U.S. patent application number 11/140221 was filed with the patent office on 2006-01-05 for cleaning system, device and method.
This patent application is currently assigned to International Test Solutions, Inc.. Invention is credited to Billie Joyce Freeze, Alan E. Humphrey.
Application Number | 20060001438 11/140221 |
Document ID | / |
Family ID | 26844015 |
Filed Date | 2006-01-05 |
United States Patent
Application |
20060001438 |
Kind Code |
A1 |
Humphrey; Alan E. ; et
al. |
January 5, 2006 |
Cleaning system, device and method
Abstract
The cleaning device may clean probe elements. The probe elements
may be the probe elements of a probe card testing apparatus for
testing semiconductor wafers or semiconductor dies on a
semiconductor wafer or the probe elements of a handling/testing
apparatus for testing the leads of a packaged integrated circuit.
During the cleaning of the probe elements, the probe card or the
handler/tester is cleaned during the normal operation of the
testing machine without removing the probe card from the prober.
The cleaning device may be placed within the prober or
tester/handler similar to a wafer containing semiconductor dies to
be tested so that the probe elements of the testing machine contact
the cleaning medium periodically to remove debris and/or reshape
the tips of the probe elements. The cleaning device may include a
substrate, that may be shaped and sized like a typical
semiconductor wafer that typically fits into the testing machine,
and a pad attached to the upper surface of the substrate that
cleans and/or reshapes the probe element tips without removing the
testing head with the probe elements from the testing machine. The
cleaning medium may chemically clean the probe elements and trap
the environmentally hazardous material within and on the pad.
Inventors: |
Humphrey; Alan E.;
(Livermore, CA) ; Freeze; Billie Joyce;
(Livermore, CA) |
Correspondence
Address: |
DLA PIPER RUDNICK GRAY CARY US, LLP
2000 UNIVERSITY AVENUE
E. PALO ALTO
CA
94303-2248
US
|
Assignee: |
International Test Solutions,
Inc.
|
Family ID: |
26844015 |
Appl. No.: |
11/140221 |
Filed: |
May 27, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10427661 |
May 1, 2003 |
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11140221 |
May 27, 2005 |
|
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|
09624750 |
Jul 24, 2000 |
6777966 |
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10427661 |
May 1, 2003 |
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60146526 |
Jul 30, 1999 |
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Current U.S.
Class: |
324/758.04 ;
324/754.03; 324/762.05 |
Current CPC
Class: |
G01R 3/00 20130101; B08B
7/0028 20130101; B08B 2220/01 20130101; B08B 1/00 20130101 |
Class at
Publication: |
324/754 |
International
Class: |
G01R 31/02 20060101
G01R031/02 |
Claims
1. A cleaning device for cleaning the probe elements in a
semiconductor testing apparatus, the cleaning device comprising: a
substrate having a configuration to be introduced into the testing
apparatus during the normal testing operating of the testing
apparatus; and a pad, secured to the substrate, the pad having
predetermined characteristics that cause the pad to clean debris
from the probe elements when the probe elements contact the pad so
that the probe elements are cleaned, without modification or
damage, during the normal operation of the testing machine.
2. The cleaning device of claim 1, wherein the substrate comprises
a semiconductor wafer.
3. The cleaning device of claim 2, wherein the predetermined
characteristics comprise one or more of durometer, tack and
elasticity.
4. The cleaning device of claim 1, wherein the pad comprises an
elastomeric material that traps and removes the debris from the
probe elements within and on the surface of the pad.
5. The cleaning device of claim 4, wherein the elastomeric material
comprises one or more of rubbers, synthetic polymers and natural
polymers.
6. The cleaning device of claim 5, wherein the pad further
comprises an abrasive material that maintains the shape of or
shapes the tips of the probe elements when the probe elements are
driven into and removed from the elastomeric network.
7. The cleaning device of claim 1, wherein the pad comprises a
tacky material so that the debris adheres to the pad when the probe
elements contact the pad.
8. The cleaning device of claim 1, wherein the pad comprises one or
more layers of chemical cleaning agents, which may oxidize and/or
reduce contaminates when the probe elements are inserted into the
pad.
9. The cleaning device of claim 8, wherein one or more layers
comprise a first layer of gelled acid and a second layer of gelled
oxidizing agent.
10. The cleaning device of claim 9, wherein the gelled acid
comprises acetic acid and the gelled oxidizing agent comprises
peroxide.
11. The cleaning device of claim 1, wherein the pad traps hazardous
material, such as lead, on and within the pad when the probe
elements are inserted into the pad so that the hazardous materials
are not released into the environment.
12. A cleaning device for cleaning the probe elements in a
semiconductor testing apparatus, the cleaning device comprising: a
substrate having a configuration to be introduced into the testing
apparatus during the normal testing operation of the testing
apparatus; and a cleaning pad having one or more layers of
chemicals that clean the probe elements and one or more sealing
layers that confine the chemical layers and keeps debris removed
from the probe elements in the cleaning pad so that the probe
elements are cleaned during the normal operations of the testing
machine.
13. The cleaning device of claim 12, wherein the one or more layers
comprise a first layer of gelled acid and a second layer of gelled
oxidizing agent.
14. The cleaning device of claim 13, wherein the gelled acid
comprises acetic acid and the gelled oxidizing agent comprises
peroxide.
15. A method for cleaning the probe elements of a testing machine,
the method comprising: loading a cleaning device into the prober,
the cleaning device having the same configuration as the wafers
with the semiconductor dies normally tested by the testing
apparatus, the cleaning device having a top surface with
predetermined properties that clean the probe elements; and
contacting the probe elements with the cleaning device during the
normal testing operation of the prober so that any debris is
removed from the probe elements during the normal operation of the
testing machine.
16. The method of claim 15, wherein the loading further comprises
periodically loading a cleaning cassette containing one or more
cleaning devices into the testing machine when the probe elements
are being cleaned.
17. The method of claim 15, wherein the loading further comprises
loading one or more cleaning devices into one or more cassettes
along with semiconductor wafers having dies being tested by the
prober so that the cleaning devices are contacted during the
testing process of the die.
18. The method of claim 17, wherein the probe card remains in a
cleaned state for a longer period of time increases yield
performance increases the amount of revenue for the
manufacturer.
19. The method of claim 18, wherein the probe card cleaning device
is able to prolong the life of the probe card reduced the number of
probe cards the manufacturer is required to purchase in order to
have spares.
20. The method of claim 19, wherein less abrasive cleaning is
required to be done to the probe card the extended life of the
probe card is two to three times longer reducing the amount of
probe cards needed to be purchased, increasing savings to the
manufacturer.
21. The method of claim 20, wherein the cleaning material
properties, such as density and abrasiveness can be selected for
any given probe element material or shape to remove embedded or
bonded debris without significant damage to the probe element
reducing the amount of probe cards needed to be purchased,
increasing savings to the manufacturer.
22. A cleaning device for cleaning probe elements comprising: a
substrate having a predetermined configuration appropriate for the
particular probe elements; and a pad, secured to the substrate, the
pad having predetermined characteristics that cause the pad to
clean debris from the probe elements when the probe elements
contact the pad so that the probe elements are cleaned.
23. The cleaning device of claim 22, wherein the substrate
comprises a semiconductor wafer.
24. The cleaning device of claim 23, wherein the predetermined
characteristics comprise one or more of durometer, tack and
elasticity.
25. The cleaning device of claim 22, wherein the pad comprises an
elastomeric material that traps and removes the debris from the
probe elements within and on the surface of the pad.
26. The cleaning device of claim 25, wherein the elastomeric
material comprises one or more of rubbers, synthetic polymers and
natural polymers.
27. The cleaning device of claim 26, wherein the pad further
comprises an abrasive material that maintains the shape of or
shapes the tips of the probe elements when the probe elements are
driven into and removed from the elastomeric network.
28. The cleaning device of claim 22, wherein the pad comprises a
tacky material so that the debris adheres to the pad when the probe
elements contact the pad.
29. The cleaning device of claim 22, wherein the pad comprises one
or more layers of chemical cleaning agents, which may oxidize
and/or reduce contaminates when the probe elements are inserted
into the pad.
30. The cleaning device of claim 29, wherein one or more layers
comprise a first layer of gelled acid and a second layer of gelled
oxidizing agent.
31. The cleaning device of claim 30, wherein the gelled acid
comprises acetic acid and the gelled oxidizing agent comprises
peroxide.
32. The cleaning device of claim 22, wherein the pad traps
hazardous material, such as lead, on and within the pad when the
probe elements are inserted into the pad so that the hazardous
materials are not released into the environment.
Description
RELATED CASES
[0001] This application claims priority from U.S. Provisional
Patent Application No. 60/146,526 filed Jul. 30, 1999 and the
provisional application is incorporated herein.
BACKGROUND OF THE INVENTION
[0002] This invention relates generally to a medium for cleaning a
manual test interface while it is still in the prober. This manual
interface is generally referred to as a probe card, which is used
in the prober to make an electrical connection between the die on a
silicon wafer and the tester so that the functionality of the die
may be evaluated.
[0003] Currently, the method for cleaning the probe card is to
remove it from the prober and manually clean the debris from the
probe tips. The probe tips need to be cleaned to remove debris from
them since the debris reduces the quality of the electrical circuit
completed by the contact of the probe tips to any surfaces on a
die. The completed electrical circuit is used to evaluate the
electrical characteristics of the die by the test apparatus. The
degradation of the quality of the electrical circuit caused by the
probe tip debris may be interpreted by the test apparatus as a
failure of the die under test even though the die is functioning
correctly. This false failure of the die results in the rejection
or the rework of good die thereby increasing the cost of the final
products sold. In the industry, it has been seen that a 1% change
in yield from an individual prober can equate to more than
$1,000,000 per annum. Therefore, with thousands of probers
operating worldwide, the impact to the industry from maintaining
clean probes during testing can be very substantial.
[0004] Individual semiconductor (integrated circuit) devices are
typically produced by creating multiple devices on a silicon wafer
using well known semiconductor processing techniques including
photolithography, deposition, and sputtering. Generally, these
processes are intended to create multiple, fully functional
integrated circuit devices prior to separating (singulating) the
individual devices (dies) from the semiconductor wafer. However, in
practice, physical defects in the wafer material and defects in the
manufacturing processes invariably cause some of the individual
devices to be non-functional, some of which may be repairable. It
is desirable to identify the defective devices prior to separating
or cutting the dies on the wafer. In particular, some product is
actually repairable when the flaws are caught at the wafer lever.
Other product may not be repairable but may be used in a downgraded
application from the original product. This determination of the
product's capabilities (a product definition provided by electrical
probe testing) at the wafer level saves the manufacturer
considerable cost later in the manufacturing process. In addition,
product cost may be reduced if defective devices are
identified.
[0005] To enable the manufacturer to achieve this testing
capability a probe card, prober and tester are employed to make
temporary electrical connections to the bonding pads, solder or
gold bumps or any surface on the chip where connection can be made
by making manual contact to that surface. The surface may be on the
individual circuit device or on multiple circuit devices when the
devices are still part of a wafer. Once the connections between the
tester and the circuit device are made, power and electrical
signals are transferred from the tester to the device for testing,
to determine its functionality and to identify its acceptance or
rejection for further processing. Typically, the temporary
connections to the device bonding elements are made by contacting
multiple electrically conductive probes (needle like structures)
against the electrically conductive bonding elements of the device.
By exerting controlled pressure (downwards force on the bonding
pads) of the probe tips against the bonding pads, a satisfactory
electrical connection is achieved allowing the power, ground and
test signals to be transmitted.
[0006] The tester and prober need a manual interface to the bonding
elements on the die to achieve contact. A probe card having a
plurality of probes is used to make the connection with the bonding
pads of the semiconductor die. The probes may be cantilever beams
or needles or vertical beams. Typically, each probe is an
inherently resilient spring device acting as a cantilever beam, or
as an axially loaded column. A variation is to mount multiple
probes in a spring-loaded support. In a conventional prober, the
probe card, and its multiple probes, are held in precise mechanical
alignment with the bonding elements of the device under test (or
multiple devices, or wafer as the case may be) and the device is
vertically translated into contact with the tips of the probes. In
the typical prober, the tips of the probes may perform a scrubbing
action in which the tip of the probes moves horizontally as it
contacts the bonding pad in order to scrub away oxide, or any other
material on the pad, that may inhibit the electrical contact
between the probes and the bonding pads. Although the scrubbing
action improves the electrical contact between the probe tip and
the bonding pad, it unfortunately also generates some debris (the
scraped up oxide or other debris) that may also prevent the probe
tip from making a good electrical contact with the bonding pad.
Alternatively, the probe tip may press vertically into the bonding
pad, solder or gold bump with sufficient force to penetrate any
surface material and establish good electrical contact. The probe
tip may become contaminated with contaminates such as aluminum,
copper, lead, tin or gold.
[0007] Typically, the debris generated by probing needs to be
periodically removed from the probe elements to prevent a build-up
which causes increased contact resistance, continuity failures and
false test indications, which in turn results in artificially lower
yields and subsequent increased product costs. Typically, the
entire probe card with the plurality of probes must be removed from
the prober and cleaned or abrasively cleaned in the prober. In a
typical prober, the probe card is cleaned as often as several times
an hour.
[0008] The process of cleaning in the prober using an abrasive pad
burnishes the tips but it does not remove the debris. The
burnishing actually causes wear to the probe card by shortening the
probe tips. In addition, since it does not remove the debris, and
since the debris exhibits a slight electrical charge, it attracts
more debris so the probe card will require cleaning more often than
the original clean card. Currently the debris from burnishing can
be removed manually by means of alcohol and a cotton tip swab or an
air gun. Each method cleans the probes but requires stopping the
prober and a person to perform the function.
[0009] Other contaminates, such as lead and tin, may be removed by
abrasive cleaning/burnishing or cleaning the probes with a solution
that may typically be an acid for example. When probe cards which
have collected lead and tin are burnished, particulates of lead are
released into the air that cause environmental hazards. In
addition, the acid solution requires a separate, rather expensive
machine that sprays the solution onto the tips in a closed chamber.
These typical cleaning processes are expensive since the tester
will have down time and a replacement card must be purchased to run
while the other probe card is being cleaned. In addition the
equipment and manual labor adds additional costs to the task
performed.
[0010] It is desirable to provide a probe card cleaning device and
method which overcomes the above limitations and drawbacks of the
conventional cleaning devices and methods so that the probe cards
may be cleaned more rapidly and effectively while in the prober and
it is to this end that the present invention is directed. The
cleaning device and method may also be used with other devices.
SUMMARY OF THE INVENTION
[0011] In accordance with the invention, a cleaning medium is
provided that will clean the probes of a probe card without
removing the probe card from the prober. In particular, the
cleaning medium may be placed within the prober similar to a wafer
being tested so that the probes of the probe card contact the
cleaning medium periodically to remove debris and/or contaminates
from the probes. In a preferred embodiment, the cleaning medium may
include a substrate that may be shaped like a typical semiconductor
wafer that typically fits into the prober. The substrate may also
be a ceramic plate or any type of substrate, which can fit over or
replace the abrasive plate in the prober. The pad may have
predetermined mechanical and/or chemical characteristics, such as
abrasiveness, density, elasticity, tackiness, planarity, and/or
chemical properties, such as being acetic or basic, so that when
the probe tips contact the pad surface, the tips of the probes are
cleaned and the debris and contaminates are removed from the tips.
In another embodiment, the pad may be made of a material so that
the probe tips may penetrate into or through the pad, which cleans
the debris from the tips. In a preferred embodiment, the substrate
may be a semiconductor wafer, ceramic, or any material to which the
cleaning pad will attach. In another embodiment, the physical
properties of the pad, such as density and abrasiveness, may be
predetermined so as to clean the probe element and remove bonded or
embedded debris from the probe elements without causing significant
damage to the probe elements. In another embodiment, the physical
properties of the pad, such as density and abrasiveness, may be
predetermined so as to shape or reshape the probe elements during
probing on or into the medium.
[0012] Thus, in accordance with the invention, a cleaning medium
for cleaning probe elements in a semiconductor testing apparatus is
provided wherein the cleaning medium comprises a substrate having a
configuration to be introduced into the testing apparatus during
normal testing operation, and a pad, secured to the substrate. The
pad has predetermined characteristics, which clean debris from the
probe elements and maintain or modify the shape of the probe
element when the elements contact or penetrate into or through the
pad.
[0013] In accordance with another aspect of the invention, a method
for cleaning the probe elements on a prober or an analyzer is
provided wherein the method comprises loading a cleaning medium
into the prober, the cleaning medium having the same configuration
as the wafers with the semiconductor dies normally tested by the
testing apparatus and the cleaning medium having a top surface with
predetermined properties, such as abrasiveness, tack, hardness,
that clean the probes. The method further comprises contacting the
probe elements with the cleaning medium during the normal testing
operation in the prober so that any debris is removed from the
probe elements during the normal operation of the prober or
analyzer.
[0014] In accordance with another aspect of the invention, a method
for maintaining or modifying the shape of the probe elements on a
prober or an analyzer is provided wherein the method comprises
loading a cleaning medium into the prober or analyzer, the medium
having varying density, tack, abrasiveness or other physical
characteristics which are optimized for various probe elements of
the probe cards.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] FIG. 1 is a side view of an automated testing system that
may include the cleaning device in accordance with the
invention;
[0016] FIG. 2 is a top view of the automated testing system of FIG.
1;
[0017] FIG. 3 is a top view of a cleaning device in accordance with
the invention;
[0018] FIG. 4 is a sectional view taken along line A-A in FIG. 3 of
the cleaning device in accordance with the invention;
[0019] FIG. 5 is a flowchart illustrating a method for cleaning a
probe tip in accordance with the invention;
[0020] FIGS. 6A and 6B are diagrams illustrating another embodiment
of the cleaning device in accordance with the invention; and
[0021] FIG. 7 is a flowchart illustrating a method for
manufacturing the cleaning device shown in FIGS. 6A and 6B.
DETAILED DESCRIPTION OF A PREFERRED EMBODIMENT
[0022] The invention is particularly applicable to a cleaning
medium for cleaning the probes in a prober and it is in this
context that the invention will be described. It will be
appreciated, however, that the device and method in accordance with
the invention has greater utility, such as cleaning other types of
semiconductor processing equipment. The cleaning method can also be
used on an analyzer which is a metrology tool used in the routine
maintenance of probe cards.
[0023] FIGS. 1 and 2 are diagrams illustrating a testing system 10
that may be cleaned using the cleaning medium in accordance with
the invention. In particular, the system 10 may include a tester 11
electrically connected to a prober machine 12 that may actually
apply the probes to the semiconductor wafer or die and test them.
The prober machine 12 may further include a prober 13 and an
interface head 14 as shown in FIG. 1. The prober machine 12 may
also have an abrasion/sanding disk 16, which is typically used to
burnish the probe tips, as shown in FIG. 2. The prober machine 12
may also include a prober chuck 15 that moves the wafers/dies
during the testing process. Instead of the typically removing the
prober 13 in order to clean the probe elements, the cleaning device
in accordance with the invention permits the probe elements to be
cleaned while the prober is operating. In particular, a cleaning
wafer cassette containing the cleaning device in accordance with
the invention may be introduced periodically into the testing
system in accordance with the invention. Alternatively, a cleaning
device in accordance with the invention may be loaded into each
cassette with other wafers being tested so that the probe elements
are cleaned each time a cassette of wafers is tested. Thus the
cleaning medium will clean the probe needles during the normal
testing operation of the prober. Now the cleaning medium in
accordance with the invention will be described in more detail.
[0024] FIGS. 3 and 4 are diagrams illustrating a cleaning device 20
in accordance with the invention. As shown in FIG. 4, the cleaning
device 20 may include a substrate 22 and a pad 24 secured or
adhered to a surface 25 of the substrate. The substrate may be any
material that can support the pad and has sufficient strength to
resist breaking when the probes come into contact with the pad and
generate a contact force. Thus, the substrate may be plastic,
metal, glass, silicon, ceramic or any other similar material. In a
preferred embodiment, the substrate 22 may be a semiconductor
wafer. The wafer surface 25 onto which the pad is secured or
adhered may have a flat mirror finish or a slightly abrasive
roughness finish with microroughness of about 1-3 .mu.m. The
abrasive finish may burnish/abrade the probe tips during the
cleaning process.
[0025] The pad 24 may be made of a material with predetermined
properties that contribute to the cleaning of the probe elements
tips that contact the pad. For example, the pad may have abrasive,
density, elasticity, and/or tacky properties that contribute to
cleaning the probe tips. The abrasiveness of the pad will loosen
debris from the scrubbing action and remove unwanted material from
the tips. Using a more dense material, the abrasiveness of the pad
may round or sharpen the probe tips. Typical abrasives that may be
used include aluminum oxide, silicon carbide, and diamond although
the abrasive material may also be other well known abrasive
materials. The tackiness of the pad may cause any debris on the
probe tip to preferentially stick to the pad and therefore be
removed from the probe tip. In a preferred embodiment, the pad may
be made of an elastomeric material that may include rubbers and
both synthetic and natural polymers. The elastomeric material may
be a material manufactured with a slight tackiness or some abrasive
added to the body of the material. The material may have a
predetermined elasticity, density and surface tension parameters
that allow the probe tips to penetrate the elastomeric material and
remove the debris on the probe tips without damage to the probe
tip, while retaining the integrity of the elastomeric matrix. In
the preferred embodiment, the elastomeric material may be Gel-Pak
LLC "GEL" membrane with a thickness of the elastomeric material
being generally between 1 and 20 mils thick. The thickness of the
pad may be varied according the specific configuration of the probe
tip.
[0026] As the one or more probe elements of the prober contact the
pad during the normal operation of the prober machine, they exert a
vertical contact force to drive the probe element into the pad
where the debris on the probe elements will be removed and retained
by the pad material. The amount and size of the abrasive material
added to the elastomer may vary according the configuration and
material of the probe elements to achieve a pad, which will remove
the debris but will not damage the probe elements. The pad material
and abrasiveness may vary in the manufacturing of a pad used to
reshape or sharpen the probe element tips. The same cleaning and
reshaping may also be accomplished by the substrate alone. Now, a
method for cleaning a plurality of probe elements in accordance
with the invention will be described.
[0027] FIG. 5 is a flowchart illustrating a method 30 for cleaning
a plurality of probes in accordance with the invention. The method
accomplishes the goal of removing the debris from the probe tips
without removing the probe card from the prober, which increases
the productivity of the tester. In step 31, the cleaning device,
that may have the same size and shape as typical wafers containing
the dies being tested by the tester, may be inserted into a wafer
cleaning tray. In accordance with the invention, the cleaning
medium may be located in the wafer cleaning tray or one or more
cleaning pads may be inserted into one or more cassettes that also
contain wafers with semiconductor devices to be tested so that, as
each cassette is run through the tester, the cleaning device in the
cassette cleans the probe elements. In step 32, the tester is
operated and tests the semiconductor dies on the wafers. In step
33, the prober identifies a predetermined number of failures in the
dies being tested which indicates that the prober element's may be
dirty. In step 34, the cleaning device in accordance with the
invention (a wafer) is loaded and aligned with the chuck. In step
35, the probe elements in the tester contact the cleaning device so
that the debris is removed from the probe elements or the tips of
the probes may be reshaped. As described above, this cleaning step
may occur either when the cleaning device is periodically installed
from the wafer cleaning tray into the prober or every time from the
wafer cassette, or anytime the prober cleans the probe card on the
burnishing plate. In step 36, the cleaning is completed and the
prober returns to testing the die and wafers. In step 37, the
cleaning wafer is returned to the cleaning tray so that the prober
machine can continue to test dies. In accordance with the
invention, the cleaning device does not interrupt, in any way, the
operation of the prober since the cleaning of the probes is
accomplished during the normal operation of the testing machine. In
this manner, the cleaning device is inexpensive and permits the
probe to be cleaned and/or shaped without removing the probe card
from the prober. Now, another embodiment of the cleaning device in
accordance with the invention will be described.
[0028] FIGS. 6A and 6B are diagram illustrating a second embodiment
of a cleaning device 40 in accordance with the invention. In more
detail, the cleaning device 40 may include one or more different
layers of material which may clean or sharpen the probe elements as
will now be described. Thus, in accordance with this embodiment of
the invention, the cleaning pad may be placed on a substrate for
use on the abrasive plate in the prober, the prober chuck, analyzer
or any other machine. As shown in FIG. 6A, the cleaning device 40
may include a frame 42 that encloses one or more layers of chemical
cells 44. The layers in the cleaning device may be made of a
material which exhibits acetic or basic chemical properties which
may be used to oxidize and/or reduce contaminates on the probe
tips. The layers may also be made of materials that induce chemical
reactions and/or mechanical actions that remove such contaminates.
The removal of the contaminates, such as heavy metals, that may be
environmentally hazardous will be trapped on or in the pad so that
they will not be dispersed into the air. This embodiment will now
be described in more detail with reference to FIG. 6B.
[0029] FIG. 6B is a diagram illustrating a second embodiment of a
cleaning device 40 in accordance with the invention with a probe
needle 52 inserted into the layers of the cleaning device in order
to clean the probe needle. In more detail, the cleaning device may
have a shape of a typical wafer so that it may be used in-line and
may further include one or more different layers of material. In
particular, the cleaning device 40 may include a substrate 54
having a wall wherein the wall may be constructed of several pieces
made of chemically resistant material. The walls may include a
bottom portion 56, a middle portion 58 and an upper portion 60
stacked on top of each other with a layer of elastomeric material
61 in between the portions of the wall. The walls of the substrate
form a well region into which one or more different layers of
chemicals may be placed and these chemicals may etch away materials
struck onto the probe needles. A first bottom well 64 of the
substrate may be filled with an acid matrix such as acetic acid, as
described with reference to FIG. 7 and sealed into the well by a
layer 61 of elastomeric material. The chemical matrix may consist
of chemicals in any form, solid, liquid, gas, or encapsulated,
emulsified, saturated, gelled, or the like, provided the amount of
chemical induces the desired reaction. Once the seal is in place,
the middle portion of the wall 58 may be positioned and secured to
the seal by an adhesive, mechanical, thermal, or like methods to
form a second well 66. In the second well 66, a peroxide mixture
that gels is placed into the well as described in more detail with
reference to FIG. 7, and sealed by a sealing layer 61. Finally, the
upper portion 60 is secured to the top seal layer to form the
cleaning device in accordance with the invention.
[0030] During the cleaning operation, the probe needle 52 may
penetrate through the two seal layers 61 and thus extend into the
acid and peroxide matrix layers in the wells. The acid and peroxide
may react with the contaminates on the probe needle to remove heavy
metals and the like. In particular, the acid and peroxide matrix
may remove the contaminates from the probe needle and the
contaminants may be trapped in the cleaning device by the sealing
layers 61. Now, a method for manufacturing the cleaning device
shown in FIGS. 6A and 6B will be described.
[0031] FIG. 7 is a flowchart illustrating a method 70 for
manufacturing the cleaning device 40 shown in FIGS. 6A and 6B. In
particular, in step 72, a substrate with a well region is provided.
The substrate is typically made of a chemical resistant material
such as certain types of plastic. In step 74, the lower cell of the
substrate is filled with the appropriate chemicals and sealed using
the elastomeric material. In step 76, the upper cell of the
substrate is filled with the appropriate chemicals and sealed using
the elastomeric material. Thus, a two layer cleaning device in
accordance with the invention is formed. In accordance with the
invention, however, the cleaning device may have any number of
different layers of chemicals wherein each different layer may
serve a particular function such as removing a different
contaminant from the probe element. The above embodiment is
typically used for a system that tests the wafers or one or more
dies on a semiconductor wafer prior to being encapsulated into a
package. Now, another embodiment of the cleaning device will be
described wherein the cleaning device may be used for cleaning the
probe elements of a handler or a tester that may be used to
electrically test the leads of a packaged integrated circuit.
[0032] In accordance with another embodiment of the invention, the
cleaning device described above may also be used in connection with
an handling/testing apparatus that is used to handling and testing
integrated circuits (IC) wherein an individual semiconductor die
from the wafer described above has been encapsulated into a
material, such as plastic. The IC package may have one or more
electrical leads extending out from the package that communicate
electrical signals, such as a power signal, a ground signal, etc.,
with the die inside of the package. The testing/handling apparatus
may have a plurality of probe elements (similar to the probe card
tester described above) that contact the leads of the package and
test the electrical characteristics of the packaged IC in a typical
manner. Similar to the probe card cleaner embodiment, the cleaning
device may be, in a preferred embodiment, a semiconductor shaped
substrate with a pad material wherein the probe elements of the
handler/tester may contact the pad periodically to remove debris
from the tips of the probe elements as described above. The various
different materials used for the cleaning device including the
multi-layer embodiment may be used with the tester/handler. The
size of the cleaning device may be modified slightly to fit the
size and shape of the particular tester/handler.
[0033] While the foregoing has been with reference to a particular
embodiment of the invention, it will be appreciated by those
skilled in the art that changes in this embodiment may be made
without departing from the principles and spirit of the invention,
the scope of which is defined by the appended claims.
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