U.S. patent application number 11/250940 was filed with the patent office on 2006-02-16 for master base for fabrication and method for manufacturing the same.
This patent application is currently assigned to SONY CORPORATION. Invention is credited to Moriaki Abe, Jumi Kimura, Kazuhiro Shinoda.
Application Number | 20060035472 11/250940 |
Document ID | / |
Family ID | 19126380 |
Filed Date | 2006-02-16 |
United States Patent
Application |
20060035472 |
Kind Code |
A1 |
Kimura; Jumi ; et
al. |
February 16, 2006 |
Master base for fabrication and method for manufacturing the
same
Abstract
A master base for fabrication includes a substrate, a first
photoresist layer disposed on the substrate, and a second
photoresist layer disposed on the first photoresist layer, wherein
the first photoresist layer attenuates or absorbs rays reflected at
the interface between the first photoresist layer and the substrate
to prevent the reflected rays from interfering with applied rays in
a exposing step. A method for manufacturing a master base for
fabrication includes the steps of forming a first photoresist layer
on a substrate, baking the first photoresist layer at the setting
temperature of the first photoresist layer, and forming a second
photoresist layer on the first photoresist layer.
Inventors: |
Kimura; Jumi; (Miyagi,
JP) ; Abe; Moriaki; (Miyagi, JP) ; Shinoda;
Kazuhiro; (Miyagi, JP) |
Correspondence
Address: |
ROBERT J. DEPKE;LEWIS T. STEADMAN
TREXLER, BUSHNELL, GLANGLORGI, BLACKSTONE & MARR
105 WEST ADAMS STREET, SUITE 3600
CHICAGO
IL
60603-6299
US
|
Assignee: |
SONY CORPORATION
|
Family ID: |
19126380 |
Appl. No.: |
11/250940 |
Filed: |
October 14, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10261609 |
Sep 30, 2002 |
6979527 |
|
|
11250940 |
Oct 14, 2005 |
|
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Current U.S.
Class: |
438/758 |
Current CPC
Class: |
G03F 7/094 20130101;
G03F 7/091 20130101 |
Class at
Publication: |
438/758 |
International
Class: |
H01L 21/31 20060101
H01L021/31; H01L 21/469 20060101 H01L021/469 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 2, 2001 |
JP |
JP2001-306803 |
Claims
1-2. (canceled)
3. A method for manufacturing a master base for fabrication
comprising the steps of: forming a first photoresist layer on a
substrate; baking the first photoresist layer at the setting
temperature of the first photoresist layer, and forming a second
photoresist layer on the first photoresist layer.
4. The method for manufacturing a master base for fabrication
according to claim 3, wherein the first photoresist layer comprises
a plurality of sublayers, and the plurality of sublayers are
prepared by repeating the steps of forming a sublayer comprising a
photoresist material to bake the sublayer at the setting
temperature of the photoresist material.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to master bases for
fabrication, for example, a master base for manufacturing masters
for the fabrication of microlens arrays, and a method for
manufacturing the master base for fabrication.
[0003] 2. Description of the Related Art
[0004] Currently, the following processing procedure is generally
employed for manufacturing microlenses: a photoresist material is
applied onto a substrate to form a photoresist layer thereon, the
photoresist layer is patterned to form an array, and the obtained
array is provided as a mold for microlenses.
[0005] In this processing procedure, as shown in FIG. 3, a single
photoresist layer 20 is formed on a substrate 10, and the
photoresist layer 20 is patterned to form a desired pattern by a
photolithography method. However, there is a problem in that the
obtained pattern does not have a smooth surface functioning as, for
example, a lens surface. That is, steps 30 are situated on the
surface of the pattern, as shown in FIG. 3B and FIG. 3C, which is a
partly enlarged view of FIG. 3B.
[0006] It has been found that the above phenomenon is caused as
follows: in a single photoresist layer on a substrate, rays applied
to the photoresist layer interfere with rays reflected at an
interface between the substrate surface and the photoresist layer
surface to form standing waves and the photoresist layer is also
exposed to the standing waves.
[0007] That is, when the single photoresist layer is exposed, the
applied rays, which are supplied from a light source, interfere
with the reflected rays to form other rays having different
intensities. The formed rays having different intensities cause
steps, which form the same pattern as the interference pattern, on
the surface of the photoresist layer. As a result, the processed
photoresist layer having an optical lens shape have steps on the
surface, that is, the surface is not smooth. Therefore, when the
processed photoresist layer is used as a master for manufacturing,
for example, microlenses, obtained microlens have inferior
converging performance due to the occurrence of scattering.
[0008] In the present invention, in order to solve the above
problem, two or more photoresist layers are formed on a substrate
to suppress or eliminate the adverse effects caused by rays
reflected at the interface between the bottom of the photoresist
layers and the substrate, as described below. However, this method
employing two or more photoresist layers causes another problem.
That is, in a step of forming a plurality of the photoresist
layers, a photoresist layer is formed and is then pre-baked to form
another photoresist layer thereon, and this procedure is repeated.
In this procedure, when the formed lower photoresist layer is
pre-baked at a temperature of less than 120.degree. C., which is
included in the pre-baking conditions of photoresist layers used in
an ordinary photolithography method, the formed lower photoresist
layer is not sufficiently cured. Therefore, when the upper
photoresist layer is provided on the lower photoresist layer in
this state to form a layered photoresist portion, the treatment of
providing the upper photoresist layer causes the thickness of the
lower photoresist layer to change so that the thickness of the
entire layered photoresist portion changes. As a result, there is a
problem in that the difference in thickness is increased depending
on areas of the layered photoresist portion.
[0009] The difference in thickness causes a visible interference
pattern over the upper surface of the layered photoresist
portion.
[0010] FIG. 4 is an illustration showing a process in which the
difference in thickness arises in the layered photoresist portion.
As shown in FIG. 4A, a first photoresist layer 21 is formed on a
substrate 10. As shown in FIG. 4B, the first photoresist layer 21
is then pre-baked at less than 120.degree. C. When an second
photoresist layer 22 is provided on the first photoresist layer 21
in this state, the flatness of the first photoresist layer 21 is
damaged by the formation of the second photoresist layer 22,
thereby causing waves over the top surface, as shown in FIG. 4C.
This state causes the visible interference pattern described
above.
[0011] If a master base prepared by the above method is used for
manufacturing lenses, optical lenses having a desired performance
cannot be obtained.
SUMMARY OF THE INVENTION
[0012] Accordingly, it is an object of the present invention to
provide a master base for fabrication in which reflected rays are
attenuated or absorbed to prevent applied rays from interfering
with the reflected rays so that rays having different intensities
are not formed.
[0013] It is another object of the present invention to provide a
method for manufacturing a master base for fabrication having high
processing preciseness, wherein the method includes the step of
forming a plurality of photoresist layers and the influence of a
upper sublayer on a lower sublayer is suppressed in the step to
reduce the difference in thickness of the amount of the photoresist
layers.
[0014] In order to achieve the above objects, the present invention
provides a master base for fabrication including a substrate, a
first photoresist layer disposed on the substrate, and a second
photoresist layer disposed on the first photoresist layer, wherein
the first photoresist layer attenuates or absorbs rays reflected at
the interface between the first photoresist layer and the substrate
to prevent the reflected rays from interfering with applied rays in
an exposing step.
[0015] In the master base for fabrication of the present invention,
the first photoresist layer may include a plurality of
sublayers.
[0016] Furthermore, the present invention provides a method for
manufacturing a master base for fabrication including the steps of
forming a first photoresist layer on a substrate, baking the first
photoresist layer at the setting temperature of the first
photoresist layer, and forming a second photoresist layer on the
first photoresist layer.
[0017] In the method of manufacturing a master base for fabrication
of the present invention, the first photoresist layer may include a
plurality of sublayers, and the plurality of sublayers may be
prepared by repeating the steps of forming a sublayer comprising a
photoresist material to bake the sublayer at the setting
temperature of the photoresist material.
[0018] Since a layered structure having two or more photoresist
layers is employed, rays reflected at the interface between the
substrate and the first photoresist layer are reduced, thereby
obtaining a smooth surface, which is spherical or a spherical.
[0019] Since a lower resist layer is pre-baked at a setting
temperature thereof or more, for example, 120.degree. C. or more,
to set the lower photoresist layer sufficiently, the difference in
thickness of the layered structure is reduced when an upper
photoresist layer is formed on the lower photoresist layer, thereby
eliminating a visible interference pattern. Thus, a master base for
fabrication having superior processing preciseness can be
obtained.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] FIG. 1 is an illustration showing a process for
manufacturing a master base for fabrication according to the
present invention;
[0021] FIG. 2 is an illustration showing a method of forming
photoresist layers for manufacturing a master base for fabrication
according to the present invention;
[0022] FIG. 3 is an illustration showing a process for
manufacturing a conventional master base for fabrication; and
[0023] FIG. 4 is an illustration showing a step of forming
photoresist layers for manufacturing a conventional master base for
fabrication.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0024] An embodiment of the present invention will now be described
with reference to accompanying drawings.
[0025] FIG. 1 is an illustration showing a process for
manufacturing a master for fabrication, for example, a microlens
master.
[0026] In this embodiment, in order to eliminate surface steps
caused by interference due to applied rays and reflected rays in an
exposure step, a first photoresist layer 21 is disposed on a
substrate 10 and a second photoresist layer 22 is disposed on the
first photoresist layer 21, as shown in FIG. 1. The first
photoresist layer 21 attenuates or absorbs rays reflected at the
interface between the substrate 10 and the first photoresist layer
21 to prevent the reflected rays from interfering with applied rays
for exposure. Thus, a lens array 31 having a smooth surface, that
is, a surface with no steps, can be obtained. Two or more
photoresist layers may be disposed on the substrate 10.
[0027] In order to form a layer having a large thickness, a
material for the layer having a large viscosity must be used.
However, when such a material is used, it is difficult to form a
layer having an even thickness because the material is not
uniformly spread. Therefore, the first photoresist layer 21
includes a plurality of sublayers having a thickness of 2 to 10
.mu.m so as to have a thickness sufficient to attenuate or absorb
the reflected rays.
[0028] FIG. 2 is an illustration showing a method of forming
photoresist layers on a substrate according to an embodiment of the
present invention.
[0029] As shown in FIG. 2A, a photoresist material is applied onto
the substrate 10 to form the first photoresist layer 21. The first
photoresist layer 21 is then pre-baked at a temperature at which
the photoresist material is sufficiently set, for example,
120.degree. C. or more. In this embodiment, the second photoresist
layer 22 is formed on the first photoresist layer 21 after the
first photoresist layer 21 is completely set.
[0030] The completely set first photoresist layer 21 can maintain
the flatness of the surface when the second photoresist layer 22 is
formed thereon. Therefore, the second photoresist layer 22 has a
flat surface, as shown in FIG. 2C.
[0031] A master base for fabrication of the present invention is
then completed. The obtained master base for fabrication is
patterned by exposure and development into a master having the lens
array 31 with a smooth surface.
[0032] When such a master is used for manufacturing microlenses,
microlenses having desired optical characteristics such as a
light-converging function can be obtained.
* * * * *