U.S. patent application number 11/413703 was filed with the patent office on 2006-11-02 for heat-dissipation device and electronic apparatus utilizing the same.
This patent application is currently assigned to BENQ CORPORATION. Invention is credited to Chang Chien Li, Kelvin Liao, Bang Ji Wang.
Application Number | 20060242966 11/413703 |
Document ID | / |
Family ID | 37233094 |
Filed Date | 2006-11-02 |
United States Patent
Application |
20060242966 |
Kind Code |
A1 |
Wang; Bang Ji ; et
al. |
November 2, 2006 |
Heat-dissipation device and electronic apparatus utilizing the
same
Abstract
An electronic apparatus and a heat-dissipation device thereof.
The electronic apparatus includes a plate and the heat-dissipation
device. The plate includes a first component and a second component
thereon. The heat-dissipation device is adjacent to the plate, and
includes a first sensor, a first cooling component, a second
sensor, and a second cooling component thereon. The first sensor
measures the temperature of the plate around the first component.
The first cooling component is coupled to the first sensor to
adjust the temperature of the plate around the first component. The
second sensor measures the temperature of the plate around the
second component. The second cooling component is coupled to the
second sensor to adjust the temperature of the plate around the
second component.
Inventors: |
Wang; Bang Ji; (Taipei,
TW) ; Li; Chang Chien; (Taipei County, TW) ;
Liao; Kelvin; (Taoyuan City, TW) |
Correspondence
Address: |
QUINTERO LAW OFFICE
1617 BROADWAY, 3RD FLOOR
SANTA MONICA
CA
90404
US
|
Assignee: |
BENQ CORPORATION
TAOYUAN
TW
|
Family ID: |
37233094 |
Appl. No.: |
11/413703 |
Filed: |
April 28, 2006 |
Current U.S.
Class: |
62/3.2 ;
257/E23.08; 257/E23.082; 257/E23.099; 62/259.2 |
Current CPC
Class: |
H01L 23/34 20130101;
H01L 2924/00 20130101; F25B 21/02 20130101; H01L 23/467 20130101;
H01L 2924/0002 20130101; H01L 23/38 20130101; H01L 2924/0002
20130101 |
Class at
Publication: |
062/003.2 ;
062/259.2 |
International
Class: |
F25B 21/02 20060101
F25B021/02; F25D 23/12 20060101 F25D023/12 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 29, 2005 |
TW |
TW94113889 |
Claims
1. An electronic apparatus comprising: a plate comprising a first
component and a second component; and a heat-dissipation device,
disposed adjacent to the plate, comprising a first sensor, a first
cooling component, a second sensor, and a second cooling component,
wherein the first a sensor measures the temperature of the plate
around the first component, the first cooling component is coupled
to the first sensor to adjust the temperature of the plate around
the first component, the second sensor measures the temperature of
the plate around the second component, and the second cooling
component is coupled to the second sensor to adjust the temperature
of the plate around the second component.
2. The electronic apparatus as claimed in claim 1, wherein the
electronic apparatus is a projector, and the plate is a
ballast.
3. The electronic apparatus as claimed in claim 1, wherein each of
the first cooling component and the second cooling component is a
thermoelectric cooling chip respectively.
4. The electronic apparatus as claimed in claim 1, wherein each of
the first cooling component and the second cooling component is a
miniature fan respectively.
5. The electronic apparatus as claimed in claim 1, wherein each of
the first cooling component and the second cooling component is a
miniature heat-dissipation module respectively.
6. A heat-dissipation device comprising: a body comprising a
plurality of adjacent zones; a plurality of sensors disposed in the
zones respectively; and a plurality of cooling components disposed
in the zones respectively and coupled to the corresponding sensor
that is located in the same zone.
7. The heat-dissipation device as claimed in claim 6, wherein each
cooling component is a thermoelectric cooling chip.
8. The heat-dissipation device as claimed in claim 6, wherein each
cooling component is a miniature fan.
9. The heat-dissipation device as claimed in claim 6, wherein each
cooling component is a miniature heat-dissipation module.
10. An electronic apparatus comprising: a plate; a first component
disposed on the plate; a second component disposed on the plate; a
first sensor, disposed on the plate, corresponding to the first
component to measure the temperature of the plate around the first
component; a first cooling component, disposed on the plate and
coupled to the first sensor, corresponding to the first component
to adjust the temperature of the plate around the first component;
a second sensor, disposed on the plate, corresponding to the second
component to measure the temperature of the plate around the second
component; and a second cooling component, disposed on the plate
and coupled to the second sensor, corresponding to the second
component to adjust the temperature of the plate around the second
component.
11. The electronic apparatus as claimed in claim 10, wherein each
of the first cooling component and the second cooling component is
a thermoelectric cooling chip respectively.
12. The electronic apparatus as claimed in claim 10, wherein each,
of the first cooling component and the second cooling component is
a miniature fan respectively.
13. The electronic apparatus as claimed in claim 10, wherein each
of the first cooling component and the second cooling component is
a miniature heat-dissipation module respectively.
Description
BACKGROUND
[0001] The invention relates to an electronic apparatus and a
heat-dissipation device thereof, and in particular, to a
heat-dissipation device with various cooling functions for various
components.
[0002] When determining a cooling condition in an electronic
apparatus, a worst condition for all components inside the
electronic apparatus, such as voltage, atmospheric temperature,
humidity, or load, is previously assumed. Then, a safe cooling
condition is obtained.
[0003] To cool the components inside the electronic apparatus, fans
and other heat-dissipation devices are disposed. For more accurate
heat-dissipation, the fans and other heat-dissipation devices can
change its rotational speed or other cooling parameters according
to sensors. However, since some components inside the electronic
apparatus are difficult to be cooled, the fans and other
heat-dissipation devices may overly cool other components due to
the components those are difficult to be cooled. Thus, noise
increases, and energy is wasted.
SUMMARY
[0004] Electronic apparatuses are provided. An exemplary embodiment
of an electronic apparatus comprises a plate and a heat-dissipation
device. The plate comprises a first component and a second
component. The heat-dissipation device is disposed adjacent to the
plate, and comprises a first sensor, a first cooling component, a
second sensor, and a second cooling component. The first sensor
measures the temperature of the plate around the first component.
The first cooling component is coupled to the first sensor to
adjust the temperature of the plate around the first component. The
second sensor measures the temperature of the plate around the
second component. The second cooling component is coupled to the
second sensor to adjust the temperature of the plate around the
second component.
[0005] Note that the electronic apparatus is a projector, and the
plate is a ballast. Each of the first cooling component and the
second cooling component may be a thermoelectric cooling chip, a
miniature fan, or a miniature heat-dissipation module
respectively.
[0006] Heat-dissipation devices are provided. An exemplary
embodiment of a heat-dissipation device comprises a body, a
plurality of sensors, and a plurality of cooling components. The
body comprises a plurality of adjacent zones. Each sensor is
disposed in each zone respectively. Each cooling component is
disposed in each zone respectively, and coupled to the
corresponding sensor that is located in the same zone.
[0007] Another exemplary embodiment of an electronic apparatus
comprises a plate, a first component, a second component, a first
sensor, a first cooling component, a second sensor, and a second
cooling component. The first component is disposed on the plate.
The second component is disposed on the plate. The first sensor is
disposed on the plate, and corresponds to the first component to
measure the temperature of the plate around the first component.
The first cooling component is disposed on the plate and coupled to
the first sensor, and corresponds to the first component to adjust
the temperature of the plate around the first component. The second
sensor is disposed on the plate, and corresponds to the second
component to measure the temperature of the plate around the second
component. The second cooling component is disposed on the plate
and coupled to the second sensor, and corresponds to the second
component to adjust the temperature of the plate around the second
component.
DESCRIPTION OF THE DRAWINGS
[0008] The invention can be more fully understood by reading the
subsequent detailed description and examples with references made
to the accompanying drawings, wherein:
[0009] FIG. 1 is a schematic view of an embodiment of a
heat-dissipation device;
[0010] FIG. 2a is a schematic view of an embodiment of an
electronic apparatus;
[0011] FIG. 2b is a schematic view of the assembled electronic
apparatus in FIG. 2a; and
[0012] FIG. 3 is a schematic view of another embodiment of an
electronic apparatus.
DETAILED DESCRIPTION
[0013] Referring to FIG. 1, an embodiment of a heat-dissipation
device 10 comprises a body 11, a plurality of sensors 12, and a
plurality of cooling components 13. The body 11 comprises a
plurality of adjacent zones 11a. Each sensor 12 is disposed in one
of the zones 11a. respectively. Each cooling component 13 is also
disposed in one of the zones 11a respectively, and is coupled to
the corresponding sensor 12 that is located in the same zone
11a.
[0014] Each sensor 12 may be an electronic thermometer, and each
cooling component 13 may be a thermoelectric cooling chip, a
miniature fan, or a miniature heat-dissipation module.
[0015] Referring to FIGS. 2a and 2b, an embodiment of an electronic
apparatus 100 comprises a plate 20 and the heat-dissipation device
10. The plate 20 comprises a first component 21 and a second
component 22 thereon. The heat-dissipation device 10 is disposed
adjacent to the plate 20. In FIG. 2a, a sensor, corresponding to
the first component 21, is referred as a first sensor 12a, and
measures the temperature of the plate 20 around the first component
21. A cooling component, corresponding to the first component 21,
is referred to as a first cooling component 13a, and adjusts the
temperature of the plate 20 around the first component 21. A
sensor, corresponding to the second component 22, is referred as a
second sensor 12b, and measures the temperature of the plate 20
around the second component 22. A cooling component, corresponding
to the second component 22, is referred to as a second cooling
component 13b, and adjusts the temperature of the plate 20 around
the second component 22.
[0016] When the temperature of the first component 21 is increased,
the first sensor 12a can detect an increase in the temperature of
the plate 20 around the first component 21. Then, the first sensor
12a outputs a signal to the first cooling component 13a to decrease
the temperature of the plate 20 around the first component 21.
Similarly, when the temperature of the second component 22 is
increased, the second sensor 12b can detect an increase in the
temperature of the plate 20 around the second component 22. The
second sensor 12b then outputs a signal to the second cooling
component 13b to decrease the temperature of the plate 20 around
the second component 22. Note that the sensors and the cooling
components, not corresponding to the heated components, are
idle.
[0017] The electronic apparatus 100 may be a projector, and the
plate 20 may be a ballast.
[0018] As previously described, since the heat-dissipation device
comprises the sensor and the cooling component in each zone, the
device can be conveniently mass-produced and can be applied to
various electronic apparatuses. Additionally, since various
components can be cooled separately, the cooling function can be
optimized, thus reducing cost and prolonging product life.
[0019] FIG. 3 is a schematic view of another embodiment of an
electronic apparatus 200. The electronic apparatus 200 of FIG. 3
differs from the electronic apparatus 100 of FIG. 2 in that the
design concept of the heat-dissipation device 10 of FIG. 1 is
directly applied in a plate 210 of the electronic apparatus
200.
[0020] Specifically, referring to FIG. 3, the electronic apparatus
200 comprises a plate 210, a first component 220, a second
component 230, a first sensor 240, a first cooling component 250, a
second sensor 260, and a second cooling component 270. The first
and second components 220 and 230 are disposed on the plate 210.
The first sensor 240 is disposed on the plate 210, and corresponds
to the first component 220 to measure the temperature of the plate
210 around the first component 220. The first cooling component 250
is disposed on the plate 210 and coupled to the first sensor 240,
and corresponds to the first component 220 to adjust the
temperature of the plate 210 around the first component 220. The
second sensor 260 is disposed on the plate 210, and corresponds to
the second component 230 to measure the temperature of the plate
210 around the second component 230. The second cooling component
270 is disposed on the plate 210 and coupled to the second sensor
260, and corresponds to the second component 230 to adjust the
temperature of the plate 210 around the second component 230.
[0021] For convenience of mass production, sensors and cooling
components can be disposed on zones without heated components, of
the plate.
[0022] Since the concept of the heat-dissipation device in FIG. 1
is directly applied to the plate of the electronic apparatus in
FIG. 3, the heat dissipation of the electronic apparatus can be
optimized.
[0023] While the invention has been described by way of example and
in terms of preferred embodiment, it is to be understood that the
invention is not limited thereto. To the contrary, it is intended
to cover various modifications and similar arrangements (as would
be apparent to those skilled in the art). Therefore, the scope of
the appended claims should be accorded the broadest interpretation
so as to encompass all such modifications and similar
arrangements.
* * * * *