U.S. patent application number 11/442010 was filed with the patent office on 2006-11-30 for method and apparatus for dissipating heat, and radar antenna containing heat dissipating apparatus.
This patent application is currently assigned to SENSIS CORPORATION. Invention is credited to Brian J. Edward, Peter J. Ruzicka, Mark Sabatino.
Application Number | 20060268518 11/442010 |
Document ID | / |
Family ID | 37463086 |
Filed Date | 2006-11-30 |
United States Patent
Application |
20060268518 |
Kind Code |
A1 |
Edward; Brian J. ; et
al. |
November 30, 2006 |
Method and apparatus for dissipating heat, and radar antenna
containing heat dissipating apparatus
Abstract
There is provided a heat dissipation device comprising at least
one inlet plenum, at least one outlet plenum and chambers, in which
the chambers communicate directly with the inlet plenum and with
the outlet plenum. Also provided is a heat dissipation device
comprising at least two inlet plenums, at least two outlet plenums
and at least two chambers, the first chamber communicating directly
with a first inlet plenum and a first outlet plenum, the second
chamber communicating directly with a second inlet plenum and a
second outlet plenum. Also provided are methods of dissipating
heat, comprising passing fluid across and/or through such devices.
Also provided are radar antennas comprising radar electronic
components mounted on such devices.
Inventors: |
Edward; Brian J.;
(Jamesville, NY) ; Sabatino; Mark; (Jamesville,
NY) ; Ruzicka; Peter J.; (Auburn, NY) |
Correspondence
Address: |
BURR & BROWN
PO BOX 7068
SYRACUSE
NY
13261-7068
US
|
Assignee: |
SENSIS CORPORATION
East Syracuse
NY
|
Family ID: |
37463086 |
Appl. No.: |
11/442010 |
Filed: |
May 26, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60686006 |
May 31, 2005 |
|
|
|
Current U.S.
Class: |
361/695 |
Current CPC
Class: |
H05K 7/20154
20130101 |
Class at
Publication: |
361/695 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. A heat dissipation device, comprising: at least a first inlet
plenum; at least a first outlet plenum; a plurality of first plenum
heat transfer chambers, each said first plenum heat transfer
chamber communicating directly with said first inlet plenum on a
first side of said first plenum heat transfer chamber and
communicating directly with said first outlet plenum on a second
side of said first plenum heat transfer chamber; and at least one
heat transfer element positioned in each said heat transfer
chamber.
2. A device as recited in claim 1, wherein: said first inlet plenum
extends in a first direction, said first outlet plenum extends in a
second direction, and said first direction is substantially
parallel to said first direction.
3. A device as recited in claim 1, wherein: said first inlet plenum
comprises at least a first inlet plenum first wall, a first inlet
plenum second wall, a first inlet plenum third wall and a first
inlet plenum fourth wall, said first inlet plenum first wall
extends substantially in a first inlet plenum first wall plane,
said first inlet plenum second wall extends substantially in a
first inlet plenum second wall plane, said first inlet plenum third
wall extends substantially in a first inlet plenum third wall
plane, said first inlet plenum fourth wall extends substantially in
a first inlet plenum fourth wall plane, said first outlet plenum
comprises at least a first outlet plenum first wall, a first outlet
plenum second wall, a first outlet plenum third wall and a first
outlet plenum fourth wall, said first outlet plenum first wall
extends substantially in a first outlet plenum first wall plane,
said first outlet plenum second wall extends substantially in a
first outlet plenum second wall plane, said first outlet plenum
third wall extends substantially in a first outlet plenum third
wall plane, said first outlet plenum fourth wall extends
substantially in a first outlet plenum fourth wall plane, said
first inlet plenum first wall is substantially parallel to said
first outlet plenum first wall, said first inlet plenum second wall
is substantially parallel to said first outlet plenum second wall,
said first inlet plenum third wall is substantially parallel to
said first outlet plenum third wall, and said first inlet plenum
fourth wall is substantially parallel to said first outlet plenum
fourth wall.
4. A device as recited in claim 1, wherein each of said heat
transfer elements comprises a base and a plurality of protrusions
extending from said base.
5. A device as recited in claim 4, wherein each of said plurality
of protrusions comprises a fin.
6. A device as recited in claim 1, wherein: each of said heat
transfer elements comprises a base and a plurality of protrusions,
said first inlet plenum extends in a first direction, and each of
said protrusions extends in a direction substantially perpendicular
to said first direction.
7. A device as recited in claim 1, wherein: each of said heat
transfer elements comprises a base and a plurality of protrusions,
each of said protrusions extends from said base toward said first
inlet plenum.
8. A device as recited in claim 1, wherein: at least a first of
said heat transfer elements is positioned within a first of said
first plenum heat transfer chambers, said first heat transfer
element comprises a base and a plurality of protrusions, said base
has a base first side and a base second side, said protrusions
extend from said base first side, and at least one electronic
component is mounted on said base second side.
9. A device as recited in claim 1, wherein: said device further
comprises: at least a second inlet plenum and at least a second
outlet plenum; and a plurality of second plenum heat transfer
chambers, each of said second plenum heat transfer chambers
communicates directly with said second inlet plenum on a first side
of said second plenum heat transfer chamber and communicates
directly with said second outlet plenum on a second side of said
second plenum heat transfer chamber, and at least one heat transfer
element is positioned within each of said second plenum heat
transfer chambers.
10. A device as recited in claim 1, wherein: said device further
comprises at least a second outlet plenum and at least one second
plenum heat transfer chamber, and each of said second plenum heat
transfer chambers communicates directly with said first inlet
plenum on a first side of said second plenum heat transfer chamber
and communicates directly with said second outlet plenum on a
second side of said second plenum heat transfer chamber.
11. A device as recited in claim 10, wherein said first and second
outlet plenums are positioned on opposite sides of said first inlet
plenum.
12. A heat dissipation device, comprising: a plurality of inlet
plenums, comprising at least a first inlet plenum and a second
inlet plenum; a plurality of outlet plenums, comprising at least a
first outlet plenum and a second outlet plenum; a plurality of heat
transfer chambers, comprising at least a first heat transfer
chamber and a second heat transfer chamber, said first heat
transfer chamber communicating directly with said first inlet
plenum on a first side of said first heat transfer chamber and with
said first outlet plenum on a second side of said first heat
transfer chamber, said second heat transfer chamber communicating
directly with said second inlet plenum on a first side of said
second heat transfer chamber and communicating directly with said
second outlet plenum on a second side of said second heat transfer
chamber; and at least one heat transfer element positioned in each
said heat transfer chamber.
13. A device as recited in claim 12, wherein: said first inlet
plenum extends in a first direction, said first outlet plenum
extends in a second direction, and said first direction is
substantially parallel to said first direction.
14. A device as recited in claim 12, wherein: said first inlet
plenum comprises at least a first inlet plenum first wall, a first
inlet plenum second wall, a first inlet plenum third wall and a
first inlet plenum fourth wall, said first inlet plenum first wall
extends substantially in a first inlet plenum first wall plane,
said first inlet plenum second wall extends substantially in a
first inlet plenum second wall plane, said first inlet plenum third
wall extends substantially in a first inlet plenum third wall
plane, said first inlet plenum fourth wall extends substantially in
a first inlet plenum fourth wall plane, said first outlet plenum
comprises at least a first outlet plenum first wall, a first outlet
plenum second wall, a first outlet plenum third wall and a first
outlet plenum fourth wall, said first outlet plenum first wall
extends substantially in a first outlet plenum first wall plane,
said first outlet plenum second wall extends substantially in a
first outlet plenum second wall plane, said first outlet plenum
third wall extends substantially in a first outlet plenum third
wall plane, said first outlet plenum fourth wall extends
substantially in a first outlet plenum fourth wall plane, said
first inlet plenum first wall is substantially parallel to said
first outlet plenum first wall, said first inlet plenum second wall
is substantially parallel to said first outlet plenum second wall,
said first inlet plenum third wall is substantially parallel to
said first outlet plenum third wall, and said first inlet plenum
fourth wall is substantially parallel to said first outlet plenum
fourth wall.
15. A device as recited in claim 12, wherein each of said heat
transfer elements comprises a base and a plurality of protrusions
extending from said base.
16. A device as recited in claim 15, wherein each of said plurality
of protrusions comprises a fin.
17. A device as recited in claim 12, wherein: at least a first of
said heat transfer elements is positioned within said first heat
transfer chamber, said first heat transfer element comprises a base
and a plurality of protrusions, said first inlet plenum extends in
a first direction, and each of said protrusions extends in a
direction substantially perpendicular to said first direction.
18. A device as recited in claim 12, wherein: at least a first of
said heat transfer elements is positioned within said first heat
transfer chamber, said first heat transfer element comprises a base
and a plurality of protrusions, each of said protrusions extends
from said base toward said first inlet plenum.
19. A device as recited in claim 12, wherein: at least a first of
said heat transfer elements is positioned within said first heat
transfer chamber, said first heat transfer element comprises a base
and a plurality of protrusions, said base has a base first side and
a base second side, said protrusions extend from said base first
side, and at least one electronic component is mounted on said base
second side.
20. A device as recited in claim 12, wherein: said device further
comprises at least a third heat transfer chamber, said third heat
transfer chamber contains at least one heat transfer element, and
said third heat transfer chamber communicates directly with said
first inlet plenum on a first side of said third heat transfer
chamber and communicates directly with said second outlet plenum on
a second side of said third heat transfer chamber.
21. A device as recited in claim 20, wherein said first and second
outlet plenums are positioned on opposite sides of said first inlet
plenum.
22. A method of dissipating heat, comprising: passing fluid through
at least one inlet plenum, then passing said fluid across a
plurality of protrusions of a heat transfer element, and then
passing said fluid through at least one outlet plenum, said heat
transfer element being positioned within a heat transfer chamber,
said heat transfer chamber communicating directly with said first
inlet plenum on a first side of said heat transfer chamber and
communicating directly with said first outlet plenum on a second
side of said heat transfer chamber, said heat transfer element
comprising a base and said plurality of protrusions.
23. A method as recited in claim 22, wherein said fluid is
gaseous.
24. A method as recited in claim 22, wherein said fluid is air.
25. A method of dissipating heat, comprising: passing fluid through
at least one inlet plenum, then passing said fluid across a
plurality of fins of a heat transfer element, and then passing said
fluid through at least one outlet plenum, said heat transfer
element being positioned within a heat transfer chamber, said heat
transfer chamber communicating directly with said first inlet
plenum on a first side of said heat transfer chamber and
communicating directly with said first outlet plenum on a second
side of said heat transfer chamber, said heat transfer element
comprising a base and said plurality of fins.
26. A method as recited in claim 25, wherein said fluid is
gaseous.
27. A method as recited in claim 25, wherein said fluid is air.
28. A radar antenna, comprising: at least a first inlet plenum; at
least a first outlet plenum; a plurality of first plenum heat
transfer chambers, each said first plenum heat transfer chamber
communicating directly with said first inlet plenum on a first side
of said first plenum heat transfer chamber and communicating
directly with said first outlet plenum on a second side of said
first plenum heat transfer chamber; at least one heat transfer
element positioned in each said heat transfer chamber, said heat
transfer element comprising a base, said base comprising a first
base side and a second base side; and at least one radar electronic
component mounted on said second base side.
29. A radar antenna as recited in claim 28, wherein: said heat
transfer element comprises said base and a plurality of
protrusions.
30. A radar antenna as recited in claim 28, wherein: said heat
transfer element comprises said base and a plurality of fins.
31. A radar antenna, comprising: a plurality of inlet plenums,
comprising at least a first inlet plenum and a second inlet plenum;
a plurality of outlet plenums, comprising at least a first outlet
plenum and a second outlet plenum; a plurality of heat transfer
chambers, comprising at least a first heat transfer chamber and a
second heat transfer chamber, said first heat transfer chamber
communicating directly with said first inlet plenum on a first side
of said first heat transfer chamber and with said first outlet
plenum on a second side of said first heat transfer chamber, said
second heat transfer chamber communicating directly with said
second inlet plenum on a first side of said second heat transfer
chamber and communicating directly with said second outlet plenum
on a second side of said second heat transfer chamber; at least one
heat transfer element positioned in each said heat transfer
chamber, each said heat transfer element comprising a base, said
base comprising a first base side and a second base side; and at
least one radar electronic component mounted on said second base
side.
32. A radar antenna as recited in claim 31, wherein: said heat
transfer element comprises said base and a plurality of
protrusions.
33. A radar antenna as recited in claim 31, wherein: said heat
transfer element comprises said base and a plurality of fins.
34. A heat dissipation device, comprising: at least a first inlet
plenum; a plurality of outlet plenums, comprising at least a first
outlet plenum and a second outlet plenum; and a plurality of heat
transfer chambers, comprising at least a first heat transfer
chamber and a second heat transfer chamber, said first heat
transfer chamber communicating directly with said first inlet
plenum on a first side of said first heat transfer chamber and with
said first outlet plenum on a second side of said first heat
transfer chamber, said second heat transfer chamber communicating
directly with said first inlet plenum on a first side of said
second heat transfer chamber and communicating directly with said
second outlet plenum on a second side of said second heat transfer
chamber; and at least one heat transfer element positioned in each
said heat transfer chamber.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional
Patent Application No. 60/686,006, filed May 31, 2005, the entirety
of which is incorporated herein by reference.
FIELD OF THE INVENTION
[0002] The present invention relates to apparatus for dissipating
heat. The present invention further relates to the thermal
management of electronic components, and more particularly,
limiting temperatures of components generating heat at very high
density. The present invention further relates to methods of
dissipating heat, e.g., from electronic components.
[0003] In preferred aspects, the present invention relates to
apparatus for dissipating heat from electronic components, e.g.,
electronic components for a radar antenna. The present invention
further relates to array antenna systems, and more particularly,
tile-construct active phased array systems having forced air
cooling.
BACKGROUND OF THE INVENTION
[0004] Evolving electronic components are operating at higher
speeds and higher power levels and are being packed more and more
densely. As a consequence, these components are generating
increasingly larger amounts of heat in smaller areas. To limit the
temperatures of these components, and thereby realize peak
performance plus reliable operation, this heat energy must be
effectively removed.
[0005] The continued trend in digital electronic integrated
circuits, such as computer processors, is to form more active
devices (transistors) into smaller areas and to operate these
devices at higher speeds. The by-product of this trend is the
generation of very high heat densities. Removal of this heat has
been identified as perhaps the biggest issue facing computer
designers. Consequently, to support performance improvements,
effective heat extraction techniques are essential. New transistor
materials, such as silicon carbide, are being developed for both
analog power and radio frequency (RF) devices. These materials
enable generation, conversion, and management of much higher power
levels than has been previously possible. Heat densities at the
point of generation can be on the order of 7000 Watts per square
millimeter peak, ten times the amount associated with current
transistors. To fully realize the potential of these new material
components, effective heat removal techniques are needed.
[0006] Opto-electronic components, such as laser diodes and
photo-detectors, must be maintained within temperature bounds to
operate properly. As their power levels increase, techniques for
removal of their excess heat, so as to maintain preferred
operational temperatures, are essential.
[0007] Next generation radar systems will be required to deliver
high levels of performance and operational flexibility, feature
exceptional reliability, and be amenable to growth in capability
while being readily integrated into their host platforms. Active
phased arrays afford significant radar performance capability while
"tile" construct implementations yield minimum volume and weight
systems, and effective air-cooling promotes reliable operation.
[0008] Phased arrays are configured from a plurality of individual
radiating elements whose phase and amplitude states can be
electronically controlled. The radiated energy from the collection
of elements combines constructively (focused) so as to form a beam.
The angular position of the beam is electronically redirected by
controlling the elements' phases. The shape of the beam is altered
by controlling both the elements' phases and amplitudes. Active
phased array antennas include the initial low noise amplifier for
receive and the final power amplifier for transmit with each
individual radiator, in addition to the phase and amplitude control
circuitry. These components are packaged into Transmit/Receive
(T/R) modules and are distributed, with the radiating elements,
over the array structure.
[0009] Tile array implementations package the phased array active
circuits into low-profile modules which are disposed in a plane
parallel to the radiating face of the array. This is in contrast to
"brick" constructs which package the circuitry into higher profile
modules which are disposed orthogonal to the face of the array.
Tile construction yields relatively thin and hence low volume
active phased arrays which are more readily adapted to the host
platforms. The construction also results in minimizing weight,
which is universally beneficial for all platforms.
BRIEF SUMMARY OF THE INVENTION
[0010] In accordance with a first aspect of the present invention,
there is provided a heat dissipation device comprising at least a
first inlet plenum, at least a first outlet plenum, a plurality of
first plenum heat transfer elements and a plurality of first plenum
heat transfer chambers, each first plenum heat transfer chamber
communicating directly with the first inlet plenum on a first side
of the first plenum heat transfer chamber and communicating
directly with the first outlet plenum on a second side of the first
plenum heat transfer chamber, at least one of the first plenum heat
transfer elements being positioned in each heat transfer
chamber.
[0011] In accordance with a second aspect of the present invention,
there is provided a heat dissipation device comprising at least
first and second inlet plenums, at least first and second outlet
plenums, at least first and second heat transfer chambers, and a
plurality of heat transfer elements, the first heat transfer
chamber communicating directly with the first inlet plenum on a
first side of the first heat transfer chamber and with the first
outlet plenum on a second side of the first heat transfer chamber,
the second heat transfer chamber communicating directly with the
second inlet plenum on a first side of the second heat transfer
chamber and communicating directly with the second outlet plenum on
a second side of the second heat transfer chamber, at least one
heat transfer element being positioned in each heat transfer
chamber.
[0012] The present invention is further directed to methods of
dissipating heat, comprising passing fluid (preferably gaseous, a
particularly preferred fluid being air) through inlet plenums,
through heat transfer elements, and through outlet plenums of
devices according to the first aspect of the present invention or
devices according to the second aspect of the present invention as
described above.
[0013] The present invention is further directed to a radar antenna
comprising radar electronic components mounted on a device
according to the first aspect of the present invention or on a
device according to the second aspect of the present invention.
[0014] In another aspect, the present invention provides a
tile-construct phased array which incorporates an air-cooling
thermal management system integral to the array structure.
Preferably, the tile-construct phased array supplies fresh cooling
air to each T/R module, unheated by neighboring units, to
effectively limit component temperatures to acceptable values and
yield a uniform temperature over the array. Such an approach
promotes reliable and high performance active array operation. The
use of air cooling additionally minimizes the overhead power that
is consumed by the thermal management system. The tile construct
approach described herein can provide convenient access to the T/R
modules. These units can be removed and replaced, potentially with
higher transmit power modules to promote radar system capability
growth. The air-cooling design fully supports management of the
increased thermal loads associated with such high power units.
[0015] The invention may be more fully understood with reference to
the accompanying drawings and the following detailed description of
the invention.
BRIEF DESCRIPTION OF THE DRAWING FIGURES
[0016] FIG. 1 is a bottom view of a heat dissipation device
according to a first embodiment in accordance with the present
invention.
[0017] FIG. 2 is a cross-sectional view taken along line 7-7 in
FIG. 1.
[0018] FIG. 3 is a cross-sectional view taken along line 8-8 in
FIG. 2.
[0019] FIG. 4 shows the path of air flow through a main feed column
of an embodiment of a heat dissipation device according to the
present invention, and how air is divided through the heat sink
module and continuing air flow for distribution to other heat sink
modules downstream.
[0020] FIG. 5 shows air flow as it exits out of both sides of an
embodiment of a heat sink module according to the present invention
through channels provided between the extended surfaces of the heat
sink module.
[0021] FIG. 6 displays an air flow path as it exits heat sink
module extended surfaces and enters an exhaust air channel in an
embodiment according to the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0022] The expression "extends in a first direction" when referring
to a particular element, e.g., a plenum, indicates that a line can
be drawn in the first direction which passes through that element
(preferably, which is co-linear with an axis of that element).
[0023] The expression "fin" as used herein refers to a protrusion
having two major dimensions and one minor dimension, preferably a
structure which includes first and second substantially parallel
sides.
[0024] As used herein, the term "substantially," e.g., in the
expressions "substantially parallel", and "substantially in a
plane", means at least about 90% correspondence (preferably 95%
correspondence) with the feature recited, e.g., "substantially
parallel" means that two planes diverge from each other at most by
an angle of 10% of 90 degrees, i.e., 9 degrees (preferably 4.5
degrees); "substantially in a plane" means that a plane defined by
any trio of points in the structure and a plane connecting any
other trio of points in the structure define no angle greater than
10% of 90 degrees, i.e., 9 degrees (preferably 4.5 degrees).
[0025] The expression "substantially perpendicular", as used
herein, means that at least 90% (preferably 95%) of the points in
the structure which is characterized as being substantially
perpendicular to a reference plane are located on one of or between
a pair of planes (1) which are perpendicular to the reference
plane, (2) which are parallel to each other and (3) which are
spaced from each other by a distance of not more than 10%
(preferably 5%) of the largest dimension of the structure.
[0026] As mentioned above, in accordance with a first aspect of the
present invention, there is provided a heat dissipation device
comprising at least a first inlet plenum, at least a first outlet
plenum, a plurality of first plenum heat transfer elements and a
plurality of first plenum heat transfer chambers.
[0027] Preferably, in heat dissipation devices according to the
first aspect of the present invention, each first plenum heat
transfer chamber communicates directly with the first inlet plenum
on a first side of the first plenum heat transfer chamber and
communicates directly with the first outlet plenum on a second side
of the first plenum heat transfer chamber.
[0028] The expression "communicating directly" as used herein,
e.g., in the expression "each first plenum heat transfer chamber
communicating directly with the first inlet plenum" indicates that
the respective elements, e.g., the first plenum heat transfer
chamber and the first outlet plenum are in communication with no
heat transfer elements positioned therebetween.
[0029] In accordance with this aspect of the present invention, the
first inlet plenum and the first outlet plenum, and the walls
thereof, can extend in any desired direction or directions relative
to one another. Preferably, the first inlet plenum is substantially
parallel to the first outlet plenum. Preferably, respective walls
of the first inlet plenum are parallel to respective walls of the
first outlet plenum.
[0030] Any suitable heat transfer elements (which may be the same
or different from one another) can be employed in the first aspect
of the present invention.
[0031] In accordance with the first aspect of the present
invention, the heat transfer elements can be placed in any desired
orientation in relation to the first inlet plenum. Preferably, each
of the heat transfer elements comprises a base and a plurality of
protrusions provided on the base, and each of the protrusions
extend in directions substantially perpendicular to the direction
in which the first inlet plenum extends, and/or each of the
protrusions extends from its base toward the first inlet
plenum.
[0032] Preferably, the heat transfer elements each comprise a base
and a plurality of protrusions provided on the base, and at least
one electronic component (e.g., an integrated circuit component) is
mounted on a side of the base opposite to the side on which the
protrusions are provided.
[0033] Preferably, the device according to the first aspect of the
present invention further comprises at least a second inlet plenum
and at least a second outlet plenum as well as a plurality of
second plenum heat transfer chambers, each of the second plenum
heat transfer chambers communicates directly with the second inlet
plenum on a first side of the second plenum heat transfer chamber
and communicates directly with the second outlet plenum on a second
side of the second plenum heat transfer chamber, and at least one
heat transfer device is positioned in each of the second plenum
heat transfer chambers.
[0034] The device according to the first aspect of the present
invention can further comprise at least a second outlet plenum as
well as at least one second plenum heat transfer chamber, wherein
each of the second plenum heat transfer chambers communicates
directly with the first inlet plenum on a first side of the second
plenum heat transfer chamber and communicates directly with the
second outlet plenum on a second side of the second plenum heat
transfer chamber, at least one heat transfer device is positioned
in each of the second plenum heat transfer chambers, and the first
and second outlet plenums are positioned on opposite sides of the
first inlet plenum.
[0035] In accordance with the first aspect of the present
invention, the number and arrangement of plenums and heat transfer
elements is not restricted, and any desired number and arrangement
of inlet plenums, outlet plenums and heat transfer elements can be
employed. The devices according to the first aspect of the present
invention, and the components thereof, can generally be of any
desired size and shape.
[0036] As mentioned above, in accordance with a second aspect of
the present invention, there is provided a heat dissipation device
comprising at least first and second inlet plenums, at least first
and second outlet plenums, a plurality of heat transfer elements
and a plurality of heat transfer chambers.
[0037] Preferably, in heat dissipation devices according to the
second aspect of the present invention, the first heat transfer
chamber communicates directly with the first inlet plenum on a
first side of the first heat transfer chamber and with the first
outlet plenum on a second side of the first heat transfer chamber,
and the second heat transfer chamber communicates directly with the
second inlet plenum on a first side of the second heat transfer
chamber and communicates directly with the second outlet plenum on
a second side of the second heat transfer chamber.
[0038] In accordance with this aspect of the present invention, the
first inlet plenum, the second inlet plenum, the first outlet
plenum, and the second outlet plenum, and the walls thereof, can
extend in any desired direction or directions relative to one
another. Preferably, the first inlet plenum, the second inlet
plenum, the first outlet plenum and the second outlet plenum, are
substantially parallel to one another. Preferably, walls of the
first inlet plenum, the second inlet plenum, the first outlet
plenum and the second outlet plenum are parallel to one
another.
[0039] Any suitable heat transfer elements (which may be the same
or different from one another) can be employed in the second aspect
of the present invention.
[0040] In accordance with the second aspect of the present
invention, the heat transfer elements can be placed in any desired
orientation in relation to the respective inlet and outlet plenums.
Preferably, each of the heat transfer elements comprises a base and
a plurality of protrusions provided on the base, and each of the
protrusions extend in directions substantially perpendicular to the
direction in which the first and/or second inlet plenum extends,
and/or each of the protrusions extends from its base toward the
first inlet plenum or the second inlet plenum.
[0041] Preferably, the heat transfer elements each comprise a base
and a plurality of protrusions provided on the base, and at least
one electronic component (e.g., an integrated circuit component) is
mounted on a side of the base opposite to the side on which the
protrusions are provided.
[0042] The device according to the second aspect of the present
invention can further comprise one or more heat transfer chambers,
each containing at least one heat transfer device, which
communicate directly with the first inlet plenum on a first side,
communicate directly with the first outlet plenum on a second side,
and communicate directly with the second outlet plenum on a third
side, wherein the first and second outlet plenums are positioned on
opposite sides of the first inlet plenum.
[0043] In accordance with the second aspect of the present
invention, the number and arrangement of inlet plenums, outlet
plenums and heat transfer elements is not restricted, and any
desired number and arrangement of plenums in the heat transfer
elements can be employed. The devices according to the second
aspect of the present invention, and the components thereof, can
generally be of any desired size and shape.
[0044] The present invention is further directed to methods of
dissipating heat, comprising passing fluid (preferably gaseous, a
particularly preferred fluid being air) through heat transfer
chambers of devices according to the first aspect of the present
invention as discussed above.
[0045] The present invention is further directed to methods of
dissipating heat, comprising passing fluid (preferably gaseous, a
particularly preferred fluid being air) through heat transfer
chambers of devices according to the second aspect of the present
invention as discussed above.
[0046] As noted above, the present invention is further directed to
a radar antenna comprising radar electronic components mounted on a
device according to the first aspect of the present invention, or
on a device according to the second aspect of the present
invention.
[0047] The invention provides devices which provide ways to supply
ambient air feed from upstream air movers. In an embodiment which
provides such feature, air is heated only by the thermal
dissipation of the air movers and energy from mechanical stirring.
The near ambient temperature air passes through each heat sink
module without being pre-heated by passing through another module
or by air from adjacent modules. This provides the maximum
temperature differential between the air and the heated surface,
thereby promoting more effective heat transfer.
[0048] FIG. 4 shows the path of the air flow through the main feed
column of an embodiment of a heat dissipation according to the
present invention, and how it divides into air that passes through
the heat sink module extended surfaces and the continuing air flow
for distribution to other heat sink modules downstream. This column
is pressurized by the blowers and flow impinges upon the heat sink
module extended surfaces. The path of flow is from the ends of the
extended surfaces towards the base and is directed and channeled to
exit out of the sides of the extended surface region of the heat
sink module. The geometry of the extended surface does not
necessarily need to be a plate fin configuration-this could be any
of a wide variety of geometries as long as air flow is channeled
and directed as shown.
[0049] FIG. 5 shows the path of air flow as it exits out of both
sides of an embodiment of a heat sink module extended surface
region and flows through the channeled paths provided between the
extended surfaces of the heat sink module.
[0050] FIG. 6 displays an air flow path as it exits a heat sink
module extended surface region and enters the exhaust air channel
of an embodiment according to the present invention. This flow is
free to divert in either direction or split to both directions
depending on its location to other heat sink modules and the
pressure at the exits.
[0051] The heat transfer is accomplished by the mass air flow rate
passing through each of the individual heat sink modules, supplied
by and flowing through the air feed columns. Long air-feed columns
of over a few modules in length will require air metering at the
individual heat sink modules to accommodate for the pressure drop
as the air flows along the feed column and is distributed to each
heat sink module along the length of the feed column. This metering
can be provided by metering or orifice plates at each location to
provide air flow control.
[0052] A first embodiment of a heat dissipation device according to
the present invention is depicted in FIGS. 1-2. This embodiment
corresponds with the first and second aspects of the present
invention as discussed above.
[0053] FIG. 1 is a bottom view of the heat dissipation device 60
according to the first embodiment. The heat dissipation device 60
comprises a housing 61 which defines a first inlet plenum 62, a
second inlet plenum 63, a third inlet plenum 64, a first outlet
plenum 65 and a second outlet plenum 66.
[0054] The inlet plenums can each include a separate fluid supply
device, e.g., a fan or pump, for supplying fluid into each such
plenum, or, alternatively, one or more of the inlet plenums can be
supplied with fluid from a manifold which includes one or more
fluid supply devices, e.g., fans or pumps.
[0055] FIG. 2 is a cross-sectional view of the heat dissipation
device 60 taken along line 7-7 in FIG. 1. FIG. 2 shows heat
transfer elements 71-76, each positioned in a respective heat
transfer chamber formed in the housing 61. FIG. 2 also depicts heat
transfer chamber outlets 77-80 also formed in the housing 61.
[0056] FIG. 3 is a cross-sectional view of the heating dissipation
device 60 taken along line 8-8 in FIG. 2. FIG. 3 depicts a first
outlet plenum conduit 81 and a second outlet plenum conduit 82. The
heat transfer elements each include a base and a plurality of fins
(e.g., as shown in FIG. 3), the first heat transfer element 71
includes a base 83 and a plurality of fins, including a fin
84).
[0057] As can be seen from FIGS. 2 and 3, fluid supplied through
the first inlet plenum 62 passes across the fins of the heat
transfer element 71 (the heat transfer element 71 comprises a base
83 and fins 84), through the first outlet plenum conduit 81,
through the heat transfer chamber outlet 77 and into the first
outlet plenum 65, through which it exits the heat dissipation
device 60. Similarly, a first portion of fluid from the second
inlet plenum 63 passes across the fins of the heat transfer element
73, through the outlet plenum conduit 81 and through the heat
transfer chamber outlet 77 into the first outlet plenum 65, through
which it exits the heat dissipation device 60; a second portion of
fluid from the second inlet plenum 63 passes across the fins of the
heat transfer element 73, through the outlet plenum conduit 82,
through the heat transfer chamber outlet 79 and into the second
outlet plenum 66, through which it exits the heat dissipation
device 60. Similarly, fluid from the third inlet plenum 64 passes
across the fins of the heat transfer element 75, through the outlet
plenum conduit 82, through the heat transfer chamber outlet 79 and
into the second outlet plenum 66, through which it exits the heat
dissipation device 60.
[0058] In an analogous way, fluid passes from the first inlet
plenum 62, across the fins of the heat transfer element 72, through
an outlet plenum conduit (not visible in FIG. 3), then through the
heat transfer chamber outlet 78 into the first outlet plenum 65,
through which it exits the heat dissipation device 60; fluid passes
from the second inlet plenum 63 across the fins of the heat
transfer element 74, and respective portions thereof pass through
outlet plenum conduits (not visible in FIG. 3) and then through the
heat transfer chamber outlets 78 and 80, respectively, into the
first outlet plenum 65 and the second outlet plenum 66, through
which it exits the heat dissipation device 60, respectively; and
fluid passes from the third inlet plenum 64, across the fins of the
heat transfer element 76, through an outlet plenum conduit (not
visible in FIG. 3), through the heat transfer chamber outlet 80 and
into the second outlet plenum 66, through which it exits the heat
dissipation device 60.
[0059] Although the first embodiment shown in FIGS. 1-3 includes
only first, second and third inlet plenums and first and second
outlet plenums, devices according to the first and/or second
aspects of the present invention can include any number of inlet
and outlet plenums, whereby, e.g., respective portions of fluid
from the third inlet plenum 64, after passing across the fins of
the heat transfer element 75 could be directed either to the left
and to the right from the perspective shown in FIG. 3, i.e.,
through the outlet plenum conduit 82 and through another outlet
plenum conduit on an opposite side of the fins of the heat transfer
element 75 relative to the outlet plenum conduit 82 and then
through a heat transfer chamber outlet and into an additional
outlet plenum positioned to the right (from the perspective shown
in FIG. 3) of the third inlet plenum 64 shown in FIG. 3.
[0060] In such a way, the heat transfer chambers in which the heat
transfer elements 71 and 72, respectively, are positioned
communicate directly with the first inlet plenum 62 on respective
first sides of those heat transfer chambers and communicate
directly with the first outlet plenum 65 on respective second sides
of those heat transfer chambers. Similarly, in the device depicted
in FIGS. 1-3, the heat transfer chambers in which the heat transfer
elements 73 and 74 are positioned communicate directly with the
second inlet plenum 63 on respective first sides of those heat
transfer chambers, communicate with the first outlet plenum 65 on
respective second sides of those heat transfer chambers, and
communicate with the second outlet plenum 66 on respective third
sides of those heat transfer chambers.
[0061] Any two or more structural parts of the devices described
herein can be integrated. Any structural part of the devices
described herein can be provided in two or more parts which are
held together, if necessary. Similarly, any two or more functions
can be conducted simultaneously, and/or any function can be
conducted in a series of steps.
* * * * *