U.S. patent application number 11/402773 was filed with the patent office on 2006-12-14 for apparatus and process for cylindrically grinding workpieces.
This patent application is currently assigned to HON HAI Precision Industry CO., LTD.. Invention is credited to Shih-Chieh Yen.
Application Number | 20060281394 11/402773 |
Document ID | / |
Family ID | 37480571 |
Filed Date | 2006-12-14 |
United States Patent
Application |
20060281394 |
Kind Code |
A1 |
Yen; Shih-Chieh |
December 14, 2006 |
APPARATUS AND PROCESS FOR CYLINDRICALLY GRINDING WORKPIECES
Abstract
An apparatus for cylindrically grinding workpieces includes a
first holding tool (100) for positioning pre-grinding workpieces
(60) and a second holding tool (200) for positioning partially
ground workpieces (i.e. workpieces which have been ground on one
side only). The first holding tool defines a first groove (12) for
containing the pre-grinding workpieces to be partially ground and
the second bonding defines a second groove (22) for containing the
partially ground workpieces. A stopping board (23) connects one
side of the second groove, and the stopping board has a projection
(231) for transferring the partially ground workpieces from the
first groove to the second groove. The present invention also
provides a process for cylindrically grinding workpieces.
Inventors: |
Yen; Shih-Chieh; (Tu-Cheng,
TW) |
Correspondence
Address: |
PCE INDUSTRY, INC.;ATT. CHENG-JU CHIANG JEFFREY T. KNAPP
458 E. LAMBERT ROAD
FULLERTON
CA
92835
US
|
Assignee: |
HON HAI Precision Industry CO.,
LTD.
Tu-Chen City
TW
|
Family ID: |
37480571 |
Appl. No.: |
11/402773 |
Filed: |
April 12, 2006 |
Current U.S.
Class: |
451/57 |
Current CPC
Class: |
B24B 41/06 20130101;
B24B 9/146 20130101 |
Class at
Publication: |
451/057 |
International
Class: |
B24B 1/00 20060101
B24B001/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 10, 2005 |
CN |
200510035285.3 |
Claims
1. An apparatus for cylindrically grinding workpieces, comprising:
a first holding tool for positioning pre-grinding workpieces, the
first holding tool defining a first groove for containing the
pre-grinding workpieces to be partially ground; and a second
holding tool for positioning the partially ground workpieces, the
second holding tool defining a second groove for containing the
partially ground workpieces, and a stopping board connecting one
side of the second groove; wherein the stopping board has a
projection for transferring the partially ground workpieces from
the first groove to the second groove.
2. The apparatus as claimed in claim 1, wherein the first groove
has a V-shaped cross section.
3. The apparatus as claimed in claim 1, wherein the stopping board
detachably connects the second holding tool by means of bolt or
adhesive.
4. The apparatus as claimed in claim 1, wherein the projection of
the stopping board is semicircular shaped.
5. The apparatus as claimed in claim 1, wherein the first holding
tool has a first stopping board connected one side of the first
groove.
6. The apparatus as claimed in claim 5, wherein the first stopping
board has a first projection for preventing workpieces moving out
of the first groove during the grinding process.
7. The apparatus as claimed in claim 6, wherein the first
projection of the first stopping board is semicircular shaped.
8. A process for grinding workpieces, comprising the steps of:
positioning a plurality of pre-grinding workpieces in a first
groove of a first holding tool, with a first portion of the
pre-grinding workpieces projecting out of the first groove;
partially grinding the first portion of the pre-grinding workpieces
to a first predetermined shape; providing a second holding tool,
the second holding tool having a second groove and a stopping board
connecting one side of the second groove, the stopping board having
a projection; placing the second holding tool on the partially
ground workpieces, with the first portion in the second groove;
moving the second holding tool, with the projection pushing the
partially ground workpieces a predetermined distance; reversing the
two holing tools, with the first holding tool being on the second
holding tool; moving the first holding tool until the partially
ground workpieces completely leave the first groove, a second
portion of the workpieces projecting out of the second groove; and
grinding the second portion of the workpieces to a second
predetermined shape.
9. The process as claimed in claim 8, the workpieces are positioned
in the first groove by bonding the workpieces together with
adhesive.
10. The process as claimed in claim 9, further comprising a step of
detaching and cleaning the bonded workpieces after grinding the
second portion of the workpieces.
11. The process as claimed in claim 8, wherein the workpieces are
ground using a grinding wheel.
12. The process as claimed in claim 8, wherein the first and second
predetermined shapes are each semicircular shape.
13. An apparatus for holding a stack of bonded workpieces in a
grinding process, the apparatus comprising: a first holding tool,
wherein the first holding tool has a first positioning groove for
positioning pre-grinding workpieces to be partially ground, the
first positioning groove has a first cross section corresponding to
an outer periphery of the pre-grinding workpieces; and a second
holding tool, wherein the second holding tool has a second
positioning groove for positioning the partially ground workpieces
for further grinding, the second positioning groove receiving
ground portions of the partially ground workpieces and has a second
cross section corresponding to the ground portions; and a
projecting member fixed relative to the second holding tool and
aligning with the second positioning groove, wherein the projecting
member moves the partially ground workpieces along the first
positioning groove so as to compactly transfer the workpieces from
the first holding tool to the second holding tool when the first
and second holding tools are placed upon and move relative to each
other.
14. The apparatus of claim 13, wherein the first positioning groove
is substantially V-shaped, and the second positioning groove is
substantially semicircular shaped.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention generally relates to cylindrical
grinding apparatuses and processes and, more particularly, to a
holder for holding workpieces during a cylindrically grinding
process and a holding method for such a process.
[0003] 2. DISCUSSION OF THE RELATED ART
[0004] Usually, optical elements such as camera lenses and
spectacles are in used in cylindrical form. However, original
optical workpieces (i.e. lens blanks) are most easily manufactured
in the form of a square. Therefore, these original optical
workpieces have to be cylindrically ground before use.
[0005] A typical example of a contemporary cylindrical grinding
apparatus is a centering apparatus. The centering apparatus
typically includes a pair of holders for holding the original
workpiece, where each holder has a hollow chamber communicating
with a surface of the holder. The holder can hold the workpiece on
its surface by using an air pump pumping the hollow chamber, a
grinding wheel is then used to cylindrically grind the workpiece.
However, the centering apparatus can only cylindrically grind one
piece of workpiece at a time.
[0006] FIGS. 6-7 show an apparatus for cylindrically grinding more
than one workpiece at a time. The apparatus includes a first
holding tool 30 and a second holding tool 40. The first holding
tool 30 defines a holding groove 32, and the second holding tool 40
defines a semicircular groove 42. The holding groove 32 and the
semicircular groove 42 are both for securing the workpieces 50 in
the holding tools 30, 40. In use, firstly, a plurality of
workpieces 50 are placed in the holding groove 32 of the first
holding tool 30. Secondly, the workpieces 50 are bonded together
using adhesive. Thirdly, a grinding wheel is used to grind a
portion of the workpieces 50 projecting out of the holding groove
32 into a semicircular shape. Fourthly, the semicircular portion 51
of the workpieces 50 is transferred to the semicircular groove 42
of the second holding tool 40. Fifthly, the other portion of the
workpieces 50 is also ground into a semicircular shape using the
grinding wheel. The final result being that the workpieces 50 are
ground to a cylindrical shape.
[0007] When transferring the workpieces 50 from the first holding
tool 30 to the second holding tool 40, the adhesive should be
dissolved so that the workpieces 50 can be taken out of the first
holding tool 30. However, the workpieces 50 will not be compact in
the second holding tool 40 because the workpieces 50 will be
disarrayed whilst the adhesive is dissolved.
[0008] Therefore, an apparatus and a process for cylindrically
grinding workpieces which can easily and compactly transfer the
workpieces is desired.
SUMMARY OF THE INVENTION
[0009] In one aspect, an apparatus for cylindrically grinding
workpieces includes a first holding tool for positioning
pre-grinding workpieces and a second holding tool for positioning
partially ground workpieces (i.e. workpieces which have been ground
on one side only). The first holding tool defines a first groove
for containing the pre-grinding workpieces to be partially ground
and the second bonding defines a second groove for containing the
partially ground workpieces. A stopping board connects one side of
the second groove, and the stopping board has a projection for
transferring the partially ground workpieces from the first groove
to the second groove.
[0010] In another aspect of the preferred embodiment, a process for
grinding workpieces can be used wherein a plurality of pre-grinding
workpieces are positioned in a first groove of a first holding tool
with a first portion of the pre-grinding workpieces projecting out
of the first groove. The first portion of the pre-grinding
workpieces is partially ground into a first predetermined shape. A
second holding tool is provided, the second holding tool defining a
second groove and a stopping board connecting to one side of the
second groove, the stopping board having a projection. The second
holding tool is then placed on the partially ground workpieces with
the first portion in the second groove. The second holding tool is
then moved with the projection pushing the workpieces a
predetermined distance. The position of the two holding tools is
then reversed, with the first holding tool being placed on the
second holding tool. The first holding tool is then moved until the
partially ground workpieces completely leave the first groove, a
second portion of the workpieces then projects out of the second
groove, this second portion is then ground into a second
predetermined shape thus completing the grinding process.
[0011] Other advantages and novel features will become more
apparent from the following detailed description when taken in
conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Many aspects of the apparatus can be better understood with
reference to the following drawings. The components in the drawings
are not necessarily drawn to scale, the emphasis instead being
placed upon clearly illustrating the principles of the present
apparatus. Moreover, in the drawings, like reference numerals
designate corresponding parts throughout the several views.
[0013] FIG. 1 is a schematic view of a first holding tool of an
apparatus for cylindrically grinding workpieces in accordance with
a preferred embodiment;
[0014] FIG. 2 is a schematic view of a second holding tool of the
apparatus for cylindrically grinding workpieces in accordance with
a preferred embodiment;
[0015] FIG. 3 is a schematic view of a step of the process for
cylindrically grinding workpieces in accordance with a preferred
embodiment;
[0016] FIG. 4 is a schematic view of another step subsequent to the
step in FIG. 3;
[0017] FIG. 5 is a schematic view of a further step subsequent to
the step in FIG.4;
[0018] FIG. 6 is a schematic view of a first holding tool for
cylindrically grinding workpieces from the prior art; and
[0019] FIG. 7 is a schematic view of a second holding tool for
cylindrically grinding workpieces from the prior art.
DETAILED DESCRIPTION OF THE EMBODIMENT
[0020] Referring to FIGS. 1-2, in a preferred embodiment, an
apparatus for cylindrically grinding workpieces 60, includes a
first holding tool 100, a second holding tool 200, and a grinding
wheel 300. The holding tools 100, 200 are configured for bonding
workpieces 60.
[0021] The first holding tool 100 defines a first groove 12 for
containing pre-grinding workpieces 60. The pre-grinding workpieces
60 can be optical elements having a non-cylindrical shape. In this
preferred embodiment, the workpieces 60 are in substantially square
form. Therefore, the first groove 12 is configured to have a
V-shaped cross section, for compliantly receiving the pre-grinding
workpieces 60 therein. Understandably, the cross section of the
first groove 12 can be of other shape depending on the form of the
pre-grinding workpieces 60. The pre-grinding worpieces 60 are
partially ground on the first groove 12 using the grinding wheel
300. A first stopping board 13 detachably connects one side of the
first holding tool 100 by means of bolt or adhesive. In this
preferred embodiment, the first stopping board 13 connects the
first holding tool 100 by means of cooperation of a first bolt 14
and a screw thread 15 (as shown in FIG. 3). The first stopping
board 13 has a first projection 131 for preventing workpieces 60
moving out of the first groove 12 during the grinding process.
[0022] The second holding tool defines a second groove 22 for
containing the partially ground workpieces 60. The second groove 22
is configured to have a semicircular cross section. The partially
ground workpieces 60 are ground to be cylinder shape on the second
groove 22. A second stopping board 23 detachably connects one side
of the second holding tool 200 using a second bolt 24. The second
stopping board 23 has a second projection 231 used for preventing
workpieces 60 moving out of the second groove 22 during grinding
process, and for transferring the partially ground workpieces 60
from the first groove 12 to the second groove 22.
[0023] Referring to FIGS. 3-5, an exemplary process for
cylindrically grinding workpieces 60 includes the steps of
[0024] (1) A stack of workpieces 60 (i.e. pre-grinding workpieces)
are placed in the first groove 12 of the first holding tool 100. A
first portion 61 of the pre-grinding workpieces 60 projects out of
the first groove 12.
[0025] (2) The pre-grinding workpieces 60 are bonded together in
the first groove using adhesive.
[0026] (3) The first portion 61 of the pre-grinding workpieces 60
is partially ground to a semicircular shape.
[0027] (4) The first stopping board 13 is detached from the first
holding tool 100. The second holding tool 200 are placed on the
partially ground workpieces 60 with the first portion 61 in the
second groove 22.
[0028] (5) The second holding tool 200 is moved with the second
projection 231 pushing the workpieces 60 a predetermined distance
along the second groove 22.
[0029] (6) The two holding tools 100, 200 are reversed with the
first holding tool 100 being on the second holding tool 200.
[0030] (7) The first holding tool 100 is moved toward the
projection 231 until the partially ground workpieces 60 completely
leave the first groove 12. A second portion 62 of the workpieces 60
projects out of the second groove 22.
[0031] (8) The second portion 62 of the workpieces 60 is ground to
a semicircular shape. Thereby, a plurality of cylindrical
workpieces 60 are obtained.
[0032] The process can easily and compactly transfer workpieces 60
from the first groove 12 to the second groove 22 using the stopping
board 23, which can promote the working efficiency of the
cylindrical process.
[0033] It is believed that the present embodiments and their
advantages will be understood from the foregoing description, and
it will be apparent that various changes may be made thereto
without departing from the spirit and scope of the invention or
sacrificing all of its material advantages, the examples here
before described merely being preferred or exemplary embodiments of
the invention.
* * * * *