U.S. patent application number 11/410836 was filed with the patent office on 2006-09-07 for display apparatus and method of manufacturing the same.
Invention is credited to Michiya Kobayashi, Toshifumi Tomimatsu.
Application Number | 20060197446 11/410836 |
Document ID | / |
Family ID | 27677834 |
Filed Date | 2006-09-07 |
United States Patent
Application |
20060197446 |
Kind Code |
A1 |
Tomimatsu; Toshifumi ; et
al. |
September 7, 2006 |
Display apparatus and method of manufacturing the same
Abstract
A display apparatus includes an array substrate including a
display area composed of a plurality of pixels arranged in a
matrix, and a sealing substrate disposed to be opposed to the array
substrate. The display area includes a pixel switch that selects a
pixel, a drive control device connected to the pixel switch, and an
organic EL device driven by the drive control device. A support
section is disposed in a frame shape on an outer peripheral portion
of the display area such that a predetermined gap is provided
between the array substrate and the sealing substrate.
Inventors: |
Tomimatsu; Toshifumi;
(Kumagaya-shi, JP) ; Kobayashi; Michiya;
(Ishikawa-gun, JP) |
Correspondence
Address: |
OBLON, SPIVAK, MCCLELLAND, MAIER & NEUSTADT, P.C.
1940 DUKE STREET
ALEXANDRIA
VA
22314
US
|
Family ID: |
27677834 |
Appl. No.: |
11/410836 |
Filed: |
April 26, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10683360 |
Oct 14, 2003 |
|
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11410836 |
Apr 26, 2006 |
|
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PCT/JP03/01017 |
Jan 31, 2003 |
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10683360 |
Oct 14, 2003 |
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Current U.S.
Class: |
313/512 |
Current CPC
Class: |
H01L 2251/566 20130101;
G09G 2300/0842 20130101; H01L 51/525 20130101; H01L 51/5246
20130101; G09G 3/3225 20130101; H01L 51/5259 20130101; G09G 3/3208
20130101; H01L 51/56 20130101; H01L 27/3246 20130101 |
Class at
Publication: |
313/512 |
International
Class: |
H01J 1/62 20060101
H01J001/62; H01J 63/04 20060101 H01J063/04 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 4, 2002 |
JP |
2002-027123 |
Claims
1. A display apparatus comprising: a first substrate including a
display area having a plurality of pixels arranged in a matrix; and
a second substrate disposed to be opposed to the first substrate,
the second substrate including a recess portion that extends over a
region corresponding to the display area, wherein the first
substrate includes, a separator that separates the pixels in the
display area and is disposed to be spaced apart from the second
substrate, and a support section disposed in a frame shape on an
outer peripheral portion of the display area such that a
predetermined gap is provided between the first substrate and the
second substrate, the support section having a height substantially
equal to a height of the separator, wherein the support section and
the separator are formed of the same material.
2. The display apparatus according to claim 1, wherein the support
section is formed in a loop shape such that the support section
seals between the display area of the first substrate and the
second substrate.
3. The display apparatus according to claim 1, wherein the support
section is disposed over a drive circuit for driving the
pixels.
4. The display apparatus according to claim 1, wherein the second
substrate provides a desiccating agent.
5. The display apparatus according to claim 1, wherein the support
section is formed of a resin including a desiccating agent.
6. The display apparatus according to claim 1, wherein the pixel
includes a self-emission type display device.
7. The display apparatus according to claim 6, wherein the
self-emission type display device comprises a first electrode
formed in an independent insular shape for each pixel, a second
electrode disposed to be opposed to the first electrode and
commonly formed for all the pixels, and a light-emitting layer
sandwiched between the first electrode and the second
electrode.
8. The display apparatus according to claim 1, wherein a seal
material for sealing between the first substrate and the second
substrate is disposed on both sides of the support section.
9. The display apparatus according to claim 8, wherein the seal
material is formed of a resin including a desiccating agent.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This is a Divisional Application and claims the benefit of
priority from U.S. Ser. No. 10/683,360, filed Oct. 14, 2003, which
is a Continuation Application of PCT Application No.
PCT/JP03/01017, filed Jan. 31, 2003, which was not published under
PCT Article 21(2) in English.
[0002] This application is based upon and claims the benefit of
priority from the prior Japanese Patent Application No.
2002-027123, filed Feb. 4, 2002, the entire contents of which are
incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0003] 1. Field of the Invention
[0004] The present invention relates to a display apparatus and a
method of manufacturing the display apparatus, and more
particularly to a self-emission type display apparatus such as an
organic electro-luminescence (EL) display apparatus and a method of
manufacturing the same.
[0005] 2. Description of the Related Art
[0006] In recent years, organic EL display apparatuses have
attracted attention as flat display apparatuses. The organic EL
display apparatus has self-luminescence properties. Thus, it has
features: a wide viewing angle is provided, reduction in thickness
is achieved without a need for backlight, power consumption can be
decreased, and a responsivity speed is high. The organic EL display
apparatus is configured such that a plurality of organic EL devices
are arranged on an array substrate in a matrix. Each organic EL
device has such a structure that an organic light-emitting layer
including an organic compound with a light-emitting function is
sandwiched between an anode and a cathode.
[0007] The organic EL device is very susceptible to moisture. Even
a small amount of moisture, e.g. about 1 ppm, would destroy the
organic EL device, and the organic EL device could no longer
maintain a display performance as a display device. It is
necessary, therefore, that the organic EL device is configured to
be kept out of contact with an external atmosphere. In a general
manufacturing process, the array substrate is sealed by a sealing
substrate, to which a desiccating material is added, in an inert
gas atmosphere of, e.g. nitrogen gas, under dew-point management.
In this case, the array substrate and the sealing substrate are
bonded to each other via a sealing material mixed with granular
spacers each having a size of several-ten .mu.m. The spacer mixed
in the sealing material defines a predetermined gap between the
array substrate and the sealing substrate so as to prevent contact
between the organic EL devices arranged on the array substrate and
the desiccating material.
[0008] When the array substrate and the sealing substrate are to be
bonded by the sealing material, the sealing material is cured by
ultraviolet irradiation in the state in which both substrates are
under pressure. In this case, there is a possibility that the
granular spacers mixed in the sealing material may press a drive
circuit provided in the vicinity of the sealing material. This may
result in damage to the drive circuit. In particular, in display
apparatuses used in small-sized mobile terminals, the production of
which has increased in recent years, there is little extra area in
the frame size and thus it is difficult to keep a sufficient
margin. Consequently, the aforementioned problem tends to occur
with the display apparatus for the small-sized mobile terminal, and
the reliability may deteriorate.
[0009] In a case where a plurality of organic EL display
apparatuses are to be cut out of a single mother substrate, there
is no portions serving as fulcra along scribe lines. As a result,
defects such as a chip tend to occur at end portions of the
substrates of the cut-out organic EL display apparatuses, and it is
difficult to cut out the display apparatuses with high
precision.
BRIEF SUMMARY OF THE INVENTION
[0010] The present invention has been made to solve the above
problems, and the object of the invention is to provide a display
apparatus capable of enhancing reliability and process precision,
and a method of manufacturing the display apparatus.
[0011] According to a first aspect of the present invention, there
is provided a display apparatus comprising:
[0012] a first substrate including a display area having a
plurality of pixels arranged in a matrix; and
[0013] a second substrate disposed to be opposed to the first
substrate,
[0014] wherein the first substrate includes
[0015] a separator that separates the pixels in the display area
and is disposed to be spaced apart from the second substrate,
and
[0016] a support section disposed in a frame shape on an outer
peripheral portion of the display area such that a predetermined
gap is provided between the first substrate and the second
substrate, the support section having a height substantially equal
to a height of the separator.
[0017] According to a second aspect of the invention, there is
provided a method of manufacturing a display apparatus including a
first substrate having a plurality of display pixels arranged in a
display area in a matrix and a separator separating the display
pixels, a second substrate disposed to be opposed to the first
substrate, and a seal material that seals the first substrate and
the second substrate, the method comprising:
[0018] a step of forming a support section, which has a height
substantially equal to a height of the separator, on a mother
substrate having display areas corresponding to a plurality of the
display apparatuses, the support section being provided on an outer
peripheral portion of each of the display areas;
[0019] a step of sealing using the seal material, in a state in
which the second substrate is disposed to be opposed to each
display area of the mother substrate, spaced apart from the
separator, and put in contact with the support section; and
[0020] a step of cutting the mother substrate in accordance with
the respective display areas, and cutting out the first
substrate.
[0021] According to a third aspect of the invention, there is
provided a method of manufacturing a display apparatus including a
first substrate having a plurality of display pixels arranged in a
display area in a matrix and a separator separating the display
pixels, a second substrate disposed to be opposed to the first
substrate, and a seal material that seals the first substrate and
the second substrate, the method comprising:
[0022] a step of forming a support section, which has a height
substantially equal to a height of the separator, on a first mother
substrate having display areas corresponding to a plurality of the
display apparatuses, the support section being provided on an outer
peripheral portion of each of the display areas;
[0023] a step of sealing using the seal material, in a state in
which a second mother substrate is disposed to be opposed to each
display area of the first mother substrate, spaced apart from the
separator, and put in contact with the support section; and
[0024] a step of cutting the first mother substrate and the second
mother substrate in accordance with the respective display areas,
and cutting out the first substrate and the second substrate sealed
by the seal material.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING
[0025] FIG. 1 schematically shows the structure of an organic EL
display apparatus according to an embodiment of the present
invention;
[0026] FIG. 2 is a cross-sectional view schematically showing the
structure of the organic EL display apparatus shown in FIG. 1;
[0027] FIG. 3 is a cross-sectional view schematically showing the
structures of an organic EL device and a drive control device in
the organic EL display apparatus shown in FIG. 1;
[0028] FIG. 4 is a perspective view for describing a method of
manufacturing the organic EL display apparatus;
[0029] FIG. 5 is a cross-sectional view for describing the method
of manufacturing the organic EL display apparatus;
[0030] FIG. 6 is a perspective view for describing another method
of manufacturing the organic EL display apparatus;
[0031] FIG. 7 is a cross-sectional view for describing this another
method of manufacturing the organic EL display apparatus;
[0032] FIG. 8 shows an example of the positional relationship
between a support section and a drive circuit; and
[0033] FIG. 9 schematically shows the structure of an array
substrate in a case where insular support portions are
arranged.
DETAILED DESCRIPTION OF THE INVENTION
[0034] A display apparatus according to an embodiment of the
present invention and a method of manufacturing the display
apparatus will now be described with reference to the accompanying
drawings.
[0035] In this embodiment, a self-emission type display apparatus,
such as an organic EL (electroluminescence) display apparatus, is
described as the display apparatus by way of example.
[0036] As is shown in FIG. 1 and FIG. 2, an organic EL display
apparatus 1 comprises an array substrate 100 as a first substrate,
on which organic EL devices serving as display devices are arranged
in a matrix, and a sealing substrate 200 as a second substrate,
which is disposed to be opposed to the array substrate 100. A
display area 102 of the array substrate 100, which displays an
image, comprises three kinds of light-emitting portions, that is,
pixels, which emit red, green and blue lights, respectively. Each
pixel is separated by separators 130. Each pixel includes an
organic EL device 40 serving as a self-emission type display
device. The sealing substrate 200 seals the display area 102 of the
array substrate 100.
[0037] The organic EL device 40 comprises a first electrode 60, a
second electrode 66 and an organic light-emitting layer 64
functioning as a light-emitting layer. The first electrode 60 is
formed in an independent insular shape for each pixel, and is
electrically insulated. The second electrode 66 is disposed to be
opposed to the first electrode 60 and is commonly formed for a
plurality of pixels. The organic light-emitting layer 64 is
sandwiched between the first electrode 60 and the second electrode
66.
[0038] In each pixel of the display area 102, the array substrate
100 includes a pixel switch 10 composed of, e.g. an N-type
thin-film transistor, a drive control device 20 composed of, e.g. a
P-type thin-film transistor, a capacitor element 30, and the
organic EL device 40. The organic EL device 40 is selected via the
pixel switch 10. An excitation power for the organic EL device 40
is controlled by the drive control device 20.
[0039] The array substrate 100 includes a plurality of scan lines Y
arranged in the row direction of the organic EL devices 40, a
plurality of signal lines X arranged in the column direction of the
organic EL devices 40, and power supply lines P for supplying power
to a first electrode of each organic EL device 40. In a peripheral
area 104 surrounding the display area 102, the array substrate 100
further includes a scan line drive circuit 107 for supplying drive
signals to the scan lines Y and a signal line drive circuit 108 for
supplying drive signals to the signal lines X.
[0040] The scan lines Y are connected to the scan line drive
circuit 107. The signal lines Y are connected to the signal line
drive circuit 108. The pixel switch 10 is provided near an
intersection between the scan line Y and signal line X. The drive
control device 20 is connected in series with the organic EL device
40. The capacitance element 30 is connected in series with the
pixel switch 10 and in parallel with the drive control device 20.
Both electrodes of the capacitance element 30 are connected to the
gate electrode and source electrode of the drive control device 20,
respectively.
[0041] The power supply line P is connected to a first electrode
power supply line (not shown) arranged on the peripheral area 104.
A second electrode of the organic EL device 40 is connected to a
second electrode power supply line (not shown) which is arranged on
the peripheral area 104 and supplies a common potential.
[0042] More specifically, the pixel switch 10 in this embodiment is
composed of an N-type thin-film transistor. In the pixel switch 10,
the gate electrode is connected to the scan line Y, the source
electrode is connected to the signal line X, and the drain
electrode is connected to one electrode of the capacitance element
30 and to the gate electrode of the drive control device 20. In the
drive control device 20, the source electrode is connected to the
power supply line P, and the drain electrode is connected to the
first electrode 60 of the organic EL device 40. The other electrode
of the capacitance element 30 is connected to the power supply line
P.
[0043] When the pixel switch 10 is selected via the associated scan
line Y, the pixel switch 10 writes a drive signal of the associated
signal line X in the capacitance element 30, and controls the
operation of the drive control device 20. The gate voltage of the
drive control device 20 is adjusted on the basis of the drive
signal. The drive control device 20 supplies a desired drive
current from the power supply line P to the organic EL device
40.
[0044] FIG. 3 is a schematic cross-sectional view showing the drive
control device 20 and organic EL device 40 of the array substrate
100.
[0045] The drive control device 20 includes a polysilicon
semiconductor layer 20P disposed on an insulating support substrate
120 formed of, e.g. glass. In the drive control device 20, a gate
electrode 20G is provided on the polysilicon semiconductor layer
20P via a gate insulation film 52. A source electrode 20S is put in
contact with a source region 20PS of the polysilicon semiconductor
layer 20P via a contact hole 93 that penetrates the gate insulation
film 52 and an interlayer insulation film 54. A drain electrode 20D
is put in contact with a drain region 20PD of the polysilicon
semiconductor layer 20P via a contact hole 94 that penetrates the
gate insulation film 52 and interlayer insulation film 54.
[0046] The organic EL device 40 is disposed on an insulation film
56 provided on the interlayer insulation film 54. The organic EL
device 40 for one pixel is partitioned by the separators 130
arranged within the display area in a matrix. The separator 130
comprises, for example, a hydrophilic film such as a silicon oxide
film (SiO) and a hydrophobic film such as a resin resist. In each
pixel, the first electrode 60 is electrically insulated from
adjacent pixels by the separators 130. The separators 130 are so
arranged as to overlap peripheral portions of the first electrode
60. Thus, the electrode portion, which is exposed from the
hydrophilic film of the separator 130, functions substantially as
the first electrode.
[0047] In the organic EL device 40, the lower-side first electrode
60 functions as an anode, and the first electrode 60 is provided on
the insulation film 56. The first electrode 60 is connected to the
drain electrode 20D of the drive control device 20 via a contact
hole 95 that penetrates the insulation film 56. The first electrode
60 is formed of a light-transmissive electrically-conductive
material such as ITO (Indium Tin Oxide) or IZO (Indium Zinc
Oxide).
[0048] The organic light-emitting layer 64 sandwiched between the
first electrode 60 and second electrode 66 may have a three-layer
stacked structure comprising a hole transporting layer and an
electron transporting layer, which are commonly formed for
respective colors, and a light-emitting layer formed individually
for each color. Alternatively, the organic light-emitting layer 64
may have a two-layer structure or a single layer structure having
an integrated function of the three layers. For example, the hole
transporting layer is interposed between the anode and the
light-emitting layer and is formed of a thin film of an aromatic
amine derivative, a polythiophene derivative, polyaniline
derivative, etc. The light-emitting layer is interposed between the
hole transporting layer and the cathode and is formed of an organic
compound that emits red, green or blue light. When the
light-emitting layer is formed by using, for instance, a
high-polymer material, it has a stacked structure of PPV
(poly-para-phenylenevinylene), a polyfluorene derivative or a
precursor thereof, etc.
[0049] In the organic EL device 40, the upper-side second electrode
66 functions as a cathode. The second electrode 66 is commonly
provided on the organic light-emitting layers 64 of the respective
organic EL devices 40. The second electrode 66 is formed of a
light-shield metal film of, e.g. Ca (calcium), Al (aluminum), Ba
(barium), Ag (silver), etc.
[0050] The sealing substrate 200 includes a recess portion 202 that
extends over at least a region corresponding to the display area
102. The sealing substrate 200 having this structure has a
desiccating agent 204 disposed in the recess portion 202. The
desiccating agent 204 absorbs moisture evaporated from the organic
EL device 40, etc.
[0051] The array substrate 100 further includes a support section
300 arranged in a frame shape surrounding the outer periphery of
the display area 102. The support section 300 has such a height as
to provide a predetermined gap between the array substrate 100 and
sealing substrate 200 in the display area 102. The height of the
support section 300 is substantially equal to the height of the
separator 130. When the support section 300 supports the sealing
substrate 200 in the peripheral area 104, the separator 130 on the
array substrate 100 is spaced apart from the sealing substrate 200
in the display area 102. Specifically, the sealing substrate 200
has the recess portion 202 opposed to the display area 102. Thus,
even if the height of the separator 130 is substantially equal to
that of the support section 300, the separator 130 does not contact
the desiccating agent 204 provided on the sealing substrate
200.
[0052] As is shown in FIG. 1, for example, the support section 300
has a continuous loop shape surrounding the display area 102.
Thereby, when the sealing substrate 200 is supported by the support
section 300 on the array substrate 100 in the peripheral area 104,
the display area 102 is sealed.
[0053] The support section 300 is formed of, e.g. resin resist. The
support section 300 and the separators 130 arranged on the display
area 102 may be formed of the same material. In this case, the
support section 300 and the separators 130 may be formed in the
same fabrication step. In particular, the water-repellent film of
the separator 130 and the support section 300 may be formed of the
same material in the same fabrication step. This fabrication method
does not require an increase in number of fabrication steps for
forming the support section 300, and can prevent a decrease in
yield.
[0054] Since the display area 102 of the array substrate 100 is
sealed by the support section 300 and sealing substrate 200,
external moisture is prevented from entering the sealed space. This
prevents degradation of the organic EL device 40. In particular,
when the separator 130 and support section 300 are formed by the
same fabrication steps, entrance of moisture can more effectively
be prevented.
[0055] The array substrate 100 and sealing substrate 200 are sealed
by a seal material 400. The seal material 400 is formed of a
photosensitive resin, e.g. an ultraviolet curing resin.
Additionally, the seal material may be formed of a photosensitive
resin mixed with a desiccating agent. If this seal material 400 is
used, entrance of external moisture can be prevented by arranging
the seal material 400 on both sides of the support section 300.
Moreover, moisture within the sealed space can effectively be
eliminated. In the case where the desiccating agent is mixed in the
seal material 400, it is not necessary to dispose the desiccating
agent 204 in the recess portion 202 of the sealing substrate
200.
[0056] The gap between the array substrate 100 and the sealing
substrate 200 is kept constant by the support section 300.
Moreover, since the support section 300 is arranged on the outer
peripheral part of the display area 102, the mechanical strength of
the entire display apparatus is increased.
[0057] An insert gas such as nitrogen gas is filled in the sealed
space defined by the support section 300 in the predetermined gap
between the array substrate 100 and sealing substrate 200. The
humidity in the sealed space is maintained at such a low level as
not to adversely affect the organic EL device 40.
[0058] In the organic EL device 40 with the above-described
structure, electrons and holes are injected in the organic
light-emitting layer 64 sandwiched between the first electrode 62
and second electrode 66. The electron and hole are recombined to
form an exciton, and light is produced by photo-emission of a
predetermined wavelength which occurs when the exciton is
deactivated. The EL light is emitted from the lower surface side of
the array substrate 100, that is, from the first electrode 60
side.
[0059] A method of manufacturing the organic EL device having the
above-described structure will now be described. In the method to
be described here, array substrates corresponding to a plurality of
EL display apparatuses are cut out of a single mother
substrate.
[0060] As is shown in FIGS. 4 and 5, display areas corresponding to
a plurality of organic EL display apparatuses are formed on a
mother substrate 500 for array substrates. Specifically, processes
of forming a semiconductor layer, a metal layer and an insulation
layer on the mother substrate 500 and patterning these layers are
repeated. Thereby, for each display area 102, the processes are
carried out to form polysilicon semiconductor layers of TFTs that
make up pixel switches 10, drive control devices 20, drive circuits
107 and 108, etc., as well as gate electrodes, capacitance elements
30, gate insulation films 52, interlayer insulation films 54,
etc.
[0061] Subsequently, source electrodes and drain electrodes of the
TFTs are formed. In this case, the source electrode of the pixel
switch 10 is formed integral with the signal line X. Thereafter,
the insulation film 56 is formed on the TFTs, and then first
electrodes 60 are formed in independent insular shapes at positions
corresponding to the respective display devices 40 on the
insulation film 56. In this case, the drain electrode 20D of the
drive control device 20 is electrically connected to the first
electrode 60.
[0062] Next, separators 130 for electrically insulating each
display device 40 are formed on the display area 102. To begin
with, a film of a hydrophilic material is formed. A part of this
film is selectively removed, thereby forming a hydrophilic film
having an opening for partly exposing the first electrode 60. Then,
a film of a hydrophobic material is formed, and a part thereof is
selectively removed, thereby forming a hydrophobic film having an
opening for partly exposing the opening of the hydrophilic film.
The plural organic EL devices 40 surrounded by the separators 130
emit light of the same color, for example, in units of a column. In
the step of forming the hydrophobic film, a frame-shaped support
section 300 having approximately the same height as the separators
130 is formed at the same time on the outer periphery of the
display area 102.
[0063] Following the above steps, a light-emission material is
applied by, e.g. an ink jet method, onto the first electrode 60
exposed from the opening of the separator 130. Thus, the organic
light-emitting layer 64 is formed. Subsequently, the second
electrode 66 is formed on the organic light-emitting layer 64.
Thereby, the organic EL device 40 is formed.
[0064] On the other hand, the desiccating agent 204 is disposed in
the recess portion 202 of the sealing substrate 200. Then, seal
materials 400 are applied onto the mother substrate 500. For
example, the seal material 400 is applied onto the support section
300 in a frame shape. In an atmosphere subjected to dew-point
management, a plurality of sealing substrates 200 are disposed and
sealed to be opposed to each display area 102 on the mother
substrate 500. Thereby, the organic EL devices 40 are sealed in the
sealed spaces between the mother substrate 500 and the sealing
substrates 200. In this case, the support sections 300 on the
mother substrate 500 support the sealing substrates 500. Thus, the
seal materials 400 applied to the support sections 300 are present
on both sides of the support sections 300 and bond the mother
substrate 500 and sealing substrates 200.
[0065] Thereafter, the mother substrate 500 is cut into unit sizes
corresponding to the respective organic EL display apparatuses.
Specifically, predetermined cutting-lines are scribed on the
surface of the mother substrate 500 by a scriber formed of a sharp,
hard member of, e.g. diamond. Cracks are made along the
cutting-lines. After cracks, i.e. scribe lines SL, are formed along
the cutting-lines, an impact is uniformly applied along the scribe
lines SL, using a rubber rod-like member called a break bar.
Thereby, the cracks are progressed within the substrate along the
scribe lines SL, and the mother substrate 500 is cut.
[0066] When a plurality of organic EL display apparatuses are cut
out of the single mother substrate, as described above, it is
desirable to situate the support sections 300 near the scribe lines
SL. Thereby, in the step of cutting the mother substrate 500, the
support sections 300 function as fulcra and occurrence of defects
in scribing can be prevented. Moreover, high-precision cutting is
enabled with respect to display apparatuses for small-sized mobile
terminals, which have little margin in the frame size.
Additionally, it is desirable that the support sections 300 be
disposed substantially in parallel with the scribe lines SL. With
such disposition, higher-precision cutting of the mother substrate
is enabled. It is preferable that, as shown in FIG. 5, the support
sections 300 be situated on both sides of the scribe lines SL in
the vicinity of the central portion of the mother substrate 500
where a plurality of organic EL display apparatuses are located
adjacent to one another. With such arrangement, higher-precision
cutting of the mother substrate can be achieved.
[0067] The support section 300 with a predetermined width is
disposed in a frame shape along the outer periphery of the sealing
substrate 200. The array substrate 100 and sealing substrate 200
are sealed via the support section 300. Therefore, the strength of
the display apparatus as a whole can be increased.
[0068] Another method of manufacturing the organic EL device having
the above-described structure will now be described. In the method
of this example, two mother substrates are used to form a plurality
of organic EL display apparatus cells. Thereafter, array substrates
and sealing substrates corresponding to a plurality of organic EL
display apparatuses are cut out of the mother substrates.
[0069] As is shown in FIGS. 6 and 7, a plurality of display areas
102 and drive circuits 107, 108 are formed on a mother substrate
for array substrates (first mother substrate) 500. Then, a support
section 300 is formed on an outer periphery portion of each display
area 102. A desiccating agent 204 is disposed in each recess
portion 202 of a mother substrate for sealing substrates (second
mother substrate) 600. Subsequently, seal material 400 is applied
to each sealing substrate 200 in a frame shape. In an atmosphere
subjected to dew-point management, the mother substrate 600 is
sealed on the mother substrate 500. Thereafter, the mother
substrate 500 and mother substrate 600 are cut into unit sizes
corresponding to the respective display areas 102. Thereby, organic
EL display apparatuses each having the array substrate 100 and
sealing substrate 200 which are sealed by the seal material 400 are
cut out.
[0070] With this manufacturing method, too, the same advantages as
with the previously described manufacturing method can be
obtained.
[0071] The present invention is not limited to the above-described
embodiments, and various modifications can be made without
departing from the spirit of the invention.
[0072] For example, in display apparatuses for small-sized mobile
terminals, which have little margin in the frame size, the support
section 300 for providing the gap may be disposed over each drive
circuit arranged on the outer peripheral portion of the display
area 102. Specifically, in FIG. 8, a support section 300 is
disposed over a drive circuit 700 such as a scan line drive circuit
or a signal line drive circuit. In this case, a pressure is applied
to the drive circuit 700 via the support section 300 when the array
substrate 100 and sealing substrate 200 are sealed by the seal
material 400 or when scribing is performed on the mother substrate
500 (600).
[0073] In the prior art wherein the mechanical strength for
providing the gap is secured by mixing fibers in the seal material
400 without disposing the support section 300, if the
aforementioned pressure is applied, the fibers may pierce the drive
circuit 700, causing damage to the drive circuit 700.
[0074] By contrast, in the structure shown in FIG. 8 wherein the
support section 300 is disposed on the outer peripheral portion of
the display area 102, the applied pressure can be dispersed over
the entire support section 300 and damage to the drive circuit 700
can be prevented. Therefore, even in the case of display
apparatuses with little margin in the frame size, high reliability
is attained.
[0075] In the above-described embodiment, the support section 300
has a continuous loop shape surrounding the display area 102.
Alternatively, insular support sections may be provided. That is,
as shown in FIG. 9, insular support sections 300 may be disposed
along the outer periphery of the display area 102 and the seal
material 400 may be provided along the support section 300.
[0076] The support section 300 may be formed of a resin material
including a desiccating agent. This effectively prevents external
moisture from entering the sealed space between the array substrate
100 and sealing substrate 200. In this case, the seal material 400
may not necessarily include the desiccating agent. In addition,
there is no need to dispose the desiccating agent 400 in the recess
portion 202 of the sealing substrate 200.
[0077] The above-described embodiment adopts a so-called
bottom-surface emission system in which EL light is emitted from
the first electrode side situated on the lower side of the array
substrate. The present invention, however, is also applicable to a
so-called top-surface emission system in which EL light is emitted
from the second electrode side situated on the upper side.
[0078] As has been described above, the display apparatus of this
invention and the method of manufacturing the same can enhance the
reliability and process precision. In addition, the mechanical
strength of the entire display apparatus can be increased.
Furthermore, entrance of external moisture, etc. via the seal
material can surely be prevented, and degradation in the display
apparatus can effectively be suppressed. Besides, the gap between
the array substrate and the sealing substrate can uniformly be
maintained.
[0079] As has been described above, the present invention can
provide a display apparatus and a method of manufacturing the same,
which can enhance the reliability and processing precision.
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