U.S. patent application number 11/157068 was filed with the patent office on 2006-08-10 for high-frequency switch in multi-layer substrate.
This patent application is currently assigned to Industrial Technology Research Institute. Invention is credited to Chang-Sheng Chen, Uei-Ming Jow, Ying-Jiunn Lai, Chang-Lin Wei, Ching-Liang Weng, Syun Yu.
Application Number | 20060176123 11/157068 |
Document ID | / |
Family ID | 36779352 |
Filed Date | 2006-08-10 |
United States Patent
Application |
20060176123 |
Kind Code |
A1 |
Wei; Chang-Lin ; et
al. |
August 10, 2006 |
High-frequency switch in multi-layer substrate
Abstract
A switch module consists of a build-up multi-layer structure and
some passive devices. The build-up multi-layer structure has
multitudes of conductive layers and dielectric layers laminated
upon each another. At least one dielectric layer is interfered
between any two conductive layers. Any one passive device is a
portion of at least one conductive layer and electrically connects
multitudes of conductive pads on the surface of the build-up
multi-layer structure.
Inventors: |
Wei; Chang-Lin; (Miao-Li,
TW) ; Weng; Ching-Liang; (Taipei City, TW) ;
Jow; Uei-Ming; (Taichung City, TW) ; Lai;
Ying-Jiunn; (Pintugn, TW) ; Yu; Syun; (Chia-I
City, TW) ; Chen; Chang-Sheng; (Taipei City,
TW) |
Correspondence
Address: |
GENUS LAW GROUP;LOWE HAUPTMAN & BERNER, LLP
1700 DIAGONAL ROAD, SUITE 300
ALEXANDRIA
VA
22314
US
|
Assignee: |
Industrial Technology Research
Institute
|
Family ID: |
36779352 |
Appl. No.: |
11/157068 |
Filed: |
June 20, 2005 |
Current U.S.
Class: |
333/104 |
Current CPC
Class: |
H05K 1/162 20130101;
H05K 1/0237 20130101; H05K 1/113 20130101; H01P 1/15 20130101; H05K
3/4644 20130101; H05K 2201/09672 20130101; H05K 1/165 20130101;
H05K 1/167 20130101 |
Class at
Publication: |
333/104 |
International
Class: |
H01P 1/10 20060101
H01P001/10 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 4, 2005 |
TW |
094103505 |
Claims
1. A switch module comprising: a build-up multi-layer structure,
said build-up multi-layer structure comprises a plurality of
conductive layers and a plurality of dielectric layers laminated
upon each another, wherein any two of said plurality of conductive
layers have at least any said plurality of dielectric layers
between; and at least a passive device being formed of a portion of
at least any said plurality of conductive layer and being
electrically connected to a plurality of conductive pads, wherein
said plurality of conductive pads are placed upon at least a
surface of said build-up multi-layer structure.
2. A switch module according to claim 1, wherein said passive
device comprises a capacitance device.
3. A switch module according to claim 2, wherein an upper
polarization plate and a lower polarization plate of said
capacitance device are respectively placed upon distinct but
adjacent two of said plurality of conductive layers, and said upper
polarization plate and said lower polarization plate overlap with
positions of up-and-down symmetry.
4. A switch module according to claim 3, wherein said upper
polarization plate and said lower polarization plate are
respectively connected to any said plurality of conductive pads by
a conductive connection structure, wherein said conductive
connection structure is placed on the dielectric layer between said
upper polarization plate and said lower polarization plate.
5. A switch module according to claim 4, wherein said conductive
connection structure comprises a conductive blind hole.
6. A switch module according to claim 1, wherein said passive
device comprises a resistance device.
7. A switch module according to claim 6, wherein said resistance
device further comprises a principle part of resistor contacting
said plurality of conductive pads and being placed upon said
surface.
8. A switch module according to claim 1, wherein said passive
device comprises a capacitance device.
9. A switch module according to claim 8, wherein said capacitance
further comprises at least a conductive coil contacting said
plurality of conductive pads and being placed upon said
surface.
10. A switch module according to claim 9, wherein said capacitance
device further comprises at least two conductive blind holes
respectively contacting said conductive coil and one of said
plurality of conductive pads, and at least a conductive tracking
line placed on said build-up multi-layer structure for contacting
said two conductive blind holes.
11. A switch module according to claim 1 further comprising at
least a conductive connection structure being placed upon said
build-up multi-layer structure and penetrating at least one of said
plurality of dielectric layer.
12. A switch module according to claim 2, wherein said conductive
connection structure comprises at least a conductive buried
hole.
13. A Single-Pole Double-Throw (SPDT) module comprising: a build-up
multi-layer structure, said build-up multi-layer structure
comprising: a plurality of conductive layers paralleled each
another, wherein two of said plurality of conductive layers being
placed upon two surfaces of said build-up multi-layer structure; a
plurality of dielectric layers, wherein any said plurality of
dielectric layers being interfered between any two of said
plurality of conductive layers; and a plurality of conductive
connection structures, wherein a portion of said plurality of
conductive connection structures piercing through a portion of said
plurality of dielectric layers to contact and connect to at least
any two of said plurality of conductive layers; a resistance device
being formed of a portion of the conductive layer placing upon said
surface; a capacitance device having at least an upper polarization
plate, a lower polarization plate, distinct two of said plurality
of conductive connection structures and two first conductive pads,
wherein said upper polarization plate and said lower polarization
plate being respectively formed of a portion of any two distinct
and adjacent said conductive layers, said distinct two of said
plurality of conductive connection structures being respectively
contacting said upper polarization plate and said lower
polarization plate, said distinct two of said plurality of said
conductive connection structures being respectively contacting any
said plurality of first conductive pads, and any said plurality of
first conductive pads being a portion of the conductive layer
placing upon any said surfaces; and an inductance device having at
least a conductive coil and two second conductive pads, said
conductive coil and said two second conductive pads being a portion
of the conductive layer placing upon any said surfaces and said
conductive coil being electrically connected to said two second
conductive pads.
14. A SPDT module according to claim 13, wherein any said plurality
of conductive connection structures comprises at least a conductive
blind hole penetrating at least one of said plurality of conductive
dielectric layers.
15. A SPDT module according to claim 14, wherein any said plurality
of conductive connection structures further comprises at least a
conductive tracking line contacting and connecting to said
conductive blind hole.
16. A SPDT module according to claim 13, wherein said upper
polarization plate and said lower polarization plate have
overlapping position between.
17. A SPDT module according to claim 13, wherein any said plurality
of conductive layers is formed of a copper foil layer.
18. A SPDT module according to claim 13 further comprising a diode
device fastening upon the conductive layer of any said surfaces.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates generally to a switch
structure for wireless communication, and more particularly to
provide a structure for manufacturing a RF switch by reference to a
build-up multi-player.
[0003] 2. Description of the Prior Art
[0004] Low cost and miniaturization are one of the important goals
for wireless communication, digital computers and portable
electronic apparatus. For example, since the RF (Radio Frequency)
switch of a RF front-end module controls the select antenna,
switches between the antenna end and receiver end, and switches
between the antenna end and-transmitter end, it's one of the key
components for wireless communication.
[0005] A RF switch is composed of ICs and passive devices, and
since the passive devices of the current RF switch are restricted
to the surface mount devices, it's not efficient for minimizing the
usage area of the circuitry board even if the layout of the
circuitry is changed, and remain restricted to miniaturization
process.
SUMMARY OF THE INVENTION
[0006] With respect to the tendency of miniaturization for
high-speed wireless communication products, a structure for a RF
switch is proposed herein. Comparing to surface mount devices, to
integrate each kind of passive device into a multi-layer board may
efficiently reduce numbers of components.
[0007] Moreover, for designing a low-cost RF switch, herein a
build-up multi-layer structure within passive devices is provided.
By utilizing inner, outer conductive layers and the contacted
conductive connection structure thereof, it's able to manufacture
surface-type and built-in passive devices.
[0008] For providing the needed RF switch of wireless
communication, furthermore, a single-pole double-throw (SPDT)
module is provided. Except to diodes, other essential passive
devices could be made in the way of manufacturing a build-up
multi-layer and thus no surface mount technique (SMT) is needed to
combine passive devices, thereby reducing the volume or area of
wireless communication products.
[0009] Accordingly, in an embodiment of the invention, a switch
module composed of a build-up multi-layer structure and several
passive devices is presented. A build-up multi-layer structure
includes a plurality of conductive layers and a plurality of
dielectric layers laminated upon each another, wherein there is at
least one dielectric layer being interfered between any two
conductive layers. Any one passive device is a portion of at least
one conductive layer and electrically connects multitudes of
conductive pads on the surface of the build-up multi-layer
structure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1A is a front perspective view of a built-in
capacitance in accordance with a first embodiment of the present
invention;
[0011] FIG. 1B is a sectional view of the built-in capacitance in
accordance with the first embodiment of the present invention;
[0012] FIG. 1C is a sectional view of an built-in capacitance in
accordance with a second embodiment of the present invention;
[0013] FIG. 2A is a front perspective view of a built-in resistance
in accordance with the first embodiment of the present
invention;
[0014] FIG. 2B is a sectional view of the built-in resistance in
accordance with the first embodiment of the present invention;
[0015] FIG. 3A is a front view of a surface inductance in
accordance with the first embodiment of the present invention;
[0016] FIG. 3B is a front view of an inductance device in
accordance with the second embodiment of the present invention;
[0017] FIG. 3C is the sectional view of the built-in capacitance
shown in FIG. 3B; and
[0018] FIG. 4 depicts a layout diagram, which illustrates an
embodiment electronic module having each device.
DETAILED DESCRIPTION OF THE INVENTION
[0019] Diagrams of embodiments of the present invention will be
described in detail in the following. Beside the detailed
descriptions, diagrams for representing a build-up multi-layer are
enlarged but the scope of the present invention should not be
regarded as limiting to those diagrams. In addition, a practical
build-up multi-layer may comprise other essential components of the
structure.
[0020] Moreover, though some embodiment diagrams are illustrated
with single component or structure only, the scope of the present
invention is not limited to. When the following descriptions that
do not enhance on the limitation of numbers, spirit and the scope
of the present invention should be expanded to cover the methods or
structures with multiple components.
[0021] FIG. 1A depicts a front perspective view of a built-in
capacitor (or embedded capacitor) in accordance with the first
embodiment of the invention. In a build-up multi-layer structure
10, any two adjacent inner conductive layers (separated by a
dielectric layer) paralleled to each another forms an upper
polarization plate 16b and a lower polarization plate 18a, wherein
the upper polarization plate 16b contacts and pierces through the
conductive connection structure (not shown in the drawing) of the
build-up multi-layer structure 10 to connect to a conductive pad
14b upon the outer conductive layer. The lower polarization plate
18a contacts and pierces through the conductive connection
structure 15a, 15b to connect to a conductive pad 14a located upon
the outer conductive layer. According to the conductive pads 14a
and 14b locating upon the outer conductive layer, it is connectable
to the outside for controlling the built-in capacitor.
[0022] FIG. 1B depicts the sectional view of the built-in capacitor
in accordance with the first embodiment of the present invention.
The build-up multi-layer structure 10 is formed of a plurality of
conductive layers, in which a dielectric layer is interfered
between any two adjacent inner conductive layers. In an embodiment
of the invention, the build-up multi-layer structure 10 comprises
the parallel inner conductive layers 16, 18, 20 and 22 and outer
conductive layers 14 and 24, wherein each conductive layer is
separated by dielectric layers 12a, 12b, 12c, 12d and 12e
respectively. Considering the data transmission, in a preferred
embodiment of the invention, dielectric layers 12a and 12b may be
made of the same material, for example the RCC/pre-preg of low
dielectric constant, as applying to a symmetrical build-up
structure, thereby reducing the power loss and the propagation
delay under a high-frequency/high-speed transmission. Dielectric
layers 12b and 12d may also be made of the same material, for
example the RCC of a high dielectric constant, to design the
built-in capacitor. Dielectric layer 12c may be made of a core
substrate material for improving the mechanical intensity of the
whole structure. Noticed that, however, the material of each
dielectric layer mentioned above is not limited.
[0023] Moreover, the inner conductive layers 16, 18, 20, and 22 are
made of thin copper foil plates, after a general circuit layout and
black/brown process, they further laminate with the outer
conductive layers 14, 24 and the dielectric layers 12a, 12b, 12c,
12d and 12e by a build-up method. In this embodiment, layouts of
the inner conductive layers 16, 18, 20, 22 comprise upper and lower
polarization plates 16b, 18a and 20a, 22b of capacitance devices,
wherein the paired upper and lower polarization plates 16b, 18a
separated by the dielectric layer 12b is of particular and
similar-sized geometrical shapes, for example a rectangle, to
satisfy the demand for a capacitor. Next, the position thereof is
almost overlapped completely, and is not electrically connected
with the other circuit lines of its existing inner conductive
layer, so does the paired upper and lower polarization plate 20a
and 22b. Furthermore, the paired upper and lower polarization
plates 16b, 18a (or 20a, 22b) have to connect and contact the
conductive pads 14b, 14a (or 24a, 24b) placing upon the outer
conductive layer 14 (or 24) by piercing through the conductive
connection structures 15b and 15a (or 17a, 17b). In the embodiment,
the conductive connection structures 15b, 15a, 17a and 17b comprise
a conductive blind hole, a conductive buried hole penetrating at
least a dielectric layer, must be able to connect to the conductive
blind holes or the conductive buried holes, which are penetrating
different dielectric layers, by a portion of conductive tracking
lines or connecting pads upon the inner conductive layers.
[0024] According to above-mentioned descriptions, the spirit of the
present invention is to utilize the up-and-down symmetrical
characteristics of the build-up multi-layer structure 10 to proceed
a double-side layout design, thereby reducing the module's size and
cost. Next, the build-up multi-layer structure 10 in the embodiment
is manufactured by the 2+2+2 build-up method of a higher yield,
which also reduces the cost. It's noticed that, the build-up
multi-layer 10 of the present invention is not limited to a
six-layer plate but also applies to the four, eight or ten layer
build-up multi-layer structure.
[0025] FIG. 1C is a sectional view of a built-in capacitor in
accordance with the second embodiment of the present invention. The
build-up multi-layer structure 10 comprises inner conductive layers
16, 18, 20, 22 and outer conductive layers 14, 24, wherein each is
separated by a dielectric layer 12a, 12b, 12c, 12d, and 12e
sequentially. The major difference to the first embodiment is, the
present second embodiment lays out one or multiple built-in
capacitors merely on a single side. Presently, the upper and lower
polarization plates may respectively be placed upon any two
adjacent inner conductive layers, as shown in the drawing, the
upper and lower polarization plates 20b and 20a are placed upon the
inner conductive layers 20 and 22 respectively. It's understood
that, now the conductive connection structures 15a and 15b are
respectively composed of conductive blind holes, conductive buried
holes penetrating multiple dielectric layers, and the conductive
tracking lines or connecting pads that connect the conductive blind
holes or the conductive buried holes penetrating the different
dielectric layers.
[0026] FIG. 2A depicts a front perspective view of a built-in
resistor (or embedded resistor) in accordance with the first
embodiment of the invention. The principle part of resistor 16a is
placed on any conductive layer, which connects to a conductive pad
14a upon outer conductive layer by contacting and piercing through
several conductive connection structure 15a of the build-up
multi-layer structure 10. With the conductive pad 14a upon outer
conductive layer, it's connectable to the outside for controlling
the built-in resistor.
[0027] FIG. 2B depicts the sectional view of the built-in resistor
in accordance with the second embodiment of the present invention.
As well as manufacturing a built-in capacitor, the build-up
multi-layer structure 10 comprises inner conductive layers 16, 18,
20, 22 and outer conductive layers 14, 24, wherein each is
separated by dielectric layer 12a, 12b, 12c, 12d, and 12e
sequentially. Some principle parts of resistor 16a or 20c are
respectively placed on any inner conductive layers 16 or 20, have
geometry shapes of particular size, and are not electrically
connected with other circuit lines upon their exiting inner
conductive layers. Moreover, the principle part of the resistor 16a
or 20c contacts the conductive connection structure 15a or 17a, for
instance the conductive blind holes, at the edges or terminals of
the geometrical shape, and be contacted/connected to the conductive
pad 14a (or 24a) placing upon the outer conductive layer 14 by
reference to the conductive connection structure 15a or 17a.
[0028] FIG. 3A is a front view of a surface inductor manufactured
in accordance with the first embodiment of the invention. There are
one or few surface inductors arid other conductive lines (not shown
in the drawing) located upon a surface 10a of the build-up
multi-layer structure 10. Each surface inductor is formed of a
conductive coil 14a paralleled with each other and terminals of the
conductive coil 14c contacted with two conductive pads 14a. Numbers
of coils, width and length of the conductive coil 14c vary for
different demands, and the geometrical shape, size thereof also
varies accordingly, which is not limited to the drawings.
[0029] FIG. 3B is a front view of an inductance device manufactured
in accordance with the second embodiment of the present invention.
The difference to the first embodiment lies on that at least one
conductive coil 14c is distributed in concentric circles. Moreover,
although one terminal of conductive coil 14c and any conductive pad
14a are placed on the same surface 10a, both of them are contacted
and connected with each other according to the conductive
connection structure 15a and conductive tracking line 16c. In this
embodiment, the conductive connection structure 15a is composed of
conductive blind holes connecting to one terminal of the conductive
coil 14c with any conductive pad 14a and the conductive tracking
line 16c between therein, wherein the conductive tracking line 16c
is placed on any inner conductive layer.
[0030] FIG. 3C is the sectional view of FIG. 3B. The build-up
multi-layer structure 10 contains inner conductive layers 16, 18,
20, 22 and outer conductive layers 14, 24, wherein each is
separated by dielectric layers 12a, 12b, 12c, 12d, and 12e
respectively. Two conductive pads 14a and conductive coil 14c are
placed on the outer conductive layer, and the conductive connection
structure 15a contains conductive tracking lines 16c placed on the
inner conductive layer 16 and the conductive blind holes connecting
to two terminals of the conductive coil 16c. It's understood that,
conductive tracking lines and the conductive blind holes connecting
with the conductive tracking lines are not limited to the drawing,
multi-layer conductive blind holes and the multi-layer conductive
tracking lines also do not depart the scope of the present
invention.
[0031] FIG. 4 is a layout diagram, which illustrates the embodiment
of the electronic module having each of the aforementioned kind of
passive devices. Referring to FIG. 4, a SPDT module 100 includes of
an input end 121, two output ends 122 and 123, two resistors 117
and 118, eight capacitors 102, 104, 109, 110, 111, 112, 115, and
116, two inductors 105, 106 and two diode IC (or transistor IC) 107
and 108. The operational principle thereof is to utilize the
control signals to control "ON" or "OFF" of the diode IC 107 and
108, making the input signals of the input end 121 being able to
selectively output through the output ends 122 or 124 and being as
well as a switch.
[0032] With comparisons to a conventional SPDT module of using
surface mount devices (SMD), SPDT module 100 of the present
invention adopts the surface-type or built-in passive devices of
all the aforementioned figures, which is able to reduce the usage
area of circuit board effectively. For example, the needed usage
area of circuit board for a conventional SPDT module is about the
size of 1000 mil*400 mil, but those for the presented SPDT module
having the same operational function is about 440 mil*300 mil,
which is 70% less than the conventional one.
[0033] According to the above-mentioned descriptions, the spirit of
the present invention is to manufacture each kind of passive device
with a build-up multi-layer structure. For example, the way of
using HDI (high density interconnection) build-up multi-layer board
to integrate the needed passive devices of a RF switch, i.e. the
capacitors, inductors and resistors, into the multi-layer board
could be applied to the RF front-end modules for wireless
communication or portable electronic products, thereby achieving
the goals of reducing cost and miniaturization.
[0034] Accordingly, a SPDT module having a build-up multi-layer
structure, few of resistance devices, capacitance devices and
inductance devices are provided in an embodiment of the present
invention. The build-up multi-layer structure contains multitudes
of conductive layers paralleled each another, wherein two
conductive layers are placed on two surfaces of the build-up
multi-layer structure; multitudes of dielectric layers, wherein any
dielectric layer is separated between any two adjacent conductive
layers; and a plurality of conductive connection structures,
wherein some conductive connection structures pierce through a
portion of dielectric layers to contact and connect to any two
conductive layers. Resistance devices are composed of parts of the
conductive layers placed on a surface. Capacitance device are
composed of an upper polarization plate, a lower polarization
plate, two distinct conductive connection structures and two first
conductive pads, the upper polarization plate and lower
polarization plate are respectively formed of a portion of two
distinct and adjacent conductive layers, wherein the two distinct
conductive connection structures respectively contacts the upper
polarization plate and lower polarization plate, the two distinct
conductive connection structures respectively connect any first
conductive pad and any first conductive pad is a portion of the
conductive layer upon any surface of the build-up multi-layer
structure. Inductance devices are composed of at least one
conductive coil and two second conductive pads, the conductive coil
and the two second conductive pads are a portion of the conductive
layer upon any surface of the build-up multi-layer structure and
the conductive coil further electrically connects to two second
conductive pads.
[0035] Although specific embodiments have been illustrated and
described, it will be obvious to those skilled in the art that
various modifications may be made without departing from what is
intended to be limited solely by the appended claims.
* * * * *