U.S. patent application number 11/122029 was filed with the patent office on 2005-11-24 for skived-fin annular heat sink.
Invention is credited to Huang, Liang-Fu.
Application Number | 20050257914 11/122029 |
Document ID | / |
Family ID | 35062602 |
Filed Date | 2005-11-24 |
United States Patent
Application |
20050257914 |
Kind Code |
A1 |
Huang, Liang-Fu |
November 24, 2005 |
Skived-fin annular heat sink
Abstract
A skived-fin annular heat sink is manufactured via a skived-fin
technology and includes at least one bottom board and a plurality
of fins. The at least one bottom board is bended to form a
closed-shaped. The fins are extended outwardly from the at least
one bottom board, wherein each of the fins has a bending portion
for connecting the fin with the bottom board. Hence the skived-fin
annular heat sink can be adapted to a chip of PCB with over limited
space, and can used to increase the number of fins for increasing
the heat-dissipating area between the chip and the heat sink.
Inventors: |
Huang, Liang-Fu; (Hsinchuang
City, TW) |
Correspondence
Address: |
ROSENBERG, KLEIN & LEE
3458 ELLICOTT CENTER DRIVE-SUITE 101
ELLICOTT CITY
MD
21043
US
|
Family ID: |
35062602 |
Appl. No.: |
11/122029 |
Filed: |
May 5, 2005 |
Current U.S.
Class: |
165/80.3 ;
257/E23.103 |
Current CPC
Class: |
H01L 23/3672 20130101;
F28F 1/16 20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101;
H01L 2924/0002 20130101 |
Class at
Publication: |
165/080.3 |
International
Class: |
F28F 007/00 |
Foreign Application Data
Date |
Code |
Application Number |
May 7, 2004 |
TW |
093207199 |
Claims
What is claimed is:
1. A skived-fin annular heat sink manufactured via a skived-fin
technology, comprising: at least one bottom board bended to form a
closed-shaped; and a plurality of fins extended outwardly from the
at least one bottom board, wherein each of the fins has a bending
portion for connecting the fin with the bottom board.
2. The skived-fin annular heat sink as claimed in claim 1, wherein
the bottom board and the fins are made of copper or copper alloy
materials.
3. The skived-fin annular heat sink as claimed in claim 1, wherein
the bottom board and the fins are made of aluminum material and
aluminum alloy materials.
4. The skived-fin annular heat sink as claimed in claim 1, wherein
the closed-shaped bottom board is formed via two semicircular
bottom board or a plurality of fan-shaped bottom board assembled
together.
5. The skived-fin annular heat sink as claimed in claim 4, further
comprising at least one connecting component for connecting every
two adjacent semicircular bottom boards or fan-shaped bottom
board.
6. The skived-fin annular heat sink as claimed in claim 1, wherein
the at least one bottom board is bended to form the closed-shaped
via a welding.
7. The skived-fin annular heat sink as claimed in claim 1, wherein
the bottom board is an erect closed cylinder.
8. The skived-fin annular heat sink as claimed in claim 1, wherein
the bottom board is an erect closed rectangle.
9. The skived-fin annular heat sink as claimed in claim 1, wherein
the fins are arranged to form a rectangular or trapezoid shape.
10. The skived-fin annular heat sink as claimed in claim 1, further
comprising a heat-conducting block disposed in a center portion of
the bottom board.
11. The skived-fin annular heat sink as claimed in claim 10,
wherein the heat-conducting block has a trapezoid-shaped
cross-sectional.
12. The skived-fin annular heat sink as claimed in claim 1, wherein
the fins are arranged obliquely on the bottom board, and each of
the fins has an upward and oblique angle formed on a bottom side
thereof.
13. The skived-fin annular heat sink as claimed in claim 1, wherein
the fins are arranged spirally on the bottom board.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a skived-fin annular heat
sink, and particularly relates to an erect skived-fin annular heat
sink manufactured via a skived-fin technology
[0003] 2. Description of the Related Art
[0004] According to the increase of IC density, too much heat is
resulted from chip operation in the information product. Hence the
temperature of the chip such as CPU usually exceeds supportable
temperature, and the chip and some components near the chip are
damaged.
[0005] In order to solve the heat-dissipating problem for chips,
many users put a heat sink with a plurality of fins on the chip.
The heat sink mainly includes an erect rectangular heat sink or an
erect annular heat sink. The annular heat sink is usually used to
dispose on chips of a PCB, such as interface card. The annular heat
sink is manufactured via extrusion, forging, stamping, machine
process, powder forming or press forming. However, the fin density
is limited by the above-mentioned process method. Hence the number
of fins (is about 100 pieces) is hard to be increased and the
thickness of the fins cannot be too thin by the above-mentioned
process method.
[0006] For example, an extruded annular heat sink is usually made
of aluminum materials. A process for manufacturing the extruded
annular heat sink includes: melting the aluminum materials and
extruding the extruded annular heat sink with same cross-sectional
shape via an extruded tool. FIGS. 1 and 2 show two top views of two
extruded annular heat sinks of the prior art, respectively. An
annular heat sink 9 has a circular cylinder portion 91, a plurality
of fins 92 extended outwardly from the cylinder portion 91 and a
heat-conducting block 93 disposed in a center portion of the
cylinder portion 91 for contacting with a surface of a chip. The
heat sink 9 is usually made of high heat-conducting materials.
Hence, when the temperature of the chip increases, the heat sink 9
is used to absorb the heat from the chip and the heat is conducted
to surrounding air via the fins 92.
[0007] In FIG. 2, an annular heat sink 9a is disclosed. The annular
heat sink 9a has an annular cylinder portion 94 and a plurality of
thick base fins 95 extended outwardly from the cylinder portion 94.
Each of the base fins 95 has a pair of extending fins 96 extended
therefrom for increasing the number of extending fins 96 and the
heat-dissipating area. However, the number of extending fins 96 is
about 100-120 pieces via the above-mentioned process method.
[0008] Another way to manufacture the annular heat sink is to bond
or weld the fins on the bottom board. Although the above-mentioned
method can increase the number of fins and the heat-dissipating
area, the fins do not connect directly with the bottom board. Hence
the heat-dissipating effect of the heat sink is decreased.
SUMMARY OF THE INVENTION
[0009] The present invention provides a skived-fin annular heat
sink to increase the number of fins for increasing the
heat-dissipating area between a chip and the heat sink. Moreover
the skived-fin annular heat sink can be adapted to on a chip of PCB
with over limited space.
[0010] One aspect of the invention is a skived-fin annular heat
sink. The skived-fin annular heat sink is manufactured via a
skived-fin technology and includes at least one bottom board and a
plurality of fins. The at least one bottom board is bended to form
a closed-shaped; and the fins are extended outwardly from the at
least one bottom board, wherein each of the fins has a bending
portion for connecting the fin with the bottom board.
[0011] It is to be understood that both the foregoing general
description and the following detailed description are exemplary,
and are intended to provide further explanation of the invention as
claimed. Other advantages and features of the invention will be
apparent from the following description, drawings and claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The various objectives and advantages of the present
invention will be more readily understood from the following
detailed description when read in conjunction with the appended
drawing, in which:
[0013] FIG. 1 is a top view of an extruded annular heat sink of the
prior art;
[0014] FIG. 2 is a top view of another extruded annular heat sink
of the prior art;
[0015] FIG. 3 is a schematic view of a process for manufacturing a
skived-fin heat sink via a skived-fin technology according to the
present invention;
[0016] FIG. 4 is another schematic view of a process for
manufacturing a skived-fin heat sink via a skived-fin technology
according to the present invention;
[0017] FIG. 4A is a schematic view of a process for manufacturing a
skived-fin heat sink via a skived-fin technology according to
another embodiment of the present invention;
[0018] FIG. 5 is a top view of a skived-fin annular heat sink
according to the best embodiment of the present invention;
[0019] FIG. 5A is a side view of a skived-fin annular heat sink
manufactured via the process of FIG. 4A according to an embodiment
of the present invention;
[0020] FIG. 5B is a side view of a skived-fin annular heat sink
manufactured via the process of FIG. 4A according to another
embodiment of the present invention;
[0021] FIG. 6 is an across-sectional view along a line 6-6 of a
skived-fin annular heat sink in FIG. 5;
[0022] FIG. 6A is an across-sectional view of a skived-fin annular
heat sink connected with a heat-conducting block according to
another embodiment of the present invention;
[0023] FIG. 7 is an across-sectional view of a skived-fin annular
heat sink according to the second embodiment of the present
invention;
[0024] FIG. 8 is a top view of a skived-fin annular heat sink
according to the third embodiment of the present invention; and
[0025] FIG. 9 is a top view of a skived-fin annular heat sink
according to the fourth embodiment of the present invention.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0026] FIG. 3 shows a schematic view of a process for manufacturing
a heat sink via a skived-fin technology according to the present
invention. The present invention provides a skived-fin heat sink
that is manufactured via a skived-fin technology. The skived-fin
technology is the best-developed technology in all heat sink
processes. A process for manufacturing the skived-fin heat sink
includes providing a plane workpiece 1 firstly. Afterward, the
workpiece 1 is fixed on a jig 2 via a calculating angle, and a
predetermined front side of the workpiece 1 is shaped via a shaping
tool 3 of a punching machine, a milling machine or a special
machine such as a CNC according to a carpenter shaping principle.
Thereafter, the workpiece 1 is shaped continuously to form a
plurality of sheet-shaped fins 11 that do not break away from the
workpiece 1, and the sheet-shaped fins 11 are vertical relative to
the workpiece 1 to form a plurality of corresponding bending
portion 112 via a suitable method. Each of the bending portions 112
is connected between the corresponding sheet-shaped fin 11 and the
workpiece 1. Because the fins 11 are integrated on the workpiece 1
via the corresponding bending portions 112 and there is no any
joint between the fins 11 and the workpiece 1, there is no any
interface or thermal resistance between the fins 11 and the
workpiece 1.
[0027] FIG. 4 shows another schematic view of a process for
manufacturing a skived-fin heat sink via a skived-fin technology
according to the present invention. There is just a little bit
distance between two sheet-shaped fins 11. Afterward, an end
section 13 of the workpiece 1 is cut to form a skived-fin workpiece
that has different length according to different embodiment.
Finally, the skived-fin workpiece is bended to form a skived-fin
annular heat sink by a bending tool.
[0028] FIG. 4A shows a schematic view of a process for
manufacturing a skived-fin heat sink via a skived-fin technology
according to another embodiment of the present invention. The
workpiece 1 is fixed obliquely on the jig 2. The workpiece 1 is
shaped continuously to form a plurality of sheet-shaped fins 11a
oblique to the workpiece 1. An inclination .theta. between the
sheet-shaped fin 11a and the workpiece 1 is determined according to
an included angle .theta. between the workpiece 1 and the tool 2.
If the workpiece 1 connects to the tool 2 via the included angle
.theta., the sheet-shaped fin 11a connects to the workpiece 1 via
the inclination .theta.. Each of the sheet-shaped fins 11a
obliquely tends to one side of the workpiece 1. Finally, the
skived-fin workpiece is bended to form a skived-fin annular heat
sink with spiral fins by a bending tool.
[0029] FIGS. 5 and 6 show a top view of a skived-fin annular heat
sink according to the best embodiment of the present invention and
an across-sectional view along a line 6-6 of a skived-fin annular
heat sink in FIG. 5, respectively. The best embodiment of the
present invention provides a closed skived-fin annular heat sink 4.
The skived-fin annular heat sink 4 has a plurality of sheet-shaped
fins 44, an annular bottom board 42, a plurality of bending portion
442 and a slot 46. The bottom board 42 is an erect closed cylinder.
The sheet-shaped fins 44 are connected with the annular bottom
board 42 via the corresponding bending portion 442. The skived-fin
annular heat sink 4 of the present invention has a larger
heat-dissipating area and a good heat-dissipating effect than that
of the heat sinks 9, 9a of prior art according to the
above-mentioned processes. Furthermore, a heat-conducting block 5
is disposed in a center portion of the skived-fin annular heat sink
4 and connected to a chip 6 for conducting heat from the chip 6 to
the skived-fin annular heat sink 4.
[0030] FIG. 5A shows a side view of a skived-fin annular heat sink
manufactured via the process of FIG. 4A according to an embodiment
of the present invention. The present invention provides a
skived-fin annular heat sink 4' according the FIG. 4A. The
skived-fin annular heat sink 4' has a plurality of oblique fins 44'
arranged thereon in order. Each of the fins 44' has an upward and
oblique angle formed on a bottom side thereof to provide larger
spaces for more airflows fluently flowing to a surrounding of the
chip 6 via the larger spaces. When airflows blow downward to the
surrounding of the chip 6 via a fan, the airflows become oblique
and downward airflows via the oblique fins 44' at the same time.
The oblique and downward airflows can improve air trap that is
happened by vertical airflows. Hence the skived-fin annular heat
sink 4' of the present invention has a good heat-dissipating
effect.
[0031] FIG. 5B shows a side view of a skived-fin annular heat sink
manufactured via the process of FIG. 4A according to another
embodiment of the present invention. A skived-fin annular heat sink
4" with a plurality of oblique fins 44" is disclosed. In this
embodiment, a parallelogram workpiece is provided to the process of
the FIG. 4A.
[0032] FIG. 6A shows an across-sectional view of a skived-fin
annular heat sink connected with a heat-conducting block according
to another embodiment of the present invention. In this embodiment,
the present invention provides a taper heat-conducting block 5' and
a skived-fin heat sink 4" having a plurality of fins 44" and a
taper bottom board 42. Moreover, The skived-fin heat sink 4" has a
receiving space formed in a center portion thereof for receiving
the taper heat-conducting block 5'.
[0033] Because of the skived-fin heat sink is manufactured by a
skived-fin process, the skived-fin heat sink can be made of an
aluminum material, an aluminum alloy, a copper or a copper alloy.
In the best mold, the skived-fin heat sink 44 is a rectangular
shape. However, the shape is not used to limit the present
invention. FIG. 7 shows an across-sectional view of a skived-fin
annular heat sink according to the second embodiment of the present
invention. A skived-fin heat sink 4a has a bottom board 42a, and a
plurality of trapezoid fins 44a connected with the bottom board 42a
for increasing the heat-dissipating effect. The fins can be any
shapes. For example, when two end triangle portions of the
workpiece are cut, the trapezoid fins 44a can be obtained. Hence,
the shape of the fins can be a fan-shaped or an arc-shaped
according the different cutting methods.
[0034] A heat-conducting block 5a is received in a center portion
of the skived-fin heat sink 4a. The heat-conducting block 5a has an
exposed bottom edge 52a extended outside the skived-fin heat sink
4a for abutting against a bottom side of the bottom board 42a.
Hence, the exposed bottom edge 52a can provide a larger
heat-conducting area for increasing the heat-dissipating effect
between the heat-conducting block 5a and the skived-fin heat sink
4a.
[0035] FIG. 8 shows a top view of a skived-fin annular heat sink
according to the third embodiment of the present invention. The
present invention provides a process for manufacturing a
semicircular skived-fin heat sink 4b. The semicircular skived-fin
heat sink 4b has two sides connected with two sides of another
semicircular skived-fin heat sink 4b, respectively. Each
semicircular skived-fin heat sink 4b has a bottom board 42b and a
plurality of fin 44b. Every two bottom boards 42b can be assembled
together to form a closed-shaped. Hence, the present invention can
use two semicircular skived-fin heat sink 4b or more than two
fan-shaped skived-fin heat sink 4b assembled together to form a
skived-fin annular heat sink. The third embodiment of the present
invention can reduce the difficulty of bending the workpiece 1, and
provide a connecting component disposed between two adjacent sides
of the skived-fin heat sink. For example, two connecting components
7b with clamping function are disposed in a slot 46b for connecting
and fixing two adjacent end sides of the semicircular skived-fin
heat sink 4b. Furthermore, the two the semicircular skived-fin heat
sinks 4b can be assembled together via welding or rivet joint.
[0036] FIG. 9 shows a top view of a skived-fin annular heat sink
according to the fourth embodiment of the present invention. In
this embodiment, the present invention provides a rectangular
skived-fin annular heat sink 4c having an erect closed rectangular
bottom board 42c and a plurality of fins 44c extended outwardly
from the bottom board 42c. Furthermore, the rectangular skived-fin
annular heat sink 4c is easy to manufacture than circular
skived-fin annular heat sink, and a heat-conducting block 5c has a
contact area same as a top surface of a chip for increasing
effective heat-dissipating area.
[0037] Conclusion, the present invention has some advantages, as
following:
[0038] 1. The skived-fin annular heat sink of the present invention
has a plurality of sheet-shaped fins more than that of the prior
art and a bottom board connected with a center portion thereof for
increasing more heat-dissipating area and good heat-dissipating
effect;
[0039] 2. The skived-fin annular heat sink can be made of an
aluminum material, an aluminum alloy, a copper or a copper alloy
easily; and
[0040] 3. The skived-fin annular heat sink can be adapted to a chip
of PCB with over limited space, such as chips on an interface card.
Moreover, a fan can be disposed on the skived-fin annular heat sink
for increasing heat-dissipating effect.
[0041] Although the present invention has been described with
reference to the preferred embodiments thereof, it will be
understood that the invention is not limited to the details
thereof. Various substitutions and modifications have been
suggested in the foregoing description, and others will occur to
those of ordinary skill in the art. Therefore, all such
substitutions and modifications are intended to be embraced within
the scope of the invention as defined in the appended claims.
* * * * *