U.S. patent application number 11/268079 was filed with the patent office on 2006-11-02 for heat dissipation device for heat-generating electronic component.
This patent application is currently assigned to Foxconn Technology Co., Ltd. Invention is credited to Hsieh-Kun Lee, Tao Li, Wan-Lin Xia, Min-Qi Xiao.
Application Number | 20060245162 11/268079 |
Document ID | / |
Family ID | 37195483 |
Filed Date | 2006-11-02 |
United States Patent
Application |
20060245162 |
Kind Code |
A1 |
Lee; Hsieh-Kun ; et
al. |
November 2, 2006 |
Heat dissipation device for heat-generating electronic
component
Abstract
A heat dissipation device includes a first heat sink (10), a
second heat sink (20), a pair of heat pipes (30) connecting the
first heat sink and the second heat sink and a fan assembly (40)
located between the first heat sink and the second heat sink. The
first heat sink comprises a base (12), a cover (14) and a plurality
of heat dissipating fins (16) sandwiched between the base and the
cover. The second heat sink comprises a plurality of cooling fins
(22). Each heat pipe comprises three portions, respectively orderly
sandwiched between the base and the heat dissipating fins,
sandwiched between the cover and the heat dissipating fins and
thermally extending in the cooling fins.
Inventors: |
Lee; Hsieh-Kun; (Tu-Cheng,
TW) ; Xia; Wan-Lin; (Shenzhen, CN) ; Li;
Tao; (Shenzhen, CN) ; Xiao; Min-Qi; (Shenzhen,
CN) |
Correspondence
Address: |
MORRIS MANNING MARTIN LLP
3343 PEACHTREE ROAD, NE
1600 ATLANTA FINANCIAL CENTER
ATLANTA
GA
30326
US
|
Assignee: |
Foxconn Technology Co., Ltd
Tu-Cheng City
TW
|
Family ID: |
37195483 |
Appl. No.: |
11/268079 |
Filed: |
November 7, 2005 |
Current U.S.
Class: |
361/701 ;
257/E23.088; 257/E23.099 |
Current CPC
Class: |
H01L 23/467 20130101;
H01L 2924/00 20130101; H01L 2924/0002 20130101; G06F 1/20 20130101;
H01L 23/427 20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
361/701 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 29, 2005 |
CN |
200510034516.9 |
Claims
1. A heat dissipation device comprising: a fan generating an
airflow; a first heat sink placed at a side of the fan, the first
heat sink comprising a base, a cover opposite to the base and a
plurality of first fins sandwiched between the base and the cover;
a second heat sink disposed at another side of the fan opposite to
the first heat sink, the second heat sink comprising a plurality of
second fins being parallel to the base and the cover; and at least
one heat pipe connecting the base and cover and further extending
into the second fins, and wherein the airflow flows from the first
fins to the second fins via the fan.
2. The heat dissipation device as claimed in claim 1, wherein a
plurality of channels is defined between the first fins to guide
the airflow flowing through the first heat sink to enter the
fan.
3. The heat dissipation device as claimed in claim 2, further
comprising a fan holder abutting against outmost ones of the first
fins, and wherein the fan is mounted at a substantially central
portion of the fan holder so that the airflow enters the fan after
flowing through the channels.
4. The heat dissipation device as claimed in claim 1, wherein the
at least one heat pipe comprises portions respectively disposed in
the base, the cover and inserted in the second fins.
5. The heat dissipation device as claimed in claim 3, wherein the
base defines a first groove accommodating the portion of the at
least one heat pipe disposed in the base and the cover defines a
second groove accommodating the portion of the at least one heat
pipe disposed in the cover.
6. A heat dissipation device comprising: a base; a cover parallel
to the base; a fin member sandwiched between the base and the
cover, the fin member defining a plurality of air passageways
therein; a cooling fins group disposed beside the fin member; a fan
assembly placed between the fin member and the cooling fins group;
and at least one heat pipe thermally connecting the base and the
cover and extending in the cooling fins group.
7. The heat dissipation device as claimed in claim 6, wherein the
base defines at least one first groove accommodating the at least
one heat pipe contacting with the base.
8. The heat dissipation device as claimed in claim 6, wherein the
cover defines at least one second groove accommodating the at least
one heat pipe contacting with the cover.
9. The heat dissipation device as claimed in claim 6, wherein the
at least one heat pipe comprises three portions, respectively
orderly sandwiched between the base and the fin member, sandwiched
between the cover and the fin member and thermally received in the
cooling fins group.
10. The heat dissipation device as claimed in claim 9, wherein the
portion of the at least one heat pipe received in the cooling fins
group is perpendicular to the other portions sandwiched between the
base and the fin member and sandwiched between the cover and the
fin member.
11. The heat dissipation device as claimed in claim 6, wherein the
fan assembly is arranged at a side of the fin member.
12. The heat dissipation device as claimed in claim 11, wherein the
fan assembly comprises a fan and a fan holder securely engaged with
the base and the cover for facilitating to hold the fan in position
to the fin member.
13. A heat dissipation device comprising: a first heat sink for
contacting with a heat-generating electronic component; a second
heat sink; a fan mounted between the first heat sink and the second
heat sink; and a heat pipe having a substantially rectangular
contour with a first transferring portion thermally engaging with a
lower portion of the first heat sink, a second transferring portion
thermally engaging with an upper portion of the first heat sink, a
connecting portion interconnecting the first and second
transferring portions, and a third transferring portion thermally
engaging with the second heat sink.
14. The heat dissipation device as claimed in claim 13, wherein the
second heat sink defines a hole therein, and the third transferring
portion is inserted in the hole.
15. The heat dissipation device as claimed in claim 14, wherein the
first heat sink has a base attached to a bottom thereof, and a
cover attached to a top thereof, the first transferring portion of
the heat pipe being sandwiched between the base and the bottom of
the first heat sink, and the second transferring portion being
sandwiched between the cover and the top of the first heat sink,
the base being adapted for contacting with the heat-generating
electronic component.
16. The heat dissipating device as claimed in claim 15, wherein the
second heat sink comprises of a plurality of fins oriented parallel
to the base, the hole being defined through the fins, the first
heat sink comprises a plurality of fins oriented perpendicular to
the base.
17. The heat dissipating device as claimed in claim 15, wherein the
cover and base form grooves respectively receiving the second and
first transferring portions of the heat pipe therein.
18. The heat dissipating device as claimed in claim 13, wherein an
air flow generated by the fan flows first through the fins of the
first heat sink, then the fan, and finally the fins of the second
heat sink.
19. The heat dissipating device as claimed in claim 13, wherein the
fan is attached to a lateral side of the first heat sink.
20. The heat dissipating device as claimed in claim 19, wherein the
first heat sink comprises a fan holder secured to the lateral side
of the first heat sink, and the fan is secured to the fan holder.
Description
BACKGROUND
[0001] 1. Field
[0002] The present invention relates generally to a heat
dissipation device, and more particularly to a heat dissipation
device using heat pipes for enhancing heat removal from
heat-generating electronic components.
[0003] 2. Related Art
[0004] As computer technology continues to advance, electronic
components such as central processing units (CPUs) of computers are
being made to provide faster operational speeds and greater
functional capabilities. When a CPU operates at high speed in a
computer enclosure, its temperature can increase greatly. It is
desirable to dissipate the heat quickly, for example by using a
heat dissipation device attached to the CPU in the enclosure. This
allows the CPU and other electronic components in the enclosure to
function within their normal operating temperature ranges, thereby
assuring the quality of data management, storage and transfer.
[0005] A conventional heat dissipation device comprises a first
heat sink, a second heat sink and a pair of heat pipes connecting
the first heat sink and the second heat sink. The first heat sink
comprises a base and a plurality of fins extending from the base.
The base defines two grooves in a top surface thereof, and a bottom
surface of the base is attached to an electronic component. Each
heat pipe has an evaporating portion accommodated in one of the
grooves and a condensing portion inserted in the second heat sink.
The base absorbs heat produced by the electronic component and
transfers heat directly to the fins of the first heat sink and the
second heat sink through the heat pipes. Because of an increased
heat dissipating area, heat dissipation efficiency of the heat
dissipation device is correspondingly improved.
[0006] However, due to structural limitation, there is no contact
between the heat pipes and top of the fins of the first heat sink,
which results in that the heat removal efficiency by the prior art
heat dissipation device still cannot meet the increasing heat
removing requirement for the up-to-the minute heat-generating
electronic devices.
SUMMARY
[0007] What is needed is a heat dissipation device with heat pipes
which has an improved heat dissipation efficiency.
[0008] A heat dissipation device in accordance with a preferred
embodiment of the present invention comprises a first heat sink, a
second heat sink, a pair of heat pipes connecting the first heat
sink and the second heat sink and a fan assembly located between
the first heat sink and the second heat sink. The first heat sink
comprises a base, a cover and a plurality of first fins sandwiched
between the base and the cover. The second heat sink comprises a
plurality of second fins. Each heat pipe is configured with a
substantially rectangular contour, having a first transferring
portion sandwiched between the base and the first fins, a second
transferring portion sandwiched between the cover and the first
fins, a connecting portion interconnecting the first and second
transferring portions, and a third transferring portion extending
in the second fins and thermally connecting therewith.
[0009] Other advantages and novel features of the invention will
become more apparent from the following detailed description when
taken in conjunction with the accompanying drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is an assembled view of a heat dissipation device in
accordance with a preferred embodiment of the present invention;
and
[0011] FIG. 2 is an exploded view of FIG. 1.
DETAILED DESCRIPTION OF THE INVENTION
[0012] FIG. 1 shows a heat dissipation device in accordance with a
preferred embodiment of the present invention. The heat dissipation
device comprises a first heat sink 10, a second heat sink 20, a
pair of heat pipes 30 connecting the first heat sink 10 and the
second heat sink 20 and a fan assembly 40 located between the first
heat sink 10 and the second heat sink 20.
[0013] Referring to FIG. 2, the first heat sink 10 comprises a base
12, a cover 14 spaced opposite to the base 12, and a plurality of
spaced first fins 16 sandwiched between the base 12 and the cover
14. The first fins 16 are oriented to be perpendicular to the base
12 and the cover 14. A plurality of channels 18 is defined between
the first fins 16. The base 12 has a bottom surface for being
attached to a heat-generating electrical component (not shown) such
as a CPU, and a top surface opposite to the bottom surface. The
base 12 defines a pair of first grooves 122 in the top surface
thereof. The cover 14 defines a pair of second grooves 142 in a
bottom surface thereof. Each first fin 16 forms a flange at each of
top and bottom ends thereof. All flanges at top ends of the first
fins 16 define a top plane. All flanges at bottom ends of the first
fins 16 define a bottom plane. The base 12 and cover 14 are
respectively soldered to the top and bottom planes.
[0014] The second heat sink 20 is located beside the first heat
sink 10 and comprises a plurality of second fins 22. Each second
fin 22 defines a pair of holes 24 for a portion of the heat pipes
30 to be inserted therein. Each heat pipe 30 is bent to have a
generally rectangular contour. Each heat pipe 30 has a first
transferring portion 32 accommodated in one of the first grooves
122, a second transferring portion 36 accommodated in one of the
second grooves 142, a connecting portion 34 interconnecting the
first and second transferring portions 32, 36, and a third
transferring portion 38 extending from the second transferred
portion 36 into one of the holes 24. The first transferring
portions 32 are secured in the first grooves 122 and the second
transferring portions 36 are secured in the second grooves 142 by
soldering. The first transferring portion 32 is parallel to the
second transferring portion 36. The third transferring portion 38
is perpendicular to the first transferring portion 32 and second
transferring portion 36. The first transferring portions 32 of the
heat pipes 30 are sandwiched between the base 12 and the bottom of
the first fins 16. The second transferring portions 36 extending
through the cover 14 are sandwiched between the cover 14 and the
top of the first fins 16. The third transferring portions 38
sufficiently thermally contact with each second fin 22 by extending
in and through the holes 24. The third transferring portions 38 are
secured in the holes 24 by soldering.
[0015] The fan assembly 40 is mounted to a lateral side of the
first heat sink 10 and comprises a fan 42 and a fan holder 44
securely engaged with the base 12 and the cover 14 for facilitating
to hold the fan 42 in position to the first heat sink 10. The fan
holder 44 abuts against outmost ones of the first fins 16, wherein
the fan 42 is mounted at a substantially central portion of the fan
holder 44. An airflow generated by the fan 42 enters the fan 42
after passing through the channels 18. The airflow then blows
through the second heat sink 20, so that the airflow flows from the
first fins 16 of the first heat sink 10 to the second fins 22 of
the second heat sink 20 via the fan 42 to take away a great amount
of heat from the first and second fins 16, 22.
[0016] The base 12 absorbs heat from the heat-generating electrical
component and a part of the heat is directly transferred to the
first fins 16 via a connection between the first fins 16 and the
base 12. The other part of the heat is absorbed by the first
transferred portions 32 and transferred to the second transferred
portions 36 and the third transferred portions 38. The heat
transferred to the second transferred portions 36 is transferred to
the first fins 16 via a connection between the first fins 16 and
the cover 14. The heat transferred to the third transferred
portions 38 is transferred to the second fins 22 via a connection
between the third transferred portions 38 and the second fins 22.
The heat absorbed by the base 12 is dissipated to the first fins 16
from the top and bottom planes thereof, and evenly distributed on
each first fin 16. The third transferred portions 38 transmit the
heat to the second fins 22 by sufficiently contacting with the
second fins 22. So the heat pipes 30 evenly dissipates the heat to
both the first heat sink 10 and the second heat sink 20. Heat
dissipation efficiency of the heat dissipation device is improved
because of a great amount of contacting area between the heat pipes
30 and the first and second heat sinks 10, 20. In this embodiment,
the first transferred portions 32 are structured as evaporating
portions and the second transferred portions 36 and the third
portions 38 are structured as condensing portions of the heat pipes
30. The airflow flows through the first, second heat sinks 10, 20
and to take heat away therefrom. In an alternative embodiment, it
is feasible that the electronic component is positioned to
thermally contact with the cover 14 instead of the base 12. That is
to say, the heat dissipation device of the present invention is
used in a reversed manner. For such use, the second transferring
portions 36 should be structured as evaporating portions and the
first and third transferring portions 32, 38 should be structured
as condensing portions of the heat pipes 30.
[0017] It is understood that the invention may be embodied in other
forms without departing from the spirit thereof. Thus, the present
examples and embodiments are to be considered in all respects as
illustrative and not restrictive, and the invention is not to be
limited to the details given herein.
* * * * *