U.S. patent application number 10/842347 was filed with the patent office on 2005-11-17 for leadless lower temperature co-crystal phase transition metal heat conductive device.
Invention is credited to Chang, Hsin-Hsiang, Chiu, Ming-Chi.
Application Number | 20050252649 10/842347 |
Document ID | / |
Family ID | 35308311 |
Filed Date | 2005-11-17 |
United States Patent
Application |
20050252649 |
Kind Code |
A1 |
Chiu, Ming-Chi ; et
al. |
November 17, 2005 |
Leadless lower temperature co-crystal phase transition metal heat
conductive device
Abstract
A leadless lower temperature co-crystal phase transition metal
heat conductive device comprises two metal substrates made from
tin, indium, bismuth and a little other elements; a metal heat
conductive sheet installed between the two metal substrates, where
the metal substrates having the effect of increasing heat
dissipating ability of the metal heat conductive sheet; a heat
dissipation device installed above a structure formed by the metal
substrates and the metal heat conductive sheet so as to dissipate
heat from the metal heat conductive sheet and the two metal
substrates; and a fan installed above the heat dissipation device
for dissipating heat from the heat dissipation device. When
leadless lower temperature co-crystal phase transition metal heat
conductive device is placed on a circuit board, the temperature
range for co-crystal phase transition is between 50.degree. C. to
70.degree. C.
Inventors: |
Chiu, Ming-Chi; (Tao Yuan
Hsien, TW) ; Chang, Hsin-Hsiang; (Tao Yuan Hsien,
TW) |
Correspondence
Address: |
MING-CHI CHIU
235 P.O. BOX 10-69
Chung-Ho
Taipei
TW
|
Family ID: |
35308311 |
Appl. No.: |
10/842347 |
Filed: |
May 11, 2004 |
Current U.S.
Class: |
165/185 ;
257/E23.099; 257/E23.109 |
Current CPC
Class: |
H01L 23/3736 20130101;
H01L 2924/0002 20130101; H01L 23/467 20130101; H01L 2924/00
20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 007/00 |
Claims
What is claimed is:
1. A leadless lower temperature co-crystal phase transition metal
heat conductive device comprising: two metal substrates made from
tin, indium, bismuth and a little other elements; a metal heat
conductive sheet installed between the two metal substrates, where
the metal substrates having the effect of increasing heat
dissipating ability of the metal heat conductive sheet; a heat
dissipation device installed above a structure formed by the metal
substrates and the metal heat conductive sheet so as to dissipate
heat from the metal heat conductive sheet and the two metal
substrates; and a fan installed above the heat dissipation device
for dissipating heat from the heat dissipation device.
2. The leadless lower temperature co-crystal phase transition metal
heat conductive device as claimed in claim 1, wherein when leadless
lower temperature co-crystal phase transition metal heat conductive
device is placed on a circuit board, the temperature range for
co-crystal phase transition is between 50.degree. C. to 70.degree.
C.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a heat dissipation device,
and particular to a leadless lower temperature co-crystal phase
transition metal heat conductive device which has higher heat
dissipating effect by using two metal substrates to enclose one
layer of metal heat conductive sheet.
BACKGROUND OF THE INVENTION
[0002] With reference to FIG. 5, conventionally, heat conductive
glue A or a film is coated upon a bottom of a heat dissipation
device. However, most of the heat conductive glue A or film contain
with lead which has lower heat conductivity. Moreover, the heat
conductive glue A or film cannot be used repeatedly. Further,
coating the heat conductive glue A or the film is performed
manually so that the distribution of the heat conductive glue A or
the film is not uniform. Thereby, if too much heat conductive glue
A or film is coated, then some of the heat conductive glue A or
film will be extruded out so as to pollute the environment and as a
result to affect the manufacturing process.
SUMMARY OF THE INVENTION
[0003] Accordingly, the primary object of the present invention is
to provide a leadless lower temperature co-crystal phase transition
metal heat conductive device which comprises two metal substrates
made from tin, indium, bismuth and a little other elements; a metal
heat conductive sheet installed between the two metal substrates,
where the metal substrates having the effect of increasing heat
dissipating ability of the metal heat conductive sheet; a heat
dissipation device installed above a structure formed by the metal
substrates and the metal heat conductive sheet so as to dissipate
heat from the metal heat conductive sheet and the two metal
substrates; and a fan installed above the heat dissipation device
for dissipating heat from the heat dissipation device. When
leadless lower temperature co-crystal phase transition metal heat
conductive device is placed on a circuit board, the temperature
range for co-crystal phase transition is between 50.degree. C. to
70.degree. C.
[0004] The various objects and advantages of the present invention
will be more readily understood from the following detailed
description when read in conjunction with the appended drawing.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] FIG. 1 is an exploded perspective view of the present
invention.
[0006] FIG. 2 is an assembled view of the present invention.
[0007] FIG. 3 is a cross section view of the present invention.
[0008] FIG. 4 shows the embodiment of the present invention.
[0009] FIG. 5 shows a prior art heat dissipation device.
DETAILED DESCRIPTION OF THE INVENTION
[0010] In order that those skilled in the art can further
understand the present invention, a description will be described
in the following in details. However, these descriptions and the
appended drawings are only used to cause those skilled in the art
to understand the objects, features, and characteristics of the
present invention, but not to be used to confine the scope and
spirit of the present invention defined in the appended claims.
[0011] With reference to FIGS. 1, 2 and 3, the leadless lower
temperature co-crystal phase transition metal heat conductive
sheet. The present invention mainly comprises the following
elements.
[0012] Two metal substrates 2 and 3 are made from tin, indium,
bismuth and a little other elements.
[0013] A metal heat conductive sheet 1 is installed between the two
metal substrates 2 and 3, where the metal substrates 2 and 3 have
the effect of increasing heat dissipating ability of the metal heat
conductive sheet 1.
[0014] A heat dissipation device 4 is installed above a structure
formed by the metal substrates 2, 3 and the metal heat conductive
sheet 1 so as to dissipate heat from the metal heat conductive
sheet 1 and the metal substrates 2 and 3.
[0015] A fan 5 is installed above the heat dissipation device 4 for
dissipating heat from the heat dissipation device 4.
[0016] The assembly view of the present invention is illustrated in
FIG. 4, where the present invention is realized on a circuit board
6 for dissipating heat generated from the circuit board 6, wherein
the temperature range for co-crystal phase transition is between
50.degree. C. to 70.degree. C. Thereby, the problem of the
pollution of the conventional heat conductive glue will not
occur.
[0017] Advantages of the present invention will be described
herein. Firstly, two metal substrates made from tin, indium,
bismuth and a little other elements enclosing the metal heat
conductive sheet has the effect of increasing the heat dissipation
effect. Moreover, the problem of the pollution of the conventional
heat conductive glue will not occur. Furthermore, the assembly of
the present invention is rapid so as to increase the manufacturing
efficiency.
[0018] The present invention is thus described, it will be obvious
that the same may be varied in many ways. Such variations are not
to be regarded as a departure from the spirit and scope of the
present invention, and all such modifications as would be obvious
to one skilled in the art are intended to be included within the
scope of the following claims.
* * * * *