U.S. patent application number 11/132228 was filed with the patent office on 2005-11-24 for lead-free solder alloy and preparation thereof.
This patent application is currently assigned to THERESA INSTITUTE.CO., LTD.. Invention is credited to Hasegawa, Masayuki.
Application Number | 20050260095 11/132228 |
Document ID | / |
Family ID | 34939923 |
Filed Date | 2005-11-24 |
United States Patent
Application |
20050260095 |
Kind Code |
A1 |
Hasegawa, Masayuki |
November 24, 2005 |
Lead-free solder alloy and preparation thereof
Abstract
The invention relates to a lead-free solder alloy including 1 to
15 percent by weight of Bi, 0.01 to 2 percent by weight of Sb,
0.001 to 2 percent by weight of Co, and the balance percent of Sn,
so as to make the individual amounts of Bi, Sb, Co and Sn summing
up to 100% by weight, in which Sb is substantially present as a
solid solution with Bi. The alloy is prepared by solidifying a melt
obtained by melting Bi together with Sb to give a mother alloy of
Bi and Sb, i.e. the solid solution of Bi and Sb, and then
solidifying a melt obtained by melting the mother alloy of Bi and
Sb together with Sn and Co. The lead-free solder alloy according to
the present invention has high tensile strength and low melting
temperature. Furthermore, the alloy displays improved performance
in practical characteristics such as wettability, thermal shock
resistance, and is inexpensive.
Inventors: |
Hasegawa, Masayuki;
(Tokorozawa-shi, JP) |
Correspondence
Address: |
BIRCH STEWART KOLASCH & BIRCH
PO BOX 747
FALLS CHURCH
VA
22040-0747
US
|
Assignee: |
THERESA INSTITUTE.CO., LTD.
|
Family ID: |
34939923 |
Appl. No.: |
11/132228 |
Filed: |
May 19, 2005 |
Current U.S.
Class: |
420/562 |
Current CPC
Class: |
B23K 35/262
20130101 |
Class at
Publication: |
420/562 |
International
Class: |
C22C 013/02 |
Foreign Application Data
Date |
Code |
Application Number |
May 20, 2004 |
JP |
2004-178994 |
Claims
What is claimed is:
1. A lead-free solder alloy comprising: 1 to 15 percent by weight
of Bi; 0.01 to 2 percent by weight of Sb; 0.001 to 2 percent by
weight of Co; and the balance percent by weight of Sn, so as to
make the individual amounts of Bi, Sb, Co and Sn summing up to 100%
by weight, Sb being substantially present as a solid solution with
Bi.
2. The lead-fee solder alloy as limed in claim 1, wherein 10 to 15
percent by weight of Bi, 0.1 to 2 percent by weight of Sb, and 0.01
to 0.05 percent by weight of Co are included.
3. A process of preparing a lead-free solder alloy a claimed as
claim 1, comprising: solidifying a melt obtained by melting Bi
together with Sb to give a mother alloy of Bi and Sb; and
solidifying a melt obtained by melting the mother alloy of Bi and
Sb together with Sn and Co.
4. A process of preparing a lead-free solder alloy as claimed in
claim 2, comprising: solidifying a melt obtained by melting Bi
together with Sb to give a mother alloy of Bi and Sb; and
solidifying a melt obtained by melting the mother alloy of Bi and
Sb together with Sn and Co.
5. A process of preparing a lead-free solder alloy as claimed in
claim 1, comprising: solidifying a melt obtained by melting Bi
together with Sb to give a mother alloy of Bi and Sb; solidifying a
melt obtained by melting Sn together with Co to give a mother alloy
of Sn and Co; and solidifying a melt obtained by melting Sn
together with the mother alloy of Bi and Sb and the mother alloy of
Sn and Co.
6. A process of preparing a lead-free solder alloy as claimed in
claim 2, comprising: solidifying a melt obtained by melting Bi
together with Sb to give a mother alloy of Bi and Sb; solidifying a
melt obtained by melting Sn together with Co to give a mother alloy
of Sn and Co; and solidifying a melt obtained by melting Sn
together with the mother alloy of Bi and Sb and the mother alloy of
Sn and Co.
Description
CROSS REFERENCE TO RELATED APPLICATIONS AND INCORPORATION BY
REFERENCE
[0001] This application is based upon and claims the benefit of
priority from the prior Japanese Patent Application No.
2004-178994, filed on May 20, 2004; the entire content of which is
incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a lead-free solder alloy
having a melting point lower than about 210.degree. C. and more
specifically, to the lead-free solder alloy displaying improved
performance in practical characteristics such as wettability and
thermal shock resistance.
[0004] 2 Discussion of the Related Art
[0005] In manufacturing electric or electronic products, electronic
elements are generally fixed on circuit substrates using a solder
alloy of Sn and Pb having a liquefying temperature (i.e. the
temperature at which a solder alloy completely melts) of
183.degree. C. However, the use of Pb causes the pollution of the
environment. Furthermore, Pb cumulates in the human body.
Therefore, the conventional Sn--Pb solder alloy should be replaced
with lead-free alloys.
[0006] Common lead-free solder alloys are in general divided into
the following groups:
[0007] (i) High-temperature alloys: ex. Sn--Cu--P (liquefying temp.
227.degree. C.)
[0008] (ii) Middle-temperature alloys: ex. Sn--Ag--Cu (liquefying
temp. 217.degree. C.)
[0009] (iii) Low-temperature alloys: ex. Sn--Zn--Bi (liquefying
temp. 199.degree. C.).
[0010] The high-temperature alloys and the middle-temperature
alloys have liquefying temperatures higher than that of the Sn--Pb
alloy. Therefore, particular equipments are generally required to
solder at high temperatures in a working environment of N.sub.2.
Furthermore, these alloys may damage circuit substrates and
electronic elements, in particular those having insufficient heat
resistance, during soldering. In addition, these alloys are
expensive, since they include costly Ag and Cu.
[0011] The low-temperature alloys do not have the above-mentioned
problems. However, the Sn--Zn--Bi alloy is not suitable to solder
circuit substrates or electronic elements including Ni. In this
case, Zn is primarily corroded due to the difference between
electrode potentials of Zn and Ni. This results in defective
soldering. The corrosion of Zn accelerates in the presence of
moisture and residual agents in the circuit substrates or the
electronic elements. Therefore, the reliability of soldering may be
influenced not only by qualities of circuit substrates and
electronic elements to be used but by the moisture in the air. In
particular, the corrosion of Zn is a serious problem in complex
electronic products such as personal computers for which thousands
of electronic elements have to be fixed on both sides of a circuit
substrate.
[0012] On the other hand, a Sn--Bi alloy without Zn can be used to
avoid the above-mentioned problem. However, the use of the Sn--Bi
alloy causes another problem. The Sn--Bi ally has an eutectic
temperature of 137.degree. C. In an electronics including a circuit
substrate on which thousands of electronic elements are fixed, a
temperature of the substrate rises above 100.degree. C., locally up
to about 140.degree. C., during the operation of the electronics.
Therefore, the Sn--Bi alloy can partially melt at the
above-mentioned temperature. This results in poor electric contact
in the marketplace.
[0013] Therefore, new low temperature lead-free alloys, which do
not have the problems described above, have been requested.
[0014] JP06-344180A discloses a solder alloy including 0.05 to 5.0
percent by weight of Co and the balance of Sn and having
intermetallic compounds of Sn and Co dispersed in a matrix of Sn.
The intermetallic compounds strengthen the structure of the solder
alloy and thus tensile strength of the alloy. The document also
describes that the addition of any of Sb, Bi, In, Ag and Ga in the
amount less than 5.0 percent by weight, or two kinds of Sb, Bi In,
Ag and Ga in the total amount less than 7.0 percent by weight
adjusts a melting point of the alloy in the range from 190 to
200.degree. C. and that the resulting low temperature alloy also
has high tensile strength.
[0015] JP08-224689A discloses that a solder alloy having
particulate structure is obtained by adding 0.01 to 5 percent by
weight of Co into a low temperature lead-free alloy including 0.1
to 57 percent by weight of Bi or 0.1 to 50 percent by weight of In
and the balance of Sn and ordinary impurities, and that
intermetallic phases of fine particles is obtained after Cu, Ni, Au
and alloys thereof are wetted. The intermetallic phases increase
joint strength of a soldered component.
[0016] Therefore, it is known from the above documents that the
addition of Co provides the solder alloys having particulate
structures which increase the tensile strength of the alloys, and
that melting temperatures of the alloys can be lowered by the
addition of Sb, Bi, In, Ag or Ga. However, the above documents are
silent about other practical performance of the disclosed
alloys.
[0017] In general, the followings are requested to a solder alloy
in practical-use, in addition to the lowered melting point and the
high tensile strength.
[0018] As a basic practical performance, the solder alloy has to
wet metallic electrodes of electronic elements and circuit
substrates to be used, and widely spreads on the electrodes after
the soldering. That is, a spreading rate of the solder alloy (i.e.
the rate of an electrode surface area covered with a solder alloy
to the whole electrode surface area) has to be high. Low spreading
rate decreases the reliability of soldering. In particular, the
high spreading rate is important in manufacturing electronic
products which include circuit substrates having thousands of
electronic elements.
[0019] It is also requested that the alloy does not include alloy
phases having too low melting temperature. Such phases may begin to
melt as s temperature of a circuit substrate rises. This decreases
the tensile strength of the alloy.
[0020] Furthermore, it is desired that a liquefying temperature of
the alloy is almost equal to a solidifying temperature (i.e. the
temperature at which a solder alloy is completely solidified).
Soldered circuit substrates are generally transported on a conveyor
belt. If the solder alloy has the liquefying temperature quite
different from the solidifying temperature, it takes a long time to
completely solidify the alloy after soldering. In such a case,
crack initiation in the alloy or solder separation from the
substrates may be caused by the vibration of the conveyor belt
during the transportation.
[0021] When electronic elements are soldered on circuit substrates,
or when the soldered substrates are cooled after soldering, or
during the operation of electronics into which the substrates are
incorporated, significant thermal shock acts on soldered parts
because thermal expansion coefficients of the electronic elements,
the circuit substrate and the solder alloy used are in general
different. The thermal shock may result in crack formation in the
alloys. Therefore, thermal shock resistance is one of the important
demand characteristics.
[0022] In addition, it is desired that the solder alloy is
inexpensive from an economical standpoint.
OBJECT AND SUMMARY OF THE INVENTION
[0023] It is therefore an object of the present invention to
provide a lead-free solder alloy having a lowered liquefying
temperature and displaying improved performance in practical
characteristics such as tensile strength, wettability and thermal
chock resistance.
[0024] It is another object of the present invention to provide the
lead-free solder alloy which is possible to replace the
conventional Sn--Pb alloy.
[0025] It is still another object of the invention to provide the
lead-free solder alloy which is inexpensive.
[0026] The above objects are achieved by a lead-free solder alloy
comprising 1 to 15 percent by weight of Bi, 0.01 to 2 percent by
weight of Sb, 0.001 to 2 percent by weight of Co; and the balance
percent by weight of Sn, so as to make the individual amounts of
Bi, Sb, Co and Sn summing up to 100% by weight, Sb being
substantially present as a solid solution with Bi. The formation of
a Sn--Bi alloy phase, which can melt at a low temperature
(137.degree. C.), is avoided by the formation of the sold solution
of Sb and Bi according to the present invention.
[0027] If the amount of Co is less than 0.001 percent by weight,
tensile strength of the alloy would decrease. If the amount of Co
is more than 2 percent by weight, the liquefying temperature would
increase and also wettability of the alloy would deteriorate. If
the amount of Bi is less than 1 percent by weight, the liquefying
temperature of the alloy would increase and improving thermal shock
resistance can little take effect. If the amount of Bi is more than
15 percent by weight, the undesired Sn--Bi ally phase can be formed
because the components segregate during the solidification of the
alloy. If the amount of Sb is less than 0.01 percent by weight,
preventing the decrease in the liquefying temperature caused by the
formation of the undesired Sn--Bi alloy phase can little take
effect. If the amount of Sb is more than 2 percent by weight, the
liquefying temperature would increase and also the wettability
would deteriorate.
[0028] The content of Co in the solder alloy according to the
invention is preferably 0.006 to 1 percent by weight, in particular
0.01 to 0.05 percent by weight. The content of Bi in the solder
alloy according to the invention is preferably 8 to 15 percent by
weight, in particular 10 to 15 percent by weight. The content of Sb
in the solder alloy according to the invention is preferably 0.05
to 2 percent by weight, in particular 0.1 to 2 percent by
weight.
[0029] In preparing the solder alloy according to the invention, Bi
has to be previously melted together with Sb to give a mother alloy
of Bi and Sb, i.e. the solid solution of Bi and Sb. The mother
alloy of Bi and Sb is hereinafter referred as a Bi/Sb mother alloy.
If Bi is directly melted together with Sn, the undesired Sn--Bi
alloy phase, which can melt at a low temperature (137.degree. C.),
is formed.
[0030] Therefore, the present invention also relates to a process
of preparing the novel lead-free solder alloy, comprising
solidifying a melt obtained by melting Bi together with Sb to give
the Bi/Sb mother alloy and solidifying a melt obtained by melting
the Bi/Sb mother alloy together with Sn and Co.
[0031] In a preferred embodiment, the solder alloy according to the
invention is prepared by a process, comprising solidifying a melt
obtained by melting Bi together with Sb to give the Bi/Sb mother
alloy, solidifying a melt obtained by melting Sn together with Co
to give a mother alloy of Sn and Co (it is hereinafter referred as
a Sn/Co mother alloy), and solidifying a melt obtained by melting
Sn together with the Bi/Sb mother alloy and the Sn/Co mother alloy.
The melting point of Co is about 1480.degree. C. Therefore, huge
amount of energy is consumed in directly melting Co together with
Sn and the Bi/Sb mother alloy. On the contrary, the Sn/Co mother
alloy can be formed at about 550.degree. C. The novel solder alloy
according to the invention can be prepared using lesser energy in
this embodiment.
BRIEF DESCRIPTION OF THE DRAWINGS
[0032] FIG. 1 (a) is a photograph of a substrate including a chip
resistor. FIG. 1 (b) is a photograph of a cross-section taken on
line A-A of FIG. 1(a), on a substrate having a chip resistor fixed
using a novel lead-free solder alloy. FIG. 1 (c) is a photograph of
a cross-section taken on line A-A of FIG. 1(a), on a substrate
having a chip resistor fixed using a conventional Sn--Pb solder
alloy.
[0033] FIG. 2 (a) is a photograph of a soldered part in a substrate
having an electronic element having 3 terminals fixed using a novel
lead-free solder alloy. FIG. 2 (b) is a photograph of a soldered
part in a substrate having a MELF resistor fixed using a novel
lead-free solder alloy. FIG. 2 (c) is a photograph of a soldered
part in a substrate having an electronic element having 3 terminals
fixed using a conventional Sn--Pb solder alloy. FIG. 2 (d) is a
photograph of a soldered part in a substrate having a MELF resistor
fixed using a conventional Sn--Pb solder alloy.
DETAILED DESCRIPTION OF THE INVENTION
[0034] The present invention will be described in further detail
below.
[0035] The solder alloy according to the present invention
comprises Sn, Bi, Sb and Co as essential components. In the solder
alloy, Sb is substantially present as a solid solution with Bi.
[0036] When Sn and Bi are mixed together, a eutectic Sn--Bi alloy
which melts at a eutectic temperature (137.degree. C.) is formed.
If such a Sn--Bi alloy phase is included in a solder alloy, the
alloy phase begins to melt at the eutectic temperature (137.degree.
C.) as a temperature of a substrate rises to about 140.degree. C.
during the operation of electronics. This may decrease tensile
strength of the solder alloy. On the other hand, Bi and Sb together
form a complete solid solution. This solution has a melting
temperature between 271.degree. C. and 630.degree. C. The melting
temperature of 271.degree. C. is obtained in the solid solution
having 0 percent by weight of Sb (i.e. pure Bi). The melting
temperature of 630.degree. C. is obtained in the solid solution
having 0 percent by weight of Bi (i.e. pure Sb). The solid solution
does not melt if the temperature of the substrate rises to about
140.degree. C. According to the invention, Sb is substantially
present as the solid solution with Bi to avoid the formation of the
undesired Sn--Bi alloy phase which begins to melt at the low
temperature (137.degree. C.).
[0037] In the solder alloy according to the invention, Sb is
included in the amount of 0.01 to 2 percent by weight, based on the
total mass of the alloy. The componet Sb serves to avoid the
formation of the undesired Sn--Bi alloy phase as mentioned above
and to improve the wettability as well. Sb also serves to improve
the elongation of the alloy and to improve the joint strength of
the soldered parts between electronic elements and circuit
substrates. If the amount of Sb is less than 0.01 percent by
weight, preventing the decrease of the liquefying temperature
caused by the formation of the Sn--Bi alloy phase can little take
effect. On the contrary, if the amount of Sb is more than 2 percent
by weight, the liquefying temperature would increase and also the
wettability and the spreading rate would deteriorate. The amount of
Sb in the novel solder alloy is preferably 0.05 to 2 percent by
weight, in particular 0.1 to 2 percent by weight.
[0038] In the solder alloy according to the invention, Bi is
included in the amount of 1 to 15 percent by weight, based on the
total mass of the alloy. The component Bi serves to adjust the
liquefying temperature and to improve the thermal shock resistance
of the alloy as well. It is considered that the thermal shock
resistance is improved because Bi relieves thermal
expansion/contraction of Sn. Sn has the volume change of 4.21% when
a melt of it is solidified and then cooled to the room temperature.
On the other hand, Bi has the corresponding volume change of
-2.31%. These adverse volume changes are effective in improving the
thermal shock resistance. If the amount of Bi is less than 1
percent by weight, the liquefying temperature of the alloy would
increase and improving the thermal shock resistance can little take
effect. On the contrary, if the amount of Bi is mom than 15 percent
by weight, the undesired Sn--Bi ally phase can be formed because
the components segregate during the solidification of the alloy.
The amount of Bi in the novel solder alloy is preferably 8 to 15
percent by weight, in particular 10 to 15 percent by weight.
[0039] In the solder alloy according to the invention, the
component Co is included in the amount of 0.001 to 2 percent by
weight, based on the total mass of the alloy. During the
solidification of the alloy, Co firstly precipitates to give
crystal nuclei, and the remainder solidifies around the nuclei to
give the fine particulate structure of the alloy. The particulate
structure gives a uniform composition in the alloy and strengthens
the tensile strength. If the amount of Co is less than 0.001
percent by weight, the particulate structure of the alloy would
become large and the tensile strength would deteriorate. On the
contrary, if the amount of Co is more than 2 percent by weight, the
liquefying temperature would increase and also the wettability and
the spreading rate would deteriorate. The amount of Co in the novel
solder alloy is preferably 0.005 to 1 percent by weight, in
particular 0.01 to 0.05 percent by weight.
[0040] The novel solder alloy can comprise unavoidable impurities.
Examples of the impurities are Cu, Fe, Al, Zn, As, Cd, Ag and Pb,
etc.
[0041] In preparing the solder alloy according to the invention, it
is very important to previously melt Bi together with Sb to give
the Bi/Sb mother alloy. If Bi and Sb are separately melted together
with Sn, the Sn--Bi alloy and a Sn--Sb alloy are prepared. The
formation of the Sn--Bi alloy phase should be avoided, because the
alloy melts at a low temperature (137.degree. C.) as mentioned
above.
[0042] Therefore, the novel solder alloy is prepared by the process
comprising solidifying a melt obtained by melting Bi together with
Sb to give the Bi/Sb mother alloy and solidifying a melt obtained
by melting the Bi/Sb mother alloy together with Sn and Co. The
Bi/Sb mother alloy is generally formed by melting Bi metal together
with Sb metal. If desired, an alloy having Bi and Sb in the amounts
different from those in the aimed mother alloy can be mixed to the
metals. Also, Sn metal and Co metal are in general used in the
process. If desired, an alloy having Sn and Co can be mixed to the
metals. In the process, these components can be mixed as solids and
then the mixture is melted, or one component can be firefly melted
and the remaining components are added into the resulting melt.
[0043] In preparing the novel solder alloy, there is no strict
limitation in the order of adding Co. Co can be melted together
with the Bi/Sb mother alloy to give further Co/Bi/Sb mother alloy,
and then the resulting mother alloy is melted together with Sn.
Instead, Sn and Co can be separately melted with the Bi/Sb mother
alloy. However, the melting point of Co is about 1480.degree. C.,
and huge amount of energy is consumed in melting Co. Furthermore,
Co can be oxidized during the melting. Therefore, the quality of
the final solder alloy is often instable.
[0044] In a preferred embodiment, the novel solder alloy is
prepared by the process comprising solidifying a melt obtained by
melting Bi together with Sb to give the Bi/Sb mother alloy,
solidifying a melt obtained by melting Sn together with Co to give
a mother alloy of Sn and Co (it is hereinafter referred as a Sn/Co
mother alloy), and then solidifying a melt obtained by melt Sn
together with the Bi/Sb mother alloy and the Sn/Co mother alloy.
The order of preparing the Bi/Sb mother alloy and the Sn/Co mother
alloy is not critical. In the process, either the Bi/Sb mother or
the Sn/Co mother alloy can be first melted with Sn. Instead, both
mother alloys can be simultaneously melted together with Sn. The
Sn/Co mother alloy is generally prepared by melting Sn metal
together with Co metal. If desired, an alloy having Sn and Co in
the amounts different from those in the aimed mother alloy can be
mixed. These components can be mixed as solids and then the mixture
is melted, or one component can be firstly melted and the remaining
components are added into the resulting melt.
[0045] In the preferred embodiment, the Sn/Co mother alloy can be
formed at about 550.degree. C. Therefore, the novel solder alloy
according to the invention can be prepared using lesser energy.
Furthermore, Co is not oxidized during the preparation, and thus
the stable final solder alloy having the uniform structure and the
uniform composition can be obtained.
[0046] The novel lead-free alloy obtained as such can be used
advantageously for stick-type solders, wire solders, resin-core
solders, cream solders (also known as soldering pastes, solders by
mixing the powders of the alloy with soldering flux), and solder
balls for BGA, and can be applied to all of the common soldering
technologies, in particular, for hand soldering, reflow soldering,
high frequency wave soldering, infrared soldering and vapor-phase
soldering.
EXAMPLES
[0047] The present invention will now be explained in detail by the
following examples. The invention is not limited to the examples
below.
[0048] (1) Effect of Sb
[0049] A: Preparation of Solder Alloy
Example 1
[0050] Bi, 10 Percent by Weight--Co, 0.05 Percent by Weight--Sb,
0.3 Percent by Weigh--Sn (Balance)--
[0051] Bi metal was melted together with Sb metal, and the
resulting melt was solidified to obtain a Bi/Sb mother alloy.
Further, Sn metal and Co metal (99:1) were melted together, and the
resulting melt was solidified to obtain a Sn/Co mother alloy. Then,
Sn metal was melted together with the Bi/Sb mother alloy and the
Sn/Co mother alloy, and the resulting melt was solidified to obtain
the final lead-free solder alloy.
Comparative Example 1
[0052] Bi, 10 wt %--Co, 0.05 wt %--Sn (Balance)
[0053] Bi metal was melted together with Co metal, and the
resulting melt was solidified to obtain a Bi/Co mother alloy. Then,
Sn metal and the Bi/Co mother alloy was melted together, and the
resulting melt was solidified to obtain the lead-free solder alloy
without Sb.
[0054] B: Characteristic Evaluation
[0055] a) Liquefying Temperature, Solidifying Temperature
[0056] For the above lead-free soldering alloys in Example 1 and
Comparative Example 1, the solidifying temperatures, and the
liquefying temperatures were measured using a differential scanning
calorimeter with rising temperature of 5.degree. C./min. The
results are shown in Table 1.
1 TABLE 1 Components (percent by weight) Solidifying Liquefying Sn
Bi Co Sb Temp(.degree. C.) Temp(.degree. C.) Example 1 Balance 10
0.05 0.3 207-209 209-211 Comparative Balance 10 0.05 203-205
206-208 Example 1
[0057] As seen from Table 1, both alloys in Example 1 and
Comparative Example 1 had lowered liquefying temperatures less than
about 210.degree. C. and narrow solidication ranges (i.e. the
difference between a liquefying temperature and a solidifying
temperature) of 2-3.degree. C. The liquefying and solidifying
temperatures of the solder alloy in Example 1 are slightly higher
than those of the alloy in Comparative Example 1.
[0058] b) Specific Gravity
[0059] Three samples of each of the alloys in Example 1 and
Comparative Example 1 were tested for the specific gravities at
20.degree. C. The results are shown below. The values measured for
respective samples did not vary as shown in Table 2. Therefore, it
is found that both alloys have uniform compositions.
2 TABLE 2 Example 1 Comparative Example 1 Specific gravities
Average Specific gravities Average Sample 1 7.5 7.5 7.5 7.5 Sample
2 7.5 7.5 Sample 3 7.5 7.5
[0060] c) Spreading Rate
[0061] Three samples of each of the alloys in Example 1 and
Comparative Example 1 were tested for the spreading rates according
to JIS-Z-3197 8.3.11. About 0.3 g of the lead-free alloy in Example
1 or Comparative Example 1 and soldering flux (RMA type according
to MIL-F-12256E) were placed on the center of copper foil having
the size of 30.times.30.times.0.3 mm, and then the alloy on the
foil was melted at 250.degree. C. for about 30 seconds. Then
spreading heights were tested with a micrometer. The results are
shown below.
[0062] As can be seen from Table 3, the alloy in Example 1 has
higher spreading rate than the alloy in Comparative Example 1,
though the liquefying temperature of the alloy in Example 1 is
slightly higher than that of the alloy in Comparative Example 1
(see Table 1).
3 TABLE 3 Example 1 Comparative Example 1 Spreading Spread-
Spreading Spread- height Weight ing height Weight ing (mm) (g) rate
(%) (mm) (g) rate (%) Sample 1 0.988 0.3010 73.1 1.065 0.2981 70.9
Sample 2 0.883 0.3001 75.9 1.042 0.2961 71.4 Sample 3 0.861 0.2981
76.5 1.056 0.3010 71.2 Average 75.16 Average 71.16
[0063] d) Wettability and Solderability
[0064] The wettability and the solderability were tested according
to JIS C 0053. A piece of copper, to which the soldering flux (RMA
type according to MIL-F-12256E) was applied, was dipped into a melt
of the alloy in Example 1 or Comparative Example 1. The test was
carried out under the conditions of bath temperatures of
250.degree. C. and 260.degree. C., dipping depth of 3 mm, and
dipping time of 5 seconds. Then, the zero cross time for estimating
the wettability and the maximum wetting force for estimating the
solderability were measured. The results are shown in Table 4.
[0065] The alloy in Example 1 has shorter zero cross time than the
alloy in Comparative Example 1. This shows that the addition of Sb
leads to improved wettability. The alloy in Comparative Example 1
has higher maximum wetting force than the alloy in Example 1.
However, the maximum wetting forces measured at 260.degree. C. were
almost equal in both alloys.
4TABLE 4 Example 1 Comparative Example 1 Zero cross time Maximum
wetting Zero cross time Maximum wetting (sec) force (mN) (sec)
force (mN) 250.degree. C. 260.degree. C. 250.degree. C. 260.degree.
C. 250.degree. C. 260.degree. C. 250.degree. C. 260.degree. C. 0.75
0.5 2.26 3.7 0.9 0.7 3.5 3.75
[0066] e) Tensile Strength and Elongation of Alloy
[0067] The tensile strength was measured for the above lead-free
solder alloys in Example 1 and Comparative Example 1 according to
JIS Z 3193. The test pieces of respective alloys were drawn at a
velocity of 8 mm/min according to ASTM. ISO 6892 standards were
applied to the thickness of the test pieces. The results are shown
in Table 5. The alloy in Example 1 had slightly higher tensile
strength than the alloy in Comparative Example 1.
5TABLE 5 Example 1 Comparative Example 1 Tensile load Tensile
strength Tensile load Tensile strength (kgf) (kgf/mm.sup.2) (kgf)
(kgf/mm.sup.2) 183.13 9.30 182.10 9.22
[0068] The elongation was measured from the initial length and the
length after rupture of the test piece. The results are shown in
Table 6. As can be seen in Table 6, the alloy in Example 1 has
higher elongation than the alloy in Comparative Example 1. This
shows that the alloy comprising Sb according to the invention has
improved resistance to the formation of cracks or brakes in the
marketplace.
6TABLE 6 Elongation (%) Example 1 Comparative Example 1 17.05
16.41
[0069] f) Initial Joint Strength (Tensile Strength in
Practical-Use)
[0070] Electronic elements were fixed onto a circuit substrate
using the alloy in Example 1 or Comparative example 1. Three
samples were prepared for respective alloys. The sample was drawn
at the velocity of 5 mm/min by a peel test device for the test of
the initial joint strength of the joint parts. The results are
shown in Table 7. As known from Table 7, the alloy in Example 1 had
higher initial joint strength than the alloy in Comparative Example
1. This shows that the alloy comprising Sb according to the
invention has improved tensile strength in the marketplace.
7 TABLE 7 Initial joint strength (kgf) Example 1 Comparative
Example 1 Sample 1 8.58 6.96 Sample 2 8.79 6.27 Sample 3 8.01 6.87
Average 8.46 6.70
[0071] (2) Comparison with Other Solder Alloys.
[0072] A: Preparation
[0073] Solder alloys shown in the following Table 8 were
prepared.
8 TABLE 8 Alloy Sn Pb Bi Sb Co In Ag Comparative Balance 37 Example
2 Comparative Balance 1 1.2 2 1 0.8 Example 3 Comparative Balance
10 0.01 3 Example 4 Example 2 Balance 10 0.1 0.01 Example 3 Balance
15 0.1 0.01 Example 4 Balance 10 0.3 0.01 Example 5 Balance 10 1.5
0.05 Example 6 Balance 10 2 0.05
[0074] The alloy in Comparative Example 1 is the conventional
Sn--Pb solder alloy. The alloys in Comparative Examples 2 and 3
respectively correspond to alloys described in the above-mentioned
prior documents, JP06-344180A and JP08-224689. The solder alloys in
Examples 2 to 6 were prepared as described in Example 1, except
that the different amounts of Sn, Bi Sb and Co were used.
[0075] B: Characteristic Evaluation for Practical Use
[0076] a) Solderability
[0077] Necessary electronic elements were set on a circuit
substrate for an automobile meter and each of cream solders
obtained by using the alloys shown in Table 8 was applied to joint
parts. The soldering was executed by heating the substrate up to
225.degree. C. and cooling it to the room temperature. Then, the
electrode surface area covered by the solder was visually
evaluated. For the evaluation, the same electronic elements, which
were likely to cause defective soldering, were selected. The
results are shown in Table 9.
9 TABLE 9 Alloy Evaluation Comparative Example 2 very good
Comparative Example 3 not good Comparative Example 4 not good
Example 2 good Example 3 very good Example 4 very good Example 5
good Example 6 good very good: more than about 75% of the surface
area was covered by the solder. good: about 50 to 75% of the
surface area was covered by the solder. not good: less than about
50% of the surface area was covered by the solder.
[0078] very good: more than about 75% of the surface area was
covered by the solder.
[0079] good: about 50 to 75% of the surface area was covered by the
solder.
[0080] not good: less than about 50% of the surface area was
covered by the solder.
[0081] As known from Table 9, the novel solder alloys in Example 2
to 6 have better solderability, compared to the solder alloys in
Comparative Examples 3 and 4. In particular, the alloys in Examples
3 and 4 have superior solderbility as well as the conventional
Sn--Pb solder alloy in Comparative Example 2.
[0082] b) Thermal Shock Resistance
[0083] Chip resistors having an electrode coated with Sn were fixed
on circuit substrates using the cream solders prepared from the
solder alloys in Examples 2 to 6 and the Sn--Pb alloy in
Comparative Example 2. The resulting substrates were tested under
the following conditions.
[0084] Apparatus: ESPEC TSA-70L
[0085] Thermal shock: 40.degree. C., 30 min 90.degree. C., 30
min
[0086] Repeat cycles: 1000 cycles
[0087] In the substrate including the conventional Sn--Pb solder
alloy, cracks were observed in the soldered parts after 500 cycles
of the thermal shock. On the contrary, cracks were not observed in
the substrates including the solder alloys in Examples 2 to 6 after
1000 cycles of the thermal shock.
[0088] The above-mentioned results can be seen in photographs in
FIG. 1. FIG. 1 (a) is a photograph of the substrate having the chip
resistor soldered. FIG. 1 (b) is a photograph of a cross-section
taken on line A-A of FIG. 1(a), on the substrate having the chip
resistor fixed using the lead-free solder alloy in Example 3 which
experienced 1000 cycles of the thermal shock. Cracks were not
observed in the soldered part in spite of the presence of two
voids, as known from the photograph.
[0089] FIG. 1 (c) is a photograph of a cross-section taken on line
A-A of FIG. 1(a), on the substrate having the chip resistor fixed
using the conventional Sn--Pb solder alloy in Comparative Example 2
which experienced 500 cycles of the thermal shock. The cracks of
various sizes were observed as known from the photograph. It is
considered that the cracks were formed because large stress caused
by the difference between the thermal expansion coefficients of the
chip resistor and the circuit substrate concentrated on the
soldered parts.
[0090] As known from the test results, the solder alloy according
to the invention has improved thermal shock resistance, compared to
the conventional Sn--Pb solder alloy.
[0091] c) Solderability to Various Electronic Elements
[0092] Chip resistors (size; 60 .mu.m.times.30 .mu.m: electrode
coated with Sn), electric elements having three terminals
(electrode coated with Sn--Pb) and MELF resistors (electrode coated
with Sn--Pb) were soldered using each of the cream solder obtained
from the solder alloys in Example 3 and the Sn--Pb alloy in
Comparative Example 2.
[0093] Both allays have good wettability to the chip resistors.
However, the followings were observed in soldering the elements
having three terminals and the MELF resistors.
[0094] FIG. 2 (a) is a photograph of a soldered part in the
substrate including the element having 3 terminals fixed using the
solder alloy in a Example 3. FIG. 2 (b) is a photograph of a
soldered part in the substrate including the MELF resistor fixed
using the solder alloy in Example 3. As known from the photographs,
the novel alloy has good solderbility to both electronic
elements.
[0095] FIG. 2 (c) is a photograph of a soldered part in the
substrate including the element having 3 term fixed using the
Sn--Pb solder alloy in Comparative Example 2. FIG. 2 (d) is a
photograph of a soldered part in the substrate including the MELF
resistor fixed using the Sn--Pb solder alloy in Comparative Example
2. As known from the photographs, the Sb--Pb alloy did not have
good solderability to these electronic elements. In soldering the
element having 3 therminals, the significant oxidation of the
soldered part was observed. In soldering the MELF resistor, the
soldered part and the solder ally was covered with a gas generated
from the coat of Sn--Pb.
[0096] Therefore, the solder alloy according to the invention can
be applied to various electronic elements, compared to the
conventional Sn--Pb alloy.
[0097] Tthe solder alloy according to the invention have liquefying
temperature lower than about 210.degree. C. and improved
wettability. The novel alloy also has improved spreading rate and
tensile strength. Furthermore, the novel solder alloy has uniform
composition and structure, and does not include alloy phases having
too low melting points. In addition, the novel alloy melted can
solidify rapidly, because the alloy has solidifying temperature
almost equal to liquefying temperature. Furthermore, the solder
alloy according to the invention has improved thermal shock
resistance and is inexpensive because it does not include costly Cu
or Ag.
[0098] The solder alloy according to the invention displays
improved performance in practical characteristics and does not
require particular equipments to solder at high temperatures in a
working environment of N.sub.2. Therefore, the novel alloy can
easily replace the conventional Sn--Pb alloy.
* * * * *