U.S. patent application number 11/058702 was filed with the patent office on 2006-08-17 for heat sink module for an electronic device.
Invention is credited to Chang Chun-Yi, Wang Frank, Fan Jui-Chan.
Application Number | 20060181852 11/058702 |
Document ID | / |
Family ID | 36815378 |
Filed Date | 2006-08-17 |
United States Patent
Application |
20060181852 |
Kind Code |
A1 |
Frank; Wang ; et
al. |
August 17, 2006 |
Heat sink module for an electronic device
Abstract
Disclosed is a heat sink module for an electronic device,
comprising a substrate having at least a fixed hole, at least a
heat sink fin set disposed on the substrate and having a plurality
of heat sink fins and at least a resilient plate disposed on the
substrate and having at least a mount hole mounting the substrate
on an electronic device component in the electronic device in
coordination with the fixed hole so that the substrate can be
closely bonded to a surface of the electronic component. Further,
since the heat sink fin set is formed on the substrate by punching
method, an advantage of low cost of the heat sink module is
provided.
Inventors: |
Frank; Wang; (Taipei,
TW) ; Jui-Chan; Fan; (Taipei, TW) ; Chun-Yi;
Chang; (Taipei, TW) |
Correspondence
Address: |
GENUS LAW GROUP;LOWE HAUPTMAN & BERNER, LLP
1700 DIAGONAL ROAD, SUITE 300
ALEXANDRIA
VA
22314
US
|
Family ID: |
36815378 |
Appl. No.: |
11/058702 |
Filed: |
February 15, 2005 |
Current U.S.
Class: |
361/704 ;
257/E23.084; 257/E23.103 |
Current CPC
Class: |
H01L 2023/4062 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101; H01L 23/4006
20130101; H01L 2023/405 20130101; H01L 2023/4087 20130101; H01L
2924/0002 20130101; H01L 23/3672 20130101 |
Class at
Publication: |
361/704 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. A heat sink module for an electronic device used for heat
sinking an electronic component in the electronic device,
comprising: a substrate having at least a fixed hole; at least a
heat sink fin set disposed on said substrate and having a plurality
of heat sink fins; and at least a resilient plate disposed on said
substrate and having at least a mount hole mounting said substrate
on the electronic component in the electronic device in
coordination with said fixed hole so that said substrate is closely
bonded to said electronic component.
2. The heat sink module as claimed in claim 1, wherein said
substrate is made of one of copper and alumina.
3. The heat sink module as claimed in claim 1, wherein said
substrate is provided with three fixed holes disposed in a
triangular arrangement.
4. The heat sink module as claimed in claim 1, wherein said
resilient plate is welded to said substrate.
5. The heat sink module as claimed in claim 1, wherein said
resilient plate is screwed to said substrate.
6. The heat sink module as claimed in claim 1, wherein said
resilient plate is riveted to said substrate.
7. The heat sink module as claimed in claim 6, wherein said
resilient plate is provided with at least a rivet hole
approximately at a center thereof and riveted to said substrate
through said rivet hole by a rivet.
8. The heat sink module as claimed in claim 6, wherein said
resilient plate is provided with at least a rivet hole
approximately at an end thereof and riveted to said substrate
through said rivet hole by a rivet.
9. The heat sink module as claimed in claim 1, wherein said heat
sink fin set is made of one of copper and alumina.
10. The heat sink module as claimed in claim 1, wherein said heat
sink fin set is formed by punching.
11. The heat sink module as claimed in claim 1, wherein said heat
sink fin set is welded to said substrate.
12. The heat sink module as claimed in claim 1, further comprising
an insulating piece disposed between said substrate and said
electronic component.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a heat sink module and
particularly to a heat sink module for an electronic device.
[0003] 2. Description of the Related Art
[0004] In a current electronic device (e.g. a notebook computer),
electronic components (e.g. a chip) therein generally produce a
great deal of heat when working under normal states, resulting
unavoidably in temperature increases of the electronic components.
If the heat produced is not removed appropriately, the electronic
component can become exceedingly hot, leading to unstable
operations of the electronic component and even stopping the
operation of the whole electronic device or causing the electronic
device to crash. However, the heat generated through the operation
of the electronic component increases continuously as promotion of
speeds thereof is achieved constantly. Consequently, heat sink
modules suitable for a multitude of electronic devices are
unavoidably sought and developed. Referring to FIG. 1A, a
conventional heat sink module for a chip is depicted therein. The
heat sink module for a chip is a heat sink device 11 threaded onto
the chip 12 and having a plurality of heat sink fins, through which
heat generated by the chip 12 is conducted out to the ambient air
and the purpose of temperature reduction of the chip 12 is
naturally achieved. Since the chip 12 has a specific height having
a tolerance of height as compared to other chips and the heat sink
device 11 can only be disposed at a fixed height, the heat sink
device 11 can often not be closely bonded onto a surface of the
chip 12, yielding a reduction of heat sinking of the heat sink
device 11. Referring to FIG. 1B, another conventional heat sink
module for a chip is illustrated therein. The heat sink module for
a chip 15 comprises a heat sink device 13 and a resilient plate 14.
Through the fixed resilient plate 14, the heat sink device 13 is
mounted on the chip 15. Since the resilient plate 14 provides
elasticity, the heat sink device 13 can be applied onto chips of
different heights and thus the heat sink device 13 can be closely
bonded onto a surface of the chip 15. However, since two ends of
the resilient plate 14 have to be hooked by a hooking part 17 of a
chip connection seat 16 of the chip 15, the chip connection seat 16
used for connection with the heat sink device 13 is required to be
specifically designed, greatly reducing convenience of utilization
of the heat sink device 13.
[0005] The heat sink devices mentioned above are usually
manufactured by casting and hence the heat sink fins thereof are
each in a form of solid piece body in which more forming materials
are required. Further, molds for casting generally have reduced
lifetime as compared to those for punching. Hence, the heat sink
devices formed by the prior casting method are hard to have low
costs.
[0006] In view of the above, the heat sink modules for the current
electronic devices have the disadvantages of poor fixation to the
electronic devices and relative higher manufacturing costs.
SUMMARY OF THE INVENTION
[0007] It is, therefore, an object of the present invention to
provide a heat sink module for an electronic devices which is easy
to be fixed on the electronic device and has a relatively lower
manufacturing cost as compared to the prior heat sink devices.
[0008] To achieve the above object, the heat sink module for an
electronic device according to the present invention comprises a
substrate having at least a fixed hole, at least a heat sink fin
set disposed on the substrate and having a plurality of heat sink
fins and at least a resilient plate disposed on the substrate and
having at least an mount hole mounting the substrate on an
electronic device component in the electronic device in
coordination with the fixed hole so that the substrate can be
closely bonded to a surface of the electronic component. Further,
since the heat sink fin set are drawn mold into the substrate, an
advantage of low cost is provided.
[0009] In the heat sink module for an electronic device according
to the present invention, tight bonding between the substrate and
the electronic device is obtained by the provision of the resilient
plate. Further, since the punching method is employed for forming
both the substrate and the heat sink fin set, manufacturing cost of
the heat sink module is relatively reduced.
[0010] The detailed description and implementations of the present
invention will be given below in connection with the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The invention will become more fully understood from the
detailed description given hereinbelow illustration only, and thus
are not limitative of the present invention, and wherein:
[0012] FIG. 1A shows a conventional heat sink module for a
chip;
[0013] FIG. 1B shows another conventional heat sink module for a
chip;
[0014] FIG. 2 shows a heat sink module for an electronic device
according to an embodiment of the present invention;
[0015] FIG. 3 is an exploded view of the heat sink module as shown
in FIG. 2; and
[0016] FIG. 4 is a cross-sectional view of the heat sink module as
shown in FIG. 2.
DETAILED DESCRIPTION OF THE INVENTION
[0017] Referring to FIG. 2, an embodiment of a heat sink module for
an electronic device is shown therein. In this embodiment, the
electronic device is a computer chip, e.g. a north-bridge chip. The
heat sink module comprises a substrate 20, a first heat sink fin
set 41, a second heat sink fin set 42, a first resilient plate 31
and a second resilient plate 32. The first and second heat sink fin
sets 41, 42 are welded onto the substrate 20. The first and second
resilient plates 31, 32 are fastened by rivets 82, 83 respectively
to the substrate 20. When the substrate 20 is screwed to the chip
(not shown) by screws 71, 72, 73, heat generated by the chip can be
conducted to the first and second heat sink fin sets 41, 42 through
the substrate 20 and sent to the ambient air successively through
the first and second heat sink fin sets 41, 42, so that temperature
of the chip can be efficiently reduced.
[0018] Referring to FIG. 3, an exploded view of the embodiment of
the heat sink module for an electronic device shown in FIG. 2 is
provided therein. As shown, a computer chip 61 is disposed on a
printed circuit board (PCB) 60. On the PCB 60, at least a mount
seat 62 is disposed. The substrate 20 is formed by punching with
respect to a metal having a better heat conductivity (e.g. copper
or alumina). The substrate 20 has at least a fixed hole 21 and at
least a rivet hole 22. The first heat sink fin set 41 is also
formed by punching with respect to a metal of better heat
conductivity (e.g. copper or alumina). The first heat sink fin set
41 has a plurality of heat sink fins, which are welded onto the
substrate 20, to increase an area of heat sinking and thus
efficiency of heat sinking. To further enhance the area and
efficiency of heat sinking, a second heat sink fin set 42 is also
welded to the substrate 20.
[0019] The first resilient plate 31 is made of a metal. In this
embodiment, the first resilient plate 31 is provided with at least
a rivet hole 33 approximately at its center and a rivet 82 is
riveted through the rivet hole 33 and the rivet hole 22 of the
substrate 20 to the substrate 20. Alternatively, the first
resilient plate 31 may be welded or screwed to the substrate 20.
Since the first resilient plate 31 is riveted to the substrate 20,
in assembling the first resilient plate 31 to the substrate 20 a
mounter only needs to align the mount hole 34 of the first
resilient plate 31 to the fixed hole 21 and the screw hole of the
mount seat 6 without the need of holding the first resilient plate
31 manually. In this way, efficiency of assembly of the substrate
20 and the first resilient plate 31 is improved. In this
embodiment, a second resilient plate 32 is further provided. The
second resilient plate 32 is provided with at least a rivet hole 35
at one end and a mount hole 36 at the other end, wherein the mount
hole 36 is corresponded to a fixed hole 23 of the substrate 20 in
assembly. The fixed holes 21, 23, 24 lay in a triangular
arrangement on the substrate 20 so that the substrate 20 may be
firmly fixed onto the chip 61.
[0020] In this embodiment, an insulating piece 50 is provided
between the substrate 20 and the chip 61 to avoid any damage of
short circuiting resulted from electrical connection between other
electronic devices caused by the substrate 20. In addition, the
insulating piece 50 is also provided with a chip hole 51 so that
the chip 61 can contact the substrate 20 through the chip hole
51.
[0021] A screw 73 can be used to screw the second resilient plate
32 to a mount seat 63 of the PCB 60 through the mount hole 36 of
the second resilient plate 32, the fixed hole 23 of the substrate
20 and an open hole 52 of the insulating piece 50. Referring to
FIG. 4, a sectional view of the heat sink module for an electronic
device shown in FIG. 2 is illustrated therein. With an aid of
elasticity provided by the first and second resilient plates 31,
32, the substrate 20 can move vertically within a specific range.
Therefore, the heat sink module of the invention can be applied
onto chips of different heights and the vertical movement as
mentioned above can counterbalance the tolerance caused from the
assembly and manufacturing of the heat sink module so that it is
ensured that the substrate 20 can be closely bonded to the surface
of the chip 61 and better efficiency of heat sinking is
achieved.
[0022] As compared to the conventional heat sink modules, the
substrate 20 of the heat sink module of the present invention can
be more closely bonded to the surface of the chip by the use of the
resilient plates 31 and 32 and the use of the resilient plates 31
and 32 provides better elasticity. Further, each component of the
heat sink module of the invention is not manufactured by casting
and the manufacturing cost for the heat sink module is reduced.
[0023] While embodiments and applications of this invention have
been shown and described, it would be apparent to those skilled in
the art having the benefit of this disclosure that many more
modifications than mentioned above are possible without departing
from the inventive concepts herein. The invention, therefore, is
not to be restricted except in the spirit of the appended claims
and their equivalents.
* * * * *