U.S. patent application number 11/070550 was filed with the patent office on 2006-05-11 for liquid cooling device.
This patent application is currently assigned to Foxconn Technology Co., Ltd.. Invention is credited to Cheng-Tien Lai, Hsieh-Kun Lee, Zhi-Yong Zhou.
Application Number | 20060096743 11/070550 |
Document ID | / |
Family ID | 35581548 |
Filed Date | 2006-05-11 |
United States Patent
Application |
20060096743 |
Kind Code |
A1 |
Lee; Hsieh-Kun ; et
al. |
May 11, 2006 |
Liquid cooling device
Abstract
A liquid cooling device includes a casing (10) having a
container (14) for accommodating liquid therein, a base (11) and a
liquid inlet port (18) in communication with the container (14).
The base (11) comprises a heat-absorbing surface and a rough
surface for exchanging heat with liquid, and the rough surface is
opposing to the heat-absorbing surface.
Inventors: |
Lee; Hsieh-Kun; (Tu-Cheng,
TW) ; Lai; Cheng-Tien; (Tu-Cheng, TW) ; Zhou;
Zhi-Yong; (Shenzhen, CN) |
Correspondence
Address: |
MORRIS MANNING & MARTIN LLP
1600 ATLANTA FINANCIAL CENTER
3343 PEACHTREE ROAD, NE
ATLANTA
GA
30326-1044
US
|
Assignee: |
Foxconn Technology Co.,
Ltd.
Tu-Cheng City
TW
|
Family ID: |
35581548 |
Appl. No.: |
11/070550 |
Filed: |
March 2, 2005 |
Current U.S.
Class: |
165/104.33 ;
257/E23.098 |
Current CPC
Class: |
F28F 3/048 20130101;
F28D 15/0266 20130101; H01L 23/473 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
165/104.33 |
International
Class: |
F28D 15/00 20060101
F28D015/00 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 6, 2004 |
CN |
200410027662.4 |
Claims
1. A liquid cooling device comprising: a casing for accommodating
liquid therein, comprising a base and a lid on the base, the base
comprising a heat-absorbing surface and a rough surface for
exchanging heat with liquid, the rough surface opposing to the
heat-absorbing surface; and a liquid inlet port positioned on the
lid and in communication with an inner space of the casing and
perpendicularly directing to the rough surface.
2. The liquid cooling device of claim 1, wherein the rough surface
defines as a plurality of grooves therein.
3. The liquid cooling device of claim 2, wherein the rough surface
is divided into a plurality of blocks by the grooves.
4. The liquid cooling device of claim 1, wherein the rough surface
defines a plurality of cavities therein.
5. The liquid cooling device of claim 1, further comprising a
liquid outlet port provided on the lid and communicating with the
inner space of the casing.
6. A liquid cooling device comprising: a container comprising a
heat-absorbing base and a lid, the base comprising a surface
interior of the container, the surface defining a plurality of
indents therein; liquid accommodated in the container; an actuator;
pipes connecting the container and the actuator; a liquid inlet
port disposed on the lid and is oriented perpendicularly to the
base of the container, the liquid inlet port rendering the liquid
to enter the container; and a liquid outlet port which allows the
liquid to leave the container when actuated by the actuator.
7. The liquid cooling device of claim 6, wherein the liquid inlet
port is located at a middle of the lid and the indents comprise a
plurality of grooves.
8. The liquid cooling device of claim 6, wherein the liquid inlet
port is located at a middle of the lid and the indents comprise a
plurality of cavities therein and depth of the cavities is less
than that of the base.
9. The liquid cooling device of claim 6, further comprising a
liquid circulation located outside of said container, the liquid
circulation having opposite ends thereof connecting with said inlet
and outlet ports respectively wherein the liquid inlet port is
located at a middle of the lid.
10. The liquid cooling device of claim 9, further comprising a heat
sink connected to the liquid circulation.
11. A liquid cooling device for dissipating heat from a
heat-generating component, comprising: a casing disposed next to
said component, said casing comprising a container used to receive
cooling liquid therein and a base disposed next to said container
for thermally contacting with said component to acquire said heat
from said component and thermally contacting with said cooling
liquid received in said container to transmit said heat to said
received cooling liquid via a recessed surface of said base facing
said received cooling liquid, and said thermally contacting of said
base with said received cooling liquid in said container being
achievable by means of receiving portions of said received cooling
liquid inside said base via said recessed surface; and a cooling
liquid circulation system connected to said casing and in
communication with said container for passage of said cooling
liquid so as to urge said cooling liquid moving into said container
for acquiring said heat from said base and out of said container
for heat dissipation said cooling liquid circulation system
comprising a liquid inlet port disposed on said casing and
perpendicularly directing to said recessed surface of said base,
said liquid inlet port enabling said cooling liquid to enter said
container.
12. The liquid cooling device of claim 11, wherein a plurality of
grooves is defined on said recessed surface of said base so as to
form said recessed surface and divide said recessed surface into a
plurality of blocks.
13. The liquid cooling device of claim 11, wherein a plurality of
cavities is defined on said recessed surface of said base so as to
form said recessed surface.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is related to a U.S. patent application
entitled "LIQUID COOLING DEVICE", recently filed with the same
assignee as the instant application. The disclosure of the above
identified application is incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a cooling device, and more
particularly to a cooling device utilizing liquid for cooling a
heat-generating device.
[0004] 2. Description of Related Art
[0005] Liquid cooling devices were commonly utilized to cool huge
systems such as furnaces. Today, liquid cooling devices also are
used to cool electronic or electrical components, such as chipsets,
dies or computer central processing units (CPUs), by circulating
the cooling liquid in a channel.
[0006] Generally, a liquid cooling device comprises a casing,
forming a liquid container made of metal material. The casing
comprises a base and a lid covering the base. The base is for
contacting a cooled component and comprises an upper surface. The
lid comprises a liquid outlet and a liquid inlet. Liquid pipes
respectively connect the liquid outlet and the liquid inlet to a
liquid tank. The liquid tank is further provided with a submersible
motor therein. In operation to dissipate heat from the cooled
component, the liquid in the liquid tank flows through the liquid
inlet pipe into the casing, and is drawn by the motor to exit from
the casing to the liquid tank for a subsequent circulation.
[0007] However, the upper surface of the base is generally flat.
Heat exchange surface between the base and the liquid is limited As
a result, the liquid is only to flow in a limited surface in the
casing. It is difficult to get maximized heat exchange
efficiency.
SUMMARY OF THE INVENTION
[0008] Accordingly, an object of the present invention is to
provide a liquid cooling device getting maximized heat exchange
efficiency.
[0009] In order to achieve the object set out above, a liquid
cooling device in accordance with a preferred embodiment of the
present invention comprises a casing, a liquid inlet port and a
liquid outlet port in communication with the container. The casing
comprises a container for accommodating liquid therein and a base.
The base comprises a heat-absorbing surface and a rough surface for
exchanging heat with liquid. The rough surface is opposing to the
heat-absorbing surface.
[0010] Other objects, advantages and novel features of the present
invention will become more apparent from the following detailed
description when taken in conjunction with the accompanying
drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is an assembled, isometric view of a liquid cooling
device in accordance with a preferred embodiment of the present
invention;
[0012] FIG. 2 is a view of a casing of the liquid cooling device of
FIG. 1;
[0013] FIG. 3 is a cross-sectional view of FIG. 2, taken along line
III-III;
[0014] FIG. 4 is a view of a base of a casing of a liquid cooling
device in accordance with the preferred embodiment of the present
invention; and
[0015] FIG. 5 is a view of a base of a casing of a liquid cooling
device in accordance with an alternative embodiment of the present
invention.
DETAILED DESCRIPTION OF THE INVENTION
[0016] Referring to FIGS. 1-3, a liquid cooling device in
accordance with a preferred embodiment of the present invention
comprises a casing 10, and an actuator 50 connected to the casing
10 by a liquid outlet pipe 100 and a liquid inlet pipe 200
respectively at opposite locations of the actuator 50.
[0017] The casing 10 comprises a base 11 for intimately contacting
a heat generating component or source (not shown) by a side surface
thereof and a lid 12 cooperating with the base 11 to form a
container 14 therebetween to accommodate liquid for circulation.
The base 11 and the lid 12 are hermetizated by calk, packing, shim,
or seal, for keeping the liquid from leaking out of the container
14. A pair of tubular connectors, for connecting the pipes 100, 200
to the casing 10, extends outwardly from the lid 12. The connectors
are respectively named as liquid inlet port 18 and liquid outlet
port 19, according to the directions along which the liquid flows
in the connectors. The liquid inlet port 18 is disposed at a middle
of the lid 12.
[0018] The container 14, the liquid outlet pipe 100, the actuator
50 and the liquid inlet pipe 200 cooperatively define a hermetical
circulation route or loop for liquid. The actuator 50 can be a
pump, an impeller, a promoter or the like, for actuating liquid to
continuously circulate in the route along the arrow as shown in
FIG. 1.
[0019] For promoting the cooling efficiency of the device, a
radiator is arranged on the liquid circulation route. A fin member
30 is an example of the radiator. In the preferred embodiment of
the present invention, a portion of the liquid outlet pipe 100
enters into the fin member 30, so that heat, still contained in the
liquid after naturally cooled in the casing 10, is removed to the
fin member 30 and is dissipated to ambient air. Thus, the liquid is
extremely cooled before entering the container 14 for a subsequent
circulation. Understandably, a fan (now shown) can be mounted onto
the fin member 30 for enhancing heat dissipation capability of the
fin member 30.
[0020] FIG. 4 shows a base 11 of a casing 10 of the liquid cooling
device in accordance with the preferred embodiment of the present
invention. The base 11 comprises an upper surface 110. The upper
surface 110 defines a plurality of grooves 111 therein. The upper
surface 110 is divided into a plurality of blocks by the grooves
111 so as to form a recessed structure. Heat exchange surface
between the base 11 and the liquid is increased. The liquid enters
into the container 14 from the liquid inlet port 18. The liquid
flows on the upper surface 110 and in the grooves 111 to
sufficiently absorb heat from the base 11, so that heat exchange
efficiency between the liquid and the base 11 is improved.
[0021] FIG. 5 shows another type of a base 41. The base 41
comprises an upper surface 410. The upper surface 410 defines a
plurality of cavities 411 therein. Depth of each cavity 411 is less
than that of the base 41. The design of the base 41 having the
cavities 411, also increases heat exchange surface between the base
41 and the liquid.
[0022] Moreover, it is understood that other rough surfaces, such
as a wave-like surface, can be competent to increase heat exchange
surface between the base and the liquid.
[0023] For showing clearly, the casing 10, the fin member 30 and
the actuator 50 are positioned separately, and connected by the
100, 200 in the preferred embodiment of the present invention.
However, it is also understood that the fin member 30 can be
directly positioned on the casing 10, and the actuator 50 can be
positioned within the fin member 30, without the liquid outlet pipe
100 and the liquid inlet pipe 200, to thereby save space occupied
by the liquid cooling device.
[0024] It is understood that the invention may be embodied in other
forms without departing from the spirit thereof. Thus, the present
example and embodiment is to be considered in all respects as
illustrative and not restrictive, and the invention is not to be
limited to the details given herein.
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