U.S. patent application number 10/937567 was filed with the patent office on 2006-03-09 for configurable heat sink.
Invention is credited to Stephan Karl Barsun, Christian Belady, Gregory L. Huff, Christopher G. Malone, Brandon Rubenstein, Roy Zeighami.
Application Number | 20060048932 10/937567 |
Document ID | / |
Family ID | 35995042 |
Filed Date | 2006-03-09 |
United States Patent
Application |
20060048932 |
Kind Code |
A1 |
Rubenstein; Brandon ; et
al. |
March 9, 2006 |
Configurable heat sink
Abstract
Systems, methodologies, media, and other embodiments associated
with a configurable heat sink are described. One exemplary system
embodiment includes a base portion of a heat sink to which
different accessories may be removably attached. The example system
may include a first accessory like a cover that forms an assembly
with the base portion of the heat sink and causes the assembly to
operate in a first manner.
Inventors: |
Rubenstein; Brandon;
(Loveland, CO) ; Barsun; Stephan Karl;
(Sacramento, CA) ; Belady; Christian; (McKinney,
TX) ; Huff; Gregory L.; (Plano, TX) ; Malone;
Christopher G.; (Rockline, CA) ; Zeighami; Roy;
(McKinney, TX) |
Correspondence
Address: |
HEWLETT-PACKARD COMPANY;Intellectual Property Administration
P.O. Box 272400
Fort Collins
CO
80527-2400
US
|
Family ID: |
35995042 |
Appl. No.: |
10/937567 |
Filed: |
September 9, 2004 |
Current U.S.
Class: |
165/185 ;
257/E23.099 |
Current CPC
Class: |
H01L 23/467 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101; H01L 2924/0002
20130101 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Claims
1. A configurable heat sink apparatus, comprising: a base having a
first surface and one or more second surfaces, the first surface
being configured to be positioned in contact with a heat source,
the one or more second surfaces being configured with one or more
apertures, and the base including a heat dissipation apparatus
configured to dissipate heat from the heat source; and one or more
accessories that are removably attachable to the one or more second
surfaces, the one or more accessories being configured to be
positioned over at least a portion of one or more of the one or
more apertures, the one or more accessories being configured to
control, at least in part, the flow of one or more mediums
experienced by the heat dissipation apparatus.
2. The configurable heat sink apparatus of claim 1, the one or more
accessories comprising one or more of, a cover, an air moving
apparatus, and a fluid moving apparatus.
3. The configurable heat sink apparatus of claim 2, the one or more
mediums comprising one or more of, a gas, air, a liquid, water, and
a solution.
4. The configurable heat sink apparatus of claim 3, the heat source
being an integrated circuit.
5. The configurable heat sink apparatus of claim 4, where a first
accessory may be removed from the configurable heat sink apparatus
and replaced with a second accessory, the first and second
accessories being provided with the configurable heat sink
apparatus.
6. A user configurable heat sink, comprising: a base having a first
surface and one or more second surfaces, the first surface being
configured to be positioned in contact with an integrated circuit,
the one or more second surfaces being configured with one or more
apertures, the base including a heat dissipation apparatus
configured to dissipate heat from the integrated circuit; and one
or more accessories including a cover, a fan, or a pump, that are
removably attached to one or more of the one or more second
surfaces, the one or more accessories being configured to be
positioned over at least a portion of one or more of the one or
more apertures, the one or more accessories being configurable to
control, at least in part, a flow of one or more of, a gas, and a
fluid in the heat dissipation apparatus.
7. A multi-directional flow heat sink assembly, comprising: a heat
dissipation component configured to conduct heat away from a heat
source to which the multi-directional flow sink assembly may be
attached; and one or more flow components configured to influence a
flow of a medium in the heat dissipation component, the one or more
flow components being removably attachable to the multi-directional
flow heat sink assembly.
8. The multi-directional flow heat sink of claim 7, the one or more
flow components being configured to produce a flow of a medium in
the heat dissipation component that is one of, an impinging flow,
and a straight-through flow.
9. The multi-directional flow heat sink of claim 7, where the one
or more flow components include one or more of, a cover, and a flow
generator.
10. The multi-directional flow heat sink of claim 9, the flow
generator comprising one or more of, a gas moving fan, and a fluid
moving pump.
11. A multi-directional flow heat sink assembly, comprising: a heat
dissipation component configured to conduct heat away from a an
integrated circuit to which the multi-directional flow sink
assembly may be attached; and one or more of a cover, a gas moving
fan, and a fluid moving pump that are removably attachable to the
multi-directional flow heat sink assembly and that are configured
to produce one or more of, an impinging flow in the heat
dissipation component, and a straight-through flow in the heat
dissipation component.
12. A processor assembly, comprising: a heat sink configured to be
cooled by one of two or more air flows, the heat sink including a
fin configured to dissipate heat; and a control element configured
to control an air flow in an area of the processor assembly
containing the fin.
13. The processor assembly of claim 12, the control element
comprising one of, an air blocking element, an air directing
element, and an air moving element.
14. The processor assembly of claim 13, the air blocking element
being configured to control air to flow from a passive input
region, past the fin, and out a passive output region.
15. The processor assembly of claim 13, the air moving element
being configured to control air to flow from an active input
region, past the fin, and out an active output region.
16. The processor assembly of claim 13, the air directing element
being configured to shape a path of an air flow in the area of the
processor assembly containing the fin.
17. The processor assembly of claim 12, the control element
comprising one of a cover, a duct, and a fan.
18. The processor assembly of claim 17, the cover being configured
to control air to flow from a passive input region, past the fin,
and out a passive output region.
19. The processor assembly of claim 17, the fan being configured to
control air to flow from an active input region, past the fin, and
out an active output region.
20. The processor assembly of claim 17, the duct being configured
to shape a path of an air flow in the area of the processor
assembly containing the fin.
21. A processor assembly, comprising: a heat sink configured to be
cooled by a medium flowing in one of two or more configurations;
and an apparatus configured to affect the flow configuration of the
medium, the apparatus being attached to the heat sink, the
apparatus being configurable to take on an open, active state and a
closed, inactive state.
22. The processor assembly of claim 21, the apparatus being
configurable to take on the open, active state when a cover
associated with the apparatus is at least partially open.
23. The processor assembly of claim 22, the heat sink experiencing
an impinging flow configuration when the apparatus is configured in
the open, active state.
24. The processor assembly of claim 21, the apparatus being
configurable to take on the closed, inactive state when a cover
associated with the apparatus is closed.
25. The processor assembly of claim 24, the heat sink experiencing
a straight-through flow configuration when the apparatus is
configured in the closed, inactive state.
26. The processor assembly of claim 21, the medium being a gas.
27. The processor assembly of claim 21, the medium being a
fluid.
28. A heat dissipation apparatus, comprising: a heat sink
configured to be cooled by one of two or more air flows; and a fan
attached to the heat sink, the fan being configurable to take on an
open, active state and a closed, inactive state, where the fan is
configured to take on the open, active state when a cover attached
to the fan is in an open position, and where the fan is configured
to take on the closed, inactive state when the cover is in a closed
position; and where the heat sink is cooled by an impinging air
flow when the fan is configured in the open, active state and the
heat sink is cooled by a straight-through air flow when the fan is
configured in the closed, inactive state.
29. A computer executable method, comprising: identifying a heat
source for which heat dissipation is desired; producing a heat sink
assembly configured to provide heat dissipation for the heat
source, where the heat sink assembly includes a configurable heat
sink and two or more accessories that are removably attachable to
the heat sink assembly; and providing the heat sink assembly as a
single part.
30. The method of claim 29, including: determining a range of heat
dissipation requirements for the heat source; and selecting the two
or more accessories based, at least in part, on the range of heat
dissipation requirements for the heat source.
31. The method of claim 29, where providing the heat sink assembly
as a single part includes one or more of, packaging the heat sink
and the two or more accessories in a single package, warehousing
the heat sink and the two or more accessories under a single
picking number, and inventorying the heat sink and the two or more
accessories under a single inventory number.
32. A system, comprising: means for dissipating heat from an
integrated circuit; first means for altering an airflow through the
means for dissipating heat, where the first means are swappable
with second means for altering the airflow through the means for
dissipating heat; and means for removably attaching the first and
second means for altering the airflow to the means for dissipating
heat.
33. A method for removing heat from a heat source, comprising:
providing a configurable heat sink assembly having an interface
surface, a heat dissipation apparatus, and one or more accessories
configurable to control an air flow in the area of the heat
dissipation apparatus; configuring the configurable heat sink
assembly by manipulating one or more of the one or more
accessories; contacting the heat source with the interface surface;
and causing a first air flow in the area of the heat dissipation
apparatus, where the first air flow is controlled, at least in
part, by the one or more accessories.
34. The method of claim 33, including: reconfiguring the
configurable heat sink assembly by manipulating one or more of the
one or more accessories; and causing a second air flow in the area
of the heat dissipation apparatus, where the second air flow is
controlled, at least in part, by the one or more accessories.
Description
BACKGROUND
[0001] Thermal dissipation devices like heat sinks appear in many
applications. A heat sink may be, for example, a metal mass that is
thermally coupled (e.g., attached) to a heat source and that draws
heat energy away from the heat source by conduction. The heat
energy may then be dissipated from surfaces of the heat sink into
an atmosphere by convection. The convection effect may be enhanced,
for example, by a fan. Heat sources and their related heat
dissipation requirements may vary widely. Thus, heat sinks may vary
widely. Heat sinks may vary in size, material, surface area, fin
design, inclusion of a fan, inclusion of a liquid element, and so
on.
[0002] Conventionally, a heat source (e.g., integrated circuit
(IC)) may have its heat dissipation requirements determined and
then a heat sink may be selected and/or designed to meet those heat
dissipation requirements. However, a system may include a number of
heat sources and thus a system may include a number of different
heat sinks. Increasing the number and type of heat sinks can
increase system complexity and cost, manufacturing complexity and
cost, warehousing costs, and so on. Furthermore, the heat
dissipation requirements of a heat source may change based on an
application in which it is employed. For example, a microprocessor
that is clocked at a first speed may have a first heat dissipation
requirement but that same microprocessor clocked at a second speed
may have a second heat dissipation requirement.
[0003] To address these cost/complexity and other concerns, some
conventional heat sinks may be upgraded by having a fan bolted on
to their top. Other heat sinks may include programmable fans that
can react to varying heat dissipation requirements. Still other
heat sinks may be designed to be easily removed from an integrated
circuit and replaced with a different heat sink. While these
approaches may address some cost/complexity concerns, they may
raise others like part proliferation, warehousing complexity,
inventory control, order fulfillment, and so on. For example, one
IC may be associated with three heat sinks. For a first system a
first heat sink would be acquired/manufactured, warehoused, picked,
and applied to an IC during system manufacture. In a second system,
a second heat sink would be acquired/manufactured, warehoused,
picked, and applied to the IC during system manufacture while in a
third system, a third heat sink would be acquired/manufactured,
warehoused, picked, and applied to the sink during system
manufacture. If the heat dissipation requirements of the IC in the
first system changed, then a customer may order the second or third
heat sink which would then be picked, shipped, billed, and so on,
to the customer, who may retrofit the heat sink to the IC after
removing the initially installed heat sink.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] The accompanying drawings, which are incorporated in and
constitute a part of the specification, illustrate various example
systems, methods, and so on, that illustrate various example
embodiments of aspects of the invention. It will be appreciated
that the illustrated element boundaries (e.g., boxes, groups of
boxes, or other shapes) in the figures represent one example of the
boundaries. One of ordinary skill in the art will appreciate that
one element may be designed as multiple elements or that multiple
elements may be designed as one element. An element shown as an
internal component of another element may be implemented as an
external component and vice versa. Furthermore, elements may not be
drawn to scale.
[0005] FIG. 1 illustrates a front view of an example configurable
heat sink.
[0006] FIG. 2 illustrates a side view of an example configurable
heat sink.
[0007] FIG. 3 illustrates a top view of an example configurable
heat sink with no accessories attached.
[0008] FIG. 4 illustrates a top view of an example configurable
heat sink with a cover attached.
[0009] FIG. 5 illustrates a top view of an example configurable
heat sink with a fan attached.
[0010] FIG. 6 illustrates a perspective view of an example
configurable heat sink with no accessories attached.
[0011] FIG. 7 illustrates a perspective view of an example
multi-directional flow heat sink configured to experience a
through-flow.
[0012] FIG. 8 illustrates a perspective view of an example
multi-directional flow heat sink configured to experience an
impinging flow.
[0013] FIG. 9 illustrates an example method associated with
providing a configurable heat sink.
[0014] FIG. 10 illustrates an example method or cooling a heat
source.
DETAILED DESCRIPTION
[0015] Example systems described herein concern a configurable heat
sink. One example heat sink may include a base portion to which
different accessories may be attached. An example system may
include a first accessory like a lid or cover that forms an
assembly with the base portion of the heat sink and allows the
assembly to operate in a first manner. For example, a
multi-directional flow heat sink with the cover in place may
operate as a through-flow device. An example system may also
include a second accessory like a fan that forms an assembly with
the base portion of the heat sink and allows the assembly to
operate in a second manner. For example, a multi-directional flow
heat sink with the cover removed and a fan in its place may operate
as an impinging-flow device. While two accessories and two air-flow
configurations are described, it is to be appreciated that the
examples are not so limited. For example, a heat sink may be
provided with a set of accessories removably attached to the heat
sink. A user may then configure the heat sink for a particular
platform or for a particular heat dissipation task by removing a
subset of accessories (e.g., covers, fans) while leaving another
subset in place.
[0016] The following includes definitions of selected terms
employed herein. The definitions include various examples and/or
forms of components that fall within the scope of a term and that
may be used for implementation. The examples are not intended to be
limiting. Both singular and plural forms of terms may be within the
definitions.
[0017] "Computer-readable medium", as used herein, refers to a
medium that participates in directly or indirectly providing
signals, instructions and/or data. A computer-readable medium may
take forms, including, but not limited to, non-volatile media,
volatile media, and transmission media. Non-volatile media may
include, for example, optical or magnetic disks, and so on.
Volatile media may include, for example, optical or magnetic disks,
dynamic memory and the like. Common forms of a computer-readable
medium include, but are not limited to, a floppy disk, a flexible
disk, a hard disk, a magnetic tape, other magnetic media, a CD-ROM,
other optical media, a RAM, a ROM, an EPROM, a FLASH-EPROM, or
other memory chip or card, a memory stick, a carrier wave/pulse,
and other media from which a computer, a processor or other
electronic device can read. Signals used to propagate instructions
or other software over a network, like the Internet, can be
considered a "computer-readable medium."
[0018] FIG. 1 illustrates a front view of a configurable heat sink
apparatus 100. FIG. 2 illustrates a side view of configurable heat
sink apparatus 100 and FIG. 3 illustrates a top view of
configurable heat sink apparatus 100. The configurable heat sink
apparatus 100 may include a base 110 that can be positioned in
contact with a heat source 120. The configurable heat sink
apparatus 100 may include an aperture 130 (opening, e.g., hole,
slit, channel) that facilitates having an accessory 140 interact
with a heat dissipation apparatus in base 110. Fins associated with
an example heat dissipation apparatus (e.g., heat sink) are visible
in the side view and top view. In FIGS. 1 and 2, there is an
accessory 140 attached to the top of the heat sink apparatus 100,
while in FIG. 3 there is no accessory attached to the heat sink
apparatus 100. The configurable heat sink apparatus 100 may be
configured to provide different heat dissipation performance by the
selective addition, deletion, swapping, interaction, and so on, of
various accessories that may be removably attached to base 110.
[0019] The heat sink apparatus 100 may include a base 110. The base
110 may have a first surface and a second surface(s). While base
110 is illustrated being substantially rectangular in FIGS. 1, 2
and 3, it is to be appreciated that base 110 may take on various
shapes and forms. Also, while base 110 is illustrated being
substantially closed to the flow of a medium in the front view,
being substantially open to the flow of a medium in the side view,
and being configurably opened or closed to the flow of a medium in
the top view, it is to be appreciated that various locations,
shapes, sizes and so on, of openings (e.g., apertures) into the
configurable heat sink apparatus 100 may be employed. The first
surface may be configured to be positioned in contact with a heat
source 120 to facilitate thermal transfer from the heat source 120
to the first surface. Thus, in one example, the first surface may
be substantially flat to facilitate increasing the contact area
between the base 110 and the heat source 120. In one example, the
heat source 120 may be an integrated circuit like a
microprocessor.
[0020] The second surface(s) may be configured with an aperture(s)
130 through which a medium like air, water, and so on, may flow.
The aperture(s) 130 may facilitate bringing a medium in contact
with or into the area of a heat dissipation apparatus located in
the base 110. While the heat dissipation apparatus is described
being in the base 110, it is to be appreciated that the heat
dissipation apparatus may, in some examples, form the base 110.
Thus, in one example, the first surface and the second surface(s)
may form part of the heat dissipation apparatus. The heat
dissipation apparatus (e.g., a heat sink with fins) may be
configured to dissipate heat from the heat source 120. For example,
the heat dissipation apparatus may conduct heat away from the heat
source 120 and then the heat conducted into the heat dissipation
apparatus may be dissipated by convection. The flow of the medium
that the heat dissipation apparatus experiences may affect
convection associated with dissipating heat from the heat
dissipation apparatus and thus may control the heat dissipation
performance of the configurable heat sink apparatus 100.
[0021] Configurable heat sink apparatus 100 may also include an
accessory 140 that is removably attachable to a second surface. The
accessory 140 may be configured to be positioned over an
aperture(s) 130. For example, accessory 140 may completely cover
aperture 130, may partially cover aperture 130, and so on. While a
single aperture 130 and a single accessory 140 are illustrated, it
is to be appreciated that configurable heat sink apparatus 100 may
include one or more apertures 130 and one or more accessories 140.
In different examples the accessories may be removably attached to
the base 110 by, for example, screws, fasteners, clips, slot and
tab systems, male/female systems, and the like.
[0022] As described above, the flow of a medium experienced by a
heat dissipation apparatus associated with configurable heat sink
apparatus 100 may affect the heat dissipation performance of
apparatus 100. Thus, the accessory 140 may be configured to
control, at least in part, the flow of a medium experienced by the
heat dissipation apparatus. For example, the accessory 140 may be
configured to control the volume, type, direction, and so on, of
medium that flows into and/or out of the apparatus 100. By way of
illustration, the accessory 140 may be a cover, an air moving
apparatus, a fluid moving apparatus, and so on, that selectively
blocks, provides, or influences the flow of the medium into and/or
out of base 110. The cover, air moving apparatus, fluid moving
apparatus, and so on, may be configured to control the flow of
mediums including, but not limited to, a gas, air, a liquid, water,
and a solution. Again, while a single accessory 140 is illustrated,
one or more accessories may be removably attachable to base 110.
The accessories may be enabled individually, in sets, and/or
collectively by a user by, for example, opening and/or closing a
cover associated with the accessory. Additionally, while a first
accessory may initially be attached to base 110, a user may remove
the first accessory and replace it with a second accessory. To
facilitate adding, removing, and/or swapping accessories,
configurable heat sink apparatus 100 may be packaged as a single
part with both the base 110 and the accessories available to the
user. This facilitates producing, warehousing, shipping, and so on,
a single product that can be employed in various platforms with
various heat sources that have various heat dissipation
requirements.
[0023] FIG. 4 illustrates a top view of configurable heat sink 100
with a cover 150 attached. Cover 150 blocks the flow of a medium
through aperture 130. Thus, a different flow of medium may be
experienced by configurable heat sink apparatus 100 with cover 150
attached than would be experienced if cover 150 were removed. This
different flow of medium may control the heat dissipation
performance of configurable heat sink 100. In FIG. 3, cover 150 was
not present and thus configurable heat sink apparatus 100 would
experience a different flow of medium than it would when configured
as in FIG. 4 with the cover attached. To facilitate a user
configuring heat sink apparatus 100, the heat sink apparatus 100
may be shipped with cover 150 attached and the user may decide
whether to leave cover 150 in place or to remove it. By way of
illustration, if heat source 120 is a processor being operated
below its rated clock speed, then configurable heat sink 100 may
only be required to provide a first (e.g., lower) heat dissipation
performance. Therefore, cover 150 may be left in place. But if heat
source 120 is a processor being operated at its rated clock speed,
then configurable heat sink 100 may be required to provide a second
(e.g., greater) heat dissipation performance. Therefore, cover 150
may be removed. In another example, if heat source 120 is a
processor that is being over-clocked, then configurable heat sink
100 may be required to provide a third (e.g., maximum) heat
dissipation performance. Thus cover 150 may be removed and a fan
may be attached to cover aperture 130. Once again, to facilitate
providing these three different levels of heat dissipation
performance, configurable heat sink 100 may be shipped as a single
part that includes the base and removably attachable and swappable
accessories like covers, fans, ducts, pumps, and so on.
[0024] By way of further illustration, configurable heat sink 100
may be employed in various applications where it may be desired to
control the direction of air flow across a heat dissipation
apparatus in base 110. Therefore, configurable heat sink 100 may be
configured with several apertures and several covers 150. By
selectively removing some covers and leaving other covers in place,
an air flow path may be controlled. This may be desired, for
example, when configurable heat sink 100 is employed in
applications having relatively cooler air zones and relatively
warmer air zones. To facilitate cooling, it may be desirable to
input air from a relatively cooler air zone.
[0025] FIG. 5 illustrates a top view of a configurable heat sink
500 with an attached fan 510. FIG. 5 also illustrates three
different air flows through configurable heat sink 500. In one
example, configurable heat sink 500 may be configured as a
processor assembly that includes a heat sink configured to be
cooled by a medium flowing in one of two or more configurations.
The processor assembly may include an apparatus (e.g., fan 510)
that is configured to affect the flow configuration of the medium.
The apparatus may be attached to the heat sink 500 and may, for
example, be configurable to take on an open (e.g., active) state, a
closed (e.g., inactive) state, and so on.
[0026] In one example, the apparatus (e.g., fan 510) may be
configurable to take on the open, active state when a cover (not
illustrated) associated with the apparatus is at least partially
open. Thus, in one example, if a cover is removed, slid open,
retracted, positioned to permit the flow of a medium through fan
510, and so on, then heat sink 500 may experience an increased air
flow due to the action of fan 510. In this example, heat sink 500
may experience an impinging flow when the apparatus (e.g., fan 510)
is configured in the open, active state.
[0027] In another example, the apparatus (e.g., fan 510) may be
configurable to take on the closed, inactive state when a cover
associated with the apparatus is closed. In this example, the heat
sink 500 may experience a straight-through flow when the apparatus
is configured in the closed, inactive state. The impinging flow
described above may occur when fan 510 blows down onto a surface(s)
of heat sink 500. The straight-through flow may occur when air
enters through one opening of heat sink 500 and leaves through
another opening. While a fan 510 is illustrated, it is to be
appreciated that in some examples the apparatus may take other
forms (e.g., fluid pump).
[0028] Heat sink 500 may experience various air flows or flows of
other mediums. Three possible flows labeled F1, F2 and F3 are
illustrated in FIG. 5. A first flow (F1), may be experienced when,
for example, a cover is in place over fan 510. Thus, air may enter
one side of heat sink 500, blow across fins in heat sink 500, and
exit another side of the heat sink 500. A second flow (F2) may be
experienced when, for example, the cover is removed from fan 510
and fan 510 spins its vanes in a first direction. In flow F2 air
may be pulled through fan 510, directed onto the fins of heat sink
500, and forced out two sides of heat sink 500. A third flow (F3)
may be experienced when, for example, the cover is removed from fan
510 and fan 510 spins its vanes in a second direction. In flow F3
air may be pulled in through two sides of heat sink 500, drawn
across the fins of heat sink 500, and pulled out through fan 510.
While three air flows are illustrated, it is to be appreciated that
other air flows may be created in a configurable heat sink.
Similarly, while air is described, it is to be appreciated that
flows of other mediums (e.g., gas, liquid) may be created.
Furthermore, while a single fan is illustrated, it is to be
appreciated that heat sink 500 may be configured with two or more
fans and that the opening and/or closing of various covers on the
fans and the direction of spin of the two or more fans may produce
different flows of medium.
[0029] FIG. 6 illustrates a perspective view of a configurable heat
sink 600 with no accessories attached. Heat sink 600 may be, for
example, part of a multi-directional flow heat sink assembly. Heat
sink 600 may include, for example, a heat dissipation component 660
that is configured to conduct heat away from a heat source 610
(e.g., integrated circuit, microprocessor) to which the
multi-directional flow sink assembly may be attached. In FIG. 6,
the multi-directional flow heat sink assembly is illustrated being
attached to the heat source 610 by screws. It is to be appreciated
that other attaching methods (e.g., glue, clips, tongue and groove)
may be employed.
[0030] While heat sink 600 is illustrated with no accessories
attached, and thus aperture 620 visible, the multi-directional flow
heat sink assembly may include a flow component(s) that is
configured to influence a flow of a medium experienced by the heat
dissipation component 660. In one example, the flow component may
be configured to produce flows including, but not limited to, an
impinging-flow, and a straight-through flow. The flow component(s)
may be removably attachable to the multi-directional flow heat sink
assembly. The flow components may include, for example, a cover,
and a flow generator like a fan, a pump, and so on.
[0031] Thus, FIG. 7 illustrates a perspective view of the
multi-directional flow heat sink 600 configured to experience a
through-flow. The through-flow may be generated because a cover 630
is in place over aperture 620. Therefore, air (or another medium)
may enter the multi-directional flow heat sink 600 at a first
location L1, pass over the fins of the heat dissipation component
660, and exit through a second location L2. It is to be appreciated
that in one example the multi-directional flow heat sink 600 is
user configurable because it may be delivered in configurations
including, but not limited to, with cover 630 in place, with cover
630 removed, with fan 640 in place, with fan 640 in place and
covered, and so on.
[0032] FIG. 8 illustrates a perspective view of a multi-directional
flow heat sink 600 configured to experience an impinging flow
produced by fan 640. Air may be drawn in at location L3 and escape
through locations L4 and L5. In one example, location L5 may be
configured with a cover (not illustrated) and thus air may be drawn
in at L3 and escape at L4. In another example, location L5 may be
configured with a fan (not illustrated). Thus air may be drawn in
at L3 and L5 and escape at L4. While three example configurations
are described, it is to be appreciated that various
multi-directional flow heat sinks may be produced with varying sets
of accessories to facilitate cross-platform compatibility and
user-configurability.
[0033] Example methods may be better appreciated with reference to
the flow diagram of FIG. 9. While for purposes of simplicity of
explanation, the illustrated methodology is shown and described as
a series of blocks, it is to be appreciated that the methodology is
not limited by the order of the blocks, as some blocks can occur in
different orders and/or concurrently with other blocks from that
shown and described. Moreover, less than all the illustrated blocks
may be required to implement an example methodology. Furthermore,
additional and/or alternative methodologies can employ additional,
not illustrated blocks.
[0034] In the flow diagram, blocks denote "processing blocks" that
may be implemented with logic. The processing blocks may represent
a method step and/or an apparatus element for performing the method
step. A flow diagram does not depict syntax for any particular
programming language, methodology, or style (e.g., procedural,
object-oriented). Rather, a flow diagram illustrates functional
information one skilled in the art may employ to develop logic to
perform the illustrated processing.
[0035] FIG. 9 illustrates an example method 900 associated with
providing a configurable heat sink. Computer executable method 900
may include, at 910, identifying a heat source for which heat
dissipation is desired. For example, an order may be received by an
automated order-processing system and an identifier (e.g., product
name, product serial number) for which a heat sink is desired may
be processed.
[0036] Method 900 may also include, at 920, producing a heat sink
assembly that is configured to provide heat dissipation for the
heat source. The heat sink assembly may include, for example, a
configurable heat sink and accessories that are removably
attachable to the heat sink assembly. The heat sink assembly may be
produced, for example, by an automated manufacturing process
interacting with an automated picking system. In one example,
method 900 may include determining a range of heat dissipation
requirements for the heat source and then selecting the accessories
based, at least in part, on the range of heat dissipation
requirements for the heat source.
[0037] Method 900 may also include, at 930, providing the heat sink
assembly as a single part. The heat sink assembly may be provided,
for example, by an automated fulfillment system. In one example,
providing 930 the heat sink assembly as a single part may include
automatically packaging the heat sink and the accessories in a
single package, automatically warehousing the heat sink and the
accessories under a single picking number, and automatically
inventorying the heat sink and the accessories under a single
inventory number. A picking number may be, for example, a data
value stored in a database associated with an automated warehousing
system that facilitates physically locating and retrieving, via
automated means, a part. An inventory number may be, for example, a
data value stored in a database associated with an automated
inventory system that facilitates tracking inventory properties
like quantities on hand, and so on.
[0038] At 940 a determination may be made concerning whether to
process another heat sink assembly. If the determination is no,
then processing may conclude, otherwise processing may continue at
910.
[0039] While FIG. 9 illustrates various actions occurring in
serial, it is to be appreciated that various actions illustrated in
FIG. 9 could occur substantially in parallel. By way of
illustration, a first process could identify a heat source(s) for
which a heat sink(s) is to be provided. Similarly, a second process
could control the production of a heat sink assembly while a third
process could facilitate providing the heat sink assembly as a
single part. While three processes are described, it is to be
appreciated that a greater and/or lesser number of processes could
be employed and that lightweight processes, regular processes,
threads, and other approaches could be employed. It is to be
appreciated that other example methods may, in some cases, also
include actions that occur substantially in parallel.
[0040] In one example, methodologies are implemented as processor
executable instructions and/or operations provided on a
computer-readable medium. Thus, in one example, a computer-readable
medium may store processor executable instructions operable to
perform a method that includes identifying a heat source for which
heat dissipation is desired and producing a heat sink assembly that
is configured to provide heat dissipation for the heat source. The
heat sink assembly may include a configurable heat sink and
accessories that are removably attachable to the heat sink
assembly. The method may also include providing the heat sink
assembly as a single part. While the above method is described
being provided on a computer-readable medium, it is to be
appreciated that other example methods described herein can also be
provided on a computer-readable medium.
[0041] FIG. 10 illustrates a method 1000 for removing heat from a
heat source. Method 1000 may include, at 1010 providing a
configurable heat sink assembly having an interface surface, a heat
dissipation apparatus, and an accessory configurable to control an
air flow in the area of the heat dissipation apparatus. Controlling
the air flow may include, for example, affecting the amount of air
flow in the heat dissipation apparatus, affecting the direction of
air flow in the heat dissipation apparatus, and so on. The
accessory may be, for example, a cover, a duct, a fan, a grating,
and so on.
[0042] Method 1000 may also include, at 1020, configuring the
configurable heat sink assembly by manipulating an accessory. For
example, a cover may be attached or removed, a fan may be attached
or removed, a duct may be attached, removed, or oriented in a
particular direction, and so on.
[0043] Method 1000 may also include, at 1030, contacting the heat
source with the interface surface, and, at 1040, causing a first
air flow in the area of the heat dissipation apparatus. The first
air flow may be controlled, at least in part, by how the accessory
was configured.
[0044] Over time, the heat dissipation environment in which a heat
sink operated in accordance with method 1000 may change. Thus,
method 1000 may also include, (not illustrated) reconfiguring a
configurable heat sink assembly by manipulating an accessory. For
example, where a first air flow was produced when a cover was in
place over an aperture, a second air flow may be produced when the
cover is removed and a fan is placed over the aperture. In one
example, the second flow may replace and/or operate with the first
air flow. Thus, method 1000 may also include, (not illustrated),
causing a second air flow in the area of the heat dissipation
apparatus.
[0045] While example systems, methods, and so on, have been
illustrated by describing examples, and while the examples have
been described in considerable detail, it is not the intention of
the applicants to restrict or in any way limit the scope of the
appended claims to such detail. It is, of course, not possible to
describe every conceivable combination of components or
methodologies for purposes of describing the systems, methods, and
so on, described herein. Additional advantages and modifications
will readily appear to those skilled in the art. Therefore, the
invention is not limited to the specific details, the
representative apparatus, and illustrative examples shown and
described. Thus, this application is intended to embrace
alterations, modifications, and variations that fall within the
scope of the appended claims. Furthermore, the preceding
description is not meant to limit the scope of the invention.
Rather, the scope of the invention is to be determined by the
appended claims and their equivalents.
[0046] To the extent that the term "includes" or "including" is
employed in the detailed description or the claims, it is intended
to be inclusive in a manner similar to the term "comprising" as
that term is interpreted when employed as a transitional word in a
claim. Furthermore, to the extent that the term "or" is employed in
the detailed description or claims (e.g., A or B) it is intended to
mean "A or B or both". When the applicants intend to indicate "only
A or B but not both" then the term "only A or B but not both" will
be employed. Thus, use of the term "or" herein is the inclusive,
and not the exclusive use. See, Bryan A. Garner, A Dictionary of
Modern Legal Usage 624 (2d. Ed. 1995).
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