Radiator unit

Abstract

A radiator unit includes a cooling device with a conductor, a heat dissipated object contacting a side of the cooling device and a fan connecting with the conductor. The heat dissipated object contacts the hot surface of the cooling device and the cooling device performs energy transfer to change heat to electrical energy. Hence, current flows in a circuit formed of the conductor to drive the fan rotating.

Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention:

[0002] The present invention is related to a radiator unit and particularly to a cooling device associated with a heat generating member for lowering temperature of the heat generating member and supplying electric energy by way of the cooling device moving the heat and transferring energy.

[0003] 2. Brief Description of the Related Art:

[0004] Due to various apparatus frequently producing heat during being in operation, heat-removing device has to be utilized to dissipate the generated heat energy. The most currently used heat-removing device is the cooling fan. But, extremely high temperature heat energy is incapable of being removed by the cooling fan and it often results in shutdown or damage of the product.

[0005] Taiwanese Patent Official Gazette No. 260325 discloses an improved cooling and temperature control device, which provides a fan at the top of the cooling fins and a cooling device under the cooling fins. The cooling fins have a plurality of jut pieces at the surfaces thereof and the jut pieces are arranged in order on the surfaces with an end of the respective jut piece extending outward the respective cooling fin and the contact surface of the fan. In addition, a slot is provided at the cooling fins for being inserted with a control circuit board. Further, a temperature sensor 12 is disposed at an edge of a lower conductive plate 42 of the cooling device 40 such that the temperature sensor 12 contacts with a temperature controlled object to feed back a correct sensed temperature so as to reach a purpose of temperature control.

[0006] However, the structure formed with the control circuit board, the temperature sensor and the cooling device has a cooing surface adhered with a CPU and a heat dissipation surface joined to a fan for removing heat from the heat generating object. When the power is off, the residue electric charges still act to the cooling device continuously to result in the cooling surface on the cooling device keeping absorbing heat so as to occur condensation phenomenon and lead to short circuit. Besides, the preceding improved cooling and temperature control device has to be supplied power for normal working so that the prior art obviously is unable to regenerate and reuse the energy under the condition of limited energy and material with high cost.

SUMMARY OF THE INVENTION

[0007] A primary object of the present invention is to provide a radiator unit in which a cooling device associated with a heat generating member for lowering temperature of the heat generating member and supplying electric energy by way of the cooling device moving the heat and transferring energy for being used by other heat dissipation device and saving resources.

[0008] Another object of the present invention is to provide a radiator unit with which the cooling surface thereof contacts heat generating member to prevent from short circuit due to condensation phenomenon resulting from the cold surface of the cooling device absorbing heat continuously.

BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The detail structure, the applied principle, the function and the effectiveness of the present invention can be more fully understood with reference to the following description and accompanying drawings, in which:

[0010] FIG. 1 is a plan view of a cooling device in a radiator according to the present invention;

[0011] FIG. 2 is a plan view of the first embodiment of a radiator according to the present invention; and

[0012] FIG. 3 is a plan view of the second embodiment of a radiator according to the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0013] Referring to FIGS. 1, 2 and 3, the first embodiment of a radiator unit according to the present invention includes a cooling device 10, a cooled object 20, a fan 30 and a heat removing block 40 (see FIG. 3). The cooling device 10 basically is composed of a plurality of P-type semiconductors 11 and a plurality of N-type semiconductors 12 and the P-type semiconductors 11 and the N-type semiconductors are alternately disposed to each other. Every adjacent N-type semiconductor and the P-type semiconductor is connected to each other by a conductor 13. A first substrate 14 and a second substrate 15 are used to seal and pack the P-type semiconductors 11, the N-type semiconductors 12 and the conductor 13 in a way of the conductor extending outward and exposing outside.

[0014] The heat dissipated object 20 contacts or adheres the cooling device 10 and, in a feasible implement, the second substrate 15 of the cooling device 10 is adhered to the heat dissipated object 20 to allow electrons of the N-type semiconductors 12 acquiring energy and moving to conductive band from the valence band as free electrons. The electrons are transmitted with the conductor 13 to produce current, which is reverse to moving direction of the electrons, and absorb heat at the same time. When the electrons moves to the P-type semiconductors 11, heat is released, that is, the heat is transmitted from one side to another side of the cooling device to occur Peltier effect as long as electrons pass through the N-type semiconductors 12 and the P-type semiconductors 11. In this way, the cooling device 10 forms temperature between a cold surface (the first substrate 14) and a hot surface (the second substrate 15) thereof.

[0015] Referring to FIG. 2, the heat dissipated object 20 can contact the second substrate 15 (hot surface) and the heat dissipated object 20 can be any heat generating object such as the central processing unit (CPU) of a computer, power amplifier or any other heat generating chips. The cooling device 10 performs energy transfer to change heat to electrical energy such that current flows in a circuit formed of the P-type semiconductors 11 and the N-type semiconductors connecting with the conductor 13. Besides, the conductor 13 connects with the fan 30 directly or indirectly and the current produced by the cooling device 10 drives the fan 30 to rotate.

[0016] Referring to FIG. 3, the first substrate 14 of the cooling device 10 is joined to the heat removing block 40 and low temperature at the first substrate 14 is transmitted to the heat removing block 40. The fan 30 can be mounted to heat removing block 40 and cooler air with temperature being reduced by the heat removing block 40 is blown to carry out heat exchange with other components or lower entire ambient temperature while the fan 30 rotates.

[0017] While the invention has been described with referencing to preferred embodiments thereof, it is to be understood that modifications or variations may be easily made without departing from the spirit of this invention, which is defined by the appended claims.

Claims

1. A radiator unit, comprising: a cooling device, providing a conductor; a heat dissipated object, contacting a side of the cooling device; a fan, connecting with the conductor.

2. The radiator unit as defined in claim 1, wherein the cooling device is joined to the heat removing object.

3. The radiator unit as defined in claim 2, wherein the fan is mounted to the heat removing block.

4. The radiator unit as defined in claim 1, wherein a side of cooling device is a hot surface.

5. The radiator unit as defined in claim 1, wherein a side of the cooling device is a cold surface.

6. The radiator unit as defined in claim 4, wherein the heat dissipated object contacts with the hot surface of the cooling device.