U.S. patent application number 11/243731 was filed with the patent office on 2006-02-16 for self-aligned coil process in magnetic recording heads.
Invention is credited to Terence Tin-Lok Lam, David Kaimon Lee, Edward Hin Pong Lee, Changqing Shi.
Application Number | 20060034012 11/243731 |
Document ID | / |
Family ID | 38744161 |
Filed Date | 2006-02-16 |
United States Patent
Application |
20060034012 |
Kind Code |
A1 |
Lam; Terence Tin-Lok ; et
al. |
February 16, 2006 |
Self-aligned coil process in magnetic recording heads
Abstract
In one embodiment of the present invention, a write head
includes a first pole P1, a P1 pedestal, a first back gap layer
plated on top of the first pole P1 leaving a region between the P1
pedestal and the first back gap layer for plating a coil, a first
insulation layer applied on top of the P1 pedestal and the first
back gap layer and the region between the P1 pedestal and the first
back gap layer. The write head further includes a coil, patterned
at least partially on top of the P1 pedestal and the first back gap
layer and the region between the P1 pedestal and the first back gap
layer, copper plated in the coil patterns, and a second insulation
layer applied to fill the spaces in between the coil turns. The
resulting structure is planarized via chemical mechanical
polishing.
Inventors: |
Lam; Terence Tin-Lok;
(Cupertino, CA) ; Lee; David Kaimon; (San Jose,
CA) ; Lee; Edward Hin Pong; (San Jose, CA) ;
Shi; Changqing; (San Jose, CA) |
Correspondence
Address: |
Maryam Imam, Esq.;LAW OFFICES OF IMAM
Suite 1010
111 North Market Street
San Jose
CA
95113
US
|
Family ID: |
38744161 |
Appl. No.: |
11/243731 |
Filed: |
October 4, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10652878 |
Aug 29, 2003 |
|
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11243731 |
Oct 4, 2005 |
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Current U.S.
Class: |
360/123.4 ;
216/22; 360/123.46; 360/123.49; 360/313; G9B/5.082; G9B/5.086;
G9B/5.094; G9B/5.135 |
Current CPC
Class: |
G11B 5/17 20130101; Y10T
29/49064 20150115; Y10T 29/49039 20150115; Y10T 29/49062 20150115;
G11B 5/3163 20130101; G11B 5/313 20130101; H01F 41/041 20130101;
Y10T 428/1121 20150115; Y10T 29/49043 20150115; G11B 5/3967
20130101; G11B 5/3136 20130101; G11B 5/3116 20130101 |
Class at
Publication: |
360/126 ;
216/022; 360/313 |
International
Class: |
B44C 1/22 20060101
B44C001/22; G11B 5/127 20060101 G11B005/127; G11B 5/147 20060101
G11B005/147; G11B 5/33 20060101 G11B005/33 |
Claims
1. A method of manufacturing a write head comprising: forming a P1
pedestal and a first back gap layer on top of a first pole P1
leaving a region therebetween for forming a coil, the first back
gap layer formed at a distal end of the first pole P1; depositing a
first insulation layer disposed over at least a portion of the P1
pedestal, the first pole P1 and the first back gap layer and the
region; forming a coil by depositing copper in coil pockets formed
in a coil photoresist layer deposited over the first insulation
layer, wherein the coil has multiple turns; removing the coil
photoresist layer to form spaces in between the coil turns; and
applying a second insulation layer to fill the spaces in between
the coil turns.
2. A method of manufacturing as recited in claim 1, further
comprising: removing excess deposited coil and photoresist layer to
form a planar surface.
3. A method of manufacturing as recited in claim 1, further
comprising: removing a coil seed layer before applying the second
insulation layer, wherein the coil seed layer was deposited before
applying the coil photoresist layer.
4. A method of manufacturing as recited in claim 1 wherein the
first insulation layer is made of alumina.
5. A method of manufacturing as recited in claim 2 wherein the
thickness of the first insulation layer behind the P1 pedestal is
in the range of 0.1 to 0.5 microns.
6. A method of manufacturing as recited in claim 1 wherein the coil
is made of copper.
7. A method of manufacturing as recited in claim 1 wherein the
thickness of each of the coil turns is in the range of 0.5 to 4
microns.
8. A method of manufacturing as recited in claim 1 wherein the coil
is self-aligned with respect to the P1 pedestal.
9. A method of manufacturing as recited in claim 1 wherein after
the step of applying a second insulation layer, performing the step
of hard baking to encapsulate the coil.
10. A method of manufacturing as recited in claim 9 further
including the step of: depositing alumina over the hard baked
resist; and performing a chemical mechanical polishing (CMP)
process.
11. A method of manufacturing as recited in claim 1 further
including the steps of: depositing a write gap on top of the
alumina after the chemical mechanical polishing step of claim 10;
forming a P2 pole tip on top of the write gap and at opposite end,
a second back gap on top of the first back gap; depositing alumina
on the P2 pole tip and the second back gap layer; performing CMP
process; forming a second coil layer; applying a third insulation
layer on top of the second coil layer; and forming a P3 magnetic
layer on top of the second coil layer extending from the P2 pole
tip to the second back gap layer.
12. A structure formed in a write head comprising: a first pole P1;
a P1 pedestal formed on top of the first pole P1; a first back gap
layer plated on top of the first pole P1 leaving a region between
the P1 pedestal and the first back gap layer for forming a coil; a
first insulation layer applied on top of the P1 pedestal, P1 pole
and the region between the P1 pedestal and the first back gap
layer; coil turns defined by a coil pattern that is self-aligned on
top of the P1 pedestal and the first back gap layer and the region
between the P1 pedestal and the first back gap layer, wherein the
coil turns are formed in the coil patterns with spaces formed in
between the coil turns; and a second insulation layer applied to
fill the spaces in between the coil turns.
13. A structure as recited in claim 10 further including a first
insulation layer applied to the P1 pedestal.
14. A structure as recited in claim 11 wherein the first insulation
layer is made of Al.sub.2O.sub.3.
15. A structure as recited in claim 12 wherein the thickness of the
first insulation layer behind the P1 pedestal is in the range of
0.1 to 0.5 microns.
16. A structure as recited in claim 12 wherein the thickness of the
first insulation layer in front of the back gap is in the range of
0.1 to 0.5 microns.
17. A structure as recited in claim 12 wherein the thickness of
each of the coil turns is in the range of 0.5 to 4 microns.
18. A structure as recited in claim 10 wherein the coil is
self-aligned.
19. A disc drive comprising: a write head including, a first pole
P1; a P1 pedestal; a first back gap layer plated on top of the
first pole P1 leaving a region between the P1 pedestal and the
first back gap layer for forming a coil; a first insulation layer
applied on top of the P1 pedestal and the region between the P1
pedestal and the first back gap layer; coil pattern, defined by
coil turns, self-aligned on top of the P1 pedestal and the first
back gap layer and the region between the P1 pedestal and the first
back gap layer, wherein the coil turns are formed in the coil
patterns with spaces formed in between the coil turns; and a second
insulation layer applied to fill the spaces in between the coil
turns.
20. A writer comprising: a first pole pedestal formed over a first
end of a first pole; a first back gap layer formed over second end
of the first pole; a first insulation layer at least partially
covering the first pole pedestal and the back gap; a first seed
layer at least partially covering the first pole pedestal and the
back gap; coil patterns formed on top of the first seed layer; and
self-aligned coil plated into the coil patterns.
21. A writer, as recited in claim 18, wherein the coil is
encapsulated.
22. A writer as recited in claim 18 including a self-aligned second
coil formed on top of a dielectric fill layer, the dielectric fill
layer formed on top the pedestal and the back gap.
23. A structure formed in a write head comprising: a first pole P1;
a P1 pedestal formed on top of the first pole P1; a first back gap
layer plated on top of the first pole P1 leaving a region between
the P1 pedestal and the first back gap layer for plating a coil; a
first insulation layer applied on top of the P1 pedestal and the
region between the P1 pedestal and the first back gap layer; coil
turns defined by a coil pattern formed on top of the region between
the P1 pedestal and the first back gap layer wherein the coil turns
are formed in the coil patterns with spaces formed in between the
coil turns; and a second insulation layer applied to fill the
spaces in between the coil turns, the conductivity of the area
defined below the second insulation layer and above the first pole
P1 and extending between the P1 pedestal and the first back gap
layer increasing by 20 to 40%.
24. A structure as recited in claim 23 further including a first
insulation layer applied to the P1 pedestal.
25. A structure as recited in claim 24 wherein the first insulation
layer is made of Al.sub.2O.sub.3.
26. A structure as recited in claim 24 wherein the thickness of the
first insulation layer behind the P1 pedestal is within the range
of 0.1 to 0.5 microns.
27. A structure as recited in claim 24 wherein the thickness of the
first insulation layer in front of the back gap is within the range
of 0.1 to 0.5 microns.
28. A structure as recited in claim 23 wherein the thickness of
each of the coil turns is in the range of 0.5 to 4 microns.
29. A structure as recited in claim 23 wherein the coil is
self-aligned.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation-in-part of prior U.S.
patent application Ser. No. 10/652,878, filed on Aug. 29, 2003,
entitled "Method For Patterning A Self-Aligned Coil Using A
Damascene Process", the disclosure of which is incorporated herein
by reference, as though set forth in full.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] This invention relates generally to the field of magnetic
recording heads having coils inducing magnetic flux for writing on
a magnetic medium (such as a magnetic disc) and more particularly,
to recording heads having coils that are self-aligned and with low
resistance yet utilizing conventional processing techniques for
manufacturing thereof.
[0004] 2. Description of the Prior Art
[0005] Magnetic hard drives (or disc drives) have been in common
use for storage of large groups of data for decades. Improvements
in manufacturing thereof have attracted popular attention
particularly to reducing the size of the drive and/or its internal
components to achieve both lower costs and wider applications.
[0006] Magnetic hard drives include magnetic recording head for
reading and writing of data. As well known, a magnetic recording
head generally includes two portions, a write head portion or head
for writing or programming magnetically-encoded information on a
magnetic media or disc and a reader portion for reading or
retrieving the stored information from the media.
[0007] Data is written onto a disc by a write head that includes a
magnetic yoke having a coil passing there through. When current
flows through the coil, a magnetic flux is induced in the yoke,
which causes a magnetic field to fringe out at a write gap in a
pole tip region. It is this magnetic field that writes data, in the
form of magnetic transitions, onto the disk. Currently, such heads
are thin film magnetic heads, constructed using material deposition
techniques such as sputtering and electroplating, along with
photolithographic techniques and wet and dry etching
techniques.
[0008] Examples of such thin film heads include a first and second
magnetic poles connected through a back gap forming a horseshoe
structure and having a pole tip region and a back gap region,
formed of a material such as NiFe which might be plated onto a
substrate after sputter depositing an electrically conductive seed
layer. Opposite the pole tip region, at a back end of the magnetic
pole, a magnetic back gap can be formed. A back gap is the term
generally used to describe a magnetic structure that magnetically
connects the first and second poles to form a completed magnetic
yoke as will be described.
[0009] One or more electrically conductive coils can be formed over
the first pole, between a pedestal, positioned above a portion of
the first pole, and the back gap and can be electrically isolated
from the pole and yoke by an insulation layer, which could be
alumina (Al.sub.2O.sub.3) or hard baked photoresist.
[0010] With reference to FIG. 1, a plan view of an exemplary write
element 302 can be seen in relation to the slider 111. A coil 304,
passing through a magnetic yoke 306, induces a magnetic flux in the
yoke 306. The gap in the yoke 306, in turn causes a magnetic field
to fringe out at the pole tip 308. It is this fringing field 310
that writes magnetic signals onto a nearby magnetic medium.
[0011] With reference now to FIG. 2, a magnetic head 400 according
to one possible embodiment of the present invention has magnetic
read element 402 formed between the first and second magnetic
shields, 404 and 406. A write head, generally referred to as 408,
includes a first pole P1 410. A P1 pedestal 412, disposed in a pole
tip region 413 and a first back gap layer 414, at an opposite end,
are formed over the first pole. The first pole 410, P1 pedestal
412, and back gap 414 are formed of a magnetic soft material such
as, for example, NiFe. A first coil insulation layer 416 is formed
over the first pole 410 between the P1 pedestal 412 and back gap
layer 414. An electrically conductive coil 418, shown in partial
cross section in FIG. 2, passes over the first pole 410 on top of
the first insulation layer 416. A second coil insulation layer 420
insulates each turn of the coil 418 from the other and insulates
the coil from the rest of the write head 408.
[0012] With continued reference to FIG. 2, a thin layer of
non-magnetic write gap layer 424 is deposited over the coil 418,
insulation layer 420 and P1 pedestal 412, and extends to an air
bearing surface (ABS) 426 at one end and stops short of extending
completely over the top of the back gap layer 414 at the other end.
A magnetic second back gap material layer 428 may be formed over
the top of the back gap layer 414, being magnetically connected
therewith. The ABS is the surface of the magnetic head designed
such that it enables the magnetic head to ride on a cushion of air
between the head and the disc along the disc surface.
[0013] With continued reference to FIG. 2, a P2 pole tip 430 is
provided on top of the write gap layer 424 in the pole tip region
413. The P2 pole tip 430 extends to the ABS 426, and has a width
(into the plane of the page of FIG. 2) that defines a track width
of the write head 408. The P2 pole tip is constructed of a magnetic
material, and is preferably constructed of a soft magnetic material
having a high magnetic saturation (high Bsat) and low
coercivity.
[0014] With reference still to FIG. 2, a dielectric fill material,
or layer 433, such as alumina, extends from the P2 pole tip 430 to
the second back gap layer 428. The P2 pole tip 430 and the second
back gap layer 428 may be formed at the same time or during the
same step of processing, alternatively, they may be formed
separately, as disclosed hereinabove. A second coil 434 may sit
atop the dielectric layer 433, and is insulated by an insulation
layer 436, which could be for example hard baked photoresist. A P3
magnetic layer 438 is formed above the second coil 434 and the
insulation layer 436 and extends from the P2 pole tip 430 to the
second back gap layer 428 being magnetically connected with both.
The P3 magnetic layer 438 forms the majority of a second pole of
the magnetic yoke of the write head 408.
[0015] The pole tip region 413, the P3 magnetic layer 438 and the
back gap 414 form the magnetic yoke (or yoke) referred to in the
foregoing and below. It is desirable to maintain a short yoke
length to keep the magnetic path short and thus to minimize
magnetic leakage and to achieve high data rate for better
performance. It is through the write gap 424 that the field 310 (in
FIG. 1) fringes to write magnetic signals onto the medium or
disc.
[0016] In the prior art write head 400, the P2 pole tip 430 is
shown residing below the P3 magnetic layer 438 and in fact,
connected thereto. In other prior art write heads, the P2 pole tip
430 extends all the way across forming a P2 layer without the P3
magnetic layer 438.
[0017] As those skilled in the art will appreciate, the coil 418
and the second coil 434 are critical elements of the write or
recording head because they form the coil 304 of FIG. 1, passing
through the magnetic yoke 306 (in FIG. 1), to induce a magnetic
flux in the yoke 306. The magnetic flux in the yoke 306, in turn,
causes a magnetic field to fringe out at the pole tip 308, as
earlier discussed. It is this fringing field 310 that writes
magnetic signals onto a nearby magnetic medium. The problem with
prior art write heads is that since it is desirable to keep the
yoke length short, the coil (coils 418 and 434) needs to be narrow
in an effort to attain an appropriate number of turns of the coil.
The narrowness of the coil causes the coil resistance to be high.
Therefore, the write head can become hotter during write operations
thereby causing expansion and protrusion of the write head. This
protrusion is likely to cause the write poles to protrude too close
to the disc, potentially causing scratching of the disc.
Additionally, in current write head designs, the coils 418 and 434
are carefully aligned, in large part, due to the nature of
manufacturing the same, i.e. first building insulation and then
depositing the coils. Therefore, the spaces between the first coil
turn and the P1 pedestal 412 and the last coil turn and the back
gap layer 414 have to be kept large enough to avoid shorting
between the coil and the yoke.
[0018] Therefore, the need arises for a write head of a disc drive
to have a coil wide or thick enough to have low resistance and
manufactured to be self-aligned to avoid protrusion of the write
head yet manufactured using the same tools as used in manufacturing
prior art write heads.
SUMMARY OF THE INVENTION
[0019] Briefly, in one embodiment of the present invention, a write
head includes a first pole P1, a P1 pedestal (P1P) and, a first
back gap layer plated on top of the first pole P1 leaving a region
between the P1 pedestal and the first back gap layer for plating a
coil, a first insulation layer applied on top of the P1 pedestal
and the first back gap layer and the region between the P1 pedestal
and the first back gap layer. The write head further includes a
coil, patterned at least partially on top of the P1 pedestal and
the first back gap layer and the region between the P1 pedestal and
the first back gap layer, copper plated in the coil patterns, and a
second insulation layer applied to fill the spaces in between the
coil turns. The resulting structure is planarized via chemical
mechanical polishing.
IN THE DRAWINGS
[0020] FIG. 1 illustrates a plan view of an exemplary prior art
write element 302 that can be seen in relation to the slider
111.
[0021] FIG. 2 shows a magnetic head 400 according to the prior art
having a magnetic read element and a magnetic write element.
[0022] FIG. 3 shows a top perspective view of a disc drive 100
embodying this invention is shown in accordance with an embodiment
of the present invention.
[0023] FIG. 4 shows further structures of the disc drive 100 in
accordance with an embodiment of the present invention.
[0024] FIG. 5 shows a plan view of an exemplary magnetic write (or
recording) head 500 in accordance with an embodiment of the present
invention.
[0025] FIGS. 6(a)-(i) show some of the relevant steps for
processing or manufacturing of the write head 508 of FIG. 5.
[0026] FIGS. 7(a)-(f) show additional steps needed to complete the
fabrication of the write head 508.
[0027] FIGS. 8(a)-(f) show the relevant steps for an alternative
method for fabrication of the coil 624.
[0028] FIGS. 9(a), (b) and (c) show alternative steps in
manufacturing the write head 508.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0029] The following description is an embodiment presently
contemplated for carrying out this invention. This description is
made for the purpose of illustrating the general principles of this
invention and is not meant to limit the inventive concepts claimed
herein.
[0030] Referring now to FIG. 3, a top perspective view of a disc
drive 100 embodying this invention is shown in accordance with an
embodiment of the present invention. The disc drive 100 is shown to
include a voice coil motor (VCM) 102, an actuator arm 104, a
suspension 106, a flexure 108, a slider 111, a read-write head 112,
a head mounting block 114, and magnetic disc or media 116.
Suspension 106 is connected to the actuator arm 104 at the head
mounting block 114. The actuator arm 104 is coupled to the VCM 102.
The disc 116 includes a plurality of tracks 118 and rotates about
axis 120. The tracks 118 are circular, each extending circularly
around the surface of the disc 116 for storing magnetically-encoded
data or information using the head 112, which will be discussed in
greater detail with respect to further figures. This process may be
used in perpendicular/longitudinal designs and either single or
dual layer coils.
[0031] During operation of the disc drive 100, rotation of the disc
116 generates an air cushion which is encountered by the slider
111. This air cushion acts to keep the slider 111 afloat a small
distance above the surface of the disc 116, allowing the slider 111
to fly above the surface of the disc 116. The VCM 102 is
selectively operated to move the actuator arm 104 around the axis
120, thereby moving the suspension 106 and positioning the
transducing head (not shown), which includes a main pole (not
shown), by the slider 111 over the tracks 118 of the disc 116. It
is imperative to position the transducing head properly to read and
write data from and to the concentric tracks 118.
[0032] With reference now to FIG. 4, further structures of the disc
drive 100 are shown in accordance with an embodiment of the present
invention. As shown in FIG. 4, at least one rotatable magnetic disc
116 is supported on a spindle 214 and rotated by a disc drive motor
218. The magnetic recording on each disc is in the form of an
annular pattern of concentric data tracks (not shown in FIG. 4) on
the disc 116.
[0033] At least one slider 111 is positioned near the magnetic disc
116, each slider 111 supporting one or more magnetic head
assemblies 221. As the magnetic disc rotates, the slider 111 is
moved radially in and out over the disc surface 222 so that the
magnetic head assembly 221 may access different tracks of the
magnetic disc where desired data are written. Each slider 111 is
attached to the actuator arm 104 by way of a suspension 106. The
suspension 106 provides a slight spring force which biases slider
111 against the disc surface 222. Each actuator arm 104 is attached
to an actuator means 227. The actuator means 227, as shown in FIG.
2, may be the VCM 102. The VCM 102 comprises a coil movable within
a fixed magnetic field, the direction and speed of the coil
movements being controlled by the motor current signals supplied by
the controller 229.
[0034] During operation of the disc storage system or disc drive
100, the rotation of the disc 116 generates an air bearing between
the slider 111 and the disc surface 222 which exerts an upward
force or lift on the slider. The air bearing thus counter-balances
the slight spring force of the suspension 106 and supports the
slider 111 off and slightly above the disc surface by a small,
substantially constant spacing during normal operation.
[0035] The various components of the disc storage system are
controlled in operation by control signals generated by the control
unit 229, such as access control signals and internal clock
signals. Typically, the control unit 229 comprises logic control
circuits, storage means and a microprocessor. The control unit 229
generates control signals to control various system operations such
as drive motor control signals on line 223 and head position and
seek control signals on line 228. The control signals on line 228
provide the desired current profiles to optimally move and position
slider 111 to the desired data track on the disc 116. Write and
read signals are communicated to and from write and read heads 221
by way of recording channel 225.
[0036] The above description of a typical magnetic disk storage
system and the accompanying illustration of FIG. 4 are for
representation purposes only. It should be apparent that disc
storage systems may contain a large number of discs and actuators,
and each actuator may support a number of sliders. It should be
noted that the term "disc", as used herein, is the same as the term
"disk", as known to those of ordinary skill in the art, in fact,
the terms "disc" and "disk" are used interchangeably herein.
[0037] This invention provides a new structure as well as a method
of improving the fabrication of a portion of the write head. With
reference to FIG. 5, a plan view of an exemplary magnetic write (or
recording) head 500 and read head 501 is shown in accordance with
one embodiment of the present invention. To provide perspective,
the write head 500 and the read head 501 are a part of the slider
111 of FIG. 3 operational in a disc drive, such as the disc drive
100.
[0038] The read head 501 is shown to include magnetic read element
502 sandwiched between first and second magnetic shields, 504 and
506. A write head, generally referred to as 508, includes a first
pole P1 510. A P1 pedestal 512 disposed at the air bearing surface
(ABS) 526 and a first back gap layer 514, at an opposite end, are
formed over the first pole. The first pole 510, P1 pedestal 512,
and back gap 514 are formed of a magnetic material such as for
example NiFe. A first coil insulation layer 516 is formed over the
first pole 510 between the P1 pedestal 512 and the back gap layer
514. In one method of manufacturing the write head 500, the back
gap layer 514 is made at the same time as the P1 pedestal 512.
However, in other methods of manufacturing the same, the back gap
layer 514 is made separately. In one embodiment of the present
invention, the back gap layer 514 may be made of nickel iron (NiFe)
alloys, cobolt iron (CoFe) alloys, or cobolt iron nickel (CoFeNi)
alloys. An electrically conductive coil layer 518, shown in partial
cross section in FIG. 5, is plated over the first pole 510 on top
of the first barrier/seed insulation layer 516, into the coil
pockets (reference number 518 refers to the coil pockets after they
have been filled with the coil layer). The coil material may be
deposited in the coil pockets by plating or other deposition
techniques. The coil turns induce a magnetic flux in the yoke which
is used to generate the write filed used to record magnetic
transitions on the media. The number of coil turns is dependent on
the specifics of the design of the head. The greater the number of
turns, the greater the generated flux but also greater inductance
and resistance (since each coil turn has to be narrower). One
solution to this problem is presented in the U.S. patent
application Ser. No. 10/652,878, by the same inventors, filed on
Aug. 29, 2003, entitled "Method For Patterning A Self-Aligned Coil
Using A Damascene Process", the disclosure of which is incorporated
herein by reference, as though set forth in full.
[0039] In one embodiment of the present invention, the first
insulation layer 516 is made by the deposition of a layer of
alumina (Al.sub.2O.sub.3) or silicon dioxide (SiO.sub.2) followed
by the deposition of a seed layer (e.g. Rhodium), and the coil 518
is made of copper. A second coil insulation layer 520 insulates the
turns of the coil 518 from one another and insulates the coil from
the rest of the write head 508. In one embodiment of the present
invention, the second coil insulation layer 520 is hard baked
photoresist.
[0040] The embodiment of FIG. 5 presents a non-damascene structure
and method of manufacturing the same for reducing recession of the
P1 pedestal, as will be evident shortly. However, a brief
discussion of the advantage of the write head 500 and manufacturing
thereof over that of a damascene method is presented. In damascene
techniques, various ways of manufacturing coil within coil pockets
that are self-aligned are employed but these methods require added
effort and more extensive manufacturing details that are not
required by the embodiments of the present invention. The damascene
technique of coil formation may require for example, a tri-layer
method including an imaging layer, a dielectric layer, and hard
bake resist. An alternative embodiment may consist of a bi-layer
method including an imaging layer and dielectric layer. However,
the manufacturing of the write head 500 according to one aspect of
the present invention does not require the complexities of the
damascene technique and at the same time it allows for the
formation of self-aligned coils with lower resistance due to a more
efficient use of the small space between the P1 pedestal 512 and
the back gap 514. The more efficient use of the space between the
P1 pedestal 512 and the back gap 514 allows for the formation of
copper coils that occupy a larger percentage of the area available,
leading to lower resistance and inductance for a given number of
coil turns. Also, the proximity of the last coil turn behind the P1
pedestal strengthens P1 pedestal and offers better protection
against P1 pedestal 512 sinking in during subsequent processing
steps following the formation of P1 pedestal 512.
[0041] With continued reference to FIG. 5, a thin layer of
non-magnetic write gap layer 524 is deposited over the coil 518,
insulation layers 520 and P1 pedestal 512, and extends to an air
bearing surface (ABS) 526 at one end and stops short of extending
completely over the top of the back gap layer 514 at the other end.
A magnetic second back gap material layer 528 may be formed over
the top of the back gap layer 514, being magnetically connected
therewith. The ABS is the surface of the magnetic head designed
such that it enables the magnetic head to ride on a cushion of air
between the head and the disc along the disc surface.
[0042] With continued reference to FIG. 5, a P2 pole tip 530 is
provided on top of the write gap layer 524 in the pole tip region
513. The P2 pole tip 530 extends to the ABS 526, and has a width
(into the page of FIG. 5) that defines a track width of the write
head 508. The P2 pole tip is constructed of a magnetic material,
and is preferably constructed of a soft magnetic material having a
high magnetic saturation (high Bsat), and low coercivity and a high
magnetic moment.
[0043] With reference still to FIG. 5, a dielectric material or
layer 521, such as alumina, extends from the P2 pole tip 530 to the
second back gap layer 528. A second coil 534 sits atop the
dielectric layer, and is insulated by an insulation layer 536,
which could be, for example, hard baked photoresist. A P3 magnetic
layer 538 is formed above the second coil 534 and the insulation
layer 536 and extends from the P2 pole tip 530 to the second back
gap layer 528 being magnetically connected with both. Further
details of the process for manufacturing the write head 508 are
presented shortly relative to other figures.
[0044] As noted in a comparison of FIGS. 5 and 2, the coil 518 has
a larger cross section area than that of the coil 418 because part
of the insulation layer 420 of FIG. 2 is replaced with the coil 518
of FIG. 5. Thus, the coil 518 is lower in resistance than the coil
418, which is desirable for reasons, discussed hereinabove. Viewed
from a conductivity standpoint, the conductivity of the area below
the write gap layer 524 and above the pole P1 510 is increased by
20 to 40% due to the coil 518 having a larger cross section area.
The more efficient use of the space between the P1 pedestal 512 and
the back gap 514 allows for the formation of copper coils that
occupy a larger percentage of the area available, leading to lower
resistance and inductance for a given number of coil turns. Another
an aspect of an embodiment of the invention may be based on the
ratio of conductive material to non-conductive material between P1
pedestal 512 and the back gap 514, above the P1 pole layer 510 and
below the insulation layer 521. At least one embodiment of the
present invention provides for a greater ratio of the space
described above occupied by conductive material of the coil (e.g.
copper) versus the non-conductive insulation material 520 (e.g.
AlO3). This ratio will vary with each design (yoke length) and the
number of coil turns required, but for a given design and
corresponding number of coil turns, the ratio of the area occupied
by the coil turns divided by the area occupied by insulation is
higher than the conventional methods of prior art. Furthermore,
during manufacturing of the write head and specifically during
aggressive cleaning and after the ABS is exposed, in prior art
techniques, the P1 pedestal is, at times, known to sink.
[0045] For example, in FIG. 5, the P1 pedestal 512 does not sink
because metal rather than hard baked photoresist is behind it, i.e.
the coil 518 is located in place of the insulation layer 420 that
is behind or next to the P1 pedestal 512, which as earlier
mentioned reduces or eliminates occurrences of disc scratching and
damage.
[0046] Another advantage of an embodiment according to the present
invention is based on the fact that the protrusion of the magnetic
poles and shields at the ABS is reduced in an embodiment of the
present invention because the write head is cooler during write
operations. Protrusion is reduced by packing more copper versus
insulation material into the area between the P1 pedestal 512 and
the back gap 514 (area into which copper is plated). As current is
applied into the coil, protrusion is reduced if more copper is
packed into the coil pocket. Based on ohm's law, resistance is
inversely proportional to the copper thickness. Therefore, an
increase in the coil line width results in lower resistance that
leads to lower heat generation and therefore reduced
protrusion.
[0047] Moreover, the same tools and processes that are utilized to
manufacture the write head 408 of FIG. 2 are used to manufacture
the write head 508 of FIG. 5 thereby avoiding increased
manufacturing costs. That is, no further tooling is needed to
manufacture the write head 508 of FIG. 5 while the latter offers
performance improvements over the write head 408 of FIG. 2.
[0048] For example, as a comparison to the use of damascene
process, the latter uses photolithography tool, reactive ion etch
tool, copper plating tool and CMP tool to form the coil. The
non-damascene coil process of the present invention only uses
photolithography tool and copper plating tool.
[0049] The coil 518, illustrated in FIG. 5, more efficiently
utilizes the space in the coil pocket and provides regular coil
spacing. More copper for the coils 610 is packed for coil turn.
Moreover, the likelihood of pole tip protrusions is diminished
because by maximizing the copper forming the coil turns, the write
head operates at a lower temperature.
[0050] The coil 518 of FIG. 5 is formed using a self-aligned
non-damascene process. This process may be used in
perpendicular/longitudinal designs and either single or dual layer
coils. Moreover, protrusions are further reduced by maximizing the
copper in the coil turns.
[0051] Remaining figures will now be discussed to provide further
details of the steps for manufacturing the write head 508.
[0052] FIGS. 6(a)-(i) show some of the relevant steps for
processing or manufacturing the write head 508. In FIG. 6(a), the
build-up of the first pole P1 510 is shown, at step 602. As seen
from FIG. 6(a), a first reader shield 504 is formed, in one
embodiment by plating. Then a first reader gap made of magnetically
insulting material is deposited (not shown here), next after a CMP
process, the read sensor 502 is formed by depositing the many
layers comprising the read sensor. Finally a second reader shield
506 is formed above a reader gap layer formed on top of the read
sensor 502. The first step in forming the write head is the making
of a first pole of the write head made above an insulation layer
formed on top of the second reader shield 506.
[0053] FIG. 6(b) shows step 604 where the P1 pedestal 512 and the
back gap 514 are formed by plating, in one embodiment of the
present invention. Both the P1 pedestal 512 and the back gap 514
are magnetically connected to the P1 pole 510.
[0054] In FIG. 6(c), at step 606, a dielectric insulator, such as
an alumina gap, is deposited to form the insulation layer 516, at
least partially covering the P1 pedestal, the back gap 514 and the
exposed portion of P1 pole layer 510 between the P1 pedestal 512
and the back gap 514. The alumina gap layer 516 serves as an
insulator to electrically isolate the coil turns that will be
formed on top of the P1 pole layer 510 and may typically be 0.25
microns in thickness, although other thicknesses may be employed.
In one embodiment, a typical thickness of the alumina gap is 0.1 to
0.5 microns. In one embodiment of the present invention, at step
606, a very thin seed layer may be deposited above the insulation
layer 516, serving as a seed layer for the coil turns on top of the
alumina. The seed layer (not shown here) may be made of Rhodium
(Rd), copper or other appropriate materials, and may be about 0.04
to 0.15 microns in thickness.
[0055] Next, in FIG. 6(d), at step 608, a photoresist layer 600 is
applied on top of the insulation layer 516 for the purpose of
patterning/exposing the coil turns 518 (see FIG. 5), as will soon
become apparent.
[0056] In FIG. 6(e), at step 610, the photoresist layer 600 of FIG.
6(d) is exposed with the pattern for the coil turns and depending
on whether positive or negative resist is used, the exposed or
unexposed portions of the resist 600 are developed and dissolved
away to form the pattern for the coil turns 518 (FIG. 5) within the
resist 622. So the coil turns pattern is developed above the
insulation layer 516, which is formed on top of the P1 pole layer
510, and at least partially on top of P1 pedestal 512 and the back
gap layer 514. Additionally, the coil turns pattern 622 allows for
a self-aligned coil with one or both the P1 pedestal 512 and the
back gap 514. It should be noted that the distance between the
first coil turn in coil turns pattern 622, as shown at 620 is very
narrow, allowing for a larger first coil turn cross section and
thus lower coil resistance. This occurs because more copper may be
formed in the wider first coil turn. In at least in one embodiment,
the first coil turn occupies at least partially an area under the
P2 pole layer 526 (see FIG. 5).
[0057] Next, at step 612 of FIG. 6(f), copper coil 624 is plated
wherever there is an opening in the photoresist 600, corresponding
to the coil turns photoresist pattern 622. As may be apparent to
the reader, the width of the copper coil 624 is increased and there
is more conducting material (e.g copper) as compared to the prior
art design of FIG. 2. In an example embodiment, this width increase
is experienced to be 10-30%. An example of the width of each of the
copper coil 624 plated in between two of the coil photoresist
pattern 622 is known to be 0.5 to 4 microns. Furthermore, the coil
624 is self-aligned. The presence of the deposited coil conducting
material at least partially above the P1 pedestal 512 and the back
gap 514 allows for the coil 624 to be self-aligned with both the P1
pedestal 512 and the back gap 514, and further allowing the
designer to take advantage of the maximum space available between
the P1 pedestal 512 and the back gap 514.
[0058] Next, at step 614 of FIG. 6(g), the remaining portions of
the coil turn photoresist layer 600 and the seed layer that were
deposited at step 606 are removed. The remaining photoresist layer
622 may be removed using a solvent to dissolve the photoresist, and
the seed layer may be removed using ion milling or an etching
process. When the remaining photoresist layer 622 is removed, empty
spaces 623 remain between turns of the copper coil 624.
[0059] Next, at step 616 of FIG. 6(h), an insulation layer 626,
made typically of photoresist, is applied to fill the spaces 623
between the copper coil 624 and then hard baked, encapsulating the
copper coil 624. This process is also commonly referred to as hard
bake resist. An example of the baking temperatures is 200 to 280
Celsius. The photoresist in one embodiment is a liquid resist. The
insulation layer 626 thus electrically isolates the coil turns from
each other as well as from the other elements of the write head,
e.g. the P2 pole (not shown in this figure).
[0060] Next, at step 618 of FIG. 6(i), alumina 630 is deposited on
top of the hard bake photoresist 626, as well as everywhere in the
field region to approximately the same height or level. The alumina
630 is a thick layer and is typically 2 to 4 microns. A Chemical
Mechanical Polishing (CMP) process 628 is performed to planarize
the top surface of the copper coil 624 and the insulation layer 626
of FIG. 6(h). The goal of the manufacturing of the coil 628 is for
the copper to take as much of the space between the P1 pedestal 512
and first back gap layer 514 as possible. Additionally, due to the
position of the coil photoresist pattern 622 overlapping the P1
pedestal 512 and the first back gap layer 514, the coil 628 is
self-aligned. The process described relative to FIGS. 6(a)-(i) is
less process and equipment intensive and thus more cost efficient
and easier to implement than a damascene process of manufacturing
coil turns in a write head 508.
[0061] FIGS. 7(a)-(f) show additional steps performed to complete
the fabrication of the write head 508, and will be discussed
briefly. In FIG. 7(a), at step 640, the write gap 524 is deposited
on top of the alumina that was deposited at step 618. No gap is
deposited on the first back gap 514 to allow it to form a magnetic
yoke circuit. Next, at step 642 of FIG. 7(b), the P2 pole tip 530
and the second back gap layer 528 are formed on top of the write
gap 524. Next, at step 644 of FIG. 7(c), alumina is deposited and a
CMP process is performed to planarize the top surface of the first
coil 518 upon which the second coil 534 is formed so as to insulate
the second coil 534. The coil 518 and the coil 534 are two layers
of coil and either one layer or two layers of coil may be
employed.
[0062] Next, at step 646 of FIG. 7(d), the second coil 534 is
formed of copper. Next, at step 648 of FIG. 7(e), the insulation
layer 536 is applied on top of the second coil 534 by a hard bake
process similar to that discussed hereinabove. Next, at step 650 of
FIG. 7(f), a P3 pole magnetic layer 538 is formed, extending from
the P2 pole tip 530 to the second back gap layer 528 completing the
writer horse shoe loop and forming a complete yoke magnetic
circuit.
[0063] FIGS. 8(a)-(f) are presented for a better understanding of
an alternative method for fabrication of the coil 624 shown in
FIGS. 9(a)-(c), which will now be discussed. Steps 608 and 610 of
FIGS. 8(a) and (b) are performed, as previously discussed relative
to FIGS. 6(d) and 6(e), respectively. However, next, rather than
performing step 612, step 651 of FIG. 9(a) is performed. At step
651, the copper coil 624 is plated lower than that of step 612 and
almost all of the coil photoresist pattern 622 and the seed layer
that resided on top of the P1 pedestal 512 and the first back gap
layer 514 of FIG. 8(b) are removed. Next, at step 655, in FIG.
9(b), hard bake resist insulation 657 is applied and then, at step
653 of FIG. 9(c), an alumina layer 660 is deposited onto the copper
coil 654 and a CMP process is applied to level the top of the
alumina layer 660 and the copper coil 654. The step 616 is not
performed. However, due to the position of the alumina layer 660,
the cross section of the copper coil 654 is less than that of the
embodiment discussed with reference to FIGS. 5, 6(a)-(i) and
8(a)-(f) thereby yielding higher coil resistance than the latter.
It should be noted that the figures referred to herein are not
drawn to scale.
[0064] Although the present invention has been described in terms
of specific embodiments, it is anticipated that alterations and
modifications thereof will no doubt become apparent to those
skilled in the art. It is therefore intended that the following
claims be interpreted as covering all such alterations and
modification as fall within the true spirit and scope of the
invention.
* * * * *