U.S. patent application number 11/202885 was filed with the patent office on 2006-02-16 for thermal control system for rack mounting.
This patent application is currently assigned to Thermotek, Inc.. Invention is credited to Niran Balachandran, William F. Leggett, Overton L. Parish, Tony Quisenberry.
Application Number | 20060034053 11/202885 |
Document ID | / |
Family ID | 35799731 |
Filed Date | 2006-02-16 |
United States Patent
Application |
20060034053 |
Kind Code |
A1 |
Parish; Overton L. ; et
al. |
February 16, 2006 |
Thermal control system for rack mounting
Abstract
A thermal control system of a 3U height includes various modules
for providing temperature control in a rack environment. The
modules may be, for example, a power module, user interface module,
various different pump assemblies, various different models of fan
assemblies, HTAs, and/or a serial communication interfaces. This
Abstract is provided to comply with rules requiring an Abstract
that allows a searcher or other reader to quickly ascertain subject
matter of the technical disclosure. This Abstract is submitted with
the understanding that it will not be used to interpret or limit
the scope or meaning of the claims. 37 CFR 1.72(b).
Inventors: |
Parish; Overton L.; (Frisco,
TX) ; Balachandran; Niran; (Lewisville, TX) ;
Quisenberry; Tony; (Highland Village, TX) ; Leggett;
William F.; (Lewisville, TX) |
Correspondence
Address: |
Jenkens & Gilchrist, a Professional Corporation;Suite 3700
1445 Ross Avenue
Dallas
TX
75202
US
|
Assignee: |
Thermotek, Inc.
Carrollton
TX
|
Family ID: |
35799731 |
Appl. No.: |
11/202885 |
Filed: |
August 12, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60601013 |
Aug 12, 2004 |
|
|
|
Current U.S.
Class: |
361/699 ;
361/724 |
Current CPC
Class: |
H05K 7/20772
20130101 |
Class at
Publication: |
361/699 ;
361/724 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. A precision thermal control system utilizing a heat transfer
fluid for heating and cooling select equipment, the system
comprising: a chassis; a plurality of heat transfer assembly
modules of the type formed with a plurality of low profile
extrusions having micro channels formed therein and secured within
said chassis for the flow of heat transfer fluid therethrough to
provide in excess of 700 Watts of thermal performance for thermal
control; a power supply secured within said chassis for powering
said heat transfer assembly modules; and said chassis having a
height of no more than 3U and adapted to be disposed within a 3U
mounting space of a conventional equipment rack having mounting
spaces with internal widths on the order of 17.5 inches for the
placement of equipment therein.
2. The system as set forth in claim 1 wherein said heat transfer
fluid is circulated in a closed loop to cool or heat equipment
adjacent to said precision thermal control system.
3. The precision thermal control system of claim 2 wherein both the
precision thermal control system and equipment cooled or heated
therewith are disposed in the same conventional equipment rack.
4. The system as set forth in claim 3 including a means for
securing said chassis to mounting spaces of said conventional
equipment rack.
5. The system as set forth in claim 2 wherein said micro channels
further include external heat sinks and fins extending therefrom
for cooling therewith.
6. The system as set forth in claim 2 wherein said heat transfer
fluid includes a water/glycol mixture.
7. The system as set forth in claim 2 wherein said heat transfer
fluid includes a water/alcohol mixture.
8. The system as set forth in claim 2 wherein said heat transfer
fluid includes distilled water.
9. The system as set forth in claim 2 wherein said transfer fluid
includes deionized water.
10. The system as set forth in claim 2 and further including three
heat transfer assemblies utilized to effect cooling and/or heating
in said precision thermal control system.
11. The system as set forth in claim 2 wherein a plurality of
internal fan assemblies are further utilized in conjunction with
said heat transfer fluid for the effective transfer of heat
therefrom.
12. The system as set forth in claim 11 wherein said fans are
oriented within said heat transfer assembly in a push/pull fan
arrangement for maximum efficiency of heat transfer therein.
13. The system as set forth in claim 2 wherein said precision
thermal control system is portable.
14. The system as set forth in claim 13 wherein said precision
thermal control system further comprises a plurality of support
feet adapted to be secured along at least one surface of said
chassis for facilitating the placement of said precision thermal
control system outside of a conventional equipment rack.
15. The system as set forth in claim 14 wherein said support feet
are adapted to stabilize said chassis in one of a vertical and
horizontal position.
16. The system as set forth in claim 15 wherein said precision
thermal control system further comprises a modified chassis such
that said chassis is not in contact with any surface other than the
surface of said support feet.
17. The system as set forth in claim 2 wherein said precision
thermal control system is programmable.
18. The system as set forth in claim 17 wherein a user sets a range
of satisfactory temperatures of said heat transfer fluid and said
precision thermal control system automatically adjusts fan speed
and flow rate of said heat transfer fluid in at least partial
dependence on said range of satisfactory temperatures.
19. The system as set forth in claim 17 wherein said precision
thermal control system records the temperature of said heat
transfer fluid.
20. The system as set forth in claim 19 wherein the information
recorded by said precision thermal control system can be displayed
or printed.
21. The system as set forth in claim 18 wherein said precision
thermal control system contains an alarm that is activated when the
temperature of said heat transfer fluid is outside the range of
temperature set by the user.
22. A precision thermal control method of heating and cooling
select equipment by utilizing a heat transfer fluid, the method
comprising the steps of: providing a precision thermal control
system chassis having a height of no more than 3U and adapted to be
disposed within a 3U mounting space of a conventional equipment
rack having mounting spaces with internal widths on the order of
17.5 inches for the placement of equipment therein; securing within
said chassis a plurality of heat transfer assembly modules of the
type formed with a plurality of low profile extrusions having micro
channels formed therein for the flow of heat transfer fluid
therethrough and capable of providing in excess of 700 Watts of
thermal performance for thermal control; and securing a power
supply within said chassis for powering said heat transfer assembly
modules.
23. The method of claim 22 and further comprising the steps of
circulating said heat transfer fluid in a closed loop to cool or
heat adjacent equipment.
24. The method of claim 23 and further comprising the steps of
circulating said heat transfer fluid in a closed loop to cool or
heat components disposed within a conventional equipment rack
wherein both said components and said precision thermal control
system chassis are disposed.
25. The method as set forth in claim 23 wherein said precision
thermal control method further comprises the steps of extending
external heat sinks and fins from said micro channels for cooling
therewith.
26. The method as set forth in claim 23 wherein said precision
thermal control method further comprises the steps of using a
water/glycol mixture for said heat transfer fluid.
27. The method as set forth in claim 23 wherein said precision
thermal control method further comprises the steps of using a
water/alcohol mixture for said heat transfer fluid.
28. The method as set forth in claim 23 wherein said precision
thermal control method further comprises the steps of using
distilled water for said heat transfer fluid.
29. The method as set forth in claim 23 wherein said precision
thermal control method further comprises the steps of using
deionized water for said heat transfer fluid.
30. The method as set forth in claim 23 wherein said precision
thermal control method further comprises the steps of utilizing
three or more heat transfer assemblies to effect cooling and/or
heating in said precision thermal control method.
31. The method as set forth in claim 23 wherein said precision
thermal control method further comprises the steps of utilizing a
plurality of internal fan assemblies in conjunction with said heat
transfer fluid for the effective transfer of heat therefrom.
32. The method as set forth in claim 31 wherein said precision
thermal control method further comprises the steps of orienting
said fan assemblies within said heat transfer assembly in a
push/pull fan arrangement for maximum efficiency in the heat
transfer therein.
33. The method as set forth in claim 23 wherein said precision
thermal control method further comprises the steps of being
portable.
34. The method as set forth in claim 23 wherein said precision
thermal control method further comprises the steps of being
programmable.
35. The method as set forth in claim 34 and further comprising the
steps of allowing a user to set a range of satisfactory temperature
of said heat transfer fluid.
36. The method as set forth in claim 35 and further comprising the
steps of adjusting fan speed and flow rate of said heat transfer
fluid automatically in at least partial dependence on said range of
satisfactory temperature.
37. The method as set forth in claim 34 and further comprising the
steps of recording the temperature of said heat transfer fluid.
38. The method as set forth in claim 37 and further comprising the
steps of displaying or printing recorded information.
39. The method as set forth in claim 35 and further comprising the
steps of activating an alarm when the temperature of said heat
transfer fluid is outside the range of temperature set by the
user.
40. The method as set forth in claim 37 and further comprising the
steps of monitoring the airflow across said micro channels, the
fluid flow of said heat transfer fluid, and the performance of said
micro channels.
41. The method as set forth in claim 40 and further comprising the
steps of maintaining the temperature of said heat transfer fluid to
within one-tenth of one degree Celsius of a temperature set by the
user.
42. The method as set forth in claim 33 and further comprising the
steps of adapting said precision thermal control system chassis to
stand in one of a vertical and horizontal position by adding a
plurality of support feet to at least one side of said precision
thermal control system chassis.
43. A precision thermal control method of heating and cooling
select equipment utilizing a heat transfer fluid in conjunction
with an external heat exchanger, the method comprising the steps of
providing a chassis having a height of no more than 3U; securing
within said chassis a plurality of heat transfer assembly modules
of the type formed with a plurality of low profile extrusions
having micro channels formed therein for the flow of heat transfer
fluid therethrough and capable of providing in excess of 700 Watts
of thermal performance for thermal control; securing a power supply
within said chassis for powering said heat transfer assembly
modules; securing at least one fan within said chassis for the flow
of heat transfer air for the cooling of equipment in the vicinity
thereof; and pumping said heat transfer fluid in a closed loop to
said external heat exchanger for the cooling of said heat transfer
fluid.
44. The method as set forth in claim 43, wherein said precision
thermal control method is implemented inside an isolated
environment.
Description
RELATED APPLICATIONS
[0001] The present application claims priority to U.S. Provisional
Patent Application No. 60/601,013 filed Aug. 12, 2004, and
incorporates by reference for all purposes the entire disclosures
of U.S. patent application Ser. No. 09/328,183 filed Jun. 8, 1999
and U.S. Pat. No. 6,462,949 entitled "Electronic Enclosure Cooling
System."
BACKGROUND OF THE INVENTION
[0002] 1. Technical Field
[0003] The present invention relates to thermal control systems,
and more particularly, but not by way of limitation, to low
profile, rack mounted thermal control systems for cooling or
heating equipment disposed in or in the vicinity of an equipment
rack.
[0004] 2. Background of the Related Art
[0005] As the evolution of computers continued from mini-computers
that filled entire rooms with equipment to PC modules similar to
the personal computer known today, rack mounted equipment decreased
in popularity. However, with the introduction of new electronic
equipment, such as slice servers and laser systems, racks are
returning to the computing environment. Rack mount enclosures are
compact in design and allow for mounting of various components
(e.g., servers, laser systems, chillers, etc.) in a stacked style
configuration. Utilizing racks allows a user to include various
rack mounted components in the rack, decreasing the foot print,
while the components remain easily accessible for maintenance.
[0006] By mounting multiple components in a rack heat is increased,
thereby causing deterioration and possible failure of many of the
components. For example, most laser systems, such as those utilized
for medical or industrial applications, generate a large amount of
heat that requires cooling, via a chiller, in order to maintain
proper function. In addition, many components, such as laser
systems, perform poorly when subject to vibration and noise that
many compressor-based chillers exhibit.
[0007] Conventional racks for the components as described herein
are typically constructed of predetermined spatial parameters. For
example, the height of an individual rack area, or "mounting space"
adapted for conventional electronic components and the like is
referred to in multiples of "U". Each "U" (standing for the word
"unit") is equal to 1.75 inches. A 3U height is therefore 5.25
inches. It is this "U" height that defines the standard rack
mounting spatial relationship relative to a typical "19" inch wide
mounting space. The "19" inch reference refers in actuality to the
space allotted outside the mounting spaces for the equipment or
component face plate. The inside of the mounting space generally
has an inside dimension on the order of 17.5 inches. Using these
spacing parameters, components and equipment mounted within such a
rack are typically of a height that is a "U" multiple with a face
panel on the order of 19 inches wide.
[0008] Although many components, such as servers and laser systems,
are available in a height that is on the order of a "U" multiple
for placement in the conventional rack, rack mounted chillers
typically require a height of more than 3U to offer effective
cooling to the surrounding components. Some compressor-based units
may require as much as an 8U height. It should be noted, however,
that such height is critical to space considerations of the overall
rack. Conventional equipment racks only have a specified number of
U's available and the higher the number of U's required for
temperature control equipment, the fewer U's available for the
necessary equipment. It is for this reason that special height
considerations are important along with the functionality of the
temperature control system.
[0009] Today's cooling technology typically includes passive
cooling systems, compressor-based systems, and thermoelectric
systems. In certain passive cooling systems, the air to be cooled
is circulated over an air-to-air heat exchanger, which includes
folded, finned heat exchangers, heat pipes, etc. The heat is then
exchanged with the outside ambient air. As the amount of heat to be
removed from the area increases, the size of the air-to-air heat
exchanger increases. Compressor-based systems function by using a
refrigerant and the cooling function is achieved by the compression
and expansion of the refrigerant such as European Patent
Application 1488040A2, entitled "Liquid Cooling System for a
Rack-mount Server System," which is hereby incorporated by
reference. These compressor-based systems typically weigh over
seventy pounds and create unwanted vibrations. Thermoelectric
temperature control systems use thermoelectric devices that pump
heat using the Peltier effect. Typical thermoelectric devices
incorporate a thermoelectric component that utilizes electrical
current to absorb heat from one side of the component and dissipate
that heat on the opposite side.
[0010] In addition to the above, instances arise where heating
and/or temperature stabilization is equally important. For example,
laser systems require a stable heat and temperature environment
because the frequency of the light is dependent on the temperature
of the diode. When rack-mounted systems that are vibrationally
sensitive require precise temperature control, a compressor based
system cannot be used. Thus, a more technologically complex
scenario can evolve. A simple chiller is generally not capable of
also performing a heating function without adding resistive
elements. Thermal electric temperature control systems using
thermal electric devices are, as described above, capable of both
heating and cooling, low vibration, relatively high Coefficient Of
Performance ("COP's") (ability to remove heat), low noise, and low
profile.
[0011] U.S. patent application Ser. No. 09/328,183 (the '183 patent
application) assigned to the assignee of the present invention
teaches a heating and cooling system with low vibration, relative
high COP's, low noise and low profile. The low profile cooling
system of the '183 patent application is, as stated therein,
particularly well suited for cooling power amplifiers and other
electronic components. In one embodiment, a heat transfer fluid is
circulated in a closed loop to the area of components that generate
heat. This approach allows the design, implementation and
utilization of such thermoelectric cooling systems utilizing low
profile extrusions capable of cooling high watt density sub
assemblies such as a power amplifiers and filters commonly secured
in rack mounted equipment or equipment that may be mounted around a
conventional electronic component rack.
[0012] It would therefore be a distinct advantage relative to the
above-described technology to provide a thermal control system that
would be of low vibration, high efficiency, and yet easily
mountable within a conventional rack with minimal "U"
utilization.
BRIEF SUMMARY OF THE INVENTION
[0013] The present invention relates to thermal control systems for
equipment. More particularly, one aspect of the invention relates
to low profile, rack-mounted temperature control systems for
cooling or heating equipment disposed in or in the vicinity of an
equipment rack. The control system is constructed in a 3U
(3.times.1.75''=5.25 inches) height for placement in standard "19"
inch wide equipment rack units (inside dimension of unit is in the
order of 171/2 inches.
[0014] In another aspect, the present invention relates to a
thermal control system including at least one Heat Transfer
Assembly (HTA) module. The HTA modules are formed of low profile
extrusions having micro channels formed therein. The HTA's may
include external fins and/or high density bonded fin heat
sinks.
[0015] In another aspect, one embodiment of the invention includes
a thermal control system for heating and cooling select equipment
disposed in the vicinity of conventional 19 inch equipment racks
having an interval mounting space width on the order of 17.5 inches
for the placement of equipment therein, and a height on the order
of 3U. The system further includes at least one heat transfer
assembly module of the type formed with a plurality of low profile
extrusions having micro channels formed therein and disposed within
a chassis for the flow of heat transfer fluid for thermal control
and a height no more than 3U.
[0016] In another aspect, the above-described embodiment includes
the heat transfer fluid being circulated in a closed loop to cool
or heat components within the rack wherein the thermal control
system is disposed. In one embodiment, the heat transfer fluid
includes a water/glycol mixture, and in another embodiment it
includes a water/alcohol mixture.
[0017] In yet another embodiment, the above-described invention
includes the ability to customize the design of the 3U system and
allow on the order of three heat transfer assemblies to effect
cooling and/or heating of the temperature control system. A
plurality of internal fan assemblies may also be further utilized
in conjunction with the heat transfer fluid for the effective
transfer of heat therefrom.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] A more complete understanding of the method and apparatus of
the present invention may be obtained by reference to the following
Detailed Description when taken in conjunction with the
accompanying Drawings wherein:
[0019] FIG. 1 is a top view of a temperature control system in
accordance with an embodiment of the present invention;
[0020] FIG. 2 is a front view of a temperature control system in
accordance with an embodiment of the present invention; and
[0021] FIG. 3 is a back view of a temperature control system in
accordance with an embodiment of the present invention.
[0022] FIG. 4 is an example of the temperature control system with
rubber feet attached for standing in a vertical position.
[0023] FIG. 5 is an example of the temperature control system with
rubber feet attached for standing in a horizontal position.
[0024] FIG. 6 shows the temperature control system as it would fit
into a conventional rack mount.
DETAILED DESCRIPTION OF THE INVENTION
[0025] Referring now to FIG. 1, a top view of a temperature control
system 100 in accordance with an embodiment of the present
invention is illustrated. The temperature control system 100
utilizes a heat transfer fluid that is circulated in a closed loop
to cool or heat components within a conventional rack. The heat
transfer fluid may be, for example, a water/glycol mixture,
although other heat transfer fluids may be utilized. In one
embodiment, three HTA modules 102 are utilized to effect cooling
and/or heating in the temperature control system 100, however
embodiments of the present invention may include more or fewer HTA
modules as desired. The temperature control system 100 may also
include up to six internal fan assemblies (not shown) and an
addition three internal fans with an external fan train. The fans
may be oriented in a push/pull fan arrangement or other arrangement
as desired. In alternate embodiments, fans on the heat transfer
side are not included. Instead, the temperature control system 100
may utilize micro extrusions to transfer power from the
Thermoelectric Cooling Module ("TEC") via water. The power supplies
that drive the TEC's may have variable output (5-135 Vdc) which can
be varied by the controller using, for example, a Pulse Width
Modulation ("PWM") signal. This variable output design of the power
supply can modulate the power to the TEC's to achieve precise
temperature control. This variable output also allows the chiller
to only use the minimum required input power to provide the optimal
control. This lowers the overall input power required by lowering
the drive voltage to the TEC's in applications that have low heat
loads. A preferred embodiment of the present inventions has thermal
performance capabilities of 725 Watts at 0.degree. C. delta T
supply minus ambient air. An alternative embodiment of the present
inventions utilizing a plant water supply has capabilities in
excess of 1,100 Watts at 0.degree. C. delta T supply minus service
water.
[0026] The fan assembly maximizes efficiency of the temperature
control system 100 by maximizing the airflow to the HTA modules
102. In one embodiment, the HTA modules of the present invention
are formed of low profile extrusions having a plurality of micro
channels. Each micro channel has a micro channel inlet and a micro
channel outlet. The low profile extrusions preferably formed with
heat sinks and external fins to maximize heat transfer, if space
allows. The micro channel inlets are in fluid communication with
each other, and to an inlet channel, by an inlet end cap.
Similarly, micro channel outlets are in fluid communication with
each other, and to the outlet channel, by an outlet end cap. The
heat transfer fluid is circulated through the inlet channel, the
low profile extrusion, the outlet channel, and tubing via the pump
104. Alternatively, the temperature control system 100 may be
evacuated and charged with fluid which is then circulated via the
pump 104. Further details regarding low profile extrusions and the
heat transfer fluid flow system and method herein referenced are
set forth and shown in U.S. patent application Ser. No. 09/328,183
referenced above and incorporated herein by reference.
[0027] The temperature control system 100 utilizes a pump 104, such
as a positive displacement, centrifugal, or turbine style
magnetically coupled pump. The pump 104 is of such a size as to fit
in the 3U configuration and may have a variety of gear sizes, port
sizes, etc. as needed. The customized selection of the pump and
other components may also be provided in the 3U system as described
below. A preferred embodiment of the present invention has flow
rate capabilities on the order of one gallon per minute or four
Liters per minute.
[0028] The temperature control system 100 is formed in a modular
design to allow flexibility and versatile configuration for a
variety of customers. For example, a customer may request one or
two HTAs with a smaller displacement pump in order to create a
chiller with less depth, allowing the chassis to only be fifteen
inches in depth compared to the standard twenty three inches. In
addition, the present invention also may have high thermal cycle
module capability. A preferred embodiment of the present invention
has the capability of remote temperature monitoring utilizing
external temperature sensors such as thermistors or Resistance
Temperature Detection ("RTD") devices, etc. A preferred embodiment
of the present invention also allows user communication in a
variety of manners including serial USB ports, Ethernet ports,
RS485 ports and RS232, etc. The present invention has the
capability of operation off a DC power source (150-340 Vdc) or
universal AC voltage operation (95-250 Vac, 45-70 Hz). There are
various wiring selections that can be utilized to maximize the
efficiency of the system based on the input voltage. Conductivity
meters and voltage sensors may also be utilized to ensure the
accuracy of the system. Another preferred embodiment of the present
invention utilizes flow meters to monitor air flow across the HTA's
and the fluid flow of the heat transfer fluid. The fluid in the
present invention can utilize various fluid connections and types
depending on the specific needs of the user. One contemplated
embodiment utilizes the present invention in conjunction with both
external heat exchangers including air and plant liquid coolers.
Utilizing the flow meters and conductivity meters in conjunction
with the temperature sensors gives the thermal control system the
capability of maintaining the temperature of the heat transfer
fluid to within +/-0.05 degrees Celsius.
[0029] Another aspect of one embodiment of the present invention is
the flexibility that the 3U design affords relative to the customer
requests referred to above. As seen in FIG. 1, the temperature
control system 100 includes a chassis 110 that provides a basic
frame for a variety of options that may be utilized therewith
pursuant to customer specification while maintaining the 3U height
limitation for rack mounting in accordance with the principles of
the present invention. In addition to the 3U height limitation, the
present invention weighs approximately fifty-four pounds, making it
suitable for a variety of applications. The following chart is thus
submitted for illustrating the high level of specificity with which
a customer may select various elements within the temperature
control system 100 and securement to the chassis 110. By utilizing
the following specification chart, the manufacturer of the present
invention is able to utilize an "assembly line" type of fabrication
without the need for multiple redesign and re-engineering to meet
the 3U and/or performance criteria. The various elements as set
forth in the following chart can be selected and will all fit
within the chassis 110 and within the 3U module fitting into a 3U
mounting space of the conventional rack, even though the
temperature control system 100 has been customized by a given
customer.
[0030] Referring now to FIG. 2, a front view of the temperature
control system 100 is illustrated. The temperature control system
100 exhibits a front to back air flow and easily removable air
filter. The front panel of the temperature control system 100
includes a user interface 200, such as a membrane keypad or other
user interface. The user interface 200 allows the user to enter
various information (e.g., set various conditions, adjust fan
speed, adjust temperature, display flow, heat load, thermal
performance, etc.) for use by the temperature control system 100.
At least one fan guard 202 protects the fan blades of the fan
assemblies. The front panel may also include fluid connections 204
including but not limited to quick connections National Pipe Taper
("NPT"), etc.
[0031] In operation, the 3U system of the present invention affords
multiple advantages for both the customer and user. Thermal control
systems utilizing a 3U height and manifesting low vibration
consistent with the technology set forth and described herein is a
distinct advantage. The ability to customize the particular
operational system parameters within the temperature control system
100 is likewise of significant benefit. The system 100 can be
upgraded as required while manifesting quiet operation, low
vibration and being energy efficient even after upgrades. The
upgrades are, as referenced above, integral elements that may be
selected by the customer and therefore are all compatible with the
remaining elements within the 3U system of the present
invention.
[0032] Referring now to FIG. 3, a rear panel of the temperature
control system 100 is illustrated. The rear panel also includes fan
guards 202 and fluid connections 204 similar to those of the front
panel. Also oriented on the rear panel is a power entry module 300
for supplying power to the thermal control system 100. A reservoir
filler quick disconnect 304, communication IP ports including
alarms, stand by signals, expansion/accessories, electronics side
vents, and an RS232 interface connection 302 are included on the
rear panel as well. A circuit breaker 306 prevents the thermal
control system 100 from being overloaded by a surge in power.
[0033] Referring now to FIG. 4, the thermal control system is shown
with the face plate trimmed down and with feet added. This
embodiment utilizes the advantages of the slim, low profile design,
low vibration, and precise temperature control in a bench top
vertical unit. An alternative embodiment of the bench top unit has
feet attached in such a way so that the face plate is oriented in
the same direction as when mounted in a rack giving a bench top
horizontal unit. These configurations keep the unit stable even
when not mounted in a conventional rack, allowing it to be used for
a plurality of purposes.
[0034] Referring now to FIG. 5, the thermal control system is shown
disposed in a conventional rack mount. The 3U height of the chassis
allows it to fit in the slots of the conventional rack mount,
taking up no more space than most standard electronic equipment.
The design of the chassis also allows the thermal control system to
be secured to the conventional rack mount in number of different
ways, one being with screws through the faceplate.
[0035] There are several modifications and variations of the
innovative concepts of the present application that are
contemplated and within the scope of the patented subject matter. A
few examples of these alternative embodiments are given below, but
in no way do these examples enumerate all possible contemplated
embodiments of the present application.
[0036] For example, one contemplated embodiment of the present
invention utilizes two temperature control systems for increased
cooling capabilities. The present invention has the capability of
being connected in a Master/Slave type relationship where both
temperature control systems have the capability of being mounted in
two separate mounting spaces of a conventional mounting rack.
[0037] An example of an alternative embodiment includes mounting
the thermal control system independent of the conventional mounting
rack. Rubber feet may be added and the system can be placed on a
desktop.
[0038] Another alternative implementation that is contemplated
would be to use the thermal control system disclosed in the present
application in conjunction with an external heat exchanger. In this
embodiment, the thermal control system would cool the air that
passes over the micro channels and at the same time warm the heat
transfer fluid. The heat transfer fluid could then be cooled by
some external heat exchanger, e.g. plant water. This embodiment may
be desirable to use in a closed environment such as a clean room,
where the only air exchange possible is through recirculation.
[0039] Another example embodiment includes using the thermal
control system for the temperature regulation of vehicle parts or
compartments in a vehicle.
[0040] The previous description is of a preferred embodiment for
implementing the invention, and the scope of the invention should
not necessarily be limited by this description. The scope of the
present invention is instead defined by the following claims.
* * * * *