U.S. patent application number 11/393494 was filed with the patent office on 2006-08-03 for method for providing an electrical connection.
This patent application is currently assigned to Elster Electricity, LLC. Invention is credited to Garry M. Loy, Kenneth C. Shuey.
Application Number | 20060168804 11/393494 |
Document ID | / |
Family ID | 35059046 |
Filed Date | 2006-08-03 |
United States Patent
Application |
20060168804 |
Kind Code |
A1 |
Loy; Garry M. ; et
al. |
August 3, 2006 |
Method for providing an electrical connection
Abstract
A preferred method for electrically connecting a first and a
second component includes inserting a wire pin through a through
hole formed in the first component so that a first portion of the
wire pin is located within the through hole and a second portion of
the wire pin is located within a retaining feature formed at least
in part by the second component. The preferred method also includes
moving one of the first and the second components in relation to
the other of the first and the second components so that the wire
pin resiliently deflects thereby establishing a first contact force
between the first portion of the wire and the first components and
a second contact force between the second portion of the wire and
the second component.
Inventors: |
Loy; Garry M.; (Raleigh,
NC) ; Shuey; Kenneth C.; (Zebulon, NC) |
Correspondence
Address: |
WOODCOCK WASHBURN LLP
ONE LIBERTY PLACE, 46TH FLOOR
1650 MARKET STREET
PHILADELPHIA
PA
19103
US
|
Assignee: |
Elster Electricity, LLC
|
Family ID: |
35059046 |
Appl. No.: |
11/393494 |
Filed: |
March 30, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10813841 |
Mar 31, 2004 |
7051432 |
|
|
11393494 |
Mar 30, 2006 |
|
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|
Current U.S.
Class: |
29/838 ; 29/832;
29/837 |
Current CPC
Class: |
H05K 3/368 20130101;
Y10T 29/49144 20150115; H05K 3/308 20130101; G01R 22/065 20130101;
Y10T 29/4914 20150115; Y10T 29/49147 20150115; Y10T 29/49139
20150115; B23K 2101/32 20180801; H01R 13/193 20130101; Y10T
29/53174 20150115; Y10T 29/4913 20150115; Y10T 29/53183 20150115;
H05K 2203/0271 20130101; H05K 2201/10303 20130101; H05K 2201/10287
20130101; B23K 1/0008 20130101 |
Class at
Publication: |
029/838 ;
029/837; 029/832 |
International
Class: |
H05K 3/30 20060101
H05K003/30 |
Claims
1. A method for electrically connecting a component and a printed
circuit board, comprising: inserting a wire pin through a first
through hole formed in the component so that a first portion of the
wire pin is located within the first through hole and a second
portion of the wire pin is located within a second through hole
formed in the printed circuit board; and moving one of the
component and the printed circuit board in relation to the other of
the component and the printed circuit board so that the wire pin
resiliently deflects thereby establishing a first contact force
between the first portion of the wire pin and the component, and a
second contact force between the second portion of the wire pin and
the printed circuit board.
2. The method of claim 1, wherein the component is a printed
circuit board.
3. The method of claim 2, wherein the component is a printed
circuit board of an electrical-energy meter.
4. The method of claim 1, wherein inserting a wire pin through a
first through hole formed in the component comprises inserting the
wire pin in a first direction, and moving one of the component and
the printed circuit board in relation to the other of the component
and the printed circuit board comprises moving the one of the
component and the printed circuit board in relation to the other of
the component and the printed circuit board in a second direction
substantially perpendicular to the first direction.
5. The method of claim 1, wherein moving one of the component and
the printed circuit board in relation to the other of the component
and the printed circuit board so that the wire pin resiliently
deflects comprises moving one of the component and the printed
circuit board in relation to the other of the component and the
printed circuit board so that the wire pin bends.
6. The method of claim 1, further comprising substantially aligning
the first and second through holes before inserting the wire
pin.
7. The method of claim 6, wherein the moving one of the component
and the printed circuit board in relation to the other of the
component and the printed circuit board so that the wire pin
resiliently deflects comprises substantially misaligning the first
and second through holes.
8. The method of claim 1, wherein the first through hole is a
plated through hole and the first contact force is established
between the first portion of the wire and plating of the first
through hole.
9. The method of claim 1, further comprising locking the one of the
component and the printed circuit board in position in relation to
the other of the component and printed circuit board after moving
the one of the component and the printed circuit board in relation
to the other of the component and the printed circuit board.
10. The method of claim 1, wherein inserting a wire pin through a
first through hole formed in the component comprises dropping the
wire pin through the first through hole.
11. The method of claim 1, wherein moving one of the component and
the printed circuit board in relation to the other of the component
and the printed circuit board so that the wire pin resiliently
deflects comprises moving the one of the component and the printed
circuit board in relation to the other of the component and the
printed circuit board so that the first portion of the wire is
restrained by the component and the second portion of the wire is
restrained by the printed circuit board thereby causing the first
portion of the wire to move in relation to the second portion of
the wire in response to the movement of the component in relation
to the printed circuit board.
12. A method for electrically connecting a first and a second
component, comprising: substantially aligning a first through hole
formed in the first component with a second through hole formed in
the second component; inserting a wire pin through the first
through hole in a first direction so that a first portion of the
wire pin is located within the first through hole and a second
portion of the wire pin is located within the second through hole;
and moving one of the first and the second components in a second
direction in relation to the other of the first and the second
components, the second direction being substantially perpendicular
to the first direction, thereby causing one of the first and second
portions of the wire pin to move in relation to the other of the
first and second portions of the wire pin.
13. The method of claim 12, wherein the first component is a
printed circuit board.
14. The method of claim 13, wherein the first component is a
printed circuit board of an electrical-energy meter.
15. The method of claim 12, wherein the second component is a
printed circuit board.
16. The method of claim 15, wherein the second component is a
printed circuit board of an electrical-energy meter.
17. The method of claim 12, wherein moving one of the first and the
second components in a second direction in relation to the other of
the first and the second components comprises moving one of the
first and the second components in a second direction in relation
to the other of the first and the second components so that the
wire pin resiliently deflects thereby establishing a contact force
between the wire pin and the first and second components.
18. The method of claim 12, wherein moving one of the first and the
second components in a second direction in relation to the other of
the first and the second components comprises moving the one of the
first and the second components in relation to the other of the
first and the second components so that the first portion of the
wire is restrained by the first component and the second portion of
the wire is restrained by the second component thereby causing the
first portion of the wire to move in relation to the second portion
of the wire.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This is a divisional of application Ser. No. 10/813,841,
filed Mar. 31, 2004, the entirety of which is incorporated herein
by reference.
FIELD OF THE INVENTION
[0002] The present invention relates to a method for electrically
interconnecting two or more components.
BACKGROUND OF THE INVENTION
[0003] Manufactured products that perform electrical functions
often include two or more electrically-connected components such as
circuit boards, displays, external connections, etc. The electrical
connection between components is typically achieved using
techniques such as soldering (or other conduction reflow
processes); flexible wires with connectors attached to the ends
thereof; flexible printed circuits equipped with special connectors
or electrically-conductive adhesive; rigid pins and receptacles;
arrays of springs mounted in a housing clamped between the
electrically-connected components; etc.
[0004] The above-noted techniques can present disadvantages. For
example, the process of installing flexible wires between two
electrical components can be difficult to automate. Other
techniques can more readily be automated. Achieving such
automation, however, can be relatively expensive, and may not be
cost-effective in low-volume production runs. Moreover, electrical
connections that incorporate solder or adhesive can make it
difficult to disassemble the interconnected components. The
formation of solder connections can introduce process variables
that must be closely controlled, thereby increasing the complexity
and cost of the assembly process.
SUMMARY OF THE INVENTION
[0005] A preferred method for electrically connecting a first and a
second component comprises inserting a wire pin through a through
hole formed in the first component so that a first portion of the
wire pin is located within the through hole and a second portion of
the wire pin is located within a retaining feature formed at least
in part by the second component.
[0006] A preferred method also comprises moving one of the first
and the second components in relation to the other of the first and
the second components so that the wire pin resiliently deflects
thereby establishing a first contact force between the first
portion of the wire pin and the first component, and a second
contact force between the second portion of the wire pin and the
second component.
[0007] Another preferred method for electrically connecting a first
and a second component comprises substantially aligning a first
through hole formed in the first component with one of a second
through hole formed in the second component and a pocket formed at
least in part by the second component, and inserting a wire pin
through the first through hole in a first direction so that a first
portion of the wire pin is located within the first through hole
and a second portion of the wire pin is located within one of the
second through hole and the pocket
[0008] A preferred method also comprises moving one of the first
and the second components in a second direction in relation to the
other of the first and the second components, the second direction
being substantially perpendicular to the first direction, thereby
causing one of the first and second portions of the wire pin to
move in relation to the other of the first and second portions of
the wire pin.
[0009] A preferred method for establishing electrical contact
between a first and a second component comprises substantially
aligning a first retaining feature defined at least in part by the
first component with a second retaining feature defined at least in
part by the second component so that the first and second retaining
features can each receive a respective portion of a wire pin.
[0010] A preferred method also comprises substantially misaligning
the first and second retaining features after the first and second
retaining features have each received the respective portions of
the wire pin so that the first and second components bend the wire
pin and thereby establish contact forces between the first
component and the wire pin, and the second component and the wire
pin.
[0011] Another preferred method for electrically connecting a first
and a second component comprises inserting a wire pin through a
first retaining feature formed at least in part by the first
component so that a first portion of the wire pin is located within
the first retaining feature and a second portion of the wire pin is
located within a retaining feature formed at least in part by the
second component.
[0012] A preferred method also comprises moving one of the first
and the second components in relation to the other of the first and
the second components so that the first component engages the first
portion of the wire pin by way of the first retaining feature, and
the second component engages the second portion of the wire pin by
way of the second retaining feature thereby causing the first
portion of the wire pin to move in relation to the second portion
of the wire pin and bending the wire pin.
[0013] A preferred method for electrically connecting a first, a
second, and a third component comprises inserting a wire pin
through respective through holes formed in the first and second
components so that a first portion of the wire pin is located
within the through hole formed in the first component, a second
portion of the wire pin is located within the though hole formed in
the second component, and a third portion of the wire pin is
located in a retaining feature formed at least in part by the third
component.
[0014] A preferred method also comprises moving the second
component in relation to the first and the third components so that
the wire pin resiliently deflects thereby establishing a first
contact force between the first portion of the wire pin and the
first component, a second contact force between the second portion
of the wire pin and the second component, and a third contact force
between the third portion of the wire pin and the third
component.
[0015] A preferred embodiment of an electrical energy meter
comprises a base for mounting on a supporting surface, and a
current sensor assembly comprising a plurality of contact blades
extending through the base for electrically contacting a conductor
of electrical energy, and a current transformer mechanically
coupled to the base and electrically coupled to the contact blades.
The current transformer produces an electrical output proportional
to an electrical current in the conductor of electrical energy.
[0016] A preferred embodiment also comprises a printed circuit
board for calculating a cumulative amount of electrical energy
passing through the conductor of electrical energy based on the
electrical output of the current transformer and a voltage of the
conductor of electrical energy, and a contact blade electrically
coupled to the printed circuit board by a wire pin.
[0017] The wire pin engages retaining features defined at least in
part by the respective printed circuit board and contact blade. The
retaining features are substantially misaligned so that the wire
pin is bent and contact forces are thereby established between the
wire pin and the printed circuit board, and between the wire pin
and the contact blade.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The foregoing summary, as well as the following detailed
description of a presently-preferred embodiment, is better
understood when read in conjunction with the appended diagrammatic
drawings. For the purpose of illustrating the invention, the
drawings show an embodiment that is presently preferred. The
invention is not limited, however, to the specific
instrumentalities disclosed in the drawings. In the drawings:
[0019] FIG. 1 is an exploded perspective view of an
electrical-energy meter having a printed circuit board (PCB) and a
contact blade that can be electrically connected in accordance with
a preferred method in accordance with the present invention;
[0020] FIG. 2A is a cross-sectional side view of a PCB, a contact
blade, a PCB housing, a base, and a wire pin of the
electrical-energy meter shown in FIG. 1, with the wire pin about to
be inserted through the PCB and the PCB housing;
[0021] FIG. 2B is a cross-sectional side view of the PCB, contact
blade, PCB housing, base, and wire pin shown in FIG. 2A, after the
wire pin has been inserted through the PCB and the PCB housing and
into a pocket of the base;
[0022] FIG. 2C is a cross-sectional side view of the PCB, contact
blade, PCB housing, base, and wire pin shown in FIGS. 2A and 2B,
after the PCB and PCB housing have been moved laterally in relation
to the base and contact blade;
[0023] FIG. 2D is a cross-sectional side view of the PCB, contact
blade, PCB housing, base, and wire pin shown in FIGS. 2A-2C, after
the PCB and PCB housing have been further moved laterally in
relation to the base and contact blade to bend the wire pin;
[0024] FIG. 3A a cross-sectional side view of a first and a second
PCB, a first and a second PCB housing, and a wire pin of an
alternative embodiment of the electrical-energy meter shown in
FIGS. 1-2D, after the wire pin has been inserted through the first
PCB housing and the first and second PCBs;
[0025] FIG. 3B is a cross-sectional side view of the first and
second PCBs, first and second PCB housings, and wire pin shown in
FIG. 3A, after the first PCB and first PCB housing have been moved
laterally in relation to the second PCB and PCB housing to bend the
wire pin;
[0026] FIG. 4A is a cross-sectional side view of a first and a
second PCB, a PCB housing, a base, a contact blade, and a wire pin
of an alternative embodiment of the electrical-energy meter shown
in FIGS. 1-2D, after the wire pin has been inserted through the
first and second PCBs and the PCB housing, and into a pocket of the
base; and
[0027] FIG. 4B is a cross-sectional side view of the first and
second PCB, PCB housing, base, contact blade, and wire pin shown in
FIG. 4A, after the second PCB has been moved laterally in relation
to the first PCB, PCB housing, base, and contact blade to bend the
wire pin.
DESCRIPTION OF PREFERRED METHODS
[0028] A preferred method for providing an electrical connection is
described herein. The preferred method, as described herein, is
used to establish an electrical connection between a printed
circuit board (PCB) 58 and an electrically-conductive contact blade
74 of an electrical-energy meter 14 (see FIG. 1). The preferred
method is described in relation to these particular components for
exemplary purposes only. The preferred method can be used to
electrically connect other types of components, in other types of
electrical devices or systems.
[0029] The electrical-energy meter 14 comprises a base 50, a
current sensor assembly 52, and a power transformer 54 (see FIG.
1). The current sensor assembly 52 and the power transformer 54 are
mounted on the base 50 by way of a retainer 56. The
electrical-energy meter 14 also includes the PCB 58, a PCB housing
59, a name plate 62, and a digital display 63 mounted on the name
plate 62. The name plate 62 is mounted on snap posts 64 formed in
the base 50.
[0030] The current sensor assembly 52 comprises an annular current
sensor 66, current conductors 68 that conduct electrical current to
the current sensor 66, and meter blades 69 connected to opposite
ends of each current conductor 68. The meter blades 69 are retained
in the base 50 by way of keyhole slots 70 formed in a major portion
50a of the base 50.
[0031] Each of the meter blades 69 slidably and securely engages a
corresponding receptacle (not shown) mounted on the residential or
commercial establishment in which the electrical-energy meter 14 is
used. The engagement of the blades 69 and the corresponding
receptacles electrically couples the electrical-power meter 14 to
the conductor that supplies electrical power to the residential or
commercial establishment.
[0032] The current sensor 66 is electrically coupled to the PCB 58,
and measures the electrical current flowing through the
electrical-power meter 14 by way of the current conductors 68 and
the meter blades 69. The meter blades 69 are electrically coupled
to the PCB 58 through the output of the current sensor (66). The
PCB 58 thus receives a voltage input that is proportional to the
voltage of the conductor that supplies electrical power to the
residential or commercial establishment. The PCB 58 calculates the
total (cumulative) watt-hours of power that have passed through the
electrical-energy meter 14 over time based on the measured current
and the voltage input, using conventional techniques known to those
skilled in the field of electrical-energy meter design. The PCB 58
continually updates the cumulative watt-hours, and displays the
updated value on the digital display 63.
[0033] The current sensor assembly 52, power transformer 54, PCB
58, name plate 62, and digital display 63 are housed within a cover
72.
[0034] The electrical-energy meter 14 includes a plurality of the
contact blades 74 (see FIGS. 1-2D; only one of the contact blades
74 is depicted in FIG. 1, for clarity). The contact blades 74 are
mounted in slots 76 formed in the major portion 50a of the base 50.
The contact blades 74 are electrically connected to the PCB 58, as
discussed below.
[0035] A first portion 74a of each contact blade 74 extends
downward (in the "-y" direction) from the major portion 50a of the
base 50 (from the perspective of FIGS. 2A-2D). The first portion
slidably and securely engages a corresponding receptacle (not
shown) mounted on the residential or commercial establishment in
which the electrical-energy meter 14 is used. The engagement of the
blades 74 and the corresponding receptacle facilitates the
transmission of electrical energy through the electrical energy
meter 14 to the residential or commercial establishment.
[0036] Specific details of the electrical-energy meter 14 are
presented for exemplary purposes only. The present invention can be
applied to other types of electrical-energy meters, and to other
types of devices and systems.
[0037] The PCB 58 and the contact blades 74 are electrically
connected using an electrically-conductive wire pin 77 (see FIGS.
2A-2D). A first end portion 77a of the wire pin 77 is positioned in
a through hole 78 formed in the PCB 58 when the wire pin 77 is in
its installed position, i.e., in the position depicted in FIG. 2D.
The through hole 78 is defined by a surface 80 of the PCB 58. The
through hole 78 is a plated through hole. In other words, the
surface 80 is covered by an electrically-conductive coating. The
through hole 78 acts as a retaining feature for the wire pin 77, as
discussed below.
[0038] A second end portion 77b of the wire pin 77 is positioned
against the contact blade 74 when the wire pin 77 is in its
installed position.
[0039] The through hole 78 and the contact blade 74 are
substantially misaligned with respect to the vertical ("y")
direction, i.e., the through hole 78 is offset from the contact
blade 74 in the "x" direction, when the wire pin 77 is in its
installed position. (The figures are referenced to a common
coordinate system 82 depicted therein.) This misalignment creates a
contact force between the surface 80 of the PCB 58 and the first
end portion 77a of the wire pin 77. The misalignment also creates a
contact force between the second end portion 77b of the wire pin 77
and the contact blade 74. The contact forces help to establish
electrical contact between the wire pin 77 and the PCB 58, and
between the wire pin 77 and the contact blade 74. The contact
forces also help to retain the wire pin 77 in its installed
position.
[0040] Details relating to the installation of the wire pin 77 are
as follows.
[0041] The PCB 58 is fixedly coupled to the PCB housing 59 by a
suitable means such as fasteners (not shown). The PCB housing 59
has a through hole 84 formed therein. The through hole 84 is
substantially aligned with the through hole 78 in the PCB 58.
[0042] A second portion 74b of the contact blade 74 extends upward
(in the "+y" direction) from the major portion 50a of the base 50
(from the perspective of FIGS. 2A-2D. The base 50 includes a
projection 86 that extends upward from the major portion 50a (the
projection 86 is not shown in FIG. 1, for clarity). The projection
86 is located proximate the second portion 74b of the contact blade
74, and is offset from the second portion 74b in the "x" direction.
The projection 86 and the second portion 74b define a pocket 88
therebetween. The pocket 88 acts as a retaining feature for the
wire pin 77, as discussed below.
[0043] The wire pin 77 is installed by positioning the PCB 58 and
the PCB housing 59 as shown in FIG. 2A. In particular, the PCB 58
and the PCB housing 59 are positioned so that the through holes 78,
84 are positioned over, and substantially align with the pocket
88.
[0044] The wire pin 77 is subsequently inserted through the through
holes 78, 84, until the second end portion 77b enters the pocket 88
and abuts the major portion 50a of the base 50 (the direction of
insertion is denoted by the arrow 89 in FIG. 2A). (The wire pin 77
can be inserted manually, or by a suitable automated device. The
wire pin 77 can also be inserted by dropping the wire pin 77
through the through holes 78, 84.) The respective diameters of the
wire pin 77 and the through holes 78, 84, and the width ("x" axis
dimension) of the pocket 88 are preferably chosen so that the wire
pin 77 can be freely inserted through the through holes 78, 84 and
into the pocket 88.
[0045] The length of the wire pin 77 is preferably selected so that
the wire pin 77 is positioned as shown in FIG. 2B when the wire pin
77 has been fully inserted through the through holes 78, 84. In
particular, the first end portion 77a is positioned within and
above the through hole 78, and below the through hole 84 when the
wire pin 77 has been fully inserted (from the perspective of FIG.
2B).
[0046] A force is subsequently exerted on the PCB housing 59 to
move the PCB housing 59 laterally, in the "-x" direction, in
relation to the base 50. (The force can be exerted manually, or by
a suitable automated device.) The PCB 58 is fixedly coupled to the
PCB housing 59, as discussed above. The PCB 58 therefore moves with
the PCB housing 59 (the direction of movement of the PCB 58 and the
PCB housing 59 is denoted by the arrow 90 in FIGS. 2B, 2C).
[0047] The surface 80 of the PCB 58 urges the first end portion 77a
of the wire pin 77 in the "-x" direction in response to the lateral
movement of the PCB 58. The movement of the first end portion 77a
causes a middle portion 77c of the wire pin 77 to contact an upper
edge 86a of the projection 86, as shown in FIG. 2C.
[0048] The projection 86 restrains the middle portion 77c so that
further lateral movement of the PCB 58 in relation of the base 50
causes the second end portion 77b to contact the second portion 74b
upper portion 40a of the contact blade 74 (see FIG. 2C). In other
words, the restraining effect of the projection 86 causes the wire
pin 77 to pivot about the upper edge 86a in a counterclockwise
direction (from the perspective of FIGS. 2b and 2C) until the
second end portion 77b of the wire pin 77 contacts the second
portion 74b of the contact blade 74.
[0049] Further lateral movement of the PCB 58 urges the first end
portion 77a of the wire pin 77 in the "-x" direction, while the
middle portion 77c and the second end portion 77b are restrained by
the respective projection 86 and contact blade 74. The physical
properties and the length to diameter ("L/D") ratio of the wire pin
77 are preferably selected so that the wire pin 77 can resiliently
deflect (bend) in response to this combination of forces thereon,
as shown in FIG. 2D. (The method provided by the present invention
can be used in high or low voltage applications. Hence, the
diameter of the wire pin 77 should also be selected on the basis of
the current that is to be transmitted therethrough.)
[0050] The PCB 58 is moved in the lateral ("-x") direction until a
side portion 59a of the PCB housing 59 substantially aligns with a
corresponding side portion 50b of the base 50 with respect to the
vertical ("y") direction, as shown in FIG. 2D. (The through hole 78
is substantially misaligned with the pocket 88 with respect to the
vertical direction at this point.) The side portions 59a, 50b can
each be equipped with suitable complementary locking features, such
as latches 92, to secure the PCB housing 59 and the PCB 58 in
position in relation to the base 50 once the side portions 59a, 50b
have been aligned.
[0051] The wire pin 77 forms an electrically-conductive path
between the PCB 58 and the contact blade 74. The resilience of the
wire pin 77 helps to establish a contact force between the surface
80 of the PCB 58 and the first end portion 77a of the wire pin 77,
and between the contact blade 74 and the contact blade 74.
[0052] The contact forces help to establish (and enhance) the
electrical contact between the wire pin 77 and the PCB and contact
blade 74. (The first end portion 77a contacts the surface 80 of the
PCB 58 at two locations due to the angled orientation of the first
end portion 77a in relation to the PCB 58, as depicted in FIG. 2D.
Redundant contact points are thus established between the wire pin
77 and the PCB 58.)
[0053] Friction between the first end portion 77a of the wire pin
77 and the surface 80 of the PCB 58, and between the second end
portion 77b and the contact blade 74, it is believed, helps to
retain the wire pin 77 in its installed position. (The through hole
78 and the pocket 88 thus act as retaining features that facilitate
retention of the wire pin 77 in its installed position.)
[0054] The deflection of the wire pin 77 should be limited to
values that cause the material from which the wire pin 77 is formed
to remain within its elastic limit as the wire pin 77 deflects. The
wire pin 77 thus behaves as a spring that exerts a contact force
proportional to the deflection thereof.
[0055] The contact force exerted by the wire pin 77 should be
sufficient to establish adequate electrical contact between the
wire pin 77 and the PCB 58 and contact blade 74. The contact force
should also be sufficient to adequately retain the wire pin 77 in
its installed position.
[0056] The contact force exerted by the wire pin 77 is related to
the length-to-diameter ratio thereof, and to the hardness of the
material from which the wire pin 77 is formed. The wire pin 77 is
preferably formed from a material having relatively high hardness,
conductivity, and corrosion resistance. For example, the wire pin
77 can be formed from non-annealed phosphor-bronze wire (the
drawing process used to form with phosphor-bronze material into
wire is believed to provide the phosphor-bronze material with the
requisite hardness for use in this application). Alternatively, the
wire pin 77 can be formed from materials such as stainless steel,
copper, beryllium-copper, or other suitable materials.
[0057] The preferred method (and variants thereof) can be used to
establish an electrical path between two or more components without
the use of soldering or other conduction reflow processes. The
preferred method, it is believed, does not require precise control
of process variables, in contradistinction to conduction reflow
processes. The preferred method can thus be implemented without the
expense and complications associated with providing such control.
Moreover, it is believed that the preferred method can be automated
at a relatively low cost, thus making the use of the preferred
method economically feasible for low-volume production runs.
[0058] Electrical connections formed in accordance with the
preferred method can be disassembled with relative ease, unlike
connections formed using solder or adhesive. Electrical connections
formed in accordance with the preferred method are also believed to
be more reliable than connections that rely on the use of solder or
adhesive.
[0059] The preferred method can be used in lieu of electrical
connectors and conventional flexible wires, extended rigid pins and
corresponding receptacles, and spring arrays. The preferred method,
it is believed, can provide electrical connections that are less
expensive, have a lower parts count and footprint, and require less
assembly effort than electrical connections provided by the noted
techniques.
[0060] It is believed that the electrical connections provided by
the preferred method are more reliable than connections formed
using electrical connectors and conventional flexible wires,
extended rigid pins and corresponding receptacles, and spring
arrays. Moreover, such techniques can be difficult to automate. The
preferred method, by contrast, can readily be performed on an
automated basis in both high and low-volume production runs.
[0061] The foregoing description is provided for the purpose of
explanation and is not to be construed as limiting the invention.
While the invention has been described with reference to preferred
embodiments or preferred methods, it is understood that the words
which have been used herein are words of description and
illustration, rather than words of limitation. Furthermore,
although the invention has been described herein with reference to
particular structure, methods, and embodiments, the invention is
not intended to be limited to the particulars disclosed herein, as
the invention extends to all structures, methods and uses that are
within the scope of the appended claims. Those skilled in the
relevant art, having the benefit of the teachings of this
specification, may effect numerous modifications to the invention
as described herein, and changes may be made without departing from
the scope and spirit of the invention as defined by the appended
claims.
[0062] Alternative methods within the scope of the present
invention can be used to electrically connect two components having
through holes formed therein for receiving the respective first and
second end portions 77a, 77b of the wire pin 77. For example, an
alternative version of the preferred method can be used to connect
two of the PCBs 10. The wire pin 77 can be inserted through the
through hole 78 of the upper PCB 58 so that the second end portion
77b of the wire pin 77 is positioned, in part, within the through
hole 78 of the lower PCB 58, and the first end 77a is positioned,
in part, within the through hole 78 of the upper PCB 58 (see FIG.
3A).
[0063] The lower PCB 58 is fixedly coupled to a PCB housing 94 that
does not have one of the through holes 84 formed therein (the PCB
housing 94 thus supports the wire pin 77 when the wire pin 77
positioned as depicted in FIG. 3A). The upper PCB 58 and its
associated PCB cover 59 can be moved laterally. (in the "-x"
direction) to bend the wire pin 77 as shown in FIG. 3B, thereby
establishing a contact force between the wire pin 77 and the upper
and lower PCBs 58.
[0064] Other alternative methods within the scope of the present
invention can be used to electrically connect three or more
components. For example, FIGS. 4A and 4B depict a wire pin 96 that
interconnects two of the PCBs 58 and one of the contact blades 74
(the wire pin 96 is longer than the wire pin 77, but is otherwise
substantially identical to the wire pin 77).
[0065] The wire pin 96 can be inserted through the through holes 78
in the PCBs 58, until reaching the position depicted in FIG. 4A.
The lower PCB 58 can then be moved laterally (in the "-x"
direction) to cause the wire pin 96 to resiliently deflect, thereby
establishing contact forces between the wire pin 96 and the PCBs 10
and contact blade 74 (see FIG. 4B). (The lower PCB 58 does not have
an associated PCB housing in this particular embodiment.)
* * * * *