U.S. patent application number 11/189339 was filed with the patent office on 2006-08-24 for thermal dissipation device.
This patent application is currently assigned to Comp Take Technology Co., Ltd.. Invention is credited to Ryan Chen.
Application Number | 20060185821 11/189339 |
Document ID | / |
Family ID | 36911411 |
Filed Date | 2006-08-24 |
United States Patent
Application |
20060185821 |
Kind Code |
A1 |
Chen; Ryan |
August 24, 2006 |
Thermal dissipation device
Abstract
A thermal dissipation device includes a heat sink; and at least
a heat pipe that pastes on the surface of the heat sink to conduct
the thermal to the heat sink efficiently for thermal
dissipation.
Inventors: |
Chen; Ryan; (Taipei City,
TW) |
Correspondence
Address: |
ANTHONY R. BARKUME
20 GATEWAY LANE
MANORVILLE
NY
11949
US
|
Assignee: |
Comp Take Technology Co.,
Ltd.
|
Family ID: |
36911411 |
Appl. No.: |
11/189339 |
Filed: |
July 26, 2005 |
Current U.S.
Class: |
165/80.3 ;
165/104.33; 257/E23.088; 257/E23.099 |
Current CPC
Class: |
F28D 2021/0029 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101; H01L 23/427
20130101; F28D 2021/0031 20130101; F28D 15/0266 20130101; H01L
2924/0002 20130101; H01L 23/467 20130101 |
Class at
Publication: |
165/080.3 ;
165/104.33 |
International
Class: |
F28D 15/00 20060101
F28D015/00 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 24, 2005 |
TW |
094202913 |
Claims
1. A thermal dissipation device including: a heat sink; and at
least a heat pipe that pastes on the surface of said heat sink to
conduct the thermal to said heat sink efficiently for thermal
dissipation.
2. The device according to claim 1 wherein said thermal dissipation
device further includes a base site to be connected with a heating
electronic component.
3. The device according to claim 1 wherein said heat sink of said
thermal dissipation device is used to connect with a fan.
4. The device according to claim 1 wherein said heat sink of said
thermal dissipation device is cylindrical that is implemented by
several heat sink fins.
5. The device according to claim 1 wherein said heat pipe of said
thermal dissipation device is soldered up the surface of said heat
sink.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a thermal dissipation
device, especially to a thermal dissipation device used on the
heating electrical components for thermal dissipation
performance.
BACKGROUND OF THE INVENTION
[0002] Thermal dissipation devices are very popular in the
electrical devices, such as a computer, which CPU has one thermal
dissipation device (i.e. cooler) with a fan for increasing the heat
conduction performance. If the performance of the thermal
dissipation device is not good, CPU will be over heating and the
processing speed of CPU will also be affected, or even forces this
CPU burning out. Therefore, a good thermal dissipation device is a
very important component for high efficiency electronic devices
(such as a computer). FIG. 1 is the block diagram of the
traditional thermal dissipation device. The upper side 11 of the
thermal dissipation device usually connects with one fan, and the
down side 12 usually connects with the heating electronic
components (such as a CPU). The heat of the thermal dissipation
device will be conducted outside when the fan runs. The kernel part
of this thermal dissipation device is solid, the surface of this
thermal dissipation device is implemented by several heat sink
fins; when the fan runs, the thermal dissipation performance of
these heat sink fins will be better, but the thermal of this
thermal dissipation device is distributed from the solid kernel to
the surface. At this situation, this solid kernel connects with the
electronic components with most heat, but the thermal dissipated by
the fan is the least. That is, the fan cannot conduct the thermal
effectively for this design of heat sink fins.
[0003] FIG. 2 is a block diagram of another conventional thermal
dissipation device. This thermal dissipation device is assembled
with several heat sink fins 22, several heat pipe 21 and base site
23. It is not easy to implement this thermal dissipation device
because heat pipe 21 has to be passed through every heat sink fin
22 with high cost; and takes larger space and inefficient thermal
conduction.
SUMMARY OF THE INVENTION
[0004] An objective of the present invention is to provide a new
thermal dissipation device able to conduct thermal efficiently,
increase thermal dissipation area, enhance the thermal dissipation
performance, decrease space and optimize the heat sink performance
of the fan.
BRIEF DESCRIPTION OF THE INVENTION
[0005] According to the present invention, a thermal dissipation
device includes a heat sink; and at least a heat pipe that pastes
on the surface of the heat sink to conduct the thermal to the heat
sink efficiently for thermal dissipation.
[0006] In accordance with one aspect of the present invention, the
thermal dissipation device also includes a base site to be
connected with a heating electronic component.
[0007] In accordance with one aspect of the present invention, the
heat sink of the thermal dissipation device is used to connect with
a fan.
[0008] In accordance with one aspect of the present invention, the
heat sink of the thermal dissipation device is cylindrical that is
implemented by several heat sink fins.
[0009] In accordance with one aspect of the present invention, the
heat pipe of the thermal dissipation device is soldered up the
surface of the heat sink.
[0010] The present invention may best be understood through the
following description with reference to the accompanying drawings,
in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 shows the traditional thermal dissipation device;
[0012] FIG. 2 shows another traditional thermal dissipation
device;
[0013] FIG. 3 shows the thermal dissipation device according to the
present invention; and
[0014] FIG. 4 shows the detailed of the thermal dissipation device
according to the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0015] FIG. 3 shows the thermal dissipation device according to the
present invention. The thermal dissipation device of the present
invention includes a heat sink 31, a heat pipe 32, and a base site
33. Base site 33 can be connected with one heating electronic
component (which is not shown in the diagram), the heat pipe 32 is
able to conduct the thermal of the electronic component to the heat
sink 31. Heat sink 31 can be cylindrical or any other shape, which
is implemented by several heat sink fins. Due to the heat of
electronic component is conducted from the base site to the heat
sink fins of the heat sink by the heat pipe, the thermal
distribution of the heat sink is from external to internal with
more efficiently and easy to be fan out by the fan. Further more,
this design is able to generate the largest thermal surface but
with the smallest space to enhance the thermal performance. FIG. 4
shows the detailed component diagram of the thermal dissipation
device according to the present invention.
[0016] To sum up, the thermal dissipation device of the present
invention is a newly advantaged design to conduct thermal
efficiently, increase thermal surface area, minimize the space, and
enhance thermal performance of the heat sink and the fan. Any
outlook modification, such as the number of heat pipe or the shape
of the heat sink, is included in the present invention if the heat
pipe pasted on the external surface of the heat sink.
[0017] While the invention has been described in terms of what are
presently considered to be the most practical and preferred
embodiments, it is to be understood that the invention need not be
limited to the disclosed embodiment. On the contrary, it is
intended to cover various modifications and similar arrangements
included within the spirit and scope of the appended claims which
are to be accorded with the broadest interpretation so as to
encompass all such modifications and similar structures.
* * * * *