U.S. patent application number 11/301736 was filed with the patent office on 2006-05-04 for non-volatile semiconductor memory device and its manufacturing method.
This patent application is currently assigned to KABUSHIKI KAISHA TOSHIBA. Invention is credited to Seiichi Aritome, Kazuhiro Shimizu, Toshitake Yaegashi.
Application Number | 20060091446 11/301736 |
Document ID | / |
Family ID | 16160635 |
Filed Date | 2006-05-04 |
United States Patent
Application |
20060091446 |
Kind Code |
A1 |
Yaegashi; Toshitake ; et
al. |
May 4, 2006 |
Non-volatile semiconductor memory device and its manufacturing
method
Abstract
In a non-volatile semiconductor memory device and a method for
manufacturing the device, each memory cell and its select Tr have
the same gate insulating film as a Vcc Tr. Further, the gate
electrodes of a Vpp Tr and Vcc Tr are realized by the use of a
first polysilicon layer. A material such as salicide or a metal,
which differs from second polysilicon (which forms a control gate
layer), may be provided on the first polysilicon layer. With the
above features, a non-volatile semiconductor memory device can be
manufactured by reduced steps and be operated at high speed in a
reliable manner.
Inventors: |
Yaegashi; Toshitake;
(Yokohama-shi, JP) ; Shimizu; Kazuhiro;
(Yokohama-shi, JP) ; Aritome; Seiichi;
(Yokohama-shi, JP) |
Correspondence
Address: |
HOGAN & HARTSON L.L.P.
500 S. GRAND AVENUE
SUITE 1900
LOS ANGELES
CA
90071-2611
US
|
Assignee: |
KABUSHIKI KAISHA TOSHIBA
|
Family ID: |
16160635 |
Appl. No.: |
11/301736 |
Filed: |
December 12, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10768238 |
Jan 29, 2004 |
7005345 |
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11301736 |
Dec 12, 2005 |
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10429460 |
May 5, 2003 |
6703658 |
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10768238 |
Jan 29, 2004 |
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10138849 |
May 3, 2002 |
6586805 |
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10429460 |
May 5, 2003 |
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09741261 |
Dec 19, 2000 |
6472701 |
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10138849 |
May 3, 2002 |
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09112482 |
Jul 9, 1998 |
6265739 |
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09741261 |
Dec 19, 2000 |
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Current U.S.
Class: |
257/314 ;
257/E21.689; 257/E27.081 |
Current CPC
Class: |
G11C 16/0483 20130101;
H01L 27/105 20130101; H01L 29/788 20130101; Y10S 257/908 20130101;
G11C 16/0433 20130101; G11C 16/0416 20130101; H01L 27/11526
20130101; H01L 27/11529 20130101; H01L 27/11546 20130101 |
Class at
Publication: |
257/314 |
International
Class: |
H01L 29/76 20060101
H01L029/76 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 10, 1997 |
JP |
9-184863 |
Claims
1. A non-volatile semiconductor memory device comprising: a
plurality of memory cell units each including at least one memory
cell formed by stacking a charge storing layer and a control gate
layer above a semiconductor substrate in which data is programmed
and erased by charging and discharging the charge storing layer; a
plurality of select transistors each connected to a corresponding
one of the memory cell units; and first and second transistors each
for controlling a voltage to be applied to at least one of the
memory cells and the select transistor connected thereto, the first
transistor having a first: gate insulating film, and the second
transistor having a second gate insulating film with a different
thickness from the first gate insulating film, wherein a gate
insulating film incorporated in the memory cell, a gate insulating
film incorporated in the select transistor and the first gate
insulating film are formed of substantially the same film.
2. A non-volatile semiconductor memory device comprising: a
plurality of memory cell units each including at least one memory
cell formed by stacking a charge storing layer and a control gate
layer above a semiconductor substrate in which data is programmed
and erased by charging and discharging the charge storing layer; a
plurality of select transistors each connected to a corresponding
one of the memory cell units; and first and second transistors each
for controlling a voltage to be applied to at least one of the
memory cells and the select transistor connected thereto, the first
transistor having a first gate insulating film, and the second
transistor having a second gate insulating film with a different
thickness from the first gate insulating film, wherein a gate
insulating film incorporated in the memory cell and the first gate
insulating film are formed substantially the same film, and a gate
insulating film incorporated in the select transistor and the
second gate insulating film are formed of substantially the same
film.
3. A non-volatile semiconductor memory device comprising: a
plurality of memory cell units each including a % least one memory
cell formed by stacking a charge storing layer and a control gate
layer above a semiconductor substrate in which data is programmed
and erased by charging and discharging the charge storing layer; a
plurality of select transistors each connected to a corresponding
one of the memory cell units; and first and second transistors each
for controlling a voltage to be applied to at least one of the
memory cells and the select transistor connected thereto, the first
transistor having a first gate insulating film, and the second
transistor having a second gate insulating film with a different
thickness from the first gate insulating film, wherein a gate
insulating film incorporated in the select transistor and the
second gate insulating film are formed of substantially the same
film.
4. A non-volatile semiconductor memory device according to claim 1,
wherein the second gate insulating film is thicker than the first
insulating film.
5. A non-volatile semiconductor memory device according to claim 2,
wherein the second gate insulating film is thicker than the first
insulating film.
6. A non-volatile semiconductor memory device according to claim 3,
wherein the second gate insulating film is thicker than the first
insulating film.
7. A non-volatile semiconductor memory device according to claim 3,
wherein the second gate insulating film is thinner than the first
insulating film.
8. A non-volatile semiconductor memory device comprising: a memory
cell having a self-aligned double-layer gate structure which
includes a gate insulating film, a first conductor serving as a
floating gate layer, a second conductor serving as a control gate
layer, and an insulating film electrically insulating the first and
second conductors, the gate insulating film, the first conductor,
the second conductor and the insulating film being formed above a
semiconductor substrate; and a transistor having a gate electrode
which is formed above the semiconductor substrate and has a
structure wherein a third conductor differing from the second
conductor is stacked on the first conductor.
9. A non-volatile semiconductor memory device according to claim 8,
wherein the gate insulating film of the memory cell and a gate
insulating film incorporated in the transistor are formed of
substantially the same film.
10. A non-volatile semiconductor memory device according to claim
8, wherein the third conductor has a resistance lower than the
first conductor.
11. A non-volatile semiconductor memory device according to claim
8, wherein the first conductor included in the gate electrode has a
conductivity type identical to that of source and drain regions
incorporated in the transistor, and the transistor has a salicide
structure.
12. A non-volatile semiconductor memory device according to claim
8, wherein the third conductor is a metal.
13. A non-volatile semiconductor memory device according to claim
8, wherein the first conductor is one selected from the group
consisting of monocrystalline silicon, polysilicon and amorphous
silicon.
14. A non-volatile semiconductor memory device according to claim
8, further comprising a resistive element with the double-layer
gate structure, the resistive element including the first conductor
used as a resistor, the second conductor and the insulating film
having portions thereof removed from a region of the first
conductor, and the third conductor provided on the region of the
first conductor.
15. A non-volatile semiconductor memory device according to claim
14, wherein the region of the first conductor on which the third
conductor is formed serves as a contact region in the resistive
element.
16. A non-volatile semiconductor memory device according to claim
8, further comprising an element isolating region adjacent to the
transistor, and a pattern with the double-layer gate structure
provided on the element isolating region.
17. A method of manufacturing a non-volatile semiconductor memory
device, comprising the steps of: forming, on a first region of a
semiconductor substrate, a self-aligned double-layer gate structure
which includes a gate insulating film, a first conductor serving as
a floating gate layer, a second conductor serving as a control gate
layer, and an insulating film electrically insulating the first and
second conductors, patterning the first conductor into a gate
electrode of a transistor above a second region of the
semiconductor substrate; and providing a third conductor on the
first conductor patterned in the form of the gate electrode above
the second region.
18. A method of manufacturing a non-volatile semiconductor memory
device, comprising the steps of: sequentially forming, on a
semiconductor substrate, a gate insulating film, a first conductor
serving as a floating gate layer, an insulating film, and a second
conductor serving as a control gate layer; patterning the second
conductor, the insulating film and the first conductor in a
self-aligned manner in a first region of the semiconductor
substrate, using a single mask, thereby forming a double-layer gate
structure, and removing that portion of the second conductor which
is provided on a second region of the semiconductor substrate
during the patterning of the second conductor in the first region;
forming a third conductor on the first conductor in the second
region after the patterning of the first conductor in the first
region, such that the first and third conductors are electrically
connected to each other; and patterning the third and first
conductors into a gate electrode of a transistor in the second
region.
19. A method of manufacturing a non-volatile semiconductor memory
device, according to claim 17, further comprising the steps of
forming an element isolating region adjacent to the transistor, and
forming the double-layer gate structure on the element isolating
region.
20. A method of manufacturing a non-volatile semiconductor memory
device, according to claim 18, further comprising the steps of
forming an element isolating region adjacent to the transistor, and
forming the double-layer gate structure on the element isolating
region.
Description
BACKGROUND OF THE INVENTION
[0001] This invention relates to a non-volatile semiconductor
memory device having a double-layer gate structure which includes a
gate insulating film, a floating gate layer as a charge storing
layer, an insulating film, and a control gate layer. It also
relates to a method for manufacturing the device. More
particularly, the invention relates to a structure which includes
gate insulating films and gate electrodes incorporated in a memory
cell section and its peripheral circuit section.
[0002] Non-volatile semiconductor memory devices each comprise a
memory cell (a memory cell transistor), a select transistor, and a
peripheral circuit including a transistor of a high breakdown
voltage (Vpp) and a transistor operable with a normal power Vcc
(the transistors of the peripheral circuit will hereinafter be
referred to as "peripheral circuit transistors"). These transistors
have gate insulating films of different thicknesses corresponding
to voltages applied thereto.
[0003] FIGS. 36A, 36B and FIGS. 37A and 37B are sectional views,
illustrating the conventional steps of manufacturing a nonvolatile
semiconductor memory device. As is shown in FIG. 36A, N-well
regions 302 and P-well regions 303 are formed in a silicon
substrate 301, and then sufficiently thick element isolating films
304 are formed by the LOCOS method. Element regions isolated by the
element isolating films 304 include, for example, a memory cell
section, a select transistor (select Tr), and transistors
incorporated in a memory peripheral circuit, such as a high
breakdown voltage transistor (Vpp Tr) and a normal power transistor
(Vcc Tr). First, a gate oxide film 305 is formed for the select Tr.
Then, resist is coated and patterned, thereby covering the region
other than a memory cell section with a resist layer 315, removing
the gate oxide film 305 and forming a gate oxide film 306 for the
memory cell section. In FIGS. 36 and 37, each gap indicates that
the memory cell and the select Tr, Vpp Tr and Vcc Tr show different
sections.
[0004] Referring then to FIG. 36B, a polysilicon layer 307 as a
first layer is deposited on the resultant structure and then
patterned. Thereafter, an insulating film 308 is formed on each of
the patterned polysilicon layers. The polysilicon layers 307 serve
as the floating gate of the memory cell and the gate electrode of
the select transistor. On the transistor (Vpp Tr, Vcc Tr) side of
the peripheral circuit, the insulating film 308, the polysilicon
layer 307 as the first layer, and the gaze insulating film 305
below the layer 307 are removed. Thereafter, the resist is
patterned, thereby forming a gate oxide film 309 in the Vpp Tr
section. Further, another resist layer 316 is patterned as shown in
FIG. 36B, thereby removing the gate oxide film 309 in the Vcc Tr
section.
[0005] Subsequently, as shown in FIG. 37C, a gate oxide film 310 is
formed in the Vcc Tr section, and then a polysilicon layer (gate
electrode) 311 as a second layer is formed. Thereafter, the memory
cell section and each transistor section are patterned, ion
implantation is performed, an interlayer insulating film 312 is
deposited, and wiring layers 313 are formed. Thus, a memory cell, a
select transistor, a high breakdown voltage transistor and a Vcc
transistor are formed as shown in FIG. 37D.
[0006] In the above-described structure, the four gate oxide films
365, 306, 309 and 310 of the transistors are formed in different
steps. Therefore, a great number of resist forming steps, oxidation
steps, etc. are required, resulting in an increase in manufacturing
cost.
[0007] Moreover, as described above, in the non-volatile
semiconductor memory device having a memory cell section of a
double-layer gate structure consisting of a floating gate layer
(first polysilicon layer 307) and a control gate layer (second
polysilicon layer 311), the gate electrodes of the transistors in
the peripheral circuit are usually realized by the use of the
control gate layer (second polysilicon layer 311) in the memory
cell section. If in this case, surface-channel type N-channel and
P-channel MOS transistors are formed as the transistors of the
peripheral circuit, the following difficulties will occur:
[0008] In general, the control gate layer of a memory cell
transistor has a polycide structure formed by depositing, for
example, WSi (tungsten silicide) on the second polysilicon layer to
increase the conductivity. Then, the control gate layer is coated
with resist and then patterned into a gate electrode.
[0009] In the conventional method using the control gate layer as
the gates of the transistors of the peripheral circuit, it is
necessary before the deposition of WSi to correctly implant each of
N-type and P-type impurities into the second polysilicon layer, in
order to form N-channel and P-channel MOS transistors of
surface-channel type suitable for integration. Then, it is
necessary to deposit WSi, and to correctly implant each of N-type
and P-type impurities into regions which will serve as source and
drain regions, after the gate electrode is formed. Thus, the step
of patterning resist and the step of implanting impurities must be
repeated.
[0010] If, on the other hand, the gate electrodes of the
transistors of the peripheral circuit are formed of the first
polysilicon layer 307 which will serve as the floating gate layer
of the memory cell, a surface-channel type element can be obtained
by implanting, into the gate electrode, an impurity of the same
conductivity as that of an impurity implanted in the source and
drain regions, after the gate electrode is formed. In this case,
however, the high speed operation of the transistors of the
peripheral circuit cannot be realized, since the first polysilicon
layer 307 as the floating gate layer usually has a higher
resistance than the second polysilicon layer 311 as the control
gate layer.
[0011] As explained above, in the conventional method, the
transistors of the peripheral circuits have gate insulating films
of different thicknesses, which inevitably increases the
manufacturing steps and hence the manufacturing cost. To achieve
high speed operation, the gate of each transistor of the peripheral
circuit of the memory usually has the same polycide structure as
the control gate layer of the memory cell section. If a
surface-channel type element is realized by the transistor with the
gate of the polycide structure, a great number of resist patterning
steps and impurity implanting steps are required, thereby
increasing the manufacturing cost.
BRIEF SUMMARY OF THE INVENTION
[0012] The present invention has been developed in light of the
above circumstances, and is aimed at providing a non-volatile
semiconductor memory device which can be manufactured by a small
number of steps, and a method of manufacturing the device. The
invention is also aimed at providing a non-volatile semiconductor
memory device which can be manufactured by a small number of steps
and operate at a high speed in a highly reliable manner, and a
method for manufacturing the device.
[0013] According to a first aspect of the invention, there is
provided a non-volatile semiconductor memory device comprising: a
plurality of memory cell units each including at least one memory
cell formed by stacking a charge storing layer and a control gate
layer above a semiconductor substrate in which data is programmed
and erased by charging and discharging the charge storing layer; a
plurality of select transistors each connected to a corresponding
one of the memory cell units; and first and second transistors each
for controlling a voltage to be applied to at least one of the
memory cells and the select transistor connected thereto, the first
transistor having a first gate insulating film, and the second
transistor having a second gate insulating film with a different
thickness from the first gate insulating film, wherein a gate
insulating film incorporated in the memory cell, a gate insulating
film incorporated in the select transistor and the first gate
insulating film are formed of substantially the same film.
[0014] In the non-volatile semiconductor memory device according to
the first aspect of the present invention, the second gate
insulating film may be thicker than the first insulating film.
[0015] According to a second aspect of the invention, there is
provided a non-volatile semiconductor memory device comprising: a
plurality of memory cell units each including at least one memory
cell formed by stacking a charge storing layer and a control gate
layer above a semiconductor substrate in which data is programmed
and erased by charging and discharging the charge storing layer; a
plurality of select transistors each connected to a corresponding
one of the memory cell units; and first and second transistors each
for controlling a voltage to be applied to at least one of the
memory cells and the select transistor connected thereto, the first
transistor having a first gate insulating film, and the second
transistor having a second gate insulating film with a different
thickness from the first gate insulating film, wherein a gate
insulating film incorporated in the memory cell and the first gate
insulating film are formed substantially the same film, and a gate
insulating film incorporated in the select transistor and the
second gate insulating film may be formed of substantially the same
film.
[0016] In the non-volatile semiconductor memory device according to
the second aspect of the present invention, the second gate
insulating film may be thicker than the first insulating film.
[0017] According to a third aspect of the invention, there is
provided a non-volatile semiconductor memory device comprising: a
plurality of memory cell units each including at least one memory
cell formed by stacking a charge storing layer and a control gate
layer above a semiconductor substrate in which data is programmed
and erased by charging and discharging the charge storing layer; a
plurality of select transistors each connected to a corresponding
one of the memory cell units; and first and second transistors each
for controlling a voltage to be applied to at least one of the
memory cells and the select transistor connected thereto, the first
transistor having a first gate insulating film, and the second
transistor having a second gate insulating film with a different
thickness from the first gate insulating film, wherein a gate
insulating film incorporated in the select transistor and the
second gate insulating film are formed of substantially the same
film.
[0018] In the non-volatile semiconductor memory device according to
the third aspect of the present invention, the second gate
insulating film may be thicker than the first insulating film.
[0019] In the non-volatile semiconductor memory device according to
the third aspect of the present invention, the second gate
insulating film may be thinner than the first insulating film.
[0020] According to a fourth aspect of the invention, there is
provided a non-volatile semiconductor memory device comprising: a
memory cell having a self-aligned double-layer gate structure which
includes a gate insulating film, a first conductor serving as a
floating gate layer, a second conductor serving as a control gate
layer, and an insulating film electrically insulating the first and
second conductors, the gate insulating film, the first conductor,
the second conductor and the insulating film being formed above a
semiconductor substrate; and a transistor having a gate electrode
which is formed above the semiconductor substrate and has a
structure wherein a third conductor differing from the second
conductor is stacked on the first conductor.
[0021] In the non-volatile semiconductor memory device according to
the fourth aspect of the present invention, the gate insulating
film of the memory cell and a gate insulating film incorporated in
the transistor may be formed of substantially the same film.
[0022] In the non-volatile semiconductor memory device according to
the fourth aspect of the present invention, the third conductor may
have a resistance lower than the first conductor.
[0023] In the non-volatile semiconductor memory device according to
the fourth aspect of the present invention, the first conductor
included in the gate electrode may have a conductivity type
identical to that of source and drain regions incorporated in the
transistor, and the transistor may have a salicide structure.
[0024] In the non-volatile semiconductor memory device according to
the fourth aspect of the present invention, the third conductor may
be a metal.
[0025] In the non-volatile semiconductor memory device according to
the fourth aspect of the present invention, the first conductor may
be one selected from the group consisting of monocrystalline
silicon, polysilicon and amorphous silicon.
[0026] In the non-volatile semiconductor memory device according to
the fourth aspect of the present invention, the non-volatile
semiconductor memory device may further comprise a resistive
element with the double-layer gate structure, the resistive element
including the first conductor used as a resistor, the second
conductor and the insulating film having portions thereof removed
from a region of the first conductor, and the third conductor
provided on the region of the first conductor. The region of the
first conductor on which the third conductor may be formed serves
as a contact region in the resistive element.
[0027] In the non-volatile semiconductor memory device according to
the fourth aspect of the present invention, the non-volatile
semiconductor memory device may further comprise an element
isolating region adjacent to the transistor, and a pattern with the
double-layer gate structure provided on the element isolating
region.
[0028] According to a fifth aspect of the invention, there is
provided a method of manufacturing a non-volatile semiconductor
memory device, comprising the steps of: forming, on a first region
of a semiconductor substrate, a self-aligned double-layer gate
structure which includes a gate insulating film, a first conductor
serving as a floating gate layer, a second conductor serving as a
control gate layer, and an insulating film electrically insulating
the first and second conductors, patterning the first conductor
into a gate electrode of a transistor above a second region of the
semiconductor substrate; and providing a third conductor on the
first conductor patterned in the form of the gate electrode above
the second region.
[0029] In the non-volatile semiconductor memory device according to
the fifth aspect of the present invention, the method of
manufacturing a non-volatile semiconductor memory device may
further comprise the steps of forming an element isolating region
adjacent to the transistor, and forming the double-layer gate
structure on the element isolating region.
[0030] According to a sixth aspect of the invention, there is
provided a method of manufacturing a non-volatile semiconductor
memory device, comprising the steps of: sequentially forming, on a
semiconductor substrate, a gate insulating film, a first conductor
serving as a floating gate layer, an insulating film, and a second
conductor serving as a control gate layer; patterning the second
conductor, the insulating film and the first conductor in a
self-aligned manner in a first region of the semiconductor
substrate, using a single mask, thereby forming a double-layer gate
structure, and removing that portion of the second conductor which
is provided on a second region of the semiconductor substrate
during the patterning of the second conductor in the first region;
forming a third conductor on the first conductor in the second
region after the patterning of the first conductor in the first
region, such that the first and third conductors are electrically
connected to each other; and patterning the third and first
conductors into a gate electrode of a transistor in the second
region.
[0031] In the non-volatile semiconductor memory device according to
the sixth aspect of the present invention, the non-volatile
semiconductor memory device may further comprise the steps of
forming an element isolating region adjacent to the transistor, and
forming the double-layer gate structure on the element isolating
region.
[0032] Additional object and advantages of the invention will be
set forth in the description which follows, and in part will be
obvious from the description, or may be learned by practice of the
invention. The object and advantages of the invention may be
realized and obtained by means of the instrumentalities and
combinations particularly pointed out hereinafter.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING
[0033] The accompanying drawings, which are incorporated in and
constitute a part of the specification, illustrate presently
preferred embodiments of the invention, and together with the
general description given above and the detailed description of the
preferred embodiments given below, serve to explain the principles
of the invention.
[0034] FIG. 1 is a sectional view, showing a non-volatile
semiconductor memory device according to a first embodiment of the
invention;
[0035] FIGS. 2A-2C are sectional views, illustrating in order steps
of a process for manufacturing the structure of FIG. 1;
[0036] FIG. 3 is a sectional view, showing a first modification of
the first embodiment of the invention;
[0037] FIG. 4A is a sectional view, showing a second modification
of the first embodiment of the invention;
[0038] FIG. 4B is a sectional view, showing a third modification of
the first embodiment of the invention;
[0039] FIGS. 5A-5C are first sectional views, each showing an
essential part of a non-volatile semiconductor memory device
according to a second embodiment, which are seen in a process
step;
[0040] FIGS. 6A-6C are second sectional views, each showing an
essential part of the non-volatile semiconductor memory device
according to the second embodiment, which are seen in a process
step;
[0041] FIGS. 7A-7C are third sectional views, each showing an
essential part of the non-volatile semiconductor memory device
according to the second embodiment, which are seen in a process
step;
[0042] FIGS. 8A-8C are fourth sectional views, each showing an
essential part of the non-volatile semiconductor memory device
according to the second embodiment, which are seen in a process
step;
[0043] FIGS. 9A-9C are fifth sectional views, each showing an
essential part of the non-volatile semiconductor memory device
according to the second embodiment, which are seen in a process
step;
[0044] FIGS. 10A-10C are sixth sectional views, each showing an
essential part of the non-volatile semiconductor memory device
according to the second embodiment, which are seen in a process
step;
[0045] FIGS. 11A-11C are seventh sectional views, each showing an
essential part of the non-volatile semiconductor memory device
according to the second embodiment, which are seen in a process
step;
[0046] FIGS. 12A-12C are eighth sectional views, each showing an
essential part of the non-volatile semiconductor memory device
according to the second embodiment, which are seen in a process
step;
[0047] FIGS. 13A-13C are ninth sectional views, each showing an
essential part of the non-volatile semiconductor memory device
according to the second embodiment, which are seen in a process
step;
[0048] FIGS. 14A-14C are tenth sectional views, each showing an
essential part of the non-volatile semiconductor memory device
according to the second embodiment, which are seen in a process
step;
[0049] FIGS. 15A-15C are eleventh sectional views, each showing an
essential part of the non-volatile semiconductor memory device
according to the second embodiment, which are seen in a process
step;
[0050] FIG. 16A is a sectional view, showing a part of a
non-volatile semiconductor memory device, which is seen in a
process step;
[0051] FIG. 16B is a sectional view, showing a part of a
non-volatile semiconductor memory device, which is seen in a
process step;
[0052] FIG. 16C is a sectional view, showing a part of the
non-volatile semiconductor memory device, which is seen in a
process step;
[0053] FIG. 17 is a sectional view, showing an essential part
according to a third embodiment of the invention;
[0054] FIGS. 18A-18C are first sectional views, each showing an
essential part of a non-volatile semiconductor memory device
according to a fourth embodiment, which are seen in a process
step;
[0055] FIGS. 19A-19C are second sectional views, each showing an
essential part of the non-volatile semiconductor memory device
according to the fourth embodiment, which are seen in a process
step;
[0056] FIGS. 20A-20C are first sectional views, each showing an
essential part of a non-volatile semiconductor memory device
according to a fifth embodiment, which are seen in a process
step;
[0057] FIGS. 21A-21C are second sectional views, each showing an
essential part of the non-volatile semiconductor memory device
according to the fifth embodiment, which are seen in a process
step;
[0058] FIG. 22 is a third sectional view, showing an essential part
of the non-volatile semiconductor memory device according to the
fifth embodiment, which is seen in a process step;
[0059] FIG. 23 is a sectional view, showing a non-volatile
semiconductor memory device according to a sixth embodiment of the
invention;
[0060] FIGS. 24A-24C are sectional views, useful in explaining a
method for manufacturing the structure of FIG. 23;
[0061] FIGS. 25A-25C are first sectional views, each showing an
essential part of a non-volatile semiconductor memory device
according to a seventh embodiment, which are seen in a process
step;
[0062] FIGS. 26A-26C are second sectional views, each showing an
essential part of the non-volatile semiconductor memory device
according to the seventh embodiment, which are seen in a process
step;
[0063] FIGS. 27A-27C are third sectional views, each showing an
essential part of the non-volatile semiconductor memory device
according to the seventh embodiment, which are seen in a process
step;
[0064] FIGS. 28A-28C are fourth sectional views, each showing an
essential part of the non-volatile semiconductor memory device
according to the seventh embodiment, which are seen in a process
step;
[0065] FIG. 29 is a fifth sectional view, showing an essential part
of the non-volatile semiconductor memory device according to the
seventh embodiment, which is seen in a process step;
[0066] FIG. 30 is a sixth sectional view, showing those essential
parts of the non-volatile semiconductor memory device according to
the seventh embodiment, which is seen in a process step;
[0067] FIG. 31 is a sectional view to be compared with FIG. 30,
showing those essential parts of the non-volatile semiconductor
memory device according to the seventh embodiment, which is seen in
a process step;
[0068] FIG. 32 is a circuit diagram, showing a NAND EEPROM to which
each of the embodiments of the invention is applicable;
[0069] FIG. 33 is a circuit diagram, showing a NOR EEPROM to which
each of the embodiments of the invention is applicable;
[0070] FIG. 34 is a circuit diagram, showing a DINOR EEPROM to
which each of the embodiments of the invention is applicable;
[0071] FIG. 35 is a circuit diagram, showing an AND EEPROM to which
each of the embodiments of the invention is applicable;
[0072] FIGS. 36A and 36B are sectional views, useful in explaining
conventional process steps of manufacturing a non-volatile
semiconductor memory device; and
[0073] FIGS. 37A and 37B are sectional views, useful in explaining
conventional process steps performed after the steps shown in FIGS.
36A and 36B.
DETAILED DESCRIPTION OF THE INVENTION
[0074] FIG. 1 is a sectional view, showing a non-volatile
semiconductor memory device according to a first embodiment of the
invention. As is shown in FIG. 1, N-wells 102 and P-wells 103 are
selectively formed in a P-type silicon substrate 101. In a region
in which a memory cell array is formed, a P-well 103 is formed in a
surface portion of an N-well 102. Thick element isolating films 104
are selectively formed on the silicon substrate 101 by the LOCOS
method. Element regions isolated by the films 104 include, for
example, a memory cell region, a select transistor (select Tr)
region, a high breakdown voltage transistor (Vpp Tr) region, and a
normal power transistor (Vcc Tr) region. Like FIGS. 36A, 36B, 37A
and 37B, the gap in FIG. 1 indicates that the memory cell and the
select Tr, Vpp Tr and Vcc Tr show different sections.
[0075] The memory cell and the select Tr has the same gate
insulating film 105 as the Vcc Tr. A first polysilicon layer 106
which will serve as a floating gate layer and a second polysilicon
layer 107 which will serve as a control gate layer are stacked on
each gate insulating film. An insulating film 109 is interposed
between the first and second polysilicon layers 106 and 107. The
insulating film 109 consists of, for example, a
SiO.sub.2/Si.sub.3N.sub.4/SiO.sub.2 laminated film (ONO film). In
the select Tr, part of the first polysilicon layer 106 is directly
connected to a metallic wire member 112a. In the memory cell, the
first polysilicon layer (floating gate layer) 106 is a charge
storing layer. Data programming and erasing is performed in the
first polysilicon layer when electricity is charged or discharged
under the control of the second polysilicon layer (control gate
layer). A single memory cell or a plurality of memory cells
connected to each other constitute a memory cell unit. FIG. 1 shows
a section of a memory cell arrangement in which a single control
gate (second polysilicon layer 107) is commonly used. When, for
example, this invention is applied to a NAND EEPROM, a
predetermined number of memory cells arranged in a direction
perpendicular to that section constitute a memory cell unit. Each
memory cell unit is connected to at least one select transistor
(select Tr). A plurality of memory cell units constructed as above
form a memory cell array (not shown).
[0076] The high breakdown voltage transistor (Vpp Tr) and the
normal power transistor (Vcc Tr) are used to control the voltage
for controlling the memory cell and the select Tr.
[0077] A gate insulating film 108 incorporated in the Vpp Tr is
thicker than the gate insulating film 105 of the Vcc Tr. Gate
insulating films incorporated in the memory cell, the select Tr,
and the Vcc Tr of a peripheral circuit are constituted of the gate
insulating film 105 formed in a single process step, which means
that the gate insulating films are formed of substantially the same
film.
[0078] The gate electrodes of the Vpp Tr and Vcc Tr are realized by
the use of the first polysilicon layer 106. The second polysilicon
layer (control gate layer) 107 of, for example, high impurity
concentration is provided on the first polysilicon layer 106.
However, the material provided on the first polysilicon layer 106
included in the gate electrode of the Vpp Tr or Vcc Tr is not
limited to the second polysilicon layer (control gate layer) 107,
but may be salicide or a metal.
[0079] Openings are selectively formed in an interlayer insulating
film 110 provided on the entire surface of the substrate, through
which a metallic wire member 112 extends and is electrically
connected to the gate of the select Tr and the source/drain
diffusion layers (N.sup.+ diffusion layers, P.sup.+ diffusion
layers).
[0080] With the above structure, the gate insulating films are
commonly used, and hence omit the gate oxidation step for forming
the peripheral transistors. Accordingly, the non-volatile
semiconductor memory device can be manufactured at low cost.
[0081] A method for manufacturing the memory device will be
described.
[0082] FIGS. 2A-2C are sectional views, illustrating in order steps
of a process for manufacturing the structure of FIG. 1. First, as
is shown in FIG. 2A, the N-wells 102 and P-wells 103 are
selectively formed in the silicon substrate 101. A thick element
isolating film 104 of about 300 nm is formed on the silicon
substrate 101 by the LOCOS method. Then, a gate insulating film 108
with a thickness of, for example, 40 nm for the Vpp Tr (high
breakdown voltage transistor) is formed. Subsequently, the region
in which the Vpp Tr will be formed is coated with a resist layer
115, thereby removing the gate insulating film 108 on the other
region. Thereafter, a gate insulating film with a thickness of, for
example, 8 nm is formed on the region other than the region for the
Vpp Tr, i.e. on the region for the memory cell, the select Tr and
the Vcc Tr.
[0083] After removing the resist layer 115, the first polysilicon
layer 106 is deposited on the gate insulating films 105 and 108 as
shown in FIG. 2B. After patterning the region for the memory cell,
the insulating film 109 as the SiO.sub.2/Si.sub.3N.sub.4/SiO.sub.2
laminated film (ONO film) is provided on the first polysilicon
layer 106.
[0084] Then, as is shown in FIG. 2C, the second polysilicon layer
107 is deposited after the insulating film 109 for the transistors
of the peripheral circuit is removed. Thereafter, patterning, ion
implantation, deposition of an interlayer insulating film and
formation of wires are performed to constitute the FIG. 1
structure.
[0085] Since in the above embodiment, gate insulating films of the
same kind are intentionally used to minimize the kinds of the
entire gate insulating films, the gate oxidation steps for forming
the transistors of the peripheral circuit are reduced. Although the
embodiment employs two kinds of gate insulating films, i.e. the
gate oxide film 108 for the high breakdown voltage transistor and
the gate oxide film 105 for the other transistors, the invention is
not limited to this. For example, it may be modified such that the
same film is used or different films are used to form the gate
insulating films of the memory cell and the Vcc Tr, while the same
film is used to form the gate insulating films of the select Tr and
Vpp Tr.
[0086] A modification of the non-volatile semiconductor memory
device according to the first embodiment will be described with
reference to FIGS. 3 and 4A and 4B.
[0087] The FIG. 3 structure differs from the FIG. 1 structure in
that the gate insulating film of the select Tr is substantially the
same as the gate insulating film 108 of the Vpp Tr. For example,
the gate insulating films 108 of the select Tr and the Vpp Tr are
set at a thickness of 40 nm, and the gate insulating films 105 of
the memory cell and the Vcc Tr at a thickness of 8 nm.
[0088] The FIG. 4A structure differs from the FIG. 3 structure in
that the gate insulating films (i.e. gate insulating films 118) of
the Vcc Tr differ from the gate insulating film 105 of the memory
cell. Specifically, the select Tr and the Vpp Tr have gate
insulating films 108 of 40 nm, the memory cell has a gate
insulating film of 8 nm, and the Vcc Tr has gate insulating films
118 of 12 nm.
[0089] Although in the FIG. 4A structure, the select Tr has
substantially the same gate insulating film as the Vpp Tr, it may
be modified such that the select Tr has substantially the same gate
insulating film as the Vcc Tr, while the memory cell has a gate
insulating film differing from that of the Vpp Tr, as shown in FIG.
4B. Specifically, the Vpp Tr has a gate insulating film 108 of 40
nm, the Vcc Tr and the select Tr have gate insulating films 118 of
12 nm, and the memory cell has a gate insulating film of 8 nm.
[0090] As in the FIG. 1 case, the gate insulating films are
commonly used in the FIGS. 3 and 4A and 4B, and thus the gate
oxidation steps for forming the transistors of the peripheral
circuit are reduced. To make, in particular, the select Tr have the
same gate insulating film as the transistors of the peripheral
circuit, as described above, is very advantageous to optimize the
gate insulating films of the transistors of the peripheral circuit
to enable the transistors to perform high speed operation. This is
because the select transistor has less limitations in
characteristics than the memory cell transistor, and hence the
degree of freedom in the thickness of each gate insulating film of
the transistors of the peripheral circuit is not reduced.
[0091] Moreover, the invention is advantageous in that the gate
electrodes of the peripheral circuit are realized by the use of the
first-conductive layer (floating gate layer) of the memory cell,
and therefore no complicated steps are necessary to make the
transistors of the peripheral circuit operable at high speed. In
other words, the transistors of the peripheral circuit can be
easily made to have a salicide structure or polymetal gates. This
will be described in detail below.
[0092] FIGS. 5A-5C to 15A-15C are sectional views, illustrating, in
order, the steps of manufacturing a non-volatile semiconductor
memory device according to a second embodiment of the invention.
This non-volatile semiconductor memory device has a double-layer
gate structure in which the control gate incorporated therein has a
polysilicon/wSi laminated structure. FIGS. 5A-5C to 15A-15C
illustrate a structure and a method for making the peripheral
transistors of the device operable at high speed. In this case, the
gate electrodes of the peripheral transistors are realized by the
use of the floating gate layer of the memory cell, thereby causing
the transistors to have a salicide structure. Each of FIGS. 5A, 6A,
. . . 15A is a sectional view of a memory cell section, each of
FIGS. 5B, 6B, . . . 15B is a sectional view of an N-channel
transistor incorporated in the peripheral circuit, and each of
FIGS. 5C, 6C, . . . 15C is a sectional view of a P-channel
transistor incorporated in the peripheral circuit.
[0093] First, as is shown in FIGS. 5A-5C, N-type substrate regions
with N-wells and P-type substrate regions with P-wells are formed
in the semiconductor substrate by, for example, implanting
impurities. Element isolating films 1 are formed by, for example,
selective oxidation. Then, gate oxide films (insulating films) 2
are formed on activation regions of the substrate by, for example,
gate oxidation. Subsequently, a first polysilicon layer 3 which
will serve as a floating gate layer is deposited on the resultant
structure. If necessary, an N-type impurity is doped into the
polysilicon layer 3 by, for example, the phosphor diffusion method.
Alternatively, a polysilicon layer 3 beforehand doped with an
impurity may be deposited. Further, the resultant structure is
subjected to working for forming, for example, cell slits in that
portion of the polysilicon layer 3 which corresponds to the memory
cell section shown in FIG. 5A (this step is not shown). More
specifically, the cell slits are formed in accordance with the plan
pattern of the memory cell units of the semiconductor memory device
to be formed later.
[0094] Thereafter, as is shown in FIGS. 6A-6C, an insulating film
(ONO film) 6 consisting of, for example, a
SiO.sub.2/Si.sub.3N.sub.4/SiO.sub.2 laminated film is deposited.
Then, a second polysilicon layer 7 which will serve as a control
gate layer is deposited and then doped with an N-type impurity.
Alternatively, a polysilicon layer 7 doped with an impurity may be
deposited. Subsequently, a WSi layer (not shown), for example, is
deposited on the second polysilicon layer 7. Further, an SiN film 8
which will serve as a mask is deposited on the control gate or
polysilicon layer 7 in order to increase the conductivity of the
control gate layer.
[0095] Thereafter, a resist layer 9 is coated and patterned as
shown in FIGS. 7A-7C. The SiN film 8 is etched by anisotropic
etching (in the memory cell section), and then the resist layer is
removed. Referring then to FIGS. 8A-8C, the control gate layer
(polysilicon layer) 7 and then the ONO film 6 are etched by
anisotropic etching, using the SiN film 8 as a mask. At this time,
the memory cell section has a structure as shown in FIG. 8A in
which the films 8-6 are treated for the formation of a gate
electrode, while the peripheral sections have structures as shown
in FIGS. 8B and 8C, in which the floating gate layer is
exposed.
[0096] Subsequently, as shown in FIGS. 9A-9C, a resist layer 10 is
coated and patterned. Then, the floating gate layer (first
polysilicon layer 3) is etched by anisotropic etching, using the
SiN film 8 and the resist layer 10 as masks in the memory cell
section and the peripheral sections, respectively, as shown in
respective FIGS. 9A-9C. Then, the resist layer 10 is removed.
[0097] Referring then to FIGS. 10A-10C, resist is coated, and
patterned into a resist layer 11 such that the N-channel
transistors in the memory cell section and the peripheral section
are exposed as shown in FIGS. 11A and 10B, thereby doping an N-type
impurity which will serve as N- of an LDD (Lightly Doped Drain),
and removing the resist layer 11.
[0098] Referring to FIGS. 11A-11C, resist is coated, and patterned
into a resist layer 12 such that the P-channel transistor in the
peripheral section is exposed as shown in FIG. 11C. Then, a P-type
impurity which will make a P-region of the LDD is implanted, and
the resist layer 12 is removed.
[0099] Referring then to FIGS. 12A-12C, an SiN film is deposited,
and etched by anisotropic etching such that it remains on the side
walls of the transistors in the memory cell and the peripheral
circuit as SiN films 13. Then, resist is coated, and patterned into
a resist layer 14 such that the P-channel transistor in the
peripheral section is exposed as shown in FIG. 12C. Thereafter, a
P-type impurity is implanted and the resist layer 14 is
removed.
[0100] Referring then to FIGS. 13A-13C, resist is coated, and
patterned into a resist layer 15 such that the N-channel
transistors in the memory cell section and the peripheral sections
are exposed. Then, an N-type impurity is implanted and the resist
layer 15 is removed.
[0101] Then, as shown in FIGS. 14A-14C, the oxide films (insulating
films) 2 on the source and drain regions of each transistor are
removed, thereby exposing silicon. Subsequently, a Ti/TiN film 16,
for example, is deposited by sputtering, and made to react with
silicon by annealing at high temperature. Thereafter, non-reacted
portions of the Ti/TiN film are removed, and high-temperature
annealing is performed again, thereby forming a silicide film 17
and realizing a salicide structure, as shown in FIGS. 15A-15C.
[0102] Thus, the source, drain and gate of each transistor in the
memory cell section and the peripheral sections are completed as
shown in FIGS. 15A-15C. The silicide film 17, which has come to the
salicide structure, has a lower sheet resistance and hence a lower
resistivity than the polysilicon layer 3 located below. This
enables construction of a high-speed CMOS circuit.
[0103] Thereafter, various steps (which are not shown) of
depositing an interlayer insulating film, forming contact holes and
wiring layers, depositing a protect film, etc. are performed. As a
result, the non-volatile semiconductor memory device is
completed.
[0104] If the element structure must be flattened for integration,
a dummy pattern DMY of the same double-layer gate structure as the
memory cell is formed on the element isolating region near the
peripheral transistors, as is shown in FIG. 16A.
[0105] As is shown in FIG. 16B, an interlayer insulating film, for
example, is formed on an element structure. This interlayer
insulating film is polished and flattened by, for example, CMP. If
at this time, the distance between each pair of adjacent dummy
patterns DMY, i.e. the pitch at which dummy patterns DMY are
arranged, is too great, those portions of the interlayer insulating
film which are situated between each pair of adjacent dummy
patterns are liable to be polished excessively as shown in FIG.
16C. In light of this, it is preferable that the pitch of the dummy
patterns. DMY is determined on the basis of the to-be-polished
material (in this case, the material of the interlayer insulating
film) and polishing conditions (the kind of polishing slurry, the
rotation speed of a polishing pad, etc.), so as to avoid the
aforementioned excessive polishing. In other words, it is desirable
that the dummy patterns DMY be arranged at appropriate intervals so
that the to-be-polished material between each pair of adjacent
dummy patterns DMY will not excessively be polished.
[0106] Since in the second embodiment, a single oxide film is used
between the transistors of the memory cell section and the
peripheral sections, the number of steps of resist forming,
oxidation, etc. can be reduced. If the second embodiment includes a
select transistor in the memory cell section and a high breakdown
voltage transistor in the peripheral circuit (which are not shown),
a single gate insulating film thicker than the gate oxide film
(insulating film) 2 may be used to realize the transistors.
Alternatively, it may be modified, as in the first embodiment, such
that only the high breakdown voltage transistor has a gate
insulating film which differs from the gate oxide film 2, and the
select transistor of the memory cell has the gate oxide film 2. Any
combination of gate insulating films may be employed if it can
reduce the manufacturing steps such as the oxidation step, as
compared with the conventional case.
[0107] Moreover, since the second embodiment uses the first
polysilicon layer (floating gate layer) to form the gate electrodes
of the transistors of the peripheral circuit, thereby employing the
salicide structure, surface-channel type MOS transistors can be
formed irrespective of whether or not WSi is deposited on the
control gate layer. In other words, in FIGS. 10B and 10C-FIGS. 13B
and 13C, the same impurity as in the source and drain regions of
both P-channel MOS transistors is implanted into the gate thereof,
thereby converting the transistors into surface-channel type ones,
and then causing them to have a salicide structure as shown in
FIGS. 15A-15C. Accordingly, a highly performable non-volatile
semiconductor memory device whose peripheral transistors are
operable at a high speed can be achieved by a manufacturing method
which prevents the process of implanting impurities from being
complicated. The metal to be sputtered onto silicon to obtain the
salicide structure is not limited to Ti/TiN.
[0108] FIG. 17 is a sectional view, showing a third embodiment of
the invention. In this embodiment, the floating gate layer (the
first polysilicon layer 3) is used to form a resistive element of
high resistance. In the non-volatile semiconductor memory device of
the double-layer gate structure according to the third embodiment,
the floating gate layer of the memory cell is used to realize the
gate electrodes of the transistors in the peripheral circuit, and
also realize resistive elements of high resistance in the
peripheral element portion.
[0109] Specifically, as in the second embodiment, the floating gate
layer is formed as in the second embodiment (FIGS. 5A-5C). Then, if
necessary, an impurity is implanted into the region of the
peripheral section of the memory cell, wherein a resistive element
is formed. In other words, resist is coated, and patterned such
that the region of the peripheral section wherein a resistive
element is formed is exposed. Then, a desired impurity is implanted
into the region and the resist is removed.
[0110] Subsequently, as in the second embodiment, a structure as
shown in FIGS. 6A-6C is formed, in which the SiN film 8 on the
control gate layer 7 is the uppermost layer. Thereafter, resist his
coated on the memory cell section and the resistive element and
then patterned, thereby etching the SiN film 8 by anisotropic
etching (these steps are not shown). Concerning the resistive
element, the resist is patterned such that it remains on a portion
of the resistive element other than a portion to be used as a
contact.
[0111] Then, as in the second embodiment, the SiN film 8 is used as
a mask to etch the control gate layer and the ONO film by
anisotropic etching, and the resist is removed. In the following
steps which are not shown, resist is coated and patterned, and then
the floating gate layer is etched by anisotropic etching, using, as
masks, those portions of the resist provided on the gate electrodes
of the peripheral transistors and on the contact portion of the
resistive element, and those portions of SiN provided in the memory
cell section and on the other portion of the resistive element.
Then, the resist is removed.
[0112] Moreover, as in the second embodiment, the source and drain
regions of each transistor are formed, and then salicide is
formed.
[0113] From the above-described steps, the source, drain and gate
of each transistor as shown in FIGS. 15A-15C and a resistive
element as shown in FIG. 17 are completed. Thereafter, an
interlayer insulating film 19 is deposited, and various steps of
forming contact holes and wiring layers, depositing a protect film,
etc. are performed. As a result, the non-volatile semiconductor
memory device is completed.
[0114] FIG. 17 also shows an interlayer insulating film 19 and a
metallic wire 20 formed in the step. The remaining second
polysilicon layer 7 provides a level which is substantially the
same as the peripheral element structure, which contributes to the
flattening of the interlayer insulating film 19.
[0115] If the element structure must be flattened for integration,
a dummy pattern DMY (as shown in FIG. 16A) of the same double-layer
gate structure as the memory cell is formed on the element
isolating region near the peripheral transistors.
[0116] The metal to be sputtered onto silicon to obtain the
salicide structure is not limited to Ti/TiN.
[0117] The formation of the gate electrodes of the transistors and
the resistive element, which are incorporated in the peripheral
circuit, may be performed after the formation of the memory cell,
instead of simultaneous formation of them.
[0118] Referring then to FIGS. 18A-18C and 19A-19C and part of the
second embodiment, a method, according to a fourth embodiment, for
forming first the memory cell and then the gate electrodes of the
transistors and the resistive element, which are incorporated in
the peripheral circuit, will be described.
[0119] First, in the memory section, etching is performed down to
the ONO film 6 or to the second polysilicon layer 7 as shown in
FIG. 8A, as in the case of the second embodiment. At this time, in
the resistive element, etching is performed down to the ONO film 6
or to the second polysilicon layer 7 as in the case of the third
embodiment (these steps are not shown).
[0120] After the gates are formed, a resist layer 31 is formed in
the transistor sections of the peripheral circuit as shown in FIGS.
18B and 18C. Then, the floating gate layer (the first polysilicon
layer 3) in the memory cell section is etched by anisotropic
etching, thereby removing the resist layer 31.
[0121] Thereafter, as is shown in FIGS. 19A-19C, a resist layer 32
is coated and patterned, thereby etching the floating gate layer in
the peripheral sections by anisotropic etching (FIGS. 19B and 19C).
At this time, in the resistive element, the floating gate layer is
etched by anisotropic etching, using the resist layer 32 as a mask
in the contact region, and also using the SiN film as a mask in the
remaining region (these steps are not shown). Thereafter, the
resist layer 32 is removed. Furthermore, as in the second
embodiment, the source and drain regions of each transistor are
formed, and then salicide is formed. FIGS. 18 and 19 show an
example in which when a gate is formed in the memory section,
etching is performed down to the second polysilicon layer 7 in the
peripheral sections. In this example, the ONO film 6 remaining on
each gate is removed when the oxide film (insulating film) 2 on the
source and drain regions are removed before the formation of the
salicide structure.
[0122] After the above-described steps, the source drain and gate
of each transistor and the resistive element are completed as shown
in FIGS. 15A-15C and 17, respectively. Then, various steps of
depositing an interlayer insulating film, forming contact holes and
wiring layers, depositing a protect film, etc. are performed. As a
result, the non-volatile semiconductor memory device is completed.
FIG. 17 also shows an interlayer insulating film and wiring, which
are formed in steps performed later.
[0123] If the element structure must be flattened for integration,
a dummy pattern DMY of the same double-layer gate structure as the
memory cell is formed on the element isolating region near the
peripheral transistors, as is shown in FIG. 16A.
[0124] The metal to be sputtered onto silicon to form the salicide
structure is not limited to Ti/TiN.
[0125] Referring to FIGS. 20A-20C and 21A-21C and part of the
fourth embodiment, a fifth embodiment will be described. This
embodiment is similar to the fourth embodiment in that the floating
gate layer of the memory cell is used to realize the gate
electrodes of the peripheral transistors, but differs from it in
that the gate electrodes are formed of polymetal gates each of
which consists of, for example, polysilicon and W and enables
high-speed operation of the peripheral transistors.
[0126] A method will be described, which is used in the fifth
embodiment for forming the gate electrodes of the peripheral
transistors and the resistive element after the formation of the
memory cell section.
[0127] As in the fourth embodiment, a structure as shown in FIGS.
18A-18C is formed. Then, an N-type impurity is implanted into the
memory cell section shown in FIG. 18A to form source and drain
regions therein, and thereafter the resist layer 31 is removed.
[0128] If it is necessary to form an LDD structure, an N-type
impurity of a certain concentration, which will serve as N.sup.- of
the LDD structure, is implanted during the step of implanting the
N-type impurity. In the following steps which are not shown, an SiN
film is deposited, resist is coated and patterned such that the
memory cell section is exposed, the SiN film is etched by
anisotropic etching such that it remains on the gate side walls of
the memory cell, an N-type impurity of an impurity concentration
higher than the N.sup.- is implanted, and the resist layer 31 is
removed.
[0129] In the following steps which are not shown, SiN is
deposited, resist is coated and patterned, SiN and the ONO film 6
in the peripheral sections are removed by etching, the resist is
removed, and the memory cell section is protected by an SiN film 24
(shown in FIG. 20A).
[0130] Thereafter, a W film 18, for example, is deposited, and
resist is coated and patterned into resist layers 32, as is shown
in FIGS. 20A-20C. Subsequently, the W film 18 and the floating gate
layer (the first polysilicon layer) 3 in the peripheral sections
are sequentially etched by anisotropic etching, using the resist
layers 32 as masks. Then, the resist layers 32 are removed.
[0131] Then, as in the second embodiment, source and drain regions
are formed in the peripheral sections, with the result that the
source, drain and gate of the transistors are completed, as shown
in FIGS. as is shown in FIGS. 21A-21C.
[0132] If the element structure must be flattened for integration,
a dummy pattern DMY (as shown in FIG. 22) of the same double-layer
gate structure as the memory cell is formed on the element
isolating region near the peripheral transistors.
[0133] Thereafter, various steps of depositing an interlayer
insulating film, forming contact holes and wiring layers,
depositing a protect film, etc. are performed. As a result, the
non-volatile semiconductor memory device is completed. The metal
for forming polymetal gates is not limited to W. It suffices if the
metal has a sheet resistance and resistivity lower than the first
polysilicon layer 3. Since as described above, the gate electrodes
of the peripheral transistors are not formed simultaneous with the
gate electrode of the memory cell section in the fourth and fifth
embodiments, the number of steps required for forming the gate
electrodes of the transistors is slightly greater than in the first
through third embodiments. However, in the fourth and fifth
embodiments, the steps required for gate oxidation for forming the
peripheral transistors, and accordingly the manufacturing steps,
can be reduced to some extent, since the first conductive layer
(the floating gate layer) of the memory cell is also used to form
the gate electrodes of the peripheral circuit, which means that
gate insulating films of the same kind are intentionally used
between the memory cell transistor, or the select transistor, and
the peripheral transistors.
[0134] Although the first through fifth embodiments employ
selective oxidation such as the LOCOS method, as a method for
isolating element, the invention is not limited to it. The STI
(Shallow Trench Isolation) technique, for example, may be used
instead. This method will be described below.
[0135] FIG. 23 shows a non-volatile semiconductor memory device
according to a sixth embodiment of the invention. This embodiment
differs from the FIG. 1 embodiment in that the former uses element
isolating films formed by the STI technique, and also in that in
the former, a WSi film 201 is deposited on the second polysilicon
layer 107 as the control gate layer of the memory cell section, and
the gate electrodes of the peripheral transistors (Vpp Tr, Vcc Tr)
each have a polymetal structure constituted of the first
polysilicon layer 106 and a W (tungsten) layer 202 provided
thereon.
[0136] In the sixth embodiment, gate insulating films of two kinds
are employed, which include the gate insulating films 105 used in
the memory cell transistor, the select Tr and the Vcc Tr, and the
gate insulating film 108 used in the high breakdown voltage
transistor (Vpp Tr), as in the first embodiment.
[0137] Since in the above structure, the kinds of gate insulating
films are intentionally reduced, as in the first embodiment, the
gate oxidation steps for forming the peripheral transistors can be
reduced, with the result that the non-volatile semiconductor memory
device can be manufactured at low cost. A method for manufacturing
this device will be described.
[0138] FIGS. 24A-24C are sectional views, illustrating, in order,
the steps of manufacturing the FIG. 23 structure.
[0139] First, as is shown in FIG. 24A, N-wells 102 and P-wells 103
are selectively formed in a silicon substrate 101. Subsequently, a
gate insulating film 108 with a thickness of, for example, 40 nm is
formed for a Vpp Tr (high breakdown voltage transistor) in the
substrate 101. Then, a resist layer 215 is coated on a region in
which the Vpp Tr will be formed, thereby removing that portion of
the gate insulating film 108 which is not coated with the resist
layer.
[0140] Thereafter, as is shown in FIG. 24B, a gate insulating film
105 with a thickness of, for example, 8 nm is formed on the region
other than the region for the Vpp Tr, i.e. the region for the
memory cell, the select Tr, and the Vcc Tr. After the resist layer
215 is removed, a first polysilicon layer 106 is deposited on the
gate insulating films 105 and 108. Then, a resist layer 216 is
deposited on the first polysilicon layer 106 and patterned in
accordance with to-be-isolated elements. Using the patterned resist
layer 216 as a mask, trenches 217 are formed by the STI method such
that they reach the substrate.
[0141] Then, as is shown in FIG. 24C, the trenches 217 are filled
with insulating films 218 formed of, for example, TEOS
(tetraethoxysilane). Subsequently, an insulating film 109
consisting of a SiO.sub.2/Si.sub.3N.sub.4/SiO.sub.2 laminated film
(ONO film) is formed on the insulating film 218 and the first
polysilicon layer 106. Those portions of the insulating film 109
which are provided on the select Tr, the Vpp Tr and the Vcc Tr of
the peripheral circuit are removed, and then a laminated layer of a
second polysilicon layer 107 and a WSi layer 201 is deposited.
Thereafter, in the following steps which are not shown, resist is
coated and patterned, thereby removing those portions of the second
polysilicon layer 107 and the WSi layer 201 which are provided on
the transistor sections of the peripheral circuit.
[0142] Further, in the following steps which are not shown, the
gates of the memory cell and the select Tr are formed, and ions are
implanted into the source and drain regions of the memory cell and
the select Tr. Subsequently, the memory cell and the select Tr are
masked, and a W layer 202 is deposited on those portions of the
first polysilicon layer 106 which are coated on the Vpp Tr and the
Vcc Tr of the peripheral circuit. Then, resist is coated and
patterned, thereby etching first the W layer 202 and then the first
polysilicon layer 106 by anisotropic etching. Thereafter, the steps
of forming the source and drain regions of the Vpp Tr and Vcc Tr of
the peripheral circuit, forming the entire wiring, etc. are
performed. As a result, the FIG. 23 structure is obtained.
[0143] Also in this embodiment, the kinds of gate insulating films
are intentionally reduced, thereby reducing the gate oxidation
steps for forming the transistors of the peripheral circuit. This
embodiment may be modified, for example, such that the memory cell
transistor has the same gate insulating film as the Vcc Tr, while
the select Tr has the same gate insulating film as the Vpp Tr.
[0144] Moreover, since the gate electrodes of the peripheral
circuit are realized by the use of the first conductive layer (the
floating gate layer) of the memory cell, no complicated step is
necessary to make the transistors of the peripheral circuit
operable at high speed. A description will be given of a case where
the transistors of the peripheral circuit have a salicide
structure.
[0145] FIGS. 25A-25C to 28A-28C are sectional views, illustrating,
in order, the steps of manufacturing a non-volatile semiconductor
memory device according to a seventh embodiment. This embodiment
uses element-isolating films formed by the STI (Shallow Trench
Isolation) technique. The memory device of this embodiment has a
double-layer gate structure in which the control gate has a
laminated structure of, for example, polysilicon and WSi, and the
gate electrodes of the peripheral transistors are formed using the
floating gate of the memory cell, thereby making the transistors
have a salicide structure which enables high speed operation of
them. Each of FIGS. 25A, 26A, 27A and 28A is a sectional view of a
memory cell section, each of FIGS. 25B, 26B, 27B and 28B is a
sectional view of an N-channel transistor incorporated in the
peripheral circuit, and each of FIGS. 25C, 26C, 27C and 28C is a
sectional view of a P-channel transistor incorporated in the
peripheral circuit.
[0146] First, as is shown in FIG. 25A-25C, N-type substrate regions
with N-wells and P-type substrate regions with P-wells are formed
in the semiconductor substrate by implanting impurities. Then, gate
oxide films (insulating films) 2 are formed on the substrate by,
for example, gate oxidation. Subsequently, a first polysilicon
layer 3d which will serve as a floating gate layer is deposited on
the resultant structure. If necessary, an N-type impurity is doped
into the polysilicon layer 3d by, for example, the phosphor
diffusion method. Alternatively, a polysilicon layer 3 beforehand
doped with an impurity may be deposited. Subsequently, an SiN film
21 which will serve as a mask is deposited. In the following steps
which are not shown, resist is coated and patterned, thereby
removing, by anisotropic etching, those portions of the SiN film 21
which are coated on element-isolating regions, and then removing
the resist. The polysilicon layer 3d, the gate insulating film 2
and the semiconductor substrate are sequentially etched by
anisotropic etching, using the remaining SiN film 21 as a mask,
thereby forming trenches 200 in the substrate.
[0147] Thereafter, as is shown in FIGS. 26A-26C, an insulating film
22 which consists of, for example, TEOS is deposited. The resultant
structure is flattened by, for example, CMP (Chemical Mechanical
Polishing) such that the portion of the insulating film 22 which is
provided on each portion of the SiN film 21 is removed. Thus, the
trenches 200 are each filled with the insulating film 22.
[0148] Then, as is shown in FIGS. 27A-27C, the SiN film 21 is
removed by wet etching, and another first polysilicon layer 3e
which will serve as the floating gate layer is deposited.
Subsequently, an N-type impurity, if necessary, is implanted into
the polysilicon layer by, for example, the phosphor diffusion
method. In the following steps which are not shown, resist is
coated and patterned such that cell slits are formed in the memory
cell section, the first polysilicon layer is removed by anisotropic
etching, and the resist is removed.
[0149] The FIGS. 27A-27C structure is similar to the FIGS. 5A-5C
structure except that in the former, the element-isolating regions
are defined by the trenches, and that the polysilicon layer on the
activating region has a laminated structure of the polysilicon
films 3d and 3e.
[0150] Thereafter, the transistors are formed by the same steps as
employed in the second embodiment. Specifically, the peripheral
transistors have a salicide structure in which the gate electrodes
are realized by the use of the floating gate layer of the memory
cell (the first polysilicon films 3d, 3e) as shown in FIG.
28A-28C.
[0151] If this embodiment includes a select Tr for, the memory cell
and a high breakdown voltage transistor in the peripheral circuit
(which transistors are not shown), these transistors may be formed
by the use of a single gate insulating film which is thicker than
the gate oxide film (insulating film) 2. Alternatively, it may be
modified such that only the high breakdown voltage transistor has a
gate insulating film which differs from the gate insulating film 2,
and the select Tr for the memory cell is realized using the gate
insulating film 2. In other words, any combination of gate
insulating films may be employed if it can reduce the manufacturing
steps such as oxidation.
[0152] If the element structure must be flattened for integration,
a dummy pattern DMY (as shown in FIG. 29) of the same double-layer
gate structure as the memory cell is formed on the element
isolating region near the peripheral transistors. Thereafter,
various steps (which are not shown) of depositing an interlayer
insulating film, forming contact holes and wiring layers,
depositing a protect film, etc. are performed. As a result, the
non-volatile semiconductor memory device is completed.
[0153] FIG. 30 is a sectional view, showing a case where a dummy
pattern DMY as shown in FIG. 29 is formed in each element-isolating
region adjacent to a corresponding transistor of the peripheral
circuit, then an interlayer insulating film 23 is deposited, and
the resultant structure is flattened by, for example, CMP. FIG. 31
is a sectional view, useful in explaining the difficulty of the
flattening treatment which occurs when the dummy patterns DMY are
not formed. As is understood from FIG. 30, the flattening treatment
can be performed easily when the dummy patterns DMY are formed in
the element-isolating regions adjacent to the transistors of the
peripheral circuit.
[0154] Although in the above-described embodiments, the invention
is applied to a NAND EEPROM, it is not limited to it, but also
applicable to an EEPROM of a NOR, DINOR, AND, etc. type. A
description will now be given of an EEPROM of such a type.
[0155] FIG. 32 is a circuit diagram, showing a memory cell array
incorporated in a NAND EEPROM. As is shown in FIG. 32, in the NAND
EPROM, a bit-line-side select gate (SG1), memory cell groups
(memory cell units) connected in series, and a source-line-side
select gate (SG2) are connected in series between a bit line BL and
a source line VS. The select gate of each select transistor denoted
by reference sign SG1 or SG2 and the control gate of each memory
cell denoted by reference sign CG are connected to the transistors
of a peripheral circuit (not shown) for controlling the voltage
which is applied for controlling the select transistor and the
memory cell.
[0156] FIG. 33 is a circuit diagram, showing a memory cell array
incorporated in a NOR EEPROM. As is shown in FIG. 33, in the NOR
EEPROM, a bit-line-side select gate (SG) and one memory cell are
connected in series between a bit line BL and a source line VS
perpendicular to the bit line BL. The select gate of each select
transistor denoted by reference sign SG and the control gate of
each memory cell denoted by reference sign CG are connected to the
transistors of a peripheral circuit (not shown) for controlling the
voltage which is applied for controlling the select transistor and
the memory cell.
[0157] FIG. 34 is a circuit diagram, showing a memory cell array
incorporated in a DINOR (Divided NOR) EEPROM. As is shown in FIG.
34, in the DINOR EEPROM, memory cells are connected parallel to
each other between one sub bit line (sub BL) and a plurality of
source lines VS. The sub bit line (sub BL) is connected to a bit
line BL via a bit line select gate (SG). The select gate of each
select transistor denoted by reference sign SG and the control gate
of each memory cell denoted by reference sign CG are connected to
the transistors of a peripheral circuit (not shown) for controlling
the voltage which is applied for controlling the select transistor
and the memory cell.
[0158] FIG. 35 is a circuit diagram, showing a memory cell array
incorporated in an AND EEPROM. As is shown in FIG. 35, in the AND
EEPROM, a bit-line-side select gate (SG1), memory cell groups
(memory cell units) connected parallel to each other, and a
source-line-side select gate (SG2) are connected in series between
a bit line BL and a source line VS. The select gate of each select
transistor denoted by reference sign SG1 or SG2 and the control
gate of each memory cell denoted by reference sign CG are connected
to the transistors of a peripheral circuit (not shown) for
controlling the voltage which is applied for controlling the select
transistor and the memory cell.
[0159] As described in each of the embodiments, the non-volatile
semiconductor memory devices of the invention are characterized in
that gate insulating films of the same kind are intentionally used
in order to reduce the manufacturing steps such as the resist
forming step, the oxidation step, etc. The devices are also
characterized in that the gate electrodes of the peripheral
transistors are realized using the first polysilicon layer
(floating gate layer), in order to make the transistors have a
salicide structure without any complicated step and irrespective of
whether a conductive layer (e.g. a WSi layer is provided on the
control gate layer. In other words, as compared with the case where
the gate electrodes of the peripheral transistors are formed of the
control gate layer, gate oxidation steps for the peripheral
transistors can be omitted. Further, since in the invention, an
impurity can be implanted simultaneously into the source and drain
regions and the gate electrode, the conventional resist patterning
and impurity implanting steps, which are performed just for the
gate electrodes to produce surface-channel type peripheral
transistors, can be omitted. In addition, irrespective of the WSi
layer on the control gate layer, the semiconductor memory device
can have a polymetal gate structure in which another conductive
layer is stacked. These structures enable high speed operation of
the peripheral transistors. In addition, in the invention, the
first polysilicon layer can be used as a resistive element of a
high resistance while the peripheral transistors can be operated at
high speed.
[0160] As described above, the invention can provide a non-volatile
semiconductor memory device which can be manufactured by a simple
manufacturing process and hence at low cost, and wherein the
transistors of the peripheral circuit of the memory can have a
salicide structure and a polymetal gate structure which facilitates
the employment of a high-speed CMOS circuit as a peripheral
circuit. The invention can also provide a method for manufacturing
the non-volatile semiconductor memory device.
[0161] Additional advantages and modifications will readily occur
to those skilled in the art. Therefore, the invention in its
broader aspects is not limited to the specific details and
representative embodiments shown and described herein. Accordingly,
various modifications may be made without departing from the spirit
or scope of the general inventive concept as defined by the
appended claims and their equivalent.
* * * * *