U.S. patent application number 11/432299 was filed with the patent office on 2006-11-23 for tin alloy solder compositions.
This patent application is currently assigned to American Iron & Metal Company, Inc.. Invention is credited to Karl F. Seelig.
Application Number | 20060263234 11/432299 |
Document ID | / |
Family ID | 37397305 |
Filed Date | 2006-11-23 |
United States Patent
Application |
20060263234 |
Kind Code |
A1 |
Seelig; Karl F. |
November 23, 2006 |
Tin alloy solder compositions
Abstract
A lead-free and bismuth-free solder alloy composition for
electronic assembly applications having reduced toxicity. The alloy
composition comprises about 0.01% to about 4.5% silver; about 0.01%
to about 3% copper; about 0.002% to about 5.0% antimony; about 85%
to about 99% tin and about 0.002% to about 1% of either nickel or
cobalt. The alloy composition has a melting temperature of about
217.degree. C., with superior wetting and mechanical strength
making the alloy composition well suited for electronic circuit
board manufacture and lead less component bumping or column arrays,
and replacement of conventional tin-lead solders.
Inventors: |
Seelig; Karl F.; (Jamestown,
RI) |
Correspondence
Address: |
SULLIVAN & WORCESTER LLP
ONE POST OFFICE SQUARE
BOSTON
MA
02109
US
|
Assignee: |
American Iron & Metal Company,
Inc.
Montreal
CA
|
Family ID: |
37397305 |
Appl. No.: |
11/432299 |
Filed: |
May 11, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60679869 |
May 11, 2005 |
|
|
|
Current U.S.
Class: |
420/561 |
Current CPC
Class: |
B23K 35/0244 20130101;
B23K 2101/36 20180801; C22C 13/02 20130101; B23K 35/262 20130101;
C22C 13/00 20130101 |
Class at
Publication: |
420/561 |
International
Class: |
C22C 13/02 20060101
C22C013/02 |
Claims
1. A lead-free, bismuth-free solder alloy composition comprising
about 0.01% to about 4.5% silver; about 0.01% to about 3% copper;
about 0.002% to about 5.0% antimony; about 0.002% to about 1%
nickel; and about 85% to about 99% tin.
2. A lead-free bismuth-free solder alloy composition comprising
about 1.75% to about 2.0% silver; about 0.05% to about 0.09%
copper; about 0.02% to about 2% antimony; about 0.008% to about
1.5% nickel; and about 94.4% to about 98.2% tin.
3. A lead-free, bismuth-free solder alloy composition comprising
about 1.75% to about 2.0% silver; about 0.8% copper; about 0.5%
antimony; about 0.08% nickel; and about 96.6% to about 96.9%
tin.
4. A lead-free bismuth-free solder alloy composition comprising
about 0.5% to about 1.75% silver; about 0% to about 0.5% copper;
about 0.002% to about 0.2% antimony; about 0.08% to about 0.04%
nickel; and about 97.5% to about 99.4% tin.
5. A lead-free, bismuth-free solder alloy composition comprising
about 0.01% to about 4.5% silver; about 0.01% to about 3% copper;
about 0.002% to about 5.0% antimony; about 0.002% to about 1%
cobalt; and about 85% to about 99% tin.
6. A lead-free, bismuth-free solder alloy composition comprising
about 1.0% to about 1.75% silver; about 0.2% to about .99% copper;
about 0.0001% to about 2.0% antimony; about 0.0002% to about 1%
cobalt; and about 94.3% to about 98.8% tin.
7. A lead-free bismuth-free solder alloy composition comprising
about 1.0% to about 1.75% silver; about 0.8% copper; about 1.0%
antimony; about 0.008% cobalt; and about 96.44% to about 97.2%
tin.
8. A lead-free bismuth-free solder alloy composition comprising
about 0.02% to about 1.0% silver; about 0.2% to about 0.8% copper;
about 0.2% to about 0.8% antimony, about 0.008% to about 0.4%
cobalt, and about 97% to about 99.6% tin.
9. A lead less component bumping or column array comprising the
alloy composition of any one of claims 1-2 and 5-6.
10. An electronic assembly comprising the alloy composition of any
one of claims 1-2 and 5-6.
11. The alloy composition of claim 1 or 5, wherein a flux core is
inserted into the composition to form an electronic assembly flux
cored wire solder.
12. The alloy composition of claim 1 or 5, wherein the composition
constitutes a fluxed core of flux and the alloy particles.
13. The alloy composition of claim 1 or 5, wherein said alloy
composition is formed into a solder bar; said solder bar being used
in electronic assembly solder machines.
14. The alloy composition of claim 1 or 5, wherein said alloy
composition is formed into a solder ingot, said solder ingot being
used in electronic assembly.
15. The alloy composition of claim 1 or 5, wherein said alloy
composition is formed into a solder wire, said solder wire being
used in electronic assembly.
16. The alloy composition of claim 1 or 5, wherein said alloy
composition is formed into a solder chip, said solder chip being
used in electronic assembly.
17. The alloy composition of claim 1 or 5, wherein said alloy
composition is formed Into a solder ribbon, said solder ribbon
being used in electronic assembly.
18. The alloy composition of claim 1 or 5, wherein said alloy
composition is formed into a solder powder, said solder powder
being used in electronic assembly.
19. The alloy composition of claim 1 or 5, wherein said alloy
composition is formed into a solder preform, said solder preform
being used in electronic assembly.
20. The alloy composition of claim 1 or 5, wherein said alloy is
employed in hot air levelling of printed circuit boards.
21. The alloy composition of claim 1 or 5, wherein said alloy is
employed in assembling surface mounted printed circuit boards.
22. The alloy composition of claim 1 or 5, wherein said alloy is
employed in the solder coating of printed circuit boards.
23. The alloy composition of claim 1 or 5, wherein said alloy is
employed in roll tinning of circuit boards.
24. The alloy composition of claim 1 or 5, wherein said alloy is
employed in surface mount assembly of electronic components onto a
printed circuit board.
25. The alloy composition of claim 19, wherein said solder preform
is fluxed.
26. The alloy composition of claim 19, wherein said solder preform
is unfluxed.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority to US Provisional Patent
Application No. 60/679,869, filed on May 11, 2005.
FIELD OF THE INVENTION
[0002] The invention relates to a lead-free and bismuth-free tin
alloy that contains antimony and nickel or cobalt.
BACKGROUND OF THE INVENTION
[0003] The present invention relates generally to an improved
solder composition. More specifically, the present invention
relates to an improved solder composition that contains no lead or
bismuth yet still achieves superior soldering characteristics.
[0004] In the electronic manufacturing of printed circuit boards
and the assembly of components thereon, the solders employed
generally contain tin and lead to provide mechanical and electrical
connections. Solders that contain tin and lead typically yield
highly reliable connections in both automated and manual soldering
and provide a surface on printed circuit boards extremely conducive
to soldering.
[0005] Tin-lead alloys of, for example, sixty (60%) percent tin,
forty (40%) percent lead; and sixty-three (63%) percent tin,
thirty-seven (37%) percent lead have historically been used for
most electronic soldering operations. These alloys have been
selected and are preferred because of their low melting
temperatures, mechanical strength, low relative cost, as well as
superior wetting characteristics and electrical conductivity.
[0006] However, the use of such tin-lead solders in the manufacture
of printed circuit boards and assembly of components is becoming
more and more problematic due to the toxic effects of lead exposure
to workers and the inevitable generation of hazardous waste. For
example, even small amounts of lead can affect the neurological
development of fetuses in pregnant workers. Due to these
environmental concerns, action is being taken to limit the amount
of lead entering into the environment. Federal and many state
government agencies have begun to urge the electronics industry to
find alternatives to tin-lead solders to reduce worker lead
exposure and lessen the amount of lead waste going back into the
environment.
[0007] Due to the materials used, many components and printed
circuit boards are easily damaged by exposure to high temperatures
during manufacture or assembly. Because of heat transfer and
distribution limitations and concerns, printed circuit boards are
typically exposed to temperatures higher than the liquidus
temperature of the alloy employed. In response to this concern,
electronic manufacturers are exploring alternative alloys to
replace the tin-lead alloys.
[0008] The prior art has not provided a solder composition
exhibiting optimum wetting and flow properties without toxicity.
Currently federal, military and commercial solder specifications
lack a suitable non-toxic composition. The following prior art
patents illustrate inadequate attempts to meet these needs.
[0009] Soviet Union Patent No.183,037, issued to A. I. Gubin et al.
discloses an alloy containing antimony of 1.+-.0.3%; copper
2.+-.0.3%; silver 5.+-.0.3% and the remainder being tin and having
a melting point of 225.degree.-250.degree. C. This alloy has a
liquidus temperature that does not allow it to be used in
electronic soldering because the soldering temperature required to
flow the alloy would destroy the printed circuit board and many of
the components. No feasible equipment or means currently exists to
allow this alloy to be used for the purpose of electronic soldering
or coating. Due to the high silver content, this alloy has an
economic disadvantage in the marketplace.
[0010] U.S. Pat. No. 3,503,721, issued to Lupfer, discloses a
tin-silver alloy of 96.5% tin and 3.5.+-.0.5% silver with wetting
and electrical conductivity characteristics marginally acceptable
to suit the needs of the electronics industry. However, this alloy
has mechanical strength weaknesses that would prohibit its use on a
wide range of electronic printed circuit board assemblies. For
example, creep strength, a measure of flow under pressure, and
percent elongation, metal stretching before fracture, are
considerably lower than that of the tin-lead alloys now used. Even
with the common tin-lead alloys, solderjoints stress fractures are
the cause of many field failures in printed circuit boards where
vibration or temperature variations occur. In addition, the
liquidus temperature of 221 .degree. C. requires that automated
soldering be accomplished at a temperature that in many situations
would damage the printed circuit board and/or the components. Due
to the high content of silver, the cost of this alloy is
considerably higher than tin-lead alloys. For each percentage point
of silver added to the alloy, the price increases by approximately
$0.75/lbs. (based on a silver market of $5.00/troy ounce).
[0011] U.S. Pat. No. 4,778,733, issued to Lubrano et al. discloses
an alloy containing, by weight, 0.7% to 6% copper; 0.05% to 3%
silver; with the remainder being tin with a temperature range of
440.degree.-630.degree. F. This alloy has a melting temperature
that is too high to be used in a wide range of electronic soldering
applications without damaging printed circuit boards or components.
In addition, the alloy disclosed by Lubrano et aL. exhibits
inferior soldering performance, slow wetting times and mechanical
strengths ill-suited to electronic assembly applications.
[0012] U.S. Pat. No. 4,695,428, issued to Ballentine et al.
discloses an alloy containing 0.5-4% antimony; 0.5-4% zinc; 0.1-3%
silver; 0.1-2% copper; 88-98.8% tin. The zinc content in this alloy
causes the alloy to oxidize quickly. This inhibits wetting and
flow, producing high dross formation which results in extremely
high defect levels. The productivity lost in using such a
composition for mass electronic soldering makes it an unacceptable
alternative to tin-lead solders.
[0013] U.S. Pat. No. 4,758,407, issued to Ballentine et al.
discloses an alloy containing tin, copper, nickel, silver and
antimony. All of the alloy combinations disclosed by Ballentine et
al. have liquidus temperatures in excess of those required for
electronic assembly. The lowest disclosed liquidus temperature is
238.degree. C., which is unacceptable for use in the electronics
industry.
[0014] The most commonly used lead-free alloy is comprised of
tin-silver-copper. Industry testing has proven that
tin-silver-copper, lead-free solder alloys do not offer sufficient
drop testing characteristics as compared to tin-lead solder alloys,
especially on 0.3 mm BGA devices. Common tin-silver-copper alloys,
known as SAC alloys, contain 3-4% silver and 0.5-1% copper. The
main problem with these alloys in a BGA type application is the
AgSn intermetallic plate formation as well as Kirkendal voiding
that occurs. To make SAC alloys more stable, several elements have
been added to reduce copper erosion as well as limit large
intermetallic plates from forming. For example, P, Ge, rare earth
metals, Sb, Ni, and Co have been tried. In addition, the solder
alloys composed of tin-silver-copper-antimony described in U.S.
Pat. Nos. 5,352,407 and 5,405,577, issued to Seelig et al. show
improvement versus tin-silver-copper alloys. However, this alloy
shows some improvements of tin, silver, copper alloys; however
there is still a need for enhanced performance.
[0015] Since heretofore no acceptable substitute for tin-lead
alloys in BGA applications have been found, there remains a need in
the electronics industry for an alloy composition without lead or
bismuth that can achieve the physical characteristics and
application performance of tin-lead solder alloys but without the
toxic elements.
SUMMARY OF THE INVENTION
[0016] The present invention provides solder alloys with new
advantages not found in currently available solder compositions,
and overcomes many of the disadvantages of currently available
compositions.
[0017] The invention is generally directed to novel and unique
solder compositions with particular application in the electronic
manufacturing of printed circuit boards and the assembly of
components therein, as well as lead less component bumping arrays
and column arrays. The solder compositions of the present invention
achieve desired physical characteristics, such as wetting, peel
strength, low melting point, physical strength, fatigue resistance,
electrical conductivity, matrix stability, and uniform joint
strength, but without the toxic elements found in known tin-lead
solder alloys.
[0018] The alloy compositions of the present invention include a
combination of tin, silver, copper, antimony, and either nickel or
copper, to offer a unique set of physical characteristics that
allow it to be used as a viable alternative to tin-lead alloys in
electronic soldering and printed circuit board coating, as well as
lead less component bumping arrays and column arrays. The alloy of
the present invention possesses physical characteristics that
result in a stronger mechanical joint with superior fatigue
resistance to tin-lead alloys, tin-silver alloys, or alloys
containing bismuth. In addition, the melting point temperature is
lower than any other lead-free or bismuth free alternative solder
alloy.
[0019] The preferred embodiment of the present invention has a
reduced toxicity and a melting point of about 217.degree. C and
consisting of, in weight percent, 85-99% tin; 0.01-4.5% silver;
0.01-3.0% copper; and 0.002-5.0% antimony and either 0.0001-1.0%
nickel or 0.0001-1.0% cobalt.
[0020] It is therefore an object of the present invention to
provide solder compositions that are a viable substitute for
tin-lead solder alloys.
[0021] Another object of the present invention is to provide solder
alloy compositions that are well suited for the electronic
manufacturing of printed circuit boards and the assembly of
components thereon.
[0022] It is a further object of the present invention to provide
solder alloy compositions acceptable for the electronics industry
that contain no lead or bismuth.
[0023] It is yet a further object of the present invention to
provide solder alloy compositions that are free of toxic elements
and safe for the environment.
DETAILED DESCRIPTION OF THE INVENTION
[0024] The preferred embodiments of the present invention are
lead-free and bismuth-free solder compositions that contain tin,
silver, copper, antimony, and nickel or contain tin, silver,
copper, antimony, and cobalt. The solder alloy compositions of the
present invention have the physical characteristics and the
application performance to economically meet the needs of the
electronic industry and the assembly and coating of printed circuit
boards. In particular, the alloy exhibits ideal physical
characteristics yet does not contain toxic elements as alloys found
in the prior art which could harm workers and the environment.
[0025] The alloys of the present invention have advantages over the
tin, silver, copper, antimony alloy described in the prior art.
Below is an independent comparison test between a tin, silver,
copper, antimony alloy, as described in U.S. Pat. No. 5,405,577 and
a prior art tin-lead solder alloy containing 63% tin and 37% lead.
As seen below, the mechanical strength of this alloy is superior to
known tin-lead alloys. TABLE-US-00001 Tin/Silver/Copper/ 63%
Tin/37% Lead Antimony Alloy Tensile Categories UTS(ksi) 4.92 5.73
YIELD STGTH.(ksi) 4.38 4.86 YOUNGS' MODULUS(msi) 52.8 42.40
Compression Categories ELASTIC MOD.(msi) 3.99 4.26 YS(ksi) 4.52
4.33 STRESS 25% (ksi) 7.17 8.54 Hardness Category ROCKWELL 15 W
10.08 18.28
[0026] The alloy compositions of the present invention that exhibit
the desired physical characteristics is comprised by weight as
follows: TABLE-US-00002 Metal % Composition Tin (Sn) 85-99% Silver
(Ag) 0.01-4.5% Copper (Cu) 0.01-3.0% Antimony (Sb) 0.002-5.0%
Nickel (Ni) or Cobalt (Co) 0.0001-1%
[0027] In an embodiment, the solder composition comprises about
1.75% to about 2.0% silver; about 0.8% copper; about 0.5% antimony;
about 0.08% nickel; and about 96.6% to about 96.9% tin. The melting
point temperature of the composition is in the range of about
217.degree. C. The liquidus temperature of about 217.degree. C.
coupled with superior wetting allows the alloy of the present
invention to be used with existing mass and hand soldering
equipment without damaging most printed circuit boards or
electronic components. In addition, this alloy when tested in JEDEC
drop tests of 1500 g .times.0.5 meters demonstrated twice the
fatigue life of the known SAC alloys. By comparison, an SAC alloy
containing antimony but lacking nickel (e.g., having the
composition about 1.75% to about 2.0% silver; about 0.8% copper;
about 0.5% antimony; and about 96.6% to about 96.9% tin)
demonstrated only a 30% increase in fatigue life.
[0028] In another embodiment, the solder composition comprises
about 0.5% to about 1.75% silver; about 0% to about 0.5% copper;
about 0.002% to about 0.2% antimony; about 0.08% to about 0.04%
nickel; and about 97.5% to about 99.4% tin.
[0029] In another embodiment, the solder composition comprises
about 1.0% to about 1.75% silver; about 0.8% copper; about 1.0%
antimony; about 0.008% cobalt; and about 96.44% to about 97.2% tin.
This alloy also showed an improved fatigue life over SAC alloys in
JEDEC drop tests of 1500 g .times.0.5 meters.
[0030] In another embodiment, the solder composition comprises
about 0.02% to about 1.0% silver; about 0.2% to about 0.8% copper;
about 0.2% to about 0.8% antimony, about 0.008% to about 0.4%
cobalt, and about 97% to about 99.6% tin.
[0031] The present solder compositions may comprise about 85% to
about 87% tin; about 87% to about 89% tin; about 89% to about 91%
tin; about 91% to about 93% tin; about 93% to about 95% tin; about
95% to about 97% tin; or about 97% to about 99% tin, or a
combination of two or more of the above ranges (e.g., from about
95% to about 99% tin).
[0032] The present solder compositions may comprise about 0.01% to
about 0.05% silver; about 0.05% to about 0.1% silver; about 0.1% to
about 0.5% silver; about 0.5% to about 1.0% silver; about 1.0% to
about 2.0% silver; about 2.0% to about 3.0% silver; about 3.0% to
about 4.0% silver; or about 4.0% to about 4.5% silver, or a
combination of two or more of the above ranges (e.g., from about
1.0% to about 3% silver).
[0033] The present solder compositions may comprise about 0.01% to
about 0.05% copper; about 0.05% to about 0.1% copper; about 0.1% to
about 0.5% copper; about 0.5% to about 1.0% copper; about 1.0% to
about 2.0% copper; or about 2.0% to about 3.0% copper, or a
combination of two or more of the above ranges (e.g., from about 0.
1% to about 1% copper).
[0034] The present solder compositions may comprise about 0.002% to
about 0.005% antimony; about 0.005% to about 0.01% antimony; about
0.01% to about 0.05% antimony; about 0.05% to about 0.1% antimony;
about 0.1% to about 0.5% antimony; or about 0.5% to about 1.0%
antimony; about 1.0% to about 2.0% antimony; about 2.0% to about
5.0% antimony; or a combination of two or more of the above ranges
(e.g., from about 0.1% to about 1% antimony).
[0035] The present solder compositions may comprise about 0.002% to
about 0.005% nickel; about 0.005% to about 0.01% nickel; about
0.01% to about 0.05% nickel; about 0.05% to about 0.1% nickel;
about 0.1% to about 0.5% nickel; or about 0.5% to about 1.0%
nickel, or a combination of two or more of the above ranges (e.g.,
from about 0.01% to about 0.1% nickel).
[0036] The present solder compositions may comprise about 0.002% to
about 0.005% cobalt; about 0.005% to about 0.01% cobalt; about
0.01% to about 0.05% cobalt; about 0.05% to about 0.1% cobalt;
about 0.1% to about 0.5% cobalt; or about 0.5% to about 1.0%
cobalt, or a combination of two or more of the above ranges (e.g.,
from about 0.01% to about 0.1% cobalt).
[0037] Not to be limited to any particular theory, the combination
of antimony with nickel or cobalt may inhibit the SAC alloy from
dissolving copper and forming large intermetallic platelets,
thereby yielding a more stable matrix over time, and providing
better stability and more uniform joint strength.
[0038] The alloys of the invention exhibit excellent wetting and
melting temperatures, as well as superior physical strength,
electrical conductivity, and thermocycling fatigue, for example. As
a result of these excellent physical characteristics, the solder
alloy compositions of the present invention may be successfully
substituted for the known tin-lead alloys currently used for
electronics assembly and printed circuit board manufacture, as well
as lead less component bumping arrays and column arrays. Most
capital equipment used in electronic soldering can employ these
compositions. The low melting temperature is low enough not to
cause heating damage to the board or components therein.
[0039] The alloy compositions of the present invention are well
suited for many different applications. The alloys may be employed
in the coating of circuit boards and printed circuit board
manufacture by use of "hot-air leveling" or "roll-tinning". These
processes improve solderability on the circuit board. Also, the
alloys may be used in the assembly of electronic components on
printed circuit boards when using a wavesoldering machine. The
alloys are also well suited for formation into various shapes and
sizes, such as bars, ingots, wire, chips, ribbons, powder, preform
and can be used with a core of flux. Therefore, the alloys of the
present invention may be used for assembly of electronic components
using solder wire and a heating device to hand solder the
components to the board.
[0040] In the application of coating printed circuit boards, the
compositions of the present invention have superior wetting
characteristics and improved productivity. Tin-lead alloys of the
prior art are easily contaminated by copper from the PC boards that
are dipped into a bath during processing. Since the compositions of
the present invention contain copper, minor increases in the copper
content do not readily affect performance of the compositions. In
addition, these new compositions will not absorb copper as quickly
as prior art tin-lead solders. As a result, these new alloys can
remain functional much longer than prior art tin-lead alloys to
reduce overall solder consumption drastically and reduce outlay by
manufacturers. Moreover, the solderability of the coated board is
extended because the intermetallics are distributed evenly
throughout the grain boundary of the composition. The result is a
higher quality printed circuit board that cannot be achieved by the
use of prior art solder compositions.
[0041] In surfacemount assembly or wavesoldering of components to
printed circuit boards, the compositions of the present invention
can employ the same hot temperatures, pre-heat temperatures, and
process parameters as prior art tin-lead solders now currently in
use. The nominal composition is very close to a eutectic alloy
which exhibits physical characteristics important to high speed,
low defect soldering. Since the solder alloys of the invention are
less easily contaminated than tin-lead alloys, an increased usable
life of the solder bath results. Further, solder joints formed by
wavesoldering yield higher joint strengths and excellent electrical
conductivity with even distribution of intermetallics throughout
the solder joint.
[0042] The solder alloy compositions of the present invention may
also be used in the assembly of electronic components using solder
wire in a heating device to hand solder the components to the
board. Such a method requires a composition that wets and spreads
quickly at about 235.degree. to about 260.degree. C. The
composition of the present invention can be easily formed into a
cored wire solder and used easily and successfully in hand
soldering.
[0043] Overall, the alloy compositions of the present invention
enjoy a combination of a sufficiently low melting temperature for
electronic applications, superior wetting characteristics, and
superior mechanical strength to make it an excellent alternative to
tin-lead alloys for the needs of the electronic industry for
manufacture of printed circuit boards and the assembly of
components onto the boards. The superior solderability and wetting
characteristics yield even pad thicknesses and low copper
solubility to provide a tremendous advantage in the solder coating
of printed circuit boards, such as by hot air leveling.
INCORPORATION BY REFERENCE
[0044] The contents of all cited references (including literature
references, patents, patent applications, and websites) that may be
cited throughout this application are hereby expressly incorporated
by reference. The practice of the present invention will employ,
unless otherwise indicated, techniques for the production and use
of alloys, which are well known in the art.
EQUIVALENTS
[0045] It will be appreciated by those skilled in the art that
various changes and modifications can be made to the disclosed
embodiments without departing from the spirit or essential
characteristics thereof. All such modifications and changes are
intended to be covered by the appended claims. The foregoing
embodiments are therefore to be considered in all respects
illustrative rather than limiting of the invention described
herein. Scope of the invention is thus indicated by the appended
claims rather than by the foregoing description, and all changes
that come within the meaning and range of equivalency of the claims
are therefore intended to be embraced herein.
* * * * *