U.S. patent application number 11/137975 was filed with the patent office on 2006-02-23 for electrical connector having protecting protrusions.
This patent application is currently assigned to HON. HAI PRECISION IND. CO., LTD.. Invention is credited to Hao-Yun Ma, Ming-Lun Szu.
Application Number | 20060040518 11/137975 |
Document ID | / |
Family ID | 35052067 |
Filed Date | 2006-02-23 |
United States Patent
Application |
20060040518 |
Kind Code |
A1 |
Ma; Hao-Yun ; et
al. |
February 23, 2006 |
ELECTRICAL CONNECTOR HAVING PROTECTING PROTRUSIONS
Abstract
A land grid array connector (10) for electrically connecting a
CPU package to a printed circuit board includes a housing (30)
having a top surface (320) and a number of terminals received in
passageways (31) of the housing. Each of the terminals has a
retention portion (52), a spring arm (54) extending from the
retention portion beyond the top surface. A contacting portion (58)
is formed on a topmost part of the spring arm for electrically
mating with a corresponding pad formed on a bottom of the CPU
package. A plurality of protrusions (324) is formed on the top
surface for protect the terminals from being accidental damaged, A
common supporting surface (326) is formed cooperatively by the
protrusions, above the contacting portion in a direction
perpendicular to the top surface. This can protect the contacting
portion of the terminal from being collided. As a result reliable
electrical connection between the package and contacts of the land
grid array connector is secured.
Inventors: |
Ma; Hao-Yun; (Tu-Chen,
TW) ; Szu; Ming-Lun; (Tu-Chen, TW) |
Correspondence
Address: |
WEI TE CHUNG;FOXCONN INTERNATIONAL, INC.
1650 MEMOREX DRIVE
SANTA CLARA
CA
95050
US
|
Assignee: |
HON. HAI PRECISION IND. CO.,
LTD.
|
Family ID: |
35052067 |
Appl. No.: |
11/137975 |
Filed: |
May 25, 2005 |
Current U.S.
Class: |
439/66 |
Current CPC
Class: |
H05K 7/1061 20130101;
H01R 12/714 20130101; H01R 13/2442 20130101 |
Class at
Publication: |
439/066 |
International
Class: |
H01R 12/00 20060101
H01R012/00 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 23, 2004 |
CN |
2004200789936 |
Claims
1. An electrical connector for electrically connecting an
electronic package comprising: an insulative housing defining a top
surface and a plurality of passageways extending from the top
surface; a plurality of terminals received in the passageways,
respectively; the terminals each having a retention portion secured
in a corresponding passageway, a spring arm extending from the
retention portion beyond the top surface and a contacting portion
formed on the spring arm above the top surface a distance for
electrically connecting with the package; and at least one
protrusion formed on the top surface, said protrusion cooperatively
forming a supporting surface, the supporting surface being higher
than the contacting portion in a direction perpendicular the top
surface.
2. The electrical connector as claimed in claim 1, wherein the
protrusions integrally project from the top surface, the
protrusions respectively being situated around a corresponding
passageway.
3. The electrical connector as claimed in claim 2, wherein the
passageways each define a securing section and a receiving section
perpendicular to and in communication with the securing
section.
4. The electrical connector as claimed in claim 3, wherein the
protrusion is located at one side of the receiving section of the
passageway, opposing to the securing section.
5. The electrical connector as claimed in claim 2, wherein the
protrusions each have a parallelepiped configuration.
6. The electrical connector as claimed in claim 1, wherein the
spring arm of the terminal has a first section connecting with the
retention portion and a second section bent from the first section,
the second having a taper configuration.
7. An electrical connector for electrically connecting an
electronic package comprising: an insulative housing defining a
plurality of passageways terminated on a top surface thereof; a
plurality of terminals disposed in the passageways, respectively;
each terminal having a contacting portion exposed outside the top
surface a distance in a direction perpendicular to the top surface;
and at least one protrusion formed on the top surface, said
protrusion projecting upwardly beyond the top surface a vertical
height larger than the distance the contacting portion of the
terminal beyond the top surface.
8. The electrical connector as claimed in claim 7, wherein the
protrusions each integrally project from a side of a corresponding
passageway.
9. The electrical connector as claimed in claim 8, wherein from a
top elevation aspect of the connector, the protrusion is located at
the side of the passageway, near the contacting portion of the
terminal received in the passageway.
10. The electrical connector as claimed in claim 8, wherein the
protrusion has a parallelepiped configuration.
11. An electrical connector assembly comprising: an insulative
housing defining a top surface and a plurality of passageways
therethrough; a plurality of conductive contacts secured in
corresponding passageways, respectively; each of the contacts
having a contacting portion exposed above the top surface with a
distance; and a plurality of protrusions located on the top
surface, each protrusion being situated beside a corresponding
passageway and having a vertical height respective to the top
surface larger than the distance the contacting portion above the
top surface.
12. The electrical connector assembly as claimed in claim 1,
wherein from a top elevation, the protrusion is situated at one
side of the passageway near the contacting portion of the terminal
received in the passageway.
13. The electrical connector assembly as claimed in claim 11,
further including an electronic package defining a bottom surface
with thereon a plurality of downwardly extending conductive
pin-like pads, wherein the electronic package is seated upon the
housing under a condition that the bottom surface of the electronic
package is spaced from the top surface of the housing with a
distance not less than said vertical height, and the pin-like pads
engagably and downwardly press the corresponding contact portions
of the terminals, respectively.
14. The electrical connector assembly as claimed in claim 13,
wherein under said condition, the contacting portions are
essentially flush with or located below the top surface of the
housing.
15. The electrical connector assembly as claimed in claim 12,
wherein the terminal includes a spring arm having one distal end at
which the contacting portion is located, and from said top
elevation, the corresponding protrusion situated near the
contacting portion, is located outside of said distal end and in
alignment with said spring arm along an extension direction of said
spring arm.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the invention
[0002] The present invention relates to electrical connectors, and
more particularly to a land grid array (LGA) connector for
electrically connecting an electronic package such as a CPU chip,
to a circuit substrate such as a printed circuit board (PCB).
[0003] 2. Description of the Prior Art
[0004] Land grid array (LGA) electrical connectors are widely used
in the connector industry for electrically connecting CPU chips to
PCBs. A conventional LGA electrical connector is disclosed in U.S.
Pat. No. 6,695,624. The electrical connector generally comprises an
insulative housing and a plurality of electrical terminals received
in the housing. Each terminal has a relatively long spring arm
extending beyond outside the housing, for electrically mating with
a corresponding pad on a CPU chip. However, the connector has a
shortcoming that there is no protecting means for the terminals.
When the connector is collided by an exterior object, the spring
arm is prone to be accidental damaged because of undue force
generated during the colliding. The terminal being damaged is
difficult to effectively mating with the pad on the CPU chip. This
can thereby affect reliable electrical connecting between the
connector and the CPU chip.
[0005] Therefore, a new land grid array electrical connector, which
overcomes the above-mentioned disadvantages of the prior art, is
desired.
SUMMARY OF THE INVENTION
[0006] Accordingly, a main object of the present invention is to
provide a new LGA connector with terminals, whereby the connector
can protect the terminals from being accidental damaged.
[0007] To achieve the aforementioned object, an LGA connector 1 in
accordance with a preferred embodiment of the present invention is
provided. The connector comprises an insulative housing having a
top surface and a plurality of passageways received in the housing.
The terminals each have a retention portion secured in the housing
and a spring arm extending from the retention portion. A contacting
portion is formed at a topmost part of the spring arm, exposing
above the top surface a distance in a direction perpendicular to
the top surface. A plurality of protrusions is formed on the top
surface. Said protrusions project beyond the top surface, for
protecting the terminals from collided damage. A common supporting
surface is formed on a top of said protrusions, the supporting
surface being higher than the contacting portion in the direction
perpendicular to the top surface.
[0008] Other objects, advantages and novel features of the present
invention will become more apparent from the following detailed
description when taken in conjunction with the accompanying
drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is an isometric view of an LGA connector in
accordance with a preferred embodiment of the present invention,
showing terminals received in passageways defined in a housing of
the connector respectively;
[0010] FIG. 2 is an enlarged, isometric view of one terminal of
FIG. 1
[0011] FIG. 3 is an enlarged view of a circled portion m of FIG.
1;
[0012] FIG. 4 is a cross-sectional view of the connector of FIG. 1,
together with a CPU chip and a PCB, and showing the CPU being ready
to be pressed down;
[0013] FIG. 5 is an enlarged view of a circled portion V-V of FIG.
4;
[0014] FIG. 6 is similar to FIG. 1, but showing the CPU being
pressed down; and
[0015] FIG. 7 is an enlarged view of a circled portion VII-VII of
FIG. 6.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT OF THE
INVENTION
[0016] Reference will now be made to the drawings to describe the
present invention in detail.
[0017] Referring to FIG. 1, an LGA connector 10 in accordance with
a preferred embodiment of the present invention is provided for
electrically connecting a CPU chip 80 to a PCB 90 (best seen in
FIGS. 4 and 6). The LGA connector 10 may, of course, be applied in
other environments such as for electrically interconnecting two
PCBs and so on. The connector 10 comprises a rectangular insulative
housing 30 and a plurality of terminals 50 received in the housing
30.
[0018] The housing 30 is configured with a bottom wall 32 and four
side walls 34 extending upwardly from peripheries of the bottom
wall 32. A receiving cavity 31 is defined between the bottom wall
32 and the side walls 34, for accommodating the CPU chip 3 therein.
Guiding slant surfaces 340 are formed on the side walls 34 around a
top mouth of the cavity 31, for facilitating insertion of the CPU
package 90 into the cavity 31.
[0019] Referring also to FIG. 2, a top surface 320 is formed on a
top of the bottom wall 32, for supporting the CPU chip 80 thereon.
A bottom surface 322 is formed on a bottom of the bottom wall 32,
for being mounted on the PCB 90. A plurality of passageways 321
arranged in array is defined in the bottom wall 32. The passageways
321 extend from the top surface 320 to the bottom surface 322, for
receiving the terminals 50 respectively therein. Each passageway
321 has a general T-shaped configuration, and includes a large
receiving section 323 and a narrow securing section 325
perpendicular to and in communication with the receiving section
323.
[0020] Referring best to FIGS. 2 and 4 to 7, a plurality of
parallelepiped protrusions 324 is formed on the housing 30,
projecting integrally and upwardly from the top surface 320 of
bottom wall 32. The protrusions 324 have a common top-supporting
surface 326 for engaging sustaining the CPU chip 80 thereon when
the CPU chip 80 is secured in the cavity 31 of the housing 30. In
addition, the protrusions 324 each have a uniform vertical height
relative to the top surface 322, in a thickness direction of the
bottom wall 32. Thereby, the CPU chip 80 can steadily sit on the
protrusions 324. The protrusion 324 is located around a
corresponding passageway 321 at one side near the receiving section
323 of the passageway 321 and opposing to the securing section
325.
[0021] Referring to FIG. 3, the terminals 50 are formed from
conductive material by known stamping process. Each terminal 50 has
a vertical plate-like retention portion 52, a cantilever-shaped
spring arm 54 extending upwardly from a top of the retention
portion 52, and a tail portion 56 extending downwardly from a
bottom of the retention portion 52. A plurality of barbs 520 is
formed on opposite lateral sides of the retention portion 52, for
interferingly engaging inner sides of the securing section 325 of a
corresponding passageway 321. The tail portion 56 is substantially
perpendicularly bent from the bottom of the retention portion 52,
for electrically engaging a corresponding contact pad (not showed)
on the PCB 90 via a soldering ball 92.
[0022] The spring arm 54 includes a vertical first extending
section 52A extending upwardly from the top of the retention
portion 52, and a general horizontal second extending section 54B
bent slantwise from a top end of the first extending portion 54A.
The second extending section 54B has a substantially taper
configuration, with a sectional width becoming gradually smaller
and smaller from a start end adjacent the first extending section
54A to a free end thereof. A contacting portion 58 is formed at the
free end of the second extending section 54B, with its distal end
facing downwardly. The contacting portion 58 is located at a
topmost part of the spring arm 50 and has an arced or curved upper
surface (not numbered), for electrically engaging a corresponding
pad 82 formed on a bottom of the CPU chip 80.
[0023] In assembly, the terminal 50 is loaded from a top of the
housing 30 into a corresponding passageway 321, with the tail
portion 56 going through the receiving section 325 of the
passageway 321. The retention portion 52 is planted in the securing
section 323 of the passageway 321, the barbs 520 engagingly
intervening the inner side of the securing section 323. Thus the
terminal 50 is firmly retained in the passageway 321.
[0024] After assembly, the second extending section 54B of the
spring arm 54 partly projects from the receiving section 323 beyond
the top surface 320 of the housing 30 and below the supporting
surface 326 of the protrusions 324. As best seen FIG. 5, the
supporting surface 326 of the protrusions 324 is higher a vertical
distance h than the contacting portion 58 of the terminal 50 in a
direction perpendicular to the top surface 320. From a top
elevation aspect of the connector, the protrusion 324 is close to
the contacting portion 58.
[0025] Because the contacting portion 58 of the spring arm 54 is
lower than the supporting surface 326 of the protrusion 324, when
the connector 10 is improperly collided by exterior objects from
the top of the housing 30, the protrusions 324 can resist the
exterior objects. And this thereby can avoid the contacting portion
58 from being damaged because of the undue force generated during
the colliding. In addition, in this preferred embodiment, the
protrusion 324 is located at the side of the corresponding
passageway 321, near the receiving section 323 of the passageway
321. And from a top elevation aspect of the connector, the
protrusion 324 is close to the contacting portion 58. This can
protect the contacting portion 58 of the terminal 50 from being
damaged more effectively.
[0026] In use, the connector 10 is electrically mounted on the PCB
90, the tail portion 56 of the terminal 50 connecting with the
soldered ball 92. The CPU chip 80 is inserted into the cavity 31 of
the housing 30, with each pad 82 of the CPU chip 80 seating and
pressing on the contacting portion 58 of a corresponding terminal
50. The CPU chip 80 is pressed down by exterior force until the
bottom of the CPU chip 80 is fully and steadily sustained on the
supporting surface 326 of the protrusions 324 of the housing 30.
The pad 82 of the CPU chip 80 has a bottom face pressed the
contacting portion 58 of the terminal to urge the spring arm 54 to
resiliently deform down. Thus the CPU chip 80 is electrically
connected with the connector 10.
[0027] The above-described embodiment shows that the protrusion 324
is located around a corresponding passageway 321 and has a
parallelepiped configuration, but it is not limited thereto. The
protrusion 324 may have other shapes or configuration, e.g.
step-like projection and so on, provided that those kinds of
protrusions 324 each can provide the supporting surface 326 above
the top surface 320 a determined height and avoid from intervening
with the contacts 50. And this thereby avoids colliding and
scraping damage of the housing 10 by motion of the CPU chip. As a
result, effective electrical connection between the CPU chip 60 and
the contacts 12 of the connector is secured.
[0028] While the present invention has been described with
reference to a preferred embodiment, the description is
illustrative and is not to be construed as limiting the invention.
Therefore, various equivalent modifications and changes known to
persons skilled in the art according to the spirit of the present
invention are considered within the scope of the present invention
as defined in the appended claims.
* * * * *