U.S. patent application number 10/538391 was filed with the patent office on 2006-06-01 for lead frame plating apparatus.
Invention is credited to Chul-Min Kim, Won-Chan Park.
Application Number | 20060113184 10/538391 |
Document ID | / |
Family ID | 36566363 |
Filed Date | 2006-06-01 |
United States Patent
Application |
20060113184 |
Kind Code |
A1 |
Park; Won-Chan ; et
al. |
June 1, 2006 |
Lead frame plating apparatus
Abstract
Disclosed herein is a lead frame plating apparatus. The lead
frame plating apparatus comprises side inlets provided in the
diagonal direction at opposite sides for supplying plating
solution, a flow mixing room defined with an inner space in the
longitudinal direction, a plating solution outlet for guiding the
plating solution in the direction of nozzles, and a plating
solution distribution part provided with the nozzles at an upper
part of the plating solution outlet. Each nozzle is provided, at
the lower end thereof, with a divergent-shaped expansion tube such
that an inner diameter of the inlet of the expansion tube, larger
than that of the nozzle, gradually decreases to an extent of the
inner diameter of the nozzle. The lead frame plating apparatus
supplies the plating solution through the nozzles with a uniform
distribution.
Inventors: |
Park; Won-Chan; (Kyunggi-do,
KR) ; Kim; Chul-Min; (Suwon-shi, KR) |
Correspondence
Address: |
COOPER & DUNHAM, LLP
1185 AVENUE OF THE AMERICAS
NEW YORK
NY
10036
US
|
Family ID: |
36566363 |
Appl. No.: |
10/538391 |
Filed: |
March 17, 2004 |
PCT Filed: |
March 17, 2004 |
PCT NO: |
PCT/KR04/00586 |
371 Date: |
June 9, 2005 |
Current U.S.
Class: |
204/263 ;
204/269 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 2924/0002 20130101; C25D 17/02 20130101; H01L 2924/00
20130101; C25D 5/026 20130101; C25D 5/022 20130101; H01L 23/49582
20130101 |
Class at
Publication: |
204/263 ;
204/269 |
International
Class: |
C25B 9/00 20060101
C25B009/00; C25C 7/00 20060101 C25C007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 17, 2003 |
KR |
10-2003-0016516 |
Mar 17, 2003 |
KR |
10-2003-0016515 |
Claims
1. A lead frame plating apparatus for injecting plating solution
through nozzles to a lead frame with a uniform distribution of the
plating solution, the apparatus comprising: side inlets provided in
the diagonal direction at opposite sides of the lead frame plating
apparatus, respectively, for supplying the plating solution; a flow
mixing room defined with an inner space in the longitudinal
direction for the plating solutions, having flowed in the through
the side inlets, to be mixed with each other while flowing in
parallel; and a plating solution outlet for guiding the plating
solution in the direction of nozzles, the plating solution outlet
having a cross sectional area smaller than that of the flow mixing
room.
2. The apparatus as set forth in claim 1, wherein the plating
solution outlet is installed with a distribution plate provided
with a plurality of holes.
3. The apparatus as set forth in claim 1, the apparatus further
comprising: a plating solution distribution part provided with the
nozzles at an upper side of the plating solution outlet, each
nozzle being provided, at the lower end thereof, with a
divergent-shaped expansion tube such that an inner diameter of the
inlet of the expansion tube, larger than that of the nozzle,
gradually decreased to the extent of the inner diameter of the
nozzle.
4. The apparatus as set forth in claim 3, wherein the expansion
tube at the lower end of the nozzle is mounted by being inserted
into the inside of the plating solution distribution part.
5. The apparatus as set forth in claim 3, wherein the expansion
tube at the lower end of the nozzle is mounted in a state of being
protruded from an outer side of the plating solution distribution
part.
6. The apparatus as set forth in claim 2, the apparatus further
comprising: a plating solution distribution part provided with the
nozzles at an upper side of the plating solution outlet, each
nozzle being provided, at the lower end thereof, with a
divergent-shaped expansion tube such that an inner diameter of the
inlet of the expansion tube, larger than that of the nozzle,
gradually decreased to the extent of the inner diameter of the
nozzle.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a lead frame plating
apparatus, and more particularly to a lead frame plating apparatus,
which is provided with nozzles, each having a shape for preventing
the plating solution from generating a vortex flow, and induces
mixing of the plating solution to uniformly distributing the
plating solution into nozzles.
[0003] 2. Description of the Related Art
[0004] A conventional lead frame plating apparatus will now be
described with reference to the drawings.
[0005] Referring to FIG. 1, plating solution 3 supplied through a
supply pipe 1 is driven by a pump 5 and is then supplied to a
distribution part 10 defined with a predetermined space therein
through a bottom part inlet 7.
[0006] As shown in FIGS. 2 and 3, the conventional lead frame
plating apparatus is provided with a plurality of distributing
plates 12 inside the distribution part 10, in order to induce a
uniform flow of the plating solution supplied from the bottom part
inlet 7 to be guided into nozzles 14 at an upper portion of the
apparatus.
[0007] Each distributing plate 12 is formed with a plurality of
hollow portions 13, so that when the plating solution 3 passes
through the hollow portions 13 of the distributing plates 12, the
plating solution 3 is uniformly mixed.
[0008] Then, as shown in FIG. 1, the plating solution 3 is injected
to an upper side through the nozzles 14, thereby performing a
plating operation for a lead frame 17 which is restricted in its
upward movement by a top part block 16.
[0009] Meanwhile, since the conventional lead frame plating
apparatus is provided with a mask 19 under the lead frame 17, the
plating solution 3 injected through the nozzles 14 arrives only on
predetermined portions of the lead frame 17. Further, the plating
solution 3, having fallen to a lower side, is guided to either side
to flow along a passage defined at a lower portion of a guide plate
18.
[0010] In accordance with the conventional lead frame plating
apparatus, the bottom part inlet 7 is provided at the center of a
lower side of the distribution part 10, and three or more
distributing plates 12 are used for the uniform distribution when
the plating solution from the bottom part inlet 7 flows to the
nozzles 14. With the conventional lead frame plating apparatus,
when the plating solution 3 passes through the hollow portions 13
of the distributing plates 12, vortex flow is generated, causing a
detrimental loss in pressure.
[0011] Thus, in order to supply the set amount of fluid required
for plating, the plating solution supply pump 5 should be increased
in capacity. Further, an increase of pressure for supplying the
plating solution 3 raises the inner pressure of the distribution
part 10, thereby increasing the possibility of breakage of the
apparatus and reducing durability thereof.
[0012] Further, as shown in FIGS. 4 and 5, the nozzles 14 are
mounted such that with a plurality of nozzles mounted on the upper
side of the distribution part 10, the plating solution 3 is
injected to the upper side through each nozzle aperture 15 formed
at each nozzle 15.
[0013] As described above, if the plating solution 3 is injected to
the upper side through the conventional straight nozzles 14, the
vortex flow of the plating solution 3 is generated, as shown in
FIG. 6, near the inlet of each nozzle, causing a decrease in the
width of the fluid passage of the plating solution 3. Thus, the
quantity of plating solution is reduced, thereby decreasing the
injection rate of the plating solution at the outlet of each
nozzle.
SUMMARY OF THE INVENTION
[0014] The present invention has been made to solve the above
problems, and it is an object of the present invention to provide a
lead frame plating apparatus, which supplies plating solution to
nozzles with a uniform distribution and with a reduced pressure
loss.
[0015] It is another object of the present invention to provide a
lead frame plating apparatus, which overcomes the problem of
increased cost due to the increased capacity of a supply pump for
supplying plating solution compensating for the pressure loss
occurring when the plating solution is mixed, and which prevents a
breakage of the apparatus due to an increased inner pressure of the
plating solution.
[0016] It is yet another object of the present invention to provide
a lead frame plating apparatus, which prevents a decrease in the
width of a fluid passage of the plating solution by removing vortex
flow generated near the inlet of each nozzle, thereby increasing
fluid quantity and flow rate of the plating solution injected from
the nozzles.
[0017] In accordance with an aspect of the present invention, the
above and other objects can be accomplished by the provision of a
lead frame plating apparatus, comprising: side inlets provided in a
diagonal direction at opposite sides of the lead frame plating
apparatus, respectively, for supplying plating solution; a flow
mixing room defined with an inner space in a longitudinal direction
for the plating solutions, flowing in through side inlets, to be
mixed with each other while flowing in parallel; a plating solution
outlet for guiding the plating solution in the direction of the
nozzles, the plating solution outlet having a cross-sectional area
smaller than that of the flow mixing room; and a plating solution
distribution part provided with the nozzles at an upper portion of
the plating solution outlet, each nozzle being provided, at the
lower end thereof, with a divergent-shaped expansion tube such that
an inner diameter of the inlet of the expansion tube, larger than
that of the nozzle, gradually decreases to the extent of the inner
diameter of the nozzle.
[0018] In accordance with the present invention, an excessively
large-capacity pump is not required due to the structure which
reduces pressure loss during mixing the plating solution, so that
cost reduction and prevention of breakage in the apparatus by an
excessive inner pressure can be obtained, and so that when the
plating solution passes through each nozzle, the vortex flow is not
generated, thereby achieving a proper supply of the plating
solution.
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The above and other objects, features and other advantages
of the present invention will be more clearly understood from the
following detailed description taken in conjunction with the
accompanying drawings, in which:
[0020] FIG. 1 is a structural view showing the main construction of
a conventional lead frame plating apparatus;
[0021] FIG. 2 is a front view of the conventional plating
apparatus;
[0022] FIG. 3 is a partially cut-away perspective view of FIG.
2;
[0023] FIG. 4 is a perspective view illustrating the plating
apparatus with nozzles mounted thereon;
[0024] FIG. 5 is a side sectional view of the plating apparatus of
FIG. 4;
[0025] FIG. 6 is a diagram illustrating flow of plating solution
passing through one of the nozzles;
[0026] FIG. 7 is a perspective view of a lead frame plating
apparatus according to an embodiment of the present invention;
[0027] FIG. 8 is a partially cut-away perspective view of another
embodiment of the plating apparatus;
[0028] FIG. 9 is a front view of the plating apparatus;
[0029] FIG. 10 is a plane view of the plating apparatus;
[0030] FIG. 11 is a right-side sectional view of the plating
apparatus;
[0031] FIG. 12 is a partially cut-away perspective view of the
plating apparatus;
[0032] FIG. 13 is a side sectional view of the plating
apparatus;
[0033] FIG. 14 is a side sectional view of a plating apparatus
according to another embodiment of the present invention;
[0034] FIG. 15 is a side sectional view of a plating apparatus
according to yet another embodiment of the present invention;
and
[0035] FIG. 16 is a diagram illustrating flow of plating solution
passing through one of the nozzles according to the embodiment of
the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0036] Now, preferred embodiments of the present invention will be
described in detail with reference to the annexed drawings. In the
drawings, the same or similar elements are denoted by the same
reference numerals even though they are depicted in different
drawings.
[0037] As shown in FIG. 7, a lead frame plating apparatus of the
present invention is provided with side inlets 20 for supplying
plating solution at opposite sides of a flow mixing room 30 which
has an oval-shaped cross section such that the plating solution,
flowing in through each side inlet, is mixed while flowing in
parallel.
[0038] As shown in FIGS. 7 to 11, the side inlets 20 are provided
at the opposite sides of the flow mixing room 30, respectively, in
the diagonal direction such that flow of the plating solution from
one of the side inlets 30 into the flow mixing room 30 is
influenced as little as possible by the flow from the other side
inlet 30.
[0039] The lead frame plating apparatus of the invention is
provided with a plating solution outlet 40 having a
rectangular-shaped cross section at an upper side of the side
inlets 20, and a plating solution distribution part 60 provided
with nozzles 70 at an upper side of the plating solution outlet 40
to inject the plating solution toward an upper part of the
apparatus.
[0040] The plating solution outlet 40 of the structure as described
above may be installed with one or two distributing plates 50
provided with a plurality of holes 51, as shown in FIG. 8.
[0041] Operation of the lead frame plating apparatus will be
described hereinafter.
[0042] As shown in FIGS. 7 to 12, when the plating solution flows
into both sides of the flow mixing room 30 through the side inlets
20, the plating solution from each side inlet 20 flows in parallel
and the kinetic energy of the flow changes into pressure to make
the flow uniform.
[0043] A increased pressure on the plating solution in the flow
mixing room 30 causes the plating solution to flow to the upper
side through the plating solution outlet 40, so that the plating
solution is injected to the upper part through the nozzles.
[0044] Since the flow of the plating solution from the side inlets
20 generates a relatively low pressure at the inlets but it
generates a high pressure at the opposite side of the flow mixing
room, the balance between the pressures is not maintained. In order
to compensate for the imbalance between them, the side inlets 20
are located at opposite sides of the flow mixing room. Further, as
shown in FIG. 10, the side inlets 20 are provided such that the
flow of the plating solution from one of the side inlets 20 does
not interfere with the flow from the other side inlet 20.
[0045] In accordance with another embodiment of the invention, as
shown in FIG. 8, the plating solution outlet 40 is provided with
one or two distributing plates 50. Thus, the plating solution mixed
in the flow mixing room 30 while flowing therein is mixed again
when passing through the distributing plates 50, so that the
plating solution is more uniformly mixed.
[0046] As a result, compared with the conventional plating
apparatus, the plating apparatus of the invention without or with a
few distributing plates reduces the pressure loss of the flow due
to the vortex flow generated when the plating solution passes
through the distributing plates 50, and enhances durability of the
lead frame plating apparatus due to a reduced pressure in the
plating apparatus.
[0047] Further, as shown in FIG. 13, each nozzle 70 mounted to the
distribution part 60 is provided with a first divergent-shaped
expansion tube 80 at the lower end portion. The first expansion
tube 80 is mounted by being inserted into the distribution part
60.
[0048] The first expansion tube 80 has a divergent shape in which
an inner diameter of the inlet of the first expansion tube 80,
larger than that of each nozzle 70, gradually decreases to an
extent of the inner diameter of each nozzle 70.
[0049] According to another embodiment of the invention, as shown
in FIG. 14, each nozzle 70 is provided with a second
divergent-shaped expansion tube 82 protruding from an outer side of
the distribution part 60.
[0050] According to yet another embodiment of the invention, as
shown in FIG. 15, a third divergent-shaped expansion tube 84 in
each nozzle 70 has a protruded part, similar to that of the second
tube 84 as shown in FIG. 14, on the outer side of the distribution
part 60. However, the third expansion tube 84 has a tubular shape,
whereas the second expansion tube 82 is shaped such that one end of
the divergent shape adjoins to be fixed to the distribution part 60
at a predetermined thickness.
[0051] In addition to the above embodiments, various embodiments
can be applicable within the spirit of the present invention
wherein the lower end of each nozzle 70 has a divergent shape.
[0052] Operation of the nozzles 70 will now described.
[0053] When the plating solution, having flowed in through the
supply pipe, flows into both sides of the flow mixing room 30
through each side inlet 20, the flow of the plating solution are in
parallel with each other and the kinetic energies of the flows
change into the pressure to make the flows uniform.
[0054] A raised pressure on the plating solution in the flow mixing
room 30 causes the plating solution to flow to the upper side
through the plating solution outlet 40. Then, the plating solution
is uniformly mixed again to a predetermined extent inside the
distribution part 60 and is injected to the upper part through the
nozzle 70 mounted on the upper side of the distribution part
60.
[0055] As shown in FIG. 16, the flow of the plating solution to the
upper side through each nozzle 70 is defined such that the plating
solution 90 flows from the expansion tube 80, 82 or 84, of which
the diameter gradually decreases, to the upper part through each
nozzle opening 72. Here, the shape of the expansion tube 80, 82, or
84 prevents the flow of the plating solution 90 from generating the
vortex flow, thereby avoiding the fluid passage from narrowing.
Thus, compared with the prior art, the flow rate and the fluid
quantity of the plating solution are increased, so that the plating
solution is properly supplied to the lead frame.
[0056] As is apparent from the description, in accordance with the
present invention, there is an advantageous effect in that the
plating solution is supplied with a uniform distribution and with a
reduced loss of pressure, thereby enhancing plating efficiency.
[0057] Further, due to the structure maximally reducing the
pressure loss when the plating solution is mixed, an excessively
large capacity pump is not required, thereby reducing costs.
[0058] Further, since the plating solution in an excessive pressure
for compensating the pressure loss is not required to be supplied
to the apparatus, the breakage of the apparatus due to a raised
inner pressure is prevented, thereby enhancing durability.
[0059] Further, the expansion tube of the nozzle prevents the
plating solution passing through the nozzle from generating the
vortex flow, so that the quantity of the plating solution and the
flow rate are increased, thereby enhancing reliability.
[0060] It should be understood that the embodiments and the
accompanying drawings as described above have been described for
illustrative purposes and the present invention is limited by the
following claims. Further, those skilled in the art will appreciate
that various modifications, additions and substitutions are allowed
without departing from the scope and spirit of the invention as set
forth in the accompanying claims.
* * * * *