminals.
SUMMARY
[0008] An advantage of the invention is to provide a test probe
that can cope with narrowing of the pitch of the probe-side
terminals and can test the object device well, a tester having the
test probe, and a method for manufacturing the test probe.
[0009] According to an aspect of the invention, a test probe having
a conductive part electrically connected to terminals of a
test-object device includes: a silicon substrate; a protrusion made
of resin provided on the silicon substrate; a first conductive part
which is provided on the protrusion and comes in contact with the
terminals; and a second conductive part which is provided in a
region other than a region having the protrusion on the silicon
substrate and is electrically connected to the first conductive
part.
[0010] In this case, because the conductive part is formed on the
silicon substrate, it is possible to obtain a minute conductive
part. Accordingly, the test probe can cope with the narrowing of
the pitch of the object-side terminals. Further, because the first
conductive part that directly contacts the terminals of the object
device is provided on the protrusion made of resin, the first
conductive part can well contact the terminals of the object device
when brought into contact due to the elasticity of the resin
protrusion that is a base of the first conductive part.
[0011] With the test probe of the invention, the first conductive
part may include a plurality of first wiring patterns arranged in a
first direction corresponding to the terminals, and the second
conductive part may include a plurality of second wiring patterns
corresponding to the first wiring patterns.
[0012] In this case, because the first conductive part may include
the plurality of first wiring patterns arranged in the first
direction so as to correspond with the plurality of terminals of
the object device arranged in the first direction, the test probe
can well test the object device by bringing the first wiring
patterns into contact with the terminals. Also, because the second
conductive part may include the second wiring patterns formed on
the silicon substrate corresponding to the first wiring patterns,
the test probe can have the second wiring patterns that are
minute.
[0013] With the test probe of the invention, the protrusion may
extend in the first direction so as to hold each of the plurality
of first wiring patterns.
[0014] In this case, because the protrusion may be formed so as to
extend in the first direction along the arrangement direction of
the first wiring patterns, the plurality of first wiring patterns
can be provided on the same protrusion. Therefore, variation in the
arrangement of the first wiring patterns in the height direction
can be minimized.
[0015] With the test probe of the invention, a region on the
protrusion surface other than a region having the first wiring
patterns may be dented.
[0016] In this case, because the region on the surface of the
protrusion other than the region having the first wiring patterns,
or, more specifically, the region between the first wiring
patterns, may be dented, the protrusion as the base of the first
wiring patterns may deform when coming in contact with the
terminals of the object device. Accordingly, due to the
deformation, the first wiring patterns can well contact the
terminals of the object device.
[0017] With the test probe of the invention, the protrusion surface
may be formed in a shape of an arch when seen cross-sectionally,
bulging in a direction opposite from the silicon substrate.
[0018] In this case, because the first conductive part may be
formed on the surface of the protrusion having a shape of an arch
when seen cross-sectionally, the conductive part can well contact
the terminals. Further, because the protrusion surface may be
arched when seen cross-sectionally, the first conductive part can
well adhere to the protrusion surface when setting the first
conductive part on the protrusion surface.
[0019] With the test probe of the invention, a first insulating
layer may be provided between the silicon substrate and the second
conductive part.
[0020] In this case, because the silicon substrate may be
electrically insulated from the second conductive part by the first
insulating layer, the object device can be well tested.
[0021] With the test probe of the invention, the first insulating
layer may include organic matter.
[0022] In this case, by composing the first insulating layer with
organic matter, namely, an organic resin, the second conductive
part provided on the layer thereon can well contact outer
devices.
[0023] With the test probe of the invention, a second insulating
layer may be provided so as to cover the first insulating
layer.
[0024] In this case, the second conductive part can be protected by
the second insulating layer.
[0025] With the test probe of the invention, a third insulating
layer made of resin may be provided on a second surface of the
silicon substrate opposite from a first surface having the
protrusion and the conductive part.
[0026] In this case, the third insulating layer made of resin can
protect the second surface of the silicon substrate and prevent
breakage of the silicon substrate.
[0027] With the test probe of the invention, the third insulating
layer may include a sheet form.
[0028] In this case, the third insulating layer may be provided on
the second surface of the silicon substrate by simply adhering the
sheet form to the second surface of the silicon substrate.
[0029] With the test probe of the invention, an electronic unit
that supplies an electric signal to the terminals may be mounted on
the silicon substrate.
[0030] In this case, a highly precise display test is possible when
the object device is, for example, a display device.
[0031] According to another aspect of the invention, a tester of
the invention may include the above-described test probe.
[0032] In this case, the object device can be well tested by use of
the test probe that can cope with the narrowing of the pitch of the
object device.
[0033] With the tester of the invention, a part of the second
conductive part may be electrically connected to a second substrate
mounted with the electronic unit that supplies an electric signal
to the terminals.
[0034] In this case, the electronic unit is mounted on the second
substrate that is different from the test probe directly connected
to the object device, and, by connecting the second substrate with
the part of the second conductive part of the test probe, a highly
precise display test is possible if the test-object is the display
device. Further, even when the test probe directly connected to the
object device deteriorates, only the test probe needs be replaced
instead of replacing the electronic unit with a new one.
[0035] With the tester of the invention, the second substrate may
include a silicon substrate.
[0036] In this case, by also forming the second substrate with
silicon, the conductive part corresponding to the conductive part
of the test probe that is already minutely made can be formed on
the second substrate.
[0037] With the tester of the invention, the second substrate may
include a glass substrate.
[0038] In this case, because the second substrate may be a glass
substrate, it is possible to grasp visually (or by use of an
optical position-detection device) the connection of the conductive
part of the second substrate connected to the second conductive
part of the test probe while positioning them through the second
glass substrate during the connection. Therefore, the positioning
during the connection can be carried out smoothly.
[0039] According to yet another aspect of the invention, a method
for manufacturing a test probe includes: having a conductive part
electrically connected to terminals of a test-object device;
providing a protrusion made of resin on a silicon substrate;
providing a first conductive part that comes in contact with the
terminals on the protrusion; and providing a second conductive part
that is electrically connected to the first conductive part in a
region other than a region having the protrusion on the silicon
substrate.
[0040] In this case, because the conductive part may be formed on
the silicon substrate, it is possible to obtain the minute
conductive part. Accordingly, the test probe can cope with the
narrowing of the pitch of the object-side terminals. The first
conductive part that comes directly in contact with the terminals
of object device may be provided on the protrusion made of resin,
and, therefore, when the first conductive part contacts the
terminals of the test-object, the first conductive part can well
contact the terminals of the object device due to the elasticity of
the resin protrusion being the base of the first conductive
part.
[0041] The method of the invention may further include: forming the
protrusion so as to extend in a first direction; and providing a
plurality of first wiring patterns in the first direction on the
protrusion as the first conductive part.
[0042] In this case, because the protrusion may be formed so as to
extend in the first direction along the direction in which the
first wiring patterns are arranged, the plurality of first wiring
patterns can be provided on the same protrusion. Therefore,
variation in the arrangement of the first wiring patterns in the
height direction can be minimized.
[0043] The method of the invention may further include denting a
region on the protrusion surface other than a region having the
first wiring patterns by half-etching.
[0044] In this case, because the region on the surface of the
protrusion other than the region having the first wiring patterns,
or, more specifically, the region between the first wiring
patterns, may be dented, the protrusion as the base of the first
wiring patterns may deform when coming in contact with the
terminals of the object device. Accordingly, due to the
deformation, the first wiring patterns can well contact the
terminals of the object device.
[0045] The method of the invention may further include forming the
protrusion in a shape of an arch when seen cross-sectionally, the
surface thereof bulging in a direction opposite from the silicon
substrate.
[0046] In this case, because the first conductive part may be
provided on the surface of the protrusion in a shape of an arch
when seen cross-sectionally, the conductive part can well contact
the terminals. Further, because the protrusion surface may be
arched in a cross-sectional view, the first conductive part can
well adhere to the protrusion surface when setting the first
conductive part on the protrusion surface.
[0047] The method of the invention may further include forming the
protrusion by dispensing a function liquid containing the
protrusion-forming resin from a liquid dispensing head onto the
silicon substrate.
[0048] In this case, the protrusion can be smoothly formed without
wasefully using the material.
[0049] The method of the invention may further include forming a
second insulating layer so as to cover the second conductive
part.
[0050] In this case, the second conductive part may be protected by
the second insulating layer.
[0051] The method of the invention may further include thinning the
silicon substrate.
[0052] In this case, by thinning the silicon substrate and giving
elasticity thereto, handling of the test probe my be easy; the test
probe can well contact the object device; and, further, the second
conductive part can well contact other devices such as the second
substrate.
[0053] The method of the invention may further include providing a
third insulating layer made of resin on a second surface of the
silicon substrate opposite from a first surface having the
protrusion and the conductive part.
[0054] In this case, the third insulating layer made of resin can
protect the second surface of the silicon substrate and can prevent
breakage of the thinned silicon substrate.
[0055] The method of the invention may further include adhering a
sheet form to the second surface of the silicon substrate as the
third insulating layer.
[0056] In this case, the third insulating layer may be provided on
the second surface of the silicon substrate by simply adhering the
sheet form to the second surface of the silicon substrate.
[0057] The method of the invention may further include thinning the
silicon substrate by treating the second surface before providing
the third insulating layer.
[0058] In this case, the silicon substrate may obtain elasticity
when thinned, and, furthermore, the breakage or the like of the
thinned silicon substrate may be prevented.
[0059] The method of the invention may further include dicing the
silicon substrate per every test probe after forming the plurality
of test probes on the same silicon substrate almost
simultaneously.
[0060] In this case, by forming the plurality of test probes almost
simultaneously, followed by dicing of the silicon substrate per
every test probe, the test probe can be manufactured effectively
and at low cost.
[0061] The method of the invention may further include: adhering a
sheet form to the second surface of the silicon substrate opposite
from the first surface having the protrusion and the conductive
part; and dicing the silicon substrate together with the sheet
form.
[0062] In this case, dicing can be smoothly conducted by adhering
the sheet form to the silicon substrate before dicing. Then, by
simply using the sheet form used for the dicing as the third resin
layer, the number of the manufacturing steps can be reduced, and
the test probes can be manufactured at low cost.
BRIEF DESCRIPTION OF THE DRAWINGS
[0063] The invention will be described with reference to the
accompanying drawings, wherein like numbers refer to like elements
and wherein:
[0064] FIG. 1 is a perspective view of a first embodiment of the
test probe.
[0065] FIG. 2 is a cross-sectional view of the test probe.
[0066] FIG. 3 is an enlarged cross-sectional view of the test
probe.
[0067] FIG. 4 is a perspective view of a second embodiment.
[0068] FIG. 5 shows an example of a process for manufacturing the
test probe.
[0069] FIG. 6 shows an example of a process for manufacturing the
test probe.
[0070] FIG. 7 shows an example of a process for manufacturing the
test probe.
[0071] FIG. 8 is a flat pattern view of a working example of a
tester.
DESCRIPTION OF THE EMBODIMENTS
[0072] Embodiments of the invention will now be described. In the
following descriptions, an XYZ rectangular coordinate system is
established, and a positional relation of the elements will be
described with reference to this system. Further, a predetermined
direction on a level surface is an X-axis direction; a direction
perpendicular to the X-axis direction on the level surface is a
Y-axis direction; and a direction perpendicular to both X- and
Y-axis directions (in other words, a vertical direction) is a
Z-axis direction. Furthermore, rotational directions around the X-,
Y-, and Z-axes are .theta.X, .theta.Y, and .theta.Z,
respectively.
<Test Probe>
First Embodiment
[0073] The first embodiment of the test probe will be described
with reference to the accompanying drawings. FIG. 1 shows
perspective views of a test probe 1 of the present embodiment and a
part of a liquid-crystal panel display that is the device to be
tested. FIG. 2 is a sectional side view of the test probe 1 (1A),
and FIG. 3 is a diagram of the test probe 1A seen from a +X
side.
[0074] In these drawings, the test probe 1 (1A, 1B) includes: a
silicon substrate 2, a protrusion 3 made of resin and provided on
the silicon substrate 2, and a conductive part 9 provided on the
silicon substrate 2 and electrically connected to scanning line
terminals 206 or data line terminals 306 of the liquid-crystal
panel display 100 which is the test object device. The conductive
part 9 is composed of a first conductive part 4 provided on the
protrusion 3 on the silicon substrate 2 and a second conductive
part 5 provided in a region on the silicon substrate 2 other than
the region having the protrusion 3 and electrically connected to
the first conductive part 4. There is a first insulating layer 6
between the silicon substrate 2 and the second conductive part 5,
and the second conductive part 5 is provided on an upper surface of
the first insulating layer 6. Further, the protrusion 3 is also
provided on the upper surface of the first insulating layer 6.
Also, on the silicon substrate 2, a third insulating layer 7 made
of resin is provided on an upper surface 2A having thereon the
first insulating layer 6, the protrusion 3, and the first and
second conductive parts 4 and 5 and on a lower surface 2B opposite
the upper surface 2A.
[0075] The test probe 1 is used for testing short circuit or wire
breakage in the liquid-crystal panel display 100, which is the
device to be tested, or for testing the display characteristics and
the like. As shown in FIG. 1, the liquid-crystal panel display 100
has two substrates 200 and 300 made of glass or the like, which are
put together so as to oppose one another. Further, liquid crystal
is encapsulated into a gap between the substrates 200 and 300. On
the two substrates 200 and 300, a plurality of scanning lines 202
are formed along the X-axis direction in parallel to each other on
a lower surface 200A of the substrate 200 (a surface opposite from
the substrate 300), and a plurality of data lines 302 are formed
along the Y-axis direction in parallel to each other on a upper
surface 300A of the substrate 300 (a surface opposite from the
substrate 200). Furthermore, on the lower surface 200A of the
substrate 200, the plurality of scanning line terminals 206 that
draw out the scanning lines 202 to the outside are arranged in the
Y-axis direction in a predetermined region of a -X-side end portion
204. Likewise, on the lower surface 300A of the substrate 300, the
plurality of data line terminals 306 that draw out the data lines
302 to the outside are arranged in the X-axis direction in a
predetermined region of a -Y-side end portion 304.
[0076] Additionally, the liquid-crystal panel display 100 having
such a composition is generally applied to an active matrix
liquid-crystal panel in which pixel electrodes are driven by use of
a two-terminal type nonlinear element such as a thin film diode
(TFD), or to a passive matrix liquid-crystal panel in which a
nonlinear element is not used. However, the invention can also be
applied to other liquid-crystal panels such as one having terminals
that draw out the scanning lines and data lines to the outside on
one of the substrates, such as, for example, an active matrix
liquid-crystal panel using a three-terminal type nonlinear element
such as a thin film transistor (TFT) element which is used as an
element to switch the pixel electrodes.
[0077] The scanning line terminals 206 are tip portions of the
plurality of scanning lines 202 formed on the substrate 200. Now,
with a liquid-crystal panel display 100 determined as normal by the
tester of the embodiment, a bear chip for driving each of the
scanning lines is coupled to the scanning line terminals 206 and to
outer terminals (not shown) which are provided so as to oppose the
scanning line terminals 206 at a position away from the scanning
line terminals 206 in the predetermined region 204. The bear chip
is mounted on the substrate 200 by a technique such as a
chip-on-glass (COG) technique, and the outer terminals are coupled
to flexible printed circuits (FPCs) that supply control signals
from the outside to the bear chip. Similarly, also on a portion of
the data line terminals 306 on the substrate 300, the bear chip and
the FPCs are coupled. However, since the present embodiment is
targeted at the liquid-crystal panel display 100 before being
tested, neither the bear chip nor the FPCs are mounted or coupled
at this point.
[0078] In the following, the test probe 1 (1A) that conducts the
test upon being coupled to the scanning line terminals 206 of the
liquid-crystal panel display 100 will be described. However, a
description of the test probe 1 (1B) that conducts the test upon
being coupled to the data line terminals 306 will be omitted, since
the test probes 1A and 1B have an identical composition.
[0079] The first conductive part 4 of the test probe 1(1A) is
composed of a plurality of first wiring patterns 4L arranged in the
Y-axis direction corresponding to the scanning line terminals 206.
The first wiring patterns 4L are provided so as to be coupled to
each of the scanning line terminals 206. A distance between the
first wiring patterns 4L (the pitch of the probe-side terminals)
corresponds to a distance between the scanning line terminals 206
(the pitch of the object-side terminals) of the liquid-crystal
panel display 100. Further, the second conductive part 5 is
composed of a plurality of second wiring patterns 5L provided
corresponding to the first wiring patterns 4L. The second wiring
patterns 5L are each coupled to the first wiring patterns 4L,
arranged and extending in the X-axis direction, in the region other
than the region having the protrusion 3 on the silicon substrate 2
(the first insulating layer 6).
[0080] A material used to form the first conductive part 4 or the
second conductive part 5 is, for example, gold (Au), copper (Cu),
silver (Ag), titanium (Ti), tungsten (W), titanium tungsten (TiW),
nickel (Ni), nickel vanadium (NiV), chromium (Cr), or aluminum
(Al).
[0081] Since the plurality of first wiring patterns 4L are arranged
in the Y-axis direction so as to correspond with the scanning line
terminals 206 of the liquid-crystal panel display 100, the test
probe 1 can well test the liquid-crystal panel display 100 by
contacting the first wiring patterns 4L with the scanning line
terminals 206. Further, by using a flexible material such as silver
(Ag) as the material for forming the first conductive part 4 (the
first wiring patterns 4L), the first wiring patterns 4L can adhere
well to the scanning line terminals 206.
[0082] The protrusion 3 is provided at a +X-side end portion on the
silicon substrate 2, extending in the Y-axis direction so as to be
able to support each of the plurality of first wiring patterns 4L,
that is, to be able to hold each of the plurality of first wiring
patterns 4L. The surface of the protrusion 3 is formed in a shape
of an arch when seen cross-sectionally, bulging in an opposite
direction, that is, in an upper (+Z) direction, from the silicon
substrate 2, and the protrusion 3 as a whole is in a
half-cylindrical shape. Further, as shown in FIG. 3, the region on
the surface of the protrusion 3 other than the region having the
first wiring patterns 4L is dented, forming dented parts 3Ds
between the first wiring patterns 4L.
[0083] As thus described, because the protrusion 3 is formed so as
to extend in the Y-axis direction along the direction in which the
first wiring patterns 4L are arranged, the plurality of first
wiring patterns 4L can be provided on the same protrusion 3.
Therefore, variation in the arrangement of the first wiring
patterns in the height direction can be minimized. Also, because
the first wiring patterns 4L of the first conductive part 4 are
held on the surface of the half-cylindrically shaped protrusion 3,
they can well contact the scanning line terminals 206. Further,
because the surface of the protrusion 3 is arched when seen
cross-sectionally, the first wiring patterns 4L can be adhered well
to the surface of the protrusion 3 when forming the first wiring
patterns 4L thereon. Furthermore, because the regions between the
first wiring patterns 4L are the dented parts 3Ds on the surface of
the protrusion 3, the protrusion 3 which is the base of the first
wiring patterns 4L deforms when the first wiring patterns 4L come
in contact with the scanning line terminals 206. Accordingly, due
to the deformation, the first wiring patterns 4L can well contact
the scanning line terminals 206. Here, it is desirable that the
dented part 3D of the resin part 3 of has a depth of 5 .mu.m or
more. The protrusion 3 can thereby sufficiently deform.
[0084] As mentioned above, the protrusion 3 is composed of resin
(synthetic resin). A material for forming the protrusion 3 is, for
example, polyimide resin, silicone-modified polyimide resin, epoxy
resin, silicone-modified epoxy resin, acrylic resin, phenol resin,
benzocyclobutene (BCB), or polybenzoxazole (PBO).
[0085] The first insulating layer 6 is used to electrically
insulate the silicon substrate 2 from the second conductive part 5
and is provided on the surface of the silicon substrate 2. The
first insulating layer 6 may be inorganic matter such as SiO.sub.2
or organic matter (resin). In this case, if the first insulating
layer 6 is composed of organic matter (organic resin), owing to its
elasticity, the second conductive part 5 provided on the upper
layer of the first insulating layer 6 can well contact outer
devices (a bear chip 10 and a second substrate 20 as will be
described later). Further, by using a flexible material such as
silver (Ag) as the material for forming the second conductive part
5 (the second wiring patterns 5L), the second conductive part 5 can
have good adhesiveness to the outer devices.
[0086] On the silicon substrate 2, the bear chip (the electronic
unit) 10, which drives each of the scanning lines 202 by supplying
electric signals to the scanning line terminals, is mounted on the
second conductive part 5 (the second wiring patterns 5L) by use of
an anisotropic adhesive or the like. Further, one end portion
(+X-side end portion) of the second wiring patterns 5L is coupled
to the first wiring patterns 4L as the connection terminals as
described, and the other end portion (-X-side end portion)
functions as the connection terminals connected to the outer
devices. The connection terminals 5T, which are the other end
portion of the second conductive part 5, are connected to a circuit
substrate (not shown) that supplies the control signals to the bear
chip 10. The bear chip 10 here is identical, for example, to one
that gets mounted on the predetermined region 204 of the substrate
200 after the test. Accordingly, when testing the liquid-crystal
panel display 100, the high-precision display test adjusted to
actual driving conditions of the liquid-crystal panel display 100
is possible.
[0087] In the region other than the region for mounting the first
conductive part 4, the connection terminals 5T, and the bear chip
10, there is provided a second insulating layer 8. The second
insulating layer 8 is to cover the second conductive part 5 in the
region other than the region for mounting the outer terminals 5T
and the bear chip 10, thereby protecting the second conductive part
5. As a material for forming the second insulating layer 8, a
synthetic resin such as polyimide resin may be used.
[0088] The silicon substrate 2 is formed to have a thickness of 200
.mu.m or less. Consequently, it is easy to conduct paralleling of
the liquid-crystal panel display 100 and the substrate 200.
Further, because a third insulating layer 7 made of resin is
provided on the lower surface 2B of the silicon substrate 2, the
lower surface 2B of the silicon substrate 2 is protected by the
third insulating layer 7, and breakage (crack) of the second
silicon substrate 2 can be prevented.
[0089] As a material for forming the third insulating layer 7, a
material well known in the art such as polyimide resin may be used.
Further, it is possible to form the third insulating layer 7 by
coating the lower surface 2B of the silicon substrate 2 with a
solution (dispersing solution) including the mentioned material by,
for example, spin-coating or, alternatively, by applying the sheet
form including the mentioned material on the lower surface 2B of
the silicon substrate 2. By using the sheet form in order to form
the third insulating layer 7, the third insulating layer 7 can be
provided on the lower surface 2B of the silicon substrate 2 by
simply applying the sheet form to the lower surface 2B of the
silicon substrate 2.
[0090] When testing the liquid-crystal panel display 100 using the
test probe 1 (1A, 1B) having the above-described composition, as
shown in FIG. 1, the first conductive part 4 (the first wiring
patterns 4L) of the test probe 1A is brought into contact with the
scanning line terminals 206 of the liquid-crystal panel display
100. Then, while keeping the scanning line terminals 206 of the
liquid-crystal panel display 100 and the first wiring patterns 4L
of the test probe 1A in position, the silicon substrate 2 of the
test probe 1A is pressed against the substrate 200 of the
liquid-crystal panel display 100 using a presser (not shown) made
of elastic matter. As a consequence, the scanning line terminals
206 are adhered and electrically connected to the first wiring
patterns 4L. Similarly, while keeping the data line terminals 306
of the liquid-crystal panel display 100 and the first wiring
patterns 4L of the test probe 1B in position, the silicon substrate
2 of the test probe 1B is pressed against the substrate 300 of the
liquid-crystal panel display 100 using a presser (not shown) made
of elastic matter. As a consequence, the data line terminals 306
are adhered and electrically connected to the first wiring patterns
4L.
[0091] Then, the control signals (electric signals) to the bear
chip 10 are supplied to the connection terminals 5T of each of the
test probes 1A and 1B. Consequently, a condition is set for the
plurality of scanning lines 202 on the substrate 200 and the
plurality of data lines 302 on the substrate 300 to receive from
the bear chip 10 the same driving signals as those when the bear
chip 10 is mounted on the terminal portions of the substrates 200
and 300 by the COG technique. Accordingly, by examining the liquid
display in this condition by use of an image analysis such as a CCD
or visually, the display test such as the pixel defect test can be
conducted.
[0092] Because the conductive part 9 is formed on the silicon
substrate 2, the test probe 1 having the composition as described
above can have the minute conductive part 9. Accordingly, even if
the liquid-crystal panel display 100 becomes more highly precise,
and, thereby, the pitch of the scanning line terminals or of the
data line terminals narrows, the test probe 1 can cope with the
narrowing of the pitch. Further, because the first conductive part
4 that directly comes in contact with the scanning line terminals
206 or the data line terminals 306 of the liquid-crystal panel
display 100 is provided on the protrusion 3 made of resin, and
because of the elasticity of the resin protrusion 3 being the base
of the first conductive part 4, the first conductive part 4 can
well contact the scanning line terminals 206 or the data line
terminals 306 of the liquid-crystal panel display 100 when brought
into contact.
Second Embodiment
[0093] Next, the second embodiment will be described. In the
following, the same reference numbers are given to the same or
similar composition elements as those in the first embodiment, and
the descriptions for those elements are simplified or omitted.
[0094] In the first embodiment, the bear chip 10 is provided on the
silicon substrate 2. However, in the second embodiment, the bear
chip 10 is provided on a second substrate 20, which defers from the
silicon substrate 2.
[0095] As shown in FIG. 4, the bear chip 10 is not provided on the
silicon substrate 2, and the second insulating layer 8 covers the
second conductive part 5 almost entirely excluding the connection
terminals 5T. Further, on a lower surface 20B of the second
substrate 20, third wiring patterns are formed corresponding to the
connection terminals 5T composed of the -X-side end portion of the
second wiring patterns 5L of the second conductive part 5. The bear
chip 10 is mounted on the third wiring patterns provided on the
lower surface 20B of the second substrate 20. Then, by electrically
connecting the third wiring patterns of the second substrate 20
with the connection terminals 5T of the silicon substrate 2, the
electric signals are supplied from the bear chip 10 to the scanning
line terminals 206 of the liquid-crystal panel display 100 through
the third wiring patterns, the connection terminals 5T, the second
wiring patterns 5L, and the first wiring patterns 4L.
[0096] The second substrate 20 is composed of a glass substrate.
Consequently, when connecting the third wiring patterns on the
lower surface 20B of the second substrate 20 with the connection
terminals 5T of the second conductive part 5 on the silicon
substrate 2 while positioning them visually (or by use of the
optical position-detection device), for example, it is possible to
check the connection condition of the third wiring patterns on the
second substrate 20 connected to the connection terminals 5T on the
silicon substrate 2 through the second substrate 20 made of glass
(seeing through the second substrate 20). Hence, the positioning at
the time of connection can be smoothly carried out.
[0097] Alternatively, the second substrate 20 can be composed of
silicon. By composing the second substrate 20 with silicon, the
third wiring patterns corresponding to the connection terminals 5T
(the second wiring patterns 5L) of the minutely-made test probe 1
can be formed on the second substrate 20.
(Method for Manufacturing the Test Probe)
[0098] Next, the method for manufacturing the test probe 1 will be
described with reference to FIGS. 5-7. It is to be noted here that
a plurality of (in the drawings, two) test probes 1 are formed
simultaneously.
[0099] First, as shown in FIG. 5(A), the first insulating layer 6
is formed on the upper surface 2A of the silicon substrate 2. Then,
as shown in FIG. 5(B), the resin for forming the protrusion 3 is
disposed on the predetermined region on the first insulating layer
6. The protrusion 3 is formed into the half-cylindrical shape,
extending in the predetermined direction (the Y-axis direction) on
the silicon substrate 2. In this embodiment, the protrusion 3 is
formed based on a liquid dispensing method (an ink-jet method).
According to the liquid dispensing method, as shown in FIG. 5(B), a
liquid dispensing head (an ink-jet head) 50 dispenses a liquid drop
D that is a functional liquid containing the resin for forming the
protrusion 3 onto the silicon substrate 2 (the first insulating
layer 6). As a consequence, the protrusion 3 having the shape of an
arch in a cross-sectional view whose surface bulges in the
direction opposite (that is, in the upper direction) from the
silicon substrate 2 is formed. By forming the protrusion 3 by the
liquid dispensing method, the material can be used economically,
and the protrusion 3 can be formed smoothly. Alternatively, the
protrusion 3 may be formed by a photolithography method. In this
case, the protrusion 3 contains a photosensitive resin. Depending
on conditions of exposure, development, curing, and the like, the
protrusion 3 having the shape of an arch in a cross-sectional view
can be formed easily and with high precision. Next, as shown in
FIG. 5(C), the conductive part 9 including the first and second
conductive parts 4 and 5 is formed on each of the protrusion 3 and
the first insulating layer 6. The conductive part (wiring pattern)
9 can be formed by sputtering, plating, and liquid dispensing
(ink-jet) methods. On the protrusion 3, the plurality of first
wiring patterns 4L arranged in a longitudinal direction of the
protrusion 3 are formed as the first conductive part 4 that come in
contact with the scanning line terminals 206. In the region other
than the region where the protrusion 3 is provided, the second
wiring patterns 5L electrically connected to the first wiring
patterns 4L are formed.
[0100] Next, as shown in FIG. 6(A), an O.sub.2 plasma treatment is
conducted. By the O.sub.2 plasma treatment, the region on the
surface of the protrusion 3 other than the region having the first
wiring patterns 4L is selectively half-etched, while the first
wiring patterns 4L are a mask. As a consequence, as shown in FIG.
3, the dented parts 3Ds are formed between the first wiring
patterns 4L. Then, as shown in FIG. 6(B), the second insulating
layer 8 that covers the second conductive part 5 is provided.
Thereafter, a given process such as a polishing process is carried
out to the lower surface 2B of the silicon substrate 2, and,
because of this treatment, the silicon substrate 2 is thinned to
have the desired thickness (of 200 .mu.m or less).
[0101] Next, as shown in FIG. 7(A), the sheet form that acts as the
third insulating layer 7 is applied to the lower surface 2B of the
silicon substrate 2 opposite from the upper surface 2A on which the
protrusion 3 and the conductive part 9 are provided. As described,
in the embodiment, the plurality of test probes 1 are formed on the
same silicon substrate 2. Then, by using the applied sheet form as
a sheet for dicing, the silicon substrate 2 is diced (cut) per
every test probe 1 together with the sheet form as shown in FIG.
7(B). By thus forming the plurality of test probes 1 almost
simultaneously on the silicon substrate 2, and then by dicing the
silicon substrate 2 per every test probe 1, the test probes 1 can
be efficiently produced while enabling reduction of the cost of the
test probes 1. Then, by simply using the sheet form used for the
dicing as the third resin layer 7, the number of steps required for
the manufacture can be reduced, and the manufacture of the test
probes 1 can be realized at low cost. After the dicing, the bear
chips 10 are mounted as shown in FIG. 7(C), and the test probes 1
can be obtained.
<Tester>
[0102] FIG. 8 is a diagram outlining an example of a tester 70
having the test probe 1. In FIG. 8, the tester 70 includes a holder
72 for holding the substrate 200, which is the device to be tested,
and an adjustment unit 71 that can adjust the positions and
postures of the holder 72 holding the substrate 200. The holder 72
holds the region other than the predetermined region 204 on the
substrate 200. At a position opposite the predetermined region 204
on the substrate 200 held by the holder 72, the first conductive
part 4 provided on the protrusion 3 of the test probe 1 is
arranged. Also, there is a presser 73 made of elastic matter above
the first conductive part 4 interposing the substrate 200. With the
tester 70, while keeping the scanning line terminals 206 of the
substrate 200 and the first conductive part 4 of the test probe 1
in position, the substrate 200 is pressed against the test probe 1
by the presser 73 made of elastic matter. As a consequence, the
scanning line terminals 206 are adhered and electrically connected
to the first wiring patterns 4L. A condition is thereby set for the
plurality of scanning lines 202 on the substrate 200 to receive
from the bear chip 10 the same driving signals as those when the
bear chip 10 is mounted on the portion of the scanning line
terminals 206 of the substrate 200 by the COG technique. Therefore,
by examining the liquid display in this condition by use of the
image analysis such as the CCD or visually, the display test such
as the pixel defect test can be conducted. Additionally, the
composition of the tester 70 may include the second substrate 20 as
described with reference to FIG. 4.
[0103] It is to be noted that the device to be tested by the test
probe and the tester of the invention is not limited to the
liquid-crystal panel display. Any device having terminals can be
tested by the test probe and the tester of the invention.
* * * * *