U.S. patent application number 11/480377 was filed with the patent office on 2006-11-09 for transparent member, optical device using transparent member and method of manufacturing optical device.
Invention is credited to Takeshi Ashida.
Application Number | 20060252169 11/480377 |
Document ID | / |
Family ID | 36145415 |
Filed Date | 2006-11-09 |
United States Patent
Application |
20060252169 |
Kind Code |
A1 |
Ashida; Takeshi |
November 9, 2006 |
Transparent member, optical device using transparent member and
method of manufacturing optical device
Abstract
In a method of manufacturing an optical device, a whole
substrate is first prepared which has a plurality of regions
corresponding to substrates constituting a plurality of optical
devices, respectively. A plurality of chips are then mounted to the
plurality of regions, respectively. A whole sealing member having a
plurality of sealing members is integrally attached to the whole
substrate to form an intermediate body. The intermediate body is
divided into the above-described regions. Thus, the optical device
having a substrate, a chip as an optical element mounted to the
substrate and a sealing member with transparency provided at the
substrate for the purpose of sealing the chip is manufactured. This
manufacturing method improves the efficiency of manufacturing an
optical device.
Inventors: |
Ashida; Takeshi; (Kyoto-shi,
JP) |
Correspondence
Address: |
BIRCH STEWART KOLASCH & BIRCH
PO BOX 747
FALLS CHURCH
VA
22040-0747
US
|
Family ID: |
36145415 |
Appl. No.: |
11/480377 |
Filed: |
July 5, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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11243967 |
Oct 6, 2005 |
|
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11480377 |
Jul 5, 2006 |
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Current U.S.
Class: |
438/29 ;
257/E33.073 |
Current CPC
Class: |
G02B 3/0031 20130101;
H01L 2224/73265 20130101; H01L 2224/48247 20130101; H01L 2924/12043
20130101; H01L 2924/15787 20130101; H01L 2924/01006 20130101; H01L
2924/01005 20130101; H01L 2224/48247 20130101; H01L 2924/00
20130101; H01L 2224/32245 20130101; H01L 2924/00 20130101; H01L
2924/00014 20130101; H01L 2224/85 20130101; H01L 2224/73265
20130101; H01L 2224/48247 20130101; H01L 2924/00 20130101; H01L
2224/32245 20130101; H01L 2924/01033 20130101; H01L 2924/15787
20130101; H01L 2924/12043 20130101; H01L 2924/00 20130101; H01L
2224/48091 20130101; H01L 2924/01082 20130101; H01L 2224/97
20130101; H01L 2224/32245 20130101; H01L 24/97 20130101; G02B
3/0075 20130101; H01L 2224/97 20130101; H01L 2224/48091 20130101;
H01L 33/58 20130101; H01L 2224/97 20130101; H01L 2224/73265
20130101; H01L 2924/12041 20130101 |
Class at
Publication: |
438/029 |
International
Class: |
H01L 21/00 20060101
H01L021/00 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 7, 2004 |
JP |
2005-294980 |
Claims
1. A method of manufacturing an optical device, comprising the
steps of: mounting a chip as an optical element to a substrate;
fixing a protecting member to said substrate so as to surround said
chip; and attaching a transparent member to a top surface of said
protecting member, wherein said step of attaching said transparent
member includes the steps of molding one molded body having a
plurality of transparent members, one of said plurality of
transparent members being arranged at a corresponding one of a
plurality of regions sectioned by phantom lines in a grid pattern;
and dividing said one molded body along said phantom lines to form
each of said plurality of transparent members.
2. The method of manufacturing the optical device according to
claim 1, wherein said one molded body comprises a double-faced
sheet having a base material, a temporary adhesive layer attached
to one side of said base material and an actual adhesive layer
attached to the other side of said base material and to said
transparent member, and is cut along said phantom lines with said
temporary adhesive layer temporarily fixed to another member; after
said plurality of transparent members are formed, each of said
plurality of transparent members is removed from said base
material; and said transparent member is then bonded to the top
surface of said protecting member by said actual adhesive
layer.
3. A method of manufacturing an optical device comprising a
substrate, a chip as an optical element mounted to said substrate,
a protecting member provided at said substrate so as to surround
said chip and a transparent member attached to a top surface of
said protecting member, comprising the steps of: preparing a whole
substrate having a plurality of regions which can be sectioned by
phantom lines in a grid pattern to correspond to a plurality of
substrates, respectively; mounting a plurality of chips to said
plurality of regions, respectively; integrally attaching a whole
protecting member having a plurality of protecting members to said
whole substrate; forming one intermediate body by attaching one
molded body to a top surface of said whole protecting member, said
one molded body having a plurality of transparent members arranged
at the plurality of regions, respectively, sectioned by said
phantom lines in a grid pattern; and dividing said one intermediate
body along said phantom lines in said grid pattern to form a
plurality of optical devices each having said substrate, said
protecting member, said transparent member and said chip.
4. A method of manufacturing an optical device comprising a
substrate, a chip as an optical element mounted to said substrate
and a sealing member with transparency provided at said substrate
for the purpose of sealing said chip, comprising the steps of:
preparing a whole substrate having a plurality of regions which can
be sectioned by phantom lines in a grid pattern to correspond to a
plurality of substrates, respectively; mounting a plurality of
chips to said plurality of regions, respectively; forming one
intermediate body by integrally providing a whole sealing member
having a plurality of sealing members at said whole substrate; and
dividing said one intermediate body along said phantom lines in
said grid pattern to form a plurality of optical devices each
having said substrate, said sealing member and said chip.
Description
[0001] This application is a Divisional of co-pending application
No. 11/243,967, filed on Oct. 6, 2005, the entire contents of which
are hereby incorporated by reference and for which priority is
claimed under 35 U.S.C. .sctn.120.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a transparent member used
in an optical device having a chip as an optical element, an
optical device using the transparent member, and a method of
manufacturing the optical device.
[0004] 2. Description of the Background Art
[0005] Referring to FIGS. 21 to 25, a first method of manufacturing
a conventional optical device is described. Specifically, a method
of manufacturing a package of a light-emitting diode (hereinafter
referred to as an "LED") is described as an example of a
manufacturing method of the optical device. For the sake of
simplicity, respective drawings in association with the description
below are schematically depicted and not drawn to scale.
[0006] In the method of manufacturing the conventional optical
device, as shown in FIG. 21, an LED chip 3 is first die-bonded to a
top surface 2 of a lead frame 1 as a substrate. Then, electrodes
(not shown) of lead frame 1 and LED chip 3 are wire-bonded to each
other via a wire 4.
[0007] Then, as shown in FIG. 22, for example by transfer molding,
a protecting member 6 composed of a cured resin is formed at a
prescribed region on top surface 2 excluding the region around LED
chip 3 and wire 4 and at a prescribed region of a bottom surface 5.
Protecting member 6 serves to protect LED chip 3 and wire 4, and in
some cases, to reflect light emitted from LED chip 3 in an upward
direction of the drawing. Furthermore, when forming protecting
member 6, a concave portion 7 is formed in protecting member 6 on
the side of top surface 2. The process described above provides a
partially-completed product 8 corresponding to an LED package as
one completed product. In this partially-completed product 8, a
portion protruding from protecting member 6 in lead frame 1
functions as a lead of the LED package. It is to be noted that, in
the state shown in FIG. 22, secondary molding may be performed, as
necessary, to fill the space around LED chip 3 and wire 4 with a
cured resin having transparency.
[0008] As shown in FIG. 23, an adhesive (not shown) is then applied
to concave portion 7 of partially-completed product 8, and a
transparent member composed of a material having transparency, that
is, a lens member 9 is prepared. Lens member 9 is thereafter
transported in a state held by adsorption and the like, and aligned
with concave portion 7 of partially-completed product 8. Lens
member 9 individually manufactured by injection molding, includes a
transparent portion 10 having a configuration of a partial sphere
and functioning as a convex lens, and a plate-like flange portion
11 extending laterally at the bottom of transparent portion 10, and
has a circular shape in plan view.
[0009] As shown in FIG. 24, lens member 9 is then lowered to be
placed on concave portion 7, and the adhesive cures to bond lens
member 9 and partially-completed product 8 shown in FIG. 22. Thus,
a partially-completed product with a lens 12 shown in FIGS. 24 and
25 is completed. Subsequent to the above-described process, the
lead is subjected to bending, whereby an LED package is
completed.
[0010] In addition to the above-described manufacturing method, the
following second manufacturing method is also known, depending on
the structure of the LED package. In the proposed manufacturing
method, a layered ceramic substrate is used instead of lead frame
1, and a metal cap is attached to the top surface of the layered
ceramic substrate instead of protecting member 6, and a lens (a
transparent member) is attached to a hole portion provided in the
top surface of the metal cap. This manufacturing method is
disclosed, for example, in Japanese Patent Laying-Open No.
2003-163382. The lens used in this method is a convex lens having a
circular shape in plan view and a convex cross-section at its
center portion.
[0011] In a manufacturing method proposed as a third manufacturing
method, a light-emitting diode pellet (an LED chip) on a lead frame
is sealed with resin to form a photoelectric conversion substrate
having a rectangular shape in plan view, onto which a transparent
resin plate (a transparent member) is mounted. The transparent
resin plate has a plate-like portion which is rectangular in plan
view and a convex lens portion integrated. This manufacturing
method is disclosed, for example, in Japanese Patent Laying-Open
No. 4-348088. The transparent resin plate with a lens is molded by
an injection molding method.
[0012] However, the conventional method set forth above poses the
following problems. First, in the first and second manufacturing
methods, the lens (including the lens member in the first
manufacturing method) has a circular shape in plan view and a
convex cross-section at the center portion. This makes it difficult
to pick up the lens by gripping or adsorption and the like and to
handle the lens during transportation even if the lens has a small
area of a flange portion. In addition, if a jig for a handling
operation contacts a portion through which light of the lens passes
(transparent portion 10 in FIG. 25), the lens will be damaged.
Also, management of inventory and processes become complicated
because it is necessary to store, pick up and transport individual
lenses in all of the first to third manufacturing methods.
Furthermore, it is difficult to improve the efficiency of
manufacturing LEDs because it is necessary to manufacture lenses
and partially-completed products one by one and then attach one
lens to one partially-completed product in all of the first to
third manufacturing methods.
SUMMARY OF THE INVENTION
[0013] An object of the present invention is to provide a
transparent member with improved production efficiency and quality,
an optical device using the transparent member, and a method of
manufacturing the optical device.
[0014] The transparent member of the present invention is, in an
optical device having a substrate and a chip as an optical element
mounted to the substrate, a transparent member used for the purpose
of protecting the chip. The transparent member has a rectangular
shape in plan view and is formed by dividing one integral molded
body along phantom lines in a grid pattern. This structure allows a
plurality of transparent members to be manufactured together, and
therefore, increases the efficiency of manufacturing the
transparent member. Furthermore, the transparent member has a
rectangular shape in plan view so that it can be held by supporting
its opposite sides. Therefore, errors occurring in handling of the
transparent member and damages to it are prevented.
[0015] An optical device of one aspect of the present invention
includes a substrate, a chip as an optical element mounted to the
substrate, a protecting member provided on the substrate so as to
surround the chip, and a transparent member attached to a top
surface of the protecting member. Furthermore, the transparent
member has a rectangular shape in plan view and is formed by
dividing one integral molded body along phantom lines in a grid
pattern. This structure can produce effects similar to those caused
by the above-described transparent member.
[0016] In addition, the optical device of the above-described
aspect may be formed by dividing an intermediate body along the
phantom lines in a grid pattern. In this case, the intermediate
body desirably includes a whole substrate having a plurality of
regions corresponding to a plurality of substrates, a plurality of
chips mounted to the plurality of regions, respectively, sectioned
by the phantom lines in a grid pattern, a whole protecting member
integrally provided on the whole substrate as well as having a
plurality of protecting members corresponding to the plurality of
regions, respectively, and one molded body attached to a top
surface of the whole protecting member and having a plurality of
transparent members.
[0017] An optical device of another aspect of the present invention
includes a substrate, a chip as an optical element mounted to the
substrate, and a sealing member with transparency provided at the
substrate for the purpose of sealing the chip. In addition, the
optical device is formed by dividing an intermediate body along
phantom lines in a grid pattern. In this case, the intermediate
body includes a whole substrate having a plurality of regions
sectioned by the phantom lines in the grid pattern to correspond to
the plurality of substrates, respectively, a plurality of chips
mounted to the plurality of regions, respectively, and a whole
sealing member having a plurality of sealing members corresponding
to the plurality of regions, respectively, and integrally provided
on the whole substrate. This structure also can improve the
efficiency of manufacturing the optical device and facilitates
handling of it.
[0018] The above-described optical device can be manufactured by
the following manufacturing method.
[0019] A method of manufacturing an optical device of one aspect of
the present invention includes the steps of mounting a chip as an
optical element to a substrate, fixing a protecting member to the
substrate so as to surround the chip, and attaching a transparent
member to a top surface of the protecting member. The step of
attaching the transparent member includes the steps of molding one
molded body having a plurality of transparent members arranged at a
plurality of regions, respectively, sectioned by phantom lines in a
grid pattern, and dividing the one molded body along the phantom
lines to form each of the plurality of transparent members.
[0020] Furthermore, the one molded body preferably includes a
double-faced sheet having a base material, a temporary adhesive
layer attached to one side of the base material and an actual
adhesive layer attached to the other side of the base material and
attached to the transparent member. In this case, the one molded
body may be cut along the phantom lines with the temporary adhesive
layer fixed to other members to form the plurality of transparent
members, and after that, each of the plurality of transparent
members may be removed from the base material. Then, the
transparent member may be bonded to the top surface of the
protecting member by the actual adhesive layer. This allows the
manufacturing process to be simplified because it is not necessary
to bond the transparent member to an opening using an adhesive.
[0021] A method of manufacturing an optical device of another
aspect of the present invention is a method of manufacturing an
optical device having a substrate, a chip as an optical element
mounted to the substrate, a protecting member provided at the
substrate so as to surround the chip, and a transparent member
attached to a top surface of the protecting member. The
manufacturing method includes the steps of preparing a whole
substrate having a plurality of regions which can be sectioned by
phantom lines in a grid pattern to correspond to a plurality of
substrates, respectively, mounting a plurality of chips to the
plurality of regions, respectively, integrally attaching a whole
protecting member having a plurality of protecting members to the
whole substrate, forming one intermediate body by attaching one
molded body to a top surface of the whole protecting member, the
one molded body having a plurality of transparent members arranged
at the plurality of regions, respectively, sectioned by the phantom
lines in the grid pattern, and dividing the one intermediate body
along the phantom lines in the grid pattern to form a plurality of
optical devices each having the substrate, the protecting member,
the transparent member and the chip.
[0022] A method of manufacturing an optical device of still another
aspect of the present invention is a method of manufacturing an
optical device provided with a substrate, a chip as an optical
element mounted to the substrate, and a sealing member with
transparency provided at the substrate for the purpose of sealing
the chip. The manufacturing method includes the steps of preparing
a whole substrate having a plurality of regions which can be
sectioned by phantom lines in a grid pattern to correspond to a
plurality of substrates, respectively, mounting a plurality of
chips to the plurality of regions, respectively, forming one
intermediate body by integrally providing a whole sealing member
having a plurality of sealing members at the whole substrate, and
dividing the one intermediate body along the phantom lines in the
grid pattern to form a plurality of optical devices each having the
substrate, the sealing member and the chip.
[0023] The foregoing and other objects, features, aspects and
advantages of the present invention will become more apparent from
the following detailed description of the present invention when
taken in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] FIGS. 1-4 are partial sectional views for describing a
method of manufacturing an optical device of the first
embodiment.
[0025] FIG. 5 is a perspective view of a completed lens member of
the first embodiment.
[0026] FIGS. 6-9 are partial sectional views for describing a
method of manufacturing an optical device of the second
embodiment.
[0027] FIG. 10 is a plan view of a partially-completed product with
a lens of the optical device of the second embodiment.
[0028] FIGS. 11-14 are partial sectional views for describing a
method of manufacturing an optical device of the third
embodiment.
[0029] FIG. 15 is a cross sectional view of a completed optical
device of the third embodiment.
[0030] FIGS. 16-19 are partial sectional views for describing a
method of manufacturing an optical device of the fourth
embodiment.
[0031] FIG. 20 is a cross sectional view of a completed optical
device of the fourth embodiment.
[0032] FIGS. 21-24 are cross sectional views of a method of
manufacturing a conventional optical device.
[0033] FIG. 25 is a plan view of a partially-completed product with
a lens of the conventional optical device.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
First Embodiment
[0034] First, referring to FIGS. 1 to 5, a transparent member, an
optical device and a method of manufacturing the optical device
according to a first embodiment of the present invention will be
described. In each drawing described below, the same components as
those in FIGS. 21 to 25 are designated by the same reference
characters. Furthermore, in the following description, an LED chip
is used as an example of an optical element, and an LED package is
used as an example of an optical device. However, the optical
element of the present invention is not limited to the LED chip,
and may be a light-receiving element converting received light to
an electrical signal, for example, a chip such as a photodiode (PD)
or a solid-state image sensor. Also, the optical element of the
present invention may be a light-emitting element emitting light
depending on received electrical signals, for example, a chip such
as a laser diode (LD). In addition, the optical device of the
present invention may be a module used in optical communication. In
other words, the present invention can be applied to any optical
element.
[0035] In the present embodiment, a lens member, that is, a
transparent member, which is bonded to a partially-completed
product having a substrate, an LED chip and a protecting member
(see a partially-completed product 8 shown in FIG. 23) is
manufactured. The transparent member is formed by performing resin
molding to integrally create a molded body including a plurality of
lens members and then dividing the molded body.
[0036] According to the method of manufacturing the optical device
of the present embodiment, a lower mold 13 and an upper mold 14
facing each other are first prepared, as shown in FIG. 1. Then, a
prescribed amount of a granular resin material 16 composed of a
thermosetting resin having transparency is supplied to a cavity 15
provided in lower mold 13. Cavity 15 has a plurality of concave
portions in accordance with the shape of the lens member. Each of
the plurality of concave portions is formed within a region
sectioned by a phantom grid pattern. Also, resin material 16 may be
in the form of powder, a mass or a sheet instead of a granule as
shown, and may be a thermoplastic resin having prescribed
transparency. A resin material which is liquid at room temperature
may be injected into cavity 15.
[0037] Then, as shown in FIG. 2, lowering upper mold 14 (see FIG.
1) causes lower mold 13 and upper mold 14 to be clamped together
and resin material 16 to be pressed. Resin material 16 is
subsequently heated by heaters (not shown) provided in lower mold
13 and upper mold 14, and melted. This causes a fluid resin 17 to
be formed within cavity 15. Fluid resin 17 thereafter cures to form
a molded body 19 composed of a cured resin 18, as shown in FIG. 3,
that is, so-called compression molding is performed. Thus, molded
body 19 including a plurality of lens members is molded integrally.
Note that transfer molding may be carried out to integrally mold
molded body 19.
[0038] As shown in FIG. 3, upper mold 14 is then raised to open
lower mold 13 and upper mold 14. Molded body 19 is removed from
cavity 15 and then transported to a cutting machine used in the
next process while being held by means such as adsorption.
[0039] Then, molded body 19 is temporarily fixed to a stage 21 by a
dicing sheet 20 having an appropriate tackiness, in other words, a
low adhesive strength. Molded body 19 is thereafter cut by a rotary
blade 22, that is, molded body 19 is divided, along phantom dicing
lines 23 in a grid pattern extending toward a Y direction (the
direction from the front to backward in FIG. 4) and an X direction
(the direction from left to right in FIG. 4), respectively. As a
result, a plurality of lens members 25 (see FIG. 5) are formed.
[0040] It is noted that, as shown in FIG. 5, lens member 25 has a
transparent portion 10 functioning as a transparent member, that
is, a convex lens, and a plate-like flange portion 24 of a
rectangular shape in plan view. This lens member 25 having the
rectangular shape corresponds to the transparent member of the
present invention. Each of the plurality of lens members 25 which
remains temporarily fixed to dicing sheet 20 is then transported,
stored and shipped.
[0041] As in the case of the process shown in FIG. 23, an adhesive
(not shown) is applied to a concave portion 7 of a
partially-completed product 8. Lens member 25 is then detached from
dicing sheet 20, held by adsorption and the like, transported and
aligned with concave portion 7. It is assumed that, in the present
embodiment, concave portion 7 shown in FIGS. 22 to 24 has a
rectangular shape in plan view corresponding to flange portion 24
shown in FIG. 5.
[0042] Then, as in the case of the process shown in FIG. 24, lens
member 25 is lowered to be rested on concave portion 7, and the
adhesive cures. Thus, a partially-completed product with a lens
(see a partially-completed product with a lens 12 in FIGS. 24 and
25) is completed. After the above-described process, a lead is
subjected to bending, whereby the optical device (an LED package)
of the present embodiment is completed.
[0043] As described above, according to the present embodiment,
after molded body 19 including the plurality of lens members 25 is
molded integrally, it is divided into the plurality of lens members
25. Therefore, as compared to the case of forming the plurality of
lens members 25 one by one by injection molding and the like, the
efficiency of manufacturing the optical device is increased.
Further, inventory management, storage and transportation and the
like are simplified. Lens member 25 also has a wide plate-like
flange portion 24 and a rectangular shape in plan view. Therefore,
it is possible to grip and adsorb flange portion 24 when handling
lens member 25. Furthermore, lens member 25 can be held by
supporting its opposite sides even if flange portion 24 has a small
area. Thus, errors occurring in handling lens member 25 and quality
deterioration caused by damages to transparent portion 10 are
prevented.
[0044] Note that, in the present embodiment, molded body 19 is cut
by rotary blade 22. However, the method of cutting molded body 19
is not limited to the above-described method. Molded body 19 may
have grooves formed corresponding to dicing lines 23, and may be
bent to be divided along the grooves to form the plurality of lens
members 25.
[0045] In addition, in the present embodiment, lens member 25 is
used as a transparent member. However, the transparent member is
not limited to the lens member and may be a lens member integrated
with a barrel (a portion including a protecting member 6 and a lens
member 9 on the top side of a substrate 1 in FIG. 23).
Second Embodiment
[0046] Referring to FIGS. 6 to 10, a transparent member, an optical
device and a method of manufacturing the optical device according
to a second embodiment of the present invention will be described.
In the present embodiment, when a molded body is cut, it is
temporarily fixed to a stage. In addition, each of a plurality of
lens members formed by cutting the molded body is bonded to a
corresponding partially-completed product. Also, by using a
double-faced sheet, the molded body is temporarily fixed to the
stage, and the lens member is bonded to the partially-completed
product.
[0047] In the method of manufacturing the optical device of the
present embodiment, as shown in FIG. 6, a double-faced sheet 26 is
first affixed to the bottom side of a molded body 19. Double-faced
sheet 26 has a three-layer structure which is constituted of a base
material 27, a temporary adhesive layer 28 for temporary fixing
which is formed on one side (the bottom side in FIG. 6) of base
material 27 and has a low adhesive strength, and an actual adhesive
layer 29 for actual fixing which is formed on the other side (the
top side in FIG. 6) of base material 27 and has a high adhesive
strength. Actual adhesive layer 29 is affixed to the bottom side of
molded body 19. Furthermore, actual adhesive layer 29 corresponding
to one lens member 25 is patterned so as to be located underneath a
flange portion 24 but not underneath a transparent portion 10. Note
that when an acrylic-like transparent member, for example, is used
as actual adhesive layer 29, actual adhesive layer 29 may be
provided across the entire bottom side of lens member 25.
[0048] Double-faced sheet 26 is then used in place of dicing sheet
20 shown in FIG. 4 to temporarily fix molded body 19 to a stage 21
by temporary adhesive layer 28. Molded body 19 is thereafter cut by
a rotary blade 22 along dicing lines 23 in a grid pattern to
thereby form a plurality of lens members 25. At this time, each of
the plurality of lens members 25 is rectangular in plan view and is
provided with double-faced sheet 26.
[0049] The plurality of lens members 25 are then stripped off from
temporary adhesive layer 28 on stage 21. Thus, as shown in FIG. 7,
lens member 25 is formed in which actual adhesive layer 29 and base
material 27 are affixed in this order to the bottom side of lens
member 25.
[0050] After stripping base material 27 from actual adhesive layer
29, as shown in FIG. 8, lens member 25 is transported with flange
portion 24 adsorbed by an adsorption holder 30. As shown in FIGS. 9
and 10, lens member 25 is thereafter aligned with a
partially-completed product 31, and lowered to contact the top side
of partially-completed product 31, and then pressurized to bond
lens member 25 on the top side of partially-completed product 31.
In other words, lens member 25 is attached to an opening of a
protecting member 6 surrounding a chip 3. A lead is then subjected
to bending, whereby the optical device (an LED package) of the
present embodiment is completed.
[0051] As described above, in the present embodiment, one
double-faced sheet 26 is used which functions as temporary fixing
means used in cutting molded body 19 and actual fixing means for
bonding each of the plurality of lens members 25 to a corresponding
partially-completed product 31. The plurality of lens members 25
are formed by cutting molded body 19. Thus, it is possible to
eliminate the process of applying an adhesive to
partially-completed product 31, and therefore, the efficiency of
manufacturing the optical device can be improved.
Third Embodiment
[0052] Then, referring to FIGS. 11 to 15, a transparent member, an
optical device and a method of manufacturing the optical device
according to a third embodiment of the present invention will be
described. In the method of manufacturing the optical device of the
present embodiment, as shown in FIG. 11, a whole substrate 33 is
first prepared in which a plurality of regions 32 sectioned by
phantom lines in a grid pattern and corresponding to optical
devices, respectively, are formed. Note that whole substrate 33
includes a printed board and the like. Chips 3 are then die-bonded
to regions 32 each having a rectangular shape in plan view,
respectively, and electrodes (not shown) of chip 3 and whole
substrate 33 are wire-bonded to each other by a wire 4.
[0053] Then, as shown in FIG. 12, a whole protecting member 34
surrounding a chip in each of the plurality of regions 32 is
integrally formed by transfer molding. Note that, in place of this
process, whole protecting member 34 may be integrally pre-molded
separately from whole substrate 33 and then be aligned with whole
substrate 33 to be bonded to it. Using these methods, whole
protecting member 34 may be integrally provided at whole substrate
33.
[0054] As shown in FIG. 13, a molded body 19 is then prepared (see
FIG. 3). Molded body 19 is integrally molded by a transparent
resin. It is preferable that an adhesive sheet 35 is previously
affixed to the bottom side of molded body 19. Adhesive sheet 35 has
functions similar to those of actual adhesive layer 29 shown in
FIGS. 6 to 9. Furthermore, molded body 19 is aligned with whole
substrate 33 and then lowered to be pressed on a top surface (the
top side in FIG. 13) of whole protecting member 34. In other words,
molded body 19 is attached such that it blocks an opening of whole
protecting member 34 provided to surround chip 3. Thus, attachment
is established between molded body 19 and whole protecting member
34.
[0055] As shown in FIG. 14, an intermediate body 36 having molded
body 19 and whole protecting member 34 bonded is temporarily fixed
to a stage (not shown). Intermediate body 36 is then cut by a
rotary blade 22 along phantom dicing lines 23 in a grid pattern
extending toward a Y direction (the direction from the front to
backward in the drawing) and an X direction (the direction from
left to right in the drawing), respectively. Thus, intermediate
body 36 is divided into regions 32 to form a plurality of optical
devices 37 (an LED package) shown in FIG. 15.
[0056] Optical device 37 has a substrate 38 which is a division of
whole substrate 33, a chip 3 mounted on the top side of substrate
38, a protecting member 39 provided to surround chip 3, and a lens
member 25 which is a transparent member mounted on the top side of
protecting member 39 to block its opening. In addition, optical
device 37 is electrically connected to another printed board (not
shown) or the like by an external electrode (not shown) provided on
the bottom side of substrate 38.
[0057] As described above, according to the method of manufacturing
the optical device of the present embodiment, whole protecting
member 34 surrounding chip 3 mounted to each region 32 of whole
substrate 33 is integrally molded. Also, integral molded body 19
having transparency is bonded on whole protecting member 34 to form
intermediate body 36. Furthermore, intermediate body 36 is divided
into regions 32 to complete optical device 37. Therefore, as
compared to a conventional manufacturing method of bonding one lens
member to one partially-completed product (see FIGS. 21 to 25), the
above-described manufacturing method considerably improves the
efficiency of manufacturing the optical device. In addition, lens
member 25 constituting optical device 37 is treated integrally as
molded body 19 until intermediate body 36 is cut. Thus, a plurality
of lens members 25 can be integrally held by gripping and adsorbing
a portion (a peripheral portion) not corresponding to lens member
25 of molded body 19. Therefore, errors occurring in handling
molded body 19 and quality deterioration of the optical device
caused by damages to lens member 25 are prevented. Optical device
37 also has a rectangular shape in plan view so that it can be held
by supporting its opposite sides. Therefore, handling of optical
device 37 is facilitated and damage to lens member 25 is
prevented.
Fourth Embodiment
[0058] Referring to FIGS. 16 to 20, a transparent member, an
optical device and a method of manufacturing the optical device
according to a fourth embodiment of the present invention will be
described. In the method of manufacturing the optical device of the
present embodiment, as described using FIG. 11, a plurality of
chips 3 are die-bonded to a plurality of regions 32 of a whole
substrate 33, respectively, and electrodes (not shown) of chips 3
and whole substrate 33 are wire-bonded to each other by a wire 4. A
lower mold 40 and an upper mold 41 facing each other are then
prepared. Note that a cavity 42 is formed in lower mold 40 and, in
cavity 42, a plurality of concave portions corresponding to a
plurality of chips 3, respectively, are formed within the plurality
of regions sectioned by phantom lines in a grid pattern. Whole
substrate 33 is also fixed to upper mold 41 by means of adsorption
and the like, as shown in FIG. 16. In addition, as described using
FIG. 1, a prescribed amount of a granular resin material 43 formed
of thermosetting resin having transparency is supplied to cavity
42.
[0059] As shown in FIG. 17, resin material 43 is heated and melted
to form a fluid resin 44 within a cavity 15, and lower mold 40 and
upper mold 41 are thereafter clamped together. Then, a heater (not
shown) provided in lower mold 40 is used to heat resin material 43.
In place of or in addition to the heater, a contact type heating
plate and/or non-contact type halogen lamp and the like may be also
inserted between lower mold 40 and upper mold 41. As a result of
the above-described process, an intermediate body 46 having a
molded body 45 is formed (see FIG. 18). Molded body 45 is composed
of a cured resin created by curing fluid resin 44. Intermediate
body 46 has whole substrate 33 and molded body 45.
[0060] As shown in FIG. 18, upper mold 41 is then raised to open
the lower mold (not shown) and upper mold 41. Molded body 45
functions as a whole sealing member which integrally seals all of a
plurality of chips 3 on whole substrate 33. In the above-described
process, in short, compression molding is carried out to integrally
mold intermediate body 46. Note that a cured resin may be formed by
transfer molding in place of compression molding to integrally mold
intermediated body 46.
[0061] As shown in FIG. 19, intermediate body 46 is then
temporarily fixed to a stage (not shown). Intermediate body 46 is
then cut by a rotary blade 22 along phantom dicing lines 23 in a
grid pattern extending toward a Y direction (the direction from the
front to backward in the drawing) and an X direction (the direction
from left to right in the drawing), respectively. Thus,
intermediate body 46 is divided into regions 32 to form a plurality
of optical devices 47 shown in FIG. 20.
[0062] By carrying out the above-described process, optical device
47 (an LED package) of the present embodiment shown in FIG. 20 is
completed. This optical device 47 has a substrate 38 divided from
whole substrate 33, a chip (not shown) mounted on the top side of
substrate 38, a transparent member, that is, a lens member 50
having a transparent portion 48 in the form of a convex lens and a
plate-like flange portion 49 and sealing the chip.
[0063] As described above, in the present embodiment, chips 3
mounted to regions 32 in whole substrate 33, respectively, are
integrally sealed to mold intermediate body 46. Intermediate body
46 is then divided into regions 32 to form the plurality of optical
devices 47. Therefore, as compared to the conventional
manufacturing method of bonding one lens member to one
partially-completed product (see FIGS. 21 to 25), the efficiency of
manufacturing the optical device is further improved. As compared
to the manufacturing method of forming the protecting member of the
third embodiment (FIGS. 16 to 20), the production efficiency is
also improved. In addition, intermediate body 46 can be held by
gripping and adsorbing a portion not corresponding to lens member
50 of intermediate body 46 (a peripheral portion in molded body
45). Therefore, errors occurring in handling intermediate body 46
and quality deterioration of the optical device caused by damages
to lens member 50 are prevented. Furthermore, optical device 47 has
a rectangular shape in plan view so that it can be held by
supporting its opposite sides to facilitate handling of optical
device 47 and to prevent damages to lens member 50.
[0064] Note that the present embodiment employs a method in which
intermediate body 46 having whole substrate 33 and molded body 45
is molded integrally. However, instead of using the above-described
method, a member as an alternative to a portion composed of a cured
resin may be integrally pre-molded by a transparent resin, and the
molded member may be used as a whole sealing member. In this case,
the whole sealing member is first integrally pre-molded separately
from whole substrate 33. Specifically, a portion of molded body 45
other than a prescribed space around LED chip 3 and wire 4, in
other words, a portion corresponding to molded body 19 and whole
protecting member 34 shown in FIG. 4, is integrally molded as a
whole sealing member. The whole sealing member is aligned with
whole substrate 33 and bonded to it. Thus, the whole sealing member
functioning as a protecting member and a lens member is integrally
provided on whole substrate 33 to form an intermediate body. The
intermediate body is then divided into regions 32 to form a
plurality of optical devices. As a result, each of the plurality of
optical devices has a structure in which lens member 25 and
protecting member 39 shown in FIG. 15 are integrated and composed
of a transparent resin.
[0065] It is noted that, in each of the first to fourth
embodiments, lens members 25 and 50 have transparent portions 10
and 48 in the form of a convex lens and plate-like flange portions
24 and 49, respectively. However, the present invention is not
limited to the above-described structure, and may be formed such
that lens members 25 and 50 are in their entirety to be a
transparent portion in the form of a convex lens. In this case,
lens members 25 and 50 or optical devices 37 and 47 can be held by
supporting the opposite sides, that is, portions other than the
transparent portion in the form of a convex lens while a dicing
sheet (see dicing sheet 20 in FIG. 4) is expanded after having been
cut. This prevents errors occurring in handling lens members 25 and
50 and optical devices 37 and 47, as well as quality
deterioration.
[0066] Furthermore, wire-bonding is used to electrically connect
electrodes of a chip and a substrate. However, other connecting
methods may be used in place of the above-described structure. For
example, a chip may be flip-chip bonded so that light is emitted
from a light-emitting element or incident on a light-receiving
element via an opening provided at the substrate.
[0067] In addition, in the present embodiment, a rotary blade 22
cuts molded body 19, and intermediate bodies 36 and 46. However,
the present invention is not limited to this, and can employ means
of cutting (trimming) by a laser beam as well as cutting by a wire
saw and the like.
[0068] Lens member 25 of the present embodiment is placed such that
its convex portion is directed toward the outer side of the optical
device. However, lens member 25 of the present invention is not
limited to this and may be placed such that its convex portion is
directed toward the interior of the optical device. In addition,
lens member 25 may have a convex shape protruding from the main
surfaces of both sides of the optical device, and a shape having a
transparent portion in the form of a convex lens and a light
reflecting wall provided therearound. These are also applied to
molded body 19 of the third embodiment and the whole sealing member
described in the fourth embodiment.
[0069] For example, if a lens member is not required as in a
certain type of a light-receiving element and the like, a
plate-like member can be used as a transparent member. Also, after
a plate-like molded body is integrally molded and bonded to a whole
protecting member to form an intermediate body, the intermediate
body may be divided to form a plurality of optical devices (see
FIGS. 13 and 14). Furthermore, a plate-like member may be provided
in place of lens member 50 shown in FIGS. 16 to 20. In these cases,
the plate-like member is equivalent to the transparent member
according to the present invention.
[0070] The present invention may be also applied to any optical
device provided with a light-receiving element or both of a
light-emitting element and a light-receiving element.
[0071] Although the present invention has been described and
illustrated in detail, it is clearly understood that the same is by
way of illustration and example only and is not to be taken by way
of limitation, the spirit and scope of the present invention being
limited only by the terms of the appended claims.
* * * * *