U.S. patent application number 11/265386 was filed with the patent office on 2006-03-16 for piezoelectric actuator and pump using same.
This patent application is currently assigned to PAR TECHNOLOGIES LLC. Invention is credited to W. Joe East.
Application Number | 20060056999 11/265386 |
Document ID | / |
Family ID | 22876498 |
Filed Date | 2006-03-16 |
United States Patent
Application |
20060056999 |
Kind Code |
A1 |
East; W. Joe |
March 16, 2006 |
Piezoelectric actuator and pump using same
Abstract
A method of manufacturing piezoelectric actuators (14) is
disclosed along with a miniature diaphragm pump (10) using the
actuators. The object was an actuator which could be used in
miniature diaphragm pumps and other applications and which would be
smaller in size and simpler to manufacture than prior art
actuators, yet would provide forces and displacements an order of
magnitude higher than any previously known devices of similar size.
The pump (10) incorporates the new actuator along with a novel
one-way valve (200) and a small driver circuit (18). The pump is of
direct application in the liquid cooling systems of small
computers, and in other fluid systems.
Inventors: |
East; W. Joe; (Newport News,
VA) |
Correspondence
Address: |
NIXON & VANDERHYE, PC
901 NORTH GLEBE ROAD, 11TH FLOOR
ARLINGTON
VA
22203
US
|
Assignee: |
PAR TECHNOLOGIES LLC
Hampton
VA
|
Family ID: |
22876498 |
Appl. No.: |
11/265386 |
Filed: |
November 3, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10380547 |
May 28, 2003 |
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PCT/US01/28947 |
Sep 14, 2001 |
|
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11265386 |
Nov 3, 2005 |
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60233248 |
Sep 18, 2000 |
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Current U.S.
Class: |
417/413.2 ;
310/328 |
Current CPC
Class: |
F04B 43/046 20130101;
H01L 41/0973 20130101; H01L 41/0477 20130101; H01L 41/047 20130101;
Y10T 29/42 20150115; Y10T 29/49128 20150115; H01L 41/29 20130101;
H01L 41/042 20130101 |
Class at
Publication: |
417/413.2 ;
310/328 |
International
Class: |
F04B 17/03 20060101
F04B017/03; H01L 41/053 20060101 H01L041/053 |
Claims
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29. A piezoelectric actuator comprising: a first metallic layer; a
piezoelectric element having a first surface adhered to the first
metallic layer, the piezoelectric element also having a second
surface which is opposite the first surface; a second metallic
layer adhered to the second surface of the piezoelectric element;
wherein a ratio of thickness of the first metallic layer to
thickness the second metallic layer is about 2:1.
30. The apparatus of claim 29, wherein the first metallic layer is
stainless steel and the second metallic layer is aluminum.
31. The apparatus of claim 29, wherein a ratio of thickness of the
piezoelectric element to thickness of the first metallic layer is
about 2:1.
32. The apparatus of claim 29, wherein the first metallic layer has
a greater surface area than the piezoelectric element and the
piezoelectric element has a greater surface area than the second
metallic layer.
33. The apparatus of claim 29, wherein the first metallic layer has
a greater diameter than the piezoelectric element and the
piezoelectric element has a greater diameter than the second
metallic layer.
34. The apparatus of claim 29, wherein the first surface of the
piezoelectric element is adhered to the first metallic layer by a
polyimide adhesive, and wherein the second metallic layer is
adhered to the second surface of the piezoelectric element by the
polyimide adhesive.
35. A pump comprising: a body for at least partially defining a
pumping chamber; at least one piezoelectric actuator which, during
application of an electric field, acts upon a fluid in the pumping
chamber, the piezoelectric actuator comprising a first metallic
layer secured to a first surface of the piezoelectric element and a
second metallic layer secured to a second surface of the
piezoelectric element, the second surface being opposite the first
surface; wherein the first metallic layer has a larger surface area
than the piezoelectric element so that the piezoelectric element is
setback from an edge of the first metallic layer; wherein the
piezoelectric element is substantially enclosed between the first
metallic layer and the second metallic layer except insofar as the
second metallic layer is setback from an edge of the piezoelectric
element in view of the second metallic layer having a smaller
surface area than the piezoelectric element; wherein the first
metallic layer has a rim which serves as a clamping surface for
clamping the piezoelectric actuator in position within the
body.
36. The apparatus of claim 35, wherein the second metallic layer
does not serve to clamp the piezoelectric actuator in position
within the body.
37. The apparatus of claim 35, wherein the piezoelectric element
comprises a polycrystalline material.
38. The apparatus of claim 35, wherein the first metallic layer
comprises stainless steel.
39. The apparatus of claim 35, wherein the piezoelectric actuator
further comprises a polyimide adhesive which adheres at least one
of (1) a first surface of the piezoelectric element to the first
metallic layer; and (2) a second surface of the piezoelectric
element to the second metallic layer.
40. The apparatus of claim 35, wherein the second metallic layer
comprises aluminum.
41. The apparatus of claim 35, wherein relative sizes of the
surface area of the second metallic layer and the piezoelectric
element are chosen to prevent arcing over of a driving voltage from
the second metallic layer to the first metallic layer.
42. The apparatus of claim 35, wherein the body has a port which is
situated so that fluid traveling between the port and the pumping
chamber travels in a direction parallel to a plane of the
piezoelectric actuator.
43. The apparatus of claim 35, wherein the body has a port which is
situated so that fluid traveling between the port and the pumping
chamber travels in a direction perpendicular to a plane of the
piezoelectric actuator.
44. The apparatus of claim 35, further comprising a second
piezoelectric actuator which is situated in mirror image
positioning to the at least one piezoelectric actuator with respect
to the pumping chamber.
45. The apparatus of claim 35, further comprising a sealing member
which provides a seal between the piezoelectric actuator and the
body and which defines a thickness of the pumping chamber, the
thickness of the pumping chamber facilitating self-priming of the
pump.
46. The apparatus of claim 35, wherein the piezoelectric actuator
is substantially unconstrained in its placement in the body except
by being secured to the first metallic layer.
47. The apparatus of claim 35, wherein the piezoelectric actuator
has mechanical contact with the body only through the rim of the
first metallic layer.
Description
[0001] This application claims the benefit of U.S. Provisional
Patent Application No. 60/233248 filed 18 Sep. 2000[18/09/00].
TECHNICAL FIELD
[0002] The present invention is in the field of the manufacture of
ferroelectric actuators and miniature diaphragm pumps using these
actuators as the prime mover. In the best mode the actuators are
piezoelectric.
BACKGROUND ART
[0003] The prior art for this invention may be grouped as follows:
[0004] I. U.S. Pat. Nos. 5,471,721, 5,632,841, 5,849,125,
6,162,313, 6,042,345, 6,060,811, and 6,071,087 showing either
prestressing of piezoelectric actuators, or dome-shaped
piezoelectric actuators, or both. This prior art is generally
inapposite because the present invention does not use a prestressed
or dome-shaped piezoelectric actuator. [0005] II. U.S. Pat. Nos.
6,179,584, 6,213,735, 5,271,724, 5,759,015, 5,876,187, 6,227,809
showing so-called micropumps. Such pumps generally pump only a drop
of fluid at a time; because of the small forces and low Reynolds
numbers involved, this prior art is generally inapposite. [0006]
III. U.S. Pat. Nos. 4,034,780, 4,095,615 showing flapper valves.
These are flappers mounted on a separate hinge. No prior art was
found showing a flex valve with a miniature pump. [0007] IV. U.S.
Pat. Nos. 5,084,345, 4,859,530, 3,936,342, 5,049,421 showing use of
polyimide adhesives for various purposes, including bonding metals
and other materials to film. [0008] V. U.S. Pat. Nos. 4,939,405,
5,945,768 showing electrical driver circuits for piezoelectric
actuators. [0009] VI. U.S. Pat. Nos. 6,227,824, 6,033,191,
6,109,889, German WO 87/07218 showing various kinds of pumps
incorporating piezoelectric actuators.
DISCLOSURE OF INVENTION
[0010] This invention is a method for making a high-displacement
ferroelectric actuator, in this case a piezoelectric actuator. This
piezoelectric actuator may then be used as the diaphragm in a small
diaphragm pump. The pump is small, lightweight, quiet, and
efficient. The best mode, a round pump about 40 mm[1.5''] in]
diameter by about 13 mm[0.5'']thick and weighing approximately 35 g
[one ounce], can pump upwards of 450 milliliters of water or other
fluids per minute. These pumping rates are accomplished using a
six-volt battery at 25 ma driving through a small electronic driver
circuit, approximately 25 mm [1''] square. This circuit forms part
of the invention. The one way valve[s] necessary for operation of
the invention are flex valves in which a thin film of polyimide
acts as the working element.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is a perspective view of the pump of the invention
with the parts in the positions they would be for the best
mode.
[0012] FIG. 2 is a sectional view of the pump along line 2-2 of
FIG. 1.
[0013] FIG. 3 is a sectional view of the press used to make the
piezoelectric actuators of the invention.
[0014] FIG. 4 shows the driver circuit for the piezoelectric
actuator used with the pump.
[0015] FIG. 5 is a partially diagrammatic view showing an
alternative embodiment of the invention in which the pump chamber
is reduced in size.
[0016] FIG. 6 is a partially diagrammatic view showing another
alternative embodiment of a pump in which the inlet and outlet are
perpendicular to the plane of the actuator.
BEST MODE FOR CARRYING OUT THE INVENTION
[0017] FIG. 1 shows how the piezoelectric actuator of the present
invention may be used in a miniature diaphragm pump. The pump 10 is
generally in the form of a circular short cylinder. It includes the
pump body 12, piezoelectric actuator 14, pump cover 16 and
piezoelectric actuator electronic driver circuit 18. The pump body
12 has lugs 20 for mounting the pump to any substrate. Inlet 22 and
outlet 24 are part of the pump body 12 though they could be
separate pieces otherwise fastened to the pump body. The pump cover
16 is essentially the same diameter and of the same material as the
pump body 12. The material would ordinarily be of a standard
plastic such as acetal[DELRIN.RTM.], PVC, or PC, or of a metal such
as stainless steel or brass. These are preferable since they can be
easily machined or thermally formed. The cover 16 may be fastened
to the pump body 12 by any means such as by a fast-curing adhesive
while the pump body 12 and cover 16 are under compression such as
by clamping. The pump cover has an opening 26 for venting the space
above the actuator 14.
[0018] The dimensions of the pump depend on the particular
application. In the best mode the pump body 12 is about 40
mm[1.5''] in diameter. A pump chamber 30 is formed in the center of
the pump body 12, for example by molding or machining. The pump
chamber 30 is about 28 mm[1.125''] in diameter or about 3 mm[1/8'']
less in diameter than the diameter of the piezoelectric actuator
14. The chamber 30 is about 6 mm[0.25''] deep. A seat 32 about 3
mm[0.125''] wide and about 2 mm[0.070''] deep is provided in the
pump body 12 at the top of the pump chamber 30. As shown in FIG. 2
the piezoelectric actuator 14 is mounted on the seat 32 to form the
diaphragm in the top of the pump chamber 30.
[0019] To assemble the pump a sealing washer 34 the same diameter
as the piezoelectric actuator is put on the seat 32 to seat the
pump chamber when the piezoelectric actuator 14 is put in place.
The sealing washer 34 may be of a relatively soft material such as
Buna-N or silicon rubber to account for any irregularities in the
mating surfaces and ensure a good seal between the actuator 14 and
the pump body 12. Once the piezoelectric actuator 14 is in place an
o-ring seal 36 is placed on top of the piezoelectric actuator 14 to
hold the piezoelectric actuator 14 in place and seal it from the
cover 16. The cover 16 of the same outside diameter as the pump
body 12 base but only about 1/8'' thick is then put in place.
Sealing washer 34 and o-ring seal 36 are referred to collectively
as the pump seals, even though they both have the additional
function of fixing the actuator 14 in place with respect to the
pump body 12. The cover 16 is then fastened to the body 12 while
under compression, for example by adhesive under clamping pressure,
to seal the piezoelectric actuator 14 to the body 12 and fix the
actuator 14 in place to allow pumping action.
[0020] The process for making the piezoelectric actuator 14
generally is as follows:
[0021] A piezoelectric wafer 38 formed of a polycrystalline
ferroelectric material such as PZT5A available from Morgan Electro
Ceramics is obtained. As the name implies this material is actually
a ceramic. It is processed into the high displacement piezoelectric
actuator 14 by laminating the piezoelectric wafer 38 between a
metal substrate layer 40 and an outer metal layer 42 as shown in
FIG. 2, where the thicknesses of the three layers and the adhesive
between them are exaggerated for clarity. The bonding agent 41
between the layers 38 and 40 is a polyimide adhesive. This
lamination process does several things: It ruggedizes the
piezoelectric actuator 14 because the metal layers keep the
piezoelectric from fracturing during high displacement. It permits
higher voltage due to the relatively low dielectric constant of the
polyimide adhesive, thereby allowing 3-5 times higher displacement
than a conventional piezoelectric. Being laminated between metal
layers using a high performance polyimide adhesive makes the
piezoelectric actuator highly resistant to shock and vibrations.
With this invention piezoelectric actuator devices can be used in
environments as hot as a continuous 200.degree. C., compared to
only 115.degree. C. for a conventional piezoelectric. The
significant increase in temperature is due to the polyimide
adhesive used in the bonding process which is unaffected by
temperatures up to 200.degree. C. Epoxy adhesives used in
conventional piezoelectrics normally can withstand temperatures up
to only 115.degree. C. This increase in operating temperature would
allow the pumps of this invention to be used in a variety of pump
applications, even pumping boiling water continuously.
[0022] The piezoelectric wafers 38 are available from the vendor
mentioned in various shapes and thicknesses. For the invention
circular wafers 25 mm[1''] in diameter and 0.2 mm[0.008''] thick
were found to be optimum. Square wafers were tried but did not give
maximum displacement. In general the thinner the wafer, the greater
the displacement at a given voltage, but the lower the force. The
0.2 mm[8-mil] thickness gives the best flow rate for the diameter
of the wafer.
[0023] In the best mode stainless steel 0.1 mm[0.004''] thick is
used for the substrate layer 40, the layer in contact with the
pumped liquid. Stainless steel is chosen for its compatibility with
many liquids, including water, its fatigue resistance, its
electrical conductivity and its ready availability at low cost.
Aluminum 0.05 mm[0.001''] thick is used for the outer layer 42
primarily for its electrical conductivity in transmitting the
actuating voltage to the piezoelectric wafer 38 across its surface,
but also for its robustness and ready availability at low cost.
[0024] The diameter of the piezoelectric wafer 38 being about 25
mm[1''] as noted above, the diameter of the substrate layer 40 is
about 40 mm[1.25'']. The setback of the wafer 38 from the edge of
the substrate layer 40 is an important feature of the invention.
This leaves a rim that serves as a clamping surface for the
actuator assembly. This means that the entire piezoelectric wafer
38 is free and relatively unconstrained, except insofar as it is
bonded to the substrate 40 and the outer layer 42. This allows
maximum displacement of the actuator 14, ensuring maximum flow of
liquid through the pump.
[0025] The diameter of the outer layer 42 is smaller than the
diameter of the wafer 38. This setback of the outer layer 42 from
the edge of the wafer 38 is done to prevent arcing over of the
driving voltage from the outer layer 42 to the substrate layer
40.
[0026] Other materials and thicknesses may be used for the
enclosing layers 40 and 42 as long as they meet the requirements
noted.
[0027] Of special note is that the piezoelectric actuator of the
invention is flat. In much of the prior art the actuator is
dome-shaped, it being supposed that this shape is necessary for
maximum displacement of the actuator and therefore maximum capacity
of the pump for a given size actuator. Special molds and methods
are proliferated to produce the shapes of the actuator considered
necessary, or to produce a prestress in the actuator that is
supposed to increase its displacement. Our tests of the invention
have shown, however, that a dome shape is not necessary, and that
the flat actuator has a higher pumping capacity for a given size
than any known pump in the prior art. As such the actuator is much
simpler to produce in large quantities, as the following will
demonstrate. The flat shape also means that the pump may be smaller
for a given application. A flat actuator is also inherently easier
to mount in any given application than a dome shaped actuator would
be. Furthermore, pumps using the actuator have been shown to have
sufficiently long life for numerous applications. Many
manufacturers whose names are household words are using or testing
this invention.
[0028] The process for making the piezoelectric actuator 14
specifically is as follows: [0029] 1. The piezoelectric wafer 38
and and enclosing layers 40 and 42 are cleaned using a solvent that
does not leave a residue, such as ethanol or acetone. All oil,
grease, dust and fingerprints must be removed to ensure a good
bond. [0030] 2. The piezoelectric wafer 38 is then coated on both
sides with a thin layer 41, not more than 0.1 mm[0.005''], of a
high performance polyimide gel adhesive such as that available from
Ranbar Inc. The gel should contain a minimum of 25% solids to allow
sufficient material for a good bond after the solvent is driven
off. [0031] 3. The piezoelectric wafer 38 is then placed under a
standard heat lamp for about 5 minutes to remove most of the
solvent from the gel and start the polyimide gel polymerization
process. Both sides of the piezoelectric must be cured under the
heat lamp since both sides are to be bonded to metal. [0032] 4.
Once the adhesive is dry to the touch, the piezoelectric wafer 38
is then placed between the substrate layer 40 and the outer layer
42. [0033] 5. The assembly is placed in a special press. This press
was developed specifically for making piezoelectric actuators 14
and provides uniform temperature and pressure to ensure a good bond
between the three components of the actuator. Referring to the best
mode shown in FIG. 3 the press comprises two 300 mm[12''] square by
6 mm[1/4''] thick plates of aluminum 101 held together with
thumbscrews 102, four on each edge. To ensure uniform pressure
while in the press, the bottom plate 101 of the press is covered
with a sheet of low cost polyimide film 104 such as Upilex
available from Ube Industries Ltd. The piezoelectric actuators 38
are placed on the film and a sheet of high temperature, 4 mm[1/8'']
thick rubber 106 is placed over the piezoelectric actuators. The
rubber on top and the film on bottom cushion the piezoelectric
actuators 38 providing even distribution of pressure when the press
is taken to temperature. Of course other dimensions of the press
plates are possible. [0034] 6. Once the piezoelectric actuators are
placed in the press the thumbscrews 102 are made finger tight.
[0035] 7. The press is then placed in a standard convection oven
for thirty minutes at about 200.degree. C. [0036] 8. The press is
removed from the oven, allowed to cool to a safe temperature, and
the actuators 14 removed from the press.
[0037] The press 100 is the result of an effort to develop a low
cost, rapid process for manufacturing piezoelectric actuators. The
press takes advantage of the thermal expansion of the aluminum
plates 101 which creates the necessary pressure to cause the
polyimide adhesive to bond to the piezoelectric wafer 38 and metal
layers 40, 42 while it is at curing temperature. The press can be
put into the oven, and taken out, while the oven is at temperature
thereby allowing continuous operation during the manufacturing
process. The abrupt change in temperature does not affect the
piezoelectric actuators 14 since they will remain under pressure
even while the press is removed from the oven and allowed to assume
room temperature.
[0038] Of special note is that this press process is one of further
driving off the solvent and curing the polyimide at a relatively
low temperature. Prior art processes for making similar
piezoelectric actuators require the mold/press to be taken to much
higher temperatures, high enough to melt the polyimide adhesive.
Furthermore, since such high temperatures depole the piezoelectric
ceramic, it is necessary to pole it again at the end of the
process. The present invention eliminates this step altogether,
thus contributing to the lower cost of manufacturing the
piezoelectric actuators.
[0039] Using these simple methods and hardware it is possible to
manufacture hundreds of thousands of piezoelectric actuators 14 per
month, or even more, depending on the scale of the operation
desired.
[0040] The principle of the piezoelectric actuator pump 10 is the
same as for any diaphragm pump. Normally the diaphragm in a
diaphragm pump is operated by a cam or a pushrod connected to a
motor or engine. This is not the case in the piezoelectric actuator
pump 10. The piezoelectric actuator 14 acts as the diaphragm and
moves when a pulsed electric field is imposed across the
piezoelectric wafer 38 by means of the enclosing layers 40 and 42.
This varying electric field causes the piezoelectric actuator 14 to
expand and contract. As the actuator 14 expands, with its edge
constrained, it assumes a slight dome shape as the center of the
actuator moves away from the pump chamber 30. This draws liquid
into the pump chamber 30 through the inlet 22. When the
piezoelectric actuator 14 contracts it moves toward the liquid,
forcing it out of the pump chamber 30 through outlet 24.
[0041] One of the problems with prior art piezoelectric actuators
has been the voltage necessary to drive the piezoelectric. To
provide power to the piezoelectric actuator pump 10 the electrical
driver 18 shown in FIG. 4 was invented that converts the voltage
from any six volt d.c. power source to an alternating current of
over 200 volts peak-to-peak This voltage is sufficient in the
preferred embodiment to drive a piezoelectric actuator to attain
the pumping rates noted above. In the circuit in FIG. 4 point A is
connected to the substrate layer 40 while point B is connected to
the outer layer 42.
[0042] Piezoelectric actuators perform better when the peak-to-peak
voltage is not evenly balanced. They respond better to a positive
voltage than the same negative voltage. Thus the circuit 18 has
been designed to produce alternating current with the voltage
offset to 150 volts positive and 50 volts negative. This is
sufficient voltage for the piezoelectric actuator to make a very
efficient pump. While a sinusoidal wave will work, at the lower
frequencies and voltages, a square wave makes the piezoelectric
more efficient. Values of the circuit components in FIG. 4 are as
follows: TABLE-US-00001 R1 - 8 to 20 M.OMEGA. R2 - 8 to 20 M.OMEGA.
R3 - 680 K.OMEGA. R4 - 1 M.OMEGA. C1 - 0.1 .mu.F C2 - 0.1 .mu.F C3
- 0.1 .mu.F[200 v] C4 - 0.47 .mu.F[200] L1 - 680 .mu.H D1 - BAS21
diode
[0043] U1 is an IMP 528 chip designated an electroluminescent lamp
driver. In this circuit, with the other components, it serves to
shape the pulses and amplify them to the 200 volt peak-to-peak
value needed to drive the piezoelectric actuator 14. The values of
R1 and R2 are chosen to vary the frequency of the output between
about 35 Hz and about 85 Hz, depending on the particular
application.
[0044] This circuit is composed of miniaturized components so it
may be contained in a box 302 approximately 25 mm[1''] square by 6
mm[1/4''] deep. It has only eleven off-the-shelf surface mount
components. The box 302 may be mounted anywhere in proximity to the
pump 10. In the best mode it is mounted on top of the pump, as
shown in FIGS. 1 and 2, for example by an appropriate adhesive.
Leads 15 run from the driver circuit 18 and are fastened to spring
loaded contacts 304 such as those sold by the ECT Company under the
trademark POGO.RTM.. These contacts 304 are mounted in a box 306 on
top of pump cover 16 and project through the pump cover 16 to make
contact with the two layers 40 and 42. This small driver circuit
eliminates the need for the large power supplies and transformers
used in prior art piezoelectric applications. Alternatively the
leads 15 could be run through an opening in the cover 16 and
fastened electrically to the layers 40 and 42, as by soldering.
O-ring 36 is soft enough to accommodate the soldered point on the
substrate layer 42.
[0045] Several conventional types of one-way valves were evaluated
as inlet and outlet valves for the piezoelectric actuator pump 10.
All had various drawbacks including bulk and poor response to the
dynamic behavior of the piezoelectric actuator 14. An inline flex
valve 200 was invented that is well adapted to the action of the
piezoelectric actuator 14 as shown in FIG. 2. The working element
of the flex valve is an elliptical disk 202 of polyimide film about
0.05 mm[0.002''] thick. The disk 202 is the same size and shape as
the end of a short piece of rigid tube 204 formed at about a
45.degree. angle to the axis of the rigid tube 204. The inside
diameter of the rigid tube 204 is the same as the inside diameter
of the inlet 22 or outlet 24 of the pump body 12. Rigid tube 204 is
captured in the end of the flexible system conduit 206 which slips
over the inlet/outlet 22,24 and carries the system liquid, as shown
in FIG. 2. Valve disk 202 is attached to the nether end of the
slanted surface at the point designated 203 by any sufficient means
such as by adhesive or thermal bonding. A similar flex valve 200
may be placed in the outlet 24. Both disks 202 of both valves would
point in the same direction downstream. However, it was found in
operating the pump 10 that it would pump at full capacity with no
valve at all in the outlet. It is postulated that the liquid in the
inlet circuit, even with the inlet valve partially open, provides
enough inertia to act as a closed inlet valve. Operation with only
the inlet valve is considered to be the best mode.
[0046] This flex valve 200 is an important feature of the
invention. It is of absolute minimum bulk. The mass of the disk 202
is also about as light as it could possibly be so it reacts rapidly
to the action of the actuator 14. When it is open it presents
virtually no resistance to the system flow. Mounted at the
45.degree. angle, it has to move through an angle of only
45.degree. to fully open, whereas if it were mounted perpendicular
to the flow it would have to move through an angle twice as large.
It is of extreme simplicity and low cost of materials and
fabrication. Also no part of the valve 200 projects into pump
chamber 30. This minimizes the volume of pump chamber 30 which
helps make the pump self-priming and increases its efficiency.
Further contributing to these characteristics is that the flex
valve 200 is biased closed when the pump is not operating.
[0047] FIGS. 5 and 6 show alternative embodiments of the pump of
the invention. The pump in FIG. 5 is essentially the same as that
of FIG. 2 except that the pump chamber 30 is reduced in thickness
to that of the sealing washer 34. This improves the self-priming
ability of the pump. The pump in FIG. 6 also has a minimally thick
pump chamber 30. Further, the inlet 22 and outlet 24 are
perpendicular to the plane of the actuator 14, a configuration that
may be more convenient in some applications.
[0048] In yet another embodiment, not shown, the bottom of the pump
body comprises a piezoelectric actuator 14 arranged identically but
as a mirror image of the piezoelectric actuator 14 just described,
with the substrate layers 40 facing each other across the pump
chamber 30.
[0049] In still another embodiment, not shown, two of the pumps
above described are mounted side by side in one pump body. The
actuator; seals; inlets and outlets, with one-way valve in the
inlets only; pump covers; and drivers are positioned in one or more
of the configurations described above. In a preferred form of this
embodiment, the drivers are in series electrically, with the pumps
operating in parallel fluidwise in the system in which they are
deployed.
INDUSTRIAL APPLICABILITY
[0050] This invention has particular application for water cooling
of the CPU in computers but may have wider applications wherever a
very small pump of relatively high flow rate and minimum power
consumption is needed to move liquids at very low cost. The
piezoelectric actuator by itself can have very many other
applications, such as speakers, audible alarms, automotive sensors,
sound generators for active noise cancellation, and
accelerometers.
* * * * *