U.S. patent application number 11/030263 was filed with the patent office on 2006-07-06 for thermal management apparatus, systems, and methods.
This patent application is currently assigned to Halliburton Energy Services, Inc.. Invention is credited to James J. Freeman, Juan-Carlos Jakaboski, Yogendra Joshi, Bruce H. JR. Storm.
Application Number | 20060144619 11/030263 |
Document ID | / |
Family ID | 36387200 |
Filed Date | 2006-07-06 |
United States Patent
Application |
20060144619 |
Kind Code |
A1 |
Storm; Bruce H. JR. ; et
al. |
July 6, 2006 |
Thermal management apparatus, systems, and methods
Abstract
An apparatus and a system, as well as a method and article, may
operate to circulate a coolant through a thermal conduit thermally
coupled to a chassis heat exchange element including a plurality of
receiving sections thermally coupled to a corresponding plurality
of electronic devices. The temperature of one or more of the
plurality of electronic devices may be sensed, and the flow rate of
the coolant adjusted in accordance with the sensed temperature. The
thermal conduit may include thermally conductive, flow disrupting
elements. The chassis heat exchange element may operate in a
downhole environment, including logging and drilling
operations.
Inventors: |
Storm; Bruce H. JR.;
(Houston, TX) ; Freeman; James J.; (Houston,
TX) ; Jakaboski; Juan-Carlos; (Albuquerque, NM)
; Joshi; Yogendra; (Decatur, GA) |
Correspondence
Address: |
SCHWEGMAN, LUNDBERG, WOESSNER & KLUTH, P.A.
P.O. BOX 2938
MINNEAPOLIS
MN
55402
US
|
Assignee: |
Halliburton Energy Services,
Inc.
|
Family ID: |
36387200 |
Appl. No.: |
11/030263 |
Filed: |
January 6, 2005 |
Current U.S.
Class: |
175/17 ;
166/57 |
Current CPC
Class: |
H05K 7/20281 20130101;
E21B 47/017 20200501 |
Class at
Publication: |
175/017 ;
166/057 |
International
Class: |
E21B 7/00 20060101
E21B007/00 |
Claims
1. A method, comprising: circulating a first coolant through a
thermal conduit thermally coupled to a chassis heat exchange
element including a plurality of receiving sections thermally
coupled to a corresponding plurality of electronic devices; sensing
a temperature of at least one of the plurality of electronic
devices; and adjusting a flow rate of the first coolant in
accordance with the temperature.
2. The method of claim 1, further including: adjusting the flow
rate of the first coolant in accordance with a change in a
viscosity of the first coolant.
3. The method of claim 1, wherein adjusting the flow rate of the
first coolant comprises adjusting the flow rate of the first
coolant to a substantially constant flow rate.
4. The method of claim 1, further including: removing the chassis
heat exchange element from a borehole; removably coupling a
charging pump to the thermal conduit; and circulating a second
coolant through the thermal conduit, wherein the second coolant has
a second temperature substantially less than a first temperature of
the first coolant.
5. The method of claim 1, further including: replacing a first heat
sink thermally coupled to the chassis heat exchange element with a
second heat sink having a second temperature substantially less
than a first temperature of the first heat sink.
6. The method of claim 1, further including: adjusting a volume in
fluid communication with the conduit to maintain a substantially
constant pressure of the coolant.
7. The method of claim 1, further including: inserting the chassis
heat exchange element into a borehole.
8. An article including a machine-accessible medium having
associated information, wherein the information, when accessed,
results in a machine performing: circulating a coolant through a
thermal conduit thermally coupled to a chassis heat exchange
element including a plurality of receiving sections thermally
coupled to a corresponding plurality of electronic devices; sensing
a temperature of at least one of the plurality of electronic
devices; and adjusting a flow rate of the coolant in accordance
with the temperature.
9. The article of claim 8, wherein the information, when accessed,
results in a machine performing: indicating the temperature.
10. The article of claim 8, wherein the information, when accessed,
results in a machine performing: determining an optimal flow rate
associated with the coolant.
11. The article of claim 8, wherein the information, when accessed,
results in a machine performing: increasing the flow rate in
accordance with sensing an increased temperature associated with
the at least one of the plurality of electronic devices; and
decreasing a flow rate of the coolant in accordance with sensing a
decreased temperature associated with the at least one of the
plurality of electronic devices.
12. The article of claim 8, wherein the information, when accessed,
results in a machine performing: adjusting a volume of the coolant
to maintain a substantially constant coolant pressure.
13. The article of claim 8, wherein adjusting the flow rate of the
coolant comprises adjusting the flow rate of the coolant to a
substantially constant flow rate.
14. An apparatus, comprising: a chassis heat exchange element
including a plurality of receiving sections thermally coupled to a
corresponding plurality of electronic devices; a thermal conduit
thermally coupled to the chassis heat exchange element; and a flow
rate regulator to adjust a flow rate of a coolant to be circulated
in the thermal conduit.
15. The apparatus of claim 14, further including: a pump to
circulate the coolant in the thermal conduit.
16. The apparatus of claim 14, wherein the thermal conduit
includes: thermally conductive flow disruptive elements.
17. The apparatus of claim 14, wherein the coolant comprises one of
water and an oil.
18. The apparatus of claim 14, further including: a feedback and
control system to monitor a temperature of at least one of the
plurality of electronic devices.
19. The apparatus of claim 14, further including: a heat sink
including a heat exchanger thermally coupled to the chassis heat
exchange element.
20. The apparatus of claim 14, wherein the flow rate regulator is
capable of adjusting the flow rate of the coolant to be a
substantially constant flow rate.
21. A system, comprising: a chassis heat exchange element to be
used down-hole and including a plurality of sections thermally
coupled to a corresponding plurality of electronic devices; a
thermal conduit thermally coupled to the chassis heat exchange
element; a flow rate regulator to adjust a flow rate of a coolant
to be circulated in the thermal conduit; and a collar to couple to
a drill bit and to house the chassis heat exchange element.
22. The system of claim 21, further including: a fluid expansion
compensator in fluid communication with the fluid conduit.
23. The system of claim 22, wherein the fluid expansion compensator
includes a spring and a piston.
24. The system of claim 21, further including: a circuit board
having a thermally conductive layer thermally coupled to the
plurality of electronic devices.
25. The system of claim 21, further including: an antenna coupled
to at least one of the plurality of electronic devices.
26. The system of claim 21, further including: a heat sink
including a heat exchanger thermally coupled to the chassis heat
exchange element.
27. The system of claim 21, wherein the flow rate regulator is
capable of adjusting the flow rate of the coolant to be a
substantially constant flow rate.
28. A system, comprising: a chassis heat exchange element to be
used down-hole and including a plurality of receiving sections
thermally coupled to a corresponding plurality of electronic
devices; a thermal conduit thermally coupled to the chassis heat
exchange element; a flow rate regulator to adjust a flow rate of a
coolant to be circulated in the thermal conduit; and a tool body to
couple to a logging cable and to house the chassis heat exchange
element.
29. The system of claim 28, further including: a charging pump
capable of being removably fluidly coupled to the thermal
conduit.
30. The system of claim 28, wherein the logging cable includes one
of a wireline, a mono-cable, and a slick-line.
31. The system of claim 28, further including: a first circuit
board attached to a first side of the chassis heat exchange
element; and a second circuit board attached to a second side of
the chassis heat exchange element.
32. The system of claim 28, wherein the receiving sections are to
receive the plurality of electronic devices attached to the first
circuit board and to the second circuit board.
33. The system of claim 28, further including: a heat sink
including a heat exchanger thermally coupled to the chassis heat
exchange element.
34. The system of claim 28, wherein the flow rate regulator is
capable of adjusting the flow rate of the coolant to be a
substantially constant flow rate.
Description
RELATED APPLICATIONS
[0001] This disclosure is related to pending U.S. patent
application Ser. No. 10/602,236, titled "Method and Apparatus for
Managing the Temperature of Thermal Components", by Bruce H. Storm,
Jr. and Haoshi Song, filed on Jun. 24, 2003, and is assigned to the
assignee of the embodiments disclosed herein, Halliburton Energy
Services, Inc.
TECHNICAL FIELD
[0002] Various embodiments described herein relate to thermal
management generally, including apparatus, systems, and methods
used to manage electronic device thermal conditions.
BACKGROUND INFORMATION
[0003] Electronic devices may be designed to operate at a variety
of temperatures, including up to about 200 C or greater, which is
approximately the same as the ambient temperature experienced by
various downhole drilling components. The variety of such
components available to designers may be somewhat limited, however,
and those that are available can be relatively expensive and
difficult to obtain. In addition, managing thermal conditions
associated with such components used in the downhole environment
can be difficult, since operations can continue for days at a time.
For a variety of reasons, then, there is a need to provide enhanced
thermal management apparatus, systems, and methods for electronic
devices used in downhole environments.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] FIG. 1 is a block diagram of several apparatus according to
various embodiments of the invention;
[0005] FIG. 2 illustrates a chassis heat exchange element according
to various embodiments of the invention;
[0006] FIG. 3 illustrates several systems according to various
embodiments of the invention;
[0007] FIG. 4 is a flow chart illustrating several methods
according to various embodiments of the invention; and
[0008] FIG. 5 is a block diagram of an article according to various
embodiments of the invention.
DETAILED DESCRIPTION
[0009] In some embodiments, an element that serves as both a
chassis and a heat exchanger may be thermally coupled to a
plurality of electronic devices using a corresponding plurality of
receiving sections (e.g., machined recesses tailored to receive the
individual devices). The chassis heat exchange element may include
a conduit thermally coupled to the chassis heat exchange element. A
flow rate regulator may be used adjust the flow rate of a coolant
(e.g., water, oil, etc.) circulated in the conduit. In some
embodiments, thermally conductive, flow disruptive elements may be
included in the conduit. In some embodiments, the chassis heat
exchange element may be used in conjunction with downhole drilling
and logging operations.
[0010] For the purposes of this document, a "chassis heat exchange
element" may mean any substantially rigid structure that serves
both as a chassis and as a heat exchange device in direct thermal
communication with at least one electronic device from which heat
is to be removed. "Direct thermal communication" means that
relatively thin thermally conductive materials (e.g., epoxy,
grease, polymer, etc., comprising a total layer thickness of less
than about 5 mm) may be interposed between the electronic device
and the chassis heat exchange element (e.g., between the device and
a receiving section). In some cases, the electronic device may be
placed in direct contact with the chassis heat exchange
element.
[0011] FIG. 1 is a block diagram of several apparatus 100 according
to various embodiments of the invention. For example, an apparatus
100 may include a chassis heat exchange element 104.
[0012] FIG. 2 illustrates a chassis heat exchange element 204
according to various embodiments of the invention. The chassis heat
exchange element 104 shown in FIG. 1 may be similar to or identical
to the chassis heat exchange element 204 shown in FIG. 2.
[0013] Referring now to FIGS. 1 and 2, it can be seen that the
chassis heat exchange elements 104, 204 may include a plurality of
receiving sections 208 thermally coupled to a corresponding
plurality of electronic devices 212. Thus, various relatively thin
(e.g., less than about 5 mm total thickness) layers of thermal
epoxies, grease, polymers, etc. may be interposed between the
electronic devices 212 and the chassis heat exchange elements 104,
204, perhaps disposed within the receiving sections 208.
[0014] The apparatus 100 may also include a thermal conduit 116,
216 thermally coupled to the chassis heat exchange element 104,
204. A flow rate regulator 120, 220 may be used to adjust the flow
rate of a coolant 122, 222 circulated in the thermal conduit 116,
216. In some embodiments, the flow rate regulator 120, 220 may be
designed so as to be capable of adjusting the flow rate of the
coolant 122, 222 to be a substantially constant flow rate. The flow
rate regulator 120, 220 may also comprise a processor 124, perhaps
electrically coupled to one or more thermocouples 128. The
processor 124 may be thermally coupled to the chassis heat exchange
element 104, 204.
[0015] Thus, in some embodiments, the apparatus 100 may comprise a
feedback and control system 130 (e.g., comprising the flow rate
regulator 120, 220; the processor 124; and thermocouples 128) to
monitor the temperature of one or more of the plurality of
electronic devices 212 and/or the coolant 122, 222, and to adjust
the flow rate of the coolant 122, 222 in accordance with the sensed
temperature. In this case, the flow rate of the coolant 122, 222
may be adjustable, including a set of states such as OFF, ON (at a
preselected rate), ON (at a rate selected from a continuous range
of rates), and ON (at a rate selected from a range of discrete
rates), among others.
[0016] Alternatively, or in addition, the flow rate of the coolant
122, 222 may be adjusted to comprise a preselected flow rate,
perhaps a fixed flow rate, and/or an optimal flow rate determined
by simulation and/or experiment. In such cases, a designer may
choose not to use any feedback and control system 130.
[0017] In some embodiments, the apparatus 100 may include a pump
and/or valve 232 to circulate the coolant 122, 222 in the thermal
conduit 116, 216. The thermal conduit 116, 216 may includes
thermally conductive flow disruptive elements 236, including
laminar flow disruptive elements, similar to or identical to those
in-tube heat transfer enhancement devices known as HiTRAN.RTM.
Matrix Elements available from Cal Galvin, Ltd. of Warwickshire,
England. Of course, other laminar flow disruptive elements, such as
spikes and other protuberances located within the thermal conduit
116, 216, and perhaps attached to the internal wall of the conduit
116, 216, may be used as well.
[0018] Many different types of coolant 122, 222 may be used within
the thermal conduit 116, 216 of the apparatus 100. For example, the
coolant 122, 222 may comprise water, such as distilled or
de-ionized water. Thus, the coolant 122, 222 may comprise
non-hydrocarbon-based fluids. In some embodiments, the coolant 122,
222 may comprise hydrocarbon-based fluids, such as oils, including
poly(alpha-olefin) oils and other synthetic lubricants.
[0019] In some embodiments, the apparatus 100 may include
additional elements. For example, the thermal conduit 116, 216 may
be placed in fluid communication with a heat exchanger 140, perhaps
immersed in a material 144, such as a phase-change material,
including a eutectic phase-change material, a solid, a liquid, or a
gas. The heat exchanger 140 and/or material 144 may be contained in
a heat sink 146, which may in turn include a canister. Thus, the
heat exchanger 140, material 144, and/or heat sink 146 may be
thermally coupled to the chassis heat exchange element 104. In some
embodiments, the apparatus 100 may be housed in a flask 148, such
as an insulated and/or evacuated flask. Other embodiments may be
realized.
[0020] For example, in some embodiments, the apparatus 100 may
include a fluid expansion compensator 152 in fluid communication
with the fluid conduit 116, 216. The fluid expansion compensator
152 may be used to maintain the pressure of the coolant 122, 222 at
substantially the same value. Actuation of the fluid expansion
compensator 152 may occur in a mechanical fashion (e.g., the fluid
expansion compensator may include a piston and a spring to adjust a
volume responsive to the pressure of the coolant), or in an
electrical one, such as by moving a piston to adjust a volume
coupled to the coolant 222 in accordance with a sensed pressure of
the coolant 222, as monitored by the processor 124. A solenoid or
other electrically-movable device may be mechanically coupled to
the fluid expansion compensator 152 and activated by the processor
124.
[0021] In some embodiments, the apparatus 100 may include one or
more circuit boards 254, perhaps located on the first and second
sides 256, 258 of the chassis thermal exchange element 104, 204.
The circuit boards may have a thermally conductive layer 260
thermally coupled to the plurality of electronic devices 212. The
thermally conductive layer 260 may be embedded within the circuit
boards 254, or provided as an outside layer of the circuits boards
254. If the thermally conductive layer 260 is embedded within the
circuit boards 254, vias or similar mechanisms may be used to
couple heat from the electronic devices 212 (e.g., using thermal
grease or thermally conductive adhesive) to the thermally
conductive layer 260. The thermally conductive layer 260 may in
turn be coupled, mechanically and/or thermally to side rails 261
that can be attached to the circuit boards 254 and/or the chassis
thermal exchange elements 104, 204, if desired. As noted
previously, multiple receiving sections 208 may be used to receive
the plurality of electronic devices 212 attached to the circuit
boards 254. In some embodiments, an antenna 262 may be coupled to
one or more of the plurality of electronic devices 212.
[0022] FIG. 3 illustrates several systems 364 according to various
embodiments of the invention, which may comprise portions of a
bottom hole assembly 320 as part of a downhole drilling operation.
Such systems 364 may be used in drilling and logging
operations.
[0023] In some embodiments, a system 364 may form a portion of a
drilling rig 302 located at the surface 304 of a well 306. The
drilling rig 302 may provide support for a drill string 308. The
drill string 308 may operate to penetrate a rotary table 310 for
drilling a borehole 312 through subsurface formations 314. The
drill string 308 may include a Kelly 316, a drill pipe 318, and a
bottom hole assembly 320, perhaps located at the lower portion of
the drill pipe 318.
[0024] The bottom hole assembly 320 may include drill collars 322,
perhaps coupled to a downhole tool 324 and/or a drill bit 326. The
drill bit 326 may operate to create a borehole 312 by penetrating
the surface 304 and subsurface formations 314. The downhole tool
324 may comprise any of a number of different types of tools
including MWD (measurement while drilling) tools, LWD (logging
while drilling) tools, and others.
[0025] During drilling operations, the drill string 308 (perhaps
including the Kelly 316, the drill pipe 318, and the bottom hole
assembly 320) may be rotated by the rotary table 310. In addition
to, or alternatively, the bottom hole assembly 320 may also be
rotated by a motor (e.g., a mud motor) that is located downhole.
The drill collars 322 may be used to add weight to the drill bit
326. The drill collars 322 also may stiffen the bottom hole
assembly 320 to allow the bottom hole assembly 320 to transfer the
added weight to the drill bit 326, and in turn, assist the drill
bit 326 in penetrating the surface 304 and subsurface formations
314.
[0026] During drilling operations, a mud pump 332 may pump drilling
fluid (sometimes known by those of skill in the art as "drilling
mud") from a mud pit 334 through a hose 336 into the drill pipe 318
and down to the drill bit 326. The drilling fluid can flow out from
the drill bit 326 and be returned to the surface 304 through an
annular area 340 between the drill pipe 318 and the sides of the
borehole 312. The drilling fluid may then be returned to the mud
pit 334, where such fluid is filtered. In some embodiments, the
drilling fluid can be used to cool the drill bit 326, as well as to
provide lubrication for the drill bit 326 during drilling
operations. Additionally, the drilling fluid may be used to remove
subsurface formation 314 cuttings created by operating the drill
bit 326.
[0027] Thus, it may be seen that in some embodiments the system 364
may include a bottom hole assembly 320, as well as one or more
apparatus 300, similar to or identical to the apparatus 100
described above and illustrated in FIG. 1. In some embodiments, the
system 364 may include a collar 322 to couple to a drill bit 326
and to house one or more chassis heat exchange elements (included
in the apparatus 300).
[0028] In some embodiments (e.g., wireline applications), a system
364 may include a tool body 370 to couple to a logging cable 374.
The tool body 370 may house an apparatus 300, including one or more
chassis heat exchange elements. The logging cable 374 may comprise
a wireline (multiple power and communication lines), a mono-cable
(a single conductor), and a slick-line (no conductors for power or
communications).
[0029] A variety of mechanisms can be used to cool the apparatus
300 when it is brought to the surface 306 after operation in the
borehole 312. In some cases, it is desirable to remove and replace
the apparatus 300 entirely. In others, a charging pump 378 is used.
The charge pump 378 may be used to circulate the coolant 122, 222
in the conduit 116, 216 of the apparatus 100, 300 (see FIGS. 1 and
2). For rapid turnaround, the coolant 122, 222 may be chilled while
it is circulated. This can occur either by replacing the coolant
122, 222 with new coolant, or simply chilling the existing coolant
and circulating it within the conduit until the temperature of the
circulated coolant remains at a selected temperature. Thus, a
system 364 may include a charging pump 378 capable of being
removably fluidly coupled to the thermal conduit 116, 216 in the
apparatus 100, 300 (see FIGS. 1 and 2).
[0030] The apparatus 100, chassis heat exchange elements 104, 204,
thermal conduits 116, 216, flow rate regulators 120, 220, coolant
122, 222, processor 124, thermocouples 128, feedback and control
system 130, fluid expansion compensator 152, receiving sections
208, electronic devices 212, pump and valve 232, thermally
conductive flow disruptive elements 236, heat exchanger 140,
material 144, flask 148, circuit boards 254, first and second sides
256, 258, thermally conductive layer 260, side rails 261, antenna
262, drilling rig 302, surface 304, well 306, drill string 308,
rotary table 310, borehole 312, subsurface formations 314, Kelly
316, drill pipe 318, bottom hole assembly 320, drill collars 322,
downhole tool 324, drill bit 326, mud pump 332, mud pit 334, hose
336, annular area 340, system 364, tool body 370, logging cable
374, and charging pump 378 may all be characterized as "modules"
herein. Such modules may include hardware circuitry, and/or one or
more processors and/or memory circuits, software program modules,
including objects and collections of objects, and/or firmware, and
combinations thereof, as desired by the architect of the apparatus
100, 300 and systems 364, and as appropriate for particular
implementations of various embodiments of the invention. For
example, such modules may be included in a system operation
software simulation package, such as an electrical signal
simulation package, a power usage and distribution simulation
package, a power/heat dissipation simulation package, a signal
transmission-reception simulation package, and/or a combination of
software and hardware used to simulate the operation of various
potential embodiments.
[0031] It should also be understood that the apparatus and systems
of various embodiments can be used in applications other than for
logging, drilling, and downhole operations, and thus, various
embodiments are not to be so limited. The illustrations of
apparatus 100, 300 and systems 364 are intended to provide a
general understanding of the structure of various embodiments, and
they are not intended to serve as a complete description of all the
elements and features of apparatus and systems that might make use
of the structures described herein.
[0032] Applications that may include the novel apparatus and
systems of various embodiments include electronic circuitry used in
high-speed computers, communication and signal processing
circuitry, modems, processor modules, embedded processors, data
switches, and application-specific modules, including multilayer,
multi-chip modules. Such apparatus and systems may further be
included as sub-components within a variety of electronic systems,
such as televisions, cellular telephones, personal computers,
spaceflight computers, personal digital assistants (PDAs),
workstations, radios, video players, vehicles, and others.
[0033] FIG. 4 is a flow chart illustrating several methods
according to various embodiments of the invention. Thus, in some
embodiments, a method 411 may (optionally) begin with inserting an
apparatus (e.g., similar to or identical to apparatus 100, 300
shown in FIGS. 1 and 3), including one or more chassis heat
exchange elements, into a borehole at block 421. The method 411 may
continue at block 425 with circulating a coolant through a thermal
conduit thermally coupled to the chassis heat exchange element(s)
(including a plurality of receiving sections thermally coupled to a
corresponding plurality of electronic devices, as noted above). The
method 411 may continue with sensing a temperature of one or more
of the plurality of electronic devices (and/or the coolant) at
block 429. Thus, the method 411 may also include indicating the
temperature at block 431, either to a processor included in the
plurality of electronic devices, or in a variety of other ways,
such as by operating an alarm.
[0034] In some embodiments, the method 411 may include adjusting a
flow rate of the coolant in accordance with the sensed temperature
at block 441. Thus, the method 411 may further include, for
example, increasing the flow rate in accordance with sensing an
increased temperature associated with one or more of the plurality
of electronic devices, as well as decreasing the flow rate of the
coolant in accordance with sensing a decreased temperature
associated with one or more of the plurality of electronic devices
at block 445. The flow rate may even be adjusted to a substantially
constant flow rate, if desired. The method 411 may also include
determining an optimal flow rate (e.g., a rate determined to
provide a maximum operational time downhole) associated with the
coolant at block 445.
[0035] In some embodiments, the method 411 may include adjusting
the flow rate of the coolant in accordance with a change in the
viscosity of the coolant at block 449. The method 411 may also
include adjusting a volume in fluid communication with the conduit
to maintain a substantially constant pressure of the coolant at
block 453 (e.g., using an expansion valve).
[0036] More extensive cooling operations may be conducted in a
number of ways, as indicated above. For example, the method 411 may
include removing one or more of the apparatus (e.g., similar to or
identical to apparatus 100, 300 shown in FIGS. 1 and 3), including
one or more chassis heat exchange elements, from the borehole at
block 457. In some circumstances, the method 411 may include
replacing a first heat sink, perhaps including a heat exchanger
(e.g., similar to or identical to the heat sink 146 and heat
exchanger 140), thermally coupled to one or more chassis heat
exchange elements in the apparatus, with a second heat sink (to be
thermally coupled to the chassis heat exchange element) at block
463. In many embodiments, the second heat sink may have a
temperature substantially less than the temperature of the first
heat sink. The chassis heat exchange element may be removably
attached to circuit boards holding the electronic devices being
cooled, or not.
[0037] In some circumstances, the method 411 may include removably
coupling a charging pump to the thermal conduit included in the
chassis heat exchange element at block 467, and circulating a
second coolant through the thermal conduit (wherein the second
coolant has a second temperature substantially less than a first
temperature of the original, or first coolant). As noted above,
whether or not a second coolant is used to replace the first
coolant, the coolant that is in fact circulated by the charging
pump may be chilled to speed up the cooling process.
[0038] It should be noted that the methods described herein do not
have to be executed in the order described, or in any particular
order. Any of the activities described above in conjunction with
the methods 411 may be simulated, such that software and hardware
modules are combined to provide a simulation environment that
mimics the behavior of the apparatus 100, 300 and systems 364 in
the real world. Moreover, various activities described with respect
to the methods identified herein can be executed in serial,
parallel, or iterative fashion. For the purposes of this document,
the terms "information" and "data" may be used interchangeably.
Information, including parameters, commands, operands, and other
data, including data in various formats (e.g., time division,
multiple access) and of various types (e.g., binary, alphanumeric,
audio, video), can be sent and received in the form of one or more
carrier waves.
[0039] Upon reading and comprehending the content of this
disclosure, one of ordinary skill in the art will understand the
manner in which a software program can be launched from a
computer-readable medium in a computer-based system to execute the
functions defined in the software program. One of ordinary skill in
the art will further understand the various programming languages
that may be employed to create one or more software programs
designed to implement and perform the methods disclosed herein. The
programs may be structured in an object-orientated format using an
object-oriented language such as Java or C++. Alternatively, the
programs can be structured in a procedure-orientated format using a
procedural language, such as assembly or C. The software components
may communicate using any of a number of mechanisms well-known to
those skilled in the art, such as application program interfaces or
inter-process communication techniques, including remote procedure
calls. The teachings of various embodiments are not limited to any
particular programming language or environment. Thus, other
embodiments may be realized, as shown in FIG. 5.
[0040] FIG. 5 is a block diagram of an article 585 according to
various embodiments of the invention, such as a computer, a memory
system, a magnetic or optical disk, some other storage device,
and/or any type of electronic device or system. The article 585 may
comprise a processor 587 coupled to a machine-accessible medium
such as a memory 589 (e.g., a memory including an electrical,
optical, or electromagnetic conductor) having associated
information 591 (e.g., computer program instructions, and/or other
data), which when accessed, results in a machine (e.g., the
processor 587) performing such actions as (simulating) circulating
a coolant through a thermal conduit thermally coupled to a chassis
heat exchange element including a plurality of receiving sections
thermally coupled to a corresponding plurality of electronic
devices, (simulating) sensing a temperature of at least one of the
plurality of electronic devices, and (simulating) adjusting a flow
rate of the coolant in accordance with the temperature. The use of
the term "simulating" is used here to emphasize that the activities
described can be conducted under real-world conditions, or merely
simulated so as to mimic real-world behavior.
[0041] Other actions may include indicating the temperature,
determining an optimal flow rate associated with the coolant, and
perhaps increasing the flow rate in accordance with sensing an
increased temperature associated with one or more of the plurality
of electronic devices, or decreasing the flow rate of the coolant
in accordance with sensing a decreased temperature associated with
one or more of the plurality of electronic devices. The flow rate
of the coolant may even be adjusted to a substantially constant
flow rate. In some embodiments, actions may include adjusting a
volume of the coolant to maintain a substantially constant coolant
pressure.
[0042] Implementing the apparatus, systems, and methods described
herein may provide a mechanism to increase the operational time of
electronic devices used in downhole applications. The use of less
expensive, more widely available components that tolerate lower
operational temperatures may also be enabled.
[0043] The accompanying drawings that form a part hereof, show by
way of illustration, and not of limitation, specific embodiments in
which the subject matter may be practiced. The embodiments
illustrated are described in sufficient detail to enable those
skilled in the art to practice the teachings disclosed herein.
Other embodiments may be utilized and derived therefrom, such that
structural and logical substitutions and changes may be made
without departing from the scope of this disclosure. This Detailed
Description, therefore, is not to be taken in a limiting sense, and
the scope of various embodiments is defined only by the appended
claims, along with the full range of equivalents to which such
claims are entitled.
[0044] Such embodiments of the inventive subject matter may be
referred to herein, individually and/or collectively, by the term
"invention" merely for convenience and without intending to
voluntarily limit the scope of this application to any single
invention or inventive concept if more than one is in fact
disclosed. Thus, although specific embodiments have been
illustrated and described herein, it should be appreciated that any
arrangement calculated to achieve the same purpose may be
substituted for the specific embodiments shown. This disclosure is
intended to cover any and all adaptations or variations of various
embodiments. Combinations of the above embodiments, and other
embodiments not specifically described herein, will be apparent to
those of skill in the art upon reviewing the above description.
[0045] The Abstract of the Disclosure is provided to comply with 37
C.F.R. .sctn.1.72(b), requiring an abstract that will allow the
reader to quickly ascertain the nature of the technical disclosure.
It is submitted with the understanding that it will not be used to
interpret or limit the scope or meaning of the claims. In addition,
in the foregoing Detailed Description, it can be seen that various
features are grouped together in a single embodiment for the
purpose of streamlining the disclosure. This method of disclosure
is not to be interpreted as reflecting an intention that the
claimed embodiments require more features than are expressly
recited in each claim. Rather, as the following claims reflect,
inventive subject matter lies in less than all features of a single
disclosed embodiment. Thus the following claims are hereby
incorporated into the Detailed Description, with each claim
standing on its own as a separate embodiment.
* * * * *