U.S. patent application number 10/934485 was filed with the patent office on 2006-03-09 for computer bezel with inlet airflow guiding device.
Invention is credited to Ying-Chun Chou, Kuo-Chung Liao, Wen-Lung Yu.
Application Number | 20060049728 10/934485 |
Document ID | / |
Family ID | 35995515 |
Filed Date | 2006-03-09 |
United States Patent
Application |
20060049728 |
Kind Code |
A1 |
Yu; Wen-Lung ; et
al. |
March 9, 2006 |
Computer bezel with inlet airflow guiding device
Abstract
A computer bezel with an inlet airflow guiding device, which is
not only suitable for a computer chassis with the BTX
specification, but also able to provide a desktop computer an
attractive appearance. The computer bezel with an inlet airflow
guiding device includes a computer chassis, a front bezel, an inlet
airflow guiding member, an airflow guiding space, and a plurality
of inlet airflow openings. The airflow guiding space and the inlet
airflow openings provide a low airflow impedance inlet that
facilitates the movement of the incoming inlet airflow. The front
cooling fan is thereby capable of providing the high power
components of the desktop computer with low temperature air at a
high velocity.
Inventors: |
Yu; Wen-Lung; (Taipei,
TW) ; Chou; Ying-Chun; (Taipei, TW) ; Liao;
Kuo-Chung; (Taipei, TW) |
Correspondence
Address: |
Yi-Wen Tseng
4331 Stevens Battle Lane
Fairfax
VA
22033
US
|
Family ID: |
35995515 |
Appl. No.: |
10/934485 |
Filed: |
September 7, 2004 |
Current U.S.
Class: |
312/223.2 |
Current CPC
Class: |
G06F 1/181 20130101;
G06F 1/20 20130101 |
Class at
Publication: |
312/223.2 |
International
Class: |
A47B 81/00 20060101
A47B081/00 |
Claims
1. A computer bezel with an inlet airflow guiding device,
comprising: a computer chassis; a front bezel connecting to the
computer chassis; an inlet airflow guiding member formed on the
front bezel; an airflow guiding space defined between the front
bezel and the computer chassis; and a plurality of inlet airflow
openings which allow exterior air to flow into the computer chassis
through the airflow guiding space.
2. The computer bezel with an inlet airflow guiding device of claim
1, wherein the inlet airflow guiding member protrudes from the
front bezel.
3. The computer bezel with an inlet airflow guiding device of claim
1, wherein the inlet airflow guiding member protrudes from the a
portion of the front bezel.
4. The computer bezel with an inlet airflow guiding device of claim
1, wherein the inlet airflow guiding member is a trapezoidal prism
that is comprised of a body plate and two side plates respectively
extending from the body plate.
5. The computer bezel with an inlet airflow guiding device of claim
4, wherein the angle between the body plate and the side plate is
an obtuse angle, a right angle, or an acute angle.
6. The computer bezel with an inlet airflow guiding device of claim
1, wherein the inlet airflow guiding member concaves from the front
bezel.
7. The computer bezel with an inlet airflow guiding device of claim
1, wherein the inlet airflow openings are cut around the
circumference of the inlet airflow guiding member.
8. The computer bezel with an inlet airflow guiding device of claim
7, wherein the inlet airflow openings are further cut around the
circumference of the front bezel.
9. The computer bezel with an inlet airflow guiding device of claim
7, wherein the inlet airflow openings are further cut from the
front surface of the inlet airflow guiding member or the front
bezel.
Description
BACKGROUND OF THE INVENTION
[0001] The present invention relates in general to computer front
bezels, and more particularly, to a computer bezel with an inlet
airflow guiding device, which is suitable to be installed onto a
computer chassis that complies with the Balanced Technology
Extended (BTX) Interface Specification suggested by the Intel
Corporation.
[0002] Various electrical instruments nowadays, and especially the
desktop computer, are crowded with different electrical components
and peripheral devices, such as the Central Processing Unit (CPU),
the interface card, the hard disk, the disk burner, and the power
supply. Those electrical components and peripheral devices each
generate different levels of heat during their respective
operations. The CPU because of its high processing speed, in
particular, generates a large amount of heat. Nonetheless, the
computer case of the average desktop computer is closed.
Accordingly, the inner temperature of a desktop computer is very
high. Therefore, one or more heat dissipation modules are installed
inside the computer chassis to remove the heat generated by the
electrical components and peripheral devices. The removal of this
generated heat helps to ensure that the inside of the computer case
maintains a moderate operating temperature.
[0003] The conventional heat dissipation system for desktop
computers nowadays has a circular opening bored in its rear plate
and a corresponding cooling fan installed in that circular opening.
Further, some heat dissipating modules are comprised of modules
that have a heat dissipating fin and cooling fan assembled onto a
high temperature electrical component. This conventional heat
dissipation system is barely able to complete its work. Heat
dissipation is also hindered in the conventional arts because the
exhaust airflow is hindered by internal electrical components. The
inner airflows created by the conventional heat dissipating system
interfere with each other. This happens when some of the heated air
is re-circulated into the cooling fan which is assembled on an
electrical component. Some heated air re-circulates into the
cooling fan assembled on an electrical component, and therefore
reduces the heat transfer capability of the heat dissipating
module. Furthermore, the electrical components and peripheral
devices will continue to evolve and new components will need to be
integrated. The current heat dissipation system is unable to
satisfy the future demand of a new generation of computer
systems.
[0004] Accordingly, Intel Corporation developed the BTX system. The
BTX system takes into account not only routing and electrical
performance requirements, but also takes into account heat transfer
and airflow management requirements. Heat transfer and airflow
management requirements help to ensure that a computer has a proper
operating environment. Among other things, the BTX system suggests
a heat removing disposition with a front-to-back airflow. The BTX
system suggests that the CPU be positioned in front of the
motherboard, adjacent to the front panel; that a circular opening
be bored in the front panel; and that a thermal module with a
cooling fan be assembled onto the top of the CPU. The BTX system is
thereby capable of providing the CPU with low temperature cooling
air which is blown at a high velocity.
[0005] However, to comply with the BTX system specification, a 9 cm
circular opening must be bored on the front panel. This opening
will ruin the attractive appearance of a computer, and especially
the appearance of cube computers. Because the competitive edge of a
cube computer is its attractive appearance, the front panel opening
would be a fatal blow to cube computer products.
BRIEF SUMMARY OF THE INVENTION
[0006] The present invention provides a computer bezel with an
inlet airflow guiding device, which is not only suitable for a
computer chassis that complies with the BTX specification, but also
able to provide a desktop computer an attractive appearance.
[0007] The computer bezel with an inlet airflow guiding device
provided by the present invention includes a computer chassis, a
front bezel, an inlet airflow guiding member formed on the front
bezel, an airflow guiding space defined between the front bezel and
the computer chassis, and a plurality of inlet airflow openings
formed on or around the inlet airflow guiding member. The computer
chassis uses a front-to-back airflow disposition which has a front
cooling fan installed at the front panel of the computer chassis.
This front-to-back airflow disposition complies with the BTX
specification suggested by the Intel Corporation. The airflow
guiding space and the inlet airflow openings provide a low airflow
impedance inlet that facilitates the movement of the incoming inlet
airflow. The front cooling fan is thereby capable of providing the
high power components of the desktop computer with low temperature
air at a high velocity. Further, it is unnecessary for the present
invention to bore a large diameter airflow opening on the front
bezel, which would spoil the attractive appearance of a
computer.
[0008] These and other objectives of the present invention will
become obvious to those of ordinary skill in the art after reading
the following detailed description of preferred embodiments.
[0009] It is to be understood that both the foregoing general
description and the following detailed description are exemplary,
and are intended to provide further explanation of the invention as
claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] These as well as other features of the present invention
will become more apparent upon reference to the drawings
therein:
[0011] FIG. 1 is a perspective view of the first embodiment of the
present invention before installation.
[0012] FIG. 2 is a perspective view of the first embodiment of the
present invention after installation.
[0013] FIG. 3 is a partial top view of the first embodiment of the
present invention after installation.
[0014] FIG. 4 is a perspective view of the second embodiment of the
present invention before installation.
[0015] FIG. 5 is a perspective view of the second embodiment of the
present invention after installation.
[0016] FIG. 6 is a partial top view of the second embodiment of the
present invention after installation.
[0017] FIG. 7 is a partial top view of the third embodiment of the
present invention after installation.
DETAILED DESCRIPTION OF THE INVENTION
[0018] Reference will now be made in detail to the preferred
embodiments of the present invention, examples of which are
illustrated in the accompanying drawings. Wherever possible, the
same reference numbers are used in the drawings and the description
to refer to the same or like parts.
[0019] Referring to FIGS. 1 though 3, a computer bezel with an
inlet airflow guiding device of the first embodiment of the present
invention is illustrated. The computer bezel with an inlet airflow
guiding device includes a computer chassis 1, a front bezel 2 which
connects to the computer chassis 1, an inlet airflow guiding member
3 which is formed on the front bezel 2, an airflow guiding space 32
which is defined between the front bezel 2 and the computer chassis
1, and a plurality of inlet airflow openings 33. The computer
chassis 1 uses a front-to-back airflow disposition by utilizing a
front cooling fan 4 which is installed at the front panel 11 of the
computer chassis 1. This front-to-back airflow disposition complies
with the BTX specification suggested by the Intel Corporation.
[0020] The computer bezel with an inlet airflow guiding device of
the present invention enables the low temperature exterior air to
pass through the inlet airflow openings 33 and the airflow guiding
space 32, and further be drawn by the cooling fan 4 into the
computer chassis 1. The airflow guiding space 32 and the inlet
airflow openings 33 provide a low airflow impedance inlet, which
facilitates the movement of the entering airflow stream, and
thereby able to supply the desktop computer with an affluent
airflow stream. The front cooling fan 4 is thereby capable of
providing the high power components of the computer motherboard
with low temperature air at a high velocity. Further, it is
unnecessary for the present invention to bore a large diameter
airflow opening on the front bezel 2, which would spoil the
attractive appearance of a computer.
[0021] The computer chassis 1 has a large diameter opening 36 bored
on the front panel 11 thereof. The large diameter opening 36
corresponds with the front cooling fan 4, and enables the cooling
fan 4 to acquire sufficient low temperature air from the airflow
guiding space 32 which is defined between the inlet airflow guiding
member 3 and the front panel of the computer chassis 1.
[0022] The inlet airflow guiding member 3 of the present embodiment
protrudes from the front end surface 21 of the front bezel 2. The
inlet airflow guiding member 3 includes a body plate 34, a top
plate, a bottom plate, and two side plates 35, and a plurality of
inlet airflow openings 33. The side plates 35 respectively extend
from the body plate 34. The angle between the body plate 34 and the
side plate 35 may be an obtuse angle, a right angle, or an acute
angle. The said angle of the present embodiment is a right angle.
The inlet airflow openings 33 are formed on the top plate, the
bottom plate, and the side plates 35 of the inlet airflow guiding
member 3. This disposition of the inlet airflow openings 33
provides the cooling fan 4 with multi directional input sources for
a surrounding type of inlet airflow. The airflow guiding space 32
is formed between the inlet airflow member 3 and the computer
chassis 1. The volume and the configuration of the airflow guiding
space 32 depend on the shape of the inlet airflow guiding member 3
and the front bezel 2. The inlet airflow guiding member 3 and the
front bezel 2 provide the computer with an attractive appearance.
The airflow guiding space 32 and the inlet airflow openings 33
provide a low airflow impedance inlet that facilitates the movement
of the entering airflow stream. The cooling fan 4 is thereby able
to provide the high power components of the computer motherboard
with low temperature air at a high velocity. Further, it is
unnecessary when utilizing the present invention to bore a large
diameter airflow opening on the front bezel 2, which would spoil
the attractive appearance of a computer.
[0023] Referring to FIGS. 4 through 6, a computer bezel with an
inlet airflow guiding device of the second embodiment of the
present invention is illustrated. The inlet airflow guiding member
3 protrudes from a portion of the front bezel 2. The inlet airflow
guiding member 3 is a trapezoidal prism that is comprised of a body
plate 34, a top plate, a bottom plate, and two side plates 35, and
a plurality of inlet airflow openings 33 which are formed on the
top plate, the bottom plate, and the side plates 35. The side
plates 35 respectively extend from the body plate 34. The angle
between the body plate 34 and the side plate 35 may be an obtuse
angle, a right angle, or an acute angle. The said angle of the
present invention is an obtuse angle. The airflow guiding space 32
is formed between the inlet airflow member 3 and the computer
chassis 1. The volume and the configuration of the airflow guiding
space 32 depend on the shape of the inlet airflow guiding member 3
and the front bezel 2. The airflow guiding space 32 and the inlet
airflow openings 33 provide a low airflow impedance inlet that
facilitates the movement of the incoming inlet airflow. The present
invention is capable of providing the cooling fan 4 with abundant
airflow for heat dissipation purposes.
[0024] Referring to FIG. 7, a computer bezel with an inlet airflow
guiding device of the third embodiment of the present invention is
illustrated. Instead of protruding from the front bezel, the inlet
airflow guiding member 3 concaves from the front bezel 2 or from a
portion of the front bezel 2. The inlet airflow guiding member 3
includes a body plate 34, a top plate, a bottom plate, and two side
plates 35, and a plurality of inlet airflow openings 33 which are
formed on the top plate, the bottom plate, and the side plates 35.
The side plates 35 respectively extend from the body plate 34. The
angle between the body plate 34 and the side plate 35 may be an
obtuse angle, a right angle, or an acute angle. The said angle of
the present invention is a right angle. The airflow guiding space
32 is formed between the inlet airflow member 3 and the computer
chassis 1. The airflow guiding space 32 and the inlet airflow
openings 33 provide a low airflow impedance inlet that facilitates
the movement of the incoming inlet airflow. The present invention
is capable of providing the cooling fan 4 with abundant airflow for
heat dissipation purposes.
[0025] Furthermore, the inlet airflow openings 33 of the present
invention may be further formed around the circumference of the
front bezel 2, or be formed on the front surface of the inlet
airflow guiding member 3 or the front surface of the front bezel 2.
This disposition will further reduce the airflow impedance and
thereby facilitate the movement of the incoming inlet airflow.
[0026] In summary, the present invention provides the computer not
only an attractive appearance but also with a low airflow impedance
inlet which facilitates the movement of the inlet airflow. The
present invention is capable of providing the cooling fan with and
abundant airflow for heat dissipation purposes. The cooling fan is
thereby able to provide the high power components of the computer
motherboard with low temperature air at a high velocity.
[0027] While an illustrative and presently preferred embodiment of
the invention has been described in detail herein, it is to be
understood that the inventive concepts may be otherwise embodied
and employed and that the appended claims are intended to be
construed to include such variations except insofar as limited by
the prior art.
* * * * *