U.S. patent application number 11/242189 was filed with the patent office on 2006-04-13 for air-conditioning and heating system utilizing thermo-electric solid state devices.
This patent application is currently assigned to TIGERONE DEVELOPMENT, LLC. Invention is credited to William J. Langan, Douglas T. Rice.
Application Number | 20060075758 11/242189 |
Document ID | / |
Family ID | 36143893 |
Filed Date | 2006-04-13 |
United States Patent
Application |
20060075758 |
Kind Code |
A1 |
Rice; Douglas T. ; et
al. |
April 13, 2006 |
Air-conditioning and heating system utilizing thermo-electric solid
state devices
Abstract
In one embodiment, a cooling and heating system includes a heat
exchanger, a thermoelectric cooler coupled to the heat exchanger
and operable to cool or heat a fluid within the heat exchanger, a
heat transfer device, an input conduit coupled between the heat
exchanger and the heat transfer device, a return conduit coupled
between the heat exchanger and the heat transfer device, and a pump
operable to transport the fluid through the input conduit, the heat
exchanger, the return conduit, and the heat transfer device.
Thermal energy existing within the fluid, while flowing through the
heat transfer device, is utilized to heat or cool an environment
adjacent the heat transfer device.
Inventors: |
Rice; Douglas T.; (Veradale,
WA) ; Langan; William J.; (Spokane, WA) |
Correspondence
Address: |
BAKER BOTTS L.L.P.
2001 ROSS AVENUE
SUITE 600
DALLAS
TX
75201-2980
US
|
Assignee: |
TIGERONE DEVELOPMENT, LLC;
|
Family ID: |
36143893 |
Appl. No.: |
11/242189 |
Filed: |
October 3, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60616678 |
Oct 7, 2004 |
|
|
|
Current U.S.
Class: |
62/3.3 ;
62/434 |
Current CPC
Class: |
B60H 1/00478 20130101;
F25B 21/04 20130101; F25B 25/00 20130101 |
Class at
Publication: |
062/003.3 ;
062/434 |
International
Class: |
F25B 21/02 20060101
F25B021/02; F25D 17/02 20060101 F25D017/02 |
Claims
1. A cooling and heating system, comprising: a heat exchanger; a
thermoelectric cooler coupled to the heat exchanger and operable to
cool or heat a fluid within the heat exchanger; a heat transfer
device; an input conduit coupled between the heat exchanger and the
heat transfer device; a return conduit coupled between the heat
exchanger and the heat transfer device; a pump operable to
circulate the fluid through the input conduit, the heat exchanger,
the return conduit, and the heat transfer device; and wherein
thermal energy existing within the fluid while flowing through the
heat transfer device is utilized to heat or cool an environment
adjacent the heat transfer device.
2. The cooling and heating system of claim 1, further comprising a
fan adjacent the heat transfer device and operable to force air
over the heat transfer device.
3. The cooling and heating system of claim 1, further comprising a
heat transfer structure coupled to the thermoelectric cooler and
operable to remove thermal energy from the thermoelectric
cooler.
4. The cooling and heating system of claim 1, further comprising a
fan adjacent the heat transfer structure and operable to force air
over the heat transfer structure to aid in removing the thermal
energy.
5. The cooling and heating system of claim 1, wherein the pump
comprises a magnetic pump and is coupled to the return conduit.
6. The cooling and heating system of claim 1, further comprising a
thermostat controller module operable to control the temperature of
one side of the thermoelectric cooler.
7. The cooling and heating system of claim 1, wherein the heat
exchanger comprises an upper section having a first passageway and
a lower section having a second passageway, the first and second
passageways separated by a copper plate.
8. The cooling and heating system of claim 1, wherein the fluid
comprises a combination of glycol and distilled water.
9. The cooling and heating system of claim 1, wherein the input
conduit, the heat exchanger, the return conduit, and the heat
transfer device comprise a closed loop system.
10. The cooling and heating system of claim 9, wherein the fluid is
introduced to the closed loop system via a valve assembly coupled
to the input conduit.
11. The cooling and heating system of claim 1, wherein the heat
transfer device is coupled to a limb of a patient.
12. The cooling and heating system of claim 1, wherein the heat
transfer device comprises a radiator of an automobile.
13. A cooling and heating method, comprising: coupling together an
input conduit, a heat exchanger, a return conduit, and a heat
transfer device to form a closed loop; coupling a thermoelectric
cooler to the heat exchanger; cooling or heating a fluid within the
heat exchanger; circulating the fluid through the input conduit,
the heat exchanger, the return conduit, and the heat transfer
device; and heating or cooling an environment adjacent the heat
transfer device via thermal energy existing within the fluid while
the fluid is flowing through the heat transfer device.
14. The cooling and heating method of claim 13, further comprising
forcing air over the heat transfer device via a fan adjacent the
heat transfer device.
15. The cooling and heating method of claim 13, further comprising
coupling a heat transfer structure to the thermoelectric cooler to
remove thermal energy from the thermoelectric cooler.
16. The cooling and heating method of claim 15, further comprising
forcing air over the heat transfer structure to aid in removing the
thermal energy.
17. The cooling and heating method of claim 13, further comprising
control the temperature of one side of the thermoelectric
cooler.
18. The cooling and heating method of claim 13, wherein the fluid
comprises a combination of glycol and distilled water.
19. The cooling and heating method of claim 13, further comprising
coupling the heat transfer device to a limb of a patient.
20. The cooling and heating method of claim 13, wherein the heat
transfer device comprises a radiator of an automobile.
21. A cooling and heating system, comprising: a heat exchanger; a
plurality of thermoelectric coolers coupled to the heat exchanger
and operable to cool or heat a fluid within the heat exchanger; and
wherein the heat exchanger comprises an upper section having a
first passageway and a lower section having a second passageway,
the first and second passageways separated by a copper plate.
22. The cooling and heating system of claim 21, further comprising
a heat transfer structure coupled to the thermoelectric coolers and
operable to remove thermal energy from the thermoelectric
coolers.
23. The cooling and heating system of claim 22, further comprising
a fan adjacent the heat transfer structure and operable to force
air over the heat transfer structure to aid in removing the thermal
energy.
24. The cooling and heating system of claim 21, wherein the fluid
comprises a combination of glycol and distilled water.
25. The cooling and heating system of claim 21, wherein the copper
plate is approximately 1/4 inches thick.
Description
RELATED APPLICATIONS
[0001] This application claims the priority under 35 U.S.C.
.sctn.119 of provisional application Ser. No. 60/616,678 filed Oct.
7, 2004.
FIELD OF THE INVENTION
[0002] This invention relates generally to heating and cooling
systems and, more particularly, to a closed-loop air-conditioning
and heating system utilizing thermo-electric solid state
devices.
BACKGROUND OF THE INVENTION
[0003] Conventional air conditioner systems in automobiles include
many moving parts, including compressors, condensers, and
evaporators. The compressor is typically driven by a belt coupled
to the automobile's engine. Hence, the engine needs to be operating
when cool air is desired within the vehicle, which wastes
considerable fuel and further pollution of the atmosphere. In
addition, these moving parts, including the engine, are noisy and
are subject to wear and tear.
SUMMARY OF THE INVENTION
[0004] In one embodiment, a cooling and heating system includes a
heat exchanger, a thermoelectric cooler coupled to the heat
exchanger and operable to cool or heat a fluid within the heat
exchanger, a heat transfer device, an input conduit coupled between
the heat exchanger and the heat transfer device, a return conduit
coupled between the heat exchanger and the heat transfer device,
and a pump operable to transport the fluid through the input
conduit, the heat exchanger, the return conduit, and the heat
transfer device. Thermal energy existing within the fluid, while
flowing through the heat transfer device, is utilized to heat or
cool an environment adjacent the heat transfer device.
[0005] Some embodiments of the invention provide numerous technical
advantages. Other embodiments may realize some, none, or all of
these advantages. For example, in one embodiment, a closed-loop
cooling and heating system includes thermo-electric coolers (TECs)
that cool or heat a liquid flowing through the closed-loop system.
The liquid may then be pumped through a heat transfer device that
is used to heat or cool an environment. Depending on the
application, this may include the use of forced air. Such a system
may be used for automotive heating or cooling purposes or used in
medical device applications. In an automotive application, for
example, such a system is an electronic, non-pressurized system
that may run on battery power alone and include no hazardous
materials, no moving parts (other than a pump), and be
cost-effective.
[0006] Other technical advantages are readily apparent to one
skilled in the art from the following figures, descriptions, and
claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 is a schematic of a cooling and heating system
according to one embodiment of the invention; and
[0008] FIG. 2 is a schematic of a heat exchanger for use in the
system of FIG. 1 according to one embodiment of the invention.
DETAILED DESCRIPTION
[0009] FIG. 1 is a schematic of a cooling and heating system 100
according to one embodiment of the invention. System 100 may be
utilized in any suitable application, such as automotive
applications, medical device applications, or other suitable
applications that require the cooling or heating of an environment
130, as described in greater detail below. In the illustrated
embodiment, system 100 includes an input conduit 110, a heat
transfer device 108, a return conduit 112, and a heat exchanger 102
that collectively form a closed-loop system. In other embodiments,
however, system 100 may be an open-loop system. System 100 also
includes one or more thermoelectric coolers ("TECs") coupled to
heat exchanger 102 and operable to cool or heat a fluid 106 flowing
through system 100, a shutoff valve 116, an input coupler valve
118, a bleeder valve 120, a fan 122, a heat transfer structure 124,
and a fan 126. The present invention contemplates more, fewer, or
different components than those illustrated in FIG. 1.
[0010] Heat exchanger 102 is described in greater detail below in
conjunction with FIG. 2. Generally, heat exchanger 102 includes a
passageway therein that allows fluid 106 to flow therethrough while
being cooled or heated by thermal energy generated from TECs 104.
TECs 104 may be any thermoelectric coolers that are operable to
cool or heat fluid 106 within heat exchanger 102. TECs 104 may
couple to an outside surface of heat exchanger 102 in any suitable
manner. Any suitable number and type of TECs 104 is contemplated by
the present invention depending on the desired amount of cooling or
heating of fluid 106 flowing through heat exchanger 102.
[0011] Heat transfer structure 124 is coupled to TECs 104 and is
operable to remove thermal energy from TECs 104. For example,
during operation of TECs 104, the sides of TECs 104 that are
coupled to heat exchanger 102 may be cooling fluid 106 within heat
exchanger 102. In this case, it is desirable for heat to be removed
from the opposite sides of TECs 104 in order to increase the
efficiency of TECs 104. Therefore, heat transfer structure 124 is
operable to aid in removing heat from TECs 104. Any suitable heat
transfer structure is contemplated by the present invention, such
as a finned structure. To aid in removing heat from TECs 104,
optional fan 126 may be coupled to or positioned adjacent heat
transfer structure 124 to force air over heat transfer structure
124. Any suitable fan 126 is contemplated by the present invention.
In other embodiments, other suitable additional cooling methods for
heat transfer structure 124 are contemplated by the present
invention, such as running a fluid through heat transfer structure
124.
[0012] Heat transfer device 108 may be any suitable device or
structure that is utilized to cool or heat environment 130 as a
result of the thermal energy contained in fluid 106 flowing through
heat transfer device 108. Heat transfer device 108 may be any
suitable size and shape and may take any suitable form depending on
the application for system 100. For example, heat transfer device
108 may be a radiator of an automobile or a medical device that is
coupled to a limb of a patient. In another automotive application,
heat transfer device 108 may function as a heater core that is
utilized to cool or heat the inside of an automobile or other
suitable vehicle by forcing air over heat transfer device 108 via
fan 122, which may be any suitable fan. Other applications for heat
transfer device 108 are contemplated by the present invention, and
the thermal energy of fluid 106 flowing through heat transfer
device 108 may be utilized in any suitable manner to cool or heat
environment 130.
[0013] Both input conduit 110 and return conduit 112 may be any
suitable conduits operable to transport fluid 106 therethrough.
Conduits 110 and 112 may be any suitable length and any suitable
diameter. Conduits 110 and 112 may be rigid conduits, flexible
conduits, or a combination of rigid and flexible conduits. For
example, a portion of conduit 110 and/or conduit 1 12 may be
manufactured from high pressure flex hose. Any suitable coupling
methods may be utilized to couple conduits 110 and 112 to
respective components of system 100.
[0014] Pump 114 is utilized to circulate fluid 106 through system
100. Any suitable pump is contemplated by the present invention. In
one particular embodiment of the invention, pump 114 is a magnetic
pump and is coupled to return conduit 112. However, pump 114 may
also be coupled to input conduit 110. Any suitable size pump is
contemplated by the present invention.
[0015] Fluid 106 may be any suitable fluid. In a preferred
embodiment of the invention, fluid 106 is a combination of glycol
and distilled water. However, other suitable glycol-base fluids are
contemplated by the present invention. In other embodiments, water,
antifreeze, or ethanol with a water base and water wetter
dispersant may be utilized for fluid 106. Fluid 106 may be injected
or otherwise introduced into system 100 via input coupler valve
118, which may be coupled to input conduit 110 in any suitable
manner.
[0016] Bleeder valve 120 may be used to purge system 100 of all air
during the fluid input injection process. As fluid 106 is injected
into system 100 via input coupler valve 118, bleeder valve 120
allows the air in system 100 to be bled off until all air is purged
and there is a constant flow of fluid 106, at which time bleeder
valve 120 is then closed. The air and fluid 106 being bled off
comes from the output of heat exchanger 102. Shutoff valve 116 is
used to prevent any backflow of air or fluid 106 into bleeder valve
120 during the fluid input injection process. Shutoff valve 116 is
closed off, which allows the air and fluid 106 to follow the flow
indicated by the arrows. Once system 100 is charged (all air is
purged), shutoff valve 116 is then opened to allow complete
unrestricted closed-loop flow through system 100.
[0017] Although not illustrated in FIG. 1, in order for TECs 104 to
cool or heat fluid 106 flowing through heat exchanger 102, power
must be delivered to TECs 104. This power may originate from any
suitable power source and may be any suitable power level. For
example, a suitable DC current may be delivered to TECs 104 to cool
or heat fluid 106 flowing through heat exchanger 102 depending upon
the polarity of the DC current. Also not illustrated in FIG. 1, a
thermostat controller module may be coupled to TECs 104 in order to
control the temperature of the sides of TECs 104 that are in
contact with heat exchanger 102. Any suitable thermostat controller
module is contemplated by the present invention.
[0018] FIG. 2 is a schematic of heat exchanger 102 according to one
embodiment of the invention. In the embodiment illustrated in FIG.
2, heat exchanger 102 comprises an upper section 200 having a first
passageway 201 and a lower section 202 having a second passageway
203. A metal plate 204 is sandwiched between upper section 200 and
lower section 202.
[0019] Heat exchanger 102 may have any suitable size and shape and
may be formed from any suitable material. For example, in the
embodiment illustrated in FIG. 2, both upper section 200 and lower
section 202 are formed from a suitable metal, such as aluminum
having any suitable thickness. In the illustrated embodiment, the
thickness of both upper section 200 and lower section 202 is
approximately one inch. Upper portion 200 and lower portion 202
have recesses 207, 208 respectively, for accepting metal plate 204.
Recesses 207, 208 preferably match the contour of metal plate 204.
In addition, the depth of recesses 207, 208 is preferably
approximately half the thickness of metal plate 204. Therefore,
when metal plate 204 is sandwiched between upper section 200 and
lower section 202 then upper section 200 and lower section 202 may
be coupled to one another around their perimeters. For example, any
suitable coupling method is contemplated by the present invention,
such as welding.
[0020] Passageways 201, 203 formed in upper section 200 and lower
section 202, respectively, may have any suitable configuration and
any suitable volume. In the illustrated embodiment, passageways
201, 203 take the form of a serpentine configuration for fluid 106
to flow therethrough. Passageways 201 and 203 are coupled to one
another by a hole 205 formed in one end of metal plate 204.
[0021] Metal plate 104 may be any suitable size and shape and may
be formed from any suitable metal, such as copper. Metal plate 104
may also have any suitable thickness, such as 1/4 inch. Each of the
passageways 201, 203 are in contact with respective sides of metal
plate 204 so that fluid 106 flowing through passageways 201, 203
contact metal plate 204. This allows metal plate 204 to absorb
thermal energy from fluid 106 flowing through upper portion 200 and
transfer some of that thermal energy to the fluid 106 when it flows
through passageway 203 of lower section 202.
[0022] In one embodiment, fluid 106 enters passageway 201 via
opening 209 in upper section 200. Fluid 106 then flows through
passageway 201 until it gets to an end 210 of passageway 201 before
traveling through hole 205 down to passageway 203. Fluid 106 then
travels through passageway 203 until reaching an outlet opening 211
in bottom section 202. As fluid 106 flows through passageway 201,
TECs 104 either cool or heat fluid 106. Some of the thermal energy
from fluid 106 as it flows through passageway 201 is absorbed by
metal plate 204 so that as the fluid flows through passageway 203
in bottom section 202 the fluid 106 is not only cooled or heated by
thermoelectric coolers 104 coupled to bottom section 202, but also
cooled or heated from the thermal energy existing within metal
plate 204.
[0023] Referring back to FIG. 1, in one embodiment of the invention
where fluid 106 is utilized to cool environment 130, fluid 106 is
injected into system 100 via input coupler valve 118. Pump 114 is
used to circulate 106 through system 100. Fluid 106 enters heat
exchanger 102 where it is cooled by thermoelectric coolers 104 as
described above in conjunction with FIG. 2. Heat transfer structure
124 with or without fan 126 is utilized to remove heat from the
outside surfaces of TECs 104 in order to increase the efficiency of
TECs 104. The fluid exits heat exchanger 102 and travels through
input conduit 110 to heat transfer device 108. Fluid 106 flows
through heat transfer device 108 in order to cool environment 130
with or without the help of fan 122. Fluid 106 is then returned to
heat exchanger 102 via return conduit 112. Fluid 106 then
continually travels through this closed loop system 100.
[0024] Thus, system 100 in one embodiment is a closed-loop cooling
and heating system that includes thermoelectric coolers 104 that
cool or heat fluid flowing through system 100. It is a
Freon.RTM.-free, non-pressurized system that is based on
electronics and is used to cool or heat an environment. System 100
may be utilized in any suitable environment and application. For
example, system 100 may be utilized in an environment having an
ambient temperature of somewhere between -10.degree. F. and
+120.degree. F. As described above, any suitable number of
applications is contemplated by the present invention, such as
automotive applications, medical device applications, or other
suitable applications.
[0025] Although embodiments of the invention and their advantages
are described in detail, a person skilled in the art could make
various alterations, additions, and omissions without departing
from the spirit and scope of the present invention as defined by
the appended claims.
* * * * *