U.S. patent application number 11/497408 was filed with the patent office on 2006-11-23 for methods and apparatus for providing fluid to a semiconductor device processing apparatus.
This patent application is currently assigned to Applied Materials, Inc.. Invention is credited to Sandy Shih-Hsun Chao, Songjae Lee, Ho Seon Shin.
Application Number | 20060264160 11/497408 |
Document ID | / |
Family ID | 35504301 |
Filed Date | 2006-11-23 |
United States Patent
Application |
20060264160 |
Kind Code |
A1 |
Chao; Sandy Shih-Hsun ; et
al. |
November 23, 2006 |
Methods and apparatus for providing fluid to a semiconductor device
processing apparatus
Abstract
In a first aspect, a valve assembly is provided that includes a
valve assembly output adapted to output at least one of DI water
and a chemical. A first valve of the valve assembly includes (1) a
first input adapted to receive the chemical; (2) a first output
adapted to circulate the chemical to a chemical return; and (3) a
second output adapted to output the chemical to the valve assembly
output. The valve assembly also includes a second valve positioned
downstream from the first valve. The second valve includes (1) an
input adapted to receive deionized (DI) water; and (2) an output
adapted to output DI water to the valve assembly output. A check
valve is coupled between the second output of the first valve and
the output of the second valve, and the first valve, second valve
and check valve are included in a single manifold.
Inventors: |
Chao; Sandy Shih-Hsun;
(Campbell, CA) ; Lee; Songjae; (San Jose, CA)
; Shin; Ho Seon; (Cupertino, CA) |
Correspondence
Address: |
DUGAN & DUGAN, PC
55 SOUTH BROADWAY
TARRYTOWN
NY
10591
US
|
Assignee: |
Applied Materials, Inc.
|
Family ID: |
35504301 |
Appl. No.: |
11/497408 |
Filed: |
July 31, 2006 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
11048106 |
Jan 28, 2005 |
|
|
|
11497408 |
Jul 31, 2006 |
|
|
|
60540540 |
Jan 30, 2004 |
|
|
|
Current U.S.
Class: |
451/285 |
Current CPC
Class: |
C07C 217/84 20130101;
C07C 43/23 20130101; Y10T 137/87249 20150401; F16K 27/003 20130101;
C07F 9/12 20130101; Y10T 137/87885 20150401; C07C 237/04
20130101 |
Class at
Publication: |
451/285 |
International
Class: |
B24B 29/00 20060101
B24B029/00 |
Claims
1. A semiconductor device processing apparatus comprising: a
polishing device; and a valve assembly coupled to the polishing
device and adapted to provide fluid to the polishing device, the
valve assembly including: a valve assembly output adapted to output
at least one of DI water and a chemical to the polishing device; a
first valve comprising: a first input adapted to receive the
chemical; a first output adapted to circulate the chemical to a
chemical return; and a second output adapted to output the chemical
to the valve assembly output; a second valve positioned downstream
from the first valve comprising: an input adapted to receive
deionized (DI) water; and an output adapted to output DI water to
the valve assembly output; and a check valve coupled between the
second output of the first valve and the output of the second
valve; wherein the first valve, second valve and check valve are
included in a single manifold.
2. The semiconductor device processing apparatus of claim 1
wherein: the polishing device includes a scrubber device; and the
valve assembly is adapted to selectively deliver the chemical and
DI water to the scrubber device.
3. The semiconductor device process apparatus of claim 2 wherein
the both the scrubber device and the valve assembly are included
within the polishing device.
4. The semiconductor device process apparatus of claim 1 wherein
the first valve further comprises a manual override switch.
5. The semiconductor device process apparatus of claim 1 wherein at
least one of the first and second valves is a
pneumatically-actuated valve.
6. The semiconductor device process apparatus of claim 1 wherein
one or more DI water path within the valve assembly includes no
dead leg.
Description
[0001] This application is a division of U.S. Non-Provisional
patent application Ser. No. 11/048,106, filed Jan. 28, 2005, which
claims priority from U.S. Provisional Patent Application Ser. No.
60/540,540, filed Jan. 30, 2004. Both applications are incorporated
by reference herein in their entirety.
FIELD OF THE INVENTION
[0002] The present invention relates generally to semiconductor
device manufacturing, and more particularly to methods and
apparatus for providing fluid to a semiconductor device processing
apparatus.
BACKGROUND OF THE INVENTION
[0003] While manufacturing a semiconductor device, a substrate may
be processed by a semiconductor device processing apparatus, such
as a polishing device. A polishing device may dispense a fluid,
such as a chemical (e.g., a slurry) or water (e.g., deionized (DI)
water), to the substrate being processed. To supply chemicals
and/or DI water to a polishing device, a plurality of valves that
form a valve system may be employed. Generally, a plurality of
separate valves are coupled together to form the valve system. The
use of separate valves, however, is costly and non-compact. Such a
valve system typically cannot be included in a polishing device.
Accordingly, improved methods and apparatus are desired for
providing fluid to a semiconductor device processing apparatus.
SUMMARY OF THE INVENTION
[0004] In a first aspect of the invention, a valve assembly is
provided. The valve assembly is adapted to provide fluid to a
semiconductor device processing apparatus and includes a valve
assembly output adapted to output at least one of DI water and a
chemical. A first valve of the valve assembly includes (1) a first
input adapted to receive the chemical; (2) a first output adapted
to circulate the chemical to a chemical return; and (3) a second
output adapted to output the chemical to the valve assembly output.
The valve assembly also includes a second valve positioned
downstream from the first valve. The second valve includes (1) an
input adapted to receive deionized (DI) water; and (2) an output
adapted to output DI water to the valve assembly output. A check
valve is coupled between the second output of the first valve and
the output of the second valve. The first valve, second valve and
check valve are included in a single manifold.
[0005] In a second aspect of the invention, a fluid dispensing
system is provided. The fluid dispensing system is adapted to
provide fluid to a semiconductor device processing apparatus and
includes a plurality of the above described valve assemblies within
a single manifold.
[0006] In a third aspect of the invention, a semiconductor device
processing apparatus is provided that includes a polishing device
and a valve assembly coupled to the polishing device. The valve
assembly is adapted to provide fluid to the polishing device and
includes a valve assembly output adapted to output at least one of
DI water and a chemical to the polishing device. A first valve of
the valve assembly includes (1) a first input adapted to receive
the chemical; (2) a first output adapted to circulate the chemical
to a chemical return; and (3) a second output adapted to output the
chemical to the valve assembly output. The valve assembly also
includes a second valve positioned downstream from the first valve.
The second valve includes (1) an input adapted to receive deionized
(DI) water; and (2) an output adapted to output DI water to the
valve assembly output. A check valve is coupled between the second
output of the first valve and the output of the second valve. The
first valve, second valve and check valve are included in a single
manifold. Numerous other aspects are provided, as are methods in
accordance with these other aspects of the invention.
[0007] Other features and aspects of the present invention will
become more fully apparent from the following detailed description,
the appended claims and the accompanying drawings.
BRIEF DESCRIPTION OF THE FIGURES
[0008] FIG. 1 illustrates an exemplary fluid dispensing system in
accordance with an embodiment of the present invention.
[0009] FIG. 2 is a cross-sectional schematic representation of a
valve assembly included in the fluid dispensing system in
accordance with an embodiment of the present invention.
[0010] FIG. 3 is a schematic representation of a second exemplary
fluid dispensing system in accordance with an embodiment of the
present invention.
[0011] FIG. 4 is a block diagram of a third exemplary fluid
dispensing system, which is an alternative embodiment of the second
exemplary fluid dispensing system.
DETAILED DESCRIPTION
[0012] The present invention relates to reducing the space occupied
by (e.g., footprint) and cost of a fluid dispensing system for
providing or dispensing fluid to a semiconductor device processing
apparatus. Further, the volume of dead legs included in the fluid
dispensing system is greatly reduced when compared to conventional
fluid dispensing systems.
[0013] FIG. 1 illustrates an exemplary fluid dispensing system in
accordance with an embodiment of the present invention. With
reference to FIG. 1, the fluid dispensing system 101 is coupled to
a chemical source 103, such as a slurry supply. The fluid
dispensing system 101 receives a chemical (e.g., slurry) output
from the chemical source 103. Similarly, the fluid dispensing
system 101 is coupled to a supply of water (e.g., deionized (DI)
water) 105 and receives DI water output from the supply of water
105. The fluid dispensing system 101 also is coupled to a chemical
return 107 and a DI water return 109. When the fluid dispensing
system 101 is not using the chemical received from the chemical
source 103 and/or the DI water received from the supply of DI water
105, the fluid dispensing system 101 may circulate the chemical
and/or the DI water by outputting the chemical and/or DI water to
the chemical return 107 and/or the DI water return 109,
respectively.
[0014] In one embodiment, the fluid dispensing system 101 is
coupled to and included in a semiconductor device processing
apparatus 111, such as a polishing device for performing chemical
mechanical polishing. In other embodiments, the fluid dispensing
system 101 may be external to the semiconductor device processing
apparatus 111. Assuming that the semiconductor device processing
apparatus 111 is a polishing device, the semiconductor polishing
device 111 may include and/or be coupled to a scrubbing device 113
for removing polishing chemicals and particulates from the surface
of a substrate being processed by the polishing device 111. An
output of the fluid dispensing system 101 is coupled to the
scrubber device 113 and provides the chemical and/or DI water to
the scrubber device 113 during substrate processing.
[0015] FIG. 2 is a cross-sectional schematic representation of a
valve assembly 201 included in the fluid dispensing system 101 in
accordance with an embodiment of the present invention. The valve
assembly 201 is adapted to receive fluid and output (e.g., provide)
fluid to the semiconductor device processing apparatus 111. With
reference to FIG. 2, the valve assembly 201 includes a first valve
203 coupled to a second valve 205. The first valve 203 is adapted
to (1) receive a chemical from the chemical source or supply 103
and circulate the chemical to the chemical return 107; or (2)
output the chemical to the semiconductor device processing
apparatus 111. More specifically, the first valve 203 includes a
first input 207 adapted to couple to the chemical source 103 and
receive the chemical from the chemical source 103. The first valve
203 includes a first output 209 (e.g., a chemical-return output)
adapted to couple to the chemical return 107 and circulate the
chemical by outputting the chemical to the chemical return 107. The
size (e.g., diameter) of the first output 209 may be smaller than
the size of the first input 207 to provide increased back pressure.
Further, the first valve 203 includes a second output 211 adapted
to output the chemical toward an output 213 of the valve assembly
201. Therefore, in the embodiment shown, the first valve 203 is a
three-way valve with one input and two outputs. Valves of different
configurations and/or types may be employed as the first valve
203.
[0016] The first valve 203 includes a manual override switch 215
(e.g., a tap) adapted to prevent the first valve 203 from
outputting the chemical from the second output 211. Therefore,
actuating (e.g., turning on) the manual override switch 215 may
prevent (e.g., lock out) one or more components of the
semiconductor device processing apparatus 111 to which the valve
assembly 201 is coupled from receiving the chemical until the
manual override switch 215 is turned off. In one embodiment, the
default setting of the manual override switch 215 is on, which
prevents one or more components of the semiconductor device
processing apparatus 111 from receiving the chemical. In other
embodiments, the default setting of the manual override switch 215
may be off. It should be noted that the first valve 203 of the
valve assembly 201 incorporates the functionality of two valves
(e.g., a manual valve and three-way valve) into a single valve,
thereby minimizing the space required by the valve assembly
201.
[0017] The valve assembly 201 includes a second valve 205 coupled
to the first valve 203 via a check valve 217. The check valve 217
is adapted to permit a one-way flow of fluid in the valve assembly
201 (as described below). The second valve 205 is positioned
downstream from the first valve 203. More specifically, the second
output 211 of the first valve 203 is coupled to an output 219 of
the second valve 205 via the check valve 217.
[0018] The second valve 205 is adapted to receive and output DI
water. More specifically, the second valve 205 includes an input
221 adapted to couple to the DI water supply 105 and receive DI
water from the DI water supply 105 of the fluid dispensing system
101. The output 219 of the second valve 205 is coupled to the
output 213 of the valve assembly 201 and adapted to output DI water
thereto. In one embodiment, the second valve 205 is a two-way
valve. However, different configurations and/or types of valves may
be employed as the second valve 205.
[0019] As shown in FIG. 2, the output 213 of the valve assembly 201
is coupled to the first valve 203 (e.g., via the second output 211
of the first valve 203) and to the second valve 205 (e.g., via the
output 219 of the second valve 205). The output 213 of the valve
assembly 201 is adapted to output (e.g., dispense) the chemical,
which is received from the first valve 203, and/or DI water, which
is received from the second valve 205, from the valve assembly 201
to the semiconductor device processing apparatus 111.
[0020] The valve assembly 201 may include a DI water return output
(not shown in FIG. 2, but see reference numeral 301 in FIG. 3)
coupled to the second valve 205 and adapted to couple to the DI
return 109 and circulate DI water by outputting the DI water to the
DI return 109. Before being output from the DI-water-return output,
the DI water received in the valve assembly 201 travels along a DI
water circulation path 223.
[0021] In one embodiment, one or more of the first and second
valves 203, 205 are pneumatically-actuated valves. However, other
types of valves may be employed.
[0022] As shown in FIG. 2, the first valve 203, second valve 205
and check valve 217 are included in or formed as a single manifold
(e.g., valve manifold 225). In this manner, the space occupied by
the valve assembly 201, and therefore, the fluid dispensing system
101, is reduced compared to conventional fluid dispensing systems.
Further, including the first valve 203, second valve 205 and check
valve 217 in the valve manifold 225 reduces the number of fittings
(e.g., flare or other suitable fittings) required to receive the
chemical in and/or dispense the chemical from the fluid dispensing
system 101. The number of potential leakage points thereby is
reduced.
[0023] The operation of the valve assembly 201 (and the fluid
dispensing system 101) is now described with reference to FIG. 2.
During operation, the valve assembly 201 receives a chemical. More
specifically, the first input 207 of the first valve 203 receives
the chemical from the chemical supply 103. When the first valve 203
is closed (e.g., via the manual override switch 215 or
pneumatically), the first valve 203 outputs the chemical from the
first output 209 (e.g., a chemical return output) of the first
valve 203. In this manner, the chemical is circulated from the
chemical supply 103 to the chemical return 107. The circulation of
the chemical prevents conglomeration and/or settling of the
chemical within the first valve 103 (so as to reduce wafer defects
which may be caused by such conglomeration/settling).
[0024] While the first valve 203 is closed, the second output 211
of the first valve 203 does not output the chemical. Note that the
volume between the second output 211 of the first valve 203 and the
check valve 217 may include stagnant chemicals output by the first
valve 203 before the first valve 203 was closed. That is, the
volume between the second output 211 of the first valve 203 and the
check valve 217 may be a dead leg. However, because the dead leg is
located within the manifold 225, its volume is relatively
small.
[0025] Alternatively, when the first valve 203 is open, the first
valve 203 may output the chemical from the second output 211 of the
first valve 203 toward the check valve 217. The check valve 217
permits a one-way flow of fluid from the first valve 203 through
the check valve 217 and toward the output 213 of the valve assembly
201. (It is assumed the second valve 205 is closed. As described
below, the second valve 205 may be closed while the first valve 203
is open to avoid contaminating the DI water supply with the
chemical.) Thereafter, the valve assembly 201 dispenses the
chemical from the output 213 (e.g., valve manifold output) of the
valve assembly 201. For example, the valve assembly 201 and,
therefore, the fluid dispensing system 101 may dispense the
chemical to a polishing device component, such as the scrubber
device 113.
[0026] Further, during operation, the valve assembly 201 receives
DI water. More specifically, the input 221 of the second valve 205
receives DI water from the DI water supply 105, for example, via a
DI water input 220 (FIG. 3) of the fluid dispensing system 101.
When the second valve 205 is closed (e.g., pneumatically), the DI
water received by the valve assembly 201 circulates along the
DI-water circulation path 223 toward the DI-water-return output
(not shown in FIG. 2; 301 in FIG. 3). Alternatively, when the
second valve 205 is open, the second valve 205 outputs the DI water
from the output 219 of the second valve 205 toward the check valve
217 and/or the output 213 of the valve assembly 201. Because the
check valve 217 permits only a one-way flow of fluid, and the
second valve 205 is positioned downstream from the check valve 217,
the check valve 217 prevents the DI water from the output 219 of
the second valve 205 from reaching the first valve 203. DI water
thereby is prevented from contaminating the chemical supply 103 or
the chemical return 107.
[0027] The DI water output from the output 219 of the second valve
205 travels toward the output 213 of the valve assembly 201 along
an output path 227 of the valve assembly 201. The DI water may
serve to purge portions of the valve assembly 201 (e.g., the path
227). Thereafter, the valve assembly 201 dispenses the DI water
from the output 213 (e.g., valve manifold output) of the valve
assembly 201. For example, the valve assembly 201 and, therefore,
the fluid dispensing system 101 may dispense the DI water to a
scrubber device 113 of a polishing device. Because DI water may
flow along the DI water circulation path 223 and through the DI
water return output (not shown in FIG. 2; 301 in FIG. 3) while the
second valve 205 is closed, and along output path 227 and through
the output 213 of the valve assembly 201 when the second valve 205
is open, no DI water dead legs exist.
[0028] In one embodiment, the second valve 205 is closed while the
first valve 203 is open. In this manner, the chemical output by the
second output 211 of the first valve 203 toward the output 213 of
the valve assembly 201 may be prevented from contaminating the DI
water supply 105 and/or the DI water return 109. Further, the DI
water may be prevented from diluting the chemical. The valve
assembly 201 dispenses the chemical from the output 213 of the
valve assembly 201 to a component of the semiconductor device
processing apparatus 111.
[0029] The second valve 205 may be open while the first valve 203
is closed. In this manner, the valve assembly 201 dispenses DI
water from the output 213 of the valve assembly 201 to a component
of the semiconductor device processing apparatus 111, and
circulates the chemical from the first output 209 of the first
valve 203 to the chemical return 107.
[0030] Alternatively, the first 203 and second valves 205 both may
be closed. In this manner, the valve assembly 201 circulates the
chemical and DI water to the chemical return 107 and the DI water
return 109, respectively. Other combinations of states (e.g., on or
off) may be employed for the first valve 203 and second valve 205.
Altering the states of the first valve 203 and/or second valve 205
enables a user to employ the valve assembly 201 to selectively
supply the chemical to one or more components of a semiconductor
device processing apparatus 111. The states of the first valve 203
and/or second valve 205 may be altered using two actuators (e.g.,
an actuator corresponding to each of the first valve 203 and second
valve 205). Other numbers of actuators may be used.
[0031] FIG. 3 is a schematic representation of a second exemplary
fluid dispensing system 303 in accordance with an embodiment of the
present invention. The second exemplary fluid dispensing system 303
includes a plurality of the valve assemblies 201a-h of FIG. 2
coupled together. Each of the plurality of valve assemblies 201a-h
are included or formed in the same manifold 225. Therefore, the
space occupied by the second exemplary fluid dispensing system 303
is smaller than that occupied by conventional fluid dispensing
systems. Each of the plurality of valve assemblies 201a-h may be
(1) coupled to a chemical supply 103 via a respective first input
207a-h (only 207h is shown in FIG. 3); (2) coupled to a chemical
return 107 via a respective first output 209a-h; and (3) coupled to
a respective component of a semiconductor device processing
apparatus 111 via a respective output 213a-h of the valve assembly
201a-h. Two or more of the plurality of valve assemblies 201a-h may
be coupled to the same or different chemical supplies, chemical
returns and/or semiconductor device processing apparatus
components. Although in one embodiment, the second exemplary fluid
dispensing system 303 includes eight valve assemblies 201a-h, the
second exemplary fluid dispensing system 303 may include a larger
or smaller number of valve assemblies 201.
[0032] The second exemplary fluid dispensing system 303 includes a
DI water input 220 adapted to couple to and receive DI water from
the DI supply 105 and a DI-water-return output 301 adapted to
couple to and circulate DI water to the DI water return 109. For
example, the input of the second valve 205a of the valve assembly
201a adjacent a first end of the manifold 225 may serve as or be
coupled to the DI water input 220 of the second exemplary fluid
dispensing system 303. The inputs of the second valves of the
remaining valve assemblies 201b-h may be similarly coupled to the
DI-water input 220. Similar to the DI water circulation path 223 of
the valve assembly 201 of FIG. 2, the second exemplary fluid
dispensing system 303 may include a DI water circulation path, for
example, through one or more (e.g., each of) the second valves
205a-h of the plurality of valve assemblies 201a-h. The operation
of the second exemplary fluid dispensing system 303 is similar to
that of the first exemplary fluid dispensing system 101 of FIG. 2
and is not described herein.
[0033] By providing and employing the second exemplary fluid
dispensing system 303, one or more chemicals and/or DI water may be
selectively dispensed (e.g., supplied) to one or more components of
the semiconductor device processing apparatus 111. The one or more
chemicals and/or DI water also may be circulated to respective
chemical returns and/or a DI water return. The footprint, cost, and
size and number of dead legs in fluid circulation paths of the
second exemplary fluid dispensing system 303 thereby are
reduced.
[0034] FIG. 4 is a block diagram of a third exemplary fluid
dispensing system 401, which is an alternative embodiment of the
second exemplary fluid dispensing system 303, in accordance with an
embodiment of the invention. Like reference numerals have been used
to designate functionally similar components. The third exemplary
fluid dispensing system 401 includes three valve assemblies 201a-c
similar to the valve assemblies 201a-h of the second exemplary
fluid dispensing system 303. Other numbers of valve assemblies may
be employed. In contrast to the second exemplary fluid dispensing
system 303, the third exemplary fluid dispensing system 401
includes a DI-water input 402 (e.g., in the manifold 225), which is
coupled to the input 221a-c of a second valve 205a-c included in
each of the valve assemblies 201a-c via a check valve 403 adapted
to permit one-way flow of fluid. As shown in FIG. 4, the DI water
path 223 is coupled to and extends through the inputs 221a-c of the
second valves 205a-c of each of the valve assemblies 201a-c.
[0035] Further, the outputs 213a-c of the valve assemblies 201a-c
are each coupled to a pressure transducer 405a-c for measuring
incoming pressure (e.g., the pressure of a chemical or DI water
output from the third exemplary fluid dispensing system 401). Each
output 213a-c of the valve assemblies 201a-c also is coupled to a
slurry or chemical dispense module 407a-c.
[0036] The foregoing description discloses only exemplary
embodiments of the invention. Modifications of the above disclosed
apparatus and methods which fall within the scope of the invention
will be readily apparent to those of ordinary skill in the art. For
example, one or more of the pneumatically-actuated valves of the
present fluid dispensing systems 101, 303, 401 may be remotely
actuated, (e.g., by software). The fluid dispensing system 101,
303, 401 may be fabricated from chemically resistant materials such
as PTFE (e.g., Teflon.RTM.), PFA, or other high purity polymers.
Other valve materials also may be employed. In one embodiment, a
plurality of second exemplary fluid dispensing systems 303 may be
coupled together (e.g., connected in a row). A removable DI water
supply fitting may be coupled to the DI water input 220 of the
first fluid dispensing system 303 in the row. Similarly, a
removable DI water return fitting may be coupled to the
DI-water-return output 301 of the last fluid dispensing system 303
of the row.
[0037] In one or more embodiments, the first input 207 and the
first output 209 of the first valve 203 are included on the same
side of the manifold 225, thereby facilitating connections to the
chemical supply 103 and chemical return 107. Further, the first
valve 203 of each of the valve assemblies 201 of the fluid
dispensing system 101, which includes the manual override switch
215, may be positioned at the bulkhead of the fluid dispensing
system 101, thereby reducing the need for additional manual valves.
The first valves 203 may be positioned differently.
[0038] Accordingly, while the present invention has been disclosed
in connection with exemplary embodiments thereof, it should be
understood that other embodiments may fall within the spirit and
scope of the invention, as defined by the following claims.
* * * * *