U.S. patent application number 11/060442 was filed with the patent office on 2006-08-24 for cooling plate module.
This patent application is currently assigned to Cooler Master Co. Ltd.. Invention is credited to Qiang-Fei Duan.
Application Number | 20060185830 11/060442 |
Document ID | / |
Family ID | 36911417 |
Filed Date | 2006-08-24 |
United States Patent
Application |
20060185830 |
Kind Code |
A1 |
Duan; Qiang-Fei |
August 24, 2006 |
Cooling plate module
Abstract
A cooling plate module includes a cooling plate and a liquid
driving module. The liquid driving module includes an accommodation
chamber and a liquid driving unit used to driving cooling liquid.
The liquid driving module includes a liquid inlet communicated to
the accommodation chamber and a first liquid outlet is communicated
to the bottom of the accommodation chamber. A cap encloses the
first liquid outlet and a second liquid outlet is defined on the
cap. The cooling plate is assembled with the cap to define a closed
space therein and the first liquid outlet is corresponding to the
heat-dissipating plates. Therefore, there is no duct connecting
between the cooling plate and the liquid driving module, the
stagnant problem caused by pressure difference can be prevented and
the cool liquid can directly flush the heat-dissipating plates for
enhancing heat dissipation efficiency.
Inventors: |
Duan; Qiang-Fei; (Chung-Ho
City, TW) |
Correspondence
Address: |
HDSL
4331 STEVENS BATTLE LANE
FAIRFAX
VA
22033
US
|
Assignee: |
Cooler Master Co. Ltd.
|
Family ID: |
36911417 |
Appl. No.: |
11/060442 |
Filed: |
February 18, 2005 |
Current U.S.
Class: |
165/104.33 ;
257/E23.098 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 2924/00 20130101; H01L 23/473 20130101; H01L 2924/0002
20130101 |
Class at
Publication: |
165/104.33 |
International
Class: |
F28D 15/00 20060101
F28D015/00 |
Claims
1. A cooling plate module used in a liquid cooling cyclic mechanism
for removing heat from a heat source, comprising a cooling plate
comprising a heat absorbing face on bottom thereof and being in
contact with a heat source, and a plurality of heat-dissipating
plates on top face of the cooling plate; a liquid driving module
comprising an accommodation chamber and a liquid driving unit used
to driving a cooling liquid, the liquid driving module comprising a
liquid inlet communicated to the accommodation chamber and a first
liquid outlet communicated to a bottom of the accommodation
chamber; a cap enclosing the first liquid outlet and a second
liquid outlet being defined on the cap; wherein the cooling plate
is assembled with the cap to define a closed space therein and the
first liquid outlet is corresponding to the heat-dissipating
plates.
2. The cooling plate module as in claim 1, wherein the
heat-dissipating plates are arranged in one of longitudinal manner
and transverse manner.
3. The cooling plate module as in claim 1, wherein the
heat-dissipating plates are such arranged that a runner is defined
between the plurality of heat-dissipating plates and forms a closed
loop.
4. The cooling plate module as in claim 1, wherein the liquid
driving module is a reciprocating pump.
5. The cooling plate module as in claim 1, wherein the liquid
driving module is a centrifugal pump.
6. The cooling plate module as in claim 1, wherein the liquid
driving module is an axial-flow pump.
7. The cooling plate module as in claim 1, wherein a sealing pad is
provided between the cap and the cooling plate.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a cooling plate module, and
more particularly to a cooling plate module used for heat emitting
device such as a CPU.
[0003] 2. Description of Prior Art
[0004] The computers are developed with more powerful function and
computation speed. Beside performance issue, the product
appearance, the construction and motherboard connection ways are
also under extensive exploited. As downsize of form factor and
increasing of processing speed, the heat dissipation for central
processing unit (CPU) is also an important issue to solve.
[0005] FIG. 1 shows a perspective view of a prior art
liquid-cooling heat dissipation system 100a. As shown in this
figure, the liquid-cooling heat dissipation system 100a comprises a
heat dissipation stage 10a, a water outlet 101a and a water inlet
102a on both ends of the heat dissipation system stage 10a,
respectively, a duct 103a connected between the water inlet 102a
and a water outlet 201a of a water pump 20a, a duct 104a connected
between the water outlet 101a and a water inlet 301a of a cooling
stage 30a, which is composed of a plurality of heat-dissipating
fins 303a. The cooling stage 30a comprises a water outlet 302a
connected to a water inlet 401a of a water tank 40a through a duct
402a. The water tank 40a comprises a water outlet connected to the
water inlet 202a of the water pump 20a, thus forming the
liquid-cooling heat dissipation system 100a. During operation, the
water pump 20a conveys cool water to the heat dissipation stage 10a
for heat exchanging into hot water. Afterward, hot water flows to
the cooling stage 30a through the duct 104a for heat exchanging
into cool water there and cool water flows back to the water tank
40a through the duct 304a. The above operations are repeated for
cyclic heat exchange.
[0006] However, above-described prior art liquid-cooling heat
dissipation system 100a is composed of separate heat dissipation
stage 10a, water pump 20a, cooling stage 30a and water tank 40a and
ducts 103a, 104a, 304a and 402a interconnecting between above
devices. The liquid-cooling heat dissipation system 100a thus
formed is bulky and hard to assemble. This is adverse to the
compact trend of computer.
SUMMARY OF THE INVENTION
[0007] The present invention provides a cooling plate module
wherein the cooling plate is integrally formed with the liquid
driving module such that the layout of the cooling plate module can
be minimized to reduce space.
[0008] The present invention further provides a cooling plate
module, wherein there is no duct connecting between the cooling
plate and the liquid driving module, the stagnant problem caused by
pressure difference can be prevented and the cool liquid can
directly flush the heat-dissipating plates for enhancing heat
dissipation efficiency.
[0009] According to one aspect of the present invention, the
cooling plate module is applied to a liquid cooling cyclic
mechanism and comprises a cooling plate and a liquid driving
module. The liquid driving module includes an accommodation chamber
and a liquid driving unit used to driving cooling liquid. The
liquid driving module includes a liquid inlet communicated to the
accommodation chamber and a first liquid outlet is communicated to
the bottom of the accommodation chamber. A cap encloses the first
liquid outlet and a second liquid outlet is defined on the cap. The
cooling plate is assembled with the cap to define a closed space
therein and the first liquid outlet is corresponding to the
heat-dissipating plates.
[0010] According to another aspect of the present invention, the
cooling plate module is communicated with the water tank module
through ducts. The water tank module comprises a box with a liquid
entrance region and a liquid exit region provided on both sides of
the water tank, respectively. The box comprises a cooling stage at
center thereof and composed of a plurality of stacked
heat-dissipating fins arranged in rows. Runners are defined between
rows of the heat-dissipating fins; both ends of the runner are
communicated with the liquid entrance region and the liquid exit
region. When the hot liquid in the liquid entrance region flows to
the liquid exit region through the runners, the hot liquid is first
heat exchanged with the heat-dissipating fins into cool liquid and
then the cool liquid flows to the liquid exit region.
BRIEF DESCRIPTION OF DRAWING
[0011] The features of the invention believed to be novel are set
forth with particularity in the appended claims. The invention
itself however may be best understood by reference to the following
detailed description of the invention, which describes certain
exemplary embodiments of the invention, taken in conjunction with
the accompanying drawings in which:
[0012] FIG. 1 shows a perspective view of a prior art
liquid-cooling heat dissipation system.
[0013] FIG. 2 shows an exploded view of the cooling plate module
according to the present invention.
[0014] FIG. 3 shows another exploded view of the cooling plate
module according to the present invention.
[0015] FIG. 4 shows an exploded view of the cooling plate before
assembling to the box.
[0016] FIG. 5 shows a perspective view of the cooling plate module
according to the present invention.
[0017] FIG. 6 shows a sectional view of the liquid cooling cyclic
mechanism according to the present invention.
[0018] FIG. 7 shows a sectional view of the cooling plate module
according to the present invention.
[0019] FIG. 8 shows another sectional view of the cooling plate
module according to the present invention.
[0020] FIG. 9 shows another preferred embodiment of the present
invention.
[0021] FIG. 10 shows still another preferred embodiment of the
present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0022] With reference to FIGS. 2 and 6, the cooling plate module 10
according to the present invention is applied to a liquid cooling
cyclic mechanism 100, which is used for the heat dissipation of a
CPU 200 and composed of the cooling plate module 10 and a water
tank module 20 connected with the cooling plate module 10 through
ducts. The cooling plate module 10 comprises a cooling plate 1 and
a liquid driving module 2. The cooling plate 1 comprises a heat
absorbing face 11 on bottom thereof and being in contact with a
heat source. A plurality of heat-dissipating plates 12 are formed
on top face of the cooling plate 1 and can be arranged in
longitudinal or transverse manner. A runner is defined between the
plurality of heat-dissipating plates 12 and forms a closed
loop.
[0023] With reference to FIGS. 2, 3 and 4, the liquid driving
module 2 comprises an accommodation chamber 21 and a liquid driving
unit 22 located in the accommodation chamber 21 and used to driving
the cool liquid. The liquid driving unit 22 comprises a coil stage
221, an upper cover 222, an impeller stage 223, a sealing washer
224 and a lower cover 225. The lower cover 225 comprises a liquid
inlet 23 communicated with the accommodation chamber 21. A first
liquid outlet 24 is communicated to the bottom of the accommodation
chamber 21 and is enclosed by a cap 3. A second liquid outlet 31 is
defined on the cap 3. The cooling plate 1 is assembled with the cap
3 to define a closed space therein and the first liquid outlet 24
is corresponding to the heat-dissipating plates 12. In the present
invention, the liquid driving module 2 can be reciprocating pump,
centrifugal pump or axial-flow pump.
[0024] To assemble the cooling plate module 10, the coil stage 221,
the upper cover 222, the impeller stage 223, the sealing washer 224
and the lower cover 225 are assembled to the accommodation chamber
21 in turn. Thereafter, sealing pads 32 are provided between the
cap 3 and the cooling plate 1 and provided atop the cap 3, and are
retained by bolt units 4. The cooling plate 1 is fixed to bottom of
the cap 3 and the heat-dissipating plates 12 are located in the cap
3 and corresponding to the first liquid outlet 24. The thus
assembled cooling plate module 10 is shown in FIG. 5.
[0025] As shown in FIG. 6, the water tank 20 of the liquid cooling
cyclic mechanism 100 comprises a box 5 with a liquid entrance
region 51 and a liquid exit region 52 provided on both sides of the
water tank 20, respectively. The box 5 comprises a cooling stage 53
at center thereof and composed of a plurality of stacked
heat-dissipating fins 531 arranged in rows. Runners 532 are defined
between rows of the heat-dissipating fins 531; both ends of the
runner 532 are communicated with the liquid entrance region 51 and
the liquid exit region 52. When the hot liquid in the liquid
entrance region 51 flows to the liquid exit region 52 through the
runners 532, the hot liquid is first heat exchanged with the
heat-dissipating fins 531 into cool liquid and then the cool liquid
flows to the liquid exit region 52.
[0026] In the present invention, during the assembling of the
liquid cooling cyclic mechanism 100, the liquid inlet 23 of the
cooling plate module 10 is communicated to the liquid outlet 521 of
the liquid exit region 52 of the water tank 20 through duct 6.
Moreover, the second liquid outlet 31 of the cooling plate module
10 is communicated to the liquid inlet 511 of the liquid entrance
region 51 of the water tank 20 through duct 6, thus forming the
liquid cooling cyclic mechanism 100 with continuous cycles.
Thereafter, the liquid cooling cyclic mechanism 100 is assembled to
the CPU 200 with the heat absorbing face 11 being in contact with
the CPU 200 for heat dissipating the CPU 200.
[0027] With reference to FIGS. 7 and 8, during operation of the
present invention, the cool liquid in the water tank 20 is conveyed
to the accommodation chamber 21 through the duct 6 and the liquid
inlet 23 of the cooling plate module 10 and driven by the liquid
driving unit 22. The cool liquid then flows to the cap 3 through
the first liquid outlet 24 for heat dissipating the
heat-dissipating plates 12 in the cap 3. More particularly, the
cool liquid is heat exchanged with the heat-dissipating plates 12
into hot liquid. The hot liquid then flows to the liquid entrance
region 51 of the water tank 20 through the second liquid outlet 31
of the cooling plate module 10 and another duct 6.
[0028] The hot liquid flowing into the liquid entrance region 51 of
the water tank 20 will be conveyed to each runner 532 and heat
exchanged with the heat-dissipating fins 531 into cool liquid. The
cool liquid flows to the liquid exit region 52 of the water tank 20
and then flows to the cooling plate module 10 through the duct 6
connected to the liquid exit region 52, thus performing cyclic heat
exchange.
[0029] FIG. 9 shows another preferred embodiment of the present
invention, the liquid driving module 2 is integrally formed at
center of the cap 3 such that the cool liquid flowing into the
accommodation chamber 21 will directly flow out of the first liquid
outlet 24 and flush the heat-dissipating plates 12 to heat
dissipate the heat-dissipating plates 12 with enhanced
efficiency.
[0030] FIG. 10 shows still another preferred embodiment of the
present invention, the cap 3 comprises two second liquid outlets 31
thereon. In case of only one water tank 20, one liquid outlet 31 is
connected to the liquid inlet 511 of the liquid entrance region 51
of the water tank 20 through a duct 6. The liquid outlet 521 of the
liquid exit region 52 of the water tank 20 is connected to the
liquid inlet 23 of the cooling plate module 10 through another duct
6. When two water tanks 20 are to be used, the two second liquid
outlets 31 are connected to the two water tanks 20 through
respective duct 6.
[0031] In the present invention, the cooling plate 1 is integrally
formed with the liquid driving module 2 such that the layout of the
cooling plate module 10 can be minimized to reduce space. Moreover,
there is no duct connecting between the cooling plate 1 and the
liquid driving module 2, the stagnant problem caused by pressure
difference can be prevented and the cool liquid can directly flush
the heat-dissipating plates 12 for enhancing heat dissipation
efficiency.
[0032] Although the present invention has been described with
reference to the preferred embodiment thereof, it will be
understood that the invention is not limited to the details
thereof. Various substitutions and modifications have suggested in
the foregoing description, and other will occur to those of
ordinary skill in the art. Therefore, all such substitutions and
modifications are intended to be embraced within the scope of the
invention as defined in the appended claims.
* * * * *