U.S. patent application number 11/045266 was filed with the patent office on 2006-08-03 for heat-dissipation apparatus of portable computer.
This patent application is currently assigned to Chaun-Choung Technology Corp.. Invention is credited to Chung Wu.
Application Number | 20060171113 11/045266 |
Document ID | / |
Family ID | 36756298 |
Filed Date | 2006-08-03 |
United States Patent
Application |
20060171113 |
Kind Code |
A1 |
Wu; Chung |
August 3, 2006 |
Heat-dissipation apparatus of portable computer
Abstract
A heat-dissipation apparatus of the portable computer is
fabricated in a host and a display unit pivotal connected therein
for dissipating the heat from the electronic component. The
apparatus has a conductive part whose thickness is designed to be
equal to the thickness of the portable computer when closed. The
conductive part has a first connecting portion and a second
connecting portion, which the second connecting portion is used to
be inserted by a cooling end of a first heat pipe. The heating end
of the first heat pipe extends into the host and faces to the
electronic component. The first connecting portion is used to be
inserted by a heating end of a second heat pipe. The cooling end of
the second heat pipe extends to the display unit.
Inventors: |
Wu; Chung; (Taipei,
TW) |
Correspondence
Address: |
HDSL
4331 STEVENS BATTLE LANE
FAIRFAX
VA
22033
US
|
Assignee: |
Chaun-Choung Technology
Corp.
|
Family ID: |
36756298 |
Appl. No.: |
11/045266 |
Filed: |
January 31, 2005 |
Current U.S.
Class: |
361/679.26 |
Current CPC
Class: |
G06F 1/203 20130101;
G06F 2200/203 20130101 |
Class at
Publication: |
361/687 |
International
Class: |
G06F 1/20 20060101
G06F001/20 |
Claims
1. A heat-dissipation apparatus of portable computer fabricated in
a host and a display unit pivotal connected together for cooling
down an electronic component in the host, comprising: a conductive
part fabricated between the host and the display unit and having a
first connecting portion and a second connecting portion; a first
heat pipe having a cooling end connecting to the second connecting
portion and a heating end extending into the host; and a second
heat pipe having a heating end connecting to the first connecting
portion and a cooling end extending to the display unit.
2. The heat-dissipation apparatus of portable computer of claim 1,
wherein the first connecting portion and the second connecting
portion are positioned at different axes of the conductive part
apart.
3. The heat-dissipation apparatus of portable computer of claim 1,
wherein the first connecting portion and the second connecting
portion are separated by an interval of the conductive part
apart.
4. The heat-dissipation apparatus of portable computer of claim 1,
wherein the first connecting portion and the second connecting
portion are through holes of the conductive part.
5. The heat-dissipation apparatus of portable computer of claim 1,
wherein the first connecting portion and the second connecting
portion are indents on the conductive part.
6. The heat-dissipation apparatus of portable computer of claim 1,
wherein the first connecting portion has a cover whereon.
7. The heat-dissipation apparatus of portable computer of claim 1,
wherein the first connecting portion is a through hole and the
second connecting portion is an indent on the conductive part.
8. The heat-dissipation apparatus of portable computer of claim 1,
wherein the heating end of the first heat pipe extends into the
host and connects to a heat sink, which faces to a surface of the
electronic component.
9. The heat-dissipation apparatus of portable computer of claim 1,
wherein the thickness of the conductive part is equal to the
thickness of the portable computer when closed.
10. The heat-dissipation apparatus of portable computer of claim 3,
wherein the interval of the first heat pipe and the second heat
pipe fabricated in the conductive part is equal to the thickness
between the electronic component of the host and the display unit
when portable computer closed.
Description
BACKGROUND OF THE INVENTION
[0001] The present invention relates in general to a
heat-dissipation apparatus of a portable computer, and more
particular, to an apparatus which has a conductive part with the
different axes for fabricating a first heat pipe extending onto the
electronic component, and a second heat pipe extending to a display
unit. The conductive part is not a hinge, so it has nothing to do
with the supporting force of the portable computer. The thickness
of the conductive part can be adjusted to fit the thickness of the
portable computer for keeping the heat pipe being relative to the
electronic component smoothly.
[0002] Nowadays, the portable computer needs to be reduced its
weight and size for carrying out. The space of host of the portable
computer therefore is reduced comparatively, specially the space
for fabricating heat-dissipation apparatus. Due to the processing
speed of the computer is much faster than before, the
heat-dissipation issue is become much more important, too. How to
compromise between larger space and better heat conductibility will
be an important issue for manufacturer.
[0003] Conventional heat pipe has an excellent heat conductibility
so as to be used in the heat-dissipation module usually. One
example is referring to an U.S. Pat. No. 6,122,166 disclosed a
personal computer cooling device having hinged heat pipe. The
cooling device is composed by a first heat pipe and a second heat
pipe, which forms a hinge at the same time by their combination for
connecting the host and the display unit of the portable computer.
One end of the first heat pipe is a hollow pipe which provides for
the second heat pipe pivoted therein, and another end of the first
heat pipe extends around the display unit. The end of the second
heat pipe opposite to the end pivoted in the first heat pipe
extends to a heat source of the host of the portable computer.
Therefore, the first heat pipe will conduct the heat from the heat
source to the second heat pipe, and second heat pipe dissipate the
heat. That will save the space of the portable computer and leave
another hinge structure out. But the above-mentioned hinge combined
by the heat pipes can not provide a proper supporting force to
handle the opening motion of the portable computer, and the
combination of the heat pipes is not easier to fit different types
of variable portable computers. If the heat pipes are unsuited to
the specific portable computer by means of the wrong enforcement,
the incorrect bending angle, or a difference between the heat pipes
and the portable computer, they will raise during the portable
computer opened. The efficiency of conduction will drop
therefor.
BRIEF SUMMARY OF THE INVENTION
[0004] The present invention provides a new design for relocation
the heat-dissipation apparatus of the portable computer, wherein
comprises a conductive part having a first heat pipe extending to a
electronic component and a second heat pipe extending to a display
unit which has a different height from the first heat pipe. Due to
the heat pipes do not provide the supporting force like a hinge of
the portable computer, they are easier to be adjusted for fitting
the portable computer. Furthermore, they will be kept flat on the
electronic component, but raised.
[0005] The objectives of the present invention will become obvious
to those of ordinary skill in the art after reading the following
detailed description of preferred embodiments.
[0006] It is to be understood that both the foregoing general
description and the following detailed description are exemplary,
and are intended to provide further explanation of the invention as
claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] These as well as other features of the present invention
will become more apparent upon reference to the drawings
therein:
[0008] FIG. 1 is a structural exploding schematic view of the
heat-dissipation device as disclosed in the embodiment of this
invention.
[0009] FIG. 2 is a structural combining schematic view of the
heat-dissipation device as disclosed in the embodiment of this
invention.
[0010] FIG. 3 is a three dimensional schematic view of the
heat-dissipation device applied in a portable computer as disclosed
in the embodiment of this invention.
[0011] FIG. 4 is a lateral schematic view of the heat-dissipation
device applied in a portable computer opened as disclosed in the
embodiment of this invention.
[0012] FIG. 5 is a lateral schematic view of the heat-dissipation
device applied in a portable computer closed as disclosed in the
embodiment of this invention.
[0013] FIG. 6 is a structural exploding schematic view of the
heat-dissipation device as disclosed in another embodiment of this
invention.
[0014] FIG. 7 is a structural exploding schematic view of the
heat-dissipation device as disclosed in the other embodiment of
this invention.
DETAILED DESCRIPTION OF THE INVENTION
[0015] Reference will now be made in detail to the preferred
embodiments of the present invention, examples of which are
illustrated in the accompanying drawings. Wherever possible, the
same reference numbers are used in the drawings and the description
to refer to the same or like parts.
[0016] Please refer to FIGS. 1, 2, and 3. The heat-dissipation
apparatus of portable computer of this invention comprises a
portable computer 1, a conductive part 2 adjacent to a hinge of the
portable computer 1, a first heat pipe 3, and a second heat pipe 4
at a different position from the first heat pipe 3.
[0017] The portable computer 1 comprises a host 11 and a display
unit 12, which are pivotally combined together by a hinge 13.
Therefore, the host 11 and the display unit 12 can be operated,
such as be opened or be closed relatively, according to the hinge
13.
[0018] The conductive part 2 is made of a material with high heat
conductibility. It is composed adjacent to the hinge 13 between the
host 11 and the display unit 12. The conductive part 2 comprises a
first connecting portion 21 and a second connecting portion 22
thereon. They are suitable for the first heat pipe 3 and the second
heat pipe 4 individually inserted therein by different axes.
[0019] The first connecting portion 21 is a through hole of the
conductive part 2 for the second heat pipe 4 fabricating therein
relatively. The second connecting portion 22 is an indent beneath
the conductive part 2 for the first heat pipe 3 fabricating
thereon. Therefore, the first heat pipe 3 and the second heat pipe
4 are positioned at different axes individually. There is an
interval between them. The conductive part 2 is conductive and
rotatable according to operation of the display unit 12 related to
the host 11.
[0020] Please refer to FIG. 6, it shows another embodiment of the
first connecting portion 21. It is fabricated on the conductive
part 2 by the same method of the second connecting portion 22, to
from a first connecting portion 21a. There is a cover 23 on the
first connecting portion 21a. Therefore, the second heat pipe 4
will be inserted in to the first connecting portion 21a and rotate
according the operation of the display unit 12.
[0021] The first heat pipe 3 has a cooling end connecting to the
second connecting portion 22 at the bottom of the conductive part
2, and a heating end extending into a recess 141 of the heat sink
14, wherein the heat sink 14 has a broader surface facing to the
electronic component 15 for improving heat transferring.
[0022] The second heat pipe 4 has a heating end connecting to the
first connecting portion 21 of the conductive part 2, and a cooling
end extending to an area around a display zone 120 of the display
unit 12.
[0023] The heat sink 14 is used to absorb the heat from the
electronic component 15, and transfer to the heating end 31 of the
first heat pipe 3. The first heat pipe 3 conducts the heat to the
conductive part 2 via the cooling end 32 and dissipates the heat.
Than the heating end 41 of the second heat pipe 4 absorbs the heat
from the conductive part 2. The second heat pipe 4 will conducts
the heat to the area around the display zone 120 of the display
unit 12 via the cooling end 42 and dissipates the heat.
[0024] The interval between the first heat pipe 3 and the second
heat pipe 4 of the conductive part 2 is shown in FIG. 5. It is just
equal to the thickness between the electronic component 15 of the
host 11 and the display unit 12 of the portable computer 1 when
closed. That is, the thickness of the conductive part 2 is equal to
the thickness of the portable computer 1 when closed. According to
this reason, the thickness of the conductive part 2 is designed to
be equal to the thickness of the portable computer 1 when closed.
The heating end of the first heat pipe 3 won't be tear off from the
heat sink 14, if the first heat pipe 3 and the second heat pipe 4
of the conductive part 2 are not suitable to the operation of the
portable computer 1. The flatness between the heat sink 14 and the
electronic component 15 become poorer, furthermore, the conductive
efficiency of the heat-dissipation apparatus will drop
therefor.
[0025] Please refer to FIG. 3. According to the above-mentioned
heat-dissipation apparatus having the first heat pipe 3, and the
second heat pipe 4 of the conductive part 2 is fabricated in the
portable computer 1. The first heat pipe 3 of the conductive part 2
is fabricated in the host 11, and the second heat pipe 4 is
fabricated adjacent to the display unit 12, and the conductive part
2 between the first heat pipe 3 and the second heat pipe 4 is a
media for transferring the heat. Hence, the conductive part 2 has
no any supporting function like a hinge. Because of the second heat
pipe 4 freely inserting into the first connecting portion 21, the
second heat pipe 4 will rotate according to the axis of the first
connecting portion 21 when the display unit 12 operating, such like
opening operation referring to FIG. 4 or closing operation
referring to FIG. 5. The supporting force between the host 11 and
the display unit 12 won't be influenced. The advantage of the
above-mentioned heat-dissipation apparatus includes keeping the
flatness between the electronic component and the heat pipe and not
affecting the supporting force by the hinge according to the design
of the thickness of the conductive part is equal to the thickness
of the portable computer smoothly.
[0026] Furthermore, the second connecting portion 22 of the
conductive part 2 is a through hole thereon. The cooling end 32 of
the first heat pipe 3 is relatively a cylinder pipe for inserting
into the second connecting portion 22. The heating end 31 of the
first heat pipe 3 is a flat pipe for fabricating in the recess 141
of the heat sink 14 easily.
[0027] While an illustrative and presently preferred embodiment of
the invention has been described in detail herein, it is to be
understood that the inventive concepts may be otherwise variously
embodied and employed and that the appended claims are intended to
be construed to include such variations except insofar as limited
by the prior art.
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