U.S. patent application number 11/397001 was filed with the patent office on 2006-10-05 for lamination-type cooler.
This patent application is currently assigned to DENSO Corporation. Invention is credited to Jun Abei, Mitsuharu Inagaki, Noriyoshi Miyajima.
Application Number | 20060219396 11/397001 |
Document ID | / |
Family ID | 37068934 |
Filed Date | 2006-10-05 |
United States Patent
Application |
20060219396 |
Kind Code |
A1 |
Abei; Jun ; et al. |
October 5, 2006 |
Lamination-type cooler
Abstract
A lamination-type cooler comprises: a plurality of cooling pipes
for interposing and cooling electronic parts; and a pair of
refrigerant headers respectively engaged with both end portions of
the plurality of cooling pipes, for laminating and fixing the
plurality of cooling pipes. Both end portions of a refrigerant
passage formed in each cooling pipe are respectively communicated
with header passages formed in the refrigerant headers. The cooling
pipes are composed so that a plurality of electronic parts can be
interposed between the cooling pipes being arranged in a line in a
direction perpendicular to the laminating direction of the cooling
pipes and also perpendicular to the passage forming direction of
the refrigerant passage.
Inventors: |
Abei; Jun; (Oobu-city,
JP) ; Inagaki; Mitsuharu; (Kariya-city, JP) ;
Miyajima; Noriyoshi; (Nukata-gun, JP) |
Correspondence
Address: |
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 828
BLOOMFIELD HILLS
MI
48303
US
|
Assignee: |
DENSO Corporation
Kariya-city
JP
|
Family ID: |
37068934 |
Appl. No.: |
11/397001 |
Filed: |
April 3, 2006 |
Current U.S.
Class: |
165/164 ;
257/E23.098; 257/E25.027 |
Current CPC
Class: |
H01L 23/473 20130101;
H01L 2924/0002 20130101; H01L 25/117 20130101; F28D 1/0333
20130101; H01L 2924/00 20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
165/164 |
International
Class: |
F28D 7/02 20060101
F28D007/02 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 4, 2005 |
JP |
2005-107549 |
Apr 12, 2005 |
JP |
2005-114666 |
Claims
1. A lamination-type cooler comprising: a plurality of cooling
pipes for interposing and cooling electronic parts; and a pair of
refrigerant headers respectively engaged with both end portions of
the plurality of cooling pipes, for laminating and fixing the
plurality of cooling pipes, wherein both end portions of a
refrigerant passage formed in each cooling pipe are respectively
communicated with header passages formed in the refrigerant
headers, and the cooling pipes are composed so that a plurality of
electronic parts can be interposed between the cooling pipes being
arranged in a line in a direction perpendicular to the laminating
direction of the cooling pipes and also perpendicular to the
passage forming direction of the refrigerant passage.
2. A lamination-type cooler according to claim 1, wherein an
overall length of the cooling pipe in the passage forming direction
is not more than 100 mm.
3. A lamination-type cooler according to claim 1, wherein an inner
fin, the cross section perpendicular to the passage forming
direction of which is formed into a wave-form shape, is arranged
inside the cooling pipe.
4. A lamination-type cooler according to claim 3, wherein a pitch
of the wave-form shape of the inner fin is different in each
portion of the inner fin.
5. A lamination-type cooler according to claim 4, wherein a pitch
of the wave-form shape of the inner fin is the smallest at a
position opposed to an electronic part, the amount of heat
generation of which is the largest, in the plurality of electronic
parts.
6. A lamination-type cooler according to one of claims 1, wherein
the refrigerant passage includes a plurality of divided refrigerant
passage portions which are formed by being divided in the
perpendicular direction corresponding to an arrangement number of
arranging the electronic parts.
7. A lamination-type cooler according to claim 6, wherein, in the
pair of refrigerant headers, a plurality of supply side refrigerant
headers for supplying refrigerant to the cooling pipes are arranged
corresponding to a division number of the divided refrigerant
passage portions.
8. A lamination-type cooler according to claim 7, wherein
cross-sectional areas of the passages of the plurality of supply
side refrigerant headers are different from each other.
9. A lamination-type cooler according to claim 8, wherein a header
passage of a supply side refrigerant header in the plurality of
supply side refrigerant headers, the passage cross-sectional area
of which is the largest, is communicated with the divided
refrigerant passage portion which is opposed to an electronic part,
the amount of heat generation of which the largest.
10. A lamination-type cooler according to one of claims 7, wherein
the plurality of supply side refrigerant headers branch from one
refrigerant introducing pipe.
11. A lamination-type cooler according to one of claims 1, wherein
the passage forming direction is directed in the perpendicular
direction, and a supply side refrigerant header, which is in the
pair of refrigerant headers, for supplying refrigerant to the
cooling pipe is arranged being directed upward in the perpendicular
direction.
12. A lamination-type cooler comprising: a plurality of cooling
pipes for interposing and cooling electronic parts, wherein the
plurality of cooling pipes are laminated on and fixed to each other
by a refrigerant supply header for supplying refrigerant to the
plurality of cooling pipes and by a refrigerant discharge header
for discharging the refrigerant from the plurality of cooling
pipes, one of the refrigerant supply header and the refrigerant
discharge header is arranged at both end portions of the plurality
of cooling pipes in the refrigerant flowing direction and the other
is arranged in an intermediate portion between both end portions in
the refrigerant flowing direction, and the plurality of cooling
pipes interpose the electronic parts at positions between the
refrigerant supply header and the refrigerant discharge header in
the refrigerant flowing direction.
13. A lamination-type cooler according to claim 12, wherein a
cross-sectional area of the passage of the refrigerant supply
header and a cross-sectional area of the passage of the refrigerant
discharge header are different from each other.
14. A lamination-type cooler according to claim 12, wherein an
overall cross-sectional area of the passage of the refrigerant
supply header and an overall cross-sectional area of the passage of
the refrigerant discharge header are equal to each other.
15. A lamination-type cooler according to one of claims 12, further
comprising: one refrigerant inlet portion which is an inlet of
refrigerant to the refrigerant supply header; and one refrigerant
outlet portion which is an outlet of refrigerant from the
refrigerant discharge header, wherein one of the refrigerant supply
header and the refrigerant discharge header respectively arranged
at both end portions in the refrigerant flowing direction is
communicated with all of the plurality of cooling pipes, the other
of the refrigerant supply header and the refrigerant discharge
header arranged in an intermediate portion between both end
portions in the refrigerant flowing direction is communicated with
the cooling pipes except for one side end portion cooling pipe
laminated at the end on one side of the plurality of cooling pipes,
and one of the refrigerant inlet portion and the refrigerant outlet
portion is communicated with one side end portion cooling pipe and
the other is communicated with the refrigerant supply header or the
refrigerant discharge header arranged in an intermediate portion
between both end portions in the refrigerant flowing direction.
16. A lamination-type cooler according to one of claims 12, wherein
a passage width in the perpendicular direction perpendicular to the
refrigerant flowing direction of the refrigerant supply header and
the refrigerant discharge header is larger than a passage width in
the refrigerant flowing direction, and the plurality of cooling
pipes interpose a plurality of electronic parts so that the
plurality of electronic parts can be arranged in line in the
refrigerant flowing direction and the perpendicular direction.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a lamination-type cooler
for cooling electronic parts from both sides.
[0003] 2. Description of the Related Art
[0004] There is provided a conventional lamination-type cooler 9 as
shown in FIG. 36 in which a plurality of cooling pipes 92 are
arranged to hold electronic parts 4 so that the electronic parts 4
can be cooled from both sides by the cooling pipes. Concerning this
lamination-type cooler 9, refer to the official gazette of
JP-A-2002-26215.
[0005] This lamination-type cooler 9 includes: a supply side
refrigerant header 93A for supplying a refrigerant 5 to each
cooling pipe 92; and a discharge side refrigerant header 93B for
discharging the refrigerant 5 from each cooling pipe 92. Concerning
the refrigerant passages 921 in a plurality of cooling pipes 92
which are arranged being laminated, one end of the refrigerant
passage 921 is communicated with a header passage 931 in the supply
side refrigerant header 93A, and the other end of the refrigerant
passage 921 is communicated with the header passage 931 in the
discharge side refrigerant header 93B.
[0006] However, in the above conventional lamination-type cooler 9,
each electronic part 4 is interposed between the cooling pipes 92.
Therefore, in the lamination-type cooler 9, in order to hold a
larger number of electronic parts 4 while the cooling performance
is maintained, it is necessary to increase the number of
laminations of the cooling pipes 92. Accordingly, there is a
possibility that the size of the lamination-type cooler 9 is
increased in the laminating direction D.
SUMMARY OF THE INVENTION
[0007] The present invention has been accomplished to solve the
above conventional problems. An object of the present invention is
to provide a lamination-type cooler capable of holding a large
number of electronic parts while the sizes in the passage forming
direction and the laminating direction are maintained small and the
cooling performance is maintained high.
[0008] In order to accomplish the above object, according to a
first aspect of the present invention, there is provided a
lamination-type cooler comprising:
[0009] a plurality of cooling pipes for interposing and cooling
electronic parts; and
[0010] a pair of refrigerant headers respectively engaged with both
end portions of the plurality of cooling pipes, for laminating and
fixing the plurality of cooling pipes, wherein
[0011] both end portions of a refrigerant passage formed in each
cooling pipe are respectively communicated with header passages
formed in the refrigerant headers, and
[0012] the cooling pipes are composed so that a plurality of
electronic parts can be interposed between the cooling pipes being
arranged in a line in a direction perpendicular to the laminating
direction of the cooling pipes and also perpendicular to the
passage forming direction of the refrigerant passage.
[0013] In the lamination-type cooler of the present invention,
electronic parts are cooled from both sides, and a plurality of
cooling pipes interpose the electronic parts in such a manner that
the electronic parts are arranged in a line in the perpendicular
direction.
[0014] The cooling pipe may have a space, in which one electronic
part can be arranged, in the passage forming direction. Therefore,
the sizes of the cooling pipe and the lamination-type cooler in the
passage forming direction can be maintained small. Concerning the
cooling pipe, a plurality of electronic parts can be arranged in
the perpendicular direction. Therefore, in the lamination-type
cooler, it is unnecessary to increase the number of laminations of
the cooling pipes in order to hold a larger number of electronic
parts, and it is possible to reduce the size of the lamination-type
cooler in the laminating direction.
[0015] When a plurality of electronic parts are interposed between
the cooling pipes being arranged in a line in the perpendicular
direction, the distances between a plurality of electronic parts,
which are interposed between the cooling pipes, from the
refrigerant header can be made to be substantially equal to each
other. Therefore, refrigerant supplied to the cooling pipes from
the refrigerant header can substantially uniformly cool the
electronic parts interposed between the cooling pipes.
[0016] Therefore, according to the lamination-type cooler of the
present invention, it is possible to maintain the sizes in the
passage forming direction and the laminating direction small, and
it is possible hold a large number of electronic parts while the
cooling performance is maintained high.
[0017] In this connection, electronic parts are cooled by the above
lamination-type cooler as follows.
[0018] In the case where the lamination-type cooler is used,
refrigerant is supplied from a header passage of one refrigerant
header into the refrigerant passage of each cooling pipe. When this
refrigerant flows in each refrigerant passage, heat is exchanged
between the refrigerant and the electronic parts, so that the
electronic parts can be cooled. After that, the refrigerant, the
temperature of which is raised by the heat exchange, is discharged
from each refrigerant passage into the header passage of the other
refrigerant header.
[0019] A preferred embodiment of the present invention described
above will be explained below.
[0020] In the present invention, for example, an inverter element
can be incorporated into the above electronic part. Especially, the
electronic part can be a semiconductor module into which IGBT
(electric power switching element) and FWD (diode element) are
incorporated.
[0021] The semiconductor module used for an inverter may be an
inverter used for an automobile, an inverter used for driving a
motor of industrial equipment or an inverter used for an air
conditioner in a building.
[0022] The electronic part can be a battery used for a hybrid
electric vehicle (HEV) or an electric vehicle (EV). The electronic
part can be a semiconductor which has not been made into a module
yet. For example, the electronic part can be a thyristor, power
transistor, power FET and IGBT.
[0023] The refrigerant (cooling medium) made to flow in the cooling
pipe can be water, to which an antifreezing solution of ethylene
glycol is mixed, a natural refrigerant such as water or ammonium, a
refrigerant of carbon fluoride such as Fluorinert (trademark), a
refrigerant of CFC such as HCFC123 or HFC134a, a refrigerant of an
alcohol such as methanol or alcohol and a refrigerant of a ketone
such as acetone.
[0024] At both end portions of the cooling pipe in the passage
forming direction, protruding pipe portions are respectively formed
which protrude in the laminating direction. The protruding pipe
portions of each cooling pipe are connected to the protruding pipe
portions of the adjoining cooling pipes. It is preferable that the
refrigerant header is formed out of the protruding pipe portions
which are connected as described above.
[0025] In this case, it is unnecessary to compose the refrigerant
header of another member different from the cooling pipe.
Therefore, it is possible to reduce the number of parts of the
lamination-type cooler. Further, it becomes easy to manufacture the
lamination-type cooler.
[0026] According to a second aspect of the present invention, it is
preferred that an overall length of the cooling pipe in the passage
forming direction is not more than 100 mm.
[0027] In this case, it is possible to appropriately ensure a
space, in which one electronic part can be arranged, in the passage
forming direction of the cooling pipe. Accordingly, the sizes of
the cooling pipe and the lamination-type cooler in the passage
forming direction can be appropriately reduced.
[0028] When consideration is given to the size of one electronic
part, an entire length of the cooling pipe in the passage forming
direction can be not less than 50 mm.
[0029] According to a third aspect of the present invention, it is
preferred that an inner fin, the cross section perpendicular to the
passage forming direction of which is formed into a wave-form
shape, is arranged inside the cooling pipe.
[0030] In this case, due to the inner fin, the cooling efficiency
of the cooling pipe can be enhanced.
[0031] According to a fourth aspect of the present invention, it is
preferred that a pitch of the wave-form shape of the inner fin is
different in each portion of the inner fin.
[0032] In this case, the heat transfer performance in the cooling
pipe can be made to be different in each portion in the
perpendicular direction. That is, in a portion of the cooling pipe
in the perpendicular direction, the heat transfer performance of
which is to be enhanced, it is possible to reduce a pitch of the
wave-form shape of the inner fins.
[0033] Therefore, for example, when a pitch of the wave-form shape
of the inner fin opposed to a portion of each electronic part, the
amount of heat generation of which is the largest, is minimized,
each electronic part can be effectively cooled.
[0034] According to a fifth aspect of the present invention, it is
preferred that a pitch of the wave-form shape of the inner fin is
the smallest at a position opposed to an electronic part, the
amount of heat generation of which is the largest, in the plurality
of electronic parts.
[0035] In this case, an electronic part, the amount of heat
generation of which is the largest, can be effectively cooled by a
portion of the inner fin, the heat transfer performance of which is
the highest.
[0036] According to a sixth aspect of the present invention, it is
preferred that the refrigerant passage includes a plurality of
divided refrigerant passage portions which are formed by being
divided in the perpendicular direction corresponding to an
arrangement number of arranging the electronic parts.
[0037] In this case, in the cooling pipe, the electronic part can
be opposed to a division refrigerant passage section in which
refrigerant flows, and a space formed between the electronic parts
can be opposed to a division section which divides the division
refrigerant passage sections from each other. Due to the above
structure in the refrigerant pipe, refrigerant can be made to flow
only in a portion opposed to each electronic part. Therefore, each
electronic part can be effectively cooled.
[0038] According to a seventh aspect of the present invention, it
is preferred that, in the pair of refrigerant headers, a plurality
of supply side refrigerant headers for supplying refrigerant to the
cooling pipes are arranged corresponding to a division number of
the divided refrigerant passage portions.
[0039] In this case, division refrigerant passage sections can be
communicated with header passages of the supply side refrigerant
headers, and refrigerant can be separately supplied to the division
refrigerant passage sections via the supply side refrigerant
headers. Due to the above structure, for example, flow velocities
of the refrigerant in the supply side refrigerant headers are made
to be different from each other, so that the cooling performance of
the division refrigerant passage section can be made to be
different.
[0040] In this connection, when a plurality of header passages are
formed being divided corresponding to the division number of the
division refrigerant passage sections, a plurality of the supply
side refrigerant headers can be arranged in the lamination-type
cooler. In this case, the same operational effect can be
provided.
[0041] According to an eighth aspect of the present invention, it
is preferred that cross-sectional areas of the passages of the
plurality of supply side refrigerant headers are different from
each other.
[0042] In this case, flow rates of the refrigerant flowing in the
header passages of the supply side refrigerant headers can be made
to be different from each other. Therefore, flow rates of the
refrigerant in the header passages of the supply side refrigerant
headers, which are communicated with the division refrigerant
passage section, can be made to be different from each other.
Therefore, the cooling performance in each division refrigerant
passage section can be simply made to be different from each
other.
[0043] According to a ninth aspect of the present invention, it is
preferred that a header passage of a supply side refrigerant header
in the plurality of supply side refrigerant headers, the passage
cross-sectional area of which is the largest, is communicated with
the divided refrigerant passage portion which is opposed to an
electronic part, the amount of heat generation of which the
largest.
[0044] In this case, an electronic part, the amount of heat
generation of which is the largest, can be effectively cooled by a
supply side refrigerant header, the sectional area of the passage
of which is the largest so that the flow rate of the refrigerant
can be the highest.
[0045] According to a tenth aspect of the present invention, it is
preferred that the plurality of supply side refrigerant headers
branch from one refrigerant introducing pipe.
[0046] In this case, the refrigerant can be made to flow from one
refrigerant introducing pipe into a plurality of supply side
refrigerant headers being branched. When one refrigerant
introducing pipe is connected to a refrigerant supply source
arranged outside the lamination-type cooler, the refrigerant can be
supplied to the supply side refrigerant headers. Therefore, a
plurality of supply side headers can be arranged in the
lamination-type cooler without deteriorating the connection
property (the property of mounting the lamination-type cooler) to
the refrigerant supply source.
[0047] According to an eleventh aspect of the present invention, it
is preferred that the passage forming direction is directed in the
perpendicular direction, and a supply side refrigerant header,
which is in the pair of refrigerant headers, for supplying
refrigerant to the cooling pipe is arranged being directed upward
in the perpendicular direction.
[0048] In this case, the refrigerant can be made to flow in the
gravity direction (the perpendicular direction) in the cooling
pipes. Therefore, it is possible to effectively prevent air except
for the refrigerant from staying in the cooling pipes.
[0049] According to a twelfth aspect of the present invention, it
is preferred that a lamination-type cooler comprises:
[0050] a plurality of cooling pipes for interposing and cooling
electronic parts, wherein
[0051] the plurality of cooling pipes are laminated on and fixed to
each other by a refrigerant supply header for supplying refrigerant
to the plurality of cooling pipes and by a refrigerant discharge
header for discharging the refrigerant from the plurality of
cooling pipes,
[0052] one of the refrigerant supply header and the refrigerant
discharge header is arranged at both end portions of the plurality
of cooling pipes in the refrigerant flowing direction and the other
is arranged in an intermediate portion between both end portions in
the refrigerant flowing direction, and
[0053] the plurality of cooling pipes interpose the electronic
parts at positions between the refrigerant supply header and the
refrigerant discharge header in the refrigerant flowing
direction.
[0054] In the lamination-type cooler of the present invention,
electronic parts are cooled from both sides. In the case where
electronic parts, which are arranged in the refrigerant flowing
direction, are interposed between a plurality of cooling pipes, it
is devised so that the electronic parts can be cooled as uniformly
as possible.
[0055] That is, one of the refrigerant supply header and the
refrigerant discharge header is arranged at both end portions in
the refrigerant flowing direction, and the other is arranged in an
intermediate portion between both end portions in the refrigerant
flowing direction. The electronic parts to be interposed between
the cooling pipes are interposed at positions between the
refrigerant supply header and the refrigerant discharge header in
the refrigerant flowing direction. Therefore, it is possible to
hold a plurality of electronic parts in the refrigerant flowing
direction between the cooling pipes in such a manner that the
plurality of electronic parts are arranged in the refrigerant
flowing direction.
[0056] Due to the foregoing, in the lamination-type cooler, it is
unnecessary to increase the number of laminations of the cooling
pipes in order to hold a large number of electronic parts.
Accordingly, the size of the lamination-type cooler in the
laminating direction (the direction of laminating a plurality of
cooling pipes) can be maintained small.
[0057] Due to the above structure of the refrigerant supply header
and the refrigerant discharge header, distances between the
electronic parts from the refrigerant supply header and the
refrigerant discharge header can be made to be the substantially
same. Therefore, the refrigerant supplied from the refrigerant
supply header to the cooling pipes can flow from the intermediate
portion of the refrigerant flowing direction to both end portions.
Alternatively, the refrigerant supplied from the refrigerant supply
header to the cooling pipes can flow from both end portions of the
refrigerant flowing direction to the intermediate portion. Due to
the foregoing, the electronic parts interposed between the cooling
pipes can be substantially uniformly cooled.
[0058] Therefore, according to the lamination-type cooler of the
present invention, it is possible to maintain the size in the
laminating direction small. Further, while the cooling performance
is maintained high, a large number of electronic parts can be
held.
[0059] In this connection, the electronic parts are cooled by the
above lamination-type cooler as follows.
[0060] In the case of using the lamination-type cooler, the
refrigerant is supplied from the refrigerant supply header into the
cooling pipes. When this refrigerant flows in the cooling pipes,
heat is exchanged between the refrigerant and the electronic parts,
and the electronic parts are cooled. After that, the refrigerant,
the temperature of which has been raised by the heat exchange, is
discharged from the cooling pipes into the refrigerant discharge
header.
[0061] A preferred embodiment of the present invention described
above will be explained below.
[0062] In the present invention, for example, an inverter element
can be incorporated into the above electronic part. Especially, the
electronic part can be a semiconductor module into which IGBT
(electric power switching element) and FWD (diode element) are
incorporated.
[0063] The semiconductor module used for an inverter may be an
inverter used for an automobile, an inverter used for driving a
motor of industrial equipment or an inverter used for an air
conditioner for used for a building.
[0064] The electronic part can be a battery used for a hybrid
electric vehicle (HEV) or an electric vehicle (EV). The electronic
part can be a semiconductor which has not been made into a module
yet. For example, the electronic part can be a thyristor, power
transistor, power FET and IGBT.
[0065] The refrigerant (cooling medium) made to flow in the cooling
pipe can be water, to which an antifreezing solution of ethylene
glycol is mixed, natural refrigerant such as water or ammonium, a
refrigerant of carbon fluoride such as Fluorinert (trademark), a
refrigerant of CFC such as HCFC123 or HFC134a, a refrigerant of an
alcohol such as methanol or alcohol and a refrigerant of a ketone
such as acetone.
[0066] The cooling pipes have protruding pipe portions, which are
protruded in the laminating direction of the cooling pipes, in both
end portions and the intermediate portion in the refrigerant
flowing direction. The protruding pipe portion of each cooling pipe
is connected to the protruding pipe portion of the adjoining
cooling pipe. It is preferable that the refrigerant supply header
and the refrigerant discharge header are formed out of the
protruding pipe portions which are connected to each other as
described above.
[0067] In this case, it is unnecessary that the refrigerant supply
header and the refrigerant discharge header are respectively made
of materials different from each other. Therefore, it is possible
to reduce the number of parts of the lamination-type cooler.
Further, the lamination-type cooler can be easily manufactured.
[0068] According to a thirteenth aspect of the present invention, a
cross-sectional area of the passage of the refrigerant supply
header and a cross-sectional area of the passage of the refrigerant
discharge header can be different from each other.
[0069] In this case, a sectional area of the passage of one of the
refrigerant supply header and the refrigerant discharge header
arranged at both end portions of the cooling pipe in the
refrigerant flowing direction is made smaller than a sectional area
of the passage of the other of the refrigerant supply header and
the refrigerant discharge header arranged at the intermediate
portion of the cooling pipe in the refrigerant flowing direction.
In this way, the refrigerant can be made to flow smoothly in the
cooling pipes.
[0070] According to a fourteenth aspect of the present invention,
it is preferred that an overall cross-sectional area of the passage
of the refrigerant supply header and an overall cross-sectional
area of the passage of the refrigerant discharge header are equal
to each other.
[0071] In this case, the flow rate of the refrigerant supplied to
each cooling pipe and the flow rate of the refrigerant discharge
from each cooling pipe can be made to be substantially equal to
each other. Therefore, it is possible to reduce the resistance of
the refrigerant flowing in each cooling pipe. Therefore, it is
possible to make the refrigerant flow more smoothly in each cooling
pipe.
[0072] According to a fifteenth aspect of the present invention, it
is preferred that a lamination-type cooler further comprises: one
refrigerant inlet portion which is an inlet of refrigerant to the
refrigerant supply header; and one refrigerant outlet portion which
is an outlet of refrigerant from the refrigerant discharge header,
wherein one of the refrigerant supply header and the refrigerant
discharge header respectively arranged at both end portions in the
refrigerant flowing direction is communicated with all of the
plurality of cooling pipes, the other of the refrigerant supply
header and the refrigerant discharge header arranged in an
intermediate portion between both end portions in the refrigerant
flowing direction is communicated with the cooling pipes except for
one side end portion cooling pipe laminated at the end on one side
of the plurality of cooling pipes, and one of the refrigerant inlet
portion and the refrigerant outlet portion is communicated with one
side end portion cooling pipe and the other is communicated with
the refrigerant supply header or the refrigerant discharge header
arranged in an intermediate portion between both end portions in
the refrigerant flowing direction.
[0073] In this case, in the above lamination-type cooler, the
refrigerant can be supplied and discharged by one refrigerant inlet
portion and one refrigerant outlet portion. One refrigerant inlet
portion is connected to the supply side pipe of the refrigerant
supply source, and one refrigerant outlet portion is connected to
the return side pipe of the refrigerant supply source, so that the
lamination-type cooler can be arranged in an arrangement space in a
vehicle. Therefore, the property of mounting the lamination-type
cooler (the property of connecting the lamination-type cooler to
the refrigerant supply source) can be enhanced.
[0074] According to a sixteenth aspect of the present invention, it
is preferred that a passage width in the perpendicular direction
perpendicular to the refrigerant flowing direction of the
refrigerant supply header and the refrigerant discharge header is
larger than a passage width in the refrigerant flowing direction,
and the plurality of cooling pipes interpose a plurality of
electronic parts so that the plurality of electronic parts can be
arranged in line in the refrigerant flowing direction and the
perpendicular direction.
[0075] In this case, not only a plurality of electronic parts are
interposed between the cooling pipes described above being arranged
in the refrigerant flowing direction but also the plurality of
electronic parts are interposed between the cooling pipes being
arranged in the perpendicular direction. Due to the above
structure, in the lamination-type cooler of the present invention,
it is possible to maintain the size in the laminating direction
small. Further, while the cooling performance is maintained high, a
large number of electronic parts can be held. Due to the foregoing,
while the number of electronic parts and the cooling performance
are maintained, the size of the lamination-type cooler in the
laminating direction can be reduced.
[0076] The present invention may be more fully understood from the
description of preferred embodiments of the invention set forth
below, together with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0077] In the drawings:
[0078] FIG. 1 is a front view showing a lamination-type cooler of
Embodiment 1;
[0079] FIG. 2 is a schematic plan view showing an arrangement of
electronic parts in a cooling pipe of the lamination-type cooler of
Embodiment 1;
[0080] FIG. 3 is a schematic sectional view showing a cooling pipe
and electronic parts of the lamination-type cooler of Embodiment
1;
[0081] FIG. 4 is a schematic sectional view showing a refrigerant
header of the lamination-type cooler of Embodiment 1;
[0082] FIG. 5 is a schematic sectional view showing a refrigerant
header of the lamination-type cooler of Embodiment 1;
[0083] FIG. 6 is a schematic sectional view showing a cooling pipe
and electronic parts of the lamination-type cooler of Embodiment
2;
[0084] FIG. 7 is a schematic plan view showing an arrangement of
electronic parts in a cooling pipe of the lamination-type cooler of
Embodiment 2;
[0085] FIG. 8 is a schematic sectional view showing a cooling pipe
and electronic parts of the lamination-type cooler of Embodiment
3;
[0086] FIG. 9 is a schematic sectional view showing a cooling pipe
and electronic parts of the lamination-type cooler of Embodiment
4;
[0087] FIG. 10 is a schematic sectional view showing a refrigerant
header of the lamination-type cooler of Embodiment 5;
[0088] FIG. 11 is a schematic sectional view showing a refrigerant
header of the lamination-type cooler of Embodiment 6;
[0089] FIG. 12 is a schematic sectional view showing a refrigerant
header of the lamination-type cooler of Embodiment 7;
[0090] FIG. 13 is a schematic sectional view showing a refrigerant
header of the lamination-type cooler of Embodiment 8;
[0091] FIG. 14 is a schematic sectional view showing a refrigerant
header of the lamination-type cooler of Embodiment 9;
[0092] FIG. 15 is a front view showing a lamination-type cooler of
Embodiment 10;
[0093] FIG. 16 is a front view showing a lamination-type cooler of
Comparative Example;
[0094] FIG. 17 is a schematic plan view showing an arrangement of
electronic parts in a cooling pipe of the lamination-type cooler of
Comparative Example;
[0095] FIG. 18 is a front view showing a lamination-type cooler of
Embodiment 11;
[0096] FIG. 19 is a schematic plan view showing an arrangement of
electronic parts in a cooling pipe of the lamination-type cooler of
Embodiment 11;
[0097] FIG. 20 is a schematic sectional view showing a cooling pipe
and electronic parts of the lamination-type cooler of Embodiment
11;
[0098] FIG. 21 is a schematic sectional view showing a refrigerant
header of the lamination-type cooler of Embodiment 11;
[0099] FIG. 22 is a schematic sectional view showing a refrigerant
supply header and refrigerant discharge header of the
lamination-type cooler of Embodiment 11;
[0100] FIG. 23 is a front view showing another lamination-type
cooler of Embodiment 11;
[0101] FIG. 24 is a front view showing still another
lamination-type cooler of Embodiment 11;
[0102] FIG. 25 is a front view showing still another
lamination-type cooler of Embodiment 11;
[0103] FIG. 26 is a front view showing a lamination-type cooler of
Embodiment 12;
[0104] FIG. 27 is a schematic plan view showing an arrangement of
electronic parts in a cooling pipe of the lamination-type cooler of
Embodiment 12;
[0105] FIG. 28 is a front view showing another lamination-type
cooler of Embodiment 12;
[0106] FIG. 29 is a front view showing a lamination-type cooler of
Embodiment 13;
[0107] FIG. 30 is a schematic plan view showing an arrangement of
electronic parts in a cooling pipe of the lamination-type cooler of
Embodiment 13;
[0108] FIG. 31 is a front view showing a lamination-type cooler of
Embodiment 14;
[0109] FIG. 32 is a schematic sectional view showing a refrigerant
supply header and refrigerant discharge header of the
lamination-type cooler of Embodiment 14;
[0110] FIG. 33 is a front view showing another lamination-type
cooler of Embodiment 14;
[0111] FIG. 34 is a front view showing a lamination-type cooler of
Comparative Example;
[0112] FIG. 35 is a schematic plan view showing an arrangement of
electronic parts in a cooling pipe of the lamination-type cooler of
Comparative Example; and
[0113] FIG. 36 is a front view showing a lamination-type cooler of
a Conventional Example.
DESCRIPTION OF PREFERRED EMBODIMENTS
[0114] Embodiments of the lamination-type cooler of the present
invention will be explained below by referring to the accompanying
drawings.
[0115] First of all, Embodiment 1 will be explained as follows. As
shown in FIGS. 1 to 5, a lamination-type cooler 1 of this
embodiment includes: a plurality of cooling pipes 2 between which
electronic parts 4 are interposed so that they can be cooled; and a
pair of refrigerant headers 3 which are respectively engaged with
both end portions of the plurality of cooling pipes 2 so that the
plurality of cooling pipes 2 can be laminated and fixed. Both end
portions of a refrigerant passage 21, which is formed in each
cooling pipe 2, are respectively communicated with header passages
31 which are formed in the refrigerant headers 3.
[0116] A plurality of cooling pipes 2 are held in the perpendicular
direction W, which is perpendicular to the laminating direction D
of the cooling pipes 2 and also perpendicular to the passage
forming direction L of the refrigerant passage 21, under the
condition that the electronic parts 5 are interposed between the
cooling pipes being arranged in a line.
[0117] Referring to FIGS. 1 to 5, the lamination-type cooler 1 of
this embodiment will be described in detail as follows.
[0118] FIG. 2 is a schematic plan view showing an arrangement of
electronic parts 4 in the cooling pipe 2 of the lamination-type
cooler 1. FIGS. 3 and 4 are schematic sectional views showing the
cooling pipes 2 and the electronic parts 4 with respect to a
section perpendicular to the passage forming direction L in the
lamination-type cooler 1. FIG. 5 is a schematic sectional view
showing the cooling pipes 2 and the electronic parts 4 with respect
to a section parallel with the passage forming direction L in the
lamination-type cooler 1.
[0119] As shown in FIGS. 2 and 3, the cooling pipes 2 have
arrangement spaces 20 in which the electronic parts 4 are arranged
in a line in the perpendicular direction W. In this embodiment,
between the cooling pipes 2, two electronic parts 4 are interposed
in such a manner that the electronic parts 4 are arranged in a line
in the perpendicular direction W. When the electronic parts 4 are
interposed between the cooling pipes 2, both sides of the
electronic parts 4 come into contact with the cooling pipes 2.
[0120] The lamination-type cooler 1 of this embodiment is used for
an automobile. The electronic parts 4 of this embodiment compose a
portion of an inverter for automobile use, that is, the electronic
parts 4 of this embodiment are semiconductor modules into which
IGBTs (electric power switching elements) 41 and FWDs (diode
elements) 42 are incorporated. A cross section of each electronic
part 4 is formed into a flat shape, and an overall shape of the
electronic part 4 is formed into a rectangle, along the long side
of which IGBTs 41 and FWD 42 are arranged.
[0121] Each electronic part 4 is arranged in such a manner that an
arrangement portion of IGBT 41 is located on the upstream side of
the refrigerant 5 in the passage forming direction L and an
arrangement portion of FWD 42 is located on the downstream
side.
[0122] The electronic part 4 of this embodiment is directly
contacted with the cooling pipe 2. Except for the direct contact of
the electronic part 4 with the cooling pipe 2, the electronic part
4 can be contacted with the cooling pipe 2 via insulating material
such as a ceramic plate or heat conductive grease.
[0123] As shown in FIG. 3, the cooling pipe 2 has a flat cross
section which is formed flat in the laminating direction D. This
cooling pipe 2 is composed in such a manner that a pair of outside
plates 24, which are formed bent, are joined to each other and
compose an outer portion of the cooling pipe. An intermediate plate
25 is interposed between the pair of outside plates 24. Between
each outside plate 24 and the intermediate plate 25, an inner fin
26 is arranged, wherein a cross section of the inner fin 26 in a
direction perpendicular to the passage forming direction of the
cooling pipe 2 is formed into a wave-form shape.
[0124] The refrigerant passage 21 in the cooling pipe 2 is formed
in such a manner that the passage formed between the outside plates
24 and the intermediate plate 25 is partitioned into a plurality of
passages by the wave-form shape portions of the inner fin 26.
[0125] As shown in FIGS. 4 and 5, the cooling pipe 2 has protruding
pipe portions 23 which are formed in such a manner that portions of
the outside plate 24 at both end portions of the cooling pipe 2 in
the passage forming direction L are protruded and deformed in the
laminating direction D. These protruding pipe portions 23 are
formed toward both sides in the laminating direction D. Each
protruding pipe portion 23 includes: an inside protruding pipe
portion 23A formed on one side in the laminating direction D; and
an outside protruding pipe portion 23B formed on the other side in
the laminating direction D. The inside protruding pipe portion 23A
is formed into a shape which can be engaged with an end portion of
the outside protruding pipe portion 23B.
[0126] The refrigerant header 3 of this embodiment is formed when
the inside protruding pipe portion 23A, which is formed in the
cooling pipe 2, is engaged with the outside protruding pipe portion
23B which is formed in the cooling pipe 2 adjacent to the
aforementioned cooling pipe 2.
[0127] The lamination-type cooler 1 of this embodiment includes a
large number of cooling pipes 2 which are laminated on and fixed to
each other. The inside protruding pipe portion 23A of each cooling
pipe 2 is engaged with the outside protruding pipe portion 23B of
the cooling pipe 2 adjacent to the aforementioned cooling pipe 2,
so that the refrigerant header 3 can be composed.
[0128] As shown in FIG. 1, one of the pair of refrigerant header 3
is a supply side refrigerant header 3A for supplying the
refrigerant 5 to the plurality of cooling pipes 2, and the other of
the pair of refrigerant header 3 is a discharge side refrigerant
header 3B for discharging the refrigerant 5 from the plurality of
cooling pipes 2.
[0129] When the lamination-type cooler 1 is arranged in an
automobile, the supply side refrigerant header 3A is connected to a
supply side pipe of the refrigerant supply source, and the
discharge side refrigerant header 3B is connected to a return side
pipe of the refrigerant supply source.
[0130] In one side end portion cooling pipe 2X, which is laminated
at the end on one side of the plurality of cooling pipes 2, the
protruding pipe portions 23 compose a refrigerant inlet portion 32
in the supply side refrigerant header 3A and a refrigerant outlet
portion 33 in the discharge side refrigerant header 3B. In the
other side end portion cooling pipe 2Y laminated at the end on the
other side of the plurality of cooling pipes 2, the protruding pipe
portion 23 is formed at only one side in the laminating direction
D.
[0131] The lamination-type cooler 1 of this embodiment is assembled
as follows. First, a plurality of cooling pipes 2 are connected to
each other by the protruding pipe portions 23 so as to compose a
temporarily assembled body. Next, the electronic parts 4 are
arranged between the cooling pipes 2 in the temporarily assembled
body. Then, the cooling pipes 2, which are located at both end
portions in the laminating direction D, are pressed, that is, all
the cooling pipes 2 are pressed so that they can be compressed in
the laminating direction D. At this time, a diaphragm portion 231
located at a root portion of the outside protruding pipe portion
23B of each cooling pipe 2 is deformed, and the inside protruding
pipe portion 23A and the outside protruding pipe portion 23B are
engaged with each other. In this way, surfaces (both faces of the
heat generating body) of each electronic part 4 can be closely
contacted with a surface of each cooling pipe 2. In this way, the
lamination-type cooler 1 can be formed in which a plurality of
electronic parts 4 are interposed between the cooling pipe 2.
[0132] The electronic parts 4 are cooled by the above
lamination-type cooler 1 as follows.
[0133] At the time of cooling, the refrigerant 5 is supplied from
the supply side pipe of the refrigerant supply source to the supply
side header 3A. Then, the refrigerant 5 flows from the header
passage 31 of the supply side refrigerant header 3A into the
refrigerant passage 21 of each cooling pipe 2. When this
refrigerant 5 flows in each refrigerant passage 21, heat exchange
is conducted between the refrigerant 5 and each electronic part 4
so that the electronic part 4 can be cooled. After that, the
refrigerant 5, the temperature of which is raised by this heat
exchange, flows from each refrigerant passage 21 into the header
passage 31 of the discharge side refrigerant header 3B. The
refrigerant 5 is returned from the discharge side refrigerant
header 3B to the return side pipe of the refrigerant supply
source.
[0134] As described above, the cooling pipe 2 in the
lamination-type cooler 1 of this embodiment holds two electronic
parts 4 in such a manner that the electronic parts 4 are arranged
in a line in the perpendicular direction W. It is sufficient that
the cooling pipe 2 has an arrangement space 20, in which one
electronic part 4 is accommodated, in the passage forming direction
L. Therefore, the sizes of the cooling pipe 2 and the
lamination-type cooler 1 in the passage forming direction L can be
maintained small. Concerning the cooling pipe 2, it is possible to
arrange two electronic parts 4 in the perpendicular direction W.
Therefore, it is unnecessary that the number of lamination layers
of the cooling pipe 2 is increased in order to hold a large number
of electronic parts 4. Accordingly, the size of the lamination-type
cooler 1 in the laminating direction D can be maintained small.
[0135] When two electronic parts 4 are interposed between the
cooling pipes 2 being arranged in a line in the perpendicular
direction W, distances between a plurality of electronic parts 4,
which are interposed between the cooling pipes 2, from the
refrigerant header 3A can be made to be substantially equal to each
other. Therefore, the refrigerant 5 supplied to the cooling pipes 2
from the supply side refrigerant header 3A can substantially
uniformly cool the electronic parts 4 interposed between the
cooling pipes 2.
[0136] Therefore, according to the lamination-type cooler 1 of this
embodiment, it is possible to maintain the sizes in the passage
forming direction L and the laminating direction D small, and it is
possible to hold a large number of electronic parts 4 while the
cooling performance is maintained high.
[0137] In this connection, in the cooling pipe 2, the refrigerant
5, the temperature of which is low, flows at a high flow velocity
in a portion close to the center of the cross section of the
cooling pipe 2 perpendicular to the passage forming direction L,
and the refrigerant 5, the temperature of which is high because the
refrigerant 5 has received heat from the electronic part 4, flows
at a low flow velocity. On the downstream side of the cooling pipe
2, the refrigerant 5 of high temperature flows in a wide range.
Therefore, when a length of the cooling pipe 2 in the passage
forming direction L is extended, there is a possibility that the
electronic parts 4 can not be sufficiently cooled in a portion on
the downstream side of the cooling pipe 2.
[0138] On the other hand, in the case of the cooling pipe 2 of this
embodiment, only one electronic part 4 is arranged in the passage
forming direction L. Further, the total length L0 (shown in FIG. 2)
in the passage forming direction L of the cooling pipe 2 of this
embodiment is 100 mm which is small. Therefore, it is possible to
extend a range, in which the refrigerant 5 of low temperature
flows, on a cross section perpendicular to the passage forming
direction L of the cooling pipe 2. Accordingly, the cooling effect
of cooling the refrigerant by the lamination-type cooler 1 can be
maintained high.
[0139] As the size of each cooling pipe 2 in the passage forming
direction L is small, it is possible to reduce a distance between a
pair of refrigerant headers 3. Therefore, a mechanical strength of
the lamination-type cooler 1 can be enhanced.
[0140] Embodiment 2 will be explained below. In this embodiment,
the pitch P of the wave-form shape of the inner fin 26 of the
cooling pipe 2 is made to be different in each portion as shown in
FIG. 6.
[0141] In this embodiment, as shown in FIG. 7, concerning the two
electronic parts 4 interposed between the cooling pipes 2, two IGBT
41 are incorporated into one electronic part and two FWD 42 41 are
incorporated into the other electronic part. A quantity of heat
generation of the first electronic part 4A, into which IGBT 41 is
incorporated, is larger than that of the second electronic part 4B,
into which FWD 42 is incorporated.
[0142] As shown in FIG. 6, in the cooling pipe 2, the inner fin 26
is formed while the pitch P of the wave-form shape is changing
stepwise. That is, the pitch P of the wave-form shape of the inner
fin 26 of this embodiment changes substantially stepwise from one
end to the other end in the perpendicular direction W.
[0143] In the inner fin 26, from an end portion on the arrangement
space 20 side in which the first electronic part 4A having IGBT 41
is arranged, a small pitch wave-form portion 261, the wave-form
shape pitch P of which is the smallest, a middle pitch wave-form
portion 262 and a large pitch wave-form portion, the wave-form
shape pitch P of which is the largest, are formed in order in the
perpendicular direction W. In the inner fin 26, a heat transfer
area of the small pitch wave-form portion 261 is the largest, a
heat transfer area of the large pitch wave-form portion 263 is the
smallest, and a heat transfer area of the middle pitch wave-form
portion 262 is intermediate between them.
[0144] In this embodiment, when the pitch P of the wave-form shape
of the inner fin 26 is made to be different in each portion, the
heat transfer performance of the cooling pipe 2 can be made to be
different in each portion in the perpendicular direction W.
[0145] When the small pitch wave-form portion 261 and the middle
pitch wave-form portion 262 are opposed to the first electronic
part 4A, the amount of heat generation of which is large, the first
electronic part 4A can be effectively cooled. Therefore, the
cooling efficiency of the entire electronic parts 4 can be
enhanced.
[0146] Other points of this embodiment are the same as those of
Embodiment 1 described before, and this embodiment can provide the
same operational effect as that of Embodiment 1 described
before.
[0147] Next, Embodiment 3 will be explained below. In this
embodiment, as shown in FIG. 8, the refrigerant passage 21 of the
cooling pipe 2 includes a plurality of divided refrigerant passage
sections 22 which are formed by dividing the refrigerant passage 21
in the perpendicular direction corresponding to the number of
arrangements of the electronic parts 4.
[0148] In this embodiment, two electronic parts 4 are interposed
between the cooling pipes 2. IGBTs 41 and FWDs 42 are incorporated
into these two electronic parts 4.
[0149] In this embodiment, the refrigerant passage 21 is divided
into two. Between the two divided refrigerant passage sections 22,
a division section 221 for dividing the two divided refrigerant
passage sections 22 is formed.
[0150] In this embodiment, in the cooling pipe 2, each electronic
part 4 can be opposed to the divided refrigerant passage 22 in
which the refrigerant flows, and a space formed between the
electronic parts 4 can be opposed to the division section 221.
Therefore, in the cooling pipe 2 of this embodiment, the
refrigerant 5 can be made to flow only in the portion opposed to
each electronic part 4. Therefore, each electronic part 4 can be
effectively cooled.
[0151] Other points of this embodiment are the same as those of
Embodiment 1 described before, and this embodiment can provide the
same operational effect as that of Embodiment 1 described
before.
[0152] Next, Embodiment 4 will be explained below. In this
embodiment, as shown in FIG. 9, in the two divided refrigerant
passage sections 22 shown in Embodiment 3, the pitch P of the
wave-form shape of the inner fin 26 of the second divided
refrigerant passage section 22B is larger than the pitch P of the
wave-form shape of the inner fin 26 of the first divided
refrigerant passage section 22A.
[0153] That is, the first divided refrigerant passage section 22A
includes the first inner fin 26A having a short pitch wave portion
261, and the second divided refrigerant passage section 22B
includes the second inner fin 26B having a long pitch wave portion
263. A heat transfer area in the first divided refrigerant passage
section 22A is larger then a heat transfer area in the second
divided refrigerant passage section 22B.
[0154] Concerning the two electronic parts 4 in this embodiment,
one of the two electronic parts 4 has two IGBTs 41, and the other
has two FWDs 42. A quantity of heat generation of the first
electronic part 4A, into which IGBT 41 is incorporated, is larger
than the amount of heat generation of the second electronic part
4B, into which FWD 42 is incorporated.
[0155] In this embodiment, the first divided refrigerant passage
section 22A is opposed to the first electronic part 4A, the amount
of heat generation of which is larger, and the second divided
refrigerant passage section 22B is opposed to the second electronic
part 4B. Therefore, the first electronic part 4A can be effectively
cooled, and the cooling efficiency of the entire electronic parts 4
can be enhanced.
[0156] Other points of this embodiment are the same as those of
Embodiment 3 described before, and this embodiment can provide the
same operational effect as that of Embodiment 3 described
before.
[0157] Next, Embodiment 5 will be explained below. In this
embodiment, as shown in FIG. 10, in the lamination-type cooler 1,
two supply side refrigerant headers 3A, which are in the pair of
refrigerant headers 3 described before, are arranged corresponding
to the two divided refrigerant passage sections 22 shown in
Embodiment 3 described above.
[0158] In this embodiment, in the lamination-type cooler 1, two
discharge side refrigerant headers 3B are also arranged
corresponding to the two divided refrigerant passage sections
22.
[0159] In this embodiment, the header passage 31 of one supply side
refrigerant header 3A is communicated with one divided refrigerant
passage section 22, and the header passage 31 of the other supply
side refrigerant header 3A is communicated with the other divided
refrigerant passage section 22. Due to this structure, the divided
refrigerant passage sections 22 can be separately supplied with the
refrigerant 5 via the supply side refrigerant headers 3A.
Therefore, flow velocities of the refrigerant 5 in the header
passages 31 in the supply side refrigerant headers 3A can be made
different from each other, and the cooling performance of the
divided refrigerant passage sections 22 can be made different from
each other.
[0160] In this connection, concerning the supply side refrigerant
header 3A and the discharge side refrigerant header 3B, a plurality
of headers can be arranged in the lamination-type cooler 1 when the
header passage 31 is formed being divided according to the division
number of the divided refrigerant passages sections 22.
[0161] Other points of this embodiment are the same as those of
Embodiment 3 described before, and this embodiment can provide the
same operational effect as that of Embodiment 3 described
before.
[0162] Next, Embodiment 6 will be explained below. In this
embodiment, as shown in FIG. 11, the supply side refrigerant header
3A and the discharge side refrigerant header 3B are respectively
separately communicated with the two divided refrigerant passage
sections 22 (the two divided refrigerant passage sections 22, the
wave-form shape pitches P in the inner fins 26 of which are
different from each other) shown in Embodiment 4 described
before.
[0163] Concerning the two electronic parts 4 in this embodiment,
two IGBTs 41 are incorporated into the first electronic part 4A,
and two FWDs 42 are incorporated into the second electronic part
4B. The first divided refrigerant passage section 22A, in which the
first inner fin 26A having the small pitch wave-form section 261 is
arranged, is opposed to the first electronic part 4A, the amount of
heat generation of which is large, and the second divided
refrigerant passage section 22B, in which the second inner fin 26B
having the large pitch wave-form section 263 is arranged, is
opposed to the second electronic part 4B, the amount of heat
generation of which is small.
[0164] In this embodiment flow rates of the refrigerant 5 to be
supplied to the supply side refrigerant headers 3A can be easily
made to be different from each other. Therefore, when the flow rate
of the refrigerant 5 supplied to the first divided refrigerant
passage sections 22A, the heat transfer area of which is large, is
made to be higher than the flow rate of the refrigerant 5 supplied
to the second divided refrigerant passage sections 22B, the heat
transfer area of which is small, so that the first electronic part
4A arranged in the first divided refrigerant passage section 22A
can be effectively cooled.
[0165] Other points of this embodiment are the same as those of
Embodiment 4 described before, and this embodiment can provide the
same operational effect as that of Embodiment 4 described
before.
[0166] Next, Embodiment 7 will be explained below. In this
embodiment, as shown in FIG. 12, sectional passage areas of the two
supply side refrigerant headers 3A shown in Embodiment 5 described
before are made to be different from each other.
[0167] In this embodiment, sectional passage areas of the two
discharge side refrigerant headers 3B are made to be different from
each other. In the two divided refrigerant passage sections 22, the
inner fins 26, the pitches P of the wave-form shapes of which are
the same, are respectively arranged.
[0168] Concerning the two electronic parts 4 in this embodiment,
two IGBT 41 are incorporated into the first electronic part 4A, and
two FWD 42 are incorporated into the second electronic part 4B.
[0169] A header passage 31 of the first supply side refrigerant
header 3A.sub.a, the sectional passage area of which is large, and
a header passage 31 of the first discharge side refrigerant header
3B.sub.a are communicated with one divided refrigerant passage
section 22 which is opposed to the first electronic part 4A, the
amount of heat generation of which is large. A header passage 31 of
the second discharge side refrigerant header 3A.sub.b, the
sectional passage area of which is small, and a header passage 31
of the second discharge side refrigerant header 3B.sub.b are
communicated with the other divided refrigerant passage section 22
which is opposed to the second electronic part 4B, the amount of
heat generation of which is small.
[0170] In this embodiment, flow rates of the refrigerant 5 to be
supplied to the supply side refrigerant headers 3A can be easily
made to be different from each other. Therefore, the flow rate of
the refrigerant 5 supplied to one divided refrigerant passage
section 22 opposed to the first electronic part 4A, the amount of
heat generation of which is large, is made larger than the flow
rate of the refrigerant 5 supplied to the other divided refrigerant
passage section 22 opposed to the second electronic part 4B, the
amount of heat generation of which is small, so that the first
electronic part 4A can be effectively cooled.
[0171] Other points of this embodiment are the same as those of
Embodiment 5 described before, and this embodiment can provide the
same operational effect as that of Embodiment 5 described
before.
[0172] Next, Embodiment 8 will be explained below. In this
embodiment, as shown in FIG. 13, the header passages 31 to the
first supply side refrigerant header 3A.sub.a and the second supply
side refrigerant header 3A.sub.b respectively shown in Embodiment 7
(the two supply side refrigerant headers 3A.sub.a, 3A.sub.b, the
sectional passage areas of which are different from each other) are
communicated with the first divided refrigerant passage section 22A
and the second divided refrigerant passage section 22B (the two
divided refrigerant passage sections 22, the wave-form shape
pitches P in the inner fins 26 of which are different from each
other) shown in Embodiment 4 described before.
[0173] In this embodiment, the refrigerant 5 is supplied from the
first supply side refrigerant header 3A.sub.a to the first divided
refrigerant passage section 22A opposed to the first electronic
part 4A into which two IGBT 41 are incorporated, and the
refrigerant 5 is supplied from the second supply side refrigerant
header 3A.sub.b to the second divided refrigerant passage section
22B opposed to the second electronic part 4B into which two FWD 42
are incorporated. Therefore, the first electronic part 4A, the
amount of heat generation of which is large, can be effectively
cooled by the first supply side refrigerant header 3A.sub.a, the
cross sectional area of the header passage 31 of which is
large.
[0174] Other points of this embodiment are the same as those of
Embodiments 4 and 7 described before, and this embodiment can
provide the same operational effect as that of Embodiments 4 and 7
described before.
[0175] Next, Embodiment 9 will be explained below. As shown in FIG.
14, in this embodiment, one refrigerant introducing pipe 34 is
branched into two supply side refrigerant headers 3A.
[0176] In this embodiment, one refrigerant discharge pipe 35 is
branched into two discharge side refrigerant headers 3B. The
cooling pipe 2 of this embodiment includes two divided refrigerant
passage section 22. The supply side refrigerant header 3A and the
discharge side refrigerant header 3B are respectively communicated
with the divided refrigerant passage sections 22.
[0177] The refrigerant introducing pipe 34 and the refrigerant
discharge pipe 35 of this embodiment are formed out of the
protruding pipe portion 23 protruded from one side end portion
cooling pipe 2 laminated at the end on side in the plurality of
cooling pipes 2.
[0178] The refrigerant 5 supplied to the divided refrigerant
passage section 22 in the plurality of cooling pipes 2 can flow
from one refrigerant introducing pipe 34 to two supply side
refrigerant headers 3A. The refrigerant 5, which has flowed in the
divided refrigerant passage section 22 in the plurality of cooling
pipes 2, can flow from the two discharge side refrigerant header 3B
to one refrigerant discharge pipe 35 joined to each other.
[0179] In this embodiment, when one refrigerant introducing pipe 34
is connected to a supply side pipe of the refrigerant supply source
which is arranged outside the lamination-type cooler 1, the
refrigerant 5 can be supplied to the supply side refrigerant
headers 3A. When one refrigerant discharge pipe 35 is connected to
a return side pipe of the refrigerant supply source which is
arranged outside the lamination-type cooler 1, the refrigerant 5
can be returned from the discharge side refrigerant header 3B to
the refrigerant supply source.
[0180] Therefore, the plurality of supply side refrigerant headers
3A and discharge side refrigerant headers 3B can be arranged in the
lamination-type cooler 1 without deteriorating the connection
property (the mounting property of mounting the lamination-type
cooler 1) to the refrigerant supply source.
[0181] Other points of this embodiment are the same as those of
Embodiment 1 described before, and this embodiment can provide the
same operational effect as that of Embodiment 1 described
before.
[0182] Next, Embodiment 10 will be explained below. As shown in
FIG. 15, in this embodiment, a direction of the lamination-type
cooler 1 is devised at the time of arranging the lamination-type
cooler 1 in an automobile.
[0183] The lamination-type cooler 1 of this embodiment is arranged
in an automobile as follows. The passage forming direction L is
directed to the gravity direction (the perpendicular direction),
and the supply side refrigerant header 3A, which is in a pair of
refrigerant headers 3, is directed upward in the perpendicular
direction.
[0184] In this embodiment, the refrigerant 5 can be made to flow in
the direction of gravity in each cooling pipe 2. Therefore, it is
possible to effectively prevent air from staying in each cooling
pipe 2.
[0185] Other points of this embodiment are the same as those of
Embodiment 1 described before, and this embodiment can provide the
same operational effect as that of Embodiment 1 described
before.
[0186] In this connection, although not shown in the drawing, the
first electronic part 4A, into which two IGBTs 41 shown in
Embodiments 2, 4, 6, 7 and 8 are incorporated, and the second
electronic part 4B, into which two FWDs 42 are incorporated, can be
integrated with each other into one body by various semiconductor
package materials. Two electronic parts 4 shown in Embodiments 1, 3
and 5, into which IGBTs 41 and FWDs 42 are incorporated, can be
also integrated with each other into one body by various
semiconductor package materials.
[0187] Next, a Comparative Example will be explained below. This
Comparative Example is shown for reference. As shown in FIGS. 16
and 17, in the lamination-type cooler 1Z, a plurality of electronic
parts 4 (two electronic parts in this example) are interposed
between the cooling pipes in the passage forming direction L of the
cooling pipes 2Z.
[0188] In this Comparative Example, distances between the two
electronic parts 4, which are interposed between the cooling pipes
2Z, from the supply side refrigerant header 3A are different from
each other. Therefore, when the refrigerant 5 is supplied from the
supply side refrigerant header 3A to the cooling pipes 2Z, the
first electronic part 4A, which is located on the upstream side in
the passage forming direction L of the cooling pipe 2Z, can be
effectively cooled by the refrigerant 5 of low temperature. On the
other hand, the second electronic part 4B, which is located on the
downstream side in the passage forming direction L of the cooling
pipe 2Z, is cooled by the refrigerant 5, the temperature of which
has been raised. Therefore, it is difficult to sufficiently cool
the second electronic part 4B. Therefore, in this Comparative
Example, it is difficult for the refrigerant 5, which has been
supplied from the supply side header 93A into the cooling pipes 2,
to uniformly cool the electronic parts interposed between the
cooling pipes 2.
[0189] It is possible to consider an arrangement in which a
plurality of electronic parts 4 are arranged in the passage forming
direction L so as to increase the number of the electronic parts 4
to be held in the lamination-type cooler 1Z as described above.
However, it should be understood that it is difficult to uniformly
cool the electronic parts 4 by this structure.
[0190] Therefore, as shown in Embodiments 1 to 10, when a plurality
of electronic parts 4 are interposed between the cooling pipes 2
being formed into a line in the perpendicular direction, it is
possible to hold a large number of electronic parts 4 while the
cooling performance is maintained high.
[0191] Next, Embodiment 11 will be explained below. As shown in
FIGS. 18 to 22, in the lamination-type cooler 1 of this embodiment,
the electronic parts 4 are cooled from both sides. Therefore, the
lamination-type cooler 1 includes a plurality of cooling pipes 2
for holding and cooling the electronic parts 4. The plurality of
cooling pipes 2 are laminated and fixed by the refrigerant supply
header 3A for supplying the refrigerant 5 to the plurality of
cooling pipes 2 and by the refrigerant discharge header 3B for
discharging the refrigerant 5 from the plurality of cooling pipes
2.
[0192] The refrigerant discharge headers 3B are respectively
arranged at both end portions of the plurality of cooling pipes 2
in the refrigerant flowing direction L. The refrigerant supply
header 3A is arranged in a central portion which is an intermediate
portion located between both end portions of the plurality of
cooling pipes 2 in the refrigerant flowing direction L. The
plurality of cooling pipes 2 are arranged so that the electronic
parts 4 can be interposed between the plurality of cooling pipes 2
at positions between the refrigerant supply header 3A and the
refrigerant discharge header 3B in the refrigerant flowing
direction L.
[0193] Referring to FIGS. 18 to 11, the lamination-type cooler 1 of
this embodiment will be explained in detail below.
[0194] In this case, FIG. 19 is a schematic plan view showing an
arrangement of electronic parts 4 in a cooling pipe 2 of the
lamination-type cooler 1. FIGS. 20 and 21 are sectional schematic
illustrations showing a cross section perpendicular to the
refrigerant flowing direction L in the lamination-type cooler 1
with respect to some of the cooling pipe 2 and the electronic parts
4. FIG. 22 is a sectional schematic illustration showing a cross
section parallel with the refrigerant flowing direction L in the
lamination-type cooler 1 with respect to some of the cooling pipe 2
and the electronic parts 4.
[0195] As shown in FIGS. 19 and 20, the cooling pipe 2 has a space
20 in which a plurality of electronic parts 4 are arranged in the
refrigerant flowing direction L. In this embodiment, between the
cooling pipes 2, two electronic parts 4 are interposed being
arranged in the refrigerant flowing direction L. Two electronic
parts 4 are arranged in the arrangement space 20 of the cooling
pipe 2 in the direction L being arranged in a line. When the
electronic parts 4 are interposed between the cooling pipes 2, both
sides of the electronic parts 4 come into contact with the cooling
pipes 2.
[0196] In each cooling pipe 2 of this embodiment, the refrigerant
supply header 3A is arranged in the central portion in the
refrigerant flowing direction L. One electronic part 4 is held on
each side of the refrigerant supply header 3A in the refrigerant
flowing direction L. Due to this structure, distances between the
electronic parts 4, which are interposed between the cooling pipes
2, from the refrigerant supply header 3A in the refrigerant flowing
direction L can be the same. Further, distances between the
electronic parts 4, which are interposed between the cooling pipes
2, from the refrigerant discharge header 3B in the refrigerant
flowing direction L can be the same.
[0197] The lamination-type cooler 1 of this embodiment is used for
an automobile. The electronic part 4 of this embodiment composes a
portion of the inverter for automobile use. The electronic part 4
of this embodiment is a semiconductor module into which IGBTs
(electric power switching elements) 41 and FWDs (diode elements) 42
are incorporated. This electronic part 4 has a flat cross section.
This electronic part 4 is formed into a rectangle, along the long
side of which IGBT 41 and FWD 42 are arranged.
[0198] In the arrangement space 20 of each cooling pipe 2, each
electronic part 4 is arranged so that which IGBTs 41 and FWDs 42
can be arranged.
[0199] In this connection, as shown in FIG. 19, each electronic
part 4 can be arranged in each cooling pipe 2 as follows. IGBT 41
is located on the upstream side (the side close to the refrigerant
supply header 3A) of the flow of the refrigerant 5 in the
refrigerant flowing direction L, and FWD 42 is located on the
downstream side (the side close to the refrigerant discharge header
3B) of the flow of the refrigerant 5 in the refrigerant flowing
direction L.
[0200] In this embodiment, each electronic part 4 is directly
contacted with the cooling pipe 2. Except for that, the electronic
part 4 can be contacted with the cooling pipe 2 via insulating
material (ceramic plate) or heat conductive grease.
[0201] As shown in FIG. 20, the cooling pipe 2 has a flat cross
section which is formed flat in the laminating direction D of a
plurality of cooling pipes 2. In the cooling pipe 2, the
refrigerant passage 21, in which the refrigerant 5 flows, is formed
in the refrigerant flowing direction L. An outline portion of the
pipe is formed in such a manner that a pair of outside plates 24,
which are bent, are joined to each other. An intermediate plate 25
is interposed between the pair of outside plates 24. Between the
outside plate 24 and the intermediate plate 25, an inner fin 26 is
arranged, the cross section perpendicular to the refrigerant
flowing direction L of which is formed into a wave-form shape.
[0202] The refrigerant passage 21 in the cooling pipe 2 is formed
between the outside plate 24 and the intermediate plate 25 being
partitioned into a plurality of portions by the wave-form shape
portion of the inner fin.
[0203] As shown in FIGS. 21 and 22, at both end portions and the
central portion of the cooling pipe 2 in the refrigerant flowing
direction L, the protruding pipe portions 23 are provided which are
formed in such a manner that a portion of the outside plate 24 is
protruded and deformed in the laminating direction D. These
protruding pipe portions 23 are formed being directed to both sides
of the laminating direction D. These protruding pipe portions 23
include: an inside protruding pipe portion 23A formed on one side
of the laminating direction D; and an outside protruding pipe
portion 23B formed on the other side of the laminating direction D.
The inside protruding pipe portion 23A is formed into a shape which
can be engaged into an end portion of the outside protruding pipe
portion 23B.
[0204] The refrigerant supply header 3A and the refrigerant
discharge header 3B of this embodiment are formed when the inside
protruding pipe portion 23A formed in any cooling pipe 2 and the
outside protruding pipe portion 23B formed in the cooling pipe 2
adjacent to any cooling pipe 2 are engaged with each other.
[0205] In the lamination-type cooler 1 of this embodiment, a large
number of cooling pipes 2 are laminated on and fixed to each other.
The inside protruding pipe portion 23A of each cooling pipe 2 is
engaged with the outside protruding pipe portion 23B of the cooling
pipe 2 adjacent to it, so that the refrigerant supply header 3A and
the refrigerant discharge header 3B can be composed.
[0206] When the lamination-type cooler 1 is arranged in an
automobile, the refrigerant supply header 3A is connected to a
supply side pipe of the refrigerant supply source, and the
refrigerant discharge header 3B is connected to a return side pipe
of the refrigerant supply source.
[0207] As shown in FIG. 18, in one side end portion cooling pipe 2X
which is laminated at the end portion on one side, the refrigerant
inlet portion 32, which is an inlet of the refrigerant 5 to the
refrigerant supply header 3A, and the refrigerant outlet portion
33, which is an outlet of the refrigerant 5 from the refrigerant
discharge header 3B, are formed out of the protruding pipe portions
23. The lamination-type cooler 1 of this embodiment includes: one
refrigerant inlet portion 32; and two refrigerant outlet portions
33. In the other side end portion cooling pipe 2Y in the plurality
of cooling pipes 2 laminated at the end portion on the other side,
the protruding pipe portion 23 is formed only onto one side of the
laminating direction D.
[0208] As shown in FIG. 22, in the refrigerant supply header 3A and
the refrigerant discharge header 3B, the header passages 31, in
which the refrigerant 5 flows, are formed. The header passages 31
in the refrigerant supply header 3A and the refrigerant discharge
header 3B are communicated with the refrigerant passages 21 in all
the cooling pipes 2.
[0209] The lamination-type cooler 1 of this embodiment is assembled
as follows. First of all, a plurality of cooling pipes 2 are
connected to each other by the protruding pipe portions 23 so as to
form a temporarily assembled body. Next, the electronic parts 4 are
arranged between the cooling pipes 2 of the temporarily assembled
body. Then, the temporarily assembled body is pressed from one side
end portion cooling pipe 2X and the other side end portion cooling
pipe 2Y which are respectively located at both end portions in the
laminating direction D, and all the cooling pipes 2 are compressed
in the laminating direction D. At this time, a diaphragm portion
231 located at the root portion of the outside protruding pipe
portion 23B of each cooling pipe 2 is deformed, and the inside
protruding pipe portion 23A and the outside protruding pipe portion
23B are engaged with each other. In this way, surfaces (both sides
of the heat generating face) of the electronic parts 4 can be
closely contacted with the surfaces of the cooling pipes 2, and the
lamination-type cooler 1 can be composed, between the cooling pipes
2 of which a plurality of electronic parts 4 are interposed.
[0210] In the lamination-type cooler 1, the electronic parts 4 are
cooled as follows.
[0211] At the time of cooling, the refrigerant 5 is supplied from
the supply side pipe of the refrigerant supply source to the
refrigerant supply header 3A via the refrigerant inlet portion 32.
The refrigerant 5 flows into the refrigerant passage 21 of each
cooling pipe 2 from the header passage 31 of the refrigerant supply
header 3A. When this refrigerant 5 flows in each refrigerant
passage 21, heat exchange is conducted between the refrigerant 5
and each electronic part 4, so that the electronic part 4 can be
cooled. After that, the refrigerant 5, the temperature of which has
been raised by the heat exchange, flows from each refrigerant
passage 21 to the header passage 31 of the refrigerant discharge
header 3B. The refrigerator 5 is returned from this refrigerant
discharge header 3B to the return side pipe of the refrigerant
supply source via the refrigerant outlet portion 33.
[0212] As described above, in the lamination-type cooler 1 of this
embodiment, the refrigerant discharge headers 3B are respectively
arranged at both end portions in the refrigerant flowing direction
L, and the refrigerant supply header 3A is arranged at the central
portion in the refrigerant flowing direction L. The electronic
parts 4 interposed between the cooling pipes 2 are interposed
between the refrigerant supply header 3A and the refrigerant
discharge header 3B in the refrigerant flowing direction L.
Therefore, two electronic parts 4 can be interposed between the
cooling pipes 2 being arranged in the refrigerant flowing direction
L.
[0213] Due to the above structure, in the lamination-type cooler 1,
it is unnecessary to increase the number of laminations of the
cooling pipes 2 so as to hold a large number of electronic parts 4.
Accordingly, it is possible to reduce the size of the
lamination-type cooler 1 in the laminating direction D.
[0214] Due to the above structure of the refrigerant supply header
3A and the refrigerant discharge header 3B, the distances between
the electronic parts 4, which are interposed between the cooling
pipes 2, and the refrigerant supply header 3A and the refrigerant
discharge header 3B, can be made substantially the same. Therefore,
the refrigerant 5, which has been supplied from the refrigerant
supply header 3A to the cooling pipes 2, can flow from the
intermediate portion of the refrigerant flowing direction L to both
end portions being branched. Due to the foregoing, the electronic
parts interposed between the cooling pipes 2 can be substantially
uniformly cooled.
[0215] Therefore, according to the lamination-type cooler 1 of this
embodiment, it is possible to maintain the size of the laminating
direction D small. Further, while the cooling performance is
maintained high, a large number of electronic parts 4 can be
held.
[0216] In this connection, in the cooling pipe 2, the refrigerant
5, the temperature of which is low, flows at a high flow velocity
in a portion close to the center of the cross section of the
cooling pipe 2 perpendicular to the refrigerant flowing direction
L, and the refrigerant 5, the temperature of which is high because
the refrigerant 5 has received heat from the electronic part 4,
flows at a low flow velocity. On the downstream side of the cooling
pipe 2, the refrigerant 5 of high temperature flows in a wide
range. Therefore, when a length of the cooling pipe 2 in the
refrigerant flowing direction L is extended, there is a possibility
that the electronic parts 4 can not be sufficiently cooled in a
portion on the downstream side of the cooling pipe 2.
[0217] In the cooling pipe 2 of this embodiment, the refrigerant
supply header 3A is arranged in the central portion in the
refrigerant flowing direction, so that a distance from the
refrigerant supply header 3A to each electronic part 4 can be
reduced. Therefore, on a cross section perpendicular to the
refrigerant flowing direction L of the cooling pipe 2, it is
possible to extend a range in which the refrigerant 5 of low
temperature flows. Accordingly, the cooling effect obtained by the
lamination-type cooler 1 can be maintained high.
[0218] As the refrigerant supply header 3A is arranged in the
central portion in the refrigerant flowing direction L, it is
possible to reduce a distance between the refrigerant supply header
3A, by which the cooling pipes 2 are laminated and fixed, and the
refrigerant discharge header 3B. Therefore, it is possible to
enhance a mechanical strength of the lamination-type cooler 1.
[0219] As described above, in the lamination-type cooler 1 of this
embodiment, the refrigerant discharge headers 3B are arranged at
both end portions of the cooling pipes 2 in the refrigerant flowing
direction L, and the refrigerant supply header 3A is arranged in
the central portion of the cooling pipes 2 in the refrigerant
flowing direction L. Further, in one side end portion cooling pipe
2X, the refrigerant inlet portion 32 in the refrigerant supply
header 3A and the refrigerant outlet portion 33 in the refrigerant
discharge header 3B are formed. Except for that, the
lamination-type cooler 1 can be variously composed and the same
operational effect as that Embodiment 1 described before can be
provided.
[0220] That is, the lamination-type cooler 1 can be composed as
follows. As shown in FIG. 23, the refrigerant supply headers 3A are
arranged at both end portions of the cooling pipes 2 in the
refrigerant flowing direction L, and the refrigerant discharge
header 3B is arranged in the central portion of the cooling pipes 2
in the refrigerant flowing direction L. In one side end portion
cooling pipe 2X, the refrigerant inlet portion 32 in the
refrigerant supply header 3A and the refrigerant outlet portion 33
in the refrigerant discharge header 3B can be formed.
[0221] Further, the lamination-type cooler 1 can be composed as
follows. As shown in FIG. 24, the refrigerant discharge headers 3B
are arranged at both end portions of the cooling pipes 2 in the
refrigerant flowing direction L, and the refrigerant supply header
3A is arranged in the central portion of the cooling pipes 2 in the
refrigerant flowing direction L. In one side end portion cooling
pipe 2X, the refrigerant outlet portion 33 in the refrigerant
discharge header 3B can be formed, and in the other side end
portion cooling pipe 2Y, the refrigerant inlet portion 32 in the
refrigerant supply header 3A can be formed.
[0222] Further, the lamination-type cooler 1 can be composed as
follows. As shown in FIG. 25, the refrigerant supply headers 3A are
arranged at both end portions of the cooling pipes 2 in the
refrigerant flowing direction L, and the refrigerant discharge
header 3B is arranged in the central portion of the cooling pipes 2
in the refrigerant flowing direction L. In one side end portion
cooling pipe 2X, the refrigerant inlet portion 32 in the
refrigerant supply header 3A is formed, and in the other side end
portion cooling pipe 2Y, the refrigerant outlet portion 33 in the
refrigerant discharge header 3B can be formed.
[0223] Next, Embodiment 12 will be explained below. In this
embodiment, as shown in FIGS. 26 and 27, the overall passage
sectional area of the refrigerant supply header 3A and the overall
passage sectional area of the refrigerant discharge headers 3B are
made to be equal to each other in the lamination-type cooler 1.
[0224] The lamination-type cooler 1 of this embodiment includes:
refrigerant discharge headers 3B arranged at both end portions of
the cooling pipes 2 in the refrigerant flowing direction L; and a
refrigerant supply header 3A arranged in the central portion of the
cooling pipe 2 in the refrigerant flowing direction L.
[0225] The passage sectional area S1 of the header passage 31 of
the refrigerant supply header 3A and the passage sectional area S2
of the header passage 31 of the refrigerant discharge header 3B are
different from each other. The passage sectional area S2 of the
refrigerant discharge header 3B is half of the passage sectional
area S1 of the refrigerant supply header 3A. The overall passage
sectional area of the header passage 31 of one refrigerant supply
header 3A and the overall passage sectional area (the total passage
sectional area) of the header passage 31 of two refrigerant
discharge headers 3B are the same (S1=S2.times.2).
[0226] The electric parts 4 arranged between the cooling pipes 2
are the same. The passage sectional area S2 of the header passage
31 of one refrigerant discharge header 3B is the same as the
passage sectional area S2 of the header passage 31 of the other
refrigerant discharge header 3B.
[0227] In this embodiment, the flow rate of the refrigerant 5
supplied to each cooling pipe 2 can be made to be substantially the
same as the flow rate of the refrigerant 5 discharged from each
cooling pipe 2. Therefore, it is possible to reduce the resistance
of the refrigerant 5 flowing in each cooling pipe 2, and it is
possible to smooth the flow of the refrigerant 5 in each cooling
pipe 2.
[0228] In this embodiment, in the above one side end portion
cooling pipe 2X, the refrigerant inlet portion 32 in the
refrigerant supply header 3A and the refrigerant outlet portions 33
in the refrigerant discharge header 3B are formed. On the other
hand, in the same manner as that of Embodiment 11 described above,
the refrigerant outlet portion 33 in the refrigerant discharge
header 3B is formed in one side end portion cooling pipe 2X, and
the refrigerant inlet portion 32 in the refrigerant supply header
3A is formed in the other side end portion cooling pipe 2Y.
[0229] In this embodiment, as shown in FIG. 28, the following
structure can be adopted in the same manner as that of Embodiment
11. At both end portions of the cooling pipes 2 in the refrigerant
flowing direction L, the refrigerant supply headers 3A are
arranged, and the refrigerant discharge header 3B is arranged in
the central portion of the cooling pipes 2 in the refrigerant
flowing direction L.
[0230] It is possible to make the passage sectional area S3 of the
header passage 31 of the other refrigerant discharge header 3B
smaller than the passage sectional area S2 of the header passage 31
of one refrigerant discharge header 3B. In this case, the first
electronic part 4, the amount of heat generation of which is large,
can be arranged between the refrigerant discharge header 3B, the
passage cross sectional area S2 of which are large, and the
refrigerant supply header 3A. Further, the second electronic part
4, the amount of heat generation of which is smaller than that of
the first electronic part 4, can be arranged between the
refrigerant discharge header 3B, the passage cross sectional area
S1 of which are large, and the refrigerant supply header 3A. In
this connection, the overall passage sectional area of the header
passage 31 in one refrigerant supply header 3A can be made to be
the same as the overall passage sectional area (the total passage
sectional area) of the header passages 31 of two refrigerant
discharge headers 3B (S1=S2+S3).
[0231] Other points of this embodiment are the same as those of
Embodiment 11 described before, and this embodiment can provide the
same operational effect as that of Embodiment 11 described
before.
[0232] Next, Embodiment 13 will be explained below. The
lamination-type cooler 1 of this embodiment is composed as follows.
As shown in FIGS. 29 and 30, concerning the refrigerant supply
header 3A and the refrigerant discharge header 3B, the passage
width W1 in the perpendicular direction W, which is perpendicular
to the refrigerant flowing direction L, is made larger than the
passage width L1 in the refrigerant flowing direction L.
[0233] Two electronic parts 4 are arranged in the refrigerant
flowing direction L being interposed between a plurality of cooling
pipes 2, and the two electronic parts 4 are arranged in the
perpendicular direction W being interposed.
[0234] In this embodiment, between the cooling pipes 2, not only a
plurality of electronic parts 4 can be arranged in the refrigerant
flowing direction, and be interposed, but also a plurality of
electronic parts 4 can be arranged in the perpendicular direction
W, and be interposed. Due to this structure, it is possible to
reduce the number of laminations of the cooling pipes 2 as shown in
FIG. 29. The number of laminations of the cooling pipes 2 of this
embodiment can be reduced to a half of the number of laminations of
the cooling pipes 2 of the lamination-type cooler 1 of Embodiment
11. While the number of the electronic parts 4 to be held and the
cooling performance are maintained as they are, the size in the
laminating direction D can be reduced.
[0235] Other points of this embodiment are the same as those of
Embodiment 11 described before, and this embodiment can provide the
same operational effect as that of Embodiment 11 described
before.
[0236] Next, Embodiment 14 will be explained below. As shown in
FIGS. 31 and 32, the lamination-type cooler 1 of this embodiment
includes: one refrigerant inlet portion 32 in the refrigerant
supply header 3A; and one refrigerant outlet portion 33 in the
refrigerant discharge header 3B.
[0237] In the lamination-type cooler 1 of this embodiment, the
refrigerant header supply 3A is arranged in the central portion of
each cooling pipe 2 in the refrigerant flowing direction L, and the
refrigerant discharge headers 3B are arranged at both end portions
of each cooling pipe 2 in the refrigerant flowing direction L as
shown in Embodiments 11 to 13 described before.
[0238] The header passages 31 of the refrigerant discharge headers
3B, which are respectively arranged at both end portions of the
cooling pipes 2 in the refrigerant flowing direction, are
communicated with all the refrigerant passages 21 of a plurality of
cooling pipes 2. The header passage 31 in the refrigerant supply
header 3A, which is arranged in the central portion of the cooling
pipes 2 in the refrigerant flowing direction L, is communicated
with the refrigerant passages 21 of the cooling pipes 2 except for
one side end portion cooling pipe 2X which is laminated at the end
of the plurality of cooling pipes 2 on one side.
[0239] In the accumulation type cooler 1, the refrigerant inlet
portion 32 and the refrigerant outlet portion 33 are formed being
protruded from one side of the plurality of cooling pipes 2 in the
laminating direction D.
[0240] The header passage 31 of the refrigerant outlet portion 33
of the refrigerant discharge header 3B is communicated with (open
to) the refrigerant passage 21 of one portion side end portion
cooling pipe 2X. The refrigerant inlet portion 32 of the
refrigerant supply header 3A is extended from the refrigerant
supply header 3A communicated with the refrigerant passage 21 of
the cooling pipe 2Z adjacent to one side end portion cooling pipe
2X.
[0241] The refrigerant outlet portion 33 is arranged at a position
adjacent to the refrigerant inlet portion 32 of one side end
portion cooling pipe 2X in the refrigerant flowing direction L.
[0242] In the lamination-type cooler 1 of this embodiment, the
refrigerant 5 can be supplied and discharged by one refrigerant
inlet portion 32 and one refrigerant outlet portion 33. One
refrigerant inlet portion 32 is connected to a supply side pipe of
the refrigerant supply source, and one refrigerant outlet portion
33 is connected to a return side pipe of the refrigerant supply
source. In this way, the lamination-type cooler 1 can be arranged
in an arrangement space provided in a vehicle. Therefore, the
mounting property of mounting the lamination-type cooler 1 on the
vehicle (the connecting property of connecting the lamination-type
cooler 1 to the refrigerant supply source) can be enhanced.
[0243] In this connection, although not shown in the drawing, in
the lamination-type cooler 1 in which the refrigerant discharge
header 3B is arranged in the central portion of each cooling pipe 2
in the refrigerant flowing direction L and the refrigerant supply
headers 3A are arranged at both end portions of each cooling pipe 2
in the refrigerant flowing direction L, the header passages 31 of
the refrigerant supply headers 3A, which are respectively arranged
at both end portions of the cooling pipe in the refrigerant flowing
direction L, can be communicated with all the refrigerant passages
21 in the plurality of cooling pipes 2, and the header passage 31
of the refrigerant discharge header 3B, which is arranged at the
central portion of the cooling pipe 2 in the refrigerant flowing
direction L, can be communicated with the refrigerant passages 21
of the cooling pipes 2 except for one side end portion cooling pipe
2X.
[0244] In this connection, as shown in FIG. 33, in the
lamination-type cooler 1 of this embodiment, the refrigerant inlet
portion 32 can be formed being protruded from one side of the
lamination-type cooler 1 in the laminating direction D, and the
refrigerant outlet portion 33 can be formed being protruded from
the other side of the lamination-type cooler 1 in the laminating
direction D. In this case, the header passage 31 of the refrigerant
outlet portion 33 of the refrigerant discharge header 3B can be
communicated with (open to) the refrigerant passage 21 of one side
end portion cooling pipe 2X, and the header passage 31 of the
refrigerant inlet portion 32 of the refrigerant supply header 3A
can be communicated with (open to) the refrigerant passage 21 of
the other side end portion cooling pipe 2Y in the plurality of
cooling pipes 2 laminated at the end portion on the other side.
[0245] Finally, Comparative Example will be explained below. This
Comparative Example is shown for reference. This lamination-type
cooler 1Z is composed as follows. As shown in FIGS. 34 and 35,
between the refrigerant supply header 3A and the refrigerant
discharge header 3B which are arranged between both end portions of
the cooling pipes 2Z in the refrigerant flowing direction L, a
plurality of electronic parts 4 (two electronic parts in this
example) are interposed being arranged in the refrigerant flowing
direction L. In this Comparative Example, the refrigerant supply
header 3A and the refrigerant discharge header 3B are not arranged
in an intermediate portion of the cooling pipe 2Z in the
refrigerant flowing direction L.
[0246] In this Comparative Example, the distances between the two
electronic parts 4, which are interposed between the cooling pipes
2Z, from the refrigerant supply header 3A, are different from each
other. Therefore, when the refrigerant 5 is supplied from the
refrigerant supply header 3A to each cooling pipe 2Z, the first
electronic part 4A, which is located on the upstream side of the
cooling pipe 2Z in the refrigerant flowing direction L, can be
effectively cooled by the refrigerant 5 of low temperature. On the
other hand, the second electronic part 4B, which is located on the
downstream side of the cooling pipe 2Z in the refrigerant flowing
direction L, is cooled by the refrigerant 5 of high temperature.
Accordingly, there is a possibility that the second electronic part
4B cannot be sufficiently cooled. Therefore, in this Comparative
Example, the refrigerant 5 supplied from the refrigerant supply
header 93A to each cooling pipe 2Z cannot uniformly cool the
electronic parts 4 interposed between the cooling pipes 2Z.
[0247] As described above, in the lamination-type cooler 1Z in
which the refrigerant supply header 3A or the refrigerant discharge
header 3B is not arranged in the intermediate portion of the
cooling pipe 2Z in the refrigerant flowing direction L, it is
difficult for the electronic parts 4 to be uniformly cooled.
[0248] Therefore, as shown in Embodiments 11 to 14, in the
lamination-type cooler 1 in which the refrigerant supply header 3A
or the refrigerant discharge header 3B is arranged in the
intermediate portion of the cooling pipe 2 in the refrigerant
flowing direction L, a large number of electronic parts 4 can be
held while the cooling performance is held high.
[0249] While the invention has been described by reference to
specific embodiments chosen for purposes of illustration, it should
be apparent that numerous modifications could be made thereto, by
those skilled in the art, without departing from the basic concept
and scope of the invention.
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