U.S. patent application number 10/971914 was filed with the patent office on 2006-04-27 for twin fin arrayed cooling device with liquid chamber.
Invention is credited to Shankar Hegde.
Application Number | 20060086484 10/971914 |
Document ID | / |
Family ID | 36147243 |
Filed Date | 2006-04-27 |
United States Patent
Application |
20060086484 |
Kind Code |
A1 |
Hegde; Shankar |
April 27, 2006 |
TWIN FIN ARRAYED COOLING DEVICE WITH LIQUID CHAMBER
Abstract
A cooling device for dissipating heat from a component is
disclosed. The cooling device includes a core with a plurality of
twin fins connected with the core and a liquid chamber in thermal
communication with the component. The liquid chamber includes a
reservoir with a liquid therein and the core includes a cavity with
a liquid therein. A heat pipe is connected with the liquid chamber
and with the core and the heat pipe is in contact with the liquid
in the reservoir and the liquid in the cavity so that waste heat in
the liquid chamber is thermally communicated to the core and is
dissipated by an air flow over the twin fins and the core.
Inventors: |
Hegde; Shankar; (Bangalore,
IN) |
Correspondence
Address: |
HEWLETT PACKARD COMPANY
P O BOX 272400, 3404 E. HARMONY ROAD
INTELLECTUAL PROPERTY ADMINISTRATION
FORT COLLINS
CO
80527-2400
US
|
Family ID: |
36147243 |
Appl. No.: |
10/971914 |
Filed: |
October 21, 2004 |
Current U.S.
Class: |
165/104.33 ;
165/80.3; 257/E23.088; 257/E23.099; 361/700 |
Current CPC
Class: |
H01L 23/427 20130101;
F28D 15/0275 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101; F28F 1/14 20130101; H01L 23/467 20130101; H01L 2924/0002
20130101 |
Class at
Publication: |
165/104.33 ;
165/080.3; 361/700 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. A cooling device for dissipating heat from a component,
comprising: a plurality of twin fins, each twin fin including a
root and a pair of vanes extending outward of the root and spaced
apart to define a slot between the vanes, each vane including a
leading edge, a trailing edge, and an outer edge; a heat pipe
including a first end and a second end; a core including a
plurality of grooves adapted to receive the root, a top face, a
cavity, a liquid disposed in the cavity, and a plate connected with
the core and including an aperture, the heat pipe is connected with
the aperture and the first end is positioned in the cavity and is
in contact with the liquid; and a liquid chamber including a
reservoir, a liquid disposed in the reservoir, an aperture, and a
base including a mounting surface for thermally connecting the
liquid chamber with the component, the heat pipe is connected with
the aperture and the second end is positioned in the reservoir and
is in contact with the liquid.
2. The cooling device as set forth in claim 1, wherein the liquid
chamber further includes a lid connected with the liquid chamber
and operative to seal the liquid in the reservoir.
3. The cooling device as set forth in claim 1, wherein the first
end of the heat pipe is immersed in the liquid in the cavity and
the second end of the heat pipe is immersed in the liquid in the
reservoir.
4. The cooling device as set forth in claim 1, wherein the base
further includes a plurality of mounting holes adapted to receive a
fastener for positioning the mounting surface in thermal
communication with the component.
5. The cooling device as set forth in claim 1, wherein the grooves
extend inward of a surface of the core.
6. The cooling device as set forth in claim 1, wherein each groove
comprises a pair of spaced apart projections that extend outward of
a surface of the core.
7. The cooling device as set forth in claim 1, wherein the grooves
are a selected one of aligned with an axis of the core or aligned
at an angle with the axis of the core.
8. The cooling device as set forth in claim 1, wherein the vanes
include a top portion adapted for mounting an air flow source to
the cooling device.
9. The cooling device as set forth in claim 1, wherein the vanes
include a profile selected from the group consisting of a planar
profile, an arcuate profile, and an angular profile.
10. The cooling device as set forth in claim 9, wherein the arcuate
profile of the vanes matches a curvature of a fan blade.
11. The cooling device as set forth in claim 1 and further
comprising a thermal interface material positioned on the mounting
surface.
12. The cooling device as set forth in claim 1, wherein the
mounting surface includes a cavity inset from the mounting surface
and adapted to receive a thermal interface material.
13. The cooling device as set forth in claim 12 and further
comprising a thermal interface material positioned in the
cavity.
14. The cooling device as set forth in claim 1, wherein the root of
each twin fin is fixedly connected with the groove.
15. The cooling device as set forth in claim 14, wherein each root
is fixedly connected with the grooves using a process selected from
the group consisting of welding, brazing, vacuum brazing,
soldering, adhesively connecting, and gluing.
16. The cooling device as set forth in claim 1, wherein the grooves
include a length that substantially spans an entirety of a length
of a surface of the core and the root of each twin fin includes a
length that is substantially equal to the length of the
grooves.
17. The cooling device as set forth in claim 1, wherein the leading
edge of the vanes includes a profile selected from the group
consisting of a straight profile, an arcuate profile, a slope
profile, and a composite profile.
18. The cooling device as set forth in claim 1, wherein the leading
edges of the vanes form a chamber surrounding the top face of the
core.
19. The cooling device as set forth in claim 1, wherein the top
face of the core includes a profile selected from the group
consisting of a planar profile, a sloped profile, and an arcuate
profile.
20. The cooling device as set forth in claim 1, wherein the outer
edge of each vane includes a lip extending outward of the outer
edge and adapted to receive a mounting ring for connecting an air
flow source with the cooling device.
21. The cooling device as set forth in claim 1, wherein the twin
fins are made from a material selected from the group consisting of
aluminum, copper, silver, gold, and alloys of those materials.
22. The cooling device as set forth in claim 1, wherein the core is
made from a material selected from the group consisting of
aluminum, copper, silver, gold, alloys of those materials, and
graphite.
23. The cooling device as set forth in claim 1, wherein the core
and the twin fins are made from dissimilar materials.
24. The cooling device as set forth in claim 1, wherein a shape of
the vanes varies among the plurality of twin fins.
25. The cooling device as set forth in claim 1 and further
comprising a thermal interface material applied to a selected one
of the root, the grooves, or the root and the grooves and operative
to increase heat transfer from the core to the twin fins.
26. The cooling device as set forth in claim 1, wherein the liquid
disposed in the cavity comprises a material selected from the group
consisting of water, ammonia, ammonia including an ionic
surfactant, acetone, methanol, a heat transfer fluid, and
alcohol.
27. The cooling device as set forth in claim 1, wherein the liquid
disposed in the reservoir comprises a material selected from the
group consisting of water, ammonia, ammonia including an ionic
surfactant, acetone, methanol, a heat transfer fluid, and
alcohol.
28. A system for dissipating heat from a component, comprising: a
cooling device including a plurality of twin fins, each twin fin
including a root and a pair of vanes extending outward of the root
and spaced apart to define a slot between the vanes, each vane
including a leading edge, a trailing edge, and an outer edge; a
heat pipe including a first end and a second end; a core including
a plurality of grooves adapted to receive the root, a top face, a
cavity, a liquid disposed in the cavity, and a plate connected with
the core and including an aperture, the heat pipe is connected with
the aperture, and the first end is positioned in the cavity and in
contact with the liquid; a liquid chamber including a reservoir, a
liquid disposed in the reservoir, an aperture, a base including a
mounting surface for thermally connecting the liquid chamber with
the component, the heat pipe is connected with the aperture, and
the second end is positioned in the reservoir and in contact with
the liquid; and an air flow source for generating an air flow over
the vanes, the top face, the core, and through the slots to
dissipate the heat from the component.
29. The system as set forth in claim 28, wherein the air flow
source is a system fan.
30. The system as set forth in claim 28 and further comprising a
thermal interface material connected with the mounting surface.
Description
FIELD OF THE INVENTION
[0001] The present invention relates generally to a cooling device
for dissipating heat from a component in thermal communication with
the cooling device. More specifically, the present invention
relates to a cooling device including a core with a plurality of
twin fins connected with the core and a liquid chamber in thermal
communication with the component. Waste heat from the component is
thermally communicated from the liquid chamber to the core by a
heat pipe connected with the liquid chamber and the core. The heat
pipe is in contact with a liquid in a reservoir of the liquid
chamber and in contact with a liquid in a cavity in the core.
BACKGROUND OF THE INVENTION
[0002] It is well known in the electronics art to place a heat sink
in contact with an electronic device so that waste heat generated
by operation of the electronic device is thermally transferred to
the heat sink to cool the electronic device. However, with
continued increases in areal densities and system clock speeds in
electronic devices such as microprocessors (CPU's), digital signal
processors (DSP's), and application specific integrated circuits
(ASIC), the amount of waste heat generated by those electronic
devices and the operating temperature of those electronic devices
are directly proportional to clock speed and device geometries.
Efficient operation of a CPU as well as other high power
dissipation electronic devices requires that waste heat be
continuously and effectively removed.
[0003] However, as the aforementioned areal densities and system
clock speeds of electronic devices continue to increase, a heat
flux of the electronic devices also increases. Although air cooled
heat sinks are commonly used to dissipate waste heat from the
aforementioned electronic devices, the increased heat flux in high
performance electronic devices is often concentrated in a small
area, usually on a package surface that will be placed in thermal
contact with the heat sink. The ability to effectively dissipate
ever increasing levels of heat flux in high performance electronic
devices has challenged current heat sink designs where the entire
heat sink is fabricated using processes such as machining, forging,
casting, and extrusion. Those processes make it difficult to
increase the number of fins or an area of the fins in order to
effectively dissipate heat flux concentration.
[0004] Typically, a heat mass includes a mounting surface that is
in thermal communication with the electronic device and is
operative to thermally conduct the waste heat away from the device
and into the heat mass. As a result, the heat flux from the
electronic device is concentrated in the area of the heat mass near
the mounting surface. Ideally, it is desirable to spread the heat
flux in the heat mass over as much of a volume of the heat mass as
possible so that the heat is efficiently transferred to the fins
and dissipated by the air flow over the fins.
[0005] Heat flux is a thermal output per unit of area (i.e.
W/cm.sup.2). For example, if a total thermal output is 100 Watts
over a heat source having dimensions of 3.5 cm*3.5 cm, then the
heat flux is 100 W/(3.5 cm*3.5 cm)=8.163 W/cm.sup.2. At present,
based on area and cost constraints, electronic device package size
remains the same or decreases while the areal densities and clock
speeds continue to increase. Consequently, the problems associated
with heat flux concentration continue to increase and those
problems cannot be solved solely by increasing heat sink size, the
number of fins, or fan capacity.
[0006] Heat flux concentration can be exacerbated by conditions
that reduce an efficiency of heat transfer to/from the heat mass.
In instances where a liquid is used to transfer waste heat to the
heat mass, a tilting of the heat mass from an optimal position
(e.g. a horizontal orientation) can result in the liquid being
displaced with a resulting reduction in thermal transfer from the
liquid to the heat mass. In some prior heat sink designs, a heat
pipe in contact with the liquid is used to transfer the waste heat
from the liquid to the heat mass. However, the displacement of the
liquid caused by the titling can result in a reduced contact or no
contact at all between the heat pipe and the liquid. Consequently,
heat transfer to the heat mass is reduced when the heat sink has a
non-optimal orientation.
[0007] Typically, waste heat from the heat mass is dissipated by an
air flow through fins that are connected with the heat mass.
However, in many prior heat sink designs, a bottom portion of the
fins are placed in close proximity to a base plate that is used to
mount the heat mass (e.g. mounting surface) in thermal
communication with the electronic device to be cooled. The air flow
passes through the fins and is obstructed by the base plate
resulting in reduced air flow, turbulent air flow, back pressure,
and air shock noise. Ideally, the air flow through the fins should
be smooth and unobstructed so that the heat transfer from the fins
and the heat mass to the air flow is optimal. Moreover, when a
system fan is used to supply the air flow to two or more heat
sinks, the base plate or some other structure that obstructs the
air flow can significantly reduce heat transfer from the heat mass
and fins to the air flow.
[0008] Furthermore, many prior heat sink designs resort to a
configuration where the heat sink is mounted to an electronic
device carried by a PC board or mother board with a resulting
horizontal placement of the heat sink that matches a horizontal
mounting of the electronic device on the PC board. However, this
horizontal placement does not always allow for the aforementioned
optimal air flow. Therefore, flexibility in a placement of the heat
sink and its fins relative to the air flow is lacking in prior heat
sink designs.
[0009] Consequently, there is a need for a cooling device with
improved thermal conductivity that reduces heat flux concentration.
There is also a need for a cooling device that efficiently
transfers waste heat from a liquid when the cooling device has a
non-optimal orientation. Finally, there exists a need for a cooling
device that allows for flexibility in positioning the cooling
device to obtain an unobstructed air flow through fins of the
cooling device.
SUMMARY OF THE INVENTION
[0010] The cooling device of the present invention solves the
aforementioned problems of heat flux concentration, non-optimal
orientation, and obstructed air flow. The cooling device includes a
heat pipe including a first end and a second end, a plurality of
twin fins with each twin fin including a root and a pair of vanes
extending outward of the root, the vanes are spaced apart to define
a slot between the vanes, and each vane includes a leading edge, a
trailing edge, and an outer edge. A core includes a plurality of
grooves that are adapted to receive the roots of the twin fins. The
core also includes a top face, a cavity, a liquid disposed in the
cavity, and a plate that is connected with the core. The plate
includes an aperture and the heat pipe is connected with the
aperture with the first end of the heat pipe positioned in the
cavity and in contact with the liquid in the cavity. The cooling
device also includes a liquid chamber including a reservoir, a
liquid disposed in the reservoir, an aperture, and a base including
a mounting surface for thermally connecting the liquid chamber with
the component. The heat pipe is connected with the aperture in the
liquid chamber and the second end of the heat pipe is positioned in
the reservoir and in contact with the liquid in the reservoir.
[0011] The aforementioned problems associated with heat flux
concentration are addressed by the liquid chamber, the heat pipes,
and the core because waste heat thermally conducted into the liquid
in the reservoir via the mounting surface is thermally transferred
to the liquid in the core via the heat pipe where an air flow
through the vanes dissipates the waste heat from the core. The
vanes of the twin fins provide a large surface area for the heat in
the core to be dissipated by the air flow over vanes. Moreover,
there is flexibility in positioning the leading and trailing edges
of the vanes so that the air flow can pass through the slots of the
vanes unobstructed by any structures, such as the base, for
example. Consequently, the problems associated with obstructed air
flow are addressed by the cooling device. Another advantage to the
flexibility in positioning the twin fins relative to the air flow
is that a system fan or the like can be used to supply the air
flow.
[0012] Additionally, the first and second ends of the heat pipes
are immersed in their respective liquids so that the cooling device
can be positioned in a non-optimal orientation (e.g. a
non-horizontal orientation) and the liquids still cover the ends of
the heat pipes to ensure heat transfer from the liquid chamber to
the core. Therefore, the problems associated with reduced heat
transfer caused by a non-optimal orientation are addressed by the
cooling device.
[0013] Other aspects and advantages of the present invention will
become apparent from the following detailed description, taken in
conjunction with the accompanying drawings, illustrating by way of
example the principles of the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] FIGS. 1a and 1b are profile views depicting a cooling
device.
[0015] FIG. 1c is a side profile view depicting a cooling
device.
[0016] FIG. 1d is a cross-sectional view of a cooling device along
a line I-I of FIG. 1c.
[0017] FIG. 1e is a rear profile view depicting a cooling
device.
[0018] FIGS. 2a and 2b are profile views depicting a plurality of
twin fins connected with a core.
[0019] FIG. 2c is a bottom profile view depicting a plurality of
twin fins connected with a core.
[0020] FIG. 3 is an enlarged top profile view depicting a plurality
of twin fins connected with a plurality of grooves on a core.
[0021] FIG. 4 is a profile view depicting a twin fin connected with
a core.
[0022] FIG. 5a is a cross-sectional view depicting an insertion of
a twin fin into a groove on a core.
[0023] FIG. 5b is a top plan view depicting a plate.
[0024] FIG. 5c is a cross-sectional view of a plate along a line
II-II of FIG. 5b.
[0025] FIGS. 6a through 6g are cross-sectional views depicting a
core and examples of profiles of a top face of the core.
[0026] FIG. 7a is a side profile view depicting a core including a
plurality of grooves.
[0027] FIG. 7b is a bottom plan view of a cavity in a core.
[0028] FIG. 7c is a bottom plan view of a plate connected with a
core.
[0029] FIGS. 8a through 8e are profile views depicting a twin
fin.
[0030] FIGS. 9a and 9b are profile views depicting a vane of a twin
fin.
[0031] FIGS. 10a and 10b are profile views depicting an arcuate
profile on vane.
[0032] FIG. 11 depicts a tangential relationship between a
curvature of a vane and a curvature of a fan blade.
[0033] FIGS. 12 and 13 are cross-sectional views depicting a liquid
in a reservoir and a thermal interface material.
[0034] FIGS. 14a and 14b are cross-sectional views depicting a heat
transfer path.
[0035] FIG. 15 is a cross-sectional view depicting twin fins
connected with a core using a clamp.
[0036] FIG. 16 is a profile view depicting an example of a
clamp.
[0037] FIGS. 17 and 18 are cross-sectional views depicting an air
flow source.
[0038] FIGS. 19 and 20 are cross-sectional views depicting a system
for dissipating heat from a component.
DETAILED DESCRIPTION
[0039] In the following detailed description and in the several
figures of the drawings, like elements are identified with like
reference numerals.
[0040] As shown in the drawings for purpose of illustration, the
present invention is embodied in a cooling device for dissipating
heat from a component. The cooling device includes a plurality of
twin fins with each twin fin including a root and a pair of vanes
extending outward of the root. The vanes of the twin fins are
spaced apart to define a slot between the vanes and each vane
includes a leading edge, a trailing edge, and an outer edge. The
cooling device also includes a heat pipe including a first end and
a second end, a core including a plurality of grooves that are
adapted to receive the root of the twin fins, a top face, a cavity,
a liquid disposed in the cavity, and a plate connected with the
core and including an aperture. The heat pipe is connected with the
aperture in the plate and the first end of the heat pipe is
positioned in the cavity and the first end is in contact with the
liquid. Additionally, the cooling device includes a liquid chamber
including a reservoir and a liquid disposed in the reservoir, an
aperture, and a base including a mounting surface for thermally
connecting the liquid chamber with the component. The heat pipe is
connected with the aperture in the liquid chamber and the second
end of the heat pipe is positioned in the reservoir and the second
end is in contact with the liquid.
[0041] Waste heat from the component is thermally conducted into
the liquid in the reservoir via the mounting surface. The heat pipe
thermally conducts the heat from the second end to the first end
that is in contact with the liquid in the cavity in the core and an
air flow over the vanes, through the slots, and over the core
dissipates the waste heat into the air flow thereby cooling the
component and reducing heat flux concentration in the liquid
chamber. The cooling device can be used to dissipate waste heat
from any component that requires cooling and the component to be
cooled is not limited to electronic devices.
[0042] In FIGS. 1a through 1e, a cooling device 10 for dissipating
heat from a component (not shown) includes a plurality of twin fins
21 with each twin fin 21 including a root 27 and a pair of vanes 23
extending outward of the root 27 and spaced apart to define a slot
S between the vanes 23. Each vane 23 includes, a leading edge 26, a
trailing edge 24, and an outer edge 25. The cooling device 10 also
includes a heat pipe 14 (two are shown) including a first end 14a
and a second end 14b, a core 11 including a plurality of grooves G
that are adapted to receive the roots 27 of the twin fins 21, and a
top face 13, a cavity 11r, a liquid 11L disposed in the cavity 11r,
and a plate 20 connected with the core 11 and including an aperture
20b (two are shown). The heat pipe 14 is connected with the
aperture 20b and the first end 14a is positioned in the cavity 11r
and is in contact with the liquid 11L. A liquid chamber 15 includes
a reservoir 15r and a liquid 15L disposed in the reservoir 15r, an
aperture 15a (two are shown), and a base 100 including a mounting
surface 105 for thermally connecting the liquid chamber 15 with the
component. The heat pipe 14 is connected with the aperture 15a and
the second end 14b of the heat pipe 14 is positioned in the
reservoir 15r and is in contact with the liquid 15L.
[0043] One advantage to the cooling device 10 is that the heat
pipes 14 allow for flexibility in positioning the core 11 and the
twin fins 21 away from the liquid chamber 15 so that an air flow F
can move freely through the vanes 23 from the leading edges 26 to
the trailing edges 24 or vise-versa without being impeded by an
obstruction such as the base 100, for example. As will be described
below, an air flow source such as an axial fan, for example, can be
mounted with the vanes 23 to provide the air flow F or the air flow
source can be a system fan or the like that provides the air flow F
to an entire system that includes the cooling device 10. For
example, the heat pipes 14 can be shaped (e.g. the S-shape
depicted) so that a axis Z of the core 11 is alined with an air
flow F.sub.s from a system fan (see FIG. 18). Therefore, the
cooling device 10 allows a designer flexibility in orienting the
core 11 at various angles (e.g. above or below a mother board) to
suit a design criteria for a specific system and/or to make the
best use of available space on a mother board or inside an
enclosure that houses the cooling device 10. Furthermore, the
flexibility in orientation does not compromise the performance of
the cooling device 10.
[0044] Referring to FIGS. 1c and 1e, the heat pipes 14 can have any
shape and are not limited to the S-shape depicted herein. As
described above, the heat pipes 14 can be shaped to position the
core 11 and the twin fins 21 relative to the air flow F. Therefore,
the heat pipes 14 need not extend vertically upward from the liquid
chamber 15 as depicted, rather, the heat pipes 14 can include
curves, bends, straight sections, and may extend at an angle from
the liquid chamber 15. Generally, the heat pipes 14 can be
configured to position the core 11 and the twin fins 21 above,
below, at an angle, to the sides, or some combination of those
positions relative to the liquid chamber 15.
[0045] Although the first and second ends (14a, 14b) of the heat
pipes 14 can be positioned anywhere inside their respective cavity
11 r and reservoir 15r, preferably the heat pipes 14 have their
first and second ends (14a, 14b) positioned to maximize heat
transfer to/from their respective liquids (11L, 15L). In FIGS. 1c
and 1d, the second ends 14b are positioned so that they are in a
volume inside the in the reservoir 15r where a heat flux
concentration H.sub.c from the waste heat H.sub.w generated by the
component will be greatest. As an example, if the heat flux
concentration H.sub.c is greatest at a bottom of the reservoir 15r
because the bottom is closest to the mounting surface 105, then the
second ends 14b should positioned about in the middle of the
reservoir 15r and close to the bottom of the reservoir 15r to
maximize heat transfer from the liquid 15L to the second ends
14b.
[0046] Similarly, for the first ends 14a, it is desirable to
efficiently transfer waste heat from the heat pipes 14 to the
liquid 11L in the cavity 11r. Accordingly, in FIG. 1d, the first
ends 14a are positioned at about a middle of the cavity 11r so that
the liquid 11L completely surrounds the first ends 14a. As will be
described below, it is preferable for those portions of the heat
pipes 14 that are positioned in the reservoir 15r or the cavity 11r
to be immersed in the liquids (11L, 15L) so that heat transfer
to/from the liquids (11L, 15L) by the heat pipes 14 is maximized.
Depending on the position of the first and second ends (14a, 14b)
the immersion can be accomplished with a complete or a partial
filling of the cavity 11r and the reservoir 15r with the liquids
(11L, 15L).
[0047] Turning to FIGS. 1a, 1b, 1c, and 1d, the base 100 can
include a plurality of mounting holes 101 that extend between a top
surface 103 and the mounting surface 105. A fastener (see 65 in
FIG. 19), such as a machine screw or a bolt, for example, can be
inserted through the mounting holes 101 to effectuate mounting the
base 100 to a substrate (e.g. a PC board) that carries the
component to be cooled by the cooling device 10 and to position the
mounting surface 105 in thermal communication with the
component.
[0048] A plurality of twin fins 21 connected with the core 11 sans
the heat pipes 14 and liquid chamber 15 are depicted in greater
detail in FIGS. 2a, 2b, 2c, and 3. Turning to FIG. 3, a close up
view depicts a plurality of the twin fins 21 with their respective
roots 27 connected with the grooves G on the core 11 such that the
twin fins 21 form an array of fins that surround the core 11.
Depending on a profile of the leading edges 26 of the vanes 23, the
leading edges 26 can define a chamber 30 that surrounds the top
face 13. The top portions 29 of the vanes 23 can be adapted to
mount an air flow source to the cooling device 10. For example, the
top portion 29 can be a substantially planar surface for mounting a
fan to the vanes 23. It is preferable for the leading edges 26 to
define the chamber 30 because the chamber 30 provides a space for
the air flow F to circulate over the top face 13 to dissipate heat
from the core 11 and for the air flow F to pass over the vanes 23
and through the slots S. The top face 13 of the core 11 can be
substantially flush with the roots 27 of the twin fins 21 (see
FIGS. 2a and 3), can extend outward the roots 23 (see FIG. 2b), or
can be positioned below an upper most portion of the roots 27 (see
FIG. 17).
[0049] In FIG. 2c, a bottom face 19 of the core 11 can include an
aperture 19a that extends inward of the bottom face 19 to form the
cavity 11r . The plate 20 can be sized to fit in the aperture 19a
and then the plate 20 can be connected with the core 11. The
apertures 20b are through holes that extend all the way through the
plate 20 so that the first end 14a of the heat pipes 14 can be
positioned in the cavity 11r by inserting the first ends 14a
through the apertures 20b.
[0050] Turning to FIG. 4, the grooves G are adapted to receive the
root 27 of the twin fins 21. The grooves G can be formed by a pair
of spaced apart projections 12 that extend outward of a surface 11
s of the core 11. A space between adjacent projections 12 is
sufficient to receive a width 27w of the root of the twin fin 21.
Alternatively, in FIG. 5a, the groove G can extend inward of the
surface 11s and the groove G can include a width and a depth
sufficient to receive the root 27 of the twin fins 21. As will be
described below, the grooves G can be aligned with the axis Z of
the core 11 or the grooves G can be aligned at an angle with the
axis Z (see .beta. in FIG. 7a). Factors including a size of the
core 11 (e.g. its circumference if the core 11 is cylindrical) and
the width 27w of the roots will determine a maximum number of the
twin fins 21 that can be connected with the core 11. The root 27
can be inserted into the groove G using a tool 90. The tool 90 can
complement a shape of the slot S and the tool 90 can be used to
urge the root 27 into the groove G so that the root 27 is firmly
connected with the groove G and the root 27 is in contact with the
groove G substantially over its entire length along the core 11. As
an example, the twin fin 21 can be fixedly connected with the
groove G by applying a solder or the like to the root 27 and/or the
groove G prior to insertion, then the root 27 can be soldered in
the groove G. The tool 90 can be used to hold the root 27 in the
groove G to prevent the twin fin 21 from moving during the
insertion process.
[0051] Similarly, a brazing process can be used to connect the root
27 with the groove G. To enhance thermally conductivity between the
core 11 and the twin fin 21, a thermal sealant or a thermal
interface material can be positioned in the groove G and/or on the
root 27 prior to insertion. Although not depicted in FIG. 5a, the
above processes can be used when the groove G is formed by the
projections 12 depicted in FIG. 4. Other methods can be used to
connect the root 27 with the groove G and the present invention is
not to be construed as being limited to the methods disclosed
herein. For instance, welding, vacuum brazing, adhesives, and glue
are examples of other methods that can be used to effectuate a
connection of the roots 27 with the grooves G.
[0052] In FIGS. 5b and 5c, the plate 20 can include at least one
aperture 20b that extends all the way through the plate 20. A
perimeter 20p of the plate can have a shape that complements a
shape of the aperture 19a in the bottom face 19 of the core 11. The
plate 20 and the core 11 will have a shape that is application
dependent and need not have the circular and the cylindrical shapes
respectively as depicted herein. Similarly, the apertures 20b will
have a shape that depends on the shape of the heat pipes 14.
Accordingly, the apertures 20b need not be circular as depicted.
The plate 20 can be made from any material (e.g. a metal) that can
be soldered, brazed, or welded. Materials including but not limited
to carbon steel, aluminum (Al), ADC12 aluminum (Al), copper (Cu),
and silver (Ag). A process including but not limited to pressure
die casting, punching and shaving, forging, and machining can be
used to form the plate 20 and the apertures 20b. For example, a rod
of metal starting material can be turned on a machine tool to form
the plate 20, followed by drilling the plate 20 to form the
apertures 20b.
[0053] In FIGS. 6a through 6g, examples of various configurations
for the top face 13 of the core 11 are depicted. The top face 13
can include a planar profile in FIG. 6a, an arcuate profile in FIG.
6b, and a sloped profile in FIG. 6c. In FIGS. 6d and 6e, the sloped
and arcuate profiles can terminate in a frustum 13f (see 13f in
FIG. 2b). In FIGS. 6f and 6g, the top face 13 includes concave
arcuate and concave sloped profiles respectively, and those
profiles can include the frustum 13f. The profile of the top face
13 can be selected based on air flow management in the chamber 30
and/or to increase the air flow F over the top face 13 to enhance
heat transfer from the core 11 to the air flow F.
[0054] Turning to FIG. 7a, the grooves G can include a length L
that substantially spans an entirety of a length of the surface 11s
of the core 11. The root 27 of each twin fin 21 can have a length
that is substantially equal to the length L of the grooves G. In
FIG. 7a, the grooves G come short of extending all the way down to
the bottom face 19 by a distance d1. The distance d1 can be 5.0 mm
or less, for example. Accordingly, the length L spans a substantial
entirety of the surface 11s. The grooves G can be aligned with the
axis Z of the core 11 or the grooves G can have an angular
orientation .beta. with the axis Z.
[0055] In FIG. 7b, as one example of how the cavity 11r can be
formed in the core 11, the bottom face 19 can include the aperture
19a that extends inward of the bottom face 19 to form the cavity
11r. In FIG. 7c, the plate 20 is connected with the core 11 by
inserting the plate 20 in the aperture 19a. The aperture 19a and
the perimeter 20p of the plate 20 can be sized appropriately to
provide a proper mechanical fit between the plate 20 and the core
11. The connection of the plate 20 with the core 11 and the
connection of the heat pipes 14 with the apertures 20b in the plate
20 should be leak proof to prevent the liquid 11L from leaking out
of the cavity 11r via the apertures (19a, 20b). The plate 20 can be
connected with the core 11 and the heat pipes 14 can be connected
with the apertures 20b using a process including but not limited to
soldering, brazing, welding, and friction stir welding.
[0056] In FIGS. 8a through 8e, each twin fin 21 includes a root 27
that is common to both vanes 23, an outer edge 25, a trailing edge
24, a leading edge 26. Optionally, the vane 23 can include a lip 22
that extends outward of the outer edge 25 and the van can include a
top portion 29. The lip 22 provides a surface against which a
mounting ring (see 80 in FIG. 15) is abutted with for connecting an
air flow source with the cooling device 10; whereas, the top
portion 29 is operative to provide a surface upon which to mount
the air flow source on the vanes 23. The leading edge 26 of the
vane 23 can include a profile that is straight (i.e. planar),
arcuate, sloped, or a composite profile that is combination of one
or more of the aforementioned profiles (see FIGS. 8a and 8b). The
profile can be selected to control the air flow F in the chamber
30, over the top face 13, over the vanes 23, and through the slots
S. The profile may also be selected to complement a shape of a fan
blade that is positioned proximate the chamber 30 to provide the
air flow F. Although the trailing edge 24 is depicted as being
substantially planar, the trailing edge 24 may also be profiled and
can include a straight, an arcuate, a sloped, or a composite
profile. The slots S between the vanes 23 can diverge from the root
27 to the outer edge 25 so that the slot S widens in a direction
from the root 27 to the outer edge 25.
[0057] The root 27 and a portion 27c (see dashed lines) of the
vanes 23 may be coated with a material including but not limited to
an adhesive, a glue, a solder, or a brazing compound to effectuate
a connection of the twin fins 21 with the grooves G in the core 11.
Because the portion 27c will come into contact with the projections
12 (see FIG. 4) or a wall of the groove G (see FIG. 5a), it may be
desirable to coat the portion 27c with the aforementioned materials
to ensure the twin fin 21 is fixedly connected with the core 11.
Thermal transfer of waste heat H.sub.w from the core 11 to the twin
fins 21 can be reduced if the connection between the root 27 and
the groove G is not snug and/or any portion of the root 27 is not
in contact with the core 11. As was described above, a width 27w of
the roots 27 should be selected to complement the inside dimensions
of the grooves G or the projections 12 to ensure a snug fit.
[0058] In FIGS. 9a and 9b, the vanes 23 of the twin fins 21 include
a planar profile, that is, each vane 23 is a substantially flat
surface from the root 27 to the outer edge 25. On the other hand,
in FIGS. 10a and 10b, the vanes 23 include an arcuate profile
denoted by arrows 23a. The vanes 23 can also include an angular
profile (see FIG. 8e) wherein the vanes 23 have one or more
portions that are at an angle a with respect to another portion of
the vane 23 or with respect to some predetermined reference point
on the twin fin 21 or on the core 11. The arcuate profile 23a
depicted in FIGS. 10a and 10b can be selected to be tangential to a
point on the core 11, such as a circle of a predetermined diameter
and centered about the axis Z of the core 11. As an example, the
arcuate profile 23a can be selected to match a curvature of a fan
blade (not shown) on a fan that is mounted over the chamber 30.
Matching a curvature of the vanes 23 with a curvature of the fan
blade can result in lower air shock noise caused by the air flow F
moving over the vanes 23 and through the slot S.
[0059] Turning to FIG. 11, a circle 11c centered about the axis Z
of the core 11 has a tangent line T.sub.L that is tangent to the
circle 11c and is tangent to a curvature of the arcuate profile 23a
of vanes 23 as denoted by a second circle having a radius R.sub.T
that is equal to a distance from the root 27 to the outer edge 25
of the vanes 23. A second circle having a radius R.sub.F represents
a radius of a fan blade 71 (shown superimposed over the vanes 23)
from a center of a hub of a fan (not shown). The curvature of the
fan blade 71 matches the arcuate profile 23a of the vanes 23 such
that the two circles defined by radius lines (R.sub.T and R.sub.F)
are concentric with each other.
[0060] In FIG. 12, a thermal interface material 40 can be
positioned on the mounting surface 105 of the base 100. The thermal
interface material 40 reduces thermal resistance between a surface
51 of a component 50 and the mounting surface 105. The thermal
interface material 40 can also serve to seal micro voids on the
surface 51 thereby increasing waste heat H.sub.w transfer from the
component 50 to the liquid 15L in the reservoir 15r. Alternatively,
in FIG. 13, the mounting surface 105 of the base 100 can include a
cavity 18 inset from the mounting surface 105. A thermal interface
material 40 can be positioned in the cavity 18. The thermal
interface material 40 can be flush with the mounting surface 105,
can be inset from the mounting surface 105 (i.e. recessed into the
cavity 18) or can extend outward of the mounting surface 105.
[0061] As one example of how the liquid chamber 15 can be
implemented, the liquid chamber 15 can be a structure that is open
at one end (see FIG. 12) and the open end is positioned in contact
with a top surface 103 of the base 100 and is connected with the
top surface 103 using a process including but not limited to
welding, soldering, brazing, or friction stir welding. The
apertures 15a can be formed by a process including but not limited
to drilling, milling, machining, punching, or they can be cast or
otherwise molded into the liquid chamber 15. The reservoir 15r can
then be filled with the liquid 15L by pouring the liquid 15L into
the reservoir 15r via the apertures 15a.
[0062] In contrast, in FIG. 13, as another example of an
implementation of the liquid chamber 15, the liquid chamber 15 can
be a structure that is open at two ends with one end connected with
the top surface 103 and a lid 15t can be connected with the other
end to form the reservoir 15r. The liquid 15L can be added prior to
the connection of the lid 15t or after the connection of the lid
15t by pouring the liquid 15L through the apertures 15a as
described above. The liquid chamber 15 can be connected with the
top surface 103 and the lid 15t can be connected with the liquid
chamber 15 using the aforementioned processes. As was described
above in reference to the cavity 11r , the liquid chamber 15 must
be sealed so that it is leak proof.
[0063] Preferably, the second ends 14b of the heat pipes 14 are
completely immersed in the liquid 15L so that the waste heat
H.sub.w in the liquid 15L is transferred to the heat pipes 14 even
when the liquid chamber 15 has an orientation other than
horizontal. For example, the cooling device 10 may be connected
with a component on a PC board and the PC board may not be
perfectly level (i.e. horizontal) or a chassis that carries the PC
board may not be perfectly level. Therefore, it is desirable for
the second ends 14b to be completely immersed in the liquid 15L so
that a tilting .theta. of the liquid chamber 15 relative to a
horizontal line h does not result in the liquid 15L shifting out of
contact with the second ends 14b thereby compromising heat transfer
from the liquid 15L to the heat pipes 14. The reservoir 15r may be
completely filled or partially filled by the liquid 15L.
[0064] Depending on the material used for the liquid 15L and the
expected maximum temperature generated by the component, it may be
desirable to partially fill the reservoir 15r with the liquid 15L
to accommodate for thermal expansion of the liquid 15L and to
prevent the thermal expansion from rupturing the liquid chamber 15
or causing the liquid 15L to leak out of the liquid chamber 15.
Typically, a manufacture will set an upper operating limit on a
component (e.g. not to exceed 75.degree. C.); therefore, the liquid
15L can be selected with that upper limit in mind so that any
thermal expansion of the liquid can be predicted. Generally, the
reservoir 15r should be filled with a volume of the liquid 15L
sufficient to at least completely immerse the heat pipes 14.
Furthermore, the closer the heat pipes 14 are placed towards the
bottom of the reservoir 15r (i.e. closer to the top surface 103),
then a smaller volume of the liquid 15L will be required to immerse
the heat pipes 14 and the reservoir need not be completely
filled.
[0065] Similarly, the liquid 11L in the cavity 11r at a minimum
should completely immerse the heat pipes 14 and the cavity 11r can
be completely or partially filled with the liquid 11L. However,
unlike the reservoir 15r where the waste heat H.sub.w is
transferred to the liquid 15L, it is preferable to completely fill
the cavity 11r with the liquid 11L in order to maximize the surface
area of the liquid 11L that is in contact with the cavity 11r and
therefore in contact with the core 11 because the cavity 11r is
formed in the core 11.
[0066] In FIGS. 14a and 14b, a component 50 is in thermal
communication with the mounting surface 105. The thermal
communication can be by a direct contact between the component 50
and the mounting surface 105 as depicted or via an intermediate
structure such as the aforementioned thermal interface material 40,
for example. Waste heat H.sub.w enters the liquid chamber 15 via
the mounting surface 105 and is concentrated near the base 100
where the heat pipes 14 are positioned in the reservoir 15r. Even
though the waste heat H.sub.w is thermally conducted throughout a
volume of the liquid 15L, a heavy dashed oval depicts a region in
the liquid chamber 15 where a heat flux concentration H.sub.c is
highest.
[0067] The heat flux concentration H.sub.c can be particularly
problematic when the component 50 is a high power dissipation,
state-of-the-art, microprocessor such as the type used in leading
edge workstations, desk top PC's, servers, and laptop computers. To
efficiently cool the component 50 it is desirable to reduce the
heat flux concentration H.sub.c in the liquid chamber 15. To that
end, the waste heat H.sub.w is thermally transferred from the
liquid chamber 15 through the heat pipes 14 and into the core 11
through a path P1. The path P1 begins where the waste heat H.sub.w
in the liquid 15L is transferred to the heat pipes 14 via the
second ends 14b and continues through the heat pipes 14 where the
waste heat H.sub.w is thermally transferred to the liquid 11L by
the first ends 14a, and finally the waste heat H.sub.w is
transferred to the core 11 where it spreads upward and outward
towards the vanes 23 and the top face 13 and is dissipated by the
air flow F.
[0068] Referring to Table 1 where data in a right column depicts an
increase in heat removal efficiency of the cooling device 10 of the
present invention in comparison to a prior cooling device. The
prior cooling device did not include the heat pipes 14, the liquid
chamber 15, or the cavity 11r. Both cooling devices had sixty (60)
twin fins 21 connected with their respective cores 11, a height of
50 mm (excluding the fan), and a diameter of 69 mm measured at the
outer edges 25 of the twin fins 21. The prior cooling device had a
mass of 900 grams. In contrast, the cooling device 10 had a mass of
500 grams. The mass of both cooling devices did not include the
mass of the Delta cooling fans. The cooling device 10 included two
heat pipes 14 with a diameter of 8.0 mm and made by YC Tek.
[0069] In Table 1, the case temperature is a temperature measured
at the component 50 (e.g. at the surface 51) after the component 50
has reached a stable temperature so that a temperature difference
.DELTA.T between the case temperature and the ambient temperature
can be measured. A thermal resistance of the cooling devices is
calculated by dividing the .DELTA.T by a thermal output of the
component 50 in Watts (e.g. .DELTA.T/W). Accordingly, for the
cooling device 10, the thermal resistance was ([41.degree.
C.-25.degree. C.].fwdarw.100 W=0.16.degree. C./W ). With 100 W of
power dissipation from the components 50, the cooling device 10 had
a 6.degree. C. lower case temperature resulting in a 0.06.degree.
C./W lower thermal resistance for an improvement of 27% when
compared with the prior cooling device (e.g.
[{(0.22-0.16)/0.22}*100]=27.2727%). Another advantage of the
cooling device 10 is that its mass is lower by 400 grams (i.e. 900
grams-500 grams) when compared to the cooling device without the
heat pipes 14. TABLE-US-00001 TABLE 1 A Prior Cooling A Cooling
Device 10 with Device without Heat Pipes 14 and Data heat pipes 14
Liquid Chamber 15 Mass of Cooling 900 grams 500 grams Device
Thermal Output of 100 W 100 W Component Fan Type Delta EFB0712EH
Delta EFB0712EH Case Temperature 47.degree. C. 41.degree. C.
Ambient Temperature 25.degree. C. 25.degree. C. Thermal Resistance
0.22.degree. C./W 0.16.degree. C./W Improvement 0% 27%
[0070] Referring to FIG. 14a, the air flow F can be in a direction
from the leading edges 26 to the trailing edges 24 or from the
trailing edges 24 to the leading edges 26. Accordingly, an air flow
source, such as a fan, can either push or pull air through the
slots S and over the vanes 23. The air flow F entering the chamber
30 can also circulate over the top face 13 to dissipate the waste
heat H.sub.w from the core 11. The core 11 can have a length L that
is long relative to a width W of the core 11 (see FIG. 7a) so that
an aspect ratio (L/W) of the core 11 is large and the waste heat
H.sub.w is thermally conducted up the core 11 towards the top face
13. As was described above, the roots 27 and grooves G can span
substantially all of the length L so that the waste heat H.sub.w is
transferred from the core 11 to the twin fins 21 along the entire
length of the roots 27. The core 11 can be made from a high thermal
conductivity material (e.g. copper or graphite) that efficiently
conducts the waste heat H.sub.w upward along the axis Z and outward
towards the twin fins 21 so that the waste heat H.sub.w is spread
over a larger area.
[0071] In FIG. 15, the roots 27 of the twin fins 21 can be
connected with the grooves G using a clamp 41 that clamps around an
ear 27L on the root 27. The clamp 41 can be a C-clamp, a clamping
ring, or the like and can exert a force on the roots 27 that urges
the roots 27 into firm contact with the grooves G. As described
above, a thermal interface material or a thermal sealant material
can be applied to the roots 27 and/or the grooves G to reduce
thermal resistance between the core 11 and the twin fins 21.
[0072] One example of an implementation of the clamp 41 is depicted
in FIG. 16, where the clamp 41 includes a clamp body 43 with a gap
43g (see dashed line) in the clamp body 43. At the gap 43g, the
clamp body 43 is split into two parts 43a and 43b with an aperture
41a formed in both parts (43a, 43b). The aperture 41a can receive a
fastener or the like to urge the two parts (43a, 43b) together so
that a clamping force is exerted on the roots 27 of the twin fins
21 by a clamping surface 41c. The clamping force urges the roots 27
into contact with the grooves G.
[0073] In FIG. 17, as one example of an air flow source 70, a fan
can be mounted on the cooling device 10. The mounting can be
accomplished using a mounting ring 80 that abuts with the lips 22
on the outer edges 25 of the vanes 23. Holes (not shown) formed in
the fan and the mounting ring 80 can accommodate fasteners 73 and
75 (e.g. a nut and bolt) that pass through holes to connect the air
flow source 70 with the mounting ring 80. The blades (not shown) of
the air flow source 70 may be positioned inside the chamber 30 or
outside the chamber 30. The air flow source 70 generates the air
flow F and the air flow source 70 can push or pull air through the
cooling device 10.
[0074] Alternatively, in FIG. 18, as another example of an air flow
source 79, a system fan or the like supplies an air flow F.sub.s
that flows through the slots S and over the vanes 23 to dissipate
heat from the core 11. The air flow F.sub.s is a system air flow in
that other components in the system including the cooling device 10
and the component 50 are cooled by the air flow F.sub.s. The air
flow source 79 can be an axial fan, a blower, or an air
conditioning unit, for example. The air flow source 79 can supply
the air flow F.sub.s through one or more conduits and a duct
connected with one of the conduits can direct a portion of the
airflow F.sub.s to the cooling device 10. For example, the duct can
be positioned adjacent to the chamber 30 so that the air flow
exiting the duct passes through the slots S and over the vanes
23.
[0075] In FIG. 19, a system 200 for dissipating waste heat H.sub.w
from a component can include the cooling device 10 and the air flow
source 70 as described above. The air flow source 70 can be an
axial electric fan, for example. The base 100 can be used to
position the mounting surface 105 in thermal communication with the
component 50 to be cooled. Optionally, the thermal interface
material 40 can be used to thermally communicate the waste heat
H.sub.w from the component 50 to the mounting surface 105 and into
the liquid chamber 15. The base 100 can be mounted on a substrate
60, such as a PC board, for example, that carries the component 50.
The base 100 can be mounted with the substrate 60 using fasteners
65 inserted through the mounting holes 101 in the base 100.
[0076] In contrast, a system 200 for dissipating waste heat H.sub.w
from a component can include the cooling device 10 and the air flow
source 79 as depicted in FIG. 20, where a system fan supplies the
air flow F.sub.s. As described above, the base 100 can be mounted
to a PC board that carries the component 50. The core 11 can be
positioned so that the air flow F.sub.s and the axis Z are aligned
with each other. The alignment may be used to improve air flow
through the slots S, over the top face 13, and over the vanes
23.
[0077] The twin fins 21 can be made from a variety of thermally
conductive materials including but not limited to aluminum (Al),
copper (Cu), silver (Ag), gold (Au), alloys of those materials, and
a high thermal conductivity resin. Preferably, the vanes 23 and the
root 27 are a homogenous unit, that is, they are a unitary whole.
The twin fins 21 can be manufactured using a pressing or stamping
process. A bending or rolling process can be used to form the
arcuate profile 23a or to form an angular or non-planar profile on
the vanes 23. As an example, the twin fins 21 can be stamped from a
sheet of material, such as a copper (Cu) sheet or an aluminum (Al)
sheet.
[0078] As another example, the twin fins 21 can be molded from a
high thermal conductivity material such as a resin or a carbon
fiber re-aligned resin. The vanes 23 need not be identical among
the twin fins 21. Because the twin fins 21 are attached by their
roots 27 to the core 11, twin fins 21 with vanes 23 that differ in
size and shape can be connected with the core 11 via the grooves
G.
[0079] The heat pipes 14 can be an off-the-shelf commercially
available model or a custom made model. The heat pipes 14 can be
supplied by a company such as Thermacore.RTM. or Yeh-Chiang
Technology Corporation.RTM. (YC Tek), for example. Suitable
materials for the heat pipe 14 include but are not limited to
cooper (Cu) and aluminum (Al). The heat pipes 14 can be a solid
heat pipe or hollow heat pipe including a working fluid and a
wicking/capillary structure. Those skilled in the art will
appreciate that other mean can be used to connect the heat pipe 14
with the apertures (15a, 20b) including but not limited to welding,
brazing, soldering, and press fitting, just to name a few.
[0080] The core 11, the plate 20, the liquid chamber 15, the lid
15t, and the base 100 can also be made from a variety of thermally
conductive materials including but not limited to aluminum (Al),
copper (Cu), silver (Ag), gold (Au), alloys of those materials,
silicon (Si) substrate, thermally conductive resins, and graphite.
The core 11 and the plate 20 can be manufacture using processes
including but not limited to casting, forging, extruding, and
machining. The groves G or the projections 12 can be machined in
the core 11 or they can be formed during the casting, forging, or
extruding processes. As one example, the core 11 can be made using
a forging process or an impact forging process. A shape of the core
11 as well as the grooves G can be directly forged. The cavity 11r
and the aperture 19a can be machined by a process such as milling,
for example. The cavity 11r can also be formed from a casting
process and if necessary subsequently machined to shape. The core
11 can have any shape and need not have a circular or cylindrical
shape as depicted herein. The core 11 and the twin fins 21 can be
made from dissimilar materials. As an example, the core 11 can be
made from graphite and the twin fins 21 can be made from copper
(Cu).
[0081] Alternatively, the core 11 can be copper (Cu) and the twin
fins 21 can be made from aluminum (Al). The liquid chamber 15, the
lid 15t, and the base 100 can be made by the processes described
above for the core 11.
[0082] As another example, the base 100 can be machined from a
block of metal (e.g. copper) with the liquid chamber 15 formed in
the same block during the machining of the base 100. The reservoir
15r can be milled out of the liquid chamber 15 and then the
apertures 15a can then be drilled into a sidewall of the liquid
chamber 15 until they extend all the way to the reservoir 15r. The
lid 15t can be machined from metal stock and then connected to the
liquid chamber 15 by brazing or soldering. The liquid 15L can be
dispensed into the reservoir 15r followed by inserting the second
ends 14b of the heat pipes 14 into the apertures 15a so that the
second ends are positioned in the reservoir 15r and are in contact
with the liquid 15L. After the insertion, the heat pipes 14 can be
soldered or brazed to the liquid chamber 15 to seal the liquid 15L
in the reservoir 15r. The plate 20 and apertures 20b can be
machined from metal stock and the first ends 14a of the heat pipes
14 can be inserted through the apertures 20b and then the heat pipe
14 can be soldered, brazed, or welded to the apertures 20b. The
cavity 11r of the core 11 can be filled with the liquid 11L and
then the plate 20 can be positioned in the aperture 19a on the
bottom face 19 so that the first ends 14a are positioned in the
cavity 11r and are in contact with the liquid 11L. The plate 20 can
then be soldered, brazed, or welded to the core 11 thereby sealing
the liquid 11L in the cavity 11r. Suitable materials for the
liquids (11L, 15L) include but are not limited to water (H.sub.2O),
ammonia (NH.sub.3), ammonia (NH.sub.3) plus an ionic surfactant,
acetone, methanol, a heat transfer fluid, and dilute aqueous
solutions of long chain alcohols. Examples of the heat transfer
fluid include but are not limited to a THERMINOL.RTM. brand heat
transfer fluid.
[0083] Although several embodiments of the present invention have
been disclosed and illustrated, the invention is not limited to the
specific forms or arrangements of parts so described and
illustrated. The invention is only limited by the claims.
* * * * *