U.S. patent application number 11/179037 was filed with the patent office on 2006-05-18 for methods and apparatus for reducing an electronic device manufacturing tool footprint.
This patent application is currently assigned to APPLIED MATERIALS, INC.. Invention is credited to Janusz Jozwiak.
Application Number | 20060104799 11/179037 |
Document ID | / |
Family ID | 35906106 |
Filed Date | 2006-05-18 |
United States Patent
Application |
20060104799 |
Kind Code |
A1 |
Jozwiak; Janusz |
May 18, 2006 |
Methods and apparatus for reducing an electronic device
manufacturing tool footprint
Abstract
In at least one aspect, a method includes positioning a load
lock of an electronic device manufacturing tool such that the load
lock occupies a first floor area; and positioning a mainframe power
supply in a second floor area, wherein a substantial portion of the
second floor area is within the first floor area, thereby reducing
the electronic device manufacturing tool footprint. Additionally,
or alternatively, a mainframe controller may be placed so that the
footprint thereof substantially overlaps the footprint of the load
lock. Numerous other aspects are also provided.
Inventors: |
Jozwiak; Janusz; (San Ramon,
CA) |
Correspondence
Address: |
DUGAN & DUGAN, PC
55 SOUTH BROADWAY
TARRYTOWN
NY
10591
US
|
Assignee: |
APPLIED MATERIALS, INC.
|
Family ID: |
35906106 |
Appl. No.: |
11/179037 |
Filed: |
July 11, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60587110 |
Jul 12, 2004 |
|
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Current U.S.
Class: |
414/805 |
Current CPC
Class: |
H01L 21/6719
20130101 |
Class at
Publication: |
414/805 |
International
Class: |
B65H 85/00 20060101
B65H085/00 |
Claims
1. A method of reducing an electronic device manufacturing tool
footprint, comprising: positioning a load lock of an electronic
device manufacturing tool such that the load lock occupies a first
floor area; and positioning a mainframe power supply in a second
floor area, wherein a substantial portion of the second floor area
is within the first floor area, thereby reducing the electronic
device manufacturing tool footprint.
2. The method of claim 1 wherein positioning the mainframe power
supply in the second floor area, wherein a substantial portion of
the second floor area is within the first floor area, includes
positioning the mainframe power supply in the second floor area,
wherein all of the second floor area is within the first floor
area.
3. The method of claim 1 further comprising reducing wiring
required by the electronic device manufacturing tool.
4. The method of claim 1 further comprising positioning a mainframe
controller in a third floor area, wherein a substantial portion of
the third floor area is within the first floor area, thereby
reducing the electronic device manufacturing tool footprint.
5. The method of claim 4 wherein positioning the mainframe
controller in the third floor area, wherein a substantial portion
of the third floor area is within the first floor area, includes
positioning the mainframe controller in the third floor area,
wherein all of the third floor area is within the first floor
area.
6. A method of reducing an electronic device manufacturing tool
footprint, comprising: positioning a load lock of an electronic
device manufacturing tool such that the load lock occupies a first
floor area; and positioning a mainframe controller in a second
floor area, wherein a substantial portion of the second floor area
is within the first floor area, thereby reducing the electronic
device manufacturing tool footprint.
7. The method of claim 6 wherein positioning the mainframe
controller in the second floor area, wherein a substantial portion
of the second floor area is within the first floor area, includes
positioning the mainframe controller in the second floor area,
wherein all of the second floor area is within the first floor
area.
8. The method of claim 6 further comprising reducing wiring
required by the electronic device manufacturing tool.
9. The method of claim 6 further comprising positioning a mainframe
power supply in a third floor area, wherein all of the third floor
area is within the first floor area.
10. A method of reducing an electronic device manufacturing tool
shipping cost, comprising: placing a load lock and at least one of
a mainframe power supply and a mainframe controller of an
electronic device manufacturing tool into a container; and shipping
the container.
11. The method of claim 10 further comprising placing both the main
frame power supply and the mainframe controller of the electronic
device manufacturing tool into the container prior to shipping.
12. An apparatus for reducing an electronic device manufacturing
tool footprint, comprising: a load lock frame; a load lock of an
electronic device manufacturing tool coupled to the load lock frame
such that the load lock occupies a first floor area; and a
mainframe power supply coupled to the load lock frame, such that
the mainframe power supply occupies a second floor area wherein a
substantial portion of the second floor area is within the first
floor area, thereby reducing the electronic device manufacturing
tool footprint.
13. The apparatus of claim 12 wherein all of the second floor area
is within the first floor area.
14. The apparatus of claim 12 further comprising a mainframe
controller coupled to the load lock frame such that the mainframe
controller occupies a third floor area, wherein a substantial
portion of the third floor area is within the first floor area,
thereby reducing the electronic device manufacturing tool
footprint.
15. The apparatus of claim 14 wherein all of the third floor area
is within the first floor area.
16. An apparatus for reducing an electronic device manufacturing
tool footprint, comprising: a load lock frame; a load lock of an
electronic device manufacturing tool coupled to the load lock frame
such that the load lock occupies a first floor area; and a
mainframe controller coupled to the load lock frame such that the
mainframe controller occupies a second floor area, wherein a
substantial portion of the second floor area is within the first
floor area, thereby reducing the electronic device manufacturing
tool footprint.
17. The apparatus of claim 16 wherein all of the second floor area
is within the first floor area.
18. The apparatus of claim 17 further comprising a mainframe power
supply coupled to the load lock frame such that the mainframe power
supply occupies a third floor area, wherein a substantial portion
of the third floor area is within the first floor area, thereby
reducing the electronic device manufacturing tool footprint.
19. The apparatus of claim 18 wherein all of the third floor area
is within the first floor area.
20. An apparatus comprising: an electronic device manufacturing
tool having a mainframe that occupies a first footprint, and a
mainframe power supply that occupies a second footprint that
substantially overlaps the first footprint.
21. The apparatus of claim 20 further comprising a mainframe
controller that occupies a third footprint that substantially
overlaps the first footprint.
Description
[0001] The present application claims priority from U.S.
Provisional Patent Application Ser. No. 60/587,110, Filed Jul. 12,
2004 (Attorney Docket No. 9081/L), which is hereby incorporated by
reference herein in its entirety.
FIELD OF THE INVENTION
[0002] The present invention relates generally to electronic device
manufacturing, and more particularly to methods and apparatus for
reducing an electronic device manufacturing tool footprint.
BACKGROUND
[0003] FIG. 1 illustrates a conventional electronic device
manufacturing tool (or system) 101. With reference to FIG. 1, the
electronic device manufacturing tool 101 includes components, such
as a mainframe power supply (e.g., a mainframe power box) 103 and a
mainframe controller 105, coupled to a mainframe 107. The mainframe
107 may include one or more processing chambers 109, each of which
is coupled to a respective processing chamber power box 110 and
processing chamber controller 111, and a transfer chamber 112
coupled to a load lock 113. A footprint of the electronic device
manufacturing tool 101 is the area of a floor (e.g., in a clean
room) 115 occupied by the electronic device manufacturing tool 101.
The mainframe power box 103 and mainframe controller 105 are
coupled to a rack 117 (e.g., an enclosure rack) separate from the
mainframe 107. Therefore, the mainframe power box 103 and
controller 105 occupy a floor space 118 separate from the mainframe
of the electronic device manufacturing tool 101, thereby increasing
the electronic device manufacturing tool's footprint.
[0004] Further, the mainframe power box 103 and controller 105 are
coupled to the mainframe 107 via wiring 119, which extends from the
separate rack 117 to the mainframe 107. Therefore, the farther the
separate rack 117 is located from the mainframe 107, the more
wiring 119 is required by the electronic device manufacturing tool
101, which reduces system integration. As described below, reducing
the electronic device manufacturing tool footprint may increase
tool (or system) integration.
[0005] Accordingly, methods and apparatus for reducing an
electronic device manufacturing tool footprint are desired.
SUMMARY OF THE INVENTION
[0006] In a first aspect of the invention, a first method is
provided for reducing an electronic device manufacturing tool's
footprint. The first method includes the steps of (1) positioning a
load lock of an electronic device manufacturing tool such that the
load lock occupies a first floor area; and (2) positioning a
mainframe power supply in a second floor area, wherein a
substantial portion of the second floor area is within the first
floor area, thereby reducing the electronic device manufacturing
tool footprint.
[0007] In a second aspect of the invention, a second method is
provided for reducing an electronic device manufacturing tool
footprint. The second method includes the steps of (1) positioning
a load lock of an electronic device manufacturing tool such that
the load lock occupies a first floor area; and (2) positioning a
mainframe controller in a second floor area, wherein a substantial
portion of the second floor area is within the first floor area,
thereby reducing the electronic device manufacturing tool
footprint.
[0008] In a third aspect of the invention, a third method is
provided for reducing an electronic device manufacturing tool
shipping cost. The third method includes the steps of (1) placing a
load lock and a mainframe power supply of an electronic device
manufacturing tool into a container; and (2) shipping the
container.
[0009] In a fourth aspect of the invention, a fourth method is
provided for reducing an electronic device manufacturing tool
shipping cost. The fourth method includes the steps of (1) placing
a load lock and a mainframe controller of an electronic device
manufacturing tool into a container; and (2) shipping the
container.
[0010] In a fifth aspect of the invention, a first apparatus is
provided for reducing an electronic device manufacturing tool
footprint. The first apparatus includes (1) a load lock frame; (2)
a load lock of an electronic device manufacturing tool coupled to
the load lock frame such that the load lock occupies a first floor
area; and (3) a mainframe power supply coupled to the load lock
frame such that the mainframe power supply occupies a second floor
area. A substantial portion of the second floor area is within the
first floor area, thereby reducing the electronic device
manufacturing tool footprint.
[0011] In a sixth aspect of the invention, a second apparatus is
provided for reducing an electronic device manufacturing tool
footprint. The second apparatus includes (1) a load lock frame; (2)
a load lock of an electronic device manufacturing tool coupled to
the load lock frame such that the load lock occupies a first floor
area; and (3) a mainframe controller coupled to the load lock frame
such that the mainframe controller occupies a second floor area. A
substantial portion of the second floor area is within the first
floor area, thereby reducing the electronic device manufacturing
tool footprint.
[0012] In a seventh aspect of the invention, a third apparatus is
provided that includes (1) an electronic device manufacturing tool
having a mainframe that occupies a first footprint, and (2) a
mainframe power supply that occupies a second footprint that
substantially overlaps the first footprint.
[0013] In an eighth aspect of the invention, a fourth apparatus is
provided that includes (1) an electronic device manufacturing tool
having a mainframe that occupies a first footprint, and (2) a
mainframe controller that occupies a second footprint that
substantially overlaps the first footprint. Numerous other aspects
are provided, as are systems and apparatus in accordance with these
and other aspects of the invention.
[0014] Other features and aspects of the present invention will
become more fully apparent from the following detailed description,
the appended claims and the accompanying drawings.
BRIEF DESCRIPTION OF THE FIGURES
[0015] FIG. 1 illustrates a conventional electronic device
manufacturing tool.
[0016] FIG. 2 illustrates an exemplary electronic device
manufacturing tool in accordance with an embodiment of the present
invention.
DETAILED DESCRIPTION
[0017] The present invention relates to increasing the integration
and reducing the footprint of an electronic device manufacturing
tool (or system). FIG. 2 illustrates an exemplary electronic device
manufacturing tool (or system) 201 in accordance with an embodiment
of the present invention. The electronic device manufacturing tool
201 may be employed to manufacture and/or process substrates such
as glass or polymer substrates used to manufacture flat panel
displays, semiconductor wafers, etc. With reference to FIG. 2, the
configuration of the exemplary electronic device manufacturing tool
201 is similar to the configuration of the conventional electronic
device manufacturing tool 101 of FIG. 1. More specifically, the
exemplary electronic device manufacturing tool 201 includes a
mainframe 203. The mainframe 203 includes one or more processing
chambers 205, each of which is coupled to a respective processing
chamber power box 206 and processing chamber controller 207, a
transfer chamber 208 and a load lock 209. The load lock 209 is
supported by a load lock rack 211.
[0018] A mainframe power box (e.g., power supply) 213 of the
exemplary electronic device manufacturing tool 201, which provides
power to the mainframe 203 and to each processing chamber power box
206, is positioned differently than is the mainframe power box 103
of the conventional electronic device manufacturing tool 101. More
specifically, the load lock 209 is positioned (e.g., on the load
lock rack 211) such that the load lock 209 occupies a first floor
area 215, and the mainframe power box 213 is positioned to occupy a
second floor area 217, a substantial portion of which is included
in the first floor area 215. For example, the first floor area 215
may include the entire second floor area 217. The mainframe power
box 213 is adapted to couple to the load lock rack 211. For
example, the mainframe power box 213 may couple to and be supported
by the load lock rack 211 and/or be an integral part of the load
lock 209. For example, the mainframe power box 213 may be
positioned below the load lock 209. However, the mainframe power
box 213 may assume other positions, such as above the load lock
209. Therefore, according to the configuration of the exemplary
electronic device manufacturing tool 201, the load lock 209 and the
mainframe power box 213 occupy at least substantially overlapping
floor areas. In this manner, the footprint of the electronic device
manufacturing tool 201 is reduced. Reducing the electronic device
manufacturing tool footprint may reduce a required clean room size,
which may lower the cost of operating the tool.
[0019] Alternatively or additionally, in a similar manner to that
described above, a mainframe controller 218 of the exemplary
electronic device manufacturing tool 201 may be positioned
differently than is the mainframe controller 105 of the
conventional electronic device manufacturing tool 101. For example,
in embodiments in which both the mainframe power box 213 and the
mainframe controller 218 are positioned so as to reduce the
footprint of the manufacturing tool 101, the mainframe controller
218 is positioned to occupy a floor area (e.g., a third floor area)
219, a substantial portion of which is included within the first
floor area 215. For example, the first floor area 215 may include
at least 50 percent of, or preferably the entire third floor area
219. The mainframe controller 218 may be adapted to couple to and
be supported by the load lock rack 211. For example, the mainframe
controller 218 may couple to a side of the load lock rack 211
opposite the side of the load lock rack 211 to which the mainframe
power box 213 is coupled. Alternatively, the mainframe controller
218 may be coupled to other portions or sides of the load lock rack
211. Further, the mainframe controller 218 may be positioned above
or below the load lock 209. Therefore, according to the exemplary
configuration shown in FIG. 2, the load lock 209 and the mainframe
controller 218 occupy overlapping floor areas. In this manner, the
footprint of the electronic device manufacturing tool 201 is
reduced.
[0020] The position of the mainframe power box 213 and/or the
mainframe controller 218 of the inventive electronic device
manufacturing tool 201 may allow wiring 220 between the mainframe
power box 213 and/or the mainframe controller 218 and other
components of the electronic device manufacturing tool 201 to be
reduced. More specifically, because of the position of the
mainframe power box 213 and/or the mainframe controller 218, the
electronic device manufacturing tool 201 does not require wiring to
be run from a separate enclosure to the mainframe 203 in order to
couple the mainframe power box 213 and/or the mainframe controller
218 to the mainframe 203. The wiring 220 between the mainframe
power box 213 and/or the mainframe controller 218 and the mainframe
203 may fit compactly within the mainframe footprint. Therefore, in
addition to reducing the footprint of the electronic device
manufacturing tool, the present methods and apparatus may increase
system integration and reduce system complexity.
[0021] In accordance with an embodiment of the present invention
the exemplary electronic device manufacturing tool 201 may be
transported (e.g., shipped) more efficiently than the conventional
electronic device manufacturing tool 101. More specifically,
conventionally, the mainframe power box 103 and mainframe
controller 105 are shipped separately from the load lock 113 of the
conventional electronic device manufacturing tool 101. In contrast,
the mainframe power box 213 of the inventive electronic device
manufacturing tool 201 may be shipped with the load lock 209. As
described above, the mainframe power box 213 may be adapted to
couple to the load lock rack 211 and occupy an overlapping
footprint with the load lock 209. Therefore, the load lock 209 and
the mainframe power box 213 of the inventive electronic device
manufacturing tool 201 (e.g., which may both be assembled to the
load lock rack 209) may be shipped in the same container. By
shipping the load lock 209 and the mainframe power box 213 in the
same container, a total number of containers required to ship the
exemplary electronic device manufacturing tool 201 is reduced.
Consequently, the electronic device manufacturing tool shipping
cost is reduced. Alternatively or additionally, in a similar
manner, the mainframe controller 218 may be shipped in the same
container as the load lock 209.
[0022] The foregoing description discloses only exemplary
embodiments of the invention. Modifications of the above disclosed
apparatus and methods which fall within the scope of the invention
will be readily apparent to those of ordinary skill in the art. In
one or more embodiments, a substantial portion (e.g., at least 50
percent, and preferably 100 percent) of the floor area occupied by
the mainframe power box 213 and/or the mainframe controller 218
(e.g., a second and/or third floor area, respectively) is within
the floor area occupied by the load lock 209 (e.g., a first floor
area 215). However, in other embodiments, a substantial portion of
the floor area occupied by the mainframe power box 213 and/or the
mainframe controller 218 may be within the floor area occupied by
another component of the electronic device manufacturing tool 201.
For example, the mainframe power box 213 and/or the mainframe
controller 218 may be coupled to another component of the
electronic device manufacturing tool 201 or to a support rack of
that component.
[0023] Accordingly, while the present invention has been disclosed
in connection with exemplary embodiments thereof, it should be
understood that other embodiments may fall within the spirit and
scope of the invention, as defined by the following claims.
* * * * *