U.S. patent application number 10/927882 was filed with the patent office on 2006-03-02 for method and apparatus for cooling a module portion.
Invention is credited to Henry Wong.
Application Number | 20060044756 10/927882 |
Document ID | / |
Family ID | 35942735 |
Filed Date | 2006-03-02 |
United States Patent
Application |
20060044756 |
Kind Code |
A1 |
Wong; Henry |
March 2, 2006 |
METHOD AND APPARATUS FOR COOLING A MODULE PORTION
Abstract
A method of cooling a module portion (202) of an embedded
computer chassis (200), where the module portion comprises a front
module (206) coupled to a front portion of a backplane (204), and a
rear module (208) coupled to a rear portion of the backplane, where
the front module and the rear module are horizontally disposed, the
method includes drawing a cooling air mass (240) into the embedded
computer chassis through a front surface (230) of a first
interspace region (220) and an upper front surface (231) of a
second interspace region (221) in a direction substantially
perpendicular (250) to the front surface and the upper front
surface. A third interspace region (222) receives a first portion
of the cooling air mass (241), the cooling air mass exhausting from
the embedded computer chassis through a rear surface (210) in a
direction substantially perpendicular (256) to the rear
surface.
Inventors: |
Wong; Henry; (Tempe,
AZ) |
Correspondence
Address: |
MOTOROLA, INC.
LAW DEPARTMENT
1303 E. ALGONQUIN ROAD
SCHAUMBURG
IL
60196
US
|
Family ID: |
35942735 |
Appl. No.: |
10/927882 |
Filed: |
August 26, 2004 |
Current U.S.
Class: |
361/695 ;
361/679.02; 361/679.46; 454/184 |
Current CPC
Class: |
H05K 7/20909 20130101;
G06F 1/20 20130101 |
Class at
Publication: |
361/695 ;
361/687; 454/184 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. An embedded computer chassis, comprising: a plurality of outer
surfaces comprising a rear surface, a top surface, a first side
surface and a second side surface, wherein the rear surface is
substantially perpendicular to the first side surface and the
second side surface, and wherein the top surface is substantially
perpendicular to the rear surface; a module portion, comprising: a
backplane disposed substantially vertically within the embedded
computer chassis, wherein the backplane is substantially parallel
to the rear surface; a front module coupled to a front portion of
the backplane, wherein the front module is substantially
horizontally disposed; a rear module coupled to a rear portion of
the backplane, wherein the rear module is substantially
horizontally disposed; and a separation plate horizontally disposed
between the front module and the top surface; a first interspace
region defined by the module portion, the first side surface and
the rear surface, wherein the first interspace region comprises a
front surface substantially perpendicular to the top surface; a
second interspace region defined by the top surface and the
separation plate, wherein the second interspace region comprises an
upper front surface substantially perpendicular to the top surface
and substantially parallel to the front surface, wherein a cooling
air mass is drawn into the embedded computer chassis through the
front surface and the upper front surface in a direction
substantially perpendicular to the front surface and the upper
front surface; and a third interspace region defined by the module
portion, the second side surface and the rear surface, wherein the
third interspace region is coupled to receive a first portion of
the cooling air mass, and wherein the cooling air mass exhausts
from the embedded computer chassis through the rear surface in a
direction substantially perpendicular to the rear surface.
2. The embedded computer chassis of claim 1, further comprising an
air-moving means disposed in the second interspace region, wherein
the air-moving means is coupled to push the first portion of the
cooling air mass over the front module in a direction substantially
parallel to the backplane, and wherein the air-moving means is
coupled to push a second portion of the cooling air mass over the
rear module in a direction substantially perpendicular to the
backplane.
3. The embedded computer chassis of claim 1, wherein the backplane
operates a switched fabric.
4. The embedded computer chassis of claim 1, wherein the backplane
defines a rear module cooling port, and wherein a second portion of
the cooling air mass passes through the rear module cooling port in
a direction substantially perpendicular to the backplane.
5. A method of cooling an embedded computer chassis, comprising:
providing the embedded computer chassis including a plurality of
outer surfaces comprising a rear surface, a top surface, a first
side surface and a second side surface, wherein the rear surface is
substantially perpendicular to the first side surface and the
second side surface, and wherein the top surface is substantially
perpendicular to the rear surface; providing a module portion,
comprising: a backplane disposed substantially vertically within
the embedded computer chassis, wherein the backplane is
substantially parallel to the rear surface; a front module coupled
to a front portion of the backplane, wherein the front module is
substantially horizontally disposed: a rear module coupled to a
rear portion of the backplane, wherein the rear module is
substantially horizontally disposed; and a separation plate
horizontally disposed between the front module and the top surface;
providing a first interspace region defined by the module portion,
the first side surface and the rear surface, wherein the first
interspace region comprises a front surface substantially
perpendicular to the top surface; providing a second interspace
region defined by the top surface and the separation plate, wherein
the second interspace region comprises an upper front surface
substantially perpendicular to the top surface and substantially
parallel to the front surface; drawing a cooling air mass into the
embedded computer chassis through the front surface and the upper
front surface in a direction substantially perpendicular to the
front surface and the upper front surface; providing a third
interspace region defined by the module portion, the second side
surface and the rear surface; the third interspace region receiving
a first portion of the cooling air mass; and the cooling air mass
exhausting from the embedded computer chassis through the rear
surface in a direction substantially perpendicular to the rear
surface.
6. The method of claim 5, further comprising: an air-moving means
disposed in the second interspace region pushing the first portion
of the cooling air mass over the front module in a direction
substantially parallel to the backplane; the air-moving means
pushing a second portion of the cooling air mass over the rear
module in a direction substantially perpendicular to the
backplane.
7. The method of claim 5, wherein the backplane operates a switched
fabric.
8. The method of claim 5, wherein a second portion of the cooling
air mass is passing through a rear module cooling port in a
direction substantially perpendicular to the backplane.
9. A method of cooling a module portion of an embedded computer
chassis, wherein the module portion comprises a front module
coupled to a front portion of a backplane, and a rear module
coupled to a rear portion of the backplane, wherein the front
module and the rear module are horizontally disposed, the method
comprising: drawing a cooling air mass into the embedded computer
chassis through a front surface of a first interspace region and an
upper front surface of a second interspace region in a direction
substantially perpendicular to the front surface and the upper
front surface; providing a third interspace region receiving a
first portion of the cooling air mass, wherein the cooling air mass
is exhausting from the embedded computer chassis through a rear
surface in a direction substantially perpendicular to the rear
surface.
10. The method of claim 9, further comprising: providing an
air-moving means disposed in the second interspace region pushing
the first portion of the cooling air mass over the front module in
a direction substantially parallel to the backplane, wherein the
air-moving means pushing a second portion of the cooling air mass
over the rear module in a direction substantially perpendicular to
the backplane.
11. The method of claim 9, wherein the backplane operates a
switched fabric,
12. The method of claim 9, wherein a second portion of the cooling
air mass is passing through a rear module cooling port in a
direction substantially perpendicular to the backplane.
Description
RELATED APPLICATIONS
[0001] Related subject matter is disclosed in U.S. patent
application entitled "INTEGRATED POWER SUPPLY AND AIR INLET UNIT"
having application Ser. No. ______ and filed on the same date
herewith and assigned to the same assignee.
BACKGROUND OF THE INVENTION
[0002] Existing electronic equipment cabinets generally employ
forced air convection cooling of electronic modules mounted in
chassis within the cabinet. Many prior art cabinet and chassis
configurations circulate cooling air in a side-to-side
configuration. The side-to-side cooling pattern has the
disadvantage of pre-heating air for each successive chassis when
chassis are placed side-by-side as is common in telecommunications
and other embedded applications. As processor speeds increase and
electronic modules generate more thermal energy, prior art
configurations and methods of cooling electronic modules and their
cabinets will become inadequate.
[0003] Accordingly, there is a significant need for an apparatus
and method that overcomes the deficiencies of the prior art
outlined above.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] Referring to the drawing:
[0005] FIG. 1 is a top plan cut-away view of an embedded computer
chassis in accordance with an embodiment of the invention;
[0006] FIG. 2 is a front elevation view of an embedded computer
chassis in accordance with another embodiment of the invention;
[0007] FIG. 3 is a top plan cut-away view of an embedded computer
chassis in accordance with another embodiment of the invention;
and
[0008] FIG. 4 is an interior elevation view of an embedded computer
chassis in accordance with yet another embodiment of the
invention.
[0009] It will be appreciated that for simplicity and clarity of
illustration, elements shown in the drawing have not necessarily
been drawn to scale. For example, the dimensions of some of the
elements are exaggerated relative to each other. Further, where
considered appropriate, reference numerals have been repeated among
the Figures to indicate corresponding elements.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0010] In the following detailed description of exemplary
embodiments of the invention, reference is made to the accompanying
drawings (where like numbers represent like elements), which
illustrate specific exemplary embodiments in which the invention
may be practiced. These embodiments are described in sufficient
detail to enable those skilled in the art to practice the
invention, but other embodiments may be utilized and logical,
mechanical, electrical and other changes may be made without
departing from the scope of the present invention. The following
detailed description is, therefore, not to be taken in a limiting
sense, and the scope of the present invention is defined only by
the appended claims.
[0011] In the following description, numerous specific details are
set forth to provide a thorough understanding of the invention.
However, it is understood that the invention may be practiced
without these specific details. In other instances, well-known
circuits, structures and techniques have not been shown in detail
in order not to obscure the invention.
[0012] For clarity of explanation, the embodiments of the present
invention are presented, in part, as comprising individual
functional blocks. The functions represented by these blocks may be
provided through the use of either shared or dedicated hardware,
including, but not limited to, hardware capable of executing
software. The present invention is not limited to implementation by
any particular set of elements, and the description herein is
merely representational of one embodiment.
[0013] FIG. 1 is a top plan cut-away view of an embedded computer
chassis 100 in accordance with an embodiment of the invention. As
shown in FIG. 1, embedded computer chassis 100 can be defined by a
plurality of outer surfaces including a rear surface 110, first
side surface 112 and second side surface 114, where rear surface
110 can be substantially perpendicular to both first side surface
112 and second side surface 114.
[0014] Embedded computer chassis 100 can include a module portion
102 coupled for receiving one or more modules. For example, module
portion 102 can be coupled for receiving at least one of front
module 106 or rear module 108. As an example, front module 106 can
be coupled to front portion 105 of backplane 104, and rear module
108 can be coupled to rear portion 107 of backplane 104. Backplane
104 can include hardware and software necessary to implement a data
network using a parallel multi-drop topology, switched fabric
topology, and the like. Backplane 104 is disposed substantially
horizontal within embedded computer chassis 100 and substantially
parallel to rear surface 110. With the addition of more chassis to
embedded computer chassis 100, backplane 104 can extend vertically
as well as chassis are "stacked" with embedded computer chassis
100.
[0015] As an example of an embodiment, front module 106 can be a
payload module, switch module, and the like. Rear module 108 can be
a rear transition module to couple embedded computer chassis 100 to
other chassis, networks devices, and the like. Each of front module
106 and rear module 108 can include a printed circuit board (PCB)
having any number of electronic devices located thereon, for
example, and without limitation, processors, memory, storage
devices, I/O elements, and the like. In an embodiment, front module
106 and rear module 108 are substantially horizontally disposed in
conjunction with the orientation of backplane 104.
[0016] Embedded computer chassis 100 can be used in any application
requiring modular, embedded computing resources, for example and
without limitation, telecommunications, industrial control, system
control and data acquisition (SCADA), and the like. In the
exemplary embodiment depicted in FIG. 1, embedded computer chassis
100 can be a 1 U chassis, which refers to the height, thickness,
number of slots, and the like, of the embedded computer chassis
100. 1 U modules can be coupled together and "stacked" to form a
distributed computing system coupled to share resources from each 1
U chassis. When stacked, backplane 104 can extend vertically to
couple each of the stacked modules.
[0017] As is known in the art, "U" and multiples of "U" can refer
to both the width of a module and the height of the embedded
computer chassis 100. In an embodiment, "U" can measure
approximately 1.75 inches. As an example of an embodiment, module
portion 102 can be coupled to accommodate 6 U form factor front
module 106 and rear module 108. The invention is not limited to a 1
U chassis or 6 U modules. Any size chassis or modules, for example
5 U, 10 U, and the like, chassis, and 3 U, 9 U and the like,
modules are within the scope of the invention. The "U" terminology
is not limiting of the invention. As such, the invention is not
limited to "U" as a form factor reference. Other form factor
reference notations and increments are within the scope of the
invention.
[0018] In an embodiment, embedded computer chassis 100 can include
backplane 104, front module 106 and rear module 108 coupled to
operate a parallel multi-drop network, for example, a VERSAmodule
Eurocard (VMEbus) network using any of the VMEbus protocols known
in the art. VMEbus is defined in the ANSI/VITA 1-1994 and ANSI/VITA
1.1-1997 standards, promulgated by the VMEbus International Trade
Association (VITA), P.O. Box 19658, Fountain Hills, Aria., 85269
(where ANSI stands for American National Standards Institute). In
an embodiment of the invention, VMEbus based protocols can include,
but are not limited to, Single Cycle Transfer protocol (SCT), Block
Transfer protocol (BLT), Multiplexed Block Transfer protocol
(MBLT), Two Edge VMEbus protocol (2eVME) and Two Edge Source
Synchronous Transfer protocol (2eSST). These VMEbus protocols are
known in the art.
[0019] In another embodiment, embedded computer chassis 100 can
include backplane 104, front module 106 and rear module 108 coupled
to operate a switched fabric. Switched fabric can use switch module
as a central switching hub with any number of payload modules
coupled to switch module. Switched fabric can be based on a
point-to-point, switched input/output (I/O) fabric, whereby
cascaded switch devices interconnect end node devices. In an
embodiment, switched fabric can be configured as a star topology,
mesh topology, and the like as known in the art for communicatively
coupling switched fabrics. Switched fabric can include both
module-to-module (for example computer systems that support I/O
module add-in slots) and chassis-to-chassis environments (for
example interconnecting computers, external storage systems,
external Local Area Network (LAN) and Wide Area Network (WAN)
access devices in a data-center environment). Switched fabric can
be implemented by using one or more of a plurality of switched
fabric network standards, for example and without limitation,
InfiniBand.TM., Serial RapidIO.TM., FibreChannel.TM., Ethernet.TM.,
PCI Express.TM., Hypertransport.TM., and the like. Switched fabric
is not limited to the use of these switched fabric network
standards and the use of any switched fabric network standard is
within the scope of the invention.
[0020] In yet another embodiment, embedded computer chassis 100 can
include backplane 104, front module 106 and rear module 108 coupled
to operate a VXS network where backplane 104 conforms to the
VERSAmodule Eurocard (VMEbus) switched serial standard backplane
(VXS) as set forth in VITA 41 promulgated by VMEbus International
Trade Association (VITA), P.O. Box 19658, Fountain Hills, Ariz.,
85269. VXS network includes a switched fabric and a VMEbus network,
both located on backplane 104. In other words, a VXS network
includes a switched fabric coincident, and operating concurrently
with a VMEbus network on backplane 104.
[0021] In still another embodiment, backplane 104, front module 106
and rear module 108 can operate using CompactPCI.RTM. protocol.
CompactPCI protocol, including mechanical dimensions, electrical
specifications, and the like, are known in the art and set forth in
the CompactPCI Specification, by PCI Industrial Computer
Manufacturers Group (PCIMG.TM.), 301 Edgewater Place, Suite 220,
Wakefield, Mass.
[0022] As shown in FIG. 1, first side surface 112, rear surface 110
and module portion 102 define first interspace region 120. In one
embodiment, first interspace region 120 extends the height of
embedded computer chassis 100. In another embodiment, first
interspace region 120 extends a portion of the height of embedded
computer chassis 100. The specific size and configuration of first
interspace region 120 can be tailored by one skilled in the art to
fit a specific application and be within the scope of the
invention.
[0023] Also, second side surface 114, rear surface 110 and module
portion 102 define second interspace region 122. In one embodiment,
second interspace region 122 extends the height of embedded
computer chassis 100. In another embodiment, second interspace
region 122 extends a portion of the height of embedded computer
chassis 100. The specific size and configuration of second
interspace region 122 can be tailored by one skilled in the art to
fit a specific application and be within the scope of the
invention.
[0024] In an embodiment, embedded computer chassis 100 can include
integrated power supply air inlet unit 124 coupled to slidably
insert into the first interspace region 120. Integrated power
supply air inlet unit 124 can couple to backplane 104 and include
power supply 128 to supply power to embedded computer chassis 100.
In an embodiment, integrated power supply air inlet unit 124 can be
hot-swappable in embedded computer chassis 100 so that slidably
inserting or removing integrated power supply air inlet unit 124
does not disrupt power to embedded computer chassis 100 given that
another power supply is coupled to embedded computer chassis
100.
[0025] In an embodiment, integrated power supply air inlet unit 124
includes front surface 130 that is substantially perpendicular to
first side surface 112. Front surface 130 is an integral component
of integrated power supply air inlet unit 124. In an embodiment,
front surface 130 can include one or more orifices to allow cooling
air mass 140 to be drawn into embedded computer chassis 100 in a
direction substantially perpendicular 150 to front surface 130.
Cooling air mass 140 can function to cool heat-generating
electronics associated with front module 106, rear module 108,
backplane 104, power supply 128, and the like.
[0026] In an embodiment, embedded computer chassis 100 can include
air-moving unit 126 coupled to slidably insert into the second
interspace region 122. Air-moving unit 126 can couple to backplane
104. In an embodiment, air-moving unit 126 can draw power from
backplane 104 or from another dedicated circuit in embedded
computer chassis 100. In an embodiment, air-moving unit 126 can be
hot-swappable in embedded computer chassis 100 so that slidably
inserting or removing air-moving unit 124 does not disrupt the
operation of embedded computer chassis 100.
[0027] In an embodiment, air-moving unit 126 can include any number
of air-moving apparatuses 121, which can include, for example and
without limitation, fans, blowers, and the like. Air-moving
apparatus 121 can be configured in any combination of "push" or
"pull" patterns. In other words, air-moving apparatus 121 can
either "push" cooling air mass 140 over module portion 102, "pull"
cooling air mass 140 over module portion 102, or any combination
thereof. In pushing or pulling cooling air mass 140 over modules,
cooling air mass 140 can flow over one or both sides of modules. As
an example of an embodiment, air-moving unit 126 can include one or
more muffin fans. The number and operating point of air-moving
apparatus 121 can be chosen to fit a particular application and is
well within the abilities of one of ordinary skill in the art.
[0028] In an embodiment, air-moving unit 126 is coupled to draw
cooling air mass 140 over front module 106 in a direction
substantially parallel 152 to backplane 104 and front surface 130.
Cooling air mass 140 can flow over one or both sides of front
module 106. Once cooling air mass 140 reaches air-moving unit 126,
cooling air mass 140 can be turned approximately ninety degrees
toward rear surface 110.
[0029] In an embodiment, cooling air mass 140 can be split into
first portion of cooling air mass 141 and second portion of cooling
air mass 142 after passing through air-moving apparatus 121. In an
embodiment, air-moving unit 126 is coupled to push first portion of
cooling air mass 141 over rear module 108 in a substantially
opposite direction 154 substantially parallel to backplane 104.
First portion of cooling air mass 141 can flow over one or both
sides of rear module 108. In an embodiment, embedded computer
chassis 100 is coupled to exhaust second portion of cooling air
mass 142 through first portion 111 of rear surface 110 in a
direction substantially perpendicular 156 to rear surface 110.
Also, in an embodiment, embedded computer chassis 100 is coupled to
exhaust first portion of cooling air mass 141 through second
portion 113 of rear surface 110 in a direction substantially
perpendicular 156 to rear surface 110. Both first portion 111 and
second portion 113 of rear surface 110 can have one or more
orifices sized by one skilled in the art for a particular
application. The orifices can be sized such that first portion of
cooling air mass 141 and second portion of cooling air mass 142 are
proportioned as needed for a particular application.
[0030] In an embodiment, first portion 111 of rear surface 110 has
a dimension "Y" and second portion 113 of rear surface 110 has a
dimension "Z." In an embodiment, the ratio of first portion 111 to
second portion 113 can range between 0.5:2.0 and 2.0:0.5. In
another embodiment, the ratio of first portion 111 to second
portion 113 is substantially 1:1.
[0031] FIG. 2 is a front elevation view of an embedded computer
chassis 200 in accordance with another embodiment of the invention.
As shown in FIG. 2, embedded computer chassis 200 can include
module portion 202, first interspace region 220, third interspace
region 222 and top surface 233. First interspace region 220, third
interspace region 222 and module portion 202 will be described with
more particularity in reference to FIG. 3. Module portion 202 can
include front module 206 analogous to that described with reference
to FIG. 1. In an embodiment, first interspace region 220 can
include front surface 230 and module portion 202 can include upper
front surface 231. In an embodiment, upper front surface 231 can be
a fixed part embedded computer chassis 200. In another embodiment,
upper front surface 231 can be a part of front module 206. Front
surface 230 and upper front surface 231 are substantially
perpendicular to top surface 233. Also, upper front surface 231 is
substantially parallel to front surface 230. In an embodiment,
front surface 230 and upper front surface 231 can include one or
more orifices 272 to permit cooling air mass to enter embedded
computer chassis 200 in a direction substantially perpendicular to
front surface 230 and upper front surface 231.
[0032] Embedded computer chassis 200 can be used in any application
requiring modular, embedded computing resources, for example and
without limitation, telecommunications, industrial control, system
control and data acquisition (SCADA), and the like. In the
embodiment depicted in FIG. 2, embedded computer chassis 200 can be
a 1 U chassis, which refers to the height, thickness, number of
slots, and the like, of the embedded computer chassis 200. 1 U
modules can be coupled together and "stacked" to form a distributed
computing system coupled to share resources from each 1 U chassis.
The invention is not limited to a 1 U chassis. Any size chassis,
for example 5 U, 10 U, and the like, chassis are within the scope
of the invention. The "U" terminology is not limiting of the
invention. As such, the invention is not limited to "U" as a form
factor reference. Other form factor reference notations and
increments are within the scope of the invention.
[0033] FIG. 3 is a top plan cut-away view of an embedded computer
chassis 200 in accordance with another embodiment of the invention.
As shown in FIG. 2, embedded computer chassis 200 can be defined by
a plurality of outer surfaces including a rear surface 210, first
side surface 212 and second side surface 214, where rear surface
210 can be substantially perpendicular to both first side surface
212 and second side surface 214. Also, top surface 233 (shown in
FIG. 2) can be substantially perpendicular to rear surface 210.
[0034] Embedded computer chassis 200 can include a module portion
202 coupled for receiving one or more modules. For example, module
portion 202 can be coupled for receiving at least one of front
module 206 or rear module 208. As an example, front module 206 can
be coupled to front portion 205 of backplane 204, and rear module
208 can be coupled to rear portion 207 of backplane 204. Backplane
204 can include hardware and software necessary to implement a data
network using the Advanced Telecom and Computing Architecture
(AdvancedTCA.TM.) topology as set forth in PCI Industrial Computer
Manufacturers Group (PCIMG.RTM.) specifications 3.x, promulgated by
PCIMG, 301 Edgewater Place, Suite 220, Wakefield, Mass. Backplane
204 is disposed substantially horizontal within embedded computer
chassis 200 and substantially parallel to rear surface 210. The
addition of more chassis to embedded computer chassis 100,
backplane 204 can extend vertically as well as chassis are
"stacked" with embedded computer chassis 200.
[0035] As an example of an embodiment, front module 206 can be a
payload module, switch module, and the like. Rear module 208 can be
a rear transition module to couple embedded computer chassis 200 to
other chassis, networks devices, and the like. Each of front module
206 and rear module 208 can include a printed circuit board (PCB)
having any number of electronic devices located thereon, for
example, and without limitation, processors, memory, storage
devices, I/O elements, and the like. In an embodiment, front module
206 and rear module 208 are substantially horizontally disposed
analogous to the orientation of backplane 204.
[0036] In the exemplary embodiment depicted in FIG. 3, embedded
computer chassis 200 can be a 1 U chassis, which refers to the
height, thickness, number of slots, and the like, of the embedded
computer chassis 200. 1 U modules can be coupled together and
"stacked" to form a distributed computing system coupled to share
resources from each 1 U chassis. When stacked, backplane 204 can
extend vertically to couple each of the stacked modules.
[0037] As an example of an embodiment, module portion 202 can be
coupled to accommodate 8 U form factor front module 206 and rear
module 208. The invention is not limited to 8 U modules. Any size
modules, for example, 3 U, 6 U, 9 U and the like, modules are
within the scope of the invention. The "U" terminology is not
limiting of the invention. As such, the invention is not limited to
"U" as a form factor reference. Other form factor reference
notations and increments are within the scope of the invention.
[0038] In an embodiment, module portion 202 includes separation
plate 211 horizontally disposed between front module 206 and top
surface 233, and between rear module 208 and top surface 233. In
another embodiment, separation plate 211 can be horizontally
disposed between only front module 206 and top surface 233.
Separation plate 211 can operate to prevent incoming cooling air
mass 240 from passing over front module 206 prior to entering first
interspace region 220.
[0039] As shown in FIG. 3, first side surface 212, rear surface 210
and module portion 202 define first interspace region 220. In one
embodiment, first interspace region 220 extends the height of
embedded computer chassis 200. In another embodiment, first
interspace region 220 extends a portion of the height of embedded
computer chassis 200. The specific size and configuration of first
interspace region 220 can be tailored by one skilled in the art to
fit a specific application and be within the scope of the
invention.
[0040] As shown in FIGS. 2 and 3, top surface 233 and separation
plate 211 define second interspace region 221. Second interspace
region 221 can include upper front surface 231, which is
substantially perpendicular to top surface 233 and substantially
parallel to front surface 230.
[0041] Second side surface 214, rear surface 210 and module portion
202 define third interspace region 222. In one embodiment, third
interspace region 222 extends the height of embedded computer
chassis 200. In another embodiment, third interspace region 222
extends a portion of the height of embedded computer chassis 200.
The specific size and configuration of third interspace region 222
can be tailored by one skilled in the art to fit a specific
application and be within the scope of the invention. In an
embodiment of the invention, first interspace region 220 and second
interspace region 222 operate as air plenums to facilitate cooling
of plurality of module portion 202 and embedded computer chassis
200.
[0042] In an embodiment, first interspace region 220 can include
any number of air-moving means 223, which can include, for example
and without limitation, fans, blowers, and the like. Cooling air
mass 240 can flow over one or both sides of modules. As an example
of an embodiment, air-moving means 223 can include one or more
muffin fans. The number and operating point of air-moving means 223
can be chosen to fit a particular application and is well within
the abilities of one of ordinary skill in the art.
[0043] In an embodiment, air-moving means 223 is coupled to draw
cooling air mass 240 into embedded computer chassis 200 through
front surface 230 and upper front surface 231 in a direction
substantially perpendicular 250 to front surface 230 and upper
front surface 231. In a further embodiment, air-moving means 223 is
coupled to push first portion of cooling air mass 241 over front
module 206 in a direction substantially parallel 252 to backplane
204, upper front surface 231 and front surface 230. First portion
of cooling air mass 241 can flow over one or both sides of front
module 206.
[0044] In an embodiment, backplane 204 defines rear module cooling
port 213, which can have one or more orifices designed to permit
cooling air to flow to rear module 208. Air-moving means 223 can be
coupled to further push second portion of cooling air mass 242
through rear module cooling port 213 and over rear module 208 in a
direction substantially perpendicular 254 to backplane 204.
[0045] In an embodiment, third interspace region 222 is coupled to
receive first portion of cooling air mass 241 after first portion
of cooling air mass 241 passes over front module 206. Subsequently,
cooling air mass 240 exhausts from embedded computer chassis
through rear surface in a direction substantially perpendicular 256
to rear surface 210. In an embodiment, first portion of cooling air
mass 241 can exhaust out a portion of rear surface 210 not
coincident with rear module 208, and second portion of cooling air
mass 242 can exhaust out a portion of rear surface 210 coincident
with rear module 208.
[0046] Both rear surface 210 and rear module cooling port 213 can
have one or more orifices, sized by one skilled in the art, to
permit the passing of cooling air mass 240 or a portion of cooling
air mass 240. The orifices can be sized such that first portion of
cooling air mass 241 and second portion of cooling air mass 242 are
proportioned as needed for a particular application.
[0047] FIG. 4 is an interior elevation view of an embedded computer
chassis 200 in accordance with yet another embodiment of the
invention. FIG. 4 along with FIGS. 2 and 3 further illustrate an
embodiment of the invention. As shown in FIG. 4, cooling air mass
240 is drawn into embedded computer chassis 200 in a direction
perpendicular 250 to front surface 230 and upper front surface
231.
[0048] Air-moving means 223 is coupled to push first portion of
cooling air mass 241 over front module 206 in a direction
substantially parallel 252 to backplane 204, upper front surface
231 and front surface 230. In an embodiment, first portion of
cooling air mass 241 can flow over one or both sides of front
module 206. Air-moving means 223 can be coupled to further push
second portion of cooling air mass 242 through rear module cooling
port 213, over rear module 208 in a direction substantially
perpendicular 254 to backplane 204.
[0049] Third interspace region 222 is coupled to receive first
portion of cooling air mass 241 after first portion of cooling air
mass 241 passes over front module 206. Subsequently, cooling air
mass 240 exhausts from embedded computer chassis through rear
surface in a direction substantially perpendicular 256 to rear
surface 210. In an embodiment, first portion of cooling air mass
241 can exhaust out a portion of rear surface 210 not coincident
with rear module 208, and second portion of cooling air mass 242
can exhaust out a portion of rear surface 210 coincident with rear
module 208.
[0050] While we have shown and described specific embodiments of
the present invention, further modifications and improvements will
occur to those skilled in the art. It is therefore, to be
understood that appended claims are intended to cover all such
modifications and changes as fall within the true spirit and scope
of the invention.
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