U.S. patent application number 10/910496 was filed with the patent office on 2006-02-09 for electronic device and process for forming same.
Invention is credited to Michael Anzlowar, Charles Douglas MacPherson, Paul Anthony Sant, Matthew Stainer, Sughosh Venkatesh.
Application Number | 20060027800 10/910496 |
Document ID | / |
Family ID | 35694843 |
Filed Date | 2006-02-09 |
United States Patent
Application |
20060027800 |
Kind Code |
A1 |
MacPherson; Charles Douglas ;
et al. |
February 9, 2006 |
ELECTRONIC DEVICE AND PROCESS FOR FORMING SAME
Abstract
An electronic device includes a substrate, a structure having
openings, and a first electrode overlying the structure and lying
within the openings. From a cross-sectional view, the structure, at
the openings, has a negative slope. From a plan view, each opening
has a perimeter that may or may not substantially correspond to a
perimeter of an organic electronic component. The portions of the
first electrode overlying the structure and lying within the
openings are connected to each other. In a process for forming the
electronic device, an organic active layer may be deposited within
the opening, wherein the organic active layer has a liquid
composition.
Inventors: |
MacPherson; Charles Douglas;
(Santa Barbara, CA) ; Stainer; Matthew; (Goleta,
CA) ; Anzlowar; Michael; (Santa Barbara, CA) ;
Sant; Paul Anthony; (Santa Barbara, CA) ; Venkatesh;
Sughosh; (Goleta, CA) |
Correspondence
Address: |
E I DU PONT DE NEMOURS AND COMPANY;LEGAL PATENT RECORDS CENTER
BARLEY MILL PLAZA 25/1128
4417 LANCASTER PIKE
WILMINGTON
DE
19805
US
|
Family ID: |
35694843 |
Appl. No.: |
10/910496 |
Filed: |
August 3, 2004 |
Current U.S.
Class: |
257/40 |
Current CPC
Class: |
H01L 51/0002 20130101;
H01L 27/3246 20130101; H01L 27/3283 20130101 |
Class at
Publication: |
257/040 |
International
Class: |
H01L 29/08 20060101
H01L029/08 |
Goverment Interests
STATEMENT AS TO FEDERALLY SPONSORED RESEARCH
[0001] This invention was made with Government support under DARPA
grant number 4332. The Government may have certain rights in the
invention.
Claims
1. An electronic device comprising: a substrate; a structure having
openings, wherein from a cross-sectional view, the structure, at
the openings, has a negative slope, wherein from a plan view, each
opening has a perimeter that substantially corresponds to a
perimeter of an organic electronic component; and a first electrode
overlying the structure and lying within the openings, wherein
portions of the first electrode overlying the structure and lying
within the openings are connected to each other.
2. The electronic device of claim 1, wherein the organic electronic
component comprises an organic active layer.
3. The electronic device of claim 2, wherein a surface of the
structure is hydrophobic.
4. The electronic device of claim 1, further comprising a second
electrode lying between the substrate and the structure.
5. The electronic device of claim 4, wherein the second electrode
has a surface that is hydrophilic.
6. The electronic device of claim 1, wherein the substrate
comprises a driver circuit coupled to the organic electronic
component.
7. An electronic device comprising: a substrate; a first structure
overlying the substrate, wherein: from a cross-sectional view, the
first structure has a negative slope; and from a plan view, the
first structure has a first pattern; and a second structure
overlying the substrate, wherein: from a cross-sectional view, the
second structure has a negative slope; from a plan view, the second
structure has a second pattern different from the first pattern;
and the first structure has a portion that contacts the second
structure.
8. The electronic device of claim 7, wherein the first structure
comprises openings, wherein from a plan view, each opening has a
perimeter that substantially corresponds to a perimeter of an
organic electronic component.
9. The electronic device of claim 8, further comprising an
electrode overlying at least portions of the first structure and
the second structure.
10. The electronic device of claim 9, wherein the electrode lies
within the openings and is continuous between the openings.
11. The electronic device of claim 8, wherein the organic
electronic component comprises an organic active layer.
12. The electronic device of claim 7, wherein the second structure
has a thickness at least 1.5 times greater than a thickness of the
first structure.
13. The electronic device of claim 7, wherein the first structure
has a thickness no more than about 3 micrometers.
14. The electronic device of claim 7, wherein the second structure
has a thickness at least about 3 micrometers.
15. The electronic device of claim 7, further comprising an
electrode between the substrate and the first structure.
16. The electronic device of claim 15, wherein the electrode has a
surface that is hydrophilic.
17. The electronic device of claim 7, wherein the electronic device
comprises a passive matrix display.
18. The electronic device of claim 7, wherein the first structure
and the second structure have surfaces that are hydrophobic.
19. A process for forming an electronic device comprising the steps
of: forming a structure having a negative slope and openings,
wherein from a plan view, each opening has a perimeter that
substantially corresponds to a perimeter of an organic electronic
component; depositing an organic active layer within the opening,
wherein the organic active layer has a liquid composition; and
forming a first electrode overlying the structure and the organic
active layer and lying within the openings, wherein portions of the
first electrode overlying the structure and lying within the
openings are connected to each other.
20. The process of claim 19, further comprising forming a second
electrode before forming the structure, wherein after forming the
structure, portions of the second electrode are exposed along the
bottoms of the openings.
21. The process of claim 20, wherein the liquid composition
contacts the second electrode at a wetting angle of less than 90
degrees.
22. The process of claim 20, wherein the liquid composition
contacts the structure at a wetting angle of at least 45 degrees.
Description
FIELD OF THE INVENTION
[0002] This invention relates in general to electronic devices and
methods for forming electronic devices. More specifically, the
invention relates to electronic devices including organic
electronic components.
BACKGROUND INFORMATION
[0003] Increasingly, active organic molecules are used in
electronic devices. These active organic molecules have electronic
or electro-radiative properties including electroluminescence.
Electronic devices that incorporate organic active materials may be
used to convert electrical energy into radiation and may include a
light-emitting diode, light-emitting diode display, or diode laser.
Electronic devices that incorporate organic active layers may also
be used to generate signals in response to radiation (e.g.,
photodetectors (e.g., photoconductive cells, photoresistors,
photoswitches, phototransistors, phototubes), infrared ("IR")
detectors, biosensors); convert radiation into electrical energy
(e.g., a photovoltaic device or solar cell); and perform logic
functions (e.g. a transistor or diode).
[0004] However, the manufacturing of electronic components that
include organic active layers is difficult. Inconsistent formation
of organic active layers typically leads to poor device performance
and poor yield in device fabricating processes. In the case of
liquid deposition of organic active layers, poor wetting of
electrodes may lead to voids within the organic active layer.
[0005] FIG. 1 illustrates a plan view of a prior art structure 102
and FIG. 2 illustrates a cross-sectional view of the prior art
structure 102. The structure 102 has a perimeter having a positive
slope as seen from the cross-sectional view of FIG. 2. When a
liquid composition 106 is deposited into the well formed by the
surrounding structure 102, it may form voids. Such voids decrease
the available surface area for radiation emission or radiation
absorption, leading to reduced performance. Voids, such as void
108, may also expose underlying structures 104, such as electrodes.
When additional layers are formed over organic layers resulting
from curing the liquid composition, these layers may contact the
underlying structure 104, permitting electrical shorting between
electrodes and rendering an affected organic electronic component
inoperable.
[0006] In addition, if structure 102 is hydrophobic (i.e., has a
high wetting angle), poor wetting of liquid composition 106 can
occur in the well near the structure 102, and can result in
thinning of the organic layer. Although the organic layer may be
thick enough to prevent electrical shorting between electrodes, the
thin organic layer at the pixel edges can result in low
rectification ratios and low luminance efficiencies.
SUMMARY OF THE INVENTION
[0007] In one exemplary embodiment, an electronic device includes a
substrate, a structure having openings, and a first electrode
overlying the structure and lying within the openings. From a
cross-sectional view, the structure, at the openings, has a
negative slope. From a plan view, each opening has a perimeter that
substantially corresponds to a perimeter of an organic electronic
component. Portions of the first electrode overlying the structure
and lying within the openings are connected to each other.
[0008] In a further embodiment, an electronic device includes a
substrate, a first structure overlying the substrate, and a second
structure overlying the substrate. From a cross-sectional view, the
first structure has a negative slope and, from a plan view, the
first structure has a first pattern. From a cross-sectional view,
the second structure has a negative slope and, from a plan view,
the second structure has a second pattern different from the first
pattern. The first structure has a portion that contacts the second
structure.
[0009] In another exemplary embodiment, a process for forming an
electronic device includes forming a structure having a negative
slope and openings. From a plan view, each opening has a perimeter
that substantially corresponds to a perimeter of an organic
electronic component. The process also includes depositing an
organic active layer within the openings. The organic active layer
has a liquid composition. The process further includes forming a
first electrode overlying the structure and the organic active
layer and lying within the openings. Portions of the first
electrode overlying the structure and lying within the openings are
connected to each other. The foregoing general description and the
following detailed description are exemplary and explanatory only
and are not restrictive of the invention, as defined in the
appended claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The invention is illustrated by way of example and not
limitation in the accompanying figures.
[0011] FIGS. 1 and 2 include illustrations of a plan view and a
cross-sectional view, respectively, of a portion of a prior art
well structure.
[0012] FIGS. 3, 5, 6 and 7 include illustrations of a
cross-sectional view, a plan view, a plan view, and a
cross-sectional view of a portion of an exemplary embodiment of a
well structure before, during, and after a liquid composition is
placed within the well structure.
[0013] FIGS. 4 and 8 include illustrations of cross-sectional views
of the well structure of FIGS. 3, 5, 6, and 7 before an after a
liquid composition comes in contact with an edge having a negative
slope.
[0014] FIGS. 9 and 10 include illustrations of a plan view and a
cross-section view, respectively, of a portion of a substrate after
forming first electrodes over the substrate.
[0015] FIGS. 11 and 12 include illustrations of a plan view and a
cross-section view, respectively, of the substrate of FIGS. 9 and
10 after forming a well structure over the substrate and first
electrode.
[0016] FIGS. 13 and 14 include cross-sectional views illustrating
exemplary well structure patterns.
[0017] FIG. 15 includes an illustration of a plan view of the
substrate of FIGS. 11 and 12 after forming a separator structure
over the substrate, first electrode, and well structure.
[0018] FIGS. 16, 17, and 18 include illustrations of cross-section
views at sectioning lines 16-16, 17-17 and 18-18, respectively, of
FIG. 15.
[0019] FIGS. 19 and 20 include illustrations of a plan view and a
cross-section view, respectively, of the substrate of FIG. 15 after
forming organic layers over the substrate, first electrode, well
structure, and separator structure.
[0020] FIGS. 21, 22, and 23 include illustrations of a plan view, a
cross-sectional view, and cross-sectional views, respectively, of
the substrate of FIGS. 19 and 20 after forming a second electrode
over the substrate, first electrode, well structure, separator
structure, and organic layers.
[0021] FIGS. 24 and 25 include illustrations of a plan view and a
cross-section view, respectively, of a portion of an active-matrix
display having a common electrode.
DETAILED DESCRIPTION
[0022] In one embodiment, an electronic device includes a
substrate, a structure having openings, and a first electrode
overlying the structure and lying within the openings. From a
cross-sectional view, the structure, at the openings, has a
negative slope. From a plan view, each opening has a perimeter that
substantially corresponds to a perimeter of an organic electronic
component. Portions of the first electrode overlying the structure
and lying within the openings are connected to each other.
[0023] In one exemplary embodiment, a surface of the structure is
hydrophobic. In a further exemplary embodiment, a second electrode
lies between the substrate and the structure. In an additional
embodiment, the second electrode has a surface that is hydrophilic.
In another exemplary embodiment, the substrate includes a driver
circuit coupled to the organic electronic component.
[0024] In a further embodiment, an electronic device includes a
substrate, a first structure overlying the substrate, and a second
structure overlying the substrate. From a cross-sectional view, the
first structure has a negative slope and, from a plan view, the
first structure has a first pattern. From a cross-sectional view,
the second structure has a negative slope and, from a plan view,
the second structure has a second pattern different from the first
pattern. The first structure has a portion that contacts the second
structure.
[0025] In one exemplary embodiment, the first structure includes
openings, wherein, from a plan view, each opening has a perimeter
that substantially corresponds to a perimeter of an organic
electronic component. In another exemplary embodiment, the
electronic device includes an electrode overlying at least portions
of the first structure and the second structure. In a further
exemplary embodiment, the electrode lies within the openings and is
continuous between the openings. In an additional embodiment, the
second structure has a thickness at least 1.5 times greater than a
thickness of the first structure. In another exemplary embodiment,
the first structure has a thickness no more than about 3
micrometers. In a further exemplary embodiment, the second
structure has a thickness at least about 3 micrometers. In an
additional exemplary embodiment, the electronic device includes an
electrode between the substrate and the first structure. In another
exemplary embodiment, the electrode has a surface that is
hydrophilic. In a further exemplary embodiment, the electronic
device comprises a passive matrix display. In an additional
exemplary embodiment, the first structure and the second structure
have surfaces that are hydrophobic.
[0026] In another exemplary embodiment, a process for forming an
electronic device includes forming a structure having a negative
slope and openings. From a plan view, each opening has a perimeter
that substantially corresponds to a perimeter of an organic
electronic component. The process also includes depositing an
organic active layer within the openings. The organic active layer
has a liquid composition. The process further includes forming a
first electrode overlying the structure and the organic active
layer and lying within the openings. Portions of the first
electrode overlying the structure and lying within the openings are
connected to each other.
[0027] In one exemplary embodiment, the process includes forming a
second electrode before forming the structure, wherein after
forming the structure, portions of the second electrode are exposed
along the bottoms of the openings. In another exemplary embodiment,
the liquid composition contacts the second electrode at a wetting
angle of less than 90 degrees. In a further exemplary embodiment,
the liquid composition contacts the structure at a wetting angle of
at least 45 degrees.
[0028] For each of the exemplary embodiments disclosed above, the
organic electronic components may include an organic active
layer.
[0029] Other features and advantages of the invention will be
apparent from the following detailed description, and from the
claims. The detailed description first addresses Definitions
followed by Structures, Layers and Components of an Electronic
device, Process for Forming Electronic Devices, and Other
Embodiments.
1. Definitions and Clarification of Terms
[0030] Before addressing details of embodiments described below,
some terms are defined or clarified. As used herein, the term
"active" when referring to a layer or material is intended to mean
a layer or material that has electronic or electro-radiative
properties. An active layer material may emit radiation or exhibit
a change in concentration of electron-hole pairs when receiving
radiation.
[0031] The term "active matrix" is intended to mean an array of
electronic components and corresponding driver circuits within the
array.
[0032] The term "circuit" is intended to mean a collection of
electronic components that collectively, when properly connected
and supplied with the proper potential(s), performs a function. A
circuit may include an active matrix pixel within an array of a
display, a column or row decoder, a column or row array strobe, a
sense amplifier, a signal or data driver, or the like.
[0033] The term "connected," with respect to electronic components,
circuits, or portions thereof, is intended to mean that two or more
electronic components, circuits, or any combination of at least one
electronic component and at least one circuit do not have any
intervening electronic component lying between them. Parasitic
resistance, parasitic capacitance, or both are not considered
electronic components for the purposes of this definition. In one
embodiment, electronic components are connected when they are
electrically shorted to one another and lie at substantially the
same voltage. Note that electronic components can be connected
together using fiber optic lines to allow optical signals to be
transmitted between such electronic components.
[0034] The term "coupled" is intended to mean a connection,
linking, or association of two or more electronic components,
circuits, systems, or any combination of at least two of: (1) at
least one electronic component, (2) at least one circuit, or (3) at
least one system in such a way that a signal (e.g., current,
voltage, or optical signal) may be transferred from one to another.
Non-limiting examples of "coupled" can include direct connections
between electronic components, circuits or electronic components
with switch(es) (e.g., transistor(s)) connected between them, or
the like.
[0035] The term "driver circuit" is intended to mean a circuit
configured to control the activation of an electronic component,
such as an organic electronic component.
[0036] The term "electrically continuous" is intended to mean a
layer, member, or structure that forms an electrical conduction
path without an electrical open circuit.
[0037] The term "electrode" is intended to mean a structure
configured to transport carriers. For example, an electrode may be
an anode, a cathode. Electrodes may include parts of transistors,
capacitors, resistors, inductors, diodes, organic electronic
components and power supplies.
[0038] The term "electronic component" is intended to mean a lowest
level unit of a circuit that performs an electrical function. An
electronic component may include a transistor, a diode, a resistor,
a capacitor, an inductor, or the like. An electronic component does
not include parasitic resistance (e.g., resistance of a wire) or
parasitic capacitance (e.g., capacitive coupling between two
conductors connected to different electronic components where a
capacitor between the conductors is unintended or incidental).
[0039] The term "electronic device" is intended to mean a
collection of circuits, electronic components, or combinations
thereof that collectively, when properly connected and supplied
with the proper potential(s), performs a function. An electronic
device may include, or be part of, a system. Examples of electronic
devices include displays, sensor arrays, computer systems,
avionics, automobiles, cellular phones, and many other consumer and
industrial electronic products.
[0040] The term "hydrophilic" is intended to mean that an edge of a
liquid exhibits a wetting angle less than 90 degrees with respect
to a surface that it contacts.
[0041] The term "hydrophobic" is intended to mean that an edge of a
liquid exhibits a wetting angle of 90 degrees or more with respect
to a surface that it contacts.
[0042] The term "layer" is used interchangeably with the term
"film" and refers to a coating covering a desired area. The area
can be as large as an entire device or as small as a specific
functional area such as the actual visual display, or as small as a
single sub-pixel. Films can be formed by any conventional
deposition technique, including vapor deposition and liquid
deposition. Typical liquid deposition techniques include, but are
not limited to, continuous deposition techniques such as spin
coating, gravure coating, curtain coating, dip coating, slot-die
coating, spray coating, and continuous nozzle coating; and
discontinuous deposition techniques such as ink jet printing,
gravure printing, and screen printing.
[0043] The term "liquid composition" is intended to mean an organic
active material that is dissolved in a liquid medium or media to
form a solution, dispersed in a liquid medium or media to form a
dispersion, or suspended in a liquid medium or media to form a
suspension or an emulsion.
[0044] The term "negative slope" is intended to mean a
characteristic of a structure, wherein a side of the structure
forms an acute angle with respect to a substantially planar surface
over which the structure is formed.
[0045] The term "opening" is intended to mean an area characterized
by the absence of a particular structure that surrounds the area,
as viewed from the perspective of a plan view.
[0046] The term "organic electronic device" is intended to mean a
device including one or more semiconductor layers or materials.
Organic electronic devices include: (1) devices that convert
electrical energy into radiation (e.g., an light-emitting diode,
light emitting diode display, or diode laser), (2) devices that
detect signals through electronics processes (e.g., photodetectors
(e.g., photoconductive cells, photoresistors, photoswitches,
phototransistors, or phototubes), IR detectors, or biosensors), (3)
devices that convert radiation into electrical energy (e.g., a
photovoltaic device or solar cell), and (4) devices that include
one or more electronic components that include one or more organic
semiconductor layers (e.g., a transistor or diode).
[0047] The term "overlying," when used to refer to layers, members
or structures within a device, does not necessarily mean that one
layer, member or structure is immediately next to or in contact
with another layer, member, or structure.
[0048] The term "passive matrix" is intended to mean an array of
electronic components, wherein the array does not have any driver
circuits.
[0049] The term "perimeter" is intended to mean a boundary of a
layer, member, or structure that, from a plan view, forms a closed
planar shape.
[0050] The term "structure" is intended to mean one or more
patterned layers or members, which by itself or in combination with
other patterned layer(s) or member(s), forms a unit that serves an
intended purpose. Examples of structures include electrodes, well
structures, cathode separators, and the like.
[0051] The term "substrate" is intended to mean a base material
that can be either rigid or flexible and may be include one or more
layers of one or more materials, which can include, but are not
limited to, glass, polymer, metal or ceramic materials or
combinations thereof.
[0052] The term "wetting angle" is intended to mean a tangent angle
at the edge interface between a gas, a liquid and a solid surface
as measured from the solid surface through the liquid to a
gas/liquid interface.
[0053] As used herein, the terms "comprises," "comprising,"
"includes," "including," "has," "having" or any other variation
thereof, are intended to cover a non-exclusive inclusion. For
example, a process, method, article, or apparatus that comprises a
list of elements is not necessarily limited to only those elements
but may include other elements not expressly listed or inherent to
such process, method, article, or apparatus. Further, unless
expressly stated to the contrary, "or" refers to an inclusive or
and not to an exclusive or. For example, a condition A or B is
satisfied by any one of the following: A is true (or present) and B
is false (or not present), A is false (or not present) and B is
true (or present), and both A and B are true (or present).
[0054] Also, use of the "a" or "an" are employed to describe
elements and components of the invention. This is done merely for
convenience and to give a general sense of the invention. This
description should be read to include one or at least one and the
singular also includes the plural unless it is obvious that it is
meant otherwise.
[0055] Unless otherwise defined, all technical and scientific terms
used herein have the same meaning as commonly understood by one of
ordinary skill in the art to which this invention belongs. Although
methods and materials similar or equivalent to those described
herein can be used in the practice or testing of the present
invention, suitable methods and materials are described below. All
publications, patent applications, patents, and other references
mentioned herein are incorporated by reference in their entirety.
In case of conflict, the present specification, including
definitions, will control. In addition, the materials, methods, and
examples are illustrative only and not intended to be limiting.
2. Structures, Layers, and Components of an Electronic Device
[0056] In a particular embodiment, an electronic device includes an
array of organic electronic components and a structure having
openings that correspond to a perimeter of each of the organic
electronic components when viewed from a plan view. The structure
has a negative slope at the openings when viewed from a
cross-sectional view. Each organic electronic component may include
first and second electrodes (e.g. an anode and a cathode) separated
by one or more layers including an organic active layer. In one
embodiment, the exemplary electronic device may also include a
second structure that has a negative slope, such as an electrode
separator (e.g. cathode separator).
[0057] In one exemplary embodiment, the array of organic electronic
components may be part of a passive matrix. In another exemplary
embodiment, the array of organic electronic components may be part
of an active matrix. As such, exemplary embodiments of the
electronic device may include active matrix and passive matrix
displays.
[0058] Generally, each organic electronic component includes two
electrodes separated by one or more organic active layers. In
addition, other layers, such as hole-transport layers and
electron-transport layers, may be included between the two
electrodes. Structures having openings that correspond to the
perimeter of each of the organic electronic components define wells
within which, portions of the organic electronic components are
formed. As such, these structures may periodically be described as
well structures herein.
[0059] The cross-section of the well structures may influence
organic layer formation. FIG. 3 illustrates a cross-sectional view
of an exemplary structure 302. The structure 302 has a negatively
sloped wall or perimeter 304 and forms an acute angle with
underlying structure 308. FIG. 4 illustrates a portion of a
perimeter of an exemplary structure 402 that forms an acute angle
.alpha. (alpha) between the surface of an underlying structure 406
and the structure wall 404. In one exemplary embodiment, the angle
.alpha. (alpha) is between 0.degree. and 90.degree., such as
between 0.degree. and 60.degree. or between 10.degree. and
45.degree.. In an alternative embodiment, the angle .alpha. (alpha)
may be about equal to or greater than the capillary angle.
[0060] As illustrated in FIG. 5, when a liquid composition 306 is
deposited into the perimeter of an opening formed by the structure
302, fingers 310 can be seen. As the opening within structure 302
fills, the liquid composition forms a layer without voids. FIG. 6
illustrates a plan view of a filled opening, and FIG. 7 illustrates
a cross-sectional view at sectioning line 7-7 of FIG. 6. When the
liquid composition 306 is deposited along the perimeter 304, it
covers the underlying structure 308. In one exemplary embodiment,
the liquid forms a layer that is substantially more uniform as
compared to a similar structure and liquid composition as
illustrated in FIGS. 1 and 2.
[0061] Regarding the structure of FIG. 4, FIG. 8 illustrates a
layer 808 formed overlying surface 406. A liquid composition may be
deposited and the solvent extracted to form layer 808. As is
illustrated, layer 808 contacts structure wall 404 and covers
surface 406. Electronic devices including such a layer are less
likely to short. In addition, the more uniform layer reduces the
likelihood of poor device performance characteristics (e.g., low
rectification ratio, low luminance efficiency, etc.) found in
devices where thinning of the organic layers near the well
structures is observed.
[0062] In one embodiment, an electronic device includes a
substrate, a first structure having a negative slope, and a second
structure having a negative slope when viewed from a
cross-sectional view. The first structure overlies the substrate
and, from a plan view, has a first pattern. The second structure
overlies the substrate and, from a plan view, has a second pattern
that is different from the first. In one embodiment, the first
structure is a well structure, an array of openings within which
organic electronic components may be formed. The second structure
may, for example, be an electrode separator structure.
[0063] In another embodiment, from a plan view, each opening within
the first structure has a perimeter that substantially corresponds
to a perimeter of an organic electronic component.
[0064] In one example, the second structure may have a thickness
between approximately 3 and 10 micrometers. The first structure may
have a thickness less than 3 micrometers, such as between
approximately 1 and 3 micrometers or less than 1 micrometer such as
approximately 0.4 micrometer. The second structure may, for
example, have a thickness at least 1.5 times greater than that of
the first structure.
[0065] In another embodiment, an electronic device includes a
substrate, a structure (e.g. a well structure), and a first
electrode. The structure has openings and, when viewed from a
cross-sectional view, has a negative slope at the openings. From a
plan view, each of the openings has a perimeter that substantially
corresponds to a perimeter of an organic electronic component. The
first electrode overlies the structure and lies within the
openings. Portions of the first electrode overlying the structure
and lying within the openings are connected to each other. In a
particular example, the organic electronic component may include
one or more organic active layers. In one embodiment, the first
electrode may be a common electrode (e.g., common cathode or common
anode for an array of organic electronic components). In another
exemplary embodiment, a second electrode may lie between the
substrate and the structure. In a further exemplary embodiment, the
organic electronic component may be coupled to a driver circuit
(not shown) lying within the substrate. Note that the second
electrode may be formed before the fist electrode in one
embodiment.
[0066] In one exemplary embodiment, the structure or structures
having the negative slope have substantially hydrophobic surfaces.
The surfaces exhibit wetting angles with liquid compositions
greater than 45.degree., such as 90.degree. or higher. In contrast,
underlying structures, such as electrodes may have substantially
hydrophilic surfaces, exhibiting wetting angles of liquid
compositions less than 90.degree., such as less than 60.degree. or
between approximately 0.degree. and about 45.degree..
3. Process for Forming Electronic Devices
[0067] An exemplary process for forming electronic devices includes
forming one or more structures that overlie a substrate and have a
negative slope from a cross-sectional perspective. One exemplary
process is illustrated in FIGS. 9 through 23, which can be used for
a passive matrix display. Variations on this process may be used to
form other electronic devices.
[0068] FIG. 9 depicts a plan view of a portion of an exemplary
process sequence, and FIG. 10 depicts a cross-sectional view of the
portion as viewed from sectioning line 10-10 in FIG. 9. Electrodes
904 are deposited on a substrate 902. The substrate 902 may be a
glass or ceramic material or a flexible substrate comprising at
least one polymer film. In one exemplary embodiment, the substrate
902 is transparent. Optionally, the substrate 902 may include a
barrier layer, such as a uniform barrier layer or a patterned
barrier layer.
[0069] The electrodes 904 may be anodes or cathodes. FIG. 9 depicts
the electrodes 904 as parallel strips. Alternately, the electrodes
904 may be a patterned array of structures having plan view shapes,
such as squares, rectangles, circles, triangles, ovals, and the
like. Generally, the electrodes may be formed using conventional
processes (e.g. deposition, patterning, or a combination
thereof.
[0070] The electrodes 904 may include conductive material. In one
embodiment, the conductive material may include a transparent
conductive material, such as indium-tin-oxide (ITO). Other
transparent conductive materials include, for example,
indium-zinc-oxide, zinc oxide, and tin oxide. Other exemplary
conductive materials include, zinc-tin-oxide (ZTO), elemental
metals, metal alloys, and combinations thereof. The electrodes 904
may also be coupled to conductive leads (not shown). In one
exemplary embodiment, the electrodes 904 may have hydrophilic
surfaces.
[0071] A subsequent layer may be deposited and patterned into
structures that, from a cross-sectional view, have a negative
slope. FIG. 11 depicts a plan view of this sequence in the process,
and FIG. 12 illustrates a cross-sectional view of the sequence. A
structure 1106 is formed that has openings 1108 and has a negative
slope at the openings 1108, as viewed from a cross-sectional view.
The openings 1108 may expose portions of electrodes 904. As seen
from the plan view, the bottom of the openings 1108 may include
portions of the electrodes 904 or may also encompass a portion of
the substrate 902.
[0072] In one exemplary embodiment, the structure 1106 may be
formed from resist or polymeric layers. The resist may, for
example, be a negative resist material or positive resist material.
The resist may be deposited on the substrate 902 and over the
electrodes 904. Typical liquid deposition techniques include, but
are not limited to, continuous deposition techniques such as spin
coating, gravure coating, curtain coating, dip coating, slot-die
coating, spray coating, and continuous nozzle coating; and
discontinuous deposition techniques such as ink jet printing,
gravure printing, and screen printing. The resist may be patterned
through selective exposure to radiation, such as ultraviolet (UV)
radiation. In one embodiment, the resist is spin deposited and
baked (not shown). The resist is exposed to UV radiation through a
mask (not shown), developed, and baked, leaving a structure having
a negative slope at the openings. The negative slope can be
achieved by (1) using a UV flood exposure (not collimated) when
using the masks or (2) overexposing the resist layer while the mask
lies between the resist layer and a radiation source (not
shown).
[0073] In another exemplary embodiment, a sacrificial structure may
be used. In one embodiment, a sacrificial layer is deposited and
patterned to form a sacrificial structure having a positive slope.
In a more specific embodiment, from a cross-sectional view, the
sacrificial structure has a complementary profile as compared to
the first structure 1106 that is subsequently formed. The thickness
of the sacrificial layer is substantially the same as the
subsequently formed first structure. In one embodiment, a
sacrificial layer is deposited over the first electrodes 904 and
the substrate 902. A patterned resist layer is formed over the
sacrificial layer using a conventional technique. In one specific
embodiment, a conventional resist-erosion etching technique is used
to form sloped sidewalls. In another specific embodiment, a
conventional isotropic etch is used. The patterned resist layer is
then removed using a conventional resist removal process.
[0074] Another layer that will be used for the first structure 1106
is deposited over the sacrificial structure and within openings in
the sacrificial structure. In one embodiment, that other layer has
a thickness of at least as thick as the thickness of the
sacrificial structures. In other embodiment, that other layer is
substantially thicker than the sacrificial layer. Portions of the
other layer lying outside the sacrificial structure are removed
using an etching or polishing technique that is conventional within
the inorganic semiconductor arts. After the portions have been
removed, the first structure is formed. The sacrificial structure
is then removed to form the openings 1108 within the first
structure 1106.
[0075] In one embodiment, the materials for the first and
sacrificial structures are different to allow the material of one
of the first and sacrificial structures to be removed selectively
compared to the other structure. Exemplary materials include
metals, oxides, nitrides, and resists. The material for the
sacrificial layer may be selected so that it can be selectively
removed from the substrate 902 without causing significant damage
to the first electrodes 904. After reading this specification,
skilled artisans will be able to choose materials that meet their
needs or desires.
[0076] After formation, the structure 1106 may have a pattern. The
pattern may, for example, be the pattern illustrated in FIG. 11.
Alternative patterns are illustrated in FIGS. 13 and 14. FIG. 13
illustrates a latticework pattern. FIG. 14 illustrates patterns
that may include oval shaped openings 1404 oriented across
underlying electrodes, circular openings 1406, and oval openings
1408 oriented along underlying electrodes, as view from a plan
view.
[0077] In another embodiment, another pattern may include columns
oriented substantially parallel to the lengths of electrodes 904.
Each of the columns has the negative slope and has at least a
portion covering the substrate 902 at locations adjacent to and
between the electrodes 904. A combination of the columns with
subsequently-formed electrode separator structures can result in
rectangular openings, from a plan view. The combination of
structures are formed before any one or more of the liquid
compositions are formed over the substrate.
[0078] A second structure may, optionally, be deposited over the
substrate 902 and the structure 1106. The second structure may or
may not contact portions of the electrodes 904 depending on the
pattern of the first structure 1106. The second structure may, for
example, be an electrode separator structure. FIGS. 15, 16, 17, and
18 illustrate an exemplary process sequence including the second
structures 1510. FIG. 15 illustrates a plan view including the
second structures 1510 oriented substantially perpendicular to the
electrode structures 904. FIG. 16 illustrates a cross-sectional
view between and parallel to the lengths of the second structures
1510 at sectioning line 16-16. FIGS. 17 and 18 illustrate
cross-sectional views perpendicular to the second structures 1510.
FIG. 17 illustrates a cross-sectional view through openings 1108 at
sectioning line 17-17, and FIG. 18 illustrates a cross-sectional
view away from openings 1108 at sectioning line 18-18.
[0079] As illustrated in FIGS. 17 and 18, the cross-sectional view
of the second structure 1510 has a negative slope. The second
structure 1510 may or may not encompass portions of the first
structure 1106 at the openings. In an alternate embodiment, the
second structure 1510 may be formed to entirely overlie the first
structure 1106. In general, the second structure 1510 may be formed
through techniques similar to those described in relation to the
first structure 1106.
[0080] Once the first structure 1106 and, optionally, the second
structure 1510 are formed, the electrodes 904 exposed via the
openings may be cleaned, such as through UV/ozone cleaning. The
structures 1108 and 1510 may be treated to produce hydrophobic
surfaces. For example, fluorine-containing plasma may be used to
treat the surfaces of the structures 1108 and 1510. The fluorine
plasma may be formed using gasses such as CF.sub.4, C.sub.2F.sub.6,
NF.sub.3, SF.sub.6, or combinations thereof. The plasma process may
include direct exposure plasma or use a downstream plasma. In
addition, the plasma may include O.sub.2. In one exemplary
embodiment, a fluorine-containing plasma may include 0-20% O.sub.2,
such as about 8% O.sub.2.
[0081] In one particular embodiment, the plasma is produced using a
March PX500 model plasma generator by March Plasma Systems of
Concord, Calif. The equipment is configured in flow through mode
with a perforated, grounded plate and a floating substrate plate.
In this embodiment, a 6-inch floating substrate plate is treated
with a plasma formed from a CF.sub.4/O.sub.2 gas composition. The
gas composition may include 80-100% CF.sub.4, such as approximately
92% CF.sub.4, and 0-20% O.sub.2, such as approximately 8% O.sub.2
by volume. The substrate may be exposed for 2-5 minutes, such as
approximately 3 minutes, at a pressure of 300-600 mTorr, such as a
400 mTorr, using a 200-500 W plasma, such as a 400 W plasma.
[0082] FIGS. 19 and 20 illustrate an exemplary sequence in the
process in which an organic layer 1913 is deposited. The organic
layer 1913 may include one or more organic layers. In one
embodiment as illustrated in FIG. 20, the organic layer 1913
includes a charge transport layer 1914 and an organic active layer
1912. When present, the charge transport layer 1914 is formed over
the first electrodes 904 and before the organic active layer 1912
is formed. The charge transport layer 1914 can serve multiple
purposes. In one embodiment, the charge transport layer 1914 is a
hole-transport layer. Although not shown, an additional charge
transport layer may be formed over the organic active layer 1912.
Therefore, the organic layer 1913 may include the organic active
layer 1912 and one, both or none of the charge transport layers.
Each of the charge transport layer 1914, organic active layer 1912,
and additional charge transport layer may include one or more
layers. In another embodiment, a single layer having a graded or
continuously changing composition may be used instead of separate
charge transport and organic active layers.
[0083] Returning to FIGS. 19 and 20, the charge transport layer
1914 and the organic active layer 1912 are formed sequentially over
the electrodes 904. Each of the charge transport layer 1914 and the
organic active layer 1912 can be formed by, for example, but not
limited to, continuous deposition techniques such as spin coating,
gravure coating, curtain coating, dip coating, slot-die coating,
spray coating, and continuous nozzle coating; discontinuous
deposition techniques such as ink jet printing, gravure printing,
and screen printing; casting; and vapor depositing. For example,
liquid compositions including the organic materials may be
dispensed-through nozzles, such as micronozzles. One or both of the
charge transport layer 1914 and the organic active layer 1912 may
be cured after application.
[0084] In this embodiment, the charge transport layer 1914 is a
hole-transport layer. The hole-transport layer can be used to
potentially increase the lifetime and improve the reliability of
the device compared to a device where the conductive members 904
would directly contact the organic active layer 1912. In one
specific embodiment, the hole-transport layer can include an
organic polymer, such as polyaniline ("PANI"),
poly(3,4-ethylenedioxythiophene) ("PEDOT"), or an organic charge
transfer compound, such as tetrathiafulvalene
tetracyanoquinodimethane (TTF-TCQN). The hole-transport layer
typically has a thickness in a range of approximately 100-250
nm.
[0085] The hole-transport layer typically is conductive to allow
electrons to be removed from the subsequently formed active region
and transferred to the conductive members 904. Although the
conductive members 904 and the optional hole-transport layer are
conductive, typically the conductivity of the conductive members
904 is significantly greater than the hole-transport layer.
[0086] The composition of the organic active layer 1912 typically
depends upon the application of the organic electronic device. When
the organic active layer 1912 is used in a radiation-emitting
organic electronic device, the material(s) of the organic active
layer 1912 will emit radiation when sufficient bias voltage is
applied to the electrode layers. The radiation-emitting active
layer may contain nearly any organic electroluminescent or other
organic radiation-emitting materials.
[0087] Such materials can be small molecule materials or polymeric
materials. Small molecule materials may include those described in,
for example, U.S. Pat. No. 4,356,429 and U.S. Pat. No. 4,539,507.
Alternatively, polymeric materials may include those described in
U.S. Pat. No. 5,247,190, U.S. Pat. No. 5,408,109, and U.S. Pat. No.
5,317,169. Exemplary materials are semiconducting conjugated
polymers. An example of such a polymer is poly(phenylenevinylene)
("PPV"). The light-emitting materials may be dispersed in a matrix
of another material, with or without additives, but typically form
a layer alone. The organic active layer generally has a thickness
in the range of approximately 40-100 nm.
[0088] When the organic active layer 1912 is incorporated into a
radiation receiving organic electronic device, the material(s) of
the organic active layer 1912 may include many conjugated polymers
and electroluminescent materials. Such materials include, for
example, many conjugated polymers and electro- and
photo-luminescent materials. Specific examples include
poly(2-methoxy,5-(2-ethyl-hexyloxy)-1,4-phenylenevinylene)
("MEH-PPV") and MEH-PPV composites with CN-PPV. The organic active
layer 1912 typically has a thickness in a range of approximately
50-500 nm.
[0089] Although not shown, an optional electron-transport layer may
be formed over the organic active layer 1912. The
electron-transport layer is another example of a charge transport
layer. The electron-transport layer typically is conductive to
allow electrons to be injected from a subsequently formed cathode
and transferred to the organic active layer 1912. Although the
subsequently formed cathode and the optional electron-transport
layer are conductive, typically the conductivity of the cathode is
significantly greater than the electron-transport layer.
[0090] In one specific embodiment, the electron-transport layer can
include metal-chelated oxinoid compounds (e.g., Alq3);
phenanthroline-based compounds (e.g.,
2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline ("DDPA"),
4,7-diphenyl-1,10-phenanthroline ("DPA")); azole compounds (e.g.,
2-(4-biphenyl)-5-(4-t-butylphenyl)-1,3,4-oxadiazole ("PBD"),
3-(4-biphenyl)-4-phenyl-5-(4-t-butylphenyl)-1,2,4-triazole ("TAZ");
or any one or more combinations thereof. Alternatively, the
optional electron-transport layer may be inorganic and comprise
BaO, LiF, or Li.sub.2O. The electron-transport layer typically has
a thickness in a range of approximately 30-500 nm.
[0091] Any one or more of the charge transport layer 1914, organic
active layer 1912, and additional charge transport layer may be
applied as a liquid composition that includes one or more liquid
media. The hydrophobic and hydrophilic surfaces are specific with
respect to the liquid media within the liquid composition. In one
embodiment, the liquid composition may include a co-solvent
including, for example, alcohols, glycols, and glycol ethers. A
solvent for the organic active layer liquid media may be select
such that it does not dissolve the charge transport layer.
Alternatively, the solvent may be selected such that the charge
transport layer is soluble or partially soluble in that
solvent.
[0092] In a particular embodiment, the negative slope of the
structure 1106 causes a capillary effect, drawing a liquid
composition of the organic material around the perimeter of the
openings 1108. Once cured, the organic active layer 1912 covers
underlying layers within the openings 1106, such as the electrodes
904 and charge transport layer 1914, preventing electrical shorting
between conductive members, such as electrodes (e.g. anodes and
cathodes).
[0093] A second electrode is formed over the organic layers 1913,
which in this embodiment includes the charge transport layer 1914
and the organic active layer 1912. FIG. 21 illustrates a plan view
of the process sequence and FIGS. 22 and 23 illustrate
cross-sectional views of the process sequence. In one embodiment, a
layer is deposited using a stencil mask to form conductive members
2118 on the second structures 1510 and forming electrodes 2116 over
organic active layers 1913 and over portions of the structure 1106.
The difference in elevation between electrode 2116 and conductive
members 2118 keeps them from being connected. As illustrated in
FIG. 22, electrode layer 2116 overlies layers within the openings
1108 and portions of the first structure 1106. The portions of
electrode layer 2116 overlying the layers within the openings 1108
and the portions of the electrode 2116 overlying portions of the
first structure 1106 are connected to each other to form an
electrically continuous structure.
[0094] In one embodiment, the electrodes 2116 act as cathodes. A
layer of the electrodes 2116 closest to the organic layer 1913 can
be selected from Group 1 metals (e.g., Li, Cs), the Group 2
(alkaline earth) metals, the rare earth metals including the
lanthanides and the actinides. The electrode layers 2116 and 2118
have a thickness in a range of approximately 300-600 nm. In one
specific, non-limiting embodiment, a Ba layer of less than
approximately 10 nm followed by an Al layer of approximately 500 nm
may be deposited. The Al layer may be replaced by or used in
conjunction with any of the metals and metal alloys.
[0095] As depicted in the FIGS. 21, 22, and 23, the organic
electronic components formed from an anode, such as electrode 904,
the organic layers 1913, and a cathode, such as electrode 2116 are
addressable via a peripheral circuitry. For example, applying a
potential across one selected row of electrodes 2116 and one
selected column of electrodes 904 activate one organic electronic
component.
[0096] An encapsulating layer (not shown) can be formed over the
array and the peripheral and remote circuitry to form a
substantially complete electrical device, such as an electronic
display, a radiation detector, and a photovoltaic cell. The
encapsulating layer may be attached at the rail such that no
organic layers lie between it and the substrate. Radiation may be
transmitted through the encapsulating layer. If so, the
encapsulating layer should be transparent to the radiation.
4. Other Embodiments
[0097] After formation of the organic electronic components, the
first structure 1106 and the second structures 1510 may optionally
be altered or removed. In one exemplary embodiment, the electronic
device may be heated to about a glass transition temperature of the
material forming structure 1106 or structures 1510. Such heating
may result in reflow, causing the slope of the structures to change
in the final device, as viewed from a cross-sectional perspective.
In another embodiment, an etch process may be used to remove
structures, such as structure 1106. As such, the cross-sectional
appearance of the final electronic device may be different than the
structures and layers depicted in FIGS. 21, 22, and 23.
[0098] The electronic device formed through the process illustrated
in FIGS. 9-23 is a passive matrix device. In an alternate
embodiment, the electronic device may be an active matrix device.
FIGS. 24 and 25 illustrate an exemplary active matrix device. FIG.
25 illustrates the cross section of an electronic component at
sectional lines 25-25 in FIG. 24. Each organic electronic component
2416 may include a unique electrode 2406 having an associated
driver circuit 2418. The driver circuit 2418 may be incorporated
into a substrate 2402 over which the unique electrode 2406 is
formed. A well structure 2404 may have openings corresponding to
the perimeter of the organic electronic components 2416. Other
structures, such as some of the other well structures described
with respect to a passive matrix device, may be used in other
embodiments. The well structure 2404 has a negative slope at the
openings when viewed from a cross-sectional perspective. Organic
layer 2408 may overlie the unique electrode 2406 and may include
hole-transport layer 2412 and organic active layer 2410.
Optionally, the organic layer 2408 may include an
electron-transport layer (not shown). In addition, the organic
electronic components 2416 may include a common electrode 2414.
Each organic electronic component 2416 may then be activated
through an active matrix mechanism, such as through the driver
circuits 2418.
[0099] In the various embodiments illustrated above, the electrodes
may be cathodes or anodes. For example, the electrode 904 may be an
anode or a cathode. Similarly, electrode 2116 may be an anode or a
cathode. In one particular embodiment electrode 904 is a
transparent anode overlying a transparent substrate 902. For
electronic display devices, radiation emitted from organic
electronic components may emit through the transparent anode and
the substrate. Alternately, the electrode 904 may be a transparent
cathode.
[0100] In another embodiment, the electrode 904 and the substrate
902 may be opaque or reflective. In this embodiment, electrode 2116
may be formed of a transparent material and, for radiation emitting
devices, radiation may be emitted from organic electronic component
through electrode 2116.
[0101] In a further embodiment, the process for forming the
electronic device may be used in fabricating radiation responsive
devices, such as sensor arrays, photodetectors, photoconductive
cells, photoresistors, photoswitches, phototransistors, phototubes,
IR detectors, biosensors, photovoltaics or solar cells. Radiation
responsive devices may include a transparent substrate and
substrate side electrode. Alternatively, the radiation responsive
device may include a transparent overlying electrode.
[0102] In still a further embodiment, the process for forming the
electronic device may be used for inorganic devices. In one
embodiment, a liquid composition for forming an inorganic layer may
be used and allow better coverage of the liquid composition
adjacent to the same or other structures having a negative
slope.
[0103] In the foregoing specification, the invention has been
described with reference to specific embodiments. However, one of
ordinary skill in the art appreciates that various modifications
and changes can be made without departing from the scope of the
invention as set forth in the claims below. Accordingly, the
specification and figures are to be regarded in an illustrative
rather than a restrictive sense and all such modifications are
intended to be included within the scope of the invention.
[0104] Benefits, other advantages, and solutions to problems have
been described above with regards to specific embodiments. However,
the benefits, advantages, solutions to problems, and any element(s)
that may cause any benefit, advantage, or solution to occur or
become more pronounced are not to be construed as a critical,
required, or essential feature or element of any or all of the
claims.
* * * * *