U.S. patent application number 10/950330 was filed with the patent office on 2005-12-08 for counter flow micro heat exchanger for optimal performance.
This patent application is currently assigned to Cooligy, Inc.. Invention is credited to Munch, Mark, Upadhya, Girish.
Application Number | 20050269691 10/950330 |
Document ID | / |
Family ID | 35446781 |
Filed Date | 2005-12-08 |
United States Patent
Application |
20050269691 |
Kind Code |
A1 |
Munch, Mark ; et
al. |
December 8, 2005 |
Counter flow micro heat exchanger for optimal performance
Abstract
A micro heat exchanger and an integrated circuit are oriented
according to a counter flow orientation. To determine this
orientation, a temperature gradient of the integrated circuit is
determined. The temperature gradient is used to determine a
temperature vector that preferably indicates a directional
orientation from a hot portion of the integrated circuit to a cold
portion. The micro heat exchanger circulates a cooling fluid to
receive heat transferred from the integrated circuit. A directional
flow of this cooling liquid is determined. The directional flow is
measured as a directional vector from an inlet of the micro heat
exchanger to an outlet. The counter flow orientation is defined as
the temperature vector oriented opposite that of the directional
flow.
Inventors: |
Munch, Mark; (Los Altos,
CA) ; Upadhya, Girish; (Mountain View, CA) |
Correspondence
Address: |
HAVERSTOCK & OWENS LLP
162 NORTH WOLFE ROAD
SUNNYVALE
CA
94086
US
|
Assignee: |
Cooligy, Inc.
|
Family ID: |
35446781 |
Appl. No.: |
10/950330 |
Filed: |
September 23, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60577262 |
Jun 4, 2004 |
|
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|
Current U.S.
Class: |
257/714 ;
257/E23.098 |
Current CPC
Class: |
H01L 23/473 20130101;
H01L 2924/00 20130101; H01L 2924/0002 20130101; H01L 2924/0002
20130101 |
Class at
Publication: |
257/714 |
International
Class: |
F28F 003/00 |
Claims
What is claimed is:
1. A method of cooling an integrated circuit using a micro heat
exchanger, the method comprising: a. determining a temperature
gradient associated with the integrated circuit; b. determining a
first vector beginning at a hot portion of the temperature gradient
and ending at a cold portion of the temperature gradient; c.
determining a directional flow of a fluid within the micro heat
exchanger; d. orienting the micro heat exchanger to the integrated
circuit such that the first vector of the integrated circuit is
aligned counter with the directional flow of the micro heat
exchanger, thereby forming a counter flow alignment; and e.
coupling the micro heat exchanger to the integrated circuit
according to the counter flow alignment.
2. The method of claim 1 wherein the directional flow corresponds
to the flow of the fluid from an input port of the micro heat
exchanger to an output port of the micro heat exchanger.
3. The method of claim 2 wherein the directional flow corresponds
to a second vector beginning at the input port and ending at the
output port of the micro heat exchanger.
4. The method of claim 2 wherein an input temperature of the fluid
at the input port is less than an output temperature of the fluid
at the output port.
5. The method of claim 4 wherein the input port is positioned at
the cold portion of the integrated circuit, and the output port is
positioned at the hot portion of the integrated circuit
6. The method of claim 1 wherein an actual flow direction of the
fluid at a given point in the micro heat exchanger is different
than the directional flow.
7. The method of claim 1 wherein the hot portion corresponds to a
highest temperature on the temperature gradient.
8. The method of claim 1 wherein the cold portion corresponds to a
coldest temperature on the temperature gradient.
9. A method of cooling an integrated circuit using a micro heat
exchanger, the method comprising: a. determining a temperature
gradient from hot to cold across the integrated circuit; b.
determining a first vector beginning at a hot portion of the
temperature gradient and ending at a cold portion of the
temperature gradient; c. determining a second vector corresponding
to a directional flow of a fluid from an inlet to an outlet within
the micro heat exchanger; and d. coupling the micro heat exchanger
to the integrated circuit such that the first vector of the
integrated circuit is aligned perpendicular to the second vector of
the micro heat exchanger.
10. The method of claim 10 wherein an input temperature of the
fluid at the inlet is less than an output temperature of the fluid
at the outlet.
11. The method of claim 10 wherein an actual flow direction of the
fluid at a given point in the micro heat exchanger is different
than the second vector.
12. The method of claim 10 wherein the hot portion corresponds to a
highest temperature on the temperature gradient.
13. The method of claim 10 wherein the cold portion corresponds to
a coldest temperature on the temperature gradient.
14. A micro heat exchanger and integrated chip assembly comprising:
a. an integrated chip, wherein the integrated circuit includes an
associated temperature gradient, and a first vector begins at a hot
portion of the temperature gradient and ends at a cold portion of
the temperature gradient; and b. a micro heat exchanger coupled to
the integrated circuit, the micro heat exchanger including an input
port to receive a fluid and an output port for outputting the
fluid, wherein a second vector begins at the input port and ends at
the output port, wherein the micro heat exchanger and the
integrated circuit are oriented such that the first vector of the
integrated circuit is aligned counter with the second vector of the
micro heat exchanger.
15. The assembly of claim 14 wherein the second vector defines a
directional flow of the fluid.
16. The assembly of claim 14 wherein an input temperature of the
fluid at the input port is less than an output temperature of the
fluid at the output port.
17. The assembly of claim 16 wherein the input port is positioned
at the cold portion of the integrated circuit, and the output port
is positioned at the hot portion of the integrated circuit
18. The assembly of claim 14 wherein an actual flow direction of
the fluid at a given point in the micro heat exchanger is different
than the second vector.
19. The assembly of claim 14 wherein the hot portion corresponds to
a highest temperature on the temperature gradient.
20. The assembly of claim 14 wherein the cold portion corresponds
to a coldest temperature on the temperature gradient.
21. A method of cooling an integrated circuit using a micro heat
exchanger, the method comprising: a. determining a temperature
gradient from hot to cold across the integrated circuit; b.
determining a first vector beginning at a hot portion of the
temperature gradient and ending at a cold portion of the
temperature gradient; c. determining a second vector corresponding
to a directional flow of a fluid from an inlet to an outlet within
the micro heat exchanger; and d. coupling the micro heat exchanger
to the integrated circuit such that the first vector of the
integrated circuit is aligned with the second vector of the micro
heat exchanger.
22. The method of claim 21 wherein an input temperature of the
fluid at the inlet is less than an output temperature of the fluid
at the outlet.
23. The method of claim 22 wherein the inlet is positioned at the
hot portion of the integrated circuit, and the outlet is positioned
at the cold portion of the integrated circuit
24. The method of claim 21 wherein an actual flow direction of the
fluid at a given point in the micro heat exchanger is different
than the second vector.
25. The method of claim 21 wherein the hot portion corresponds to a
highest temperature on the temperature gradient.
26. The method of claim 21 wherein the cold portion corresponds to
a coldest temperature on the temperature gradient.
Description
RELATED APPLICATION
[0001] This Patent Application claims priority under 35 U.S.C. 119
(e) of the co-pending U.S. Provisional Patent Application Ser. No.
60/577,262 filed Jun. 4, 2004, and entitled "MULTIPLE COOLING
TECHNIQUES". The Provisional Patent Application, Ser. 60/577,262
filed Jun. 4, 2004, and entitled "MULTIPLE COOLING TECHNIQUES" is
also hereby incorporated by reference.
FIELD OF THE INVENTION
[0002] The invention relates to a method and apparatus for cooling
a heat source. In particular, the invention relates to a micro heat
exchanger using counter flow to optimally cool an integrated
circuit.
BACKGROUND OF THE INVENTION
[0003] As integrated circuits increase in complexity, performance,
and density, the heat produced by these integrated circuits also
increases. Dissipating or otherwise removing this ever increasing
heat is critical to further advancement of integrated circuits.
[0004] A heat exchanger is used to transfer heat from a heat
source, such as an integrated circuit, to another medium, such as a
fluid. Many methods for improving heat transfer from the heat
source to the heat exchanger have been developed. Examples of such
methods include optimizing the shape and/or configuration of
microchannels or fins within a heat exchanger, and improving a
thermal interface between the heat source and the heat exchanger by
using surface materials with similar thermal conductivity. The
performance of a heat exchanger is also dependent on several other
factors such as flow rate of a cooling liquid used within the heat
exchanger, and the manifold configuration used to provide the
cooling liquid to particular areas within the heat exchanger.
[0005] Examples of heat exchanger inventions are described in
co-pending U.S. patent application Ser. No. 10/439,635, filed on
May 16, 2003, and entitled "METHODS FOR FLEXIBLE FLUID DELIVERY AND
HOTSPOT COOLING BY MICROCHANNEL HEATSINKS", co-pending U.S. patent
application Ser. No. 10/439,912, filed on May 16, 2003, and
entitled "INTERWOVEN MANIFOLDS FOR PRESSURE DROP REDUCTION IN
MICROCHANNEL HEAT EXCHANGERS", co-pending U.S. patent application
Ser. No. (Cool 00303), filed on Jun. 29, 2004, and entitled
"INTERWOVEN MANIFOLDS FOR PRESSURE DROP REDUCTION IN MICROCHANNEL
HEAT EXCHANGERS", co-pending U.S. patent application Ser. No. (Cool
00304), filed on Jun. 29, 2004, and entitled "METHODS FOR FLEXIBLE
FLUID DELIVERY AND HOTSPOT COOLING BY MICROCHANNEL HEATSINKS",
co-pending U.S. patent application Ser. No. (Cool 00305), filed on
______, and entitled "APPARATUS FOR EFFICIENT VERTICAL FLUID
DELIVERY FOR COOLING A HEAT PRODUCING DEVICE", co-pending U.S.
patent application Ser. No. 10/680,584, filed on Oct. 6, 2003, and
entitled "METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID
DELIVERY FOR COOLING A HEAT PRODUCING DEVICE", co-pending U.S.
patent application Ser. No. 10/698,179, filed on Oct. 30, 2003, and
entitled "METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID
DELIVERY FOR COOLING A HEAT PRODUCING DEVICE", and co-pending U.S.
patent application Ser. No. (Cool 01303), filed on Jun. 29, 2004,
and entitled "METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID
DELIVERY FOR COOLING A HEAT PRODUCING DEVICE", which are hereby
incorporated by reference.
[0006] As more and more heat is generated by each successive
generation of integrated circuits, there is an ever increasing need
to improve the efficiency of transferring heat away from the heat
source.
SUMMARY OF THE INVENTION
[0007] In one aspect of the present invention, a method cools an
integrated circuit using a micro heat exchanger. The method
includes determining a temperature gradient associated with the
integrated circuit, determining a first vector beginning at a hot
portion of the silicon case temperature profile and ending at a
cold portion of the silicon case temperature profile, determining a
directional flow of a fluid within the micro heat exchanger,
orienting the micro heat exchanger to the integrated circuit such
that the first vector of the integrated circuit is aligned counter
with the directional flow of the micro heat exchanger, thereby
forming a counter flow alignment, and coupling the micro heat
exchanger to the integrated circuit according to the counter flow
alignment. FIG. 3 illustrates an example of such an alignment. The
directional flow can correspond to the flow of the fluid from an
input port of the micro heat exchanger to an output port of the
micro heat exchanger. The directional flow can correspond to a
second vector beginning at the input port and ending at the output
port of the micro heat exchanger. An input temperature of the fluid
at the input port can be less than an output temperature of the
fluid at the output port. The input port can be positioned at the
cold portion of the integrated circuit, and the output port is
positioned at the hot portion of the integrated circuit. An actual
flow direction of the fluid at a given point in the micro heat
exchanger can be different than the directional flow. The hot
portion can correspond to a highest temperature on the temperature
gradient. The cold portion can correspond to a coldest temperature
on the temperature gradient.
[0008] In another aspect of the present invention, a method cools
an integrated circuit using a micro heat exchanger. The method
includes determining a temperature gradient from hot to cold across
the integrated circuit, determining a first vector beginning at a
hot portion of the temperature gradient and ending at a cold
portion of the temperature gradient, determining a second vector
corresponding to a directional flow of a fluid from an inlet to an
outlet within the micro heat exchanger, and coupling the micro heat
exchanger to the integrated circuit such that the first vector of
the integrated circuit is aligned perpendicular to the second
vector of the micro heat exchanger. FIGS. 5 and 6 illustrate
examples of such alignments. An input temperature of the fluid at
the inlet can be less than an output temperature of the fluid at
the outlet. An actual flow direction of the fluid at a given point
in the micro heat exchanger can be different than the second
vector. The hot portion can correspond to a highest temperature on
the temperature gradient. The cold portion can correspond to a
coldest temperature on the temperature gradient.
[0009] In yet another aspect of the present invention, a micro heat
exchanger and integrated chip assembly includes an integrated chip,
wherein the integrated circuit includes an associated temperature
gradient, and a first vector begins at a hot portion of the
temperature gradient and ends at a cold portion of the temperature
gradient, and a micro heat exchanger coupled to the integrated
circuit, the micro heat exchanger including an input port to
receive a fluid and an output port for expelling the fluid, wherein
a second vector begins at the input port and ends at the output
port, wherein the micro heat exchanger and the integrated circuit
are oriented such that the first vector of the integrated circuit
is aligned counter with the second vector of the micro heat
exchanger. The second vector preferably defines a directional flow
of the fluid. The input temperature of the fluid at the input port
can be less than an output temperature of the fluid at the output
port. The input port can be positioned at the cold portion of the
integrated circuit, and the output port is positioned at the hot
portion of the integrated circuit. An actual flow direction of the
fluid at a given point in the micro heat exchanger can be different
than the second vector. The hot portion can correspond to a highest
temperature on the temperature gradient. The cold portion can
correspond to a coldest temperature on the temperature
gradient.
[0010] In still yet another aspect of the present invention, a
method cools an integrated circuit using a micro heat exchanger.
The method includes determining a temperature gradient from hot to
cold across the integrated circuit, determining a first vector
beginning at a hot portion of the temperature gradient and ending
at a cold portion of the temperature gradient, determining a second
vector corresponding to a directional flow of a fluid from an inlet
to an outlet within the micro heat exchanger, and coupling the
micro heat exchanger to the integrated circuit such that the first
vector of the integrated circuit is aligned with the second vector
of the micro heat exchanger. FIG. 4 illustrates an example of such
an alignment. An input temperature of the fluid at the inlet can be
less than an output temperature of the fluid at the outlet. The
inlet can be positioned at the hot portion of the integrated
circuit, and the outlet is positioned at the cold portion of the
integrated circuit. An actual flow direction of the fluid at a
given point in the micro heat exchanger can be different than the
second vector. The hot portion can correspond to a highest
temperature on the temperature gradient. The cold portion can
correspond to a coldest temperature on the temperature
gradient.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 illustrates a side view of an exemplary integrated
circuit coupled to an exemplary micro heat exchanger.
[0012] FIG. 2 illustrates a plan view of an exemplary integrated
chip.
[0013] FIG. 3 illustrates a plan view of an exemplary micro heat
exchanger superimposed over an exemplary integrated circuit, where
the micro heat exchanger and the integrated circuit are configured
according to a preferred counter flow orientation.
[0014] FIG. 4 illustrates a plan view of an exemplary micro heat
exchanger superimposed over an exemplary integrated circuit, where
the micro heat exchanger and the integrated circuit are configured
according to a first alternative orientation.
[0015] FIG. 5 illustrates a plan view of an exemplary micro heat
exchanger superimposed over an exemplary integrated circuit, where
the micro heat exchanger and the integrated circuit are configured
according to a second alternative orientation.
[0016] FIG. 6 illustrates a plan view of an exemplary micro heat
exchanger superimposed over an exemplary integrated circuit, where
the micro heat exchanger and the integrated circuit are configured
according to a third alternative orientation.
DETAILED DESCRIPTION OF THE PRESENT INVENTION
[0017] Embodiments of the present invention are directed to
improving the thermal performance of a micro heat exchanger and/or
a cold plate. Thermal performance is dependent on several factors,
such as flow rate of the cooling fluid through the micro heat
exchanger, dimensions of the thermally conductive elements within
the micro heat exchanger, and the configuration of the manifold
through which the fluid is delivered to the thermally conductive
elements. It is understood that other factors contribute to the
thermal performance of a micro heat exchanger.
[0018] Within the embodiments of the present invention, a micro
heat exchanger is preferably used to remove heat from an integrated
circuit, such as a microprocessor. It is understood that the micro
heat exchanger can be used to remove heat from other types of heat
sources. In the case where the integrated circuit has a non-uniform
heat flux, a temperature gradient of the integrated circuit is
determined. In most such cases, one portion, or side, of the
integrated circuit is hotter than a remaining portion or side of
the integrated circuit. The temperature gradient is a measure of
the varying temperature across the integrated circuit. The
temperature is preferably measured at a top surface of the
integrated circuit, where the top surface is the surface of the
integrated circuit that comes in contact with the micro heat
exchanger. The temperature gradient of the integrated circuit can
be described as either rising from the cold portion of the
integrated circuit to the hot portion, or falling from the hot
portion to the cold portion. It is understood that the terms "hot"
and "cold" are used in a relative sense. That is, the "hot" portion
of the integrated circuit is that portion that is hotter than the
remaining integrated circuit. Similarly, the "cold" portion of the
integrated circuit is that portion that is colder than the
remaining integrated circuit. The "cold" portion can just as easily
be referred to as a "warmer" or "less hot" portion. The relative
use of the term "cold" refers to that portion of the integrated
circuit that is colder than the "hot" portion of the integrated
circuit.
[0019] Once the temperature gradient of the integrated circuit is
determined, a temperature vector is determined. The temperature
vector is a measure of a general heat "flow" across the integrated
circuit. In the preferred embodiment, the temperature vector is
measured as a directional vector that points from the hot portion
of the integrated circuit to the cold portion of the integrated
circuit. It is understood that there can be numerous hot spots
scattered across the integrated circuit. However, in most cases, a
compilation of all temperature variances across the integrated
circuit yields a general temperature vector. That is, when the
temperature gradient is measured across the entire integrated
circuit, in any non-uniform heat flux application, one portion of
the integrated circuit is found to be hotter than another portion
of the integrated circuit. The temperature vector is a directional
vector that preferably points from the hot portion to the cold
portion of the integrated circuit.
[0020] The temperature vector of the integrated circuit is then
used to properly orient the micro heat exchanger on top of the
integrated circuit. To determine the proper orientation, a
directional flow of the fluid through the micro heat exchanger is
determined. In a preferred micro heat exchanger, the cooling fluid
enters the micro heat exchanger at one inlet or a plurality of
inlets. The cooling fluid exits the micro heat exchanger at one
outlet or a plurality of outlets. Although the cooling fluid can
flow in various directions within the micro heat exchanger, the
directional flow is preferably determined as a directional vector
generally pointing from the inlet to the outlet, or as the combined
vector from one or more inlets to one or more outlets.
[0021] In the preferred embodiment of the present invention, when
the micro heat exchanger is coupled to the top of the integrated
circuit, the micro heat exchanger is oriented such that the
directional vector of the fluid flow is opposite that of the
temperature vector of the integrated circuit. In other words, the
inlet of the micro heat exchanger is positioned proximate the cold
portion of the integrated circuit, and the outlet of the micro heat
exchanger is positioned proximate the hot portion of the integrated
circuit. This preferred orientation is referred to as a counter
flow orientation. In the case where the integrated circuit has
non-uniform heat flux, thermal performance of the micro heat
exchanger is improved by designing a counter flow direction for the
liquid flow through the micro heat exchanger. The inlet and the
outlet of the micro heat exchanger are in a direction counter to
the temperature gradient (hot to cold) of heat flux on the
integrated circuit.
[0022] FIG. 1 illustrates a side sectional view of an exemplary
integrated circuit 20 coupled to an exemplary micro heat exchanger
10. The integrated circuit 20 and the micro heat exchanger 10 are
coupled to form a thermal interface there between. A fluid flows
through the micro heat exchanger 10 from an inlet 12 to an outlet
14. A fluid path through the micro heat exchanger 10 generally
includes various changes in direction and/or elevation. An overall
directional flow of the fluid through the micro heat exchanger 10
is defined as the direction, or vector, from the inlet 12 to the
outlet 14. It will be understood that there can be discrete regions
in the heat exchanger that have fluid flow in any direction
including opposite that of the general fluid flow direction. The
micro heat exchanger 10 can be of any conventional type that uses
active liquid cooling. Preferably, the micro heat exchanger 10 is a
micro heat exchanger as described in the co-pending U.S. patent
application Ser. No. 10/439,635, filed on May 16, 2003, and
entitled "METHODS FOR FLEXIBLE FLUID DELIVERY AND HOTSPOT COOLING
BY MICROCHANNEL HEATSINKS", co-pending U.S. patent application Ser.
No. 10/439,912, filed on May 16, 2003, and entitled "INTERWOVEN
MANIFOLDS FOR PRESSURE DROP REDUCTION IN MICROCHANNEL HEAT
EXCHANGERS", co-pending U.S. patent application Ser. No. (Cool
00303), filed on Jun. 29, 2004, and entitled "INTERWOVEN MANIFOLDS
FOR PRESSURE DROP REDUCTION IN MICROCHANNEL HEAT EXCHANGERS",
co-pending U.S. patent application Ser. No. (Cool 00304), filed on
Jun. 29, 2004, and entitled "METHODS FOR FLEXIBLE FLUID DELIVERY
AND HOTSPOT COOLING BY MICROCHANNEL HEATSINKS", co-pending U.S.
patent application Ser. No. (Cool 00305), filed on ______, and
entitled "APPARATUS FOR EFFICIENT VERTICAL FLUID DELIVERY FOR
COOLING A HEAT PRODUCING DEVICE", co-pending U.S. patent
application Ser. No. 10/680,584, filed on Oct. 6, 2003, and
entitled "METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID
DELIVERY FOR COOLING A HEAT PRODUCING DEVICE", co-pending U.S.
patent application Ser. No. 10/698,179, filed on Oct. 30, 2003, and
entitled "METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID
DELIVERY FOR COOLING A HEAT PRODUCING DEVICE", or co-pending U.S.
patent application Ser. No. (Cool 01303), filed on Jun. 29, 2004,
and entitled "METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID
DELIVERY FOR COOLING A HEAT PRODUCING DEVICE", which are hereby
incorporated by reference. As the fluid flows through the micro
heat exchanger 10, heat is transferred from the integrated circuit
20 to the fluid. The heated fluid exits the micro heat exchanger 10
at the outlet 14. The fluid entering at the inlet 12 is preferably
cooler than the fluid exiting at the outlet 14.
[0023] FIG. 2 illustrates a plan view of an exemplary integrated
chip 30. Most integrated circuits include a non-uniform heat flux.
The integrated circuit 30 shown in FIG. 2 includes two hot spots,
hot spot 32 and hot spot 34. In general, the integrated circuit 30
can be characterized as having a hot portion 36, which includes the
hot spots 32 and 34, and a cold portion 38. As described above, the
terms "hot" and "cold" are terms used relative to each other. A
temperature gradient is defined as the change in temperature across
the integrated circuit, in this case integrated circuit 30. A
temperature vector is preferably defined as the vector from the hot
portion 36 of the integrated circuit 30 to the cold portion 38 of
the integrated circuit 30.
[0024] FIG. 3 illustrates a plan view of an exemplary micro heat
exchanger 40 superimposed over an exemplary integrated circuit 50,
where the micro heat exchanger 40 and the integrated circuit 50 are
configured according to a preferred counter flow orientation
relative to each other. As shown in FIG. 3, the directional flow of
the fluid through the micro heat exchanger 40 is from left to
right, that is from an inlet of the micro heat exchanger 40 to an
outlet. The temperature vector of the integrated circuit 50 is from
right to left, that is from a hot portion of the integrated circuit
50 to a cold portion. In the preferred counter flow orientation,
the directional flow of the fluid is substantially parallel, but
opposite in direction to the temperature vector of the integrated
circuit.
[0025] FIG. 4 illustrates a plan view of an exemplary micro heat
exchanger 60 superimposed over an exemplary integrated circuit 70,
where the micro heat exchanger 60 and the integrated circuit 70 are
configured according to a first alternative orientation. As shown
in FIG. 4, the directional flow of the fluid through the micro heat
exchanger 60 is from left to right, that is from an inlet of the
micro heat exchanger 60 to an outlet. The temperature vector of the
integrated circuit 70 is from left to right, that is from a hot
portion of the integrated circuit 70 to a cold portion. In this
first alternative orientation, the directional flow of the fluid is
substantially parallel, and in the same direction to the
temperature vector of the integrated circuit 70. This first
alternative orientation of the micro heat exchanger 60 to the
integrated circuit 70 is referred to as a parallel flow
orientation.
[0026] FIG. 5 illustrates a plan view of an exemplary micro heat
exchanger 80 superimposed over an exemplary integrated circuit 90,
where the micro heat exchanger 80 and the integrated circuit 90 are
configured according to a second alternative orientation. As shown
in FIG. 5, the directional flow of the fluid through the micro heat
exchanger 80 is from left to right, that is from an inlet of the
micro heat exchanger 80 to an outlet. The temperature vector of the
integrated circuit 90 is from top to bottom, that is from a hot
portion of the integrated circuit 90 to a cold portion. In this
second alternative orientation, the directional flow of the fluid
is substantially perpendicular to the temperature vector of the
integrated circuit 90. This second alternative orientation of the
micro heat exchanger 80 to the integrated circuit 90 is referred to
as a cross flow orientation.
[0027] FIG. 6 illustrates a plan view of an exemplary micro heat
exchanger 100 superimposed over an exemplary integrated circuit
110, where the micro heat exchanger 100 and the integrated circuit
110 are configured according to a third alternative orientation. As
shown in FIG. 6, the directional flow of the fluid through the
micro heat exchanger 100 is from left to right, that is from an
inlet of the micro heat exchanger 100 to an outlet. The temperature
vector of the integrated circuit 110 is from bottom to top, that is
from a hot portion of the integrated circuit 110 to a cold portion.
In this third alternative orientation, the directional flow of the
fluid is substantially perpendicular to the temperature vector of
the integrated circuit 110. This third alternative orientation of
the micro heat exchanger 100 to the integrated circuit 110 is also
referred to as a cross flow orientation.
[0028] To orient a micro heat exchanger to an integrated circuit
according to the preferred embodiment of the present invention, a
temperature gradient of the integrated circuit is determined. The
temperature gradient is used to determine a temperature vector that
preferably indicates a directional orientation from a hot portion
of the integrated circuit to a cold portion. The micro heat
exchanger preferably circulates a cooling fluid to receive heat
transferred from the integrated circuit. A directional flow of this
cooling liquid is determined. The directional flow is preferably
measured as a directional vector from an inlet of the micro heat
exchanger to an outlet. Once the temperature vector of the
integrated circuit and the directional flow of the micro heat
exchanger are determined, the micro heat exchanger and the
integrated circuit are preferably oriented according to a counter
flow orientation. The counter flow orientation is defined as the
temperature vector oriented opposite that of the directional flow.
In other words, the micro heat exchanger and the integrated circuit
are aligned such that the cooling liquid enters the micro heat
exchanger at a point substantially above the cold portion of the
integrated circuit, and the cooling liquid exits the micro heat
exchanger at a point substantially above the hot portion of the
integrated circuit.
[0029] The present invention has been described in terms of
specific embodiments incorporating details to facilitate the
understanding of the principles of construction and operation of
the invention. Such reference herein to specific embodiments and
details thereof is not intended to limit the scope of the claims
appended hereto. It will be apparent to those skilled in the art
that modifications may be made in the embodiment chosen for
illustration without departing from the spirit and scope of the
invention.
* * * * *