U.S. patent application number 10/518148 was filed with the patent office on 2006-06-22 for gallium-nitride-based light-emitting apparatus.
This patent application is currently assigned to NITRIDE SEMICONDUCTORS CO., LTD. Invention is credited to Masahiro Kimura, Shiro Sakai, Hisao Sato, Naoki Wada.
Application Number | 20060131558 10/518148 |
Document ID | / |
Family ID | 35150265 |
Filed Date | 2006-06-22 |
United States Patent
Application |
20060131558 |
Kind Code |
A1 |
Sato; Hisao ; et
al. |
June 22, 2006 |
GALLIUM-NITRIDE-BASED LIGHT-EMITTING APPARATUS
Abstract
A light-emitting apparatus employing a GaN-based semiconductor.
The light-emitting apparatus comprises an n-type clad layer (124);
an active layer (129) including an n-type first barrier layer
(126), well layers (128), and second barrier layers (130); a p-type
block layer (132); and a p-type clad layer (134). By setting the
band gap energy Egb of the p-type block layer (132), the band gap
energy Eg2 of the second barrier layers (130), the band gap energy
Eg1 of the first barrier layer (126), and the band gap energy Egc
of the n-type and the p-type clad layers such that the relationship
Egb>Eg2>Eg1.gtoreq.Egc is satisfied; the carriers can be
efficiently confined; and the intensity of the light emission can
be increased.
Inventors: |
Sato; Hisao; (Tokushima,
JP) ; Wada; Naoki; (Tokushima, JP) ; Sakai;
Shiro; (Tokushima, JP) ; Kimura; Masahiro;
(Tokushima, JP) |
Correspondence
Address: |
OSHA LIANG L.L.P.
1221 MCKINNEY STREET
SUITE 2800
HOUSTON
TX
77010
US
|
Assignee: |
NITRIDE SEMICONDUCTORS CO.,
LTD
TOKUSHIMA
JP
|
Family ID: |
35150265 |
Appl. No.: |
10/518148 |
Filed: |
April 16, 2004 |
PCT Filed: |
April 16, 2004 |
PCT NO: |
PCT/JP04/05475 |
371 Date: |
December 17, 2004 |
Current U.S.
Class: |
257/17 ;
257/E33.005; 257/E33.008 |
Current CPC
Class: |
H01L 33/32 20130101;
H01S 5/3086 20130101; H01S 5/3407 20130101; H01L 33/06 20130101;
H01S 5/0213 20130101; H01S 5/34333 20130101; H01S 5/3216 20130101;
B82Y 20/00 20130101; H01S 5/2009 20130101; H01S 5/222 20130101;
H01L 33/04 20130101 |
Class at
Publication: |
257/017 |
International
Class: |
H01L 31/0328 20060101
H01L031/0328 |
Claims
1. A gallium-nitride-based light-emitting apparatus comprising: a
substrate; a first-conducting-type clad layer formed on the
substrate; an active layer formed on the first-conducting-type clad
layer; and a second-conducting-type clad layer formed on the active
layer, the active layer including barrier layers and well layers
made of a gallium-nitride-based compound semiconductor, wherein the
barrier layers of the active layer include a first barrier layer
formed toward the first-conducting-type clad layer and second
barrier layers sandwiched by the well layers, the light-emitting
apparatus comprises a second-conducting-type carrier block layer
between the active layer and the second-conducting-type clad layer,
and the band gap Egb of the second-conducting-type carrier block
layer, the band gap Eg2 of the second barrier layers, the band gap
Eg1 of the first barrier layer, and the band gap Egc of the clad
layers satisfy the relationship Egb>Eg2>Eg1.gtoreq.Egc.
2. A gallium-nitride-based light-emitting apparatus according to
claim 1, wherein a thickness d1 of the first barrier layer and a
thickness d2 of each of the second barrier layers satisfy the
relationship d1>d2.
3. A gallium-nitride-based light-emitting apparatus according to
claim 2, wherein the thickness d1 of the first barrier layer
satisfies the relationship d1.ltoreq.50 nm.
4. A gallium-nitride-based light-emitting apparatus according to
claim 1, wherein a thickness d3 of each of the well layers
satisfies the relationship d3.ltoreq.4 nm.
5. A gallium-nitride-based light-emitting apparatus according to
claim 1, wherein the first barrier layer and the second barrier
layers comprise Al.sub.xIn.sub.yGa.sub.1-x-yN
(0.ltoreq.x.ltoreq.0.3 and 0.ltoreq.y.ltoreq.=0.05), and wherein
the well layers comprise Al.sub.aIn.sub.bGa.sub.1-a-bN
(0.ltoreq.a.ltoreq.0.01 and 0.ltoreq.b.ltoreq.0.1).
6. A gallium-nitride-based light-emitting apparatus according to
claim 1, wherein the second-conducting-type carrier block layer
comprises Al.sub.pIn.sub.qGa.sub.1-p-qN (0.ltoreq.p.ltoreq.0.5 and
0.ltoreq.q.ltoreq.0.1).
7. A gallium-nitride-based light-emitting apparatus according to
claim 1, wherein the clad layers comprise a super-lattice structure
formed by stacking layers of
Al.sub..alpha.In.sub..gamma.Ga.sub.1-.alpha.-.gamma.N
(0.ltoreq..alpha..ltoreq.0.2 and 0.ltoreq..gamma..ltoreq.0.1) and
layers of Al.sub..beta.In.sub..eta.Ga.sub.1-.beta.-.eta.N
(0.ltoreq..beta..ltoreq.0.05 and 0.ltoreq..eta..ltoreq.0.1).
8. A gallium-nitride-based light-emitting apparatus according to
claim 2, wherein a thickness d3 of each of the well layers
satisfies the relationship d3.ltoreq.4 nm.
9. A gallium-nitride-based light-emitting apparatus according to
claim 2, wherein the first barrier layer and the second barrier
layers comprise Al.sub.xIn.sub.yGa.sub.1-x-yN
(0.ltoreq.x.ltoreq.0.3 and 0.ltoreq.y.ltoreq.0.05), and wherein the
well layers comprise Al.sub.aIn.sub.bGa.sub.1-a-bN
(0.ltoreq.a.ltoreq.0.01 and 0.ltoreq.b.ltoreq.0.1).
10. A gallium-nitride-based light-emitting apparatus according to
claim 3, wherein the first barrier layer and the second barrier
layers comprise Al.sub.xIn.sub.yGa.sub.1-x-yN
(0.ltoreq.x.ltoreq.0.3 and 0.ltoreq.y.ltoreq.0.05), and wherein the
well layers comprise Al.sub.aIn.sub.bGa.sub.1-a-bN
(0.ltoreq.a.ltoreq.0.01 and 0.ltoreq.b.ltoreq.0.1).
11. A gallium-nitride-based light-emitting apparatus according to
claim 4, wherein the first barrier layer and the second barrier
layers comprise Al.sub.xIn.sub.yGa.sub.1-x-yN
(0.ltoreq.x.ltoreq.0.3 and 0.ltoreq.y.ltoreq.0.05), and wherein the
well layers comprise Al.sub.aIn.sub.bGa.sub.1-a-bN
(0.ltoreq.a.ltoreq.0.01 and 0.ltoreq.b.ltoreq.0.1).
12. A gallium-nitride-based light-emitting apparatus according to
claim 2, wherein the second-conducting-type carrier block layer
comprises Al.sub.pIn.sub.qGa.sub.1-p-qN (0.ltoreq.p.ltoreq.0.5 and
0.ltoreq.q.ltoreq.0.1).
13. A gallium-nitride-based light-emitting apparatus according to
claim 3, wherein the second-conducting-type carrier block layer
comprises Al.sub.pIn.sub.qGa.sub.1-p-qN (0.ltoreq.p.ltoreq.0.5 and
0.ltoreq.q.ltoreq.0.1).
14. A gallium-nitride-based light-emitting apparatus according to
claim 4, wherein the second-conducting-type carrier block layer
comprises Al.sub.pIn.sub.qGa.sub.1-p-qN (0.ltoreq.p.ltoreq.0.5 and
0.ltoreq.q.ltoreq.0.1).
15. A gallium-nitride-based light-emitting apparatus according to
claim 5, wherein the second-conducting-type carrier block layer
comprises Al.sub.pIn.sub.qGa.sub.1-p-qN (0.ltoreq.p.ltoreq.0.5 and
0.ltoreq.q.ltoreq.0.1).
16. A gallium-nitride-based light-emitting apparatus according to
claim 2, wherein the clad layers comprise a super-lattice structure
formed by stacking layers of
Al.sub..alpha.In.sub..gamma.Ga.sub.1-.alpha.-.gamma.N
(0.ltoreq..alpha..ltoreq.0.2 and 0.ltoreq..gamma..ltoreq.0.1) and
layers of Al.sub..beta.In.sub..eta.Ga.sub.1-.beta.-.eta.N
(0.ltoreq..beta..ltoreq.0.05 and 0.ltoreq..eta..ltoreq.0.1).
17. A gallium-nitride-based light-emitting apparatus according to
claim 3, wherein the clad layers comprise a super-lattice structure
formed by stacking layers of
Al.sub..alpha.In.sub..gamma.Ga.sub.1-.alpha.-.gamma.N
(0.ltoreq..alpha..ltoreq.0.2 and 0.ltoreq..gamma..ltoreq.0.1) and
layers of Al.sub..beta.In.sub..gamma.Ga.sub.1-.beta.-.eta.N
(0.ltoreq..beta..ltoreq.0.05 and 0.ltoreq.0.1).
18. A gallium-nitride-based light-emitting apparatus according to
claim 4, wherein the clad layers comprise a super-lattice structure
formed by stacking layers of
Al.sub..alpha.In.sub..gamma.Ga.sub.1-.alpha.-.gamma.N
(0.ltoreq..alpha..ltoreq.0.2 and 0.ltoreq..gamma..ltoreq.0.1) and
layers of Al.sub..beta.In.sub..eta.Ga.sub.1-.beta.-.eta.N
(0.ltoreq..beta..ltoreq.0.05 and 0.ltoreq..eta..ltoreq.0.1).
19. A gallium-nitride-based light-emitting apparatus according to
claim 5, wherein the clad layers comprise a super-lattice structure
formed by stacking layers of
Al.sub..alpha.In.sub..gamma.Ga.sub.1-.alpha.-.gamma.N
(0.ltoreq..alpha..ltoreq.0.2 and 0.ltoreq..gamma..ltoreq.0.1) and
layers of Al.sub..beta.In.sub..eta.Ga.sub.1-.beta.-.eta.N
(0.ltoreq..beta..ltoreq.0.05 and 0.ltoreq..beta..ltoreq.0.1).
20. A gallium-nitride-based light-emitting apparatus according to
claim 6, wherein the clad layers comprise a super-lattice structure
formed by stacking layers of
Al.sub..alpha.In.sub..gamma.Ga.sub.1-.alpha.-.gamma.N
(0.ltoreq..alpha..ltoreq.0.2 and 0.ltoreq..gamma..ltoreq.0.1) and
layers of Al.sub..beta.In.sub..eta.Ga.sub.1-.beta.-.eta.N
(0.ltoreq..beta..ltoreq.0.05 and 0.ltoreq..eta..ltoreq.0.1).
Description
TECHNICAL FIELD
[0001] The present invention relates generally to a
gallium-nitride-based light-emitting apparatus, and, more
particularly, to a light-emitting apparatus such as a
light-emitting diode (LED), a semiconductor laser diode (LD), etc.,
that emits light having a wavelength in the short wave region of
380 nm or less.
BACKGROUND ART
[0002] Conventionally, light emitting apparatuses such as LEDs,
LDs, etc. are known that employ gallium-nitride (GaN)-based
compound semiconductor. As to the emission of light and oscillation
having a wavelength in a wavelength region of 380 nm or below, the
light emission wavelength of the emission of light and the
oscillation is varied by varying the composition ratio of "In" in a
GaN-based compound semiconductor including In constituting an
active layer and, more specifically, the wavelength is shortened by
reducing the composition ratio of In.
[0003] FIGS. 9A, 9B, 10A and 10B show the construction of a
light-emitting apparatus (semiconductor laser) described in the
patent literature listed below. In FIGS. 9A and 9B, FIG. 9A shows a
cross-sectional view of the construction of the light-emitting
apparatus and FIG. 9B shows the composition ratio of Al in this
cross-sectional construction. This light-emitting apparatus has the
construction formed by stacking a first-conducting-type layer 11,
an active layer 12, and a second-conducting-type layer 13 on a
substrate 21 and a buffer layer 22.
[0004] The first-conducting-type layer 11 comprises a contact layer
23, a clad layer 25, and a fist light-guiding layer 26. The active
layer 12 comprises an active layer 27. The second-conducting-type
layer 13 comprises a carrier-confining layer 28, a second
light-guiding layer 29, a clad layer 30, and a contact layer 31.
The first and second light-guiding layers 26 and 29 sandwich the
active layer 12 (or the actively layer 27) in this construction and
the first and second light-guiding layers and the active layer
therebetween form a light-guiding path.
[0005] FIGS. 10A and 10B show the layer structure in the vicinity
of the active layer 12 (or the active layer 27) and the band gaps
of the layer structure. The active layer 12 (27) has a construction
formed by alternately stacking a plurality of well layers 1a and 1b
and a plurality of barrier layers 2a, 2b and 2c, and the
carrier-confining layer 28 is further formed in the active layer 27
or in the vicinity of the active layer. The carrier-confining layer
28 confines carriers from the first-conducting-type layer in the
active layer or the well layers. In a device for which it is
assumed that the first-conducting-type layer is n-type and the
second-conducting-type layer is p-type, the carrier-confining layer
28 confines electrons into the active layer. Additionally, there is
description that the carrier-confining layer 28 is provided on the
p-type layer side because electrons tend to overflow the active
layer more easily than holes, because the diffusion length of
electrons is longer compared to the diffusion length of holes in a
nitride semiconductor.
[0006] There is also description that, when a carrier-confining
layer is provided on the n-type layer side, it is not necessary to
provide a large offset between the active layer and the barrier
layer like the carrier-confining layer on the p-type layer side,
and the barrier layer 2a arranged most closely to the n-type side
in the active layer can be caused to functioned as a hole-confining
layer, and that the carrier-confining function of the n-type-side
barrier layer 2a can be preferably drawn out by increasing the film
thickness of the barrier layer 2a compared to the other barrier
layers (see, e.g., Japanese Patent Application Laid-Open
Publication No. 2003-115642).
DISCLOSURE OF THE INVENTION
[0007] As described above, a recombination of carriers can be
facilitated by taking a multi-quantum well (MQW) structure having
an active layer constructed by barrier layers and well layers, and
arranging a carrier-confining layer for confining electrons into
the p-type layer side and another carrier-confining layer for
confining holes to the n-type layer side. However, use of a
light-emitting apparatus employing a GaN-based compound
semiconductor is expanding increasingly in recent years, such that
further improvement of the intensity of the light emission thereof
is especially desired.
[0008] The object of the present invention is to provide a
light-emitting apparatus having a higher intensity of light
emission and employing a GaN-based compound semiconductor emitting
UV light.
[0009] The present invention provides a gallium-nitride-based
light-emitting apparatus comprising a substrate; a
first-conducting-type clad layer formed on the substrate; an active
layer formed on the clad layer; and a second-conducting-type clad
layer formed on the active layer, the active layer including
barrier layers and well layers made of a gallium-nitride-based
compound semiconductor, wherein the barrier layers of the active
layer include a first barrier layer formed toward the
first-conducting-type clad layer and second barrier layers
sandwiched by the well layers, wherein the light-emitting apparatus
comprises a second-conducting-type carrier block layer between the
active layer and the second-conducting-type clad layer, and wherein
the band gap Egb of the carrier block layer, the band gap Eg2 of
the second barrier layer, the band gap Eg1 of the first barrier
layer and the band gap Egc of the clad layers satisfy the
relationship Egb>Eg2 >Eg1.gtoreq.Egc.
[0010] In the present invention, carriers from the
first-conducting-type layer side are blocked by the carrier block
layer as well as carriers from the second-conducting-type layer are
blocked by the first barrier layer. By setting the relation of the
magnitudes of the band gap energy between the layers as above,
carriers can be more efficiently confined and recombination in the
active layer can be facilitated. Therefore, the intensity of the
light emission can be increased. For example, the first conducting
type can be set to be n-type and the second conducting type can be
set to be p-type, and the first barrier layer functions as a
hole-confining layer and the carrier block layer functions as an
electron-confining layer.
[0011] According to the present invention, carriers can be
efficiently confined and the intensity of the light emission can be
improved.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 shows the a light-emitting apparatus according to an
embodiment of the present invention;
[0013] FIG. 2 is an illustrative diagram of the magnitudes of band
gaps of the present invention as configured in the embodiment;
[0014] FIG. 3 shows the relationship between intensity of light
emission and the ratio of the band gap of a first barrier layer to
that of a second barrier layer;
[0015] FIG. 4 is an illustrative diagram showing the relationship
between intensity of light emission and the ratio of the band gap
of the first barrier layer to that of a clad;
[0016] FIG. 5 shows the relationship between intensity of light
emission and the ratio of the band gap of a p-type block layer to
that of a second barrier layer;
[0017] FIG. 6 shows the relationship between the film thickness of
the first barrier layer and the intensity of the light
emission;
[0018] FIG. 7 shows the relationship between the presence or
non-presence of a well layer and the intensity of the light
emission;
[0019] FIG. 8 shows the relationship between the film thickness of
a well layer and the intensity of the light emission;
[0020] FIGS. 9A and 9B show the configuration of a conventional
apparatus, wherein FIG. 9A shows a cross-sectional view of a
light-emitting apparatus and FIG. 9B shows the composition ratio of
Al; and
[0021] FIGS. 10A and 10B are illustrative diagrams showing the
magnitude of the band gap energy in a conventional apparatus,
wherein FIG. 10A shows a layered structure of the apparatus and
FIG. 10B shows the magnitude of the band gap energy in the layered
structure of FIG. 10A.
BEST MODE FOR CARRYING OUT THE INVENTION
[0022] An embodiment of the present invention will now be described
with reference to the accompanying drawings.
[0023] FIG. 1 shows a cross-sectional view of the construction of a
light-emitting apparatus employing a GaN-based compound
semiconductor apparatus according to the embodiment.
[0024] The light-emitting apparatus has a configuration comprising
a substratum layer fabricated by forming one after another a
low-temperature (LT) SiN buffer layer 112, a low-temperature (LT)
GaN buffer layer 114, a non-doped GaN buffer layer 116, a
high-temperature SiN buffer layer 118, non-doped GaN buffer layer
120 on a sapphire substrate 110; an n-type contact layer 122; an
active layer including an n-type super-lattice clad layer 124 and
an n-type first barrier layer 126; a p-type block layer 132; a
p-type super-lattice clad layer 134; and a p-type contact layer 136
that are stacked on the substratum layer. In this configuration, no
light-guiding layer is especially set. However, when a light
guiding layer is inserted, an n-type-side light-guiding layer may
be inserted between the n-type super-lattice clad layer 124 and the
n-type first barrier layer 126, and a p-type-side light-guiding
layer may be inserted between the p-type block layer 132 and the
p-type super-lattice clad layer 134.
[0025] In addition to the n-type first barrier layer 126, the
active layer 129 includes a multi-quantum well (MQW) structure
fabricated by stacking alternately n-type well layers 128 and
n-type second barrier layers 130. The n-type first barrier layer
126 and the p-type block layer 132 respectively function as
carrier-confining layers. That is, the n-type first barrier layer
126 has a function to confine holes from the p-type layers and the
p-type block layer 132 has a function to confine electrons from the
n-type layers.
[0026] The material and the thickness of each of the layers are as
follows: [0027] The n-type contact layer 122: Si-doped GaN (2
.mu.m); [0028] The n-type super-lattice clad layer 124:
Al.sub.0.2Ga.sub.0.8N barrier layer (2 nm)/50 GaN well layers (2
nm); [0029] The n-type first barrier layer 126:
Al.sub.0.13Ga.sub.0.87N (26 nm) [0030] The active layer 129:
In.sub.0.05Ga.sub.0.95N well layer 128 (2 nm)/three (3)
Al.sub.0.19Ga.sub.0.81N second barrier layers 130 (13 nm); [0031]
The p-type block layer 132: Mg-doped Al.sub.0.27Ga.sub.0.73N (25
nm); [0032] The p-type super-lattice clad layer 134: Mg-doped
Al.sub.0.2Ga.sub.0.8N barrier layer (2 nm)/30 Mg-doped GaN well
layers (2 nm); and [0033] The p-type contact layer 136: Mg-doped
GaN (20 nm).
[0034] Not shown in FIG. 1, these layers function as a
light-emitting apparatus by forming an n-type electrode on the
n-type contact layer 122 and a p-type electrode on the p-type
contact layer 136. The low-temperature SiN buffer layer 112 and the
high-temperature buffer layer 118 are not essential and do not need
to be formed.
[0035] The light-emitting apparatus shown in FIG. 1 is fabricated
in a process as follows: [0036] (1) A sapphire C-face substrate
wafer 110 is mounted on a susceptor in a MOCVD apparatus and the
substrate 110 is heat-treated at 1150.degree. C. in a hydrogen
atmosphere for ten (10) minutes. [0037] (2) Next, the temperature
is decreased to 500.degree. C., ammonia gas, and silane gas are fed
into the apparatus as material gases and the low-temperature SiN
buffer layer 112 is grown. [0038] (3) Then, trimethyl-gallium
(TMG), and ammonia gas are supplied to the apparatus as material
gases and the low-temperature GaN buffer layer 114 is grown. [0039]
(4) Next, the temperature is increased to1075.degree. C.,
trimethyl-gallium (TMG), and ammonia gas are fed into the apparatus
as material gases and the non-doped n-type GaN buffer layer 116 is
grown. [0040] (5) Then, the temperature is maintained at
1075.degree. C., ammonia gas, and silane gas are fed into the
apparatus as material gases and the high-temperature SiN buffer
layer 118 is grown thin. [0041] (6) Next, the temperature is
maintained at 1075.degree. C., trimethyl-gallium (TMG) and ammonia
gas are fed into the apparatus as material gases and the non-doped
n-type GaN layer 120 is grown. A buffer layer as the substratum
layer is formed by the above process. [0042] (7) Then, gas
containing silicon is supplied at 1075.degree. C. and the Si-doped
n-type GaN contact layer 122 is grown. [0043] (8) Next,
trimethyl-aluminum (TMA), trimethyl-gallium, ammonia gas, and
silane gas are supplied as material gases, and the n-type
super-lattice clad layer 124 is grown by growing alternately the
n-type AlGaN barrier layers and the n-type GaN well layers for a
total of 50 layers. [0044] (9) Then, the temperature is decreased
to 850.degree. C.; TMG, TMA, and ammonia gas are supplied as
material gases; and the n-type AlGaN first barrier layer 126 is
grown. [0045] (10) Next, at 850.degree. C., the active layer 129 is
grown by growing alternately the n-type InGaN well layers 128 and
the n-type AlGaN second barrier layers 130 for a total of three
layers. [0046] (11) Then, the temperature is increased to
1025.degree. C. and the Mg-doped p-type AlGaN block layer 132 is
grown. [0047] (12) Next, also at 1025.degree. C., the p-type
super-lattice clad layer 134 is grown by growing alternately the
Mg-doped p-type AlGaN barrier layers and the Mg-doped p-type GaN
well layers for a total of 30 layers. [0048] (13) Finally, at
1025.degree. C., the Mg-doped p-type GaN contact layer 136 is
grown.
[0049] After forming the layered structure as described above, the
wafer is removed from the MOCVD apparatus and the electrodes are
formed. More specifically, Ni (10 nm) and Au (10 nm) are
vacuum-deposited one after another on the surface of the wafer and
is heat-treated at 520.degree. C. in an oxygen atmosphere
containing 5% of oxygen and a p-type transparent electrode is
formed. Next, photo-resist is applied all over the surface of the
wafer and the wafer is etched using the photo-resist as an etching
mask until a portion of the n-type contact layer 122 is exposed in
the surface. Then, an n-type electrode is formed on the exposed
n-type contact layer 122. More specifically, Ti (5 nm) and Al (5
nm) are vacuum-deposited one after another on the wafer, the wafer
is heat-treated at 450.degree. C. in nitrogen gas for 30 minutes
and the n-type electrode is formed. Gold pads for wire bonding are
formed on portions of the p-type transparent electrode and the
n-type electrode, the back face of the substrate is polished and a
LED chip is cut out by scribing, the chip is mounted in a package
and an LED is obtained.
[0050] The material and thickness of each of the layers described
above are examples and, more specifically, the LED can be
fabricated under the conditions as follows: TABLE-US-00001 TABLE 1
Carrier Temp. Film Concentration for Name of Layer Composition
Thickness [cm.sup.-3] Growth p-type contact layer A1 .ltoreq. 0.1,
In .ltoreq. 0.1 .ltoreq.35 nm up to 1E18 975 to p-type clad layer,
SL A1 .ltoreq. 0.2, In .ltoreq. 0.1 .ltoreq.2 nm up to 5E17
1025.degree. C. barrier layer, .ltoreq.2 nm SL well layer A1
.ltoreq. 0.05, In .ltoreq. 0.1 .ltoreq.60 layers p-type block layer
A1 .ltoreq. 0.1, In .ltoreq. 0.1 Active Non-doped A1 .ltoreq. 0.3,
In .ltoreq. 0.05 .ltoreq.20 nm 800 to layer n-type second
900.degree. C. <5MQ barrier layer Non-doped A1 .ltoreq. 0.01, In
.ltoreq. 0.1 .ltoreq.4 nm n-type second .ltoreq.5 well layer (five)
layers Non-doped A1 .ltoreq. 0.3, In .ltoreq. 0.05 .ltoreq.50 nm
n-type first barrier layer n-type clad layer A1 .ltoreq. 0.2, In
.ltoreq. 0.1 .ltoreq.2 nm <1E17 to 1050 to SL barrier layer 1E19
1100.degree. C. SL well layer A1 .ltoreq. 0.05, In .ltoreq. 0.1
.ltoreq.2 nm <1E18 to .ltoreq.60 1E19 layers n-type A1 .ltoreq.
0.1, In .ltoreq. 0.1 .ltoreq.3 .mu.m up to 5E18 contact layer
High-tem- Non-doped A1 .ltoreq. 0.1 .ltoreq.2 .mu.m <1E17
perature n-type second buffer high-tempera- ture buffer layer
High-tempera- .ltoreq.200 s ture SiN buffer layer (not essential)
Non-doped A1 .ltoreq. 0.1 .ltoreq.2 .mu.m 1E17 n-type first
high-tempera- ture buffer layer Low-tem- Low A1 .ltoreq. 0.1
.ltoreq.50 nm 450 to perature temperature 750.degree. C. buffer
GaN-based buffer layer Low .ltoreq.200 s temperature SiN buffer
layer (not essential) Sapphire substrate
[0051] The n-type first barrier layer 126 can be constructed not
only with AlGaN but also with Al.sub.xIn.sub.yGa.sub.1-x-yN where
the ranges of the composition ratios x and y are
0.ltoreq.x.ltoreq.0.3 and 0.ltoreq.y.ltoreq.0.05. In the table,
these conditions are represented as Al.ltoreq.0.3 and
In.ltoreq.0.05.
[0052] The n-type well layer 128 and the n-type second barrier
layer 130 of the active layer 129 can also respectively be
constructed with Al.sub.xIn.sub.yGa.sub.1-x-yN and, for the well
layer 128, 0.ltoreq.x.ltoreq.0.01 and 0.ltoreq.y.ltoreq.0.1 and,
for the n-type second barrier layer 130, 0.ltoreq.x.ltoreq.0.3 and
0.ltoreq.y.ltoreq.0.05, respectively. In the table, these are
represented as Al.ltoreq.0.01 and In.ltoreq.0.1 for the n-type well
layer 128 and Al.ltoreq.0.3 and In.ltoreq.0.05 for the n-type
second barrier layer 130. The materials of the n-type first barrier
layer 126, the n-type well layer 128, the n-type second barrier
layer 130, the p-type block layer 132 and the super-lattice clad
layers 124 and 134 are summarized as follows: [0053] The n-type
first barrier layer 126 and the n-type second barrier layer 130:
Al.sub.xIn.sub.yGa.sub.1-x-yN (0.ltoreq.x.ltoreq.0.3 and
0.ltoreq.y.ltoreq.0.05); [0054] The n-type well layer 128:
Al.sub.aIn.sub.bGa.sub.1-a-bN (0.ltoreq.a.ltoreq.0.01 and
0.ltoreq.b.ltoreq.0.1); [0055] The p-type carrier block layer:
Al.sub.pIn.sub.qGa.sub.1-p-qN (0.ltoreq.p.ltoreq.0.5 and
0.ltoreq.q.ltoreq.0.1); [0056] The super-lattice clad layer
(barrier layer):
Al.sub..alpha.In.sub..gamma.Ga.sub.1-.alpha.-.gamma.N
(0.ltoreq..alpha..ltoreq.0.2 and 0.gamma..ltoreq.0.1) [0057] The
super-lattice clad layer (well layer):
Al.sub..beta.In.sub..eta.Ga.sub.1-.beta.-.eta.N
(0.ltoreq..beta..ltoreq.0.05 and 0.ltoreq..eta..ltoreq.0.1)
[0058] The aspect of the configuration shown in FIG. 1 that differs
from the conventional configuration shown in FIGS. 9A, 9B, 10A, and
10B is that the composition ratios of the n-type super lattice clad
layer 124, the p-type super-lattice clad layer 134, the p-type
block layer 132, then-type second barrier layer 130, and the n-type
first barrier layer 126 are controlled and are set such that the
band gap energy of these layers satisfy predetermined
relationships. More specifically, when the band gap energy of the
p-type block layer 132 as Egb, the band gap energy of n-type second
barrier layer 130 of the active layer 129 as Eg2, the band gap
energy of the n-type first barrier layer 126 as Eg1, and the band
gap energy of the of the n-type clad layer 124 and the p-type clad
layer 134 as Egc, in the present invention the relationship
Egb>Eg2>Eg1.gtoreq.Egc must be satisfied.
[0059] FIG. 2 shows the relationships of magnitudes of the band gap
energies of each of the layers. The n-type clad layer 124 and the
p-type clad layer 134 have a super-lattice structure. Denoting this
effective band gap energy as Egc, the band gap Egb of the p-type
block layer 132 must be higher than Egc and Eg2 to confine
electrons that are the carriers. That is, Egb must be greater than
Eg2. As to the relation of magnitudes between Eg1 and Eg2, because
it is not necessary to provide a band offset between the active
layer and the barrier layer as shown in the patent literature
described above, the Eg2 may also be equal to Eg1. However, as
described below, the inventor of the present invention found as the
result of various experiments that the intensity of the light
emission is increased to a greater extent when Eg1<E g2.
[0060] FIG. 3 shows variation of the intensity of light emission in
the case where the band gap energy Eg1 of the n-type first barrier
layer 126 is varied assuming the value of the band gap energy Eg2
of the n-type second barrier layer 130 is 1 (one). The intensities
of light emission are compared using each total light output
emitted from the fabricated LED device when a current is injected
into the device as measured by placing the device in an integrating
sphere. The wavelength of the light emission is approximately 370
nm. In the figure, the axis of the abscissa represents Eg1/Eg2and
the axis of the ordinate represents electroluminescence intensity
(relative intensity). Variation of the band gap energy of the
n-type first barrier layer 126 is realized by varying the
composition ratio of Al in Al.sub.xGa.sub.1-xN by varying the
amount supplied of trimethyl-aluminum (TMA). The band gap energy is
increased as the composition ratio x of Al is increased by
increasing the amount of TMA supplied. Band gap energy other than
Eg1 such as, for example, Egc and Egb is set at a constant value.
As can be seen from the figure, when Eg1 and Eg2 are equal
(Eg1/Eg2=1), the intensity of the light emission is 0.08, whereas,
when Eg1/Eg2=0.96 meaning that Eg1 is lower than Eg2, the intensity
of the light emission is increased to the vicinity of 0.18. From
this fact, it can be seen that the intensity of the light emission
is increased by setting the relation of energy as Eg2>Eg1.
[0061] In FIG. 3, when the value of Eg1 is further decreased and
Eg1/Eg2=0.92, the intensity of the light emission is decreased to
0.07 because Eg1 is smaller than the effective band gap Egc of the
n-type super-lattice clad layer 124 and, as a result, the
hole-confining effect is decreased. FIG. 4 shows the variation in
the intensity of the light emission when the band gap Eg1 of the
n-type first barrier layer 126 is varied, assuming the values of
the effective band gap Egc of the n-type clad layer 126 and p-type
clad layer 134 are 1 (one). Similarly as in the case shown in FIG.
3, the band gap energy of the n-type first barrier layer 126 is
varied by varying the composition ratio x of Al in
Al.sub.xGa.sub.1-xN constituting the first barrier layer. As can be
seen from the figure, compared to the intensity of the light
emission of 0.16 when Eg1 and Egc are equal, that is, when
Eg1/Egc=1 (one), the intensity of the light emission is increased
to 0.18 when Eg1/Egc=1.3 and the intensity of the light emission is
decreased to 0.07 when Eg1/Egc=0.6. Therefore, it can be seen that
Eg1 must be made greater than Egc to increase the intensity of the
light emission.
[0062] In FIG. 4, the intensity of the light emission decreases to
0.08 when Eg1 is further increased and Eg1/Egc=1.9 because, when
Eg1 is set at a value that is too large, the relationship becomes
Eg1>Eg2.
[0063] FIG. 6 shows variation of the intensity of the light
emission when the band gap energy Egb of the p-type block layer 132
is varied and the value of the band gap energy Eg2 of the n-type
second barrier layer 130 is assumed to be 1 (one). The intensity of
the light emission is monotonously increased as the band gap energy
Egb of the p-type block layer 132 is increased because the
electron-confining effect is increased as Egb is increased.
[0064] From the above, it can be seen that the intensity of the
light emission of the apparatus can be increased to a greater
degree than in a conventional apparatus by ensuring that the
relationship Egb>Eg2>Eg1.gtoreq.Egc as shown in FIG. 2 is
maintained.
[0065] On the other hand, regarding the thickness of the n-type
first barrier layer 126, it is described in the above patent
literature that the layer 126 is formed with a greater thickness
than other barrier layers. However, when the n-type first barrier
layer 126 is constructed with non-doped AlGaN or non-doped AlInGaN,
the intensity of the light emission is decreased when this layer is
formed too thick because this layer also functions as a resistor
layer.
[0066] FIG. 6 shows variation of the intensity of emitted light
when the thickness of the n-type first barrier layer 126 is varied
while the thickness of the n-type second barrier layer 130 is
fixed. The intensity of the light emission is increased as the
thickness of the n-type first barrier layer 126 is increased and an
intensity of the light emission of 0.18 is realized when the
thickness is in the vicinity of 25 nm. However, when the layer is
formed to a greater thickness, the intensity of the light emission
begins to decrease. Therefore, denoting the thickness of the n-type
first barrier layer 126 as d1 and the-thickness of the n-type
second barrier layer 130 as d2, it is desirable that the values
satisfy the relationship d1>d2. However, it is necessary to
suppress the upper limit of d1 to 50 nm or less.
[0067] In the embodiment, the n-type well layer 128 and the n-type
second barrier layer 130 are stacked on the n-type first barrier
layer 126, and the n-type well layer 128 is formed between the
n-type first barrier layer 126 and the n-type second barrier layer
130. The presence of this well layer is also preferable from the
viewpoint of improving the intensity of the light emission. FIG. 7
shows variation of the intensity of the light emission in cases
where the well layer is either formed or not formed between the
n-type first barrier layer 126 and the n-type second barrier layer
130. The intensity of the light emission is 0.2 when the well layer
is formed, as compared to an intensity of of 0.16 when the well
layer is not formed.
[0068] Furthermore, in the embodiment, the active layer 129 is
structured by the MQW consisting of the n-type first barrier layer
126, the n-type well layer 128 and the n-type second barrier layer
130. However, it is preferable to cause an increase in the quantum
effect by forming the n-type well layer 128 such that the thickness
of the layer 128 as thin as possible. FIG. 8 shows variation of the
intensity of the light emission in the case where the thickness of
the n-type well layer 128 is varied while the thickness of the
n-type second barrier layer 130 is fixed. The intensity of the
light emission is increased as the n-type well layer 128 becomes
thinner. Therefore, the thickness of the well layer 128 may be 5 nm
or below, more preferably, 4 nm or less.
* * * * *