U.S. patent application number 11/515786 was filed with the patent office on 2007-01-04 for heat sink.
Invention is credited to Wen-Shi Huang, Yu-Hung Huang, Kuo-Cheng Lin, Li-Kuang Tan, Wei-Fan Wu.
Application Number | 20070000643 11/515786 |
Document ID | / |
Family ID | 29581232 |
Filed Date | 2007-01-04 |
United States Patent
Application |
20070000643 |
Kind Code |
A1 |
Tan; Li-Kuang ; et
al. |
January 4, 2007 |
Heat sink
Abstract
A heat sink for coolers is provided. The heat sink contains a
heat conductive element, a heat dissipating shell covering over the
heat conductive element, and a plurality of heat dissipating fins
installed on the heat dissipating shell. The heat conductive
element includes a heat conductive plate and a heat conductive
block installed at the center thereof. The area of the bottom
surface of the heat conductive block is greater than that of the
topmost surface thereof. When the lower surface of the heat
conductive plate is in contact with a device that needs heat
dissipation, the heat conductive block increases the heat
conducting volume at the center of the heat conductive plate, so
that the heat produced by the device can be released at an optimal
rate.
Inventors: |
Tan; Li-Kuang; (Taoyuan
Hsien, TW) ; Huang; Yu-Hung; (Ilan Hsien, TW)
; Wu; Wei-Fan; (Taichung Hsien, TW) ; Lin;
Kuo-Cheng; (Taoyuan Hsien, TW) ; Huang; Wen-Shi;
(Taoyuan Hsien, TW) |
Correspondence
Address: |
BIRCH STEWART KOLASCH & BIRCH
PO BOX 747
FALLS CHURCH
VA
22040-0747
US
|
Family ID: |
29581232 |
Appl. No.: |
11/515786 |
Filed: |
September 6, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10339488 |
Jan 10, 2003 |
|
|
|
11515786 |
Sep 6, 2006 |
|
|
|
Current U.S.
Class: |
165/80.3 ;
257/E23.099; 361/697 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 23/467 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101 |
Class at
Publication: |
165/080.3 ;
361/697 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 16, 2002 |
TW |
91210818 |
Claims
1. A heat sink comprising: a heat dissipating base, which has a
heat conductive plate and a heat conductive block, the heat
conductive plate and the heat conductive block being separately
formed, the heat conductive block having a flat top side and a flat
bottom side, the flat bottom side of the heat conductive block
being disposed at the top side of the heat conductive plate; and a
plurality of heat dissipating fins, installed perpendicular to the
heat conductive plate and the flat top side of the heat conductive
block, the heat dissipating fins being disposed on and directly
connected to the heat conductive plate and the flat top side of the
heat conductive block; wherein the flat bottom side of the heat
conductive block has a larger area than the flat top side of the
heat conductive block.
2. The heat sink of claim 1, wherein the plurality of fins on the
heat conductive block is installed on a side surface of the heat
conductive block.
3. The heat sink of claim 1, wherein the plurality of fins, the
heat conductive plate, and the heat conductive block are made by
aluminum, aluminum alloys, copper, and copper alloys or a material
with high coefficient of thermal conduction.
4. The heat sink of claim 1, wherein the plurality of fins are
connected to the heat dissipating base by soldering, or formed
together with the heat dissipating base.
5. The heat sink of claim 1, wherein the height of the heat
conductive block is not greater than the height of the fins on the
heat dissipating base.
6. The heat sink of claim 1, wherein a side surface of the heat
conductive block is a smooth curved surface, or a plane
surface.
7. A heat sink, comprising: a heat dissipating base, which has a
heat conductive plate and a heat conductive block, the heat
conductive plate and the heat conductive block being separately
formed, the heat conductive block having a top side and a bottom
side, the bottom side of the heat conductive block being disposed
on a top side of the heat conductive plate; and a plurality of heat
dissipating fins disposed on and directly connected to the top side
of the heat conductive plate and the top side of the heat
conductive block; wherein the bottom side of the heat conductive
block has a larger area than the top side of the heat conductive
block.
8. A heat dissipating device, comprising: a fan; and a heat sink
coupled to the fan, wherein the heat sink comprises: a heat
dissipating base, which has a heat conductive plate and a heat
conductive block, the heat conductive block having a top side and a
bottom side, the bottom side of the heat conductive block being
disposed on a top side of the heat conductive plate; and a
plurality of heat dissipating fins disposed on the top side of the
heat conductive plate; wherein the bottom side of the heat
conductive block has a larger area than the top side of the heat
conductive block.
9. The heat dissipating device of claim 8, wherein the heat
dissipating base further has a heat dissipating shell covering over
the heat conductive plate and the heat conductive block, and the
heat dissipating fins are installed to the heat dissipating
shell.
10. The heat dissipating device of claim 9, wherein the heat
dissipating shell and the heat conductive block are made of
different metal materials.
11. The heat dissipating device of claim 10, wherein the heat
dissipating shell is made of aluminum, and the heat conductive
block is made of copper.
12. The heat dissipating device of claim 9, wherein the heat
dissipating shell and the heat conductive block are made by
aluminum, aluminum alloys, copper, and copper alloys or a material
with high coefficient of thermal conduction.
13. The heat dissipating device of claim 9, wherein the heat
conductive block is covered by the heat dissipating shell by
soldering or high-pressure mounting.
14. The heat dissipating device of claim 9, wherein the sink has a
screw for connecting the heat dissipating shell and the heat
conductive block.
15. The heat dissipating device of claim 9, wherein the heat
dissipating fins are formed together with the dissipating
shell.
16. The heat dissipating device of claim 9, wherein the heat
dissipating fins are only formed on a topmost surface and a side
surface of the dissipating shell.
17. The heat dissipating device of claim 8, wherein the heat sink
is used for dissipating a heat-producing device and a bottom
surface of the heat conductive plate is in direct contact with the
heat-producing device.
18. The heat dissipating device of claim 8, wherein the fan is
fixed onto the heat sink using a plurality of fixing elements on
the fins at corners of the heat sink.
19. The heat dissipating device of claim 8, wherein a cross section
width of a bottom surface of the conductive block is smaller than a
cross section width of the heat conductive plate.
20. The heat dissipating device of claim 8, wherein a vertical
height of the heat dissipating base is smaller than or equal to a
vertical height from a lower surface of the heat dissipating base
to a top of the fins.
21. The heat dissipating device of claim 8, wherein an angle
between the bottom side and a side surface of the conductive block
is small than 90 degrees.
Description
[0001] This application is a Division of co-pending application
Ser. No. 10/339,488, filed on Jan. 10, 2003, the entire contents of
which are hereby incorporated by reference and for which priority
is claimed under 35 U.S.C. .sctn.120.
FIELD OF INVENTION
[0002] The invention relates to a heat sink and, in particular to a
heat sink with a heat dissipating base that has a three-dimensional
curved surface.
Related Art
[0003] With the increasing efficiency of electronic devices, the
heat dissipating device or system becomes indispensable equipment.
If the heat produced by an electronic device is not released to the
environment properly, the efficiency may deteriorate or the device
may burn out. Therefore, the heat dissipating device is of
particular importance to microelectronic devices (e.g. IC). With
the increase in the density of elements and advance in the
packaging technology, the IC's have even smaller areas. At the same
time, the heat accumulated in each unit area grows. Therefore,
highly efficient heat sinks always form an important research
subject in the electronics industry.
[0004] Generally speaking, the heat dissipating device is installed
on the surface of a heat-generating device to remove the heat form
the device. According to the shape of the base, the heat
dissipating devices can be categorized as planar and cylindrical
ones.
[0005] Please refer to FIGS. 1, 2 and 3. FIG. 1 is a schematic view
of the conventional heat dissipating device 10. FIG. 2 is a top
view of the planar heat sink 20 shown in FIG. 1. FIG. 3 is a side
view of the planar heat sink 20 along the 3-3 cross section. As
shown in these drawings, the heat dissipating device 10 includes an
axial-flow fan 12 and a planar heat sink 20. The planar heat sink
20 has a copper or copper alloy heat conductive plate 24, an
aluminum or aluminum alloy heat dissipating shell 26 covering over
the heat conductive plate 24, and a plurality of aluminum or
aluminum alloy heat dissipating fins 22 perpendicularly installed
on the heat dissipating shell 26. The fan 12 is embedded and fixed
on the fins 22 of the heat sink 20. The lower surface of the heat
conductive plate 24 is attached onto a heat-producing device (e.g.
a CPU, not shown in the drawing).
[0006] The heat-producing device releases a lot of heat during
operations. Since copper has an extremely good heat conductive
property, the released heat rapidly flows toward the heat
dissipating shell 26 and to the fins 22 through the heat conductive
plate 24. The fan 12 further blows the heat on the fins 22 away,
thereby achieving the heat dissipation effect. However, the
produced heat forms a heat flow field (see FIG. 3) within the heat
conductive plate 24. This results in a worse heat conductive effect
in the central area of the base 24. Moreover, the position that
generates the most heat in a typical heat-producing device is the
central region. Therefore, the central area of the heat conductive
plate 24 in the planar heat sink 20 requires a better heat
conducting element to enhance the dissipation effect.
[0007] To improve the heat dissipation effect in the central region
of the heat conductive plate 24, a cylindrical heat sink is
proposed in the prior art. Please refer to FIGS. 4, 5 and 6. FIG. 4
shows another conventional heat dissipating device 30. FIG. 5 is a
top view of the cylindrical heat sink 40 in FIG. 4. FIG. 6 is a
side view of the cylindrical heat sink 40 along the 6-6 cross
section. As shown in the drawings, the heat dissipating device 30
contains an axial-flow fan 12 (same as in FIG. 1) and a cylindrical
heat sink 40. The cylindrical heat sink 40 is comprised of a copper
or copper alloy heat conductive cylinder 44, an aluminum or
aluminum alloy heat dissipating shell 46 covering over the rim of
the heat conductive cylinder 44, and a plurality of aluminum or
aluminum alloy fins 42 perpendicularly installed on the shell 46.
Analogously, the fan 12 is embedded and fixed on the fins 42 of the
heat sink 40. The other surface of the heat sink 40 is then
attached onto the heat-producing device (e.g. CPU).
[0008] As the heat-producing device is in direct contact with the
heat sink surface 40, the heat released during the operation of the
heat-producing device quickly flows to the heat conductive cylinder
44, the heat dissipating shell 46, and the fins 42. Through the
cylindrical design, the heat flows along the heat conductive
cylinder 44, the shell 46, and the fins 42 in the axial direction
toward to fan 12. The fan then provides air convection to bring out
the heat.
[0009] From the above description, one sees that the cylindrical
heat sink 40 indeed solves the unsatisfactory heat dissipation
effect in the central region of the planar heat sink 20. However,
it is easily seen from the heat flow field in FIG. 6 that the
region close to the connection interface between the heat sink 40
and the fan 12 does not have a good dissipation effect. This
obviously is a waste of available space in the heat dissipating
device 30. It is very unpractical to use such devices in small
electronics.
[0010] Furthermore, the heat conductive plate 24 of the heat sink
20 and the heat conductive cylinder 44 of the heat sink 40 are
connected to the heat dissipating shell 26, 46 by soldering,
bonding, or high-pressure mounting, respectively. If the precision
of the heat conductive plate 24, he heat conductive cylinder 44,
and the heat sinks 26, 46 is not high enough, air gaps may appear
at the connection interfaces. Besides, soldering often increases
the thermal resistance of the contact interface, also affecting the
heat conduction effect of the heat sinks 20, 40.
SUMMARY OF THE INVENTION
[0011] The invention provides an improved heat sink with a heat
dissipating base that has a three-dimensional curved surface. By
tight connection between the heat dissipating base and the heat
dissipating shell using the disclosed connector, an optimal heat
conduction effect can be achieved.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The invention will become more fully understood from the
detailed description given hereinbelow illustration only, and thus
are not limitative of the present invention, and wherein:
[0013] FIG. 1 is the schematic view of a conventional heat
dissipating device;
[0014] FIG. 2 is a top view of the planar heat sink in FIG. 1;
[0015] FIG. 3 is a side view of the planar heat sink along the
cross section 3-3;
[0016] FIG. 4 is the schematic view of another conventional heat
dissipating device;
[0017] FIG. 5 is a top view of the cylindrical heat sink in FIG.
4;
[0018] FIG. 6 is a side view of the cylindrical heat sink along the
cross section 6-6;
[0019] FIG. 7 is a schematic view of the disclosed heat dissipating
device;
[0020] FIG. 8 is a top view of the heat sink in the first
embodiment of the invention;
[0021] FIG. 9 is a side view of the heat sink in FIG. 8 along the
cross section 9-9;
[0022] FIG. 10A shows the thermal resistance of the heat
dissipating base as a function of the ratio of the cross section
width of the bottom surface of the heat conductive block and the
cross section width of the heat conductive plate in the first
embodiment of the invention;
[0023] FIG. 10B shows the thermal resistance of the heat
dissipating base as a function of the ratio of the vertical height
of the heat dissipating base and the vertical height between the
lower surface of the heat dissipating base and the top of fins in
the first embodiment;
[0024] FIG. 10C shows the thermal resistance of the heat
dissipating base as a function of the angle subtended between the
bottom surface and the side surface of the heat conductive block in
the first embodiment;
[0025] FIG. 11 is a side view of the heat sink in the second
embodiment along the cross section 11-11; and
[0026] FIG. 12 is a side view of the heat sink in the third
embodiment along the cross section 12-12.
DETAILED DESCRIPTION OF THE INVENTION
[0027] The disclosed heat sink is mounted on a heat-producing
device, which can be a microprocessor or a central processing unit
(CPU). As shown in FIGS. 7, 8 and 9, the heat dissipating device 50
of the invention contains an axial-flow fan 12 and a first improved
heat sink 60. The heat sink 60 contains a heat dissipating base 70
with a three-dimensional curved surface and a plurality of heat
dissipating fins 62. The base 70 contains a heat conductive plate
64 and a heat conductive block 66 installed at the center of the
topmost surface 61 of the heat conductive plate 64. The fins 62 are
mounted perpendicular to the topmost surface 61 of the heat
conductive plate 64 and the side surface 68 of the heat conductive
block 66. Since the fins 62 are installed along the side surface
68, they have different surface areas. The fan 12 can be fixed onto
the heat sink 60 using four fixing elements (e.g. screws) on the
fins 62 at the four corners.
[0028] It should be emphasized that the heat sink 60 in the first
embodiment is featured in that: the heat conductive plate 64 of the
heat dissipating base 70 is installed with an approximately
cylindrical heat conductive block 66 on the top surface 61. That
is, the bottom surface area of the block 66 is greater than its
topmost surface area. The heat conductive block 66 and the heat
conductive plate 64 are formed together using aluminum, aluminum
alloys, copper, copper alloys that have high coefficient of thermal
conduction to form a heat dissipating base 70 with a
three-dimensional curved surface. The fins 62 on the heat
dissipating base 70 are soldered or formed together with the heat
dissipating base 70.
[0029] The shape of the heat conductive block 66 is designed
according to the heat flow field distribution inside the heat
conductor and the coefficient of thermal conduction obtained in
experiment. Here we only use simple texts and associated figures to
describe the manufacturing and formation of the disclosed heat
conductive block 66. Please refer to FIGS. 9, 10A, 10B and 10C.
FIG. 10A shows the thermal resistance R of the heat dissipating
base 70 as a function of the ratio d/D of the cross section width d
of the bottom surface of the heat conductive block 66 and the cross
section width D of the heat conductive plate 64 in the first
embodiment of the invention. FIG. 10B shows the thermal resistance
R of the heat dissipating base 70 as a function of the ratio h/H of
the vertical height h of the heat dissipating base 70 and the
vertical height H between the bottom surface 63 of the heat
dissipating base 70 and the top of fins 62 in the first embodiment.
FIG. 10C shows the thermal resistance R of the heat dissipating
base 70 as a function of the angle .alpha. subtended between the
bottom surface 67 and the side surface 68 of the heat conductive
block 66 in the first embodiment. Parameters that affect the design
of the heat conductive block 66 include the cross section width D
of the heat conductive plate 64, the cross section width d of the
bottom surface of the heat conductive block, the vertical height h
of the heat dissipating base 70 (the total height of the heat
conductive plate 64 and the heat conductive block 66), the vertical
height H from the lower surface 63 of the heat dissipating base 70
to the top of the fins 62 (the total height of the heat conductive
plate 64, the heat conductive block 66, and the fins 62), the angle
.alpha. between the bottom surface 67 and the side surface 68 of
the heat conductive block 66, and the thermal resistance R of the
heat dissipating base 70.
[0030] As shown in FIGS. 10A, 10B, and 10C, the heat conductive
block 66 in the first embodiment has the following features: (1)
The cross section width d of its bottom surface is smaller than the
cross section width D of the heat conductive plate 64. The heat
dissipating base 70 reaches a minimum thermal resistance, point A
in FIG. 10A, when the ratio d/D approaches 0.5. (2) The vertical
height h of the heat dissipating base 70 is smaller than or equal
to the vertical height H from the lower surface of the heat
dissipating base 70 to the top of the fins 62; that is, the height
of the heat conductive block is not larger than the height of each
fin 62. When the ratio h/H is between 0.9 and 1.0, the heat
dissipating base 70 has a minimum thermal resistance, point B in
FIG. 10B. (3) The angle .alpha. between the lower surface 67 and
the side surface 68 of the heat conductive block 66 is smaller than
90 degrees. In other words, the area of the lower surface 67 is
greater than that of the topmost surface 65. When a is between 80
degrees and 85 degrees, the heat dissipating base 70 reaches a
minimum thermal resistance, point C in FIG. 10C.
[0031] When the lower surface 67 of the heat conductive plate 64 in
the first embodiment is attached to a heat-producing device (not
shown), the heat produced by the device can be transferred to each
of the fins 62 through the disclosed heat conductive block 66. The
axial-flow fan 12 then provides air convection to bring away the
heat.
[0032] FIG. 11 is a side view of the heat sink 80 in a second
embodiment of the invention along the 11-11 cross section. The
biggest difference between this heat sink 80 and the previous one
60 is that the current heat sink 80 contains a heat dissipating
base 90 comprised of a heat conductive element 92 and a heat
dissipating shell 94 covering over the heat conductive element 92.
The heat dissipating shell 94 and the heat dissipating base 90 are
made of different metal materials. For example, the heat conductive
element 92 is made of copper and the heat dissipating shell 94 is
made of aluminum. The heat dissipating fins 82 are formed together
with the heat dissipating shell 94, and they are only formed on the
topmost surface 81 and the side surface 88 of the heat dissipating
shell 94. Otherwise, the heat conductive element 92 is similar to
the heat dissipating base 70. It also has a heat conductive plate
84 and a heat conductive block 86 formed thereon. It should be
mentioned that the size, shape, composition, and property of the
heat conductive plate 84 and the heat conductive block 86 in the
current embodiment are similar to those in the first embodiment.
The only difference is that the three-dimensional curved surface of
the heat conductive element 92 is covered by the thin piece of heat
dissipating shell 94 by soldering or high-pressure mounting. The
lower surface 83 of the heat conductive element 92 (i.e. the lower
surface 83 of the heat conductive plate 84) is also in direct
contact with a heat-producing device. In the current embodiment,
the parameters in designing the heat conductive block 86 are
different from those in the first embodiment only in that the cross
section width d is the width of the bottom surface 87 of the heat
conductive block 86 plus the widths of the heat dissipating shell
94 on both sides. Therefore, the shape of the heat conductive block
86 is particularly designed according to the heat flow field inside
the heat conductor and the coefficient of thermal conduction
obtained from experiments. The experimental results in the current
embodiment are also similar to FIGS. 10A, 10B, and 10C and the heat
dissipation effect is the same as in the first embodiment, so we do
not repeat here.
[0033] With reference to FIG. 12, the composition and structure of
the third embodiment of the heat sink 100 are the same as those of
the heat sink 80. The only difference is that: the heat sink 100
has a screw 102 for connecting the heat dissipating shell 94 and
the heat conductive block 86. The heat dissipating shell 94 has a
through hole 104, and the heat conductive block 86 is formed with a
trench 106 corresponding to and with the same diameter as the
through hole 104. Another feature of the current embodiment is that
when the heat conductive element 92 and the heat dissipating shell
94 are combined together, the screw 102 with a diameter slightly
larger than those of the through hole 104 and the trench 106 is
inserted into the through hole 104 of the heat dissipating shell
94. The screw 102 is rotated into the trench 106 on the heat
conductive block 86 by hand or machine. The heat dissipating shell
94 is then tightly connected to the heat conductive element 92
through the screw 102. Therefore, it can avoid increase in thermal
resistance due to the connection of two different metals by
soldering.
[0034] It should be emphasized here that the side surface of the
heat conductive block does not need to be a plane. It can be a
smooth and curved surface. The fins can be made into other shapes
that have larger heat dissipating areas. These modifications are
still within the scope of the invention but not further described
herein.
[0035] In comparison with the prior art, a distinct characteristic
of the invention is that: all the heat sinks 60, 80, 100 in the
embodiments of the invention have heat dissipating bases 70, 90
with a three-dimensional curved surface. They are designed
according to the heat flow field inside the heat conductors and
data of coefficient of thermal conduction obtained from
experiments. Therefore, they solve the problems of inferior heat
dissipation in the conventional planar and the cylindrical heat
sinks. With the connecting element introduced in the third
embodiment, the heat dissipation effect of the disclosed heat sink
can be further improved.
* * * * *