U.S. patent application number 11/167889 was filed with the patent office on 2005-11-17 for thermal protrusion reduction in magnet heads by utilizing heat sink layers.
This patent application is currently assigned to HEADWAY TECHNOLOGIES, INC.. Invention is credited to Chhabra, Devendra, Dovek, Moris, Garfunkel, Glen.
Application Number | 20050254173 11/167889 |
Document ID | / |
Family ID | 35309159 |
Filed Date | 2005-11-17 |
United States Patent
Application |
20050254173 |
Kind Code |
A1 |
Garfunkel, Glen ; et
al. |
November 17, 2005 |
Thermal protrusion reduction in magnet heads by utilizing heat sink
layers
Abstract
A magnetic read/write head and slider assembly and method for
forming said magnetic read/write head and slider assembly, wherein
said assembly has improved heat spreading and dissipation
properties and exhibits significantly reduced thermal protrusion
during operation. The method consists of the formation of a heat
sink layer on a portion of either the upper pole yoke or the lower
magnetic pole of the writer.
Inventors: |
Garfunkel, Glen; (Milpitas,
CA) ; Dovek, Moris; (Milpitas, CA) ; Chhabra,
Devendra; (Milpitas, CA) |
Correspondence
Address: |
George O. Saile
28 Davis Avenue
Poughkeepsie
NY
12603
US
|
Assignee: |
HEADWAY TECHNOLOGIES, INC.
|
Family ID: |
35309159 |
Appl. No.: |
11/167889 |
Filed: |
June 27, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11167889 |
Jun 27, 2005 |
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10151986 |
May 21, 2002 |
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6914750 |
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10151986 |
May 21, 2002 |
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09970788 |
Oct 5, 2001 |
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6928721 |
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Current U.S.
Class: |
360/235.5 ;
G9B/5.231 |
Current CPC
Class: |
G11B 5/6005
20130101 |
Class at
Publication: |
360/235.5 |
International
Class: |
G11B 005/60 |
Claims
What is claimed is:
1-10. (canceled)
11. A method for fabricating a magnetic read/write head and slider
assembly having improved heat spreading and heat dissipation
characteristics and reduced thermal protrusion comprising:
providing a read/write head and slider assembly wherein the write
element portion of said read/write head comprises at least a lower
magnetic pole piece, an upper pole tip and yoke assembly and an
inductive coil positioned between said pole piece and yoke; forming
a heat sink layer in thermal contact with a portion of a surface of
the lower magnetic pole piece; forming an insulating overcoat over
the assembly.
12. The method of claim 11 wherein the heat sink layer covers a
portion of the upper surface of the lower magnetic pole piece and
extends laterally beneath a substantial portion of the inductive
coil.
13. The method of claim 11 wherein the heat sink layer covers a
portion of the lower surface of the lower magnetic pole piece and
extends laterally beneath a substantial portion of the inductive
coil.
14. The method of claim 11 wherein the material of which the heat
sink layer is formed is a material having thermal conductivity
which is higher than that of surrounding and contiguous
materials.
15. The method of claim 14 wherein the material of which the heat
sink layer is formed is selected from the group consisting of
electrically conducting materials and magnetic materials.
16. The method of claim 15 wherein the material of which the heat
sink layer is formed is selected from the group of materials with
high thermal conductivities consisting of Cu, Au, Ag, Ni, Al, Ta,
W, alloys thereof and combinations thereof.
17. The method of claim 11 wherein the heat sink layer is a double
layer, comprising a first layer which is an electrically insulating
spacer layer and a second layer selected from the group of
electrically conducting and magnetic materials and wherein the
electrically insulating layer is in contact with the upper surface
of the yoke.
18. The method of claim 17 wherein the second layer is a layer of
Cu formed to a thickness of between approximately 0.25 and 10
microns.
19. The method of claim 17 wherein the first layer is a layer of
alumina formed to a thickness of between approximately 0 and 10
microns.
20. The method of claim 11 wherein the overcoat layer is a layer of
alumina.
21-30. (canceled)
31. A magnetic read/write head and slider assembly having improved
heat spreading and heat dissipation characteristics and reduced
thermal protrusion comprising: a read/write head and slider
assembly wherein the write element portion of said read/write head
comprises at least a lower magnetic pole piece, an upper pole tip
and yoke assembly and an inductive coil positioned between said
lower magnetic pole piece and yoke; a heat sink layer formed on a
surface of the lower magnetic pole piece; and an insulating
overcoat encapsulating the assembly.
32. The assembly of claim 31 wherein the heat sink layer covers a
portion of the upper surface of the lower magnetic pole piece and
extends laterally beneath a substantial portion of the inductive
coil.
33. The assembly of claim 31 wherein the heat sink layer covers a
portion of the lower surface of the lower magnetic pole piece and
extends laterally beneath a substantial portion of the inductive
coil.
34. The assembly of claim 31 wherein the material of which the heat
sink layer is formed is a material having thermal conductivity
which is higher than that of surrounding and contiguous
materials.
35. The assembly of claim 34 wherein the material of which the heat
sink layer is formed is selected from the group consisting of
electrically conducting materials and magnetic materials.
36. The assembly of claim 34 wherein the material of which the heat
sink layer is formed is selected from the group of materials with
high thermal conductivities consisting of Cu, Au, Ag, Ni, Al, Ta,
W, alloys thereof and combinations thereof.
37. The assembly of claim 34 wherein the heat sink layer is a
double layer, comprising a first layer which is an electrically
insulating spacer layer and a second layer selected from the group
of electrically conducting and magnetic materials and wherein the
electrically insulating layer is in contact with the upper surface
of the yoke.
38. The assembly of claim 37 wherein the second layer is a layer of
Cu formed to a thickness of between approximately 0.25 and 10
microns.
39. The assembly of claim 37 wherein the first layer is a layer of
alumina formed to a thickness of between approximately 0 and 10
microns.
Description
Continuation-in-Part
[0001] This application is a Continuation-In-Part of Docket No. HT
01-017, application Ser. No. ______ Filing Date Oct. 5, 2001.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] This invention relates generally to the fabrication of
merged magnetic read/write heads and slider assemblies and, more
particularly, to the fabrication of such a head and slider assembly
with improved heat spreading and dissipation characteristics to
eliminate problems associated with thermal expansion and protrusion
of head elements during operation.
[0004] 2. Description of the Related Art
[0005] A merged magnetic read/write head and slider assembly
consists essentially of a magnetoresistive read sensor element
formed on the pole pieces of an inductively magnetized write
element and mounted within, or fabricated as an integral part of, a
slider assembly that physically and electrically connects the head
to an actuator arm. The read/write head is subjected to complex
thermal stresses during its normal operation due to the buildup of
thermal energy from Joule heating in its read and write stages
(sensing current in the read element and write current in the write
coil). The heat dissipation properties of the read/write head are
limited by the thermal conductivity of the protective overcoat
material (typically sputtered alumina) that covers the head. Since
alumina is a relatively poor conductor of heat, a temperature
buildup occurs in both the head and the overcoat as the overcoat is
unable to eliminate the heat produced in the head with sufficient
rapidity.
[0006] FIGS. 1 and 2 show two schematic views of a read/write head
and slider assembly. FIG. 1 shows a cross-section of the head
attached at (15) to the actuator arm (30). Details include the
overcoat (2), the upper (6) and lower (4) pole-pieces and the
insulation imbedded coil structure (5) that inductively activates
them. The read element (8) is generally formed beneath the lower
pole piece (4) which then also serves as an upper shield for the
read head. The air-bearing surface of the head, at which the read
element is positioned, is indicated as (1) and the dimensional
direction "x" is also shown. The trailing end, containing the
connecting pads (only (10) is shown), is indicated as (14). FIG. 2
is a schematic drawing showing the trailing end surface (14) of the
read/write head assembly where it attaches to external wiring
(shown as (13) in FIG. 1) along the actuator arm. The dimension "z"
on the drawing would be coming out of the plane of the drawing in
FIG. 1. FIG. 2 also shows four gold pads (16, 18, 20, 10) which
make the electrical connections to the head assembly. Two of the
pads (10 & 20) provide the sense current for the read sensor
through internal wiring (9), while the remaining pads (18, 16)
provide the coil current for the write head through wires (19).
These figures will also be discussed below in the context of the
description of the first of the preferred embodiments.
[0007] Seagle (U.S. Pat. No. 5,936,811) provides a slider assembly
similar to that in FIGS. 1 & 2 in which the current carrying
leads are disposed in a manner that eliminates the need for vias
passing through the insulating layers and shield layers to allow
the electrical activation of the read and write sensors.
[0008] Chang et al. (U.S. Pat. No. 6,158,107) provide a merged
read/write head in which the pole tips of the write head are more
advantageously defined by use of a self-alignment formation process
and show the use of a substantial overcoat in the head
formation.
[0009] Maries et al. (U.S. Pat. No. 3,770,403) discloses a magnetic
head assembly in which the read/write circuit portions of the
assembly are formed on a chip and bonded to head assembly by a
glass-ceramic material whose coefficient of expansion matches the
coefficient of expansion of the parts to be joined. Another feature
of this structure is that the method of mounting the head assembly
on the support arm allows the air flow past the assembly to act as
a coolant for the circuit chip and also allows the thermal
conductivity of the metal structure of the arm to act as a heat
sink for the circuit chip.
[0010] Phipps et al. (U.S. Pat. No. 5,757,590) deals with the
problem of electrostatic charge buildup on read/write heads, which
is another problem associated with rapid relative movement between
the head and the recording medium. Phipps provides a fusible link
element connected across the existing terminal pads of the head to
discharge the unwanted buildup.
[0011] Wang et al. (U.S. Pat. No. 6,130,863) show the use of a
magnetic coil and slider assembly even in the field of
magneto-optical storage systems.
[0012] Han et al. (U.S. Pat. No. 6,103,136) shows a
magnetoresistive read head that typifies those found in the merged
read/write heads referred to in the present invention.
[0013] Ibaraki et al. (JP5266428A2) provides a thin film magnetic
head with star-shaped metallic patterns formed on a protective
overcoat to dissipate Joule heating.
[0014] With the exception of Ibaraki et al., none of the prior art
cited deals with the significant problem of heat buildup in head
elements such as write coils, magnetic pole pieces, overcoat
regions and magnetoresistive sensing formations. This heat buildup
is not only damaging to the performance of the elements, but
differential thermal expansion causes protrusion of elements
relative to each other and relative to the air bearing surface,
which protrusion can cause damage to the rapidly moving storage
medium. Ibaraki teaches a star-shaped conductor pattern disposed on
the lateral edges of the protective overcoat on a magnetic head.
The pattern is not placed directly over the heat producing elements
as it is in the first embodiment of the present invention, nor is
it formed as a direct extension of the conducting pads of the
sensor as it is in the first embodiment of the present invention.
Furthermore, unlike the second embodiment of the present invention,
the heat dissipation element of Ibaraki et al. is placed on the
surface of the sensor overcoat and is not incorporated within the
sensor overcoat itself. It is, therefore, the purpose of the
present invention to provide two simple and efficient methods
whereby the heat dissipation properties of a read/write element can
be significantly improved.
SUMMARY OF THE INVENTION
[0015] A first object of this invention is to provide a method for
forming a magnetic read/write head and slider assembly having
improved heat spreading and dissipation characteristics when
compared to magnetic read/write heads and slider assemblies of the
prior art.
[0016] A second object of the present invention is to provide a
method for forming such a magnetic read/write head and slider
assembly having improved heat spreading and dissipation
characteristics, wherein said method of formation is simple and
efficient and requires only a slight variation in the present
method of forming such a head and slider.
[0017] A third object of this invention is to provide a magnetic
read/write head and slider assembly having significantly improved
heat spreading and dissipation characteristics.
[0018] A fourth object of this invention is to provide a read/write
head and slider assembly wherein there will be no protrusion of
head elements and overcoat relative to the air bearing surface of
the head during normal operating conditions.
[0019] In accord with the objects of this invention and as a first
embodiment thereof, there is provided a magnetic read/write head
and slider assembly and a method for forming such a magnetic
read/write head and slider assembly, wherein one of the
electrically conductive pads that connects the internal current
carrying leads of the head to the external circuitry is enlarged
and extended over a substantial portion of the bottom of the slider
(the trailing end surface) so that it covers and thermally contacts
the portion of the overcoat that is above the head structure. Since
said pad is typically fabricated of gold or other material that is
both electrically and thermally highly conductive, much more
thermally conductive than the overcoat material, the enlargement
and extension of the pad provides significant additional heat
spreading (reduction of sharp temperature gradients) and heat
dissipation for the head and slider assembly. Since the external
electrical leads connected to the pads offer additional heat
dissipation, the effect is magnified and rendered even more
advantageous.
[0020] As a second embodiment of this invention there is provided a
heat sink mechanism that consists of a highly thermally conductive
layer formed within the overcoat layer rather than on top of it as
in the first embodiment. There are several alternatives that meet
the objectives of this second embodiment, a first alternative being
a heat sink layer that is formed over the upper pole piece of the
write element and possibly separated from it by an insulating layer
and either completely or partially extending over the inductive
coils of the element and a second alternative wherein the heat sink
layer covers the upper or lower surface of the lower pole piece of
the write element. In either alternative, the material of which the
heat sink is formed must have a higher thermal conductivity than
the material which it excludes and replaces.
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The objects, features and advantages of the present
invention are understood within the context of the Description of
the Preferred Embodiments, as set forth below. The Description of
the Preferred Embodiments is understood within the context of the
accompanying figures, wherein:
[0022] FIG. 1 is a schematic drawing of a cross-section of a
magnetic read/write slider/head assembly that is representative of
both the prior art and the present invention. For purposes of
discussion, the plane of the cross-section is the x-y plane and x
denotes the slider length direction.
[0023] FIG. 2 is a schematic drawing of the top surface
configuration (trailing end of the slider) of a read write head
fabricated in accord with the prior art. The plane of this drawing
is the y-z plane relative to the drawing of FIG. 1. The trailing
end surface displayed represents the surface of attachment of the
slider/head assembly to the external wires along the actuator arm
assembly.
[0024] FIGS. 3 and 4 are the graphed results of simulations carried
out to show the temperature profile in the x-direction (FIG. 3) and
the z-direction (FIG. 4) across a head of the prior art during
normal operating conditions.
[0025] FIGS. 5 and 6 show graphed simulation results of the
protrusion profiles of the head and overcoat regions corresponding
to the temperature profiles of FIGS. 3 and 4 respectively.
[0026] FIG. 7 is analogous to FIG. 2, being a schematic view of the
rear surface of a slider/head assembly whose connective pads are
formed in accord with the methods of the present invention.
[0027] FIGS. 8 and 9 are, respectively, graphical representations
of simulated temperature profiles in the slider length direction
(x) and the slider width direction (z) for a slider fabricated in
accord with the first preferred embodiment of the present
invention. Each graph also shows the corresponding graphs for a
reference slider fabricated in accord with the prior art.
[0028] FIGS. 10 and 11 are graphical representations of simulations
of the thermal protrusion profiles corresponding, respectively, to
the temperature profiles of FIGS. 8 and 9.
[0029] FIGS. 12A, B &C are schematic representations of two
overhead (A), (B) and a side cross-sectional view (C) of a stitched
pole type of write head incorporating two versions of a heat sink
layer, one of which (A) that covers an entire upper surface of the
upper pole yoke and the induction coils, the other of which (B)
partially covers the upper pole yoke and induction coils, both
being in accord with the second preferred embodiment of the
invention.
[0030] FIG. 13 is a schematic representations of a side
cross-sectional view of a stitched pole type of read head
incorporating a heat sink layer that is formed on the upper surface
of the lower pole piece, but not impinging on the gap region. The
layer could also be formed on the lower surface of the lower pole
piece. Either position would be in accord with the objects of the
second preferred embodiment.
[0031] FIG. 14 is a graphical representation of the protrusion
modeling of a heat sink of particular material composition and
dimension, formed in accord with the schematic illustration of
FIGS. 12A &C.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0032] The first preferred embodiment of the present invention
provides an efficient and effective method for materially improving
the heat dissipation and heat spreading characteristics and
eliminating associated thermal protrusion problems of a merged
magnetic read/write head and slider assembly by the enlargement of
at least one of its current lead connecting pads. The efficacy of
this method has been substantiated by simulations that compare
heads fabricated according to the method of the invention with
heads fabricated according to methods of the prior art.
[0033] Referring first to FIG. 1, there is shown a schematic,
not-to-scale, cross-sectional diagram of a read/write head and
slider assembly typical of the prior art, mounted on an actuator
arm assembly at its trailing end surface. For the purposes of
description, the cross-sectional plane is the x-y plane as shown in
the diagram and the z-axis can be taken as coming out of the plane.
The air bearing surface (ABS) of the head is denoted as (1). The
head comprises a magnetoresistive read sensor element (8) formed
contiguously with the lower magnetic pole piece (4) of an inductive
magnetic write element which also serves as an upper shield for the
read element. The upper pole piece is of the write element is (6).
Between the upper and lower pole pieces can be seen the
cross-sections of the energizing coil turns (5) which are encased
in a protective medium (12). The read element is shielded below by
(3). The pole pieces come together to form a write gap (7). A
protective overcoat surrounds the entire formation (2). Typically
four internal conductive leads (three not shown) would emerge from
the head and terminate at connecting pads (only (10) is shown) on
the trailing end surface of the slider assembly, two leads to
provide energizing current to the coil and two leads to provide
sensing current to the read head. Only one such internal conducting
lead is indicated (9) and that lead is shown terminating in a
conductive pad (10) that emerges at the trailing end of the head
(14). In actuality, there would be four such pads, one attached to
each of the internal leads, said pads providing the electrically
conducting contact to the external circuitry. The slider assembly
connects to the actuating arm (30) along surface (15) to complete
the fabrication, with the pads (10) providing the means for
connecting the (partially drawn) internal conducting leads (9) to
external leads (13).
[0034] Referring next to FIG. 2, there is shown a schematic drawing
of the surface of the trailing end of the read head, which is shown
only as (14) in FIG. 1. The plane of the surface is the z-y plane.
The drawing shows the trailing end surface (14) and all four of the
conductive pads (10), (18), (16), (20). The pads connect by
conducting lines (19), (9) beneath the surface (drawn as dashed
lines) to the write coil leads and read element (neither shown)
within the head (12), which is also beneath the surface and drawn
as dashed. Referring next to FIG. 3, there is shown a graph of
temperature (.degree. C.) vs. distance (in microns) in the
x-direction or slider length direction (see FIG. 1) resulting from
a simulation of a read/write head of the prior art under operating
conditions. The x=0 position corresponds to the bottom of the head,
x=20 microns locates the top of the head and the region from x=20
microns to x=35 microns encompasses the overcoat. As can be seen
from the graph, there is a sharp temperature peak near the overcoat
boundary which is a result of the poor heat conduction through the
overcoat material.
[0035] Referring next to FIG. 4, there is shown the temperature
distribution of FIG. 3 as measured (by the simulation) in the
z-direction (slider width). Once again, the temperature is peaked
in the read head region.
[0036] Referring next to FIGS. 5 and 6, there is shown graphical
evidence of head and overcoat protrusion (in nanometers) produced
by the temperature distributions in FIGS. 3 and 4. In this
particular case, the maximum protrusion occurs in the overcoat
region.
[0037] Referring next to FIG. 7, there is shown a schematic drawing
of the trailing surface of a slider fabricated according to a first
preferred embodiment of the method of the present invention. This
figure is to be compared to the illustration in FIG. 2, which shows
the corresponding surface of a prior art slider. As can be seen in
FIG. 7, pad (16'), which corresponds to pad (16) of FIG. 2, has
been substantially extended (17) to cover the head region (12)
(beneath (17)). Said pad is formed of a metal, such as Au, Ag, Al
or Cu, which is both electrically and thermally conductive. In
practice, any good heat and electrical conductor that can be
efficiently and easily plated on the overcoat material can be used.
In the present embodiment, Au is used because it is easily plated
on the alumina overcoat and because the remaining conductive pads
are also Au. Heat generated within the head region beneath (17) is,
therefore, efficiently transferred to the pad extension by
conduction, is spread through both the pad and associated external
wiring that it is attached to and is dissipated thereby. Given the
purpose served by the pad extension, it should be seen that the
shape of the extension is not critical, but it should be of
sufficient area to completely cover that region of the trailing end
surface that is directly over the read head, while not being of so
large an area as to interfere with the other connecting pads. In
the present embodiment, the Au pad extension, which is plated
through a mask, is approximately square in shape and approximately
200 microns by 200 microns in size (area) and approximately between
4 and 5 microns in thickness.
[0038] Referring next to FIGS. 8 and 9, there are shown simulated
temperature profiles along the x (FIG. 8) and z (FIG. 9) directions
for a slider fabricated according to the first preferred embodiment
of the method of the present invention (10) and for a slider
fabricated according to the prior art (20). The prior art slider
profiles are the same as those in FIGS. 3 and 4.
[0039] Referring next to FIGS. 10 and 11, there are shown the
protrusion profiles corresponding to the temperature profiles in
FIGS. 8 and 9. Once again, (10) indicates the invention and (20)
indicates the prior art. The significant reduction in protrusion is
readily apparent.
[0040] Referring to FIGS. 12A, B and C, there are shown two
overhead views and one side cross-sectional view of a heat sink
formed on a stitched pole type of writer in accord with a second
preferred embodiment of the present invention. FIG. 12C is a side
cross-sectional view in which can be seen the plane of the
air-bearing surface (ABS) (2), which plane contains an intersection
with the write gap (4) formed by the space between the upper pole
tip (6) and the lower pole piece (8). The pole tip (6) is stitched
to the pole yoke (10), over which is formed the heat sink layer
(14) in accord with the second preferred embodiment of the
invention. The heat sink layer, which is formed of a material with
a thermal conductivity superior to that of surrounding materials
(insulating overcoat materials) and which acts to conduct heat away
from sensitive regions of the sensor and to dissipate it, may be
separated from the actual upper surface of the pole yoke by a
spacer layer (12), which is typically a layer of electrically
non-conductive material. Suitable materials with high thermal
conductivities include Cu, Ag, Au, Ni, Al, Ta, W and their alloys.
It is also recognized that the material of which the heat sink
layer is formed may be electrically conducting material or may be
magnetic material, but in the latter case said material will serve
only as a heat conducting and dissipating material. In either case,
the spacer layer may be necessary to provide electrical or chemical
isolation between the materials of the heat sink and the pole yoke.
A preferred configuration would consist of a copper heat sink
between 0.25 and 10 microns thick, separated from the magnetic
material of the pole yoke by an electrically insulating alumina
spacer layer between 0 and 10 microns thick. Also shown in the
figure are the inductive coils (16) for providing the magnetic
writing field and the insulating and protective overcoat material
(18) which is also preferably alumina. As can be seen in the upper
views provided by FIGS. 12A and 12B, the size and shape of the heat
sink layer (14) may vary appreciably, but it should extend at least
substantially over the pole yoke (10) and the coils (16). Although
the heat sink layer is here pictured schematically as being
rectangular in shape, it is recognized that the actual shape may be
dictated by the topology of the write head. In FIG. 12A, the layer
is shown as covering virtually the entire yoke and coil region,
whereas in 12B it is shown to have a more restrictive area. It
should also be recognized that the dimensions of the heat sink
layer will depend on the dimensions of the write element, the
thermal conductivity of the layer material and the amount of
thermal energy to be dissipated.
[0041] Referring next to FIG. 13, there is shown a schematic
cross-sectional view of a write element similar in all respects to
the element in FIG. 12C with the exception of the position of the
heat sink layer (30), which is here shown to cover a portion of the
upper surface (31) of the lower pole piece (8). It is understood
that it may be advantageous to form the heat sink layer as a double
layer with a lower spacer layer of electrically insulating
material. Although it is not shown in the figure, an alternative
position, equally capable of satisfying the objectives of the
invention, would be on the lower surface (32) of the pole
piece.
[0042] Referring finally to FIG. 14, there is shown a graphical
representation of the results of modeling the protrusion of a
writer surface relative to the ABS plane vs. distance measured from
the writer substrate for writers with (1) and without (2) a heat
sink layer. The heat sink layer in this case is a 1.5 micron thick
copper layer covering a yoke of length 18 microns and separated
from it by an alumina spacer of approximately 0.3 microns thickness
in accord with the configuration of FIG. 12. The coil layers
dissipate a power of approximately 50 mW. The upper pole tip begins
at approximately 5 microns from the substrate and its trailing edge
is approximately 35 microns from the substrate.
[0043] As is understood by a person skilled in the art, the
preferred embodiment of the present invention is illustrative of
the present invention rather than limiting of the present
invention. Revisions and modifications may be made to methods,
materials, structures and dimensions employed in the present method
of fabricating a magnetic read/write head and slider assembly with
improved heat dissipation and thermal protrusion properties, while
still providing a read/write head and slider assembly with improved
heat dissipation and thermal protrusion properties, in accord with
the spirit and scope of the present invention as defined by the
appended claims.
* * * * *