U.S. patent application number 11/364567 was filed with the patent office on 2006-09-07 for modular heel assembly for high heel shoes.
Invention is credited to David B. Robbins.
Application Number | 20060196082 11/364567 |
Document ID | / |
Family ID | 36942731 |
Filed Date | 2006-09-07 |
United States Patent
Application |
20060196082 |
Kind Code |
A1 |
Robbins; David B. |
September 7, 2006 |
Modular heel assembly for high heel shoes
Abstract
The present invention relates to a removable modular heel
assembly that is attached to a high heel shoe, which shoe may be
adapted to accept the assembly, and which assembly is designed to
increase the surface area of the heel or shoe to enhance stability,
comfort, and/or balance for the wearer.
Inventors: |
Robbins; David B.;
(Bethesda, MD) |
Correspondence
Address: |
S2IPLAW, PLLC
300 MASSACHUSETTS AVENUE, NW
SUITE 1101
WASHINGTON
DC
20001-2692
US
|
Family ID: |
36942731 |
Appl. No.: |
11/364567 |
Filed: |
February 28, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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60714051 |
Sep 2, 2005 |
|
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60651492 |
Mar 1, 2005 |
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Current U.S.
Class: |
36/42 ; 36/15;
36/24.5 |
Current CPC
Class: |
A43B 3/24 20130101; A43B
3/246 20130101; A43B 21/42 20130101 |
Class at
Publication: |
036/042 ;
036/024.5; 036/015 |
International
Class: |
A43C 13/00 20060101
A43C013/00; A43B 13/28 20060101 A43B013/28; A43B 21/36 20060101
A43B021/36 |
Claims
1. A device for increasing the surface area of a high heel shoe
contacting the ground, comprising: a modular heel unit adapted for
attachment to a shoe.
2. The device of claim 1, wherein said shoe is adapted to receive
said modular heel unit.
3. The device of claim 2, wherein said modular heel unit comprises
a spring-loaded hook on a top surface of the unit, and said shoe
comprises a receptacle for receiving said spring-loaded hook.
4. The device of claim 2, wherein said modular heel unit comprises
screw threads and said shoe comprises mating screw threads adapted
to accept said modular unit screw threads.
5. The device of claim 2, wherein said modular heel unit comprises
a snap-on attachment on a top surface of said heel unit, and said
shoe is configured with a groove on a portion of a sole adapted to
accept said snap-on attachment.
6. The device of claim 2, wherein said modular heel unit comprises
a wedge having a body and a leading edge, said unit adapted for
receiving a heel of said shoe, said wedge further comprising an
insert portion on said leading edge, and at least one attachment
means within said body of said wedge; and wherein said shoe
comprises an opening on a bottom surface of said shoe oriented to
receive said modular unit insert portion.
7. The device of claim 5, wherein said attachment means comprises a
pressure-sensitive lever system adapted to fixedly attach said heel
of said shoe inside said unit.
8. A shoe comprising an attachment means adapted for removable
attachment of a modular heel unit for said shoe, wherein said
modular heel unit is configured to increase the area of said bottom
surface of said shoe at a location where said heel is adapted for
ground contact.
9. A device for increasing the surface area of a high heel shoe at
a location where a heel of said shoe is adapted for contacting the
ground, comprising: a modular heel unit adapted for attachment to a
shoe, wherein said shoe is configured to receive said modular heel
unit, wherein said modular heel unit comprises a wedge body into
which said heel of said shoe fits, said heel unit further
comprising an insert portion on the front of said wedge, and
wherein said shoe comprises an opening on a bottom surface of said
shoe, said opening oriented to receive said modular unit insert
portion; a pressure-sensitive lever system within the body of said
modular heel unit adapted to attach to said heel of said shoe
inside said unit.
Description
RELATED PATENT APPLICATIONS
[0001] This patent application is related to, and claims the
benefit under 35 U.S.C. .sctn. 119(e) of, U.S. provisional patent
application Ser. No. 60/651,492, converted from U.S. patent
application Ser. No. 11/068,233 filed 1 Mar. 2005, and U.S.
provisional patent application Serial No. 60/714,051 filed 2 Sep.
2005, which are incorporated herein by reference in their
entirety.
FIELD OF THE INVENTION
[0002] The present invention relates to modular heel assemblies for
high heel shoes and to high heel shoes. More particularly, the
invention relates, for example, to a removable modular heel
assembly that fits against a high heel shoe that may, for example,
be adapted to accept the assembly, and which may be further
designed to increase the surface area of the heel and enhance
stability for the wearer.
BACKGROUND OF THE INVENTION
[0003] Many versions of high heel shoes, for example stiletto
heels, have small surface areas where the heel portion of the high
heel shoe contacts the ground. This results in significant
disadvantages for the wearer. For example, fatigue and discomfort
in the ankle and foot often occur from the extra effort required to
stabilize the wearer's ankle and foot in a high heel shoe with a
small surface area.
[0004] In addition, traversing anything other than smooth, level
surfaces presents perils for the wearers of high heel shoes with a
small heel surface area. Subway grates, sidewalk cracks and
cobblestone walkways are just some of the surfaces that these high
heel wearers can not traverse easily, or perhaps safely, if at all.
Often, these rough surfaces damage the heel of the shoe, and the
wearer may suffer a fall or risk injury.
[0005] To avoid the foregoing disadvantages of wearing high heel
shoes with small heel areas, a wearer often carries a second pair
of shoes with a different heel style, such as a sneaker, changing
shoes before walking on rough terrain. This is inconvenient,
however, because the extra pair of shoes may be heavy and use space
that could hold other items, and because changing shoes causes
unnecessary delay, expense, or inconvenience.
[0006] Hence, there remains a need in the art for a removable
apparatus that will attach to small heel area-high heel shoes to
widen the heel area and thus improve the stability of these fashion
staples.
SUMMARY OF THE INVENTION
[0007] An object of the present invention provides for a removable
modular heel assembly for high heel shoes that increases the
stability of the shoes. Another object of the invention provides
for a high heel shoe adapted such that a modular heel assembly may
be attached.
[0008] One embodiment of the invention provides for a removable
modular attachment for a shoe for increasing the surface area of
the heel contacting the ground, including an apparatus affixed to
or configured within the high heel shoe, and a heel modular
attachment molded to fit into the fixed heel apparatus.
[0009] In one aspect of the invention, the modular attachment
comprises a spring-loaded hook, and the fixed heel apparatus is a
receptacle for the spring-loaded hook. In another aspect of the
invention, the modular attachment includes screw threads or reverse
screw threads, and the fixed heel apparatus comprises reverse screw
threads or screw threads, respectively, that accept the modular
attachment. These threads may be configured as a single helical
coil, interrupted turns of a coil, threads having interruptions,
blunted ends, twisted ends, or any of a number of known thread
configurations or combinations thereof. In another aspect of the
invention, the modular attachment comprises a snap-on attachment,
and the fixed heel apparatus comprises grooves to accept the
snap-on attachment. In yet another aspect of the invention, the
modular attachment is a wedge that slides into place, having an
insert portion in the front of the wedge, and at least one
attachment means in the back of the wedge, in which the fixed heel
has been configured with openings oriented to receive the modular
attachment insert portions and the attachment means. In a
particular aspect of this embodiment, the attachment means include
protrusions and a pressure-activated clip that holds the modular
heel unit in place against the fixed heel of the shoe.
[0010] In another embodiment of the present invention, a modular
attachment may be provided, for example, without a corresponding
configuration within the shoe or shoe heel. For example, an
attachment may be provided that includes a spring-loaded hook for
attachment to a shoe heel. In another aspect of the invention, the
modular attachment may include a screw thread or reverse screw
thread for application to a shoe heal and may also include a means
for applying a corresponding thread to an existing shoe heel, such
as by self-tapping threads or removably attached threaded insert on
the outside of the heel. In another aspect of the invention, the
modular attachment comprises a snap-on attachment to snap on to a
shoe heel, sole or another portion of a shoe of a given
configuration. In yet another aspect of the invention, the modular
attachment is a wedge that slides into place onto a shoe heel,
wedging the original heel into the modular attachment. In another
embodiment, a modular attachment may include a pressure-activated
clip that is adapted to assist the modular heel unit in remaining
in place about the shoe heel. Another embodiment of a modular
attachment may include one or more set screws for fixedly pushing
against a portion of the shoe or heel. The shoe may further include
or be modified to include a receptacle for that set screw.
[0011] Another embodiment of the present invention provides for a
high heel shoe into which an attachment means has been manufactured
such that the shoe may accept a removable modular attachment for
the shoe, such that when the modular attachment is in place, it
increases the area of the shoe where the heel contacts the
ground.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] A more complete appreciation of the present invention and
many of its attendant advantages may be more readily understood by
reference to the following drawings. These drawings are provided
for demonstration of particular embodiments or aspects of the
present invention and are not to limit the invention.
[0013] FIG. 1 depicts a bottom view of the area under a high heel
(stiletto) shoe that makes contact with the surface below it.
[0014] FIG. 2 depicts a bottom view of an embodiment of the
invention in which the sole of the high heel shoe is equipped to
receive a modular attachment to increase the surface area of the
heel.
[0015] FIGS. 3A and 3B show a side perspective view of an
embodiment of the present invention in which a stability plate
extending from the toe portion of the shoe sole is provided to
accept a wedge modular heel attachment. FIG. 3A depicts a side view
of a shoe and a separate side perspective view of an embodiment of
a modular heel attachment; FIG. 3B shows a side view of a modular
heel attachment attached to the shoe.
[0016] FIGS. 4A, 4B, 4C and 4D depict an embodiment of the
invention in which a modular heel attachment fits over a fixed heel
and includes a spring-loaded mechanism that attaches to a
receptacle on a high heel shoe. FIG. 4A is a side view of a shoe
with a modular heel attachment; FIG. 4B is a bottom view showing
the increased surface heel area of the bottom of the heel with
modular heel attachment of FIG. 4A; FIG. 4C depicts a side
perspective view of a modular heel attachment; and FIG. 4D is an
exploded view of an embodiment of a spring-loaded mechanism.
[0017] FIG. 5 is a cross sectional perspective view of a bottom
portion of an embodiment of the present invention for a shoe
adapted to receive a protruding portion of a modular
attachment.
[0018] FIG. 6 is a bottom perspective exploded view of an
embodiment of the present invention with a shoe adapted to receive
a wedge-style modular heel and modular heel components.
[0019] FIG. 7 is a top perspective exploded view of an embodiment
of the present invention having a shoe adapted to receive a
wedge-style modular heel and modular heel components.
[0020] FIG. 8 is bottom perspective view of an embodiment of the
present invention having a wedge-style modular heel, showing a
spring-loaded hold and release mechanism.
[0021] FIG. 9 is a side perspective cross sectional view of an
embodiment of the present invention having a wedge-style modular
heel with a stiletto shoe.
[0022] FIG. 10 is a close-up side perspective view of an embodiment
of the invention having connecting meeting points at the back of a
shoe and modular heel unit.
[0023] FIG. 11 is a bottom perspective view of an embodiment of the
present invention with a modular heel unit in place on the bottom
of a shoe.
[0024] FIG. 12 is a side perspective exploded view of an embodiment
of the invention having a modular heel with tabs that fit into
grooves configured on both sides of a shoe.
DETAILED DESCRIPTION OF THE INVENTION
[0025] It should be understood that this invention is not limited
to the particular methodology, designs and materials, etc.,
described herein and as such may vary. The terminology used herein
is for the purpose of describing particular embodiments only, and
is not intended to limit the scope of the present invention, which
is defined solely by the claims.
[0026] As used herein and in the claims, the singular forms "a,"
"an," and "the" include the plural reference unless the context
clearly indicates otherwise. Thus, for example, the reference to a
rod is a reference to one or more such rods, including equivalents
thereof known to those skilled in the art. Other than in the
operating examples, or where otherwise indicated, all numbers
expressing quantities or conditions used herein should be
understood as modified in all instances by the term "about." The
term "about" when used in connection with percentages may
mean.+-.1%.
[0027] All patents and other publications identified are expressly
incorporated herein by reference for the purpose of describing and
disclosing, for example, the methodologies described in such
publications that might be used in connection with the present
invention. These publications are provided solely for their
disclosure prior to the filing date of the present application.
Nothing in this regard should be construed as an admission that the
inventors are not entitled to antedate such disclosure by virtue of
prior invention or for any other reason. All statements as to the
date or representation as to the contents of these documents is
based on the information available to the applicants and does not
constitute any admission as to the correctness of the dates or
contents of these documents.
[0028] Unless defined otherwise, all technical and scientific terms
used herein have the same meaning as those commonly understood to
one of ordinary skill in the art to which this invention pertains.
Although any known methods, devices, and materials may be used in
the practice or testing of the invention, the methods, devices, and
materials in this regard are described here.
[0029] Current high heel shoes, such as those including stiletto
heels, very often have very little heel surface (25) contacting the
ground, as exemplified in FIG. 1. This small contact area may cause
instability, imbalance, fatigue, and/or risk for the wearer. The
present invention provides for a modular heel attachment to
increase the surface area of the heel portion of a high heel shoe,
such as a shoe including a stiletto heel, and increase the wearer's
stability, comfort, or balance while traversing surfaces or
reducing risk, fatigue, or discomfort.
[0030] Shoes with adjustable-height heels have been suggested. See,
e.g., U.S. Pat. No. 6,785,987; No. 6,021,586; and No. 5,887,360.
These shoes, however, do not obtain the advantages of the present
invention.
[0031] Current high heel shoes often comprise a single-piece heel
that is either molded as a single piece with the sole of the shoe,
or attached to the sole with some combination of nails, screws, or
adhesive. The embodiments of the present invention are adapted to
be compatible with one or more of these construction techniques.
Rigid injection molded thermoplastics, for example, provide
materials suitable for the present invention, although any variety
of materials will be readily available to those of ordinary skill
in the art in light of the present specification.
[0032] The high heel shoe of the present invention may be
fabricated with, or be modified to contain, an apparatus to which a
modular heel assembly may, for example, be reversibly attached. The
apparatus may be constructed of metal, plastic, wood, or other
synthetic or natural materials, or any combination thereof. The
apparatus may form a rod to which a spring-loaded hook may attach;
a groove designed to receive a clip; or screw threads or reverse
screw threads. The apparatus may, for example, be constructed
directly into the attached heel portion of a high-heel shoe. The
apparatus may be applied or attached to a heel or other portion of
a shoe.
[0033] Alternatively, the high heel shoe of the present invention
may be fabricated or be modified to reversibly accept a modular
heel assembly. These fabrications or modifications may be, for
example, grooves into which protrusions or clips of the modular
unit fit.
[0034] FIG. 2 depicts the sole portion of a high heel shoe of an
embodiment of the invention, without the modular heel unit in
place, so that an embodiment of an attachment apparatus is visible.
More specifically, the sole of the shoe (10) may for example be
adapted during construction, or thereafter, such that attachment
cavities (8) are placed near the point where the heel is affixed
(7). The attachment cavities (8) may then accept attachment rods
(9) of the modular heel unit.
[0035] An embodiment of a modular attachment of the present
invention may be adapted to attach to a high heel shoe through a
reversible locking mechanism or reversible screw mechanism, to
increase the surface area of the heel. The modular attachment may
be removable, so that the wearer may have the look of the stiletto
heel when desired, and the stability of a larger heel when desired.
The modular attachment may be molded and manufactured to match
construction of a high heel shoe which may be manufactured to
receive the modular attachment. The modular attachment may be
constructed of metal, plastic, wood, other synthetic or natural
materials, or any combination thereof that can be configured to
screw, slide, attach or lock into place. The surface area of the
heel may, for example, be increased by any amount, up to the
maximum of the full surface area underneath the shoe. In the latter
instance, the show style of the shoe would be that of a "wedge",
depending on the modular attachment used. In certain instances, a
larger surface area than the sole may be provided, for example to
provide additional stability in certain weather conditions or for
individuals having certain disabilities.
[0036] For example, the attachment apparatus of the high heel shoe
may include openings designed to receive spring-loaded hooks. In
this embodiment, the modular heel attachment unit includes one or
more rods to which one or more spring-loaded hooks may be attached.
As shown in FIGS. 4A and 4C, the modular heel attachment (12)
contains an opening (3) designed to accept the existing fixed heel.
The modular heel (12) is contoured to fit snuggly against the shoe,
each being made to accommodate the other. The wearer opens the
spring (2) loaded hooks (6), shown in FIG. 4D, by applying pressure
to the hook, then releases the pressure when the modular heel is in
place such that the hook closes into the attachment apparatus. To
remove the heel, the wearer again applies pressure to the
spring-loaded hook to open the hook, pulls the modular heel away
from the shoe, and releases the hooks. When two hooks are used,
such as on the inside and outside portion of the shoe, pressure is
applied easily with the thumb on one hook and the index finger on
the other hook, in a grasping or pinching fashion. FIG. 4B shows
the increased surface area of the heel when the heel (25) is
inserted into the modular unit (12).
[0037] In another embodiment, the attachment includes a stability
plate built into or attached to the toe portion of the shoe against
which a wedge-shaped modular heel rests. The plate may, for
example, extend backwards of the shoe sole, or be built into the
back of the sole portion as a slot designed to accept a protrusion
built on the front portion of the wedge. FIGS. 3A and 3B depict the
former embodiment. In this embodiment, the modular heel (12) is a
wedge style with a groove (5) into which the fixed heel fits, that
rests and fits snuggly against the stability plate (4) built into
the sole portion of the shoe. The modular heel unit (12) also
contains attachment means to connect with the attachment apparatus
on the shoe. The attachment means may be spring-loaded mechanisms
such as one or more hooks (6) for attachment to the apparatus on
the heel area of the shoe, as shown in FIGS. 3A and 3B.
Alternatively, the attachment means may be one or more clips built
into rods that are embedded within the modular heel unit. In either
of these cases, the shoe may include a groove, cavity, or other
appropriate opening to receive, for example, a clip or hook.
[0038] In a wedge embodiment of the present invention, a wearer
may, for example, snap the wedge into place under the shoe by
pressing the spring-loaded hook or clip-ended rod to open it, then
releases the pressure when the modular unit is in place. FIG. 12
presents a schematic in which the modular heel unit (12) includes
two rods (30), one positioned on each side of the unit, each with a
snap-on attachment (31). The shoe contains complementary grooves
(32) to receive the clip of the snap-on attachment. The modular
heel unit is engaged or disengaged from the shoe by pressing the
spring-loaded mechanisms or rods (30), then sliding the fixed heel
into or out of the groove (3) or of the modular unit (12). An
alternative wedge embodiment is discussed in greater detail in
Example 1.
[0039] The spring-loaded hooks or clips of a modular heel
embodiment complement the attachment apparatus and may, for
example, be placed at various points along the sole of the shoe,
depending on comfort, style, and stability concerns as determined
by those of ordinary skill in the art. Attachment rods and
corresponding cavities may, for example, be placed on either side
of an area in which the modular heel contacts the sole of the shoe.
A corresponding spring-loaded mechanism may be built into the
modular attachments to fit into one or more apparatus cavities and
against one or more attachment rods.
[0040] The modular heel attachment embodiments described above may,
for example, be easier to carry than a second pair of shoes because
of less weight and/or smaller size. The modular heel unit itself
may, in various embodiments, be easy to replace, and/or less costly
than a pair of shoes. Indeed, the high heel shoe of the present
invention may be configured to accept more than one style of
modular heel unit, providing the wearer with a choice of styles,
each unit providing, for example, improved stability over the fixed
heel.
EXAMPLES
Example 1
Stiletto Shoe with Assembly for Receiving Modular Wedge
Apparatus
[0041] In this embodiment of the invention, grooves have been
manufactured into the body of the shoe that is designed to accept
protrusions of the modular wedge. FIG. 5 presents a schematic
cross-sectional view of the bottom portion of the shoe (10) which
contains a groove (14) in the posterior section of the body of the
shoe under the ball of the foot. This groove may be in the outsole,
or may start in and pass through the outsole and end within the
midsole of the shoe. The modular attachment (12) includes a
tongue-like protrusion (15), manufactured contiguous with the
modular heel that fits into the groove (14). This groove adaptation
is also depicted in FIG. 6, which presents a view from below of the
shoe and modular heel assembly. FIG. 6 also shows that the shoe
contains a groove at the top of the back of the heel (16), adapted
to receive a posterior edge (17) of the modular attachment,
depicted on FIG. 7. A close-up schematic of the top posterior
portion showing the groove (16) of the shoe and the edge (17) of
the modular unit is visible in FIG. 10.
[0042] The spring-loaded lever mechanism of this embodiment, which
allows stable attachment and easy release of the modular heel, is
depicted in FIG. 8. A lever-advancing element (20) includes a tab
(21) that protrudes from the lever-advancing element to the
exterior of the modular heel. The lever-advancing element is
secured into the modular heel with pin (24) upon which the
advancing element may pivot. A lever (27) is secured into the
modular heel with pin (29), and also includes a catch (28), that is
designed to lock the heel portion of the shoe (25) in place. A
spring (23) rests in between and presses against the
lever-advancing element (20) and the lever element (27).
[0043] FIGS. 8 and 9 are schematics showing the heel (25) in place
within the modular heel unit. Referring to FIG. 8, when the modular
heel is slid onto the shoe, the pressure applied by the sliding
motion causes the catch (24) to move with the lever (27) against
the spring (23), then once the heel (25) is in place, the catch
(28) snaps into position because of the pressure of the spring
(23). The modular heel in the attached position is shown
schematically in FIG. 11. To release the mechanism so that the
modular heel unit may be removed, the wearer applies pressure to
the tab (21), which activates the lever-advancing element (20) and
its end (22) presses against the lever (27). The lever pivots on
pin (29) and pulls the catch (28) away from the heel of the shoe
such that the modular unit may be slid away from the shoe heel.
[0044] Returning to FIG. 7, this shows a base plate (18) that forms
the bottom of the modular heel unit, providing greater contact
surface area and covering the internal mechanisms of the unit. The
base plate (18) has reinforcing features structures (19) that fit
over the pins (24) and (29) (shown in FIG. 8, not shown in FIG. 7).
The base plate also has holes (13), through which screws thread
into the body of the modular unit through matched holes (26) (FIG.
8).
[0045] The base plate is also depicted in FIG. 6 (18). FIG. 6 also
shows the body of a modular unit (12), which has an opening (13) to
house the tab (21) of the lever-advancing element. Note, however,
that in one potential commercial embodiment of the invention, the
base plate and the bottom of the shoe molding may be covered with
the appropriate outsole material(s).
* * * * *