U.S. patent application number 11/302373 was filed with the patent office on 2006-07-20 for electronic component package tape and method of manufacturing the same.
Invention is credited to Kazushige Yamazaki, Kenji Yasufuku, Atsushi Yoshida.
Application Number | 20060157382 11/302373 |
Document ID | / |
Family ID | 36682762 |
Filed Date | 2006-07-20 |
United States Patent
Application |
20060157382 |
Kind Code |
A1 |
Yasufuku; Kenji ; et
al. |
July 20, 2006 |
Electronic component package tape and method of manufacturing the
same
Abstract
An electronic component package tape comprising a carrier tape
of belt-like form storing electronic components in storage pockets
formed into a concaved box shape at predetermined pitches, a cover
tape of ribbon-like form bonded to the carrier tape to seal upper
openings of the storage pockets, and first protrusions, each having
a tip of rounded surface formed on an underside surface of the
cover tape facing the electronic components. The storage pockets
may be provided with a second protrusion formed in an upwardly
protruding manner on a bottom surface thereof. In a method of
manufacturing the electronic component package tape, the cover tape
is held between a first and a second rotating bodies. Both of the
rotating bodies are rotated to form protrusions on the cover tape,
which is bonded to an upper surface of the carrier tape in a manner
to cover openings of the storage pockets.
Inventors: |
Yasufuku; Kenji; (Fukui,
JP) ; Yoshida; Atsushi; (Fukui, JP) ;
Yamazaki; Kazushige; (Fukui, JP) |
Correspondence
Address: |
WENDEROTH, LIND & PONACK L.L.P.
2033 K. STREET, NW
SUITE 800
WASHINGTON
DC
20006
US
|
Family ID: |
36682762 |
Appl. No.: |
11/302373 |
Filed: |
December 14, 2005 |
Current U.S.
Class: |
206/714 |
Current CPC
Class: |
H05K 13/0084
20130101 |
Class at
Publication: |
206/714 |
International
Class: |
B65D 85/00 20060101
B65D085/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 18, 2005 |
JP |
2005-009845 |
Claims
1. An electronic component package tape comprising: a carrier tape
of belt-like form storing electronic components in a plurality of
storage pockets formed into a concaved box shape at predetermined
pitches; a cover tape of ribbon-like form bonded to the carrier
tape to seal upper openings of the storage pockets; and first
protrusions, each having a tip of rounded surface formed on an
underside surface of the cover tape facing the electronic
components.
2. The electronic component package tape according to claim 1,
wherein each of the storage pockets is provided with a second
protrusion formed in an upwardly protruding manner on a bottom
surface thereof.
3. The electronic component package tape according to claim 1,
wherein each of the storage pockets is provided with a recess
formed in a bottom surface thereof.
4. The electronic component package tape according to claim 2,
wherein each of the storage pockets is provided with a recess
formed in a bottom surface thereof.
5. The electronic component package tape according to claim 1,
wherein the cover tape has a thickness not smaller than 50 .mu.m
but not greater than 70 .mu.m, the first protrusions have a height
not smaller than 0.1 mm but not larger than 0.3 mm, and at least
two of the first protrusions confront an upper surface of each of
the electronic components.
6. The electronic component package tape according to claim 1,
wherein a ratio of a height of the first protrusions to a thickness
of the cover tape is not smaller than 1.5 but not larger than
6.
7. A method of manufacturing electronic component package tape
comprising the steps of: holding a cover tape of ribbon-like form
between a first rotating body having a plurality of convex portions
formed at predetermined pitches around the periphery thereof and a
second rotating body having concave portions formed around the
periphery thereof in locations corresponding to the convex
portions; forming protrusions of rounded surface on the cover tape
by rotating the first rotating body and the second rotating body;
and bonding the cover tape formed with the protrusions to an upper
surface of a carrier tape of belt-like form in a manner to cover
openings of storage pockets formed in the carrier tape for carrying
electronic components.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a belt-like electronic
component package tape containing electronic components used
primarily for automated mounting on wiring boards and the like of a
variety of electronic apparatuses. The invention also relates to a
method of manufacturing the same.
BACKGROUND OF THE INVENTION
[0002] In recent years, automated mounting of electronic components
on wiring boards has made considerable progress in manufacture of
various electronic apparatuses, and there is a continuous rise that
such electronic components as switches, variable resistors and the
like devices are packed and delivered in the form of package tapes,
in which the electronic components are stored individually in large
number of storage pockets in an embossed tape configuration.
[0003] Description is now provided of one such electronic component
package tape of the prior art with reference to FIG. 4 and FIG.
5.
[0004] FIG. 4 is a sectional view of an ordinary electronic
component package tape. In FIG. 4, carrier tape 301 made of an
insulation film in a belt-like form has a plurality of storage
pockets 311 of generally a concaved box shape formed in a
consecutive manner at predetermined pitches. Electronic components
302 such as switches and variable resistors are stored individually
in these storage pockets 311 in the same orientation.
[0005] Cover tape 303 of a ribbon-like form made of an insulation
film is bonded to an upper surface of carrier tape 301 to seal the
openings of storage pockets 311. The electronic component package
tape is thus constructed.
[0006] The electronic component package tape of this kind is wound
into a roll on a reel for transportation (not shown), and packed
for storage and the subsequent shipment. The transportation reel is
loaded on an automatic mounting machine (not shown) when electronic
components 302 are mounted on wiring boards and the like (not
shown) of the electronic apparatuses.
[0007] The belt-like electronic component package tape is pulled
out of the transportation reel by the automatic mounting machine,
and after cover tape 303 is peeled off upward, a suction head (not
shown) of the automatic mounting machine holds and picks up
electronic components 302 one after another from storage pockets
311 of carrier tape 301, and places them in predetermined positions
on the wiring boards. Electronic components 302 are hence mounted
on the wiring boards by reflow soldering or the like method.
[0008] There occasionally occurs a problem during the automated
mounting operation that electronic component 302 sticks to the
underside of cover tape 303 and comes out of the carrier tape 301
when cover tape 303 is peeled off carrier tape 301, if a surface of
electronic component 302 is stained with oil or the like
substance.
[0009] For this reason, cover tape 303 is so formed that the
underside surface is provided with a plurality of protrusions 332,
each having hole 331 in the center, as shown in the sectional view
of FIG. 5, in order that electronic components 302 can come into
close proximity of protrusions 332 having less surface areas to
contact instead of the entire surface of cover tape 303. The
electronic component package tape devised and formed in this manner
prevents electronic components 302 from sticking onto the underside
surface of cover tape 303 even when electronic components 302 are
stained with oil and the like substances, thereby avoiding problems
in the automated mounting operation.
[0010] One example of the prior art publications known to be
relevant to the invention of this application is Japanese Patent
Unexamined Publication, No. H04-31215.
[0011] In the electronic component package tape of the prior art,
as illustrated above, it is likely that the automated mounting
operation is interfered due to sticking of electronic components
302 when cover tape 303 used has a flat surface as shown in FIG. 4.
On the other hand, when cover tape 303 is provided with protrusions
332 having holes 331 as shown in FIG. 5 to prevent this problem,
there gives rise to another problem that holes 331 in protrusions
332 allow dust and the like particles to get into storage pockets
311 during transportation, and the dust enters inside electronic
components 302 such as switches and variable resistors, possibly
resulting in malfunctioning of electronic components 302.
SUMMARY OF THE INVENTION
[0012] An electronic component package tape of the present
invention comprises a carrier tape of belt-like form storing
electronic components in a plurality of storage pockets formed into
a concaved box shape at predetermined pitches, a cover tape of
ribbon-like form bonded to the carrier tape to seal upper openings
of the storage pockets, and first protrusions, each having a tip of
rounded surface, formed on an underside surface of the cover tape
facing the electronic components.
[0013] This structure, provided with the protrusions of rounded
surface and no hole, prevents dust and the like particles from
getting into the storage pockets, and the electronic components
from sticking to the underside surface of the cover tape due to oil
and the like substances, thereby achieving the electronic component
package tape capable of ensuring reliable operation of the
automated mounting.
[0014] Furthermore, a method of manufacturing electronic component
package tapes of the present invention comprises a step of holding
a ribbon-like cover tape between a first rotating body having a
plurality of convex portions formed at predetermined pitches around
the periphery thereof and a second rotating body having concave
portions formed around the periphery thereof in a corresponding
manner to the convex portions, a step of forming protrusions of
rounded surface on the cover tape by rotating the first rotating
body and the second rotating body, and a step of bonding the cover
tape formed with the protrusions to an upper surface of the
belt-like carrier tape in a manner to cover openings of storage
pockets formed in the carrier tape for carrying electronic
components.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] FIG. 1 is a sectional view of an electronic component
package tape according to one exemplary embodiment of the present
invention;
[0016] FIG. 2 is a plan view of the electronic component package
tape shown in FIG. 1;
[0017] FIG. 3 is a schematic drawing illustrating the steps of
manufacturing the electronic component package tape shown in FIG.
1; and
[0018] FIG. 4 and FIG. 5 are sectional views of electronic
component package tapes of the prior art.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENT
[0019] Description is provided of an exemplary embodiment of the
present invention with reference to FIG. 1 to FIG. 3. FIG. 1 is a
sectional view of an electronic component package tape according to
the exemplary embodiment of this invention, FIG. 2 is a plan view
of the electronic component package tape shown in FIG. 1, and FIG.
3 is a schematic drawing illustrating the steps of manufacturing
the electronic component package tape shown in FIG. 1.
[0020] According to this exemplary embodiment of the invention in
FIG. 1, the electronic component package tape comprises belt-like
carrier tape 11 carrying electronic components 2 in a plurality of
storage pockets 11A formed into a concaved box-like shape at
predetermined pitches, ribbon-like cover tape 12 bonded to carrier
tape 11 to seal upper openings of storage pockets 11A, and first
protrusions 12B having rounded tips formed on an underside surface
of cover tape 12 facing electronic components 2.
[0021] In addition, second protrusions 11B may be formed on a
bottom surfaces of storage pockets 11A in a manner to protrude
upward.
[0022] Description is provided in more detail of the structure of
the electronic component package tape according to this exemplary
embodiment of the invention.
[0023] Carrier tape 11 is a belt-like form made of an insulation
film such as polystyrene and the like materials. This carrier tape
11 is provided with a plurality of storage pockets 11A of generally
a concaved box-like shape formed in a consecutive manner at
predetermined pitches in a longitudinal direction thereof.
[0024] Formed on bottom surfaces of storage pockets 11A are a
plurality of protrusions 11B (i.e., second protrusions) protruding
upward and a recess 11C in the center bottom surface of each of
storage pockets 11A. Carrier tape 11 also has sprocket holes 11D
formed at predetermined pitches along one side orthogonal to a
widthwise direction thereof.
[0025] These storage pockets 11A individually contain electronic
components 2 such as switches and variable resistors having
terminals and control knobs extending sideway in the same
orientation.
[0026] Cover tape 12 is a ribbon-like form made of an insulation
film such as polyethylene terephthalate and the like materials.
This cover tape 12 is provided with adhesive layers of a
thermo-compression type along sealing areas 12A at both sides of
its lower surface, which bond cover tape 12 to an upper surface of
carrier tape 11 in a manner to seal the upper openings of storage
pockets 11A.
[0027] Furthermore, there are a plurality of protrusions 12B (i.e.,
first protrusions), each having a tip of generally a rounded
surface formed on the underside surface of cover tape 12 facing
electronic components 2 in a protruding manner with a small space
to upper surfaces of electronic components 2. The electronic
component package tape is constructed as above.
[0028] In other words, the electronic component package tape of the
present invention is not provided with any hole in protrusions 12B
formed to protrude on the underside surface of cover tape 12, and
this cover tape 12 prevents dust and the like particles from
getting into storage pockets 11A containing electronic components 2
since it is bonded to carrier tape 11 along sealing areas 12A at
both sides of and covers the upper openings of storage pockets
11A.
[0029] In addition, carrier tape 11 is provided with protrusions
11B formed upward on the bottom surfaces of storage pockets 11A.
Since protrusions 11B make electronic components 2 not liable to
stick to the surface of carrier tape 11, they help make electronic
components 2 easily removable from storage pockets 11A during
automated mounting, thereby achieving the automated mounting
operation more reliable.
[0030] Description is provided next of a method of manufacturing
the electronic component package tape of the structure discussed
above with reference to FIG. 3. In order to help make structures of
the individual elements more comprehensible, FIG. 3 illustrates
certain elements with a different scale of magnification.
[0031] In FIG. 3, first rotating body 13 is provided with convex
portions 13A at predetermined pitches around its periphery. Second
rotating body 14 has concave portions 14A formed around its
periphery in locations corresponding to convex portions 13A. First
rotating body 13 and second rotating body 14 are so arranged as to
face each other with convex portions 13A in engagement to concave
portion 14A around their peripheries, and that both rotating bodies
are rotatable in a synchronized motion.
[0032] A ribbon-like tape material supplied from the left side of
the drawing passes through the peripheries of first rotating body
13 and second rotating body 14 as they rotate, while being held
between convex portions 13A and concave portions 14A. Hence
produced is ribbon-like cover tape 12 formed with protrusions 12B
having the tips of generally the rounded surface at the
predetermined pitches.
[0033] In this case, cover tape 12 has a thickness not smaller than
50 .mu.m but not greater than 70 .mu.m, and protrusions 12B of the
rounded surfaces are formed into a height not smaller than 0.1 mm
but not larger than 0.3 mm at such pitches so that at least two
protrusions 12B confront an upper surface of each of the electronic
components.
[0034] In this embodiment here, protrusions 12B are not likely to
maintain their protruding shape because they tend to get flattened
if the height is smaller than 0.1 mm, or protrusions 12B become
liable to break and cover tape 12 tend to get wrinkled if the
height exceeds 0.3 mm.
[0035] In other words, it is desirable to form protrusions 12B of
such a height that a ratio of the height to the thickness of cover
tape 12 generally becomes not smaller than 1.5 but not larger than
6, and more preferably in a ratio between 2 and 4.
[0036] As an alternative way of forming such protrusions 12B on
cover tape 12, there is another method, in which the tape material
is supplied by a feeding device to make it pass through
intermittently between a vertically reciprocating punch and a base
plate with a bored hole corresponding to the punch. When compared
with this method, however, the method discussed above for forming
protrusions 12B by passing the tape material between first and
second rotating bodies 13 and 14 can make the complex feeding
device unnecessary, and form protrusions 12B easily and
continuously at a faster rate.
[0037] Cover tape 12 having protrusions 12B formed in this manner
is guided downward, and placed on top of carrier tape 11 supplied
from the right side of the drawing in a manner that the tips of
protrusions 12B confront small electronic components 2 such as
detector switches stored in a predetermined orientation inside
storage pockets 11A.
[0038] Following the above, overlapped cover tape 12 and carrier
tape 11 pass through sealing device 15 equipped with a heater (not
shown), a press punch (not shown) and the like, whereby sealing
areas 12A on the underside surface of cover tape 12 are heated and
pressed, to complete the electronic component package tape
consisting of cover tape 12 bonded to the upper surface of carrier
tape 11 containing electronic components 2 in its storage pockets
11A.
[0039] Electronic component package tape of this type is wound into
a roll on a reel for transportation (not shown), and packed for
storage and the subsequent shipment. The transportation reel is
loaded on an automatic mounting machine (not shown) when electronic
components 2 are mounted on wiring boards and the like (not shown)
of electronic apparatuses.
[0040] The belt-like electronic component package tape is pulled
out of the transportation reel by the automatic mounting machine,
and after cover tape 12 is peeled off upward, a suction head (not
shown) of the automatic mounting machine holds and picks up
electronic components 2 one after another from storage pockets 11A
of carrier tape 11, and places them in predetermined positions on
the wiring boards. Electronic components 2 are then mounted on the
wiring boards by means of reflow soldering or the like method.
[0041] Since protrusions 12B of generally the rounded surface of
cover tape 12 confronting upper surfaces of electronic components 2
result in reduction of an area of contact between protrusions 12B
and the upper surfaces of electronic components 2, this embodiment
can prevent electronic components 2 from sticking to cover tape 12
when cover tape 12 is being peeled off from carrier tape 11 even if
electronic components 2 are stained by any chance with oil or the
like substance, thereby ensuring reliability of the automated
mounting to wiring boards.
[0042] Moreover, since the underside surfaces of electronic
components 2 are in contact with protrusions 11B on the bottom
surfaces of storage pockets 11A, which also results in reduction of
an area of contact between them, this structure can prevent
electronic components 2 from sticking to the bottom surfaces of
storage pockets 11A, and help make electronic components 2 easily
removable from storage pockets 11A.
[0043] According to the present exemplary embodiment, as described,
protrusions 12B having the tips of generally the rounded surface
are formed without hole on the underside surface of cover tape 12
facing electronic components 2. Protrusions 12B can therefore
prevent dust and the like particles from getting into storage
pockets 11A, and avoid the electronic components from sticking to
the underside surface of cover tape 12 due to oil and the like
substances, thereby achieving the electronic component package tape
capable of ensuring reliable operation of the automated
mounting.
[0044] Electronic components 2 such as switches and variable
resistors are provided with moving members like control knobs and
the like as compared with passive components such as semiconductors
and capacitors. It is therefore especially important to keep such
mechanical components free from dust during transportation and
storage because of the possibility that intended operation of the
moving members is impaired if dust entered into storage pockets 11A
reaches inside of the switches and the like.
[0045] The presence of protrusions 11B formed to project upward
from the bottom surfaces of storage pockets 11A of carrier tape 11
reduces the areas of contact where the underside surfaces of
electronic components 2 rest upon these protrusions 11B, and
prevents electronic components 2 from sticking to carrier tape 11.
This helps ease the removal of electronic components 2 from storage
pockets 11A in the automated mounting, and ensures reliable
operation of the automated mounting.
[0046] In addition, formation of recesses 11C in generally the
center of the individual bottom surfaces of storage pockets 11A
also reduces the area of contact with the underside surfaces of
electronic components 2 even if protrusions 11B become deformed or
flattened.
[0047] The presence of recesses 11C is also effective for reduction
of the areas of contact between the bottom surfaces of storage
pockets 11A and the underside surfaces of electronic components 2
when protrusions 11B are not provided. Accordingly, recesses 11C
make electronic components 2 not liable to stick to carrier tape
11, help ease the removal of electronic components 2 from storage
pockets 11A in the automated mounting, and thereby they ensure
reliable operation of the automated mounting.
[0048] The electronic component package tape can be produced by a
simple method, in which ribbon-like cover tape 12 is placed between
first rotating body 13 having the plurality of convex portions 13A
formed at predetermined pitches around the periphery thereof and
second rotating body 14 having concave portions 14A formed around
the periphery thereof in locations corresponding to convex portions
13A, and first and second rotating bodies 13 and 14 are rotated to
form protrusions 12B of generally rounded surface on cover tape
12.
[0049] The electronic component package tape and the method of
manufacturing the same according to the present invention have an
advantageous feature of providing the product that is not likely to
allow dust to get into the storage pockets, and useful for the
electronic components and the like adapted primarily for automated
mounting on wiring boards and the like for use in a variety of
electronic apparatuses.
* * * * *