U.S. patent application number 11/483506 was filed with the patent office on 2006-11-09 for semiconductor device.
This patent application is currently assigned to OLYMPUS CORPORATION. Invention is credited to Daisuke Matsuo.
Application Number | 20060249801 11/483506 |
Document ID | / |
Family ID | 34056253 |
Filed Date | 2006-11-09 |
United States Patent
Application |
20060249801 |
Kind Code |
A1 |
Matsuo; Daisuke |
November 9, 2006 |
Semiconductor device
Abstract
A semiconductor device has a first substrate and a second
substrate. The first substrate has first electrodes on at least one
surface. The second substrate has concave portions on a surface,
and second electrodes provided on bottom surfaces of the concave
portions. The semiconductor device further has metallic members
located between the first electrodes of the first substrate and the
second electrodes of the second substrate. The metallic members
have a height greater than a depth of the concave portions of the
second substrate, and electrically and mechanically bond the first
electrodes of the first substrate and the second electrodes of the
second substrate.
Inventors: |
Matsuo; Daisuke;
(Hachioji-shi, JP) |
Correspondence
Address: |
SCULLY SCOTT MURPHY & PRESSER, PC
400 GARDEN CITY PLAZA
SUITE 300
GARDEN CITY
NY
11530
US
|
Assignee: |
OLYMPUS CORPORATION
TOKYO
JP
|
Family ID: |
34056253 |
Appl. No.: |
11/483506 |
Filed: |
July 10, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10921474 |
Aug 19, 2004 |
7098517 |
|
|
11483506 |
Jul 10, 2006 |
|
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Current U.S.
Class: |
257/415 |
Current CPC
Class: |
B81B 7/0006 20130101;
B81C 3/001 20130101; G02B 26/0841 20130101 |
Class at
Publication: |
257/415 |
International
Class: |
H01L 29/84 20060101
H01L029/84 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 21, 2003 |
JP |
2003-297733 |
Claims
1-16. (canceled)
17. A semiconductor device comprising: a first substrate having
first electrodes formed on at least one surface; a second substrate
having concave portions on a surface, the concave portions having
flat bottom surfaces, and second electrodes provided on the bottom
surfaces of the concave portions; and metallic members located
between the first electrodes of the first substrate and the second
electrodes of the second substrate, the metallic members
electrically and mechanically bonding the first electrodes of the
first substrate and the second electrodes of the second substrate,
so that each of the metallic members has a first contact portion
contacting with one of the first electrodes and a second contact
portion contacting with one of the second electrodes, and a minimum
distance between the first and second contact portions being larger
than a minimum distance between the surfaces of the first and
second substrates.
18. The semiconductor device according to claim 17, wherein one of
the first substrate and the second substrate comprises a
semiconductor substrate, and the semiconductor substrate has a
movable portion that mechanically operates, and a third electrode
to exert a driving force that operates the movable portion.
19. The semiconductor device according to claim 18, wherein the
first electrodes are located at different heights from the surface
of the first substrate, and the concave portions have different
depths so that all spaces between the first electrodes and the
second electrodes are equal.
20. The semiconductor device according to claim 18, wherein the
first substrate and the second substrate are made of materials
having different thermal expansion coefficients.
21. The semiconductor device according to claim 18, wherein the
material of the second substrate is a semiconductor, and the
material of the first substrate is an insulating inorganic
material.
22. The semiconductor device according to claim 21, the
semiconductor device being directed to an application to an optical
system, wherein the material of the first substrate is a material
having optical transparency in a wavelength band of light to be
used.
23. The semiconductor device according to claim 18, wherein each of
the metallic members comprises at least two metallic portions in a
direction in which the substrates are spaced.
24. The semiconductor device according to claim 18, wherein the
material of the metallic members is gold, and portions near
surfaces of the first electrodes and the second electrodes are made
of a conductive material that has satisfactory mutual diffusibility
with gold when gold is connected to the first electrodes or the
second electrodes.
25. The semiconductor device according to claim 24, wherein at
least one of the first electrodes and the second electrodes is
gold.
26. The semiconductor device according to claim 17, wherein the
first electrodes are located at different heights from the surface
of the first substrate, and the concave portions have different
depths so that all spaces between the first electrodes and the
second electrodes are equal.
27. The semiconductor device according to claim 17, wherein the
first substrate and the second substrate are made of materials
having different thermal expansion coefficients.
28. The semiconductor device according to claim 17, wherein the
material of the second substrate is a semiconductor, and the
material of the first substrate is an insulating inorganic
material.
29. The semiconductor device according to claim 28, the
semiconductor device being directed to an application to an optical
system, wherein the material of the first substrate is a material
having optical transparency in a wavelength band of light to be
used.
30. The semiconductor device according to claim 17, wherein
comprise the metallic members comprises at least two metallic
portions in a direction in which the substrates are spaced.
31. The semiconductor device according to claim 17, wherein the
material of the metallic members is gold, and portions near
surfaces of the first electrodes and the second electrodes are made
of a conductive material that has satisfactory mutual diffusibility
with gold when gold is connected to the first electrodes or the
second electrodes.
32. The semiconductor device according to claim 31, wherein at
least one of the first electrodes and the second electrodes is
gold.
Description
[0001] CROSS-REFERENCE TO RELATED APPLICATIONS
[0002] This application is based upon and claims the benefit of
priority from prior Japanese Patent Application No. 2003-297733,
filed Aug. 21, 2003, the entire contents of which are incorporated
herein by reference.
BACKGROUND OF THE INVENTION
[0003] 1. Field of the Invention
[0004] The present invention relates to a semiconductor device
constituted by a combination of substrates.
[0005] 2. Description of the Related Art
[0006] U.S. Pat. No. 6,519,075,B2 discloses a technique that
connects an electrostatically driven MEMS mirror array obtained by
processing a semiconductor substrate to connection pads of another
substrate provided with an actuator electrode by use of a solder
ball (solder bump). FIG. 13 shows a semiconductor device
manufactured in such a manner.
[0007] This semiconductor device has a mirror layer 20 and an
actuator layer 23. The mirror layer 20 has surrounding frames 22,
and gimbaled mirrors 21 allowed to incline with respect to the
surrounding frames 22. On the other hand, the actuator layer 23 has
actuator electrodes 24 to actuate the mirrors 21. The mirror layer
20 and the actuator layer 23 both have metallization regions 25,
and the metallization regions 25 of the mirror layer 20 and the
metallization regions 25 of the actuator layer 23 are bonded by the
solder balls 26.
BRIEF SUMMARY OF THE INVENTION
[0008] The present invention is directed to a semiconductor device
comprising a combination of at least two substrates. The
semiconductor device of the present invention has a first substrate
and a second substrate. The first substrate has first electrodes on
at least one surface. The second substrate has concave portions on
a surface, and second electrodes provided on bottom surfaces of the
concave portions. The semiconductor device further has metallic
members located between the first electrodes of the first substrate
and the second electrodes of the second substrate. The metallic
members have a height greater than a depth of the concave portions
of the second substrate, and electrically and mechanically bond the
first electrodes of the first substrate and the second electrodes
of the second substrate.
[0009] Advantages of the invention will be set forth in the
description which follows, and in part will be obvious from the
description, or may be learned by practice of the invention.
Advantages of the invention may be realized and obtained by means
of the instrumentalities and combinations particularly pointed out
hereinafter.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING
[0010] The accompanying drawings, which are incorporated in and
constitute a part of the specification, illustrate embodiments of
the invention, and together with the general description given
above and the detailed description of the embodiments given below,
serve to explain the principles of the invention.
[0011] FIG. 1 is an exploded perspective view of an MEMS deflecting
mirror, which is a semiconductor device in a first embodiment of
the present invention;
[0012] FIG. 2 is a sectional view of the MEMS deflecting mirror
along the line II-II indicated in FIG. 1;
[0013] FIG. 3 shows an alternative embodiment applicable in place
of concave portions shown in FIG. 1 and FIG. 2;
[0014] FIG. 4 shows an application of the semiconductor device in
the first embodiment;
[0015] FIG. 5 is an exploded perspective view of an MEMS deformable
mirror, which is the semiconductor device in a second embodiment of
the present invention;
[0016] FIG. 6 is a sectional view of the MEMS deformable mirror
along the line VI-VI indicated in FIG. 5;
[0017] FIG. 7 shows an application of the semiconductor device in
the second embodiment;
[0018] FIG. 8 is a sectional view of an MEMS high frequency switch,
which is the semiconductor device in a third embodiment of the
present invention, in which a switch is in an off-state;
[0019] FIG. 9 is a sectional view of the MEMS high frequency
switch, which is the semiconductor device in the third embodiment
of the present invention, in which the switch is in an
on-state;
[0020] FIG. 10 is a sectional view of the MEMS deflecting mirror,
which is the semiconductor device in a fourth embodiment of the
present invention;
[0021] FIG. 11 is a sectional view of the MEMS deflecting mirror,
which is the semiconductor device in a fifth embodiment of the
present invention;
[0022] FIG. 12 is a sectional view of the MEMS deformable mirror,
which is the semiconductor device in a sixth embodiment of the
present invention; and
[0023] FIG. 13 shows a semiconductor device manufactured by use of
a technique disclosed in U.S. Pat. No. 6,519,075,B2.
DETAILED DESCRIPTION OF THE INVENTION
[0024] Embodiments of the present invention will hereinafter be
described referring to the drawings.
First Embodiment
[0025] The present embodiment is directed to an MEMS deflecting
mirror. Details of the MEMS deflecting mirror are disclosed in U.S.
Pat. No. 6,519,075,B2 and the like.
[0026] FIG. 1 is an exploded perspective view of the MEMS
deflecting mirror, which is a semiconductor device in a first
embodiment of the present invention. FIG. 2 is a sectional view of
the MEMS deflecting mirror along the line II-II indicated in FIG.
1.
[0027] As shown in FIG. 1 and FIG. 2, a semiconductor device 100
comprises a mirror substrate 110, a wiring substrate 130 located to
face the mirror substrate 110, and metallic members 150 bonding the
mirror substrate 110 and the wiring substrate 130.
[0028] The mirror substrate 110 is a substrate that is manufactured
by subjecting a silicon substrate to micro fabrications such as
etching and coating and forming electrodes and wires thereon in
accordance with an MEMS technique.
[0029] The mirror substrate 110 comprises a frame member 112, a
movable mirror 114, and two hinges 116 connecting the frame member
112 and the movable mirror 114. The hinges 116 are torsionally
deformable, so that the movable mirror 114 is allowed to swing with
respect to the frame member 112 on the hinges 116. Thus, the
movable mirror 114 constitutes a movable portion that mechanically
operates. The movable mirror 114 has a reflective surface on its
upper surface (surface opposite to the wiring substrate 130). The
reflective surface may be, for example, a surface of a highly
reflective film that is separately provided on the upper surface of
the movable mirror 114.
[0030] The wiring substrate 130 has concave portions 132 on a
surface facing the mirror substrate 110. For example, the wiring
substrate 130 is made of silicon, and the concave portions 132 are
formed by wet etching.
[0031] The wiring substrate 130 further has electrodes 134 provided
on bottom surfaces of the concave portions 132, electrode pads 136
provided at an end of an upper surface of the wiring substrate 130
for electric connection to the outside, and wires 138 electrically
connecting the electrodes 134 and the electrode pads 136.
Electrodes 134, an electrode pad 136, and a wire 138 that are
continuous are formed by the same conductive thin film.
[0032] The wiring substrate 130 further has two actuator electrodes
144 provided in a part that faces the movable mirror 114 of the
mirror substrate 110, electrode pads 146 provided at an end of the
upper surface of the wiring substrate 130 for electric connection
to the outside, and wires 148 electrically connecting the actuator
electrodes 144 and the electrode pads 146. An actuator electrode
144, an electrode pad 146, and a wire 148 that are continuous are
formed by the same conductive thin film.
[0033] The two actuator electrodes 144 are spaced apart, and the
space is located directly under the hinges 116 of the mirror
substrate 110 and extends along the hinges 116 of the mirror
substrate 110.
[0034] As shown in FIG. 2 in particular, the mirror substrate 110
further has a conductive thin film 118 on a surface facing the
wiring substrate 130. The conductive thin film 118 expands over a
part covering the frame member 112, the movable mirror 114 and the
hinges 116. A part of the conductive thin film 118 located on the
movable mirror 114 constitutes a mirror electrode to exert a
driving force that swings the movable mirror 114. Parts of the
conductive thin film 118 located on the frame member 112 constitute
electrodes for electric conduction to the electrodes 134 of the
wiring substrate 130. Parts of the conductive thin film 118 located
on the hinges 116 constitute wires that electrically connect the
electrode on the movable mirror 114 and the electrode on the frame
member 112.
[0035] As shown in FIG. 2 in particular, the metallic members 150
have a height greater than a depth of the concave portions 132 of
the wiring substrate 130. The metallic members 150 are bumps made
of, for example, gold, and are provided between the electrodes 134
provided on the bottom surfaces of the concave portions 132 of the
wiring substrate 130, and parts of the conductive thin film 118
located on the frame member 112 of the mirror substrate 110. The
bumps 150 are pressure-welded with heat to electrically and
mechanically bond the electrodes 134 provided on the bottom
surfaces of the concave portions 132 of the wiring substrate 130
and the parts of the conductive thin film 118 located on the frame
member 112 of the mirror substrate 110.
[0036] The semiconductor device 100 is manufactured, for example,
as follows. First, the bumps 150 made of, for example, gold are
formed by use of a bump bonder at predetermined positions in the
parts of the conductive thin film 118 on the frame member 112 of
the mirror substrate 110. Next, the mirror substrate 110 is fixed
on a stage of a flip chip bonder so that the bumps 150 turn upward.
Then, the wiring substrate 130 is stuck to a mounting head and
positioned so that the actuator electrodes 144 of the wiring
substrate 130 properly face the movable mirror 114 of the mirror
substrate 110. In this state, the electrodes 134 provided in the
concave portions 132 of the wiring substrate 130 also properly face
the bumps 150 formed on the mirror substrate 110. Next, hot
pressure welding (heating and pressurization) is performed to
connect the bumps 150 and the electrodes 134 on the bottom surfaces
of the concave portions 132.
[0037] In the semiconductor device 100 thus manufactured, the
conductive thin film 118 provided on the mirror substrate 110 is
electrically connected by the bumps 150 to the electrodes 134
provided on the bottom surfaces of the concave portions 132 of the
wiring substrate 130. The electrodes 134 are electrically connected
to the electrode pads 136 through the wires 138. Thus, the
electrode pads 136 are connected to a ground, so that potentials of
the movable mirror 114 and the conductive thin film 118 will be
0.
[0038] If a voltage is applied to an actuator electrode 144 in this
state, electrostatic attraction is produced between the actuator
electrode 144 and the part of the conductive thin film 118 on the
movable mirror 114, that is, the mirror electrode, and the movable
mirror 114 is inclined (deflected) on the hinges 116.
[0039] The electrostatic attraction rapidly decreases as the
distance between the movable mirror 114 and the actuator electrode
144 increases. Thus, if the distance between the movable mirror 114
and the actuator electrode 144 is large, a significantly high
voltage is needed to provide a predetermined inclination to the
movable mirror 114. A large power supply is needed to obtain the
significantly high voltage. Moreover, the significantly high
voltage might exceed a limit of dielectric breakdown to break the
MEMS.
[0040] Therefore, in a configuration in which concave portions are
not formed as that of U.S. Pat. No. 6,519,075,B2, the height of the
bumps increases the distance between the mirror substrate and the
wiring substrate.
[0041] Contrarily, in the semiconductor device of the present
embodiment, because the concave portions 132 are formed in the
wiring substrate 130, the distance between the mirror substrate 110
and the wiring substrate 130, that is, the distance between the
mirror electrode and the actuator electrodes 144 is reduced owing
to the height of the bumps 150. This makes it possible to reduce a
required drive voltage.
[0042] Furthermore, if the mirror substrate 110 is directly bonded
to the wiring substrate 130, the movable mirror 114 contacts the
wiring substrate 130 when the movable mirror 114 is inclined, and
does not function as the deflecting mirror.
[0043] In the present embodiment, the substrates are connected by
the hot pressure welding of the bumps, and resins such as adhesives
and anisotropic conductive pastes or films are not used, so that
the function of the MEMS is not impaired by outward flowing or
running of the resins.
[0044] In addition, the bumps ensure that the mirror electrode and
the movable mirror 114 are electrically connected to the
ground.
[0045] As has been described so far, in the present embodiment, in
the semiconductor device in which the substrates are affixed
together, the concave portions are formed in the wiring substrate,
so that the proper space can be provided between the substrates and
that the electric connection can be achieved in all the bumps.
[0046] As a result, it is possible to obtain a semiconductor device
such as the MEMS device with a low operating voltage and less fear
of breakage.
[0047] The present embodiment is not limited to the configuration
described above, and various modifications and alterations may be
made.
[0048] The silicon substrate processed as a semiconductor substrate
has been described as an example in the present embodiment, but
various materials that enable the micro fabrication such as
chemical or physical etching and wiring formation can be selected
for the substrate.
[0049] Furthermore, in the case of the gold bump, a stud bump, a
plated bump or the like is applicable. The material of the bump is
not exclusively limited to gold but may be a conductive metal, and
for example, lead-tin solder, AuSn solder or In (indium) solder is
also applicable.
[0050] It is important that the material of the electrodes on the
surfaces of the substrates to be connected by the metallic members
is selected in accordance with the metallic members to be applied.
A gold electrode is most suitable for the gold bump, and aluminum,
nickel, titanium, copper or the like is also applicable. Portions
near surfaces of the electrodes are preferably made of a conductive
material that has satisfactory mutual diffusibility with gold when
gold is connected to the electrodes. A proper selection for the
material of the electrode improves anti-reflow properties and heat
resisting properties of the substrate and enables the substrate to
be subjected to reflow-treatment later. Moreover, if the bump is
solder, a material having satisfactory leakage properties into the
solder is usefully formed on an uppermost surface of the
electrode.
[0051] The substrates are bonded by the hot pressure welding, but
supersonic waves may be added as required in the hot pressure
welding. In this case, effects of compatibility between the
materials to be bonded can be reduced, thus providing such
anticipated benefits as more freedom in the combination of the
material of the electrode and the material of the metallic members,
and a lower heating temperature.
[0052] Furthermore, in the above description, the concave portion
132 is totally surrounded at a portion lower than the upper surface
of the wiring substrate 130 (i.e., the bottom surface) as shown in
FIG. 1 and FIG. 2, but the concave portion 132 is not limited to
this form and may be in a form where the portion lower than the
upper surface of the wiring substrate 130 extends to an edge of the
wiring substrate 130, that is, a step 142, as shown in FIG. 3. When
the concave portion 132 is the step 142, the same advantages as
described above can also be provided.
Application to the First Embodiment
[0053] The present application is directed to arraying of the
semiconductor devices including the MEMS deflecting mirrors
described above. FIG. 4 shows an application of the semiconductor
device in the first embodiment. In FIG. 4, members indicated by the
same reference numerals as those of the members shown in FIG. 1 and
FIG. 2 are the same and will not be described in detail.
[0054] The deflecting mirror can be manufactured as the MEMS in a
semiconductor process, so that a mirror array 110A in which an
array of the movable mirrors 114 is formed is produced and
connected to the concave portions 132 of the wiring substrate 130
by use of the bumps 150, thereby enabling an MEMS deflecting mirror
array to be obtained.
[0055] Such a mirror array is useful in configuring a large-scale
optical switch as in U.S. Pat. No. 6,690,885,B1, for example.
[0056] In the present application, the bumps are formed in the
concave portions, so that even in a large-scale array in which
connection probability of the bumps tends to be lower due to an
inclination error in the substrates caused by the increase in the
size of the substrates, all the bumps can achieve secure connection
and the distance between the substrates can be reduced, thus making
it possible to reduce the operating voltage.
[0057] The arrayed devices need electric circuits such as control
amplifiers to be drive voltage sources of deflectors corresponding
to the number of arrays, and the size and cost of the amplifiers
greatly vary depending on a required voltage, so that the reduction
of the drive voltage is also effective in the reduction of size and
cost of a whole drive circuit device.
[0058] In the present application, the number of bumps 150 is
increased as the scale of the array is enlarged, but the concave
portions are preformed in parts where the bumps are connected to
further ensure that all the bumps achieve connection.
Second Embodiment
[0059] The present embodiment is directed to an MEMS deformable
mirror. The MEMS deformable mirror is a device that can change the
curvature of the mirror thin film portion by use of the
electrostatic attraction between the electrode of the mirror thin
film portion and the actuator electrode, for example, as disclosed
in U.S. Patent Application KOKAI Publication No. 2002/0057506
A1.
[0060] FIG. 5 is an exploded perspective view of the MEMS
deformable mirror, which is the semiconductor device in a second
embodiment of the present invention. FIG. 6 is a sectional view of
the MEMS deformable mirror along the line VI-VI indicated in FIG.
5.
[0061] As shown in FIG. 5 and FIG. 6, a semiconductor device 200
comprises a mirror substrate 210, a wiring substrate 230 located to
face the mirror substrate 210, and the metallic members 150 bonding
the mirror substrate 210 and the wiring substrate 230.
[0062] The mirror substrate 210 comprises a frame member 212 having
an opening, a deformable mirror 214 located in the opening of the
frame member 212, and a conductive thin film 218 connecting the
frame member 212 and the deformable mirror 214. The mirror
substrate 210 is manufactured from a semiconductor substrate such
as a silicon substrate, for example, by an MEMS technique.
[0063] The deformable mirror 214 has a reflective surface on its
upper surface (surface opposite to the wiring substrate 230). The
deformable mirror 214 can easily deform together with a part of the
conductive thin film 218 located in the opening of the frame member
212, so as to change the curvature of its reflective surface. That
is, the deformable mirror 214 constitutes a movable portion that
mechanically operates.
[0064] The wiring substrate 230 has concave portions 232 on a
surface facing the mirror substrate 210. For example, the wiring
substrate 230 is made of silicon, and the concave portions 232 are
formed by wet etching.
[0065] The wiring substrate 230 further has electrodes 234 provided
on bottom surfaces of the concave portions 232, electrode pads 236
provided at an end of an upper surface of the wiring substrate 230
for electric connection to the outside, and wires 238 electrically
connecting the electrodes 234 and the electrode pads 236. Electrode
234, an electrode pad 236, and a wire 238 that are continuous are
formed by the same conductive thin film.
[0066] The wiring substrate 230 further has an actuator electrode
244 provided in a part that faces the deformable mirror 214 of the
mirror substrate 210, an electrode pad 246 provided at an end of
the upper surface of the wiring substrate 230 for electric
connection to the outside, and a wire 248 electrically connecting
the actuator electrode 244 and the electrode pad 246. The actuator
electrode 244, electrode pad 246, and wire 248, which are
continuous, are formed by the same conductive thin film.
[0067] As shown in FIG. 6, the conductive thin film 218 traverses
the opening of the frame member 212, and expands on an entire lower
surface of the frame member 212. A part of the conductive thin film
218 located on the deformable mirror 214 constitutes a mirror
electrode to exert a driving force that swings the deformable
mirror 214. Parts of the conductive thin film 218 located on the
frame member 212 constitute electrodes for electric conduction to
the electrodes 234 of the wiring substrate 230. A part of the
conductive thin film 218 located between the deformable mirror 214
and the frame member 212 supports the deformable mirror 214, and
functions as a wire to electrically connect the electrode on the
deformable mirror 214 to the electrode on the frame member 212.
[0068] As shown in FIG. 6, the metallic members 150 have a height
greater than a depth of the concave portions 232 of the wiring
substrate 230. The metallic members 150 are bumps made of, for
example, gold, and are provided between the electrodes 234 provided
on the bottom surfaces of the concave portions 232 of the wiring
substrate 230 and the parts of the conductive thin film 218 located
on the frame member 212 of the mirror substrate 210. The bumps 150
are pressure-welded with heat to electrically and mechanically bond
the electrodes 234 provided on the bottom surfaces of the concave
portions 232 of the wiring substrate 230 and the parts of the
conductive thin film 218 located on the frame member 212 of the
mirror substrate 210.
[0069] In the semiconductor device 200 thus manufactured, the
conductive thin film 218 provided on the mirror substrate 210 is
electrically connected by the bumps 150 to the electrodes 234
provided on the bottom surfaces of the concave portions 232 of the
wiring substrate 230. The electrodes 234 are electrically connected
to the electrode pads 236 through the wires 238. Thus, the
electrode pads 236 are connected to the ground, so that potentials
of the deformable mirror 214 and the conductive thin film 218 will
be 0.
[0070] If a voltage is applied to the actuator electrode 244 in
this state, the electrostatic attraction is produced between the
actuator electrode 244 and the part of the conductive thin film 218
on the deformable mirror 214, that is, the mirror electrode, and
the deformable mirror 214 deforms into a concave shape to change
the curvature of the reflective surface.
[0071] As has already been described in the first embodiment, the
electrostatic attraction rapidly decreases as the distance between
the deformable mirror 214 and the actuator electrode 244 increases.
Thus, if the distance between the deformable mirror 214 and the
actuator electrode 244 is large, a significantly high voltage is
needed to deform the deformable mirror 214 into a predetermined
shape. A large power supply is needed to obtain the significantly
high voltage. Moreover, the significantly high voltage might exceed
a limit of dielectric breakdown to break the MEMS.
[0072] Especially, as the deformable mirror does not have a less
elastic part such as the hinges in the deflecting mirror, its drive
voltage tends to be high.
[0073] In the semiconductor device of the present embodiment,
because the concave portions 232 are formed in the wiring substrate
230, the distance between the mirror substrate 210 and the wiring
substrate 230, that is, the distance between the mirror electrode
and the actuator electrode 244 can be smaller than the height of
the bumps 150. This makes it possible to reduce a required drive
voltage.
[0074] On the other hand, in order to deform the deformable mirror
214 into the predetermined shape, it is necessary to secure a
distance corresponding to the predetermined shape between the
deformable mirror 214 and the actuator electrode 244. Especially in
an electrostatically driven deformable mirror, an amount of
deformation of the deformable mirror is generally reduced to one
third of an initial space between the deformable mirror and the
actuator electrode to avoid a pull-in phenomenon wherein the
deformable mirror totally contacts the actuator electrode. Thus,
the deformable mirror 214 and the actuator electrode 244 need to be
separated three times as much as the deformation amount of the
deformable mirror 214.
[0075] After all, the distance between the deformable mirror 214
and the actuator electrode 244 is desirably adjusted to a proper
value in accordance with a design in view of the amount of the
drive voltage and the deformation amount of the deformable mirror
214. Moreover, an optimum value of the distance between the
deformable mirror 214 and the actuator electrode 244 is usually
smaller than the height of the bumps.
[0076] In the semiconductor device of the present embodiment, the
initial distance between the deformable mirror 214 and the actuator
electrode 244 can be brought to the optimum value by the metallic
members 150 such as the gold bumps and the concave portions 232
formed in the wiring substrate 230 and also by controlling
pressurization applied when the mirror substrate 210 and the wiring
substrate 230 are bonded.
[0077] In the present embodiment, the substrates are connected by
the hot pressure welding of the bumps, and resins such as adhesives
and anisotropic conductive pastes or films are not used, so that
the function of the MEMS is not impaired by outward flowing or
running of the resins.
[0078] As has been described so far, in the present embodiment, in
the semiconductor device in which the substrates are affixed
together, the concave portions are formed in the wiring substrate,
so that the proper space can be provided between the substrates and
the electric connection can be achieved in all the bumps.
[0079] As a result, it is possible to obtain a semiconductor device
such as the MEMS device with a low operating voltage and less fear
of breakage.
[0080] The present embodiment is not limited to the configuration
described above, and various modifications and alterations may be
made.
[0081] The various modifications described in the first embodiment
can be applied to the materials of the substrate, the bump and the
electrode. As also described in the first embodiment, the
supersonic waves may be added as required in the hot pressure
welding of the substrates. Moreover, the modifications described in
the first embodiment can be applied to the form of the concave
portion 232. Thus, the concave portion 232 may be in a form (the
step 142) where the portion lower than the upper surface of the
wiring substrate extends to the edge of the wiring substrate as
shown in FIG. 3.
Application of the Second Embodiment
[0082] This application is directed to the arraying of the
semiconductor devices including the MEMS deformable mirrors
described above. FIG. 7 shows an application of the semiconductor
device in the second embodiment. In FIG. 7, members indicated by
the same reference numerals as those of the members shown in FIG. 5
and FIG. 6 are the same and will not be described in detail.
[0083] The deformable mirror can be manufactured as the MEMS in the
semiconductor process, so that a mirror array 210A in which an
array of the deformable mirrors 214 is formed is produced and
connected to the concave portions 232 of the wiring substrate 230
by use of the bumps 150, thereby enabling an MEMS deformable mirror
array to be obtained. Such a device is particularly useful in an
image display device or the like.
[0084] In the present application, the bumps are formed in the
concave portions, so that even in a large-scale array in which
connection probability of the bumps tends to be lower due to an
inclination error in the substrates caused by the increase in the
size of the substrates, all the bumps can achieve secure connection
and the distance between the substrates can be reduced, thus making
it possible to reduce the operating voltage.
[0085] The arrayed devices need electric circuits such as the
control amplifiers to be drive voltage sources of the deflectors
corresponding to the number of arrays are needed, the size and cost
of the amplifiers greatly vary depending on a required voltage, so
that the reduction of the drive voltage is also effective in the
reduction of size and cost of the whole drive circuit device.
[0086] In the present application, the number of bumps 150 is
increased as the scale of the array is enlarged, but the concave
portions are preformed in parts where the bumps are connected to
further ensure that all the bumps achieve connection.
Third Embodiment
[0087] The present embodiment is directed to an MEMS high frequency
switch. The MEMS high frequency switch is disclosed in U.S. Pat.
No. 6,307,452,B1 and the like. Operation of the MEMS high frequency
switch of the present embodiment is basically similar to that of a
device disclosed in U.S. Pat. No. 6,307,452,B1.
[0088] FIG. 8 and FIG. 9 are sectional views of the MEMS high
frequency switch, which is the semiconductor device in a third
embodiment of the present invention, and FIG. 8 shows the switch in
an off-state and FIG. 9 shows the switch in an on-state.
[0089] As shown in FIG. 8 and FIG. 9, a semiconductor device 300
comprises a switch substrate 310, a wiring substrate 330 located to
face the switch substrate 310, and the metallic members 150 bonding
the switch substrate 310 and the wiring substrate 330.
[0090] The switch substrate 310 comprises a frame member 312 having
an opening, and an MEMS cantilever 314 extending from the frame
member 312 into the opening. The MEMS cantilever 314 comprises an
aluminum thin film 322, an insulating support thin film 324, and an
aluminum thin film 326, which are laminated in order on a bottom
surface of the frame member 312. The switch substrate 310 is
manufactured from a semiconductor substrate such as a silicon
substrate, for example, by the MEMS technique.
[0091] The MEMS cantilever 314 is elastically deformable, so as to
displace its free end up and down. Thus, the MEMS cantilever 314
constitutes a movable portion that mechanically operates. Moreover,
a part of the aluminum thin film 322 located on the MEMS cantilever
314 constitutes an electrode to exert a driving force that operates
the MEMS cantilever 314.
[0092] The aluminum thin film 322 extends to an end of the frame
member 312, while the support thin film 324 and the aluminum thin
film 326 terminate at the midpoint of the frame member 312.
Therefore, the aluminum thin film 322 is exposed at the end of the
frame member 312.
[0093] The wiring substrate 330 has a concave portion 332, a
concave portion 334, and a concave portion 336 on a surface facing
the switch substrate 310. For example, the wiring substrate 330 is
made of silicon, and the concave portion 332, the concave portion
334, and the concave portion 336 are formed by wet etching.
[0094] The wiring substrate 330 further has a conductive thin film
342 extending between a bottom surface of the concave portion 332
and an upper surface of the wiring substrate 330, a conductive thin
film 344 extending between a bottom surface of the concave portion
334 and the upper surface of the wiring substrate 330, and a
conductive thin film 346 extending between a bottom surface of the
concave portion 336 and the upper surface of the wiring substrate
330.
[0095] A part of the conductive thin film 342 located on the bottom
surface of the concave portion 332 constitutes an electrode for
conduction to the aluminum thin film 326. Similarly, a part of the
conductive thin film 344 located on the bottom surface of the
concave portion 334 constitutes an electrode for conduction to the
aluminum thin film 326. Moreover, a part of the conductive thin
film 346 located on the bottom surface of the concave portion 336
constitutes an electrode for conduction to the aluminum thin film
322.
[0096] Accordingly, on the side of the switch substrate 310, a part
of the aluminum thin film 322 exposed at the end of the frame
member 312 constitutes an electrode for conduction to the
conductive thin film 346. Further, a part of the aluminum thin film
326 located on the frame member 312 constitutes an electrode for
conduction between the conductive thin film 342 and the conductive
thin film 344.
[0097] The concave portion 332 and the concave portion 334 has the
same depth, and the concave portion 336 is shallower than the
concave portion 332 and the concave portion 334 by a level
difference produced by the aluminum thin film 322 and the aluminum
thin film 326, that is, by the thickness of the support thin film
324 and the aluminum thin film 326. Therefore, a space between the
part of the conductive thin film 342 located on the bottom surface
of the concave portion 332 and the aluminum thin film 326, a space
between the part of the conductive thin film 344 located on the
bottom surface of the concave portion 334 and the aluminum thin
film 326, and a space between the part of the conductive thin film
346 located on the bottom surface of the concave portion 336 and
the aluminum thin film 322 are all equal.
[0098] In FIG. 8 and FIG. 9, the concave portion 334 and the
concave portion 336 are continued from each other. Thus, the
concave portion 334 and the concave portion 336 constitute one
large concave portion having two bottom parts of different depths
in a sense. However, in the present specification, the concave
portion having the bottom parts of different depths is regarded as
plural concave portions to focus attention on the difference of
depth in the bottom parts.
[0099] Naturally, the concave portion 334 and the concave portion
336 do not need to be continuous and may be separated from each
other. In other words, the concave portion 334 and the concave
portion 336 may be independent concave portions.
[0100] The wiring substrate 330 further has an actuator electrode
352, a protection film 354 covering the actuator electrode 352, and
a contact electrode 356. The actuator electrode 352 and the contact
electrode 356 are both provided at locations facing the MEMS
cantilever 314 of the switch substrate 310.
[0101] The metallic members 150 are provided between the part of
the conductive thin film 342 located on the bottom surface of the
concave portion 332 and the aluminum thin film 326, between the
part of the conductive thin film 344 located on the bottom surface
of the concave portion 334 and the aluminum thin film 326, and
between the part of the conductive thin film 346 located on the
bottom surface of the concave portion 336 and the aluminum thin
film 322. These metallic members 150 have an equal height, and a
height greater than the depth of the concave portion 332 and the
concave portion 334 of the wiring substrate 330.
[0102] The metallic members 150 are bumps made of, for example,
gold, and are pressure-welded with heat to mechanically bond the
switch substrate 310 and the wiring substrate 330 and electrically
bond the electrodes of the switch substrate 310 and the wiring
substrate 330.
[0103] The semiconductor device 300 is manufactured, for example,
as follows.
[0104] For example, starting with an SOI substrate, processes such
as resist patterning, etching and thin film formation are performed
to configure a micro MEMS structure, thereby manufacturing the
switch substrate 310.
[0105] On the other hand, the concave portion 332, the concave
portion 334, and the concave portion 336 that have proper depths
are formed in the wiring substrate 330 in view of the level
difference produced by the aluminum thin film 322 and the aluminum
thin film 326 on the switch substrate 310.
[0106] Next, on the wiring substrate 330, the actuator electrode
352, the contact electrode 356, the conductive thin film 342, the
conductive thin film 344 and the conductive thin film 346 are
formed, and the protection film 354 is formed if necessary.
[0107] Subsequently, the bumps 150 made of, for example, gold are
formed on the electrodes provided on the bottom surfaces of the
concave portion 332, the concave portion 334, and the concave
portion 336.
[0108] Finally, the switch substrate 310 is pressure-welded with
heat to the wiring substrate 330 to complete the MEMS high
frequency switch.
[0109] In the semiconductor device 300, the aluminum thin film 322
provided on the switch substrate 310 is electrically connected by
the bump 150 to the part of the conductive thin film 346 provided
on the bottom surface of the concave portion 336 of the wiring
substrate 330. The conductive thin film 346 is connected to the
ground. Thereby, the aluminum thin film 322 of the switch substrate
310 is satisfactorily maintained at a ground potential. Moreover, a
signal is supplied to the conductive thin film 344 (or the
conductive thin film 342).
[0110] If a voltage is applied to the actuator electrode 352 in
this state, the electrostatic attraction is produced between the
actuator electrode 352 and a part of the aluminum thin film 322
facing the actuator electrode 352. As a result, the aluminum thin
film 322, that is, the MEMS cantilever 314 is drawn to the actuator
electrode 352, and the aluminum thin film 326 contacts the contact
electrode 356. Consequently, the contact electrode 356 and the
conductive thin film 344 (or the conductive thin film 342) are
electrically connected.
[0111] Furthermore, if the application of the voltage to the
actuator electrode 352 is stopped, the electrostatic attraction
between the actuator electrode 352 and the aluminum thin film 322
disappears, so that the MEMS cantilever 314 returns to an original
shape, with the result that the contact electrode 356 and the
conductive thin film 344 (or the conductive thin film 342) are
electrically disconnected.
[0112] Thus, the voltage application to the actuator electrode 352
can be performed or stopped to allow or stop a signal flow between
the contact electrode 356 and the conductive thin film 344 (or the
conductive thin film 342).
[0113] In the present embodiment, the concave portions are provided
in the parts of the wiring substrate 330 where the bumps 150 are
provided, so that a space between the switch substrate 310 and the
wiring substrate 330 can be reduced. This allows the distance
between the aluminum thin film 322 and the actuator electrode 352
to be reduced, and the voltage applied to the actuator electrode
352 can thus be reduced. Moreover, a drive distance of the support
thin film 324 is decreased to enhance an operating speed.
[0114] In the present embodiment, as the difference of distance
between the bonded surfaces of the substrates in the connected
parts is corrected in view of the thickness of the aluminum thin
film 322, the support thin film 324 and the aluminum thin film 326,
the depth of the concave portions (step) is changed
correspondingly. That is, the depth of the concave portions (step)
is properly changed depending on the place so that all the spaces
between the connected parts are uniform.
[0115] As measures for differences in shape of the members that
decrease the connection probability of the bump, including
difference in initial height of the bumps and difference in
distance between the connected parts depending on the place, the
concave portions are provided to reduce the effect of the
difference in the height of the bumps, and the depth of the concave
portion is changed depending on the place to solve the difference
in distance between the connected parts.
[0116] As a result, the electric connection can be ensured in all
the connected parts.
[0117] The present embodiment is not limited to the configuration
described above, and various modifications and alterations may be
made.
[0118] The various modifications described in the first embodiment
can be applied to the materials of the substrate, the bump and the
electrode. As also described in the first embodiment, the
supersonic waves may be added as required in the hot pressure
welding of the substrates. Moreover, the modifications described in
the first embodiment can also be applied to the form of the concave
portion. Thus, the concave portion may be in the form (the step
142) where the portion lower than the upper surface of the wiring
substrate extends to the edge of the wiring substrate as shown in
FIG. 3.
[0119] A manufacturing process has been shown as an example in the
present embodiment wherein the bumps 150 are provided on the side
of the wiring substrate 330, but the semiconductor device may be
manufactured in a manufacturing process in which the bumps 150 are
provided on the side of the switch substrate 310, and the
semiconductor device thus manufactured has the same function and
advantage as in the present embodiment.
[0120] Furthermore, it is preferable to utilize silicon oxide based
on SOI or the like for the support thin film, but various materials
can be used, such as silicon nitride and a polyimide resist.
[0121] Two kinds of depths of the concave portions have been shown
as an example in the present embodiment, but it is needless to
mention that more depth levels can be provided depending on the
shape of the surface of the frame member.
[0122] Still further, a representative example of the
electrostatically driven MEMS high frequency switch has been shown
in the present embodiment, but the present embodiment is applicable
to those that can be manufactured by proximately disposing at least
two substrates, including other electrostatically driven switches,
electromagnetically driven switches, piezoelectrically driven
switches and the like.
Fourth Embodiment
[0123] The present embodiment is directed to the MEMS deflecting
mirror similarly to the first embodiment. FIG. 10 is a sectional
view of the MEMS deflecting mirror, which is the semiconductor
device in a fourth embodiment of the present invention. In FIG. 10,
members indicated by the same reference numerals as those of the
members shown in FIG. 1 and FIG. 2 are the same and will not be
described in detail.
[0124] A semiconductor device 400 of the present embodiment is
analogous to the semiconductor device 100 in the first embodiment,
and is only different therefrom in that each of the metallic
members 150 to bond the mirror substrate 110 and the wiring
substrate 130 comprises two bumps, that is, a bump 152 and a bump
154 as shown in FIG. 10.
[0125] In the present embodiment, the semiconductor device 400 is
manufactured as follows. First, the gold bumps 152 are formed on
the parts of the conductive thin film 118 located on the frame
member 112 of the mirror substrate 110, and the gold bumps 154 are
also formed on the electrodes 134 provided in the concave portions
132 of the wiring substrate 130. Concretely, the gold bumps are
preferably formed by use of the bump bonder, which is equipment to
form bumps from a gold wire. Then, the mirror substrate 110 and the
wiring substrate 130 are positioned so that the gold bumps 152 face
the gold bumps 154, and are pressure-welded with heat. Thus the
semiconductor device 400 is obtained.
[0126] In the present embodiment, the gold bumps are respectively
preformed on the conductive thin film 118 of the mirror substrate
110 and the electrodes 134 of the wiring substrate 130. In this
case, aluminum may be used for the conductive thin film 118 and the
electrodes 134 on the bottom surfaces of the concave portions 132.
It has already been commonly known that gold should not preferably
be used in the semiconductor process, that is, a MEMS process. The
use of aluminum is preferable in this respect.
[0127] The substrates are bonded substantially by bonding of the
gold bumps, and the gold bumps satisfactorily diffuse heat to each
other in the hot pressure welding, so that the mirror substrate 110
and the wiring substrate 130 are more firmly bonded.
[0128] In the present embodiment, as each of the metallic members
150 comprise the two bumps, the height is increased, but each of
the concave portions 132 may be made deeper to reduce the distance
between the substrates.
[0129] In the present embodiment, the concave portions are
preformed in the wiring substrate, so that securer connection can
be accomplished by the bumps than has heretofore been possible, and
the mirror substrate 110 and the wiring substrate 130 can be
located with a space smaller than the height of the bumps. Further,
as the mirror substrate 110 and the wiring substrate 130 can be
bonded by the hot pressure welding with the gold bumps without
forming gold thin films on the mirror substrate 110 and the wiring
substrate 130, thus providing an advantage that gold is not needed
in the manufacturing and working processes of the semiconductor
substrate itself.
[0130] The present embodiment is not limited to the configuration
described above, and various modifications and alterations may be
made.
[0131] The various modifications described in the first embodiment
can be applied to the materials of the substrate, the bump and the
electrode. As also described in the first embodiment, the
supersonic waves may be added as required in the hot pressure
welding of the substrates. Moreover, the modifications described in
the first embodiment can also be applied to the form of the concave
portion. Thus, the concave portion may be in the form (the step
142) where the portion lower than the upper surface of the wiring
substrate extends to the edge of the wiring substrate as shown in
FIG. 3.
[0132] The material of the bumps used in combination for each
substrate is not limited to the same material. Various combinations
of materials are applicable if the materials allow the bumps to be
bonded together. For example, a combination of a gold stud bump and
a solder bump manufactured from a solder paste is possible, and
they can be bonded with head.
[0133] Furthermore, each of the bumps may be not only a two-stage
configuration combining two bumps, but also a configuration with
three or more stages combining three or more bumps. In addition,
three or more kinds of bumps may be provided. In this case,
connectivity is not specifically demanded in the bumps that are
separate from each other as long as the bumps that contact each
other have satisfactory connection, thus enabling various materials
to be selected.
Fifth Embodiment
[0134] The present embodiment is directed to the MEMS deflecting
mirror similarly to the first embodiment. FIG. 11 is a sectional
view of the MEMS deflecting mirror, which is the semiconductor
device in a fifth embodiment of the present invention. In FIG. 11,
members indicated by the same reference numerals as those of the
members shown in FIG. 5 and FIG. 6 are the same.
[0135] As shown in FIG. 11, a semiconductor device 500 comprises a
mirror substrate 510, a wiring substrate 530 located to face the
mirror substrate 510, and the metallic members 150 bonding the
mirror substrate 510 and the wiring substrate 530.
[0136] The mirror substrate 510 comprises a frame member 512 having
an opening, concave portions 522 formed in a surface of the frame
member 512 facing the wiring substrate 530, a movable mirror 114
located in the opening of the frame member 512, the hinges 116
connecting the frame member 512 and the movable mirror 114, and a
conductive thin film 518 provided on a surface facing the wiring
substrate 530.
[0137] The mirror substrate 510 is manufactured from a
semiconductor material such as silicon in the semiconductor
process. The concave portions 522 are formed by wet etching, for
example. The conductive thin film 518 is located partially on
bottom surfaces of the concave portions 522 formed in the frame
member 512.
[0138] The wiring substrate 530 has the actuator electrode 144
provided in a part that faces the movable mirror 114 of the mirror
substrate 510, and a conductive thin film 542 provided on a surface
facing the mirror substrate 510. The wiring substrate 530 is made
of, but not specifically limited to, an insulating inorganic
material, for example.
[0139] In the mirror substrate 510, a part of the conductive thin
film 518 located on the movable mirror 114 constitutes a mirror
electrode to exert a driving force that swings the movable mirror
114. Parts of the conductive thin film 518 located on the bottom
surfaces of the concave portions 522 of the frame member 512
constitute electrodes for electric conduction to the conductive
thin film 542 of the wiring substrate 530. The other part of the
conductive thin film 518 functions as a wire to electrically
connect the mirror electrode on the movable mirror 114 and the
electrodes on the bottom surfaces of the concave portions 522.
[0140] On the other hand, in the wiring substrate 530, parts of the
conductive thin film 542 facing the frame member 512 constitute
electrodes for electric conduction to the parts of the conductive
thin film 518 located on the bottom surfaces of the concave
portions 522 of the frame member 512.
[0141] The metallic members 150 have a height greater than the
depth of concave portions 522 of the mirror substrate 510. The
metallic members 150 are bumps made of, for example, gold, and are
provided between parts of the conductive thin film 518 provided on
the bottom surfaces of the concave portions 522 of the mirror
substrate 510 and the parts of the conductive thin film 542
provided on an upper surface of the wiring substrate 530. The bumps
150 are pressure-welded with heat to electrically and mechanically
bond the conductive thin film 518 on the mirror substrate 510 and
the conductive thin film 542 on the wiring substrate 530.
[0142] Operation of the semiconductor device 500 is totally the
same as that of the semiconductor device 100 in the first
embodiment and will not be described here.
[0143] In the present embodiment, the wiring substrate 530 simply
has the actuator electrode 144 and the conductive thin film 542 on
the flat upper surface. This means that the processes such as the
formation of the concave portions are not needed in the wiring
substrate 530. Thus, the wiring substrate 530 does not particularly
need to be a semiconductor substrate, and for example, a pyrex
glass may suitably be applied in terms of cost. On the other hand,
the mirror substrate 510 is made from a silicon substrate as
described above.
[0144] The mirror substrate 510 and the wiring substrate 530 are
thus made of the different materials, and therefore have different
thermal expansion coefficients. As a consequence, the bumps are
subjected to a shear stress due to a change in outside temperature.
However, since the bumps have the height greater than the gap
between substrates, the stress is reduced by shear flexure of the
bumps. As a result, a highly durable semiconductor device can be
obtained.
[0145] As described above, the present embodiment can ensure high
durability even in a configuration in which the substrates made of
different materials are bonded. Moreover, the use of different
materials can additionally bring specific effects such as lower
costs.
[0146] The present embodiment is not limited to the configuration
described above, and various modifications and alterations may be
made.
[0147] The various modifications described in the first embodiment
can be applied to the materials of the substrate, the bump and the
electrode. As also described in the first embodiment, the
supersonic waves may be added as required in the hot pressure
welding of the substrates. Moreover, the modifications described in
the first embodiment can also be applied to the form of the concave
portion. Thus, the concave portion may be in the form (the step
142) where the portion lower than the upper surface of the wiring
substrate extends to the edge of the wiring substrate as shown in
FIG. 3.
[0148] Furthermore, the use of the pyrex glass for the wiring
substrate 530 has been shown as an example to reduce costs in the
present embodiment, but the material of the wiring substrate 530 is
not limited thereto and can be more freely selected, so that
various glasses, ceramics or crystalline materials such as alumina,
various semiconductors such as GaAs, metallic substrates and the
like are applicable.
[0149] For example, the material such as GaAs can be used for
application to a particular electronic device substrate to provide
a durable semiconductor device with higher functions.
[0150] A glass epoxy resin substrate, for example, can be applied,
but is not entirely preferable because of extremely poor stability
in shape caused by temperature and unsecured accuracy of the gap
between the substrates.
Sixth Embodiment
[0151] The present embodiment is directed to the MEMS deformable
mirror similarly to the second embodiment. FIG. 12 is a sectional
view of the MEMS deformable mirror, which is the semiconductor
device in a sixth embodiment of the present invention. In FIG. 12,
members indicated by the same reference numerals as those of the
members shown in FIG. 5 and FIG. 6 are the same.
[0152] As shown in FIG. 12, a semiconductor device 600 comprises a
mirror substrate 610, a translucent wiring substrate 630 located to
face the mirror substrate 610, and the metallic members 150 bonding
the mirror substrate 610 and the translucent wiring substrate
630.
[0153] The mirror substrate 610 comprises a frame member 612 having
an opening, concave portions 622 formed in a surface of the frame
member 612 facing the translucent wiring substrate 630, a
deformable mirror 214 located in the opening of the frame member
612, and a conductive thin film 618 connecting the frame member 612
and the deformable mirror 214.
[0154] The mirror substrate 610 is manufactured from a
semiconductor material such as silicon in the semiconductor
process. The concave portions 622 are formed by wet etching, for
example. The conductive thin film 618 is located partially on
bottom surfaces of the concave portions 622 formed in the frame
member 612.
[0155] The translucent wiring substrate 630 has a translucent
actuator electrode 644 provided in a part that faces the deformable
mirror 214 of the mirror substrate 610, and a conductive thin film
642 provided on a surface facing the mirror substrate 610.
[0156] The translucent wiring substrate 630 comprises an insulating
inorganic material, and is made of, but not specifically limited
to, glass, for example. The glass is preferably an optical glass
such as BK-7 (manufactured by HOYA-SCHOTT Corporation), a pyrex
glass, or the like. Quartz, crystal or the like may be applied
depending on a wavelength band of light to be used.
[0157] Furthermore, a conductive thin film of, for example, ITO,
which is not a specific limitation, is preferably applied to the
translucent actuator electrode 644.
[0158] In the mirror substrate 610, a part of the conductive thin
film 618 located on the deformable mirror 214 constitutes a mirror
electrode to exert a driving force that deforms the deformable
mirror 214. Parts of the conductive thin film 618 located on the
bottom surfaces of the concave portions 622 of the frame member 612
constitute electrodes for electric conduction to the conductive
thin film 642 of the translucent wiring substrate 630. The other
part of the conductive thin film 618 functions as a wire to
electrically connect the mirror electrode on the deformable mirror
214 and the electrodes on the bottom surfaces of the concave
portions 622.
[0159] On the other hand, in the translucent wiring substrate 630,
parts of the conductive thin film 642 facing the frame member 612
constitute electrodes for electric conduction to the parts of the
conductive thin film 618 located on the bottom surfaces of the
concave portions 622 of the frame member 612.
[0160] The metallic members 150 have a height greater than the
depth of concave portions 622 of the mirror substrate 610. The
metallic members 150 are bumps made of, for example, gold, and are
provided between parts of the conductive thin film 642 provided on
the bottom surfaces of the concave portions 622 of the mirror
substrate 610, and the part of the conductive thin film 642
provided on an upper surface of the translucent wiring substrate
630. The bumps 150 are pressure-welded with heat to electrically
and mechanically bond the conductive thin film 618 on the mirror
substrate 610 and the conductive thin film 642 on the translucent
wiring substrate 630.
[0161] In the present embodiment, the mirror substrate 610 and the
translucent wiring substrate 630 are made of different materials,
and therefore have different thermal expansion coefficients. As a
consequence, the bumps are subjected to a shear stress due to a
change in outside temperature. However, since the bumps have the
height greater than the gap between substrates, the stress is
reduced by the shear flexure of the bumps. As a result, a highly
durable semiconductor device can be obtained.
[0162] Operation of the semiconductor device 600 is the same as
that of the semiconductor device 200 in the second embodiment, and
by applying a voltage across the deformable mirror 214 and the
translucent actuator electrode 644, the electrostatic attraction
can be produced to change the curvature of the deformable mirror
214.
[0163] Furthermore, because the translucent wiring substrate 630
and the translucent actuator electrode 644 are optically
transparent to visible light in the wavelength band of the light to
be used, the light can strike on the deformable mirror 214 via the
translucent wiring substrate 630 and the translucent actuator
electrode 644. In that case, a lower surface of the part of the
conductive thin film 618 located on the deformable mirror 214
functions as a reflective surface.
[0164] An ordinary electrostatically driven deformable mirror can
only deform the reflective surface into a concave surface toward an
incident light as disclosed in Jpn. Pat. Appln. KOKAI Publication
No. 2-101402.
[0165] On the contrary, the MEMS deformable mirror 600 of the
present embodiment can also cause the light to enter through the
wiring substrate 630, and therefore, can also deform the reflective
surface into a convex surface toward the incident light. Thereby, a
diverging beam of out-going light can be produced from a parallel
beam of incident light.
[0166] Naturally, the MEMS deformable mirror 600 of the present
embodiment can also deform the reflective surface into a concave
surface toward the incident light by causing the light to enter
from the opposite side of the wiring substrate 630 in the same
manner as the ordinary deformable mirrors.
[0167] Furthermore, the translucent wiring substrate 630 can
usually be applied as a substitute for a lid called a glass lid or
a glass window in an airtight package to directly seal
semiconductor elements such as a CPU into a ceramic cavity package,
which packages the semiconductor elements, so that it is not
necessary to use a window member separately, thus enabling the
simplification of the configuration.
[0168] Still further, for example, crystal can be applied to the
translucent-wiring substrate 630 to utilize as a wavelength plate,
and a filtering function including an optical thin film can be
provided in a surface of the translucent wiring substrate 630.
[0169] It is again unnecessary to separately prepare an optical
substrate for the optical thin film, and more complex optical
functions can be performed with a simple configuration.
[0170] As described above, in the present embodiment, high
connectivity can be obtained between the substrates, and
particularly, the use of the translucent wiring substrate makes it
possible to obtain optical characteristics that can not usually be
obtained and to obtain complex optical performance with the simple
configuration.
[0171] As described above, even when the substrates made of
different materials are laminated, the present invention can ensure
high durability, and, for example, optical properties opposite to
ordinary optical properties and particular effects such as lower
costs can additionally be obtained by using the translucent
material.
[0172] The present embodiment is not limited to the configuration
described above, and various modifications and alterations may be
made.
[0173] Since there are materials indicating various translucencies
to light of various wavelengths, various materials can be applied
to the translucent wiring substrate 630. More specifically, an
optical crystal such as optical glass, quartz, crystal, LN, LT or
sapphire can be applied to the material of the translucent wiring
substrate 630 depending on the wavelength.
[0174] Furthermore, other optical functions can also be added, and
a photonic crystal or a light guide substrate can be applied to the
translucent wiring substrate to add further optical functions.
[0175] Moreover, the material of the drive wire is not limited to
ITO, and a conductive organic thin film, a silicon thin film or the
like can be properly selected depending on the wavelength of the
light desired to be used, and such a modification of the shape of
the electrode is also effective that the electrode is positioned on
a periphery of an optical effective region to avoid a decrease in
optical performance.
[0176] While the embodiments of the present invention have so far
been described with reference to the drawings, the present
invention is not limited to these embodiments, and various
modifications and alterations may be made without departing from
its spirit.
[0177] In other words, the above-described embodiments may be
properly combined, partially omitted or have various other elements
added thereto without changing the spirit and concept of the
invention.
[0178] For example, not only the two substrates but also more
substrates may be bonded to constitute the semiconductor device.
The number and location of metallic members used for bonding are
properly set as required.
[0179] Additional advantages and modifications will readily occur
to those skilled in the art. Therefore, the invention in its
broader aspects is not limited to the specific details and
representative embodiments shown and described herein. Accordingly,
various modifications may be made without departing from the spirit
or scope of the general invention concept as defined by the
appended claims and their equivalents.
* * * * *