U.S. patent application number 11/005228 was filed with the patent office on 2006-06-08 for water cooling system for computer components.
Invention is credited to Eric Stafford.
Application Number | 20060118279 11/005228 |
Document ID | / |
Family ID | 36572908 |
Filed Date | 2006-06-08 |
United States Patent
Application |
20060118279 |
Kind Code |
A1 |
Stafford; Eric |
June 8, 2006 |
Water cooling system for computer components
Abstract
The water cooling system for computer components is a system for
removing heat from the heat-producing components of a computer, or
other electronic, system. The water cooling system for computer
components employs one or more water-block type heat exchangers to
remove heat from electronic circuit components, transferring heat
to a fluid coolant. A heat dissipating device, in the form of a
tubing coil, dissipates heat from the coolant. A coolant pump
circulates a fluid coolant from a coolant reservoir, through fluid
conduits interconnecting the water-block heat exchangers and the
heat dissipating device. The water-block type heat exchangers are
formed from a single, solid block of material, and have an internal
water passage directing the fluid coolant through the center of the
block to apply maximum cooling to the center of an electronic
circuit components where the maximum heat is produced.
Inventors: |
Stafford; Eric; (Mount
Juliet, TN) |
Correspondence
Address: |
LITMAN LAW OFFICES, LTD
PO BOX 15035
CRYSTAL CITY STATION
ARLINGTON
VA
22215
US
|
Family ID: |
36572908 |
Appl. No.: |
11/005228 |
Filed: |
December 7, 2004 |
Current U.S.
Class: |
165/104.33 ;
257/E23.098 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 23/473 20130101; F28D 1/0472 20130101; H01L 2924/0002
20130101; G06F 1/20 20130101; H01L 2924/00 20130101; F28F 7/02
20130101; F28D 1/024 20130101; G06F 2200/201 20130101 |
Class at
Publication: |
165/104.33 |
International
Class: |
F28D 15/00 20060101
F28D015/00 |
Claims
1. A water cooling system for computer components, comprising: a
heat dissipating device comprising a tubing coil; at least one
water-block heat exchanger adapted for removing heat from an
electronic component; a coolant reservoir; a coolant pump disposed
within said coolant reservoir; and a plurality of fluid conduits
interconnecting said tubing coil, said at least one water-block
heat exchanger, said coolant reservoir, and said coolant pump in
fluid communication; wherein a coolant contained within said
coolant reservoir is circulated through said at least one
water-block heat exchanger and said heat dissipating device by said
coolant pump.
2. The water cooling system for computer components according to
claim 1, wherein said tubing coil comprises a length of tubing
coiled about an axis.
3. The water cooling system for computer components according to
claim 1, wherein said heat dissipating device further comprises a
cooling fan, the cooling fan having a housing, an electric motor
disposed within the housing, and at least one fan blade driven by
the electric motor, the cooling fan being coupled to said tubing
coil.
4. The water cooling system for computer components according to
claim 3, wherein said heat dissipating device further comprises a
plurality of support posts extending from said housing, said tubing
coil being supported by said support posts.
5. The water cooling system for computer components according to
claim 3, wherein said tubing coil comprises a length of tubing
coiled about an axis.
6. The water cooling system for computer components according to
claim 5, wherein said cooling fan is oriented to blow air along
said axis.
7. A water cooling system for computer components, comprising: heat
dissipating means for dissipating heat from a coolant; at least one
water-block heat exchanger, the water block heat exchanger
comprising a single piece block of material having a center point,
the single piece block of material having a plurality of passages
defined therein, the passages forming a water channel that passes
through the center point; a coolant reservoir; a coolant pump
disposed within said coolant reservoir; and a plurality of fluid
conduits interconnecting said tubing coil, said at least one
water-block heat exchanger, said coolant reservoir, and said
coolant pump in fluid communication; wherein a coolant contained
within said coolant reservoir is circulated through said at least
one water-block heat exchanger and said heat dissipating device by
said coolant pump.
8. The water cooling system for computer components according to
claim 7, wherein said water block heat exchanger further comprises
a water inlet and a water outlet each in fluid communication with
said water channel.
9. The water cooling system for computer components according to
claim 7, wherein said water channel is an S shaped channel.
10. The water cooling system for computer components according to
claim 7, wherein said water channel is a Z shaped channel.
11. A water-block heat exchanger, comprising: a single piece block
of material having a center point; and a plurality of passages
defined within said block, the passages forming a water channel
that passes through the center point; and a water inlet and a water
outlet each disposed on said block in fluid communication with said
water channel.
12. The water-block heat exchanger according to claim 11, wherein
said passages form an S shaped water channel.
13. The water-block heat exchanger according to claim 11, wherein
said passages form a Z shaped water channel.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a cooling system for
electronic components, and more particularly, to a water cooling
system for computer components components.
[0003] 2. Description of the Related Art
[0004] It is well known that electronic components generate heat
during operation. Integrated circuit components tend to generate an
increasing amount of heat as additional circuits or gates are
included in ever-smaller packages. In computer systems, including
well-known personal computer systems, generated heat must be
removed from the electronic components to maintain the system
within operating limits. Over-temperature operations can lead to
decreased performance and to component damage.
[0005] In computer systems, including personal computers, fans are
commonly used to circulate air over the electronic components for
cooling. One or more fans typically draws air into the computer's
housing, providing a general cooling air circulation throughout.
While such a technique can be effective, such a generalized cooling
may be insufficient for a circuit where one or a few individual
components produce the greatest amount of heat. In a personal
computer, the CPU (Central Processing Unit) chip is typically the
greatest single heat producer, often with a display graphics driver
such as a Video Graphics Array (VGA) chip a close second. With such
single-point sources of heat, generalized airflow within the
computer housing does not provide optimal cooling.
[0006] A solution to such single-point heat sources is the
placement of a heat sink on the heat source, as by placing a heat
sink directly on the CPU. A heat sink generally conducts heat away
from the component to a large surface area, the large surface area
often being a plurality of cooling fins through which increased air
contact removes a greater amount of heat. Size considerations, as
well as practical limitations on the amount of air that can be
circulated within the housing, limit the effectiveness of
air-cooled heat sinks.
[0007] Water cooling systems place a water-cooled block, generally
of metal such as copper or aluminum, on a heat-generating
component. Water is circulated through the block, and the water is
cooled in a heat-dissipating device such as a radiator. A water
channel passing through the water block is subject to manufacturing
limitations, and thus may not be optimally routed to direct the
cooling water to the center of the circuit component, where heat
production is greatest. Water blocks may be manufactured from a
solid block of metal, with holes drilled into the water block to
form the water channels, with the end of the drilled holes plugged
as needed to create water-tight water channels. In this case,
placement of a water channel is limited by the reach of a drill
press. Alternatively, a water block car be formed by milling the
water channel into the top of a metal block, and then securing a
cover over the block. While this method allows an arbitrary water
channel path, the need to seal the cover presents an increased risk
of leakage.
[0008] A typical radiator employs a metal tubing having a number of
cooling fins disposed along the tubing. One or more fans pass air
through the cooling fins, transferring heat away. Increasing the
number, and thereby the density, of the cooling fins tends to
require additional, or stronger, fans to force ail through the
decreased spaces between fins, and thus increase the noise and
vibration produced by the cooling system, as well as the power
required to operate the cooling system. Additionally, suitable
radiators tend to be relatively costly.
[0009] Thus a water cooling system for computer components solving
the aforementioned problems is desired.
SUMMARY OF THE INVENTION
[0010] The water cooling system for computer components employs a
heat-dissipating device along with one or more water blocks to cool
electronic components of a computer system. The water cooling
system for computer components employs, as a heat dissipating
device, a length of copper tubing formed into a coil. The copper
coil provides sufficient heat transfer for the cooling system with
no fans employed. A single fan may be used to pass air over the
coiled tubing for enhanced heat dissipation, the fan being oriented
to move air along an axis passing lengthwise through the coil.
[0011] One or more solid metal water blocks are used to cool
various components within the computer system. Each of the water
blocks is formed from a solid metal block by drilling a plurality
of holes through the block to form a water channel. The ends of the
holes are plugged as necessary to create water-tight water
channels. The holes are disposed in the block to from a water
channel that passes through the center of the block, so that the
block, when mounted on a circuit component, directs maximum cooling
to the center of the circuit component.
[0012] These and other features of the present invention will
become readily apparent upon further review of the following
specification and drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] FIG. 1 is an environmental, perspective view of a water
cooling system for computer components according to the present
invention.
[0014] FIG. 2 is a perspective view of a heat dissipating device
for the water cooling system for computer components according to
the present invention.
[0015] FIG. 3 is an exploded view showing the mounting of a water
block to an electronic circuit component in a water cooling system
for computer components according to the present invention.
[0016] FIG. 4 is an exploded perspective view of a water block for
cooling a CPU chip for the water cooling system for computer
components according to the present invention.
[0017] FIG. 5 is a sectional view of the water block for cooling a
CPU chip shown in FIG. 4, showing the water block's internal water
channels.
[0018] FIG. 6 is a perspective view of a mounting bracket for the
water block for cooling a CPU chip shown in FIG. 4.
[0019] FIG. 7 is an exploded perspective view of a water block for
cooling a VGA chip for the water cooling system for computer
components according to the present invention.
[0020] FIG. 8 is a sectional view of the water block for cooling a
VGA chip shown in FIG. 7, showing the water block's internal water
channels.
[0021] FIG. 9 is a perspective view of a mounting bracket for the
water block for cooling a VGA chip shown in FIG. 7.
[0022] Similar reference characters denote corresponding features
consistently throughout the attached drawings.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0023] The present invention is a water cooling system for computer
components. Referring to FIG. 1, the water cooling system for
computer components comprises at least one water-block heat
exchanger 20, disposed on an electrical circuit component within a
computer system, in connection by a network of coolant circulation
lines or conduits 30 with a coolant reservoir 40 and a
heat-dissipating device 10. A coolant pump 42 circulates a fluid
coolant through the water-block heat exchangers 20, and through the
heat-dissipating device 10. As the coolant passes through a
water-block heat exchanger 20, heat from an electrical circuit
component is transferred through the water-block heat exchanger to
the coolant, thereby removing heat from the electrical circuit
component. As the coolant passes through the heat-dissipating
device 10, heat is transferred from the coolant and is dissipated
into air surrounding the heat-dissipating device 10.
[0024] Turning now to FIG. 2, the heat-dissipating device 10
comprises primarily a coil 11 of tubing 13. The coil 11 is formed
from a length of tubing 13 that is coiled about a central axis.
Copper tubing is used for the coil 12 of the illustrated
embodiment, although any type of tubing having a sufficient
heat-transferring characteristic may be used. Support posts 17 hold
the coil 11 in position. In the illustrated embodiment, four
support posts 17 are used, each post extending vertically from a
corner of the square housing of a fan 19. The fan 19 may be
provided to increase airflow across the coil 11, generally along
the axis of the coil 11. While the heat-dissipating device 10
provides sufficient heat dissipation without the fan 19 for some
applications, such as a configuration wherein water cooling is only
applied to a single component such as a computer's CPU, the
addition of the fan 19 increases the effectiveness of the
heat-dissipating device 10 for applications where additional heat
must be dissipated, such as a configuration wherein water cooling
is applied to several system components.
[0025] Turning now to FIG. 3, a mounting technique is illustrated
for fastening a water-block heat exchanger 20 to an electrical
circuit component 52 on a circuit board 50, such as a computer
system's motherboard. In the illustrated embodiment, the electrical
circuit component 52 is a computer system's CPU, an integrated
circuit package that is surface-mounted to the circuit board 50 in
a conventional manner. The mounting technique is applicable to
other circuit components as well.
[0026] The water-block heat exchanger 20 is placed on top of the
electrical circuit component 52, with the bottom surface of the
water-block heat exchanger 20 flush against the top surface of the
electrical circuit component 52. A mounting bracket 25, which is
generally a flat plate having an opening centrally defined therein
to accommodate a water inlet 21 and outlet 23 that extend from the
top of the water-block heat exchanger 20, is placed on top of the
water-block heat exchanger 20 and bolted to the circuit board 50 to
secure the water-block heat exchanger in place.
[0027] Adequate contact is desired between the bottom surface of
the water-block heat exchanger 20 and the top surface of the
electrical circuit component 52 to allow optimum heat transfer from
the electrical circuit component 52 to the water-block heat
exchanger 20. Thus, springs 27 are disposed on each bolt atop the
mounting bracket 25, so that the effects of any temperature
deformation of the circuit board 50, the electrical circuit
component 52, the water-block heat exchanger 20, the mounting
bracket 25, or the mounting hardware are minimized.
[0028] Turning now to FIGS. 4 and 5, an embodiment 100 of a
water-block heat exchanger 20 for a computer system's CPU is shown.
The CPU water-block 100 is formed from a single piece, solid block
110 of a metal such as aluminum or copper, or another material
having a suitable heat-conducting property, the block 110 being
generally square and having dimensions compatible with a computer
CPU such as the Pentium.COPYRGT. processor made by Intel.COPYRGT..
A water channel 120 is formed within the block 110 by drilling a
several interconnecting holes into the block 110. The block 110 is
a square block having four sides 111, 111B, 111C and 111D, a top
surface 113 and a bottom surface 115. Corners 117 of the block are
beveled to assist in aligning the mounting bracket 25 with the
block 110.
[0029] The water channel 120 comprises a first hole 121 drilled
into a side 111A of the block 110, and extending substantially, but
not completely, through the block 110. The first hole 121 lies
adjacent and parallel to the bottom of the block 110, and follows a
centerline 119 of the block 110. A second hole 122 is drilled into
the side 111A of the block 110 beside and parallel to the first
hole 121. A third hole 123 is drilled into the side 111B opposite
the side 111A, the third hole 123 lying beside the first hole 121
and extending substantially, but not completely, through the block
110. A fourth hole 124 is drilled into a side 111C of the block
110, the fourth hole 124 lying near the side 111B of the block 110
and extending through the third hole 123 and joining the first hole
121. A fifth hole 125 is drilled into a side 111D of the block 110,
the fifth hole 125 lying near the side 111A of the block 110 and
extending through the second hole 122 and joining the first hole
121. The open ends of each of the holes 121, 122, 123, 124 and 125
are plugged to form a watertight passageway within the block 110.
The result is an S shaped water channel 120 that can carry a fluid
coolant through a significant portion of the CPU water-block 100
and, in particular, directs the fluid coolant through the center of
the CPU water-block 100.
[0030] A water inlet 21 and a water outlet 23 are barbed fittings
for receiving a flexible tubing to provide a fluid flow through the
CPU water-block 100. The water inlet 21 and water outlet 23 are
inserted into holes 127 and 129, respectively, drilled into the top
surface 113 of the block 110 to join holes 122 and 123 within the
block 110. Thus, water entering water inlet 21 flows through the
water channel 110 and out through water outlet 23. The mounting
bracket 25, shown in FIG. 6, is a flat rectangular plate having an
opening 27 centrally defined therein to accommodate a water inlet
21 and outlet 23 that extend from the top of the CPU water-block
100.
[0031] Turning now to FIGS. 7 and 8, an embodiment 200 of a
water-block heat exchanger 20 for a computer system's VGA chip is
shown. The VGA water-block 200 is formed from a solid block 210 of
a metal such as aluminum or copper, or another material having a
suitable heat-conducting property, the block 210 being generally
square and having dimensions compatible with a typical computer
system VGA chip. A water channel 220 is formed within the VGA
water-block 200 by drilling a several interconnecting holes into
the block 210. The block 210 is a generally square block having
four sides 211A, 211B, 211C and 211D, a top surface 213 and a
bottom surface 215. Opposing corners of the block 210 are beveled
to form opposing corner faces 217.
[0032] The water channel 220 comprises a first hole 221 drilled
into one of the corner faces 217, and extending diagonally through
the block 210, passing through the center of the block 210. The
first hole 221 may extend entirely through the block, exiting the
opposite corner face 217, or may end short of the opposite corner
face 217. A second hole 222 is drilled into a side 111C of the
block 210 alongside, and parallel to, side 111B of the block 210 to
intersect with the first hole 221 near the corner face 217. A third
hole 223 is drilled into side 111D of the block 210 alongside, and
parallel to, side 111A of the block 210, to intersect with the
first hole 221 near the corner face 217. The open ends of each of
the holes 221, 222, and 223 are plugged to form a watertight Z
shaped water channel 220 within the block 210.
[0033] A water inlet 21 and a water outlet 23 are barbed fittings
for receiving a flexible tubing to provide a fluid flow through the
VGA water-block 200. The water inlet 21 and water outlet 23 are
inserted into holes 227 and 229, respectively, drilled into the top
surface 213 of the block 210 to join holes 222 and 223 within the
block 210. Thus, water entering water inlet 21 flows through the
water channel 220 and out through water outlet 23. A mounting
bracket 25, shown in FIG. 9, is a flat rectangular plate having an
opening 27 centrally defined therein to accommodate a water inlet
21 and outlet 23 that extend from the top of the VGA water-block
200.
[0034] It is to be understood that the present invention is not
limited to the embodiments described above, but encompasses any and
all embodiments within the scope of the following claims.
* * * * *