U.S. patent application number 10/899374 was filed with the patent office on 2006-01-26 for vibration severity monitor for a press die.
Invention is credited to Daniel A. Schoch.
Application Number | 20060016233 10/899374 |
Document ID | / |
Family ID | 35655702 |
Filed Date | 2006-01-26 |
United States Patent
Application |
20060016233 |
Kind Code |
A1 |
Schoch; Daniel A. |
January 26, 2006 |
Vibration severity monitor for a press die
Abstract
A die monitoring system for use in a press machine includes a
die element, a vibration severity monitor, and a monitor receiving
portion. The vibration severity monitor is configured for
monitoring a vibration severity condition of the die element. The
monitor receiving portion is associated with the die element and
includes a monitor cavity. This monitor cavity is configured for an
operable mounting of the vibration severity monitor therewithin. A
primary feature of the vibration severity monitor is that it can
remain with a particular die throughout the lifetime thereof, even
if the die is interchanged between machine presses.
Inventors: |
Schoch; Daniel A.; (Minster,
OH) |
Correspondence
Address: |
RANDALL J. KNUTH P.C.
4921 DESOTO DRIVE
FORT WAYNE
IN
46815
US
|
Family ID: |
35655702 |
Appl. No.: |
10/899374 |
Filed: |
July 23, 2004 |
Current U.S.
Class: |
72/20.1 |
Current CPC
Class: |
B21D 55/00 20130101;
B30B 15/28 20130101 |
Class at
Publication: |
072/020.1 |
International
Class: |
B21D 55/00 20060101
B21D055/00 |
Claims
1. A die system for use in a machine press, said die system
comprising: a die element; a vibration severity monitor configured
for monitoring a vibration severity condition of said die element;
and a monitor receiving portion associated with said die element,
said monitor receiving portion including a monitor cavity
configured for an operable mounting of said vibration severity
monitor therewithin.
2. The die system of claim 1, wherein said die element is capable
of use in any one of a chosen plurality of machine presses.
3. The die system of claim 1, wherein said die element is covered
by a warranty program, said vibration severity monitor being
configured for generating vibration severity data for use in
connection with said warranty program.
4. The die system of claim 1, wherein said vibration severity
monitor is configured for generating vibration severity data, said
vibration severity monitor being configured for communicating said
vibration severity data to another source in at least one of a
real-time format and a historically-captured format.
5. The die system of claim 4, wherein said vibration severity
monitor includes a wireless transmitter configured for transmitting
data online in a real-time format.
6. The die system of claim 1, wherein said monitor receiving
portion is one of an integral portion of said die element and a
separate plate attached to said die element.
7. The die system of claim 6, wherein said monitor receiving
portion is a separate plate attached to said die element.
8. The die system of claim 7, wherein said separate plate and an
accompanying said vibration severity monitor are capable of being
retrofit on an existing said die element.
9. The die system of claim 1, wherein said vibration severity
monitor is mounted in said monitor receiving portion in such a
manner so as to remain with said die element throughout a die
lifetime thereof.
10. The die system of claim 9, wherein said vibration severity
monitor circuit is shock mounted in said monitor receiving portion
and said sensor is hard mounted.
11. The die system of claim 1, wherein said vibration severity
monitor is in the form of a computer-on-a-chip.
12. The die system of claim 1, wherein said vibration severity
monitor is operatively associated with at least one accelerometer
configured for sensing an acceleration of said die element during
use thereof.
13. The die system of claim 1, wherein said vibration severity
monitor is further configured for tracking a tipping moment
severity of said die element.
14. A machine press, comprising: a first die; and a second die
operatively coupled with said first die, wherein at least one of
said first die and said second die constitutes a chosen die, each
said chosen die having a monitor receiving portion and a process
severity monitor associated therewith, said monitor receiving
portion including a monitor cavity, said process severity monitor
being mounted in said monitor cavity, said process severity monitor
being configured for monitoring a process severity condition of one
said chosen die.
15. The machine press of claim 14, wherein said monitor receiving
portion is one of an integral portion of said one said chosen die
and a separate plate attached to said one said chosen die.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the invention.
[0002] The present invention relates to vibration severity
monitoring technology for press dies and specifically to the
mounting of such a monitor relative to a die so as to remain with
that die throughout its lifetime.
[0003] 2. Description of the related art.
[0004] Vibration severity technology has been developed by The
Minster Machine Company to provide analysis of any die within any
press of a production facility (VibMan.TM.), as described in U.S.
Pat. No. 6,209,400; and analysis of all dies within a specific
press (VibCoach.TM.), as described in U.S. Pat. Applicant No.
09/487,688, filed Jan. 19, 2000.
[0005] However, a methodology has not been previously developed
which analyzes the performance of a specific die, regardless of the
press with which it is operating, during the life of a die.
Essentially, none of the previous severity monitoring systems
developed by Minster or by others is configured for remaining with
a particular die throughout its lifetime.
[0006] What is needed in the art is a methodology, when licensed to
a die manufacturer, that allows for the vibration severity
technology to travel with a particular die and that provides the
ability to certify the reliable performance of the die with any
press, so that safe and reliable operation of both a particular
press and a particular die can be assured.
SUMMARY OF THE INVENTION
[0007] The present invention (known as VibDie Technology) includes
a sensor means or device for monitoring vibration or another
operational/process severity condition with the sensor being
mounted in a cavity of a sensor receiver portion associated with a
given die, thereby allowing the sensor means to remain with the
particular die throughout its lifetime.
[0008] The present invention, in one form thereof, relates to a die
system for use in a machine press. The die system includes a die
element, a vibration severity monitor, and a monitor receiving
portion. The vibration severity monitor is configured for
monitoring a vibration severity condition of the die element. The
monitor receiving portion is associated with the die element and
includes a monitor cavity. This monitor cavity is configured for an
operable mounting of the vibration severity monitor
therewithin.
[0009] The present invention, in another form, relates to a machine
press. The machine press includes a first die and a second die
operatively coupled with the first die. At least one of the first
die and the second die constitutes a chosen die. Each chosen die
has a monitor receiving portion and a process severity monitor
associated therewith. The monitor receiving portion includes a
monitor cavity, the process severity monitor being mounted in the
monitor cavity. The process severity monitor is configured for
monitoring a process severity condition of one of the chosen die
members.
[0010] One advantage of the present invention is that the severity
monitoring circuitry thereof can remain with the same die, even as
the die is moved from press to press. Accordingly, the degree of
reliability of a particular die can continue to be monitored. The
system includes a port available to download historical data such
that the system allows an operator to use historical severity
information to define, record, and transmit wear data from grind
event to grind event on the die.
[0011] Another advantage of the present invention is that the
severity monitoring technology can be coupled with existing
tracking instrumentation (e.g., VibTracker.TM.) to allow capture of
long-term and potential minute-by-minute operating data.
[0012] Yet a further advantage of the present invention is that it
would facilitate real-time/online (via a wireless transmitter)
and/or historically-captured (via tracking instrumentation) data to
be sent to others (e.g., die manufacturer, press manufacturer,
and/or customer), thereby making continuous certification of a
particular die feasible.
[0013] An even another advantage of the present invention is that
the VibDie.TM. technology provides a potential for a documented
history of a die that can be used for warranty purposes.
[0014] An additional advantage of the present invention is that the
technology can be used with new die systems or can be retrofit to
existing ones.
[0015] A further advantage of the present invention is that the
monitoring device can be rather small (potentially an Ascics
Computer-on-a-Chip).
[0016] A yet further advantage of the present invention is that it
is possible to output the data gathered thereby to one or more
sources simultaneously (e.g., VibTracker.TM., VibDoctord.TM., die
certification, and/or press certification branded products
available from The Minster Machine Company of Minster, Ohio).
[0017] A yet additional advantage of the present invention is that
the monitor is durable and could potentially be rated to 100 G to
about 150 G, where G is equal to the force of gravity, with 20 G
being a typical force level associated with a machine press.
[0018] An even further advantage of the present invention is that
online/wireless data access and transmission of data could be used
to alert key personnel when a die is outside its reliability
parameters.
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The above-mentioned and other features and advantages of
this invention, and the manner of attaining them, will become more
apparent and the invention will be better understood by reference
to the following description of at least one embodiment of the
invention taken in conjunction with the accompanying drawings,
wherein:
[0020] FIG. 1 is a schematic, partial cut-away view of a press
machine employing a die system, including a process severity
monitor carried therewithin, of the first embodiment of the present
invention;
[0021] FIG. 2 is a schematic, partial cut-away view of a press
machine employing a die system, including a process severity
monitor carried therewithin, of the second embodiment of the
present invention;
[0022] FIG. 3 is a schematic view of the process severity monitor
of the present invention.
[0023] Corresponding reference characters indicate corresponding
parts throughout the several views. The exemplifications set out
herein illustrate at least one preferred embodiment of the
invention, in one form, and such exemplifications are not to be
construed as limiting the scope of the invention in any manner.
DETAILED DESCRIPTION OF THE INVENTION
[0024] FIGS. 1 and 2 illustrate the first and second embodiments of
the present invention. Mechanical press 10A, as shown in FIG. 1,
includes a die system 12A and a die carrying mechanism 14 (such as
a crown or bolster). Similarly, mechanical press 10B, as shown in
FIG. 2, includes a die system 12B as well as a die carrying
mechanism 14. Each die system 12A, 12B includes a die element 16A,
16B (respectively), a monitor receiving portion 18A, 18B, and a
process severity monitor 20. Where the two embodiments differ is
related to the nature of the monitor receiving portion 18A, 18B. In
the embodiment of FIG. 1, monitor receiving portion 18A is an
integral part of die element 16A. Meanwhile, in the second
embodiment, of FIG. 2, monitor receiving portion 18B is a separate
plate attached to die element 16B.
[0025] Returning to FIG. 1, each die element 16A, 16B has a forming
side 22 and a press mount side 24. Monitor receiving portion 18A,
18B is associated with press mount side 24 of the respective die
element 16A, 16B. In the case of die element 16A, monitor receiving
portion 18A is an integral portion of die element 16A. In the case
of die element 16B, however, monitor receiving portion 18B is a
separate plate that is attached to die element 16B. The ability to
provide a monitor receiving portion 18B that is separate from die
16B is important in that it makes retrofitting of previously
manufactured dies capable of being equipped with the process
severity monitoring technology of the present invention.
[0026] Within a given monitoring receiving portion 18A, 18B is a
monitor cavity 26 configured for the mounting of a process severity
monitor 20 therewithin. Process severity monitor 20 is
advantageously attached within monitor cavity 26 of monitor
receiving portion 18A, 18B by a shock mounting process including
shock mounting of the circuitry, but with the sensor hard mounted.
Yet, it is understood that any various means of attachment
including, e.g., adhesive, soldering, ultrasonic welding, or
mechanical fastening may be employed.
[0027] Process severity monitor 20 functions similar to the
VibCoach.TM. branded technology as set forth in U.S. patent
application No. 09/487,688 herby incorporated by reference. Yet, in
addition to providing for monitoring of vibration severity, it is
within the scope of the present invention that the process severity
monitor 20 could be extended to monitor other process variables as
well, such as tipping moment and/or force, as per U.S. Pat. Nos.
6,466,840; and 6,467,356 (both assigned to The Minster Machine
Company and hereby incorporated by reference thereto). The contents
of U.S. Pat. No. 6,209,400 and U.S. patent application No.
09/487,688 are hereby incorporated by reference thereto.
Additionally, other Minster patents which address vibration
severity monitoring technology include U.S. Pat. Nos. 5,094,107;
6,114,965; and 6,466,840, each of which are incorporated by
reference thereto.
[0028] Setting apart the severity monitor of the present invention
from the severity monitor systems of previous systems is the
placement of the severity monitor 20 in such a manner so as to be
able to be mounted within a particular die element 16A, 16B and be
able to remain with that particular element 16A, 16B throughout the
lifetime thereof. Another feature which sets apart severity monitor
20 is the reduction of the size achieved therewith (potentially to
a computer on a chip). With such a reduction in size, the mounting
of such a severity monitor 20 in a monitor receiving portion 18A,
18B is greatly facilitated, requiring only that a rather small
monitor cavity 26 be created in a given monitor receiving portion
18A, 18B. By being able to minimize the size of monitor cavity 26,
the effect of such a monitor cavity 26 on the operation of a
particular die element 16A, 16B should be minimized.
[0029] A schematic view of severity monitor 20 is presented in FIG.
3. Process severity monitor 20 includes a microprocessor 28, a
memory 30, at least one sensor 32, at least one data input
mechanism 34, a display 36 or at least a means to create an output
to a display, a power source connection 38, and a data output link
40. Types of data which may be input through data input mechanism
34 are the press number, press information/data, and/or time, for
example. Such data may in turn be stored in memory 30, which
advantageously has a capacity of preferably at least about eight
megabytes to accommodate the amount of data being collected over
the life of a given die. While the use of an accelerometer
(advantageously having a rating of 10 volts) as the sensor 32 has
been found to be highly effective in determining vibration
severity, it is understood that other sensors may be used instead
of or in addition to an accelerometer, such sensors including but
not limited to, velocity sensors, displacement sensors and/or load
cells. The use of such other types of sensors 32 may prove
especially useful in calculating process severity parameters other
than vibration severity. The sensors 32 incorporated with process
severity monitor 20 may range from standard size to a computer on a
chip. However, major space savings may be afforded primarily with
the downsizing of other components associated with process severity
monitor 20.
[0030] Various elements may be used to fulfill the roles of parts
34-40 of process severity monitor 20. A keyboard, touch screen,
keypad, a mouse, and/or other data entry mechanism may be used for
data input device 34. Display 36 may be any one or more of a
printer, screen, and/or other audio and/or visual indicator, as
needed. Power source connection 38 may incorporate a battery and/or
an electrical outlet, as convenient. Further, data link output 40
may be in the form of a modem, wireless transceiver, a data port,
or other data linkage.
[0031] Data can be output via output link 40 to any one or more of
a variety of data management mechanisms. Such mechanisms, as
illustrated, can include historical tracking instrumentation (e.g,.
VibTracker.TM.), a direct-line analysis means (e.g., VibDoctor.TM.
or VibAnalysis.TM.) and/or an online Internet analysis means.
Historical tracking instrumentation 42 can provide long-term,
potentially minute-by-minute performance data for the operation of
the die. Such accumulated data can then be forwarded, for example,
to die certification software 48 and/or to press certification
software 50 for warranty purposes and, of course, for certifying
the reliable or non-reliable vibration severity operation of a
particular die, regardless of the press that the die has been used
with over its history.
[0032] In addition to being able to supply historical data tracking
through tracking instrumentation 42, current/real-time data can be
supplied through a given analysis means 44 and/or 46. Analysis
means 44 is configured as a local data link, while online analysis
means 46 permits transmission of the data to a remote site. This
data can be transferred to the die manufacturer for die
certification records, the press manufacturer for press
certification records, the customer for production certification
records, and/or operating personnel. It is useful to have the
ability to relay real-time vibration severity data to the operating
personnel so that they can be alerted when a die is operating
outside its vibration severity reliability parameters (e.g., via
MinStar.TM.). The data output produced by analysis means 44 and/or
46 is schematically illustrated as analysis output 52.
[0033] While this invention has been described as having a
preferred design, the present invention can be further modified
within the spirit and scope of this disclosure. This application is
therefore intended to cover any variations, uses, or adaptations of
the invention using its general principles. Further, this
application is intended to cover such departures from the present
disclosure as come within known or customary practice in the art to
which this invention pertains and which fall within the limits of
the appended claims.
* * * * *