U.S. patent application number 10/648910 was filed with the patent office on 2006-08-10 for assembly comprising multiple microelectronic modules.
This patent application is currently assigned to VISTEON GLOBAL TECHNOLOGIES, INC.. Invention is credited to Andrew Z. Glovatsky, Vladimir Stoica.
Application Number | 20060176677 10/648910 |
Document ID | / |
Family ID | 36779718 |
Filed Date | 2006-08-10 |
United States Patent
Application |
20060176677 |
Kind Code |
A1 |
Glovatsky; Andrew Z. ; et
al. |
August 10, 2006 |
Assembly comprising multiple microelectronic modules
Abstract
An assembly that includes two or more microelectronic modules in
a self-sustaining structure that is adapted to be installed in a
housing. The microelectronic modules are affixed to supports that
are attached to ribs and arranged in parallel-spaced relationship.
When the assembly is received in a housing, the ribs engage the
inner wall of the housing to securely position the assembly. Also,
the ribs space the microelectronic modules apart from the housing
to facilitate coolant gas flow through the housing and thereby
improve thermal dissipation during operation.
Inventors: |
Glovatsky; Andrew Z.;
(Plymouth, MI) ; Stoica; Vladimir; (Farmington
Hills, MI) |
Correspondence
Address: |
VISTEON
C/O BRINKS HOFER GILSON & LIONE
PO BOX 10395
CHICAGO
IL
60610
US
|
Assignee: |
VISTEON GLOBAL TECHNOLOGIES,
INC.
|
Family ID: |
36779718 |
Appl. No.: |
10/648910 |
Filed: |
August 27, 2003 |
Current U.S.
Class: |
361/796 ;
361/803 |
Current CPC
Class: |
H05K 2201/2018 20130101;
H05K 1/144 20130101; H05K 7/1434 20130101; H05K 1/147 20130101 |
Class at
Publication: |
361/796 ;
361/803 |
International
Class: |
H05K 7/14 20060101
H05K007/14; H05K 1/14 20060101 H05K001/14 |
Claims
1. An assembly having an axis and comprising: a first support
perpendicular to the axis and having a first support perimeter, a
first microelectronic module affixed to the first support, a second
support perpendicular to the axis and having a second support
perimeter; a second microelectronic module affixed to the second
support; and a plurality of ribs, each rib being attached to the
first support at the first support perimeter outboard the first
microelectronic module and to the second support at the second
support perimeter outboard the second microelectronic module and
extending axially therebetween to maintain said first support and
said second support in parallel, spaced relationship.
2. The assembly of claim 1 further comprising a connector strip
connected to the first microelectronic module and to the second
microelectronic module and extending axially for connecting said
first microelectronic module and said second microelectronic module
to an external circuit.
3. The assembly of claim 1 wherein the first support perimeter and
the second support perimeter are substantially coextensive.
4. The assembly of claim 1 wherein the first support perimeter
comprises a first attachment tab, and wherein the second support
perimeter comprises a second attachment tab, and wherein the
assembly includes a rib attached to the first attachment tab and
the second attachment tab.
5. The assembly of claim 1 wherein the first microelectronic module
comprises a flexible substrate and a plurality of electronic
components attached to the flexible substrate.
6. The assembly of claim 5 wherein the second microelectronic
module comprises a flexible substrate and a plurality of electronic
components attached to the flexible substrate.
7. The assembly of claim 1 wherein the first microelectronic module
is generally circular and includes a chordal edge, and wherein the
assembly further comprises a connector strip connected to the first
microelectronic module adjacent said chordal edge.
8. An assembly of claim 1 further comprising housing having an
inner wall and a housing axis, and wherein the microelectronic
assembly is coaxially received in the housing, said ribs engaging
said inner wall and spacing said first and second microelectronic
modules and said first and second supports spaced apart from the
inner wall.
9. The assembly of claim 8 wherein the spacing between the inner
wall and the first and second microelectronic assemblies is adapted
for cooling gas flow.
Description
TECHNICAL FIELD OF THE INVENTION
[0001] This invention relates to an assembly that includes multiple
microelectronic modules and is received in a housing. More
particularly, this invention relates to such assembly that includes
outboard ribs that arrange the microelectronic modules in parallel,
spaced relationship and space the modules apart from the
housing.
BACKGROUND OF THE INVENTION
[0002] A microelectronic module comprises electronic components
mounted on a printed circuit board, which may be a rigid board of a
flexible membrane. It is known to package multiple microelectronic
modules within a housing. The modules may be joined in an assembly
to facilitate installation into the housing as a single,
self-sustaining structure. For rigid circuit boards, the modules
may be arranged in parallel, spaced relationship by posts that are
bolted or otherwise connected directly to the boards. However,
flexible membranes do not provide suitable support for flexible
membranes, so that the assembly tends to bend, resulting in damage
to the electronic components or the electrical connection.
[0003] The size and shape of the housing is largely dependent upon
the nature of the product. In some instances, it is desired to
provide a tubular housing. For example, in military missiles, the
housing may have a cylindrical shape. The microelectronic
assemblies may be arranged so that the printed circuit boards are
perpendicular to the axis, thereby providing additional volume
within the housing for other components, such as batteries,
gyroscopic components, motors or ordinants. The boards may be
installed with minimal clearance to the housing to prevent lateral
movement that might otherwise damage the modules. However, such
minimal clearance restricts the flow of coolant gas through the
housing that is needed for dissipation of heat generated by the
electronic components during operation.
[0004] Therefore, a need exists for an assembly that may be readily
installed into a housing and includes multiple microelectronic
modules that are arranged in spaced, parallel relationship, and
further wherein the assembly securely positions the modules spaced
apart from the housing to facilitate coolant gas flow through the
housing and thereby improve thermal dissipation during
operation.
SUMMARY OF THE INVENTION
[0005] In accordance with this invention, an assembly comprising
two or more microelectronic modules is provided that is adapted to
be installed in the housing. Each microelectronic module is affixed
to a support having a perimeter. Ribs are attached to the supports
at the perimeters and extend outboard of the modules. The ribs
arrange the supports, and thus the modules, in parallel, spaced
arrangement. When the assembly is received in a housing, the ribs
engage the inner wall of the housing to securely position the
assembly and prevent lateral movement that might otherwise damage
the electronic components or the electrical connections. In
addition, the ribs space the microelectronic modules apart from the
housing to permit coolant gas flow through the housing for thermal
dissipation.
SUMMARY OF THE FIGURES
[0006] This invention will be further illustrated with reference to
the accompanying drawings wherein:
[0007] FIG. 1 is a perspective view of a package comprising a
microelectronic assembly in accordance with a preferred embodiment
of this invention;
[0008] FIG. 2 showing elements of the microelectronic assembly in
FIG. 1 in preparation for forming the assembly; and
[0009] FIG. 3 is a cross sectional view of the package in FIG. 1
taken along line A-A in the direction of the arrows.
DETAILED DESCRIPTION OF THE INVENTION
[0010] In accordance with the preferred embodiment of this
invention, referring to FIGS. 1-3, a microelectronic package 10
comprises a microelectronic assembly 12 received in a tubular
housing 14. Housing 14 is preferably formed of metal and is
cylindrical about an axis 16, such that an inner wall 18
circumferentially surrounds assembly 12. By way of a preferred
example, housing 12 may be a segment of a casing of a missile.
While in FIG. 1, housing 14 is depicted as having a length similar
to assembly 12, housing 14 may be axially extended to include space
for containing additional components such as batteries, gyroscopic
components, motors or radiance.
[0011] Assembly 12 comprises a plurality of microelectronic modules
20. While the figures depict an assembly that includes three
modules 20, it will be understood that the assembly may suitably
include two or more modules, depending upon the nature of the
electronic operations to be carried out for the product. Each
module 20 comprises a substrate 22 having a perimeter 24 that is
generally circular and includes a chordal section 26. A plurality
of electronic components 28 are mounted on substrates 22 and
interconnected by circuit traces (not shown) that are carried on
the substrate. Preferably, substrates 22 are formed of flexible
dielectric membranes. Alternately, the assembly may suitably
comprise substrates that are formed of rigid boards.
[0012] Modules 20 are mounted on supports 30. Supports 30 are
preferably formed of metal to facilitate thermal dissipation of
heat generated by the electronic components during use.
Alternatively, the supports may suitably be formed of polymeric
material or ceramic. Supports 30 are shaped generally similar to
substrates 12 and include a edge 32 that is slightly outboard from
substrate 22 to protect substrates 22 from contact during handling.
Edge 32 includes a chordal section 33 adjacent chordal section 26
of the substrate. Supports 30 also include rib attachment tabs 34
that laterally protrude about edge 32. While in the Figures, the
supports are depicted as having open regions, the supports may be a
continuous plate without openings, or otherwise suitably sized and
shaped to adequately support the modules.
[0013] Modules 20 and supports 30 are arranged in parallel spaced
relationship perpendicular to axis 16 by ribs 40. Ribs 40 attach to
tabs 34, with the tabs being inserted into slots in the ribs.
Preferably, ribs 40 are formed of metal and enhance thermal
dissipation from supports 30 to housing 14 during operation. When
inserted into housing 14 to form package 10, ribs 40 contact inner
wall 18 to securely position modules 20 and supports 30 with the
housing and to space the modules and supports apart from inner wall
18. During operation, the spaces allow coolant gas to flow through
housing 14 for purposes of thermal dissipation of heat generated by
the electrical components.
[0014] Package 10 further comprises a flexible connection 50 that
includes sections 51, 52 and 53. Sections 51, 52 and 53 have
varying lengths and are attached to modules 20 adjacent chordal
portions 26 and extend axially therefrom to provide for external
connection electrical to the several modules 20.
[0015] One advantage of the preferred embodiment is that assembly
12 may be readily manufactured as a self-sustaining structure to
facilitate installation in housing 14. Referring to FIG. 2,
substrates 22, which are preferably formed of flexible polymeric
membranes, are cut to the desired shape and individually processed
to define circuit traces and populate the electronic components 28
to form the modules. Modules 20 are affixed to supports 30, either
prior to or after attachment of the electronic components. Supports
30 are then positioned in a planar arrangement, as indicated in
FIG. 2, and flexible circuit 50 is attached to each module 20
adjacent chordal section 26. It is an advantage of the preferred
embodiment that all electrical connections to the several devices
20 are made conveniently while substrates 22 are in a co-planar
arrangement and prior to positioning of the substrates in parallel
arrangement, since the co-planar arrangement provides more
convenient access to substrates 22 for purposes of making
electrical connections. Following attachment of the flexible
connection, supports 30 are then arranged in parallel, spaced
relationship, and ribs 40 attach to tabs 34, to complete assembly
12. Assembly 12 is axially inserted into housing 14 to form package
10. It is pointed out that modules 20 are protected during handling
and positioning of assembly 12 within housing 14 by edges 32 of
supports 30 and ribs 40 that are disposed outboard from substrates
22.
[0016] During operation, heat generated by electrical components is
dissipated by conduction through supports 30 and ribs 40 to housing
14. Also, heat is dissipated by connection via coolant gas flow
axially through housing 14. Referring to FIG. 3, the ribs 40
position supports 30 to create a gap that substantially encircles
modules 20. Also, because of the configuration of substrates 22 and
supports 30 in the preferred embodiment, a relatively large gap 60
is formed adjacent chordal sections 26. Because of the gaps 62
about devices 20 apart from gap 60, coolant gas flows from space 60
through the space between adjacent devices 20. The increased
circulation of coolant gas about devices 20 provides for enhanced
thermal dissipation.
[0017] Therefore, this invention provides a compact, robust
microelectronic assembly that includes multiple microelectronic
modules that are mounted on planar supports and formed into a
structure wherein the modules are in spaced, parallel arrangement.
In this manner, the axial volume occupied by the modules in the
housing may be reduced to increase the volume available for
packaging additional components. The ribs join the microelectronic
devices and supports into a self-sustaining structure to facilitate
handling and installation into a tubular housing. During operation,
the ribs and supports preferably conduct heat from the modules to
the housing to maintain the electronic components at desired
operating temperatures. Thermal dissipation is further enhanced by
spacing between the supports and the housing that allows coolant
gas flow about the modules.
[0018] While this invention has been described in terms of the
particular embodiments thereof, it is not intended to be so
limited, but rather only to the extent set forth in the claims that
follow.
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